Semiconductor packaging apparatus

Abstract

The invention discloses semiconductor packaging equipment. The semiconductor packaging equipment comprises a positioning assembly, a packaging assembly, a reset piece and a top block, the positioning assembly can pass through the first position and the second position in the process of moving in the first direction, and the positioning assembly is provided with a positioning groove for positioning a semiconductor; the packaging assembly is arranged in a reciprocating mode in the second direction, and the packaging assembly can abut against the positioning assembly in the moving process and push the positioning assembly to the second position; in the process that the positioning assembly moves from the first position to the second position, the ejector block can abut against the positioning assembly so as to eject the semiconductor in the positioning groove out. The packaging assembly firstly packages the semiconductor on the positioning assembly at the first position, after packaging is completed, the packaging assembly pushes the positioning assembly to move towards the second position, and the ejector block ejects the semiconductor in the positioning groove out in the moving process. Therefore, the semiconductors in the positioning grooves do not need to be manually dug out, and the working efficiency is improved.

Description

Technical Field

[0001] The present application belongs to the technical field of semiconductor processing equipment, and specifically relates to a semiconductor packaging equipment. Background Art

[0002] Semiconductor refers to materials whose electrical conductivity at room temperature is between that of conductors and insulators. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, a diode is a device made of semiconductors.

[0003] In order to improve the protection of semiconductors, semiconductors are packaged to facilitate their transportation and installation. In the existing semiconductor packaging process, semiconductors are usually positioned in slots for packaging. After packaging, materials are usually removed manually, that is, the semiconductors are manually removed from the slots, which is inefficient. Summary of the invention

[0004] The technical problem to be solved by the present application is that the existing semiconductor packaging equipment has low working efficiency. In order to solve the above technical problem, a semiconductor packaging equipment with high working efficiency is provided.

[0005] The technical solution proposed in this application is: A semiconductor packaging device, comprising: A positioning component is arranged to be reciprocatingly movable along a first direction, and the positioning component can pass through a first position and a second position during movement along the first direction, and the positioning component has a positioning groove for positioning the semiconductor; A packaging component is arranged to be reciprocatingly movable along the second direction, the packaging component can package the semiconductor on the positioning component located at the first position, and the packaging component can abut against the positioning component during movement and push the positioning component to the second position; a reset member, abutting against the positioning assembly to provide a force for moving the positioning assembly toward the first position; A top block is located on the moving path of the positioning component, and when the positioning component moves from the first position to the second position, the top block can abut against the positioning component to eject the semiconductor in the positioning groove; Wherein, the first direction and the second direction are arranged at an angle.

[0006] Further, the positioning assembly includes a positioning plate and a lifting member, the positioning plate is reciprocatingly movable along the first direction, and the positioning plate is provided with the positioning groove; The lifting member is connected to the positioning plate so as to be reciprocatingly movable along the second direction, and when the positioning assembly moves from the first position to the second position, the lifting block can abut against the lifting member and push the lifting member to move toward the positioning plate along the second direction, so that the lifting member can eject the semiconductor in the positioning groove.

[0007] Furthermore, a lifting hole is formed through the bottom wall of the positioning groove, and when the lifting member moves toward the positioning plate along the second direction, at least a portion of the lifting member can pass through the lifting hole and extend into the positioning groove.

[0008] Furthermore, the lifting member includes a lifting plate and a lifting block, the lifting plate is connected to the positioning plate so as to be reciprocatingly movable along the second direction, and the lifting plate is used to abut against the lifting block, and the lifting block is arranged on the side of the lifting plate facing the positioning plate, and is used to eject the semiconductor in the positioning groove.

[0009] Furthermore, the positioning assembly also includes a first wedge block, which is arranged on the side of the lifting member facing away from the positioning plate; during the process of the positioning assembly moving from the first position to the second position, the lifting block can abut against the first wedge block to push the lifting member to move toward the positioning plate along the second direction.

[0010] Furthermore, the packaging assembly includes a packaging seat, a packaging head and a second wedge block, the packaging seat is reciprocatingly movable along the second direction, the packaging head and the second wedge block are both arranged on the packaging seat, the packaging head can package the semiconductor on the positioning assembly located at the first position; the second wedge block is used to abut against the positioning assembly.

[0011] Further, the packaging head is reciprocally movable along the third direction on the packaging seat; the positioning assembly includes a plurality of positioning grooves arranged at intervals along the third direction; Wherein, the third direction is arranged at an angle with the first direction and the second direction.

[0012] Furthermore, the semiconductor packaging equipment further comprises a dust removal component, the dust removal component is arranged corresponding to the positioning component, and the packaging component and the dust removal component are linked; In the process that the packaging component moves along the second direction and pushes the positioning component to move to the second position, the packaging component can drive the dust removal component to blow air toward the positioning groove.

[0013] Furthermore, the dust removal assembly includes a piston cylinder, a piston plate, an air blowing pipe, a connecting sleeve and a connecting rod, the piston plate is reciprocatingly arranged in the piston cylinder along the length direction of the piston cylinder, the air blowing pipe is connected to the piston cylinder, and the air outlet end of the air blowing pipe is arranged corresponding to the positioning assembly; The connecting sleeve is connected to the piston plate, the connecting rod is rotatably arranged, and one end is arranged in the connecting sleeve. During the rotation of the connecting rod, the connecting sleeve can be driven to reciprocate along the length direction of the piston cylinder; the packaging assembly is linked with the connecting rod to drive the connecting rod to rotate during the reciprocating movement along the second direction.

[0014] Furthermore, the semiconductor packaging equipment also includes a mounting platform and a sealing cover, wherein the sealing cover is arranged on the mounting platform to form a sealed cavity; the positioning component, the packaging component, the reset member and the top block are all arranged on the mounting platform and located in the sealed cavity.

[0015] By using the semiconductor packaging equipment described above, the semiconductor is placed in the positioning groove, and the packaging component first packages the semiconductor on the positioning component located at the first position. After the packaging is completed, the packaging component moves along the second direction and pushes the positioning component to move toward the second position. During the movement, the top block pushes out the semiconductor in the positioning groove. In this way, there is no need to manually pick out the semiconductor in the positioning groove, which improves work efficiency. At the same time, after the packaging is completed, the packaging component can push the positioning component from the first position to the second position, that is, push the positioning component out from the packaging position, which makes it easy to remove the semiconductor after the packaging is completed and improves the safety of material removal. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The accompanying drawings are used to provide further understanding of the present application and constitute a part of the specification. They are used to explain the present application together with the embodiments of the present application and do not constitute a limitation of the present application.

[0017] Figure 1 A schematic diagram of the structure of a semiconductor packaging device provided by an embodiment of the present application; Figure 2 for Figure 1 A schematic diagram of the structure of the semiconductor packaging device after removing the sealing cover; Figure 3 for Figure 2 A schematic diagram of the structure of the semiconductor packaging equipment without the mounting frame; Figure 4 for Figure 3 A schematic diagram of the structure of a positioning component and a reset component in a semiconductor packaging device shown; Figure 5 for Figure 3A schematic diagram of the structure of a package driver and a package assembly in a semiconductor packaging device shown; Figure 6 for Figure 3 The schematic diagram of the structure of the dust removal component in the semiconductor packaging equipment is shown.

[0018] Description of labels: 100, positioning assembly; 110, positioning plate; 111, positioning groove; 112, lifting hole; 113, slide plate; 114, abutment block; 115, connecting column; 120, lifting member; 121, lifting plate; 122, lifting block; 123, first wedge block; 124, guide column; 200, packaging assembly; 210, packaging seat; 211, slide groove; 220, packaging head; 230, mounting block; 240, second wedge block; 250, first connecting plate; 260, second connecting plate; 270, linkage rack; 310, reset member; 320, top block; 330, mounting platform; 331, guide groove; 340, sealing cover; 341, sealing door; 342, vacuum pump; 350, mounting seat; 351, mounting groove; 360, mounting frame; 370, package drive member; 400, dust removal assembly; 410, piston cylinder; 420, piston plate; 430, air blowing pipe; 440, connecting pipe; 450, connecting sleeve; 460, connecting rod; 470, linkage gear. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0020] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicating orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0021] The present application provides a semiconductor packaging device for packaging semiconductors; at the same time, after the packaging device completes the packaging, there is no need to manually pick the semiconductor out of the groove in which the semiconductor is placed, thereby improving work efficiency.

[0022] like Figures 1 to 3 As shown, the semiconductor packaging device includes a positioning component 100 , a packaging component 200 and a resetting component 310 .

[0023] The positioning assembly 100 has a positioning groove 111 for positioning the semiconductor, and the positioning assembly 100 is arranged to be reciprocatingly movable along a first direction, and the positioning assembly 100 can pass through a first position and a second position during the movement along the first direction. The packaging assembly 200 is arranged to be reciprocatingly movable along a second direction, and the packaging assembly 200 can package the semiconductor on the positioning assembly 100 located at the first position.

[0024] The packaging component 200 can abut against the positioning component 100 during the movement and push the positioning component 100 to the second position; the reset member 310 abuts against the positioning component 100 to provide a force to move the positioning component 100 toward the first position.

[0025] It should be noted that, in this embodiment, the first direction and the second direction are arranged at an angle. Figure 2 and Figure 3 In the embodiment shown, the first direction and the second direction are perpendicular to each other. In practical applications, the second direction is a vertical direction.

[0026] Furthermore, the packaging device also includes a top block 320 , which is located on the moving path of the positioning component 100 , and when the positioning component 100 moves from the first position to the second position, the top block 320 can abut against the positioning component 100 to eject the semiconductor in the positioning groove 111 .

[0027] By using the semiconductor packaging equipment described above, a semiconductor is placed in the positioning groove 111, and the packaging component 200 first packages the semiconductor on the positioning component 100 located at the first position. After the packaging is completed, the packaging component 200 moves along the second direction and pushes the positioning component 100 to move toward the second position. During the movement, the top block 320 pushes out the semiconductor in the positioning groove 111. In this way, there is no need to manually pick out the semiconductor in the positioning groove 111, which improves work efficiency. At the same time, after the packaging is completed, the packaging component 200 can push the positioning component 100 from the first position to the second position, that is, push the positioning component 100 out of the packaging position, which is convenient for removing the semiconductor after the packaging is completed, and improves the safety of material unloading.

[0028] It should be noted that the semiconductor can be unloaded manually, that is, the positioning component 100 moves to the second position, at which time the semiconductor has been ejected by the ejector block 320, and the positioning component 100 is also moved out of the package position, making unloading more convenient and safer. Of course, in other embodiments, other mechanical equipment can also be used for unloading to further improve safety, which is not limited here.

[0029] In one embodiment, the semiconductor packaging device also includes a mounting platform 330 and a sealing cover 340, wherein the sealing cover 340 is disposed on the mounting platform 330 to form a sealed cavity; the positioning component 100, the packaging component 200, the reset member 310 and the top block 320 are all disposed on the mounting platform 330 and are located in the sealed cavity to achieve vacuum packaging.

[0030] Furthermore, an opening for semiconductors to enter and exit is provided on one side of the sealing cover 340, and a sealing door 341 for opening and closing the opening is provided. The positioning assembly 100 can approach and move away from the sealing door 341 during movement along the first direction, and the positioning assembly 100 at the second position is closer to the sealing door 341 than the positioning assembly 100 at the first position, so as to further facilitate material removal. In addition, a vacuum pump 342 can be provided on the top of the sealing cover 340, and the vacuum pump 342 is used to evacuate the sealed cavity.

[0031] In one embodiment, the semiconductor packaging device further includes a mounting seat 350 and a mounting frame 360, both of which are disposed on the mounting platform 330 and are located in the sealed cavity. The positioning assembly 100 is disposed on the mounting seat 350 so as to be reciprocable along a first direction, and the reset member 310 is disposed on the mounting seat 350; the packaging assembly 200 is disposed on the mounting frame 360 ​​so as to be reciprocable along a second direction.

[0032] In actual application, the mounting seat 350 is provided with a mounting groove 351 extending along the first direction, the reset member 310 is disposed in the mounting groove 351, the positioning assembly 100 partially extends into the mounting groove 351, and reciprocates in the first direction in the mounting groove 351, and one end of the reset member 310 abuts against the portion of the positioning assembly 100 extending into the mounting groove 351. Optionally, the reset member 310 is a spring, a spring sheet, or other structure that can push the positioning assembly 100 to move along the first direction and can be compressed.

[0033] In one embodiment, the positioning assembly 100 includes a positioning plate 110, which is reciprocally movably disposed on the mounting seat 350 along a first direction, and a positioning groove 111 is provided on a side of the positioning plate 110 that is away from the mounting seat 350, i.e., on the top. Optionally, two opposite sides of the positioning plate 110 along the first direction are extended toward the mounting seat 350 to form slide plates 113, and the two slide plates 113 extend into the mounting grooves 351 and can slide along the mounting grooves 351, so that the positioning plate 110 can stably move along the first direction, and the reset member 310 abuts against the slide plates 113.

[0034] Furthermore, an abutment block 114 is provided on one side of the positioning plate 110 along the first direction. During the movement along the second direction, the packaging component 200 can abut against the abutment block 114, thereby pushing the positioning component 100 to move to the second position.

[0035] In one embodiment, the positioning assembly 100 further includes a lifting member 120, which is connected to the positioning plate 110 so as to be reciprocatingly movable along the second direction and is located at the bottom of the positioning plate 110. In the process of the positioning plate 110 moving from the first position to the second position, the ejection block 320 can abut against the lifting member 120 and push the lifting member 120 to move toward the positioning plate 110 along the second direction, so that the lifting member 120 ejects the semiconductor in the positioning groove 111. Further, a lifting hole 112 is formed through the bottom wall of the positioning groove 111, and in the process of the lifting member 120 moving toward the positioning plate 110 along the second direction, the lifting member 120 can at least partially pass through the lifting hole 112 and extend into the positioning groove 111, thereby ejecting the semiconductor in the positioning groove 111.

[0036] It can be understood that in this embodiment, the semiconductor in the positioning groove 111 is ejected during the movement of the lifting member 120 along the second direction, and the ejector block 320 is used to push the lifting member 120 to move toward the positioning plate 110, so the ejector block 320 can be fixed relative to the mounting frame 360. In other embodiments, the lifting member 120 can be arranged to be reciprocatingly movable along the second direction, and after the positioning plate 110 moves to the second position, the ejector block 320 can pass through the lifting hole 112 and extend into the positioning groove 111 to eject the semiconductor in the positioning groove 111; at the same time, after the semiconductor is removed, the ejector block 320 can be retracted to facilitate the positioning plate 110 to move back to the first position.

[0037] In one embodiment, the lifting member 120 includes a lifting plate 121 and a lifting block 122. The lifting plate 121 is connected to the lower surface of the positioning plate 110 so as to be reciprocable along the second direction. Figure 4The lifting plate 121 is connected to the lower surface of the positioning plate 110 through the connecting column 115. At the same time, the lifting plate 121 is used to abut against the top block 320 so as to move toward the positioning plate 110 under the action of the top block 320; the lifting block 122 is arranged on the side of the lifting plate 121 facing the positioning plate 110, and is used to pass through the lifting hole 112 and extend into the positioning groove 111 to eject the semiconductor in the positioning groove 111.

[0038] Furthermore, the positioning assembly 100 further includes a first wedge block 123, which is disposed on a side of the lifting member 120 away from the positioning plate 110, specifically, on a side of the lifting plate 121 away from the positioning plate 110, and the first wedge block 123 is used to abut against the top block 320. In this way, when the positioning assembly 100 moves from the first position to the second position, the top block 320 can abut against the first wedge block 123 to push the lifting member 120 to move toward the positioning plate 110 along the second direction.

[0039] It should be explained that the first wedge block 123 abutting against the top block 320 is usually provided with a wedge surface. When the first wedge block 123 moves in the first direction, the top block 320 can abut against the wedge surface and move along the wedge surface, thereby pushing the first wedge block 123 to move in the second direction, that is, pushing the lifting plate 121 to move in the second direction. In addition, in order to provide smoothness, the end of the top block 320 abutting against the wedge surface can be set as a curved surface, preferably a spherical surface.

[0040] In one embodiment, Figure 3 and Figure 4 As shown, in order to improve the stability of the positioning assembly 100 moving along the first direction, a guide column 124 is provided at the bottom of the lifting plate 121, and a guide groove 331 extending along the first direction is also opened on the mounting platform 330, and the guide column 124 extends into the guide groove 331 to guide the movement of the positioning assembly 100.

[0041] In order to facilitate understanding of the action flow of the positioning assembly 100, Figure 3 and Figure 4 The action flow of the positioning component 100 is described as follows: When the positioning assembly 100 is located at the first position, the packaging assembly 200 packages the semiconductor in the positioning groove 111. After the packaging is completed, the packaging assembly 200 moves along the second direction and abuts against the abutment block 114 during the movement to push the positioning plate 110 to overcome the force of the reset member 310 and move to the second position; at the same time, during the movement of the positioning assembly 100 to the second position, the first wedge block 123 under the lifting plate 121 will abut against the top of the top block 320, and drive the lifting plate 121 to rise under the action of the top block 320 until the lifting block 122 on the lifting plate 121 passes through the lifting hole 112 and extends into the positioning groove 111, thereby ejecting the semiconductor. Similarly, after the packaging assembly 200 removes the force on the abutment block 114, the positioning assembly 100 can return to the first position under the action of the reset member 310.

[0042] It should be noted that for loading semiconductors, after the semiconductors are taken out, the packaging component 200 and the reset member 310 cooperate to move the positioning component 100 from the second position to the first position. When the positioning component 100 moves to a certain position in the middle, the first wedge block 123 separates from the top block 320, and the lifting plate 121 and the lifting block 122 descend, and the semiconductor can be loaded at this time. Of course, it is also possible to load the semiconductor at the second position. After loading is completed, when the positioning component 100 returns to the first position, the lifting plate 121 and the lifting block 122 descend, and the semiconductor falls back into the positioning groove 111.

[0043] In one embodiment, the packaging assembly 200 includes a packaging seat 210 and a packaging head 220. The packaging seat 210 is reciprocally movable along the second direction and is disposed on the mounting frame 360. The packaging seat 210 can abut against the positioning assembly 100 during the movement to push the positioning assembly 100 to move to the second position. The packaging head 220 is disposed on the packaging seat 210, and the packaging head 220 can package the semiconductor on the positioning assembly 100 located at the first position.

[0044] Furthermore, the semiconductor packaging device further includes a packaging driver 370, which is disposed on the mounting frame 360 ​​and connected to the packaging seat 210 to drive the packaging seat 210 to reciprocate along the second direction. Optionally, the packaging driver 370 is a cylinder or an electric cylinder, which is not limited here.

[0045] In one embodiment, the packaging head 220 is reciprocatably disposed on the packaging seat 210 along the third direction; a plurality of positioning grooves 111 are provided on the positioning plate 110 in the positioning assembly 100, and the plurality of positioning grooves 111 are arranged at intervals along the third direction. The third direction is arranged at an angle to the first direction and the second direction. In this way, when the positioning assembly 100 is located in the first position, the packaging head 220 reciprocatably movable along the third direction can package the semiconductors in the plurality of positioning grooves 111. Preferably, the first direction, the second direction and the third direction are perpendicular to each other.

[0046] Furthermore, the packaging assembly 200 further includes a mounting block 230, the packaging seat 210 is provided with a slide groove 211 extending along the third direction, the mounting block 230 is reciprocally movable in the slide groove 211 along the third direction, and the packaging head 220 is disposed on the mounting block 230. Optionally, the movement of the mounting block 230 along the third direction can be driven by an electric cylinder or a pneumatic cylinder, which is not limited here.

[0047] In one embodiment, a lifting hole 112 is formed on the bottom wall of each positioning groove 111; a plurality of lifting blocks 122 are provided on the lifting plate 121, and the plurality of lifting blocks 122 are arranged at intervals along the third direction and correspond one-to-one to the plurality of lifting holes 112, so that when the lifting plate 121 approaches the positioning plate 110, each lifting block 122 passes through a corresponding lifting hole 112 and extends into the positioning groove 111.

[0048] See also Figure 5 In one embodiment, the packaging assembly 200 further includes a second wedge block 240, which is disposed on the packaging seat 210 and is used to abut against the positioning assembly 100 to push the positioning assembly 100 to move to the second position during the movement along the second direction. The cooperation principle between the wedge block and the positioning assembly 100 can refer to the cooperation principle between the first wedge block 123 and the top block 320, which will not be described in detail here. In addition, specifically Figure 3 and Figure 5 In the illustrated embodiment, when the packaging assembly 200 moves upward along the second direction, the second wedge block 240 can abut against the abutment block 114 on the positioning block, thereby pushing the positioning assembly 100 to move to the second position.

[0049] In one embodiment, the packaging assembly 200 further includes a first connecting plate 250 and a second connecting plate 260, wherein the first connecting plate 250 is fixedly connected to the packaging seat 210, the second connecting plate 260 is fixedly connected to the first connecting plate 250, and the second wedge block 240 is disposed on the second connecting plate 260, and in the second direction, the second wedge block 240 is located below the packaging seat 210. In this way, when the positioning assembly 100 is located in the first position, the packaging head 220 is located above the positioning assembly 100 to realize the packaging of the semiconductor, and the second wedge block 240 is located below the abutment block 114; when the packaging seat 210 moves upward, the second wedge block 240 can abut against the abutment block 114 and push the positioning assembly 100 to move to the second position. Preferably, the first connecting plate 250 extends along the first direction, and the second connecting plate 260 is connected to one end of the first connecting plate 250 away from the packaging seat 210, and extends toward the bottom of the first connecting plate 250 along the second direction.

[0050] In one embodiment, the second wedge block 240 is rotatably connected to the second connecting plate 260 around an axis parallel to the third direction, and rotates between a horizontal position and an upturned position. Figure 5 As shown, the second wedge block 240 rises with the packaging seat 210, and the second wedge block 240 can abut against the abutment block 114; in some cases, if the positioning assembly 100 is in the first position, the second wedge block 240 is located above the abutment block 114. At this time, when the second wedge block 240 is descending with the packaging seat 210, the bottom surface of the second wedge block 240 can abut against the positioning assembly 100, and rotate to the flip-up position under the action of the positioning assembly 100 until it moves below the abutment block 114, and then the second wedge block 240 returns to the horizontal position under the action of gravity. Of course, in order to ensure that the second wedge block 240 returns to the horizontal position, a torsion spring or other structure can be provided to provide a driving force for the second wedge block 240 to return to the horizontal position.

[0051] In order to facilitate understanding of the action flow of the packaging component 200, Figure 3 and Figure 5 The action flow of the packaging component 200 is described as follows: When the positioning assembly 100 is located in the first position, the packaging head 220 is driven to move along the third direction to realize the packaging of the semiconductors in the plurality of positioning grooves 111. After the packaging is completed, the packaging driver 370 drives the packaging seat 210 to rise, and the second wedge block 240 rises with the packaging seat 210, and abuts against the abutment block 114 during the rising process to push the positioning assembly 100 to move to the second position. After moving to the second position, the packaging assembly 200 can remain in the current position so that the positioning assembly 100 remains in the second position. If the second wedge block 240 always abuts against the abutment block 114 when the positioning assembly 100 is located in the second position, then in the process of the packaging driver 370 driving the packaging seat 210 to descend, the positioning assembly 100 can return to the first position under the action of the reset member 310.

[0052] In one embodiment, the semiconductor packaging equipment also includes a dust removal component 400, which is disposed on the mounting frame 360 ​​and corresponds to the positioning component 100. The packaging component 200 and the dust removal component 400 are linked. In this way, in the process of the packaging component 200 moving along the second direction and pushing the positioning component 100 to move to the second position, the packaging component 200 can drive the dust removal component 400 to blow air toward the positioning groove 111, thereby removing dust from the positioning groove 111, thereby preventing dust from affecting the quality of the subsequent semiconductor package in the positioning groove 111 and ensuring the quality of the semiconductor after the packaging is completed.

[0053] See also Figure 3 and Figure 6 In one embodiment, the dust removal assembly 400 includes a piston cylinder 410, a piston plate 420 and an air blowing pipe 430. The piston plate 420 is reciprocatably disposed in the piston cylinder 410 along the length direction of the piston cylinder 410. The packaging assembly 200 is linked with the piston plate 420 to drive the piston plate 420 to reciprocate in the process of reciprocating along the second direction to achieve air extraction and air blowing. The air blowing pipe 430 is connected to the piston cylinder 410, and the air outlet end of the air blowing pipe 430 is arranged corresponding to the positioning assembly 100 to achieve air blowing toward the positioning groove 111. Optionally, the dust removal assembly 400 also includes a connecting pipe 440, which is arranged on the mounting frame 360, and the two ends of the connecting pipe 440 are respectively connected to the end of the piston cylinder 410 and the air blowing pipe 430.

[0054] In combination with the above embodiments, it can be determined that during the rising process of the packaging component 200, the piston plate 420 is driven to move toward the end where the blowing tube 430 is located, so that the blowing tube 430 blows air toward the positioning groove 111; for the positioning component 100, after the semiconductor packaging is completed, during the movement of the positioning component 100 toward the second position, the blowing tube 430 blows air toward the positioning groove 111 to remove dust at the positioning groove 111.

[0055] Furthermore, the dust removal assembly 400 further includes a connecting sleeve 450 and a connecting rod 460, wherein the connecting sleeve 450 is connected to the piston plate 420, and the connecting rod 460 is rotatably arranged, and one end of the connecting rod 460 is arranged in the connecting sleeve 450, so as to drive the connecting rod 460 to reciprocate along the length direction of the piston cylinder 410 during the rotation process; the packaging assembly 200 is linked with the connecting rod 460 to drive the connecting rod 460 to rotate during the reciprocating movement along the second direction. Specifically, the connecting rod 460 and the connecting sleeve 450 are threadedly matched, and the connecting sleeve 450 and the piston plate 420 are connected by an extension rod.

[0056] Preferably, the packaging assembly 200 further includes a linkage rack 270, which is fixedly connected to the first connecting plate 250; the dust removal assembly 400 further includes a linkage gear 470, which is fixedly connected to the connecting rod 460, and the linkage gear 470 and the linkage rack 270 are meshed with each other, thereby realizing the linkage between the packaging assembly 200 and the dust removal assembly 400. Figure 3 and Figure 6 In the illustrated embodiment, the piston cylinder 410 extends in a first direction, and the connecting shaft rotates about an axis parallel to the first direction.

[0057] In one embodiment, the dust removal assembly 400 includes two piston cylinders 410, two piston plates 420, two connecting sleeves 450, two connecting rods 460, two connecting pipes 440 and two linkage gears 470, and the corresponding packaging assembly 200 includes two linkage racks 270. Both connecting pipes 440 are connected to the blowing pipe 430 to increase the blowing flow rate. Of course, in other embodiments, the number of structures such as the piston cylinder 410 can also be other, which is not limited here.

[0058] In order to facilitate understanding of the technical solution of this application, Figure 1 and Figure 3 The action flow of the semiconductor packaging equipment in the above embodiment is described as follows: Initially, the positioning assembly 100 is located at the first position, and the packaging head 220 moves along the third direction to package the semiconductor in each positioning groove 111. After the packaging is completed, the packaging driving member 370 drives the packaging seat 210 to rise.

[0059] Regarding the positioning assembly 100: during the rising process of the packaging seat 210, the second wedge block 240 abuts against the abutment block 114 to push the positioning assembly 100 to move toward the second position. During the movement of the positioning assembly 100 toward the second position, the first wedge block 123 below the lifting plate 121 can abut against the top block 320 and rise under the action of the top block 320. The lifting block 122 above the lifting plate 121 passes through the lifting hole 112 and extends into the positioning groove 111 to eject the semiconductor in the positioning groove 111. The semiconductor can then be taken out manually and the semiconductor to be packaged can be re-inserted. Next, the packaging seat 210 descends, and the positioning assembly 100 returns to the first position under the action of the reset member 310.

[0060] For the dust removal component 400: during the rising process of the packaging seat 210, the linkage rack 270 rises, driving the connecting rod 460 to rotate, and the rotation of the connecting rod 460 drives the connecting sleeve 450 to move, thereby driving the piston plate 420 to move toward the end where the connecting pipe 440 is located, and the blowing pipe 430 blows air toward the positioning groove 111; during the descending process of the packaging seat 210, the linkage rack 270 descends. By the same token, it can be deduced that the piston plate 420 moves toward the end away from the connecting pipe 440, thereby realizing the suction of the piston cylinder 410.

[0061] Although the embodiments of the present application have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A semiconductor packaging device, characterized in that: include: A positioning component is arranged to be reciprocatingly movable along a first direction, and the positioning component can pass through a first position and a second position during movement along the first direction, and the positioning component has a positioning groove for positioning the semiconductor; A packaging component is arranged to be reciprocatingly movable along the second direction, the packaging component can package the semiconductor on the positioning component located at the first position, and the packaging component can abut against the positioning component during movement and push the positioning component to the second position; a reset member, abutting against the positioning assembly to provide a force for moving the positioning assembly toward the first position; A top block is located on the moving path of the positioning component, and when the positioning component moves from the first position to the second position, the top block can abut against the positioning component to eject the semiconductor in the positioning groove; Wherein, the first direction and the second direction are arranged at an angle.

2. The semiconductor packaging device according to claim 1, wherein: The positioning assembly includes a positioning plate and a lifting member, the positioning plate is reciprocatingly movable along the first direction, and the positioning plate is provided with the positioning groove; The lifting member is connected to the positioning plate so as to be reciprocatingly movable along the second direction, and when the positioning assembly moves from the first position to the second position, the lifting block can abut against the lifting member and push the lifting member to move toward the positioning plate along the second direction, so that the lifting member can eject the semiconductor in the positioning groove.

3. The semiconductor packaging device according to claim 2, characterized in that: A lifting hole is formed through the bottom wall of the positioning groove. When the lifting member moves toward the positioning plate along the second direction, at least a portion of the lifting member can pass through the lifting hole and extend into the positioning groove.

4. The semiconductor packaging device according to claim 2, wherein: The lifting member includes a lifting plate and a lifting block. The lifting plate is connected to the positioning plate so as to be reciprocatingly movable along the second direction, and the lifting plate is used to abut against the lifting block. The lifting block is arranged on the side of the lifting plate facing the positioning plate, and is used to eject the semiconductor in the positioning groove.

5. The semiconductor packaging device according to claim 2, wherein: The positioning assembly also includes a first wedge block, which is arranged on a side of the lifting member facing away from the positioning plate; when the positioning assembly moves from the first position to the second position, the lifting block can abut against the first wedge block to push the lifting member to move toward the positioning plate along the second direction.

6. The semiconductor packaging device according to claim 1, wherein: The packaging component includes a packaging seat, a packaging head and a second wedge block. The packaging seat is reciprocally movable along the second direction. The packaging head and the second wedge block are both arranged on the packaging seat. The packaging head can package the semiconductor on the positioning component located at the first position; the second wedge block is used to abut against the positioning component.

7. The semiconductor packaging device according to claim 6, characterized in that: The packaging head is reciprocally movable along the third direction and is disposed on the packaging seat; the positioning assembly includes a plurality of positioning grooves arranged at intervals along the third direction; Wherein, the third direction is arranged at an angle with the first direction and the second direction.

8. The semiconductor packaging device according to claim 1, wherein: The semiconductor packaging equipment further comprises a dust removal component, the dust removal component is arranged corresponding to the positioning component, and the packaging component and the dust removal component are linked; In the process that the packaging component moves along the second direction and pushes the positioning component to move to the second position, the packaging component can drive the dust removal component to blow air toward the positioning groove.

9. The semiconductor packaging device according to claim 8, characterized in that: The dust removal assembly includes a piston cylinder, a piston plate, an air blowing pipe, a connecting sleeve and a connecting rod. The piston plate is reciprocally movable in the piston cylinder along the length direction of the piston cylinder. The air blowing pipe is connected to the piston cylinder, and the air outlet end of the air blowing pipe is arranged corresponding to the positioning assembly. The connecting sleeve is connected to the piston plate, the connecting rod is rotatably arranged, and one end is arranged in the connecting sleeve. During the rotation of the connecting rod, the connecting sleeve can be driven to reciprocate along the length direction of the piston cylinder; the packaging assembly is linked with the connecting rod to drive the connecting rod to rotate during the reciprocating movement along the second direction.

10. The semiconductor packaging device according to claim 1, wherein: The semiconductor packaging equipment also includes a mounting platform and a sealing cover, wherein the sealing cover is arranged on the mounting platform to form a sealed cavity; the positioning component, the packaging component, the reset component and the top block are all arranged on the mounting platform and located in the sealed cavity.

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