Chip recovery device

Abstract

A chip recovery device recovers chips of a tape member discharged from a tape feeder using a tape member supply member. The chip recovery device is provided with a tubular recovery path and a positive pressure supply part. The recovery path has an air inlet at a first end and an air outlet at a second end. A swarf inlet opening into which swarf discharged from the tape feeder enters is provided in a region between the air inlet and the air outlet. The positive pressure supply unit supplies positive pressure to the air inlet of the recovery path, and forms an air flow in the recovery path from the air inlet toward the air outlet. As a result, the positive pressure supply unit delivers, to the air outlet, cuttings that have entered the recovery path through the cuttings entry opening.

Description

[0001] This application is a divisional application of the patent application with application number 202080082118.7, application date September 3, 2020, and invention name Chip Recovery Device. Technical Field

[0002] The present invention relates to a chip recovery device for recovering chips of a tape member discharged from a tape feeder. Background Art

[0003] The existing component assembly device (component mounting device) for assembling (installing) components on a substrate uses an assembly head to pick up the components supplied from the component supply unit and assembles them on the substrate. As the component supply unit, a tape feeder that supplies components through a tape member is often used. The tape feeder conveys a tape member (carrier tape) that stores a plurality of components in a row and supplies it to the component supply position. After the tape member to which the components are supplied is cut by a cutting device, it falls down through the chute part due to its own weight and is discharged.

[0004] The chips of the belt components discharged from the component assembly device are stored in a container provided below the component assembly device. The operator recovers the chips by pulling the container out from below the component assembly device. Therefore, in an operation line formed by arranging a plurality of component assembly devices, the chips of the belt components generated become a huge amount, and the recovery operation thereof becomes a heavy burden for the operator. Therefore, a chip recovery device that automatically recovers the chips has been proposed. For example, the following technology is disclosed in Patent Document 1: after the chips of the belt components that are cut and fall are guided into a tubular transfer path, positive pressure is applied to the side of the transfer path where the chips fall, and negative pressure is applied to the side where the chips are discharged, thereby causing the chips to move toward the outlet of the transfer path.

[0005] Prior art literature

[0006] Patent Literature

[0007] Patent Document 1: International Publication No. 2017 / 026030 Summary of the invention

[0008] The chip recovery device of the present invention recovers the chips of the belt component discharged from the belt feeder using the belt component supply component. The chip recovery device has a tubular recovery path and a positive pressure supply unit. The recovery path has an air inlet at the first end and an air outlet at the second end. A chip entry opening for the chips discharged from the belt feeder to enter is provided in the area between the air inlet and the air outlet. The positive pressure supply unit supplies positive pressure to the air inlet of the recovery path, and forms an air flow from the air inlet toward the air outlet in the recovery path. Thus, the positive pressure supply unit presses the chips entering the recovery path through the chip entry opening to the air outlet.

[0009] According to the present invention, it is possible to automatically collect the chips of the belt member with an inexpensive structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 This is a perspective view showing the chip recovery device according to the first embodiment of the present invention together with a work line including a plurality of component mounting devices.

[0011] Figure 2 yes Figure 1 A side view of one of the component assembly devices is shown.

[0012] Figure 3 yes Figure 2 An enlarged side cross-sectional view of a portion of a component assembly is shown.

[0013] Figure 4 yes Figure 1 A perspective view of the chip recovery device shown.

[0014] Figure 5 yes Figure 4 A partially exploded perspective view of a chip recovery device is shown.

[0015] Fig. 6A yes Figure 4 A cutaway perspective view of a portion of the chip recovery device shown.

[0016] Figure 6B It is shown Fig. 6A This is a diagram showing the state where the middle opening and closing plate is opened.

[0017] Fig. 7A yes Figure 4 A perspective view of a storage portion of the chip recovery device shown.

[0018] Figure 7B yes Fig. 7A A side view of the receiving portion is shown.

[0019] Fig. 8A It is an operation explanation diagram of the chip recovery device according to the first embodiment of the present invention.

[0020] Figure 8B Then Fig. 8A Operation diagram of the chip recovery device.

[0021] Figure 8C Then Figure 8B This is a diagram illustrating the operation of the chip recovery device.

[0022] Fig. 9A It is an operation explanation diagram of the chip recovery device according to the first embodiment of the present invention.

[0023] Fig. 9B Then Fig. 9A This is a diagram illustrating the operation of the chip recovery device.

[0024] Fig. 9C Then Fig. 9B This is a diagram illustrating the operation of the chip recovery device.

[0025] Fig. 10A yes Figure 7B The operation explanation diagram of the storage unit shown.

[0026] Fig. 10B Then Fig. 10A A diagram illustrating the operation of the storage unit.

[0027] Fig. 10C Then Fig. 10B A diagram illustrating the operation of the storage unit.

[0028] Fig.11A This is a cutaway perspective view of a portion of a chip recovery device according to a second embodiment of the present invention.

[0029] Fig. 11B yes Fig.11A A cross-sectional view of a portion of a chip recovery device is shown.

[0030] Fig. 12A This is a cutaway perspective view of a portion of a chip recovery device according to a third embodiment of the present invention.

[0031] Fig. 12B It is shown Fig. 12A A perspective view of the middle-bending opening and closing plate in an opened state.

[0032] Fig.13A It is an operation explanation diagram of the chip recovery device according to the third embodiment of the present invention.

[0033] Fig. 13B Then Fig.13A This is a diagram illustrating the operation of the chip recovery device.

[0034] Fig. 13C Then Fig. 13B This is a diagram illustrating the operation of the chip recovery device.

[0035] Fig.14 This is a cutaway perspective view of a portion of a chip recovery device according to a fourth embodiment of the present invention.

[0036] Fig.15A It is an operation explanation diagram of the chip recovery device according to the fourth embodiment of the present invention.

[0037] Fig. 15B Then Fig.15A This is a diagram illustrating the operation of the chip recovery device.

[0038] Fig.16A It is a cross-sectional view of a part of the chip recovery device according to the fourth embodiment of the present invention.

[0039] Fig. 16B This is a cross-sectional view of a part of another chip recovery device according to Embodiment 4 of the present invention.

[0040] Fig.17 This is a diagram for explaining the separation distance of the chip recovery device according to the fourth embodiment of the present invention.

[0041] Fig.18 It is a perspective view of a chip recovery device according to Embodiment 5 of the present invention.

[0042] Fig.19 It is a perspective view of a chip recovery device according to Embodiment 6 of the present invention.

[0043] Fig. 20 yes Fig.19 A cross-sectional view of a portion of a chip recovery device is shown.

[0044] Fig.21 It is a perspective view of a chip recovery device according to a seventh embodiment of the present invention.

[0045] Fig. 22 It is a perspective view of a chip recovery device according to an eighth embodiment of the present invention.

[0046] Fig.23 yes Fig. 22 A cross-sectional view of a portion of a chip recovery device is shown.

[0047] Fig.24 It is a side sectional view of a part of the chip recovery device according to the ninth embodiment of the present invention.

[0048] Fig.25 yes Fig.24 A cutaway perspective view of a portion of a recovery path of the chip recovery device shown.

[0049] Fig.26A It is an operation explanation diagram of the chip recovery device according to the ninth embodiment of the present invention.

[0050] Fig.26B Then Fig.26A This is a diagram illustrating the operation of the chip recovery device.

[0051] Description of Reference Numerals

[0052] 1: Chip recovery device, 2: Work line, 3: Component assembly device, 11: Base, 12: Cover member, 13: Work space, 14: Substrate conveying path, 15: Feeder carriage, 16: Tape feeder, 16K: Component supply position, 17: Tape reel, 18: Carrier tape, 21: Assembly head, 21N: Suction nozzle, 22: Head moving mechanism, 23: Control device, 31: Cutting device, 32: Slide, 32K: Discharge opening, 41: Recovery path, 41A: Air inlet, 41B: Air outlet, 41C: Upper wall, 41D: Lower wall, 41E: First vertical wall, 41F: Second vertical wall, 41K: Chip entry opening (opening), 41H: Ventilation hole, 42: Receiving portion, 42K: Chip receiving opening, 43: Positive pressure supply , 43V: control valve, 44: storage part, 51: air blower, 51N: air blow outlet, 52: pipeline, 60: opening and closing plate, 61: hinge, 71: external piping, 72: positive pressure source, 73: management device, 81: frame, 82: belt conveyor, 82B: belt, 82H: partition, 82J: driven pulley, 82K: driving pulley, 83: driving motor (motor), 84: driving belt, 85: belt guide, 86: chip passage, 87: storage box, 160: bending type opening and closing plate (opening and closing plate), 161: intermediate hinge, 162: first plate-shaped part, 163: second plate-shaped part, 260: plate-shaped member, KT: base end, ST: front end, RK: separation distance, KZ: chips, BH: parts. DETAILED DESCRIPTION

[0053] Before describing the embodiment of the present invention, the process of completing the concept of the present invention will be briefly described. The chip recovery device described in Patent Document 1 requires both a positive pressure generating device for generating positive pressure and a negative pressure generating device for generating negative pressure. Therefore, the equipment becomes larger and the manufacturing cost increases.

[0054] The present invention provides a chip recovery device capable of automatically recovering chips of a belt member with an inexpensive structure.

[0055] Hereinafter, various embodiments of the present invention will be described with reference to the drawings. It should be noted that the same components as those of the previous embodiments may be described with the same reference numerals, and detailed descriptions thereof may be omitted.

[0056] (Implementation method 1)

[0057] Figure 1The work line 2 to which the chip recovery device 1 of the embodiment 1 of the present invention is applied is shown. In the work line 2, a plurality of (here 3) component assembly devices 3 are arranged in series. The component assembly device 3 transfers the substrate KB to the adjacent downstream component assembly device 3. The component assembly devices 3 respectively assemble the components on the substrate KB. In this embodiment, in the work line 2, the substrate KB is transferred along the X-axis. That is, the X-axis is an axis extending horizontally from left to right when viewed from the operator OP, and the three component assembly devices 3 are arranged along the X-axis. The Y-axis is orthogonal to the X-axis in the horizontal plane. That is, the Y-axis extends from front to back when viewed from the operator OP. In addition, the Z-axis extends from bottom to top. The X-axis, Y-axis, and Z-axis are also defined in the same manner after the embodiment 2.

[0058] Figure 2 It is a side view of the component assembly device 3. The component assembly device 3 has a base 11 and a cover member 12 covering the upper part of the base 11, and two substrate conveying paths 14 are provided inside a working space 13 covered by the cover member 12. The substrate conveying paths 14 each have a conveying mechanism provided on the base 11, convey the substrate KB along the X-axis and position it at a predetermined working position.

[0059] Feeder carriages 15 are installed at the front and rear ends of the base 11. Figure 1 As shown in FIG. 1 , a plurality of tape feeders 16 arranged along the X-axis are respectively installed on the feeder carriage 15 . Figure 2 In the process, the tape feeder 16 takes in the carrier tape 18 (tape member) drawn out from the tape reel 17 held by the feeder carriage 15 and conveys it along the Y axis toward the substrate conveyance path 14. In this way, the tape feeder 16 supplies the components BH stored in the carrier tape 18 to the component supply position 16K.

[0060] Above the base 11, two assembly heads 21 are provided so as to be movable by a head moving mechanism 22. The assembly heads 21 each have a suction nozzle 21N extending downward. The head moving mechanism 22 includes, for example, an orthogonal coordinate robot, so that the two assembly heads 21 can be independently moved in a horizontal plane. The suction nozzles 21N of the assembly heads 21 each adsorb the component BH supplied by the tape feeder 16 to the component supply position 16K to the lower end for picking up.

[0061] The component mounting device 3 includes a control device 23. The control device 23 controls the operations of the substrate conveyance path 14, the tape feeder 16, the mounting head 21, and the head moving mechanism 22.

[0062] When performing component assembly operation, the control device 23 first operates the substrate conveying path 14 to receive the substrate KB from the device upstream (upstream of the flow of the substrate KB) and positions the substrate KB. After positioning the substrate KB, the control device 23 operates the tape feeder 16 to supply the component BH to the component supply position 16K, and operates the head moving mechanism 22 to cause the assembly head 21 to repeatedly perform the component transfer action. The component transfer action includes the action of the assembly head 21 picking up the component BH supplied by the tape feeder 16 and the action of the assembly head 21 assembling the picked-up component BH on the substrate KB.

[0063] The control device 23 causes the assembly head 21 to repeatedly perform the component transfer action to assemble all the components BH to be assembled on the substrate KB. After completing this series of actions, the control device 23 operates the substrate conveying path 14 to move the substrate KB downstream of the flow of the substrate KB. In this way, after the three component assembly devices 3 assemble the components BH on the substrate KB, the component assembly device 3 located at the most downstream position moves the substrate KB to the device downstream of the operation line 2 (downstream of the flow of the substrate KB), thereby completing the component assembly operation of each substrate KB.

[0064] Next, the chip recovery device 1 will be described. First, the cutting of the carrier tape 18 will be described. Figure 2 As shown, the feeder carriage 15 of the component assembly device 3 has a cutting device 31 and a chute 32. The cutting device 31 is provided below the tape feeder 16. The cutting device 31 cuts the carrier tape 18 after the tape feeder 16 has supplied the component BH. The chute 32 is provided below the cutting device 31. The chute 32 guides the chips KZ of the carrier tape 18 that is cut by the cutting device 31 and falls due to its own weight. Figure 3 yes Figure 2 An enlarged cross-sectional view of region III. Figure 3 As shown, the chips KZ are discharged downward from the discharge opening 32K at the lower end of the chute 32 , come out of the feeder carriage 15 , and enter the receiving portion 42 described later.

[0065] Thus, the chips KZ are generated from each of the component assembly devices 3 constituting the operation line 2, and the amount of chips KZ of the carrier 18 generated in the entire operation line 2 is huge. The chip recovery device 1 automatically collects a large amount of chips KZ generated from the operation line 2 to one location without relying on manpower, thereby facilitating waste treatment.

[0066] like Figure 4As shown, the chip recovery device 1 has two recovery paths 41, six receiving parts 42, a positive pressure supply part 43 and a storage part 44. The recovery path 41 is a tubular component extending along the arrangement direction of the component assembly device 3, and is arranged on the ground FL. That is, the recovery path 41 extends along the X-axis. There are two recovery paths 41 arranged in front and back. The recovery path 41 arranged on the front side corresponds to the three feeder carts 15 located on the front side, and the recovery path 41 arranged on the rear side corresponds to the three feeder carts 15 located on the rear side.

[0067] The recovery paths 41 extend linearly in the region below the plurality of component mounting devices 3 arranged in series along the X axis. Each recovery path 41 has an opening at a first end located upstream of the flow of the substrate KB and at a second end located downstream of the flow of the substrate KB (see also Figure 5 ). Hereinafter, the opening at the first end of the recovery path 41 is referred to as an air inlet 41A, and the opening at the second end of the recovery path 41 is referred to as an air outlet 41B.

[0068] like Fig. 6A , Figure 6B As shown, the recovery path 41 has a hollow shape with a rectangular cross section and includes an upper wall 41C, a lower wall 41D, and a first vertical wall 41E and a second vertical wall 41F arranged opposite to each other along the Y axis. The first vertical wall 41E is closer to the feeder cart 15 than the second vertical wall 41F.

[0069] like Figure 5 As shown, in the recovery path 41, a plurality of chip inlet openings (hereinafter referred to as openings) 41K are provided in the area between the air inlet 41A and the air outlet 41B. The chips KZ discharged from the belt feeder 16 through the chute 32 of the feeder carriage 15 enter the openings 41K. Figure 6B As shown, the opening 41K is provided on the first vertical wall 41E of the recovery path 41. Figure 5 As shown, the recovery path 41 corresponds to each of the three component mounting devices 3, and three openings 41K are provided in the recovery path 41 along the arrangement direction of the component mounting devices 3. That is, the three openings 41K are arranged along the X axis.

[0070] like Figure 4 as well as Figure 5 As shown, the area near the air outlet 41B of the recovery path 41 extends obliquely upward toward the air outlet 41B. The front portion of the recovery path 41 extending obliquely upward is a horizontal portion, and the air outlet 41B opens at the lower surface of the horizontal portion.

[0071] like Figure 5As shown, a vent hole 41H is provided near the air outlet 41B of each recovery path 41. In detail, the vent hole 41H is provided in a portion between an opening 41K located closest to the air outlet 41B and the air outlet 41B. In other words, the vent hole 41H is provided in the recovery path 41 at a position downstream of the most downstream opening 41K in the direction of the air flow in the recovery path 41 among the openings 41K. The vent hole 41H is an opening that connects the inside of the recovery path 41 with the outside. A mesh member having a mesh size that does not allow the chips KZ to pass through is installed in the vent hole 41H. Alternatively, the vent hole 41H may also have a size that does not allow the chips KZ to pass through.

[0072] like Fig. 6A , Figure 6B As shown, an opening and closing plate 60 serving as a baffle member for opening and closing the opening 41K is provided on the inner surface of the first vertical wall 41E. The opening and closing plate 60 is a flat rectangular member, and the base end portion KT of the opening and closing plate 60 is rotatably mounted on the inner surface of the recovery path 41. More specifically, the base end portion KT is mounted on the inner surface of the recovery path 41 via a hinge 61. The axis of the hinge 61 extends up and down. Therefore, the opening and closing plate 60 is configured to swing around the axis of the hinge 61 (i.e., in the direction within the horizontal plane) to open and close the opening 41K. That is, the opening and closing plate 60 is a door-shaped member, and the base end portion KT is freely rotatable around the axis of the hinge 61. In this way, the base end portion KT of the opening and closing plate 60 is mounted on the inner surface of the recovery path 41, and the opening and closing plate 60 is arranged in a manner that allows it to rotate around the base end portion KT.

[0073] Fig. 6A The state in which the opening and closing plate 60 is closed and the opening 41K is sealed is shown. Figure 6B The opening and closing plate 60 is opened and the opening 41K is open. Figure 6B It can be seen that the opening and closing plate 60 can be opened until the front end portion ST contacts the second vertical wall 41F of the recovery path 41 .

[0074] like Figure 2 As shown in FIG. 1 , the receiving portion 42 is provided on the ground FL below each of the feeder carts 15. The receiving portion 42 has a box shape as a whole, and as shown in FIG. Figure 5 As shown, the surface facing the recovery path 41 is open.

[0075] like Figure 5 to Figure 6B As shown, the receiving parts 42 are respectively installed on the outer sides of the first vertical wall 41E, and cover the opening 41K provided on the first vertical wall 41E from the outer side of the recovery path 41. Figure 4 as well as Figure 5 As shown, three receiving portions 42 are connected to the front recovery path 41 and the rear recovery path 41 , respectively.

[0076] like Figure 4 to Figure 6BAs shown in FIG. 4 , a chip receiving opening 42K opening upward is provided on the upper surface of the receiving portion 42. Figure 3 As shown, the chip receiving opening 42K is located directly below the chute 32 of the feeder carriage 15. Therefore, the chips KZ that pass through the chute 32 and fall due to their own weight enter the receiving portion 42 through the chip receiving opening 42K. That is, the receiving portion 42 receives the chips KZ discharged from the belt feeder 16 from the chip receiving opening 42K that is set in a manner of opening upward.

[0077] like Figure 3 as well as Figure 5 to Figure 6B As shown in FIG. 4 , an air blower 51 is provided inside the receiving portion 42. Figure 4 as well as Figure 5 As shown, three air blowers 51 provided at the three receiving parts 42 on the front side are connected in series through a pipe 52. Similarly, three air blowers 51 provided at the three receiving parts 42 on the rear side are connected in series through a pipe 52. The pipe 52 is an air supply path extending along the X-axis. In detail, in a top view, a plurality of air blowers 51 are connected to the pipe 52. The pipe 52 is provided approximately parallel to the recovery path 41. The downstream end of the air flow in the pipe 52 is closed, and the direction in which the air supplied to the pipe 52 flows is the same as the direction in which the air supplied to the recovery path 41 flows.

[0078] like Fig. 6A , Figure 6B As shown, the air blower 51 in the receiving portion 42 is provided with a plurality of air outlets 51N arranged along the extending direction of the duct 52. That is, the air outlets 51N are provided along the X axis. The air outlets 51N open toward the opening 41K of the recovery path 41, respectively.

[0079] like Figure 4 As shown, the positive pressure supply unit 43 is connected to the positive pressure source 72 via the external piping 71. The positive pressure supply unit 43 has a built-in control valve 43V. The air inlet 41A of each recovery path 41 and the upstream end of each pipeline 52 are connected to the control valve 43V via an internal piping (not shown) provided inside the positive pressure supply unit 43. The external piping 71 is connected to these internal piping via the control valve 43V.

[0080] The positive pressure supply unit 43 controls the positive pressure supplied from the positive pressure source 72 through the external pipe 71 by the control valve 43V, thereby supplying positive pressure to the air inlet 41A of each recovery path 41. When the positive pressure is supplied to the air inlet 41A of the recovery path 41, an air flow from the air inlet 41A to the air outlet 41B is formed in the recovery path 41.

[0081] The positive pressure supply unit 43 also controls the positive pressure supplied from the positive pressure source 72 by the control valve 43V, thereby supplying positive pressure to each of the pipes 52. When the positive pressure is supplied to the pipes 52, air is blown out from the air outlets 51N of the air blowers 51 in each receiving unit 42 connected to the pipes 52. When air is blown out from the air blowers 51, the opening and closing plates 60 are as shown in FIG. Figure 6B As shown in FIG. 4 , the receiving portion 42 is pushed away from the inner side thereof.

[0082] The operation of the control valve 43V is controlled by a valve which is set separately from the operation line 2. Figure 4 Alternatively, the operation of the control valve 43V may be controlled by one of the control devices 23 among the plurality of component assembly devices 3 constituting the work line 2.

[0083] like Fig. 7A , Figure 7B As shown, the storage section 44 has a belt conveyor 82. The belt conveyor 82 has a pair of frames 81, a plurality of pulleys and a belt 82B. The frames 81 are arranged opposite to each other along the X-axis. The plurality of pulleys include a driving pulley 82K and a plurality of driven pulleys 82J, and are supported by the frame 81 so as to be rotatable. The belt 82B is mounted on the plurality of pulleys. On the surface of the belt 82B, a partition 82H extending along the width of the belt 82B is provided at a constant interval.

[0084] A driving motor (hereinafter referred to as a motor) 83 is installed on one side of the frame 81. The motor 83 rotates the driving pulley 82K via the driving belt 84, thereby the belt 82B travels. A pair of belt guides 85 are provided on the frame 81, and the belt guides 85 guide the two ends of the belt 82B. Therefore, the belt 82B travels along a predetermined path. It should be noted that the operation of the motor 83 is controlled by the management device 73 or one of the control devices 23 in the plurality of component assembly devices 3.

[0085] like Figure 7B As shown, the conveying area conveyed by the belt conveyor 82 includes a discharge area R1 extending substantially horizontally along the Y axis, a rising area R2 connected to the discharge area R1 and directed obliquely upward, and a discarding area R3 connected to the rising area R2 and extending substantially horizontally along the Y axis. The drive pulley 82K is driven to rotate by the motor 83, whereby each part of the belt 82B moves in these three areas in sequence. That is, in the belt 82B, for example, the part sandwiched by two adjacent partitions 82H moves in the order of the discharge area R1 → the rising area R2 → the discarding area R3.

[0086] like Figure 4 As shown, the belt conveyor 82 is arranged so that the discharge area R1 of the belt 82B is located directly below the air outlets 41B of the two recovery paths 41. Figure 4 as well as Fig. 7A, Figure 7B As shown in FIG. 1 , a chip passage 86 is provided below the discarding region R3 of the belt 82B, and a storage box 87 is provided below the chip passage 86. The storage box 87 is a box-shaped member that is open upward.

[0087] Next, the operation of the chip recovery device 1 will be described. As described above, the chips KZ on the carrier belt 18 are discharged from the feeder carriage 15. The receiving portion 42 provided below the chute 32 is as shown in FIG. Fig. 8A as well as Fig. 9A As shown, the chips KZ are received through the chip receiving opening 42K.

[0088] The management device 73 performs the recovery operation of the chips KZ at a fixed time interval during the component assembly operation of the operation line 2. When the management device 73 performs the recovery operation of the chips KZ, first, the control valve 43V of the positive pressure supply unit 43 is operated to supply positive pressure to each pipeline 52. It should be noted that the management device 73 supplies positive pressure to the pipeline 52 in a state where positive pressure is not supplied to each air inlet 41A of the recovery path 41.

[0089] When positive pressure is supplied to each pipeline 52, as Figure 8B as well as Fig. 9B As shown by the dotted line FD in the figure, air is blown out from the air blower 51 (air blow outlet 51N). When the air is blown out from the air blower 51, the opening and closing plate 60 covering the opening 41K is pushed open by the air, and the opening 41K becomes an open state. In addition, the chips KZ in the receiving part 42 are pushed out from the opening 41K by the blown air, and enter the recovery path 41. As a result, the chips KZ in the receiving part 42 are transferred to the recovery path 41.

[0090] In this way, the air blower 51 provided in the receiving portion 42 transfers the chips KZ received by the receiving portion 42 into the recovery path 41 by blowing air from the receiving portion 42 toward the recovery path 41. In this way, the air blower 51 functions as a transfer portion that transfers the chips KZ received by the receiving portion 42 into the recovery path 41 in a state where the positive pressure supply portion 43 does not supply positive pressure to the air inlet 41A of the recovery path 41.

[0091] After the air is blown out from the air blower 51 in the receiving portion 42 through the pipe 52, the management device 73 controls the control valve 43V to stop the supply of positive pressure to the pipe 52. That is, the management device 73 stops the blowing of air from the air blower 51. Then, the management device 73 Figure 8C As shown by arrows P, positive pressure is supplied to the air inlet 41A of each recovery path 41. As a result, an air flow from the air inlet 41A toward the air outlet 41B is formed inside each recovery path 41.

[0092] When an air flow from the air inlet 41A toward the air outlet 41B is formed in the recovery path 41, as shown in FIG. Figure 8C , Fig. 9C As shown in FIG. 1 , the chips KZ transferred from the receiving portion 42 to the recovery path 41 are pressed toward the air outlet 41B due to the air flow (air pressure). In this way, the blowing of air from the air blower 51 stops, and an air flow is formed in the recovery path 41. Therefore, the opening and closing plates 60 provided in the recovery path 41 close the corresponding openings 41K respectively. Therefore, the chips KZ are not blocked by the opening and closing plates 60, and are smoothly pressed toward the air outlet 41B in the recovery path 41.

[0093] Thus, the positive pressure supply unit 43 supplies positive pressure to the air inlet 41A of the recovery path 41, thereby forming an air flow from the air inlet 41A to the air outlet 41B in the recovery path 41. Due to this air flow, the chips KZ entering the recovery path 41 through the opening 41K are pressed to the air outlet 41B.

[0094] The chips KZ that are pressure-fed toward the air outlet 41B in the recovery passage 41 are as follows. Fig. 10A The chips KZ fall downward from the air outlet 41B as shown. Furthermore, the chips KZ are discharged to the discharge area R1 of the belt 82B located below the air outlet 41B. The management device 73 continues to supply the positive pressure to the air inlet 41A for a predetermined time (several seconds). Then, after the chips KZ in the recovery path 41 are discharged from the air outlet 41B onto the belt 82B, the management device 73 stops supplying the positive pressure to the air inlet 41A of the recovery path 41.

[0095] As mentioned above, vent holes 41H are provided near the air outlets 41B of the recovery paths 41. While positive pressure is supplied to the air inlet 41A, the air in the recovery path 41 is released to the outside of the recovery path 41 through the vent holes 41H. Therefore, there is no situation where the pressure becomes extremely high at the downstream end of the recovery path 41 and the air flow rate is reduced. Therefore, it is possible to prevent a situation where a part of the chips KZ in the recovery path 41 does not reach the air outlet 41B due to the reduction in the air flow rate, thereby preventing a part of the chips KZ from being discharged. In particular, this is particularly effective in the case of a structure in which the area near the air outlet 41B of the recovery path 41 is shaped to be inclined upward and the chips KZ in this area climb the inclined surface of the recovery path 41 against their own weight.

[0096] The chips KZ in the recovery path 41 are as follows Fig. 10A After being discharged onto the belt 82B as shown in FIG. 1 , the management device 73 operates the motor 83 to cause the belt 82B to move. Fig. 10B In the rising region R2 shown in FIG. 1 , the battery is transported obliquely upward as shown by the arrow H1, and then as shown in FIG. Fig. 10CAs shown by the arrow H2, the chips KZ are transported to the discarding area R3. It should be noted that, as described above, a partition 82H extending along the width of the belt 82B is provided on the surface of the belt 82B. Therefore, the chips KZ will not separate (fall) from the belt 82B even in the rising area R2, and will be reliably transported to the discarding area R3.

[0097] like Fig. 10C As shown, the chips KZ transported to the discarding area R3 are discarded downward from the end of the discarding area R3. The chips KZ discarded from the end of the discarding area R3 fall through the chip passage 86 located directly below it and are stored in the storage box 87. Therefore, the chips KZ recovered through the two recovery paths 41 are finally stored in one storage box 87.

[0098] Thus, the belt conveyor 82 functions as a conveying section that conveys the chips KZ after receiving the chips KZ discharged from the air outlet 41B of the recovery path 41. More specifically, the belt conveyor 82 functions as a rising and falling section that raises and drops the chips KZ after receiving the chips KZ discharged from the air outlet 41B of the recovery path 41. In addition, the storage box 87 functions as a chip storage section that stores the chips KZ dropped from the belt conveyor 82 that serves as the rising and falling section.

[0099] After the chips KZ are stored in the storage box 87, the operator OP removes the storage box 87 from the storage portion 44, processes the chips KZ at a predetermined location, and returns the storage box 87 to its original position. Thus, a series of chip collecting operations are completed.

[0100] Thus, in the chip recovery device 1, the management device 73 performs a series of chip recovery actions of supplying positive pressure to the air inlet 41A of the recovery path 41 after supplying air to the air blower 51 through the pipe 52. Through this series of actions, even if the work line 2 has a plurality of component assembly devices 3 and each of the component assembly devices 3 has a feeder trolley 15, the chips KZ of the carrier 18 discharged from the plurality of feeder trolleys 15 can be collected in the collection section 44. That is, according to the chip recovery device 1, the chips KZ of the carrier 18 generated in the component assembly device 3 can be collected in one place (collection box 87) by using only positive pressure without using negative pressure.

[0101] The management device 73 repeatedly performs the above-mentioned chip recovery operation every time a constant time passes. The operator OP only needs to process the chips KZ stored in the storage box 87 every time the chip recovery operation is performed, or every time the chip recovery operation is performed multiple times. Therefore, even if the chips KZ of the carrier 18 generated from the operation line 2 become a huge amount, the burden of the chip KZ recovery operation performed by the operator OP is small, thereby greatly reducing the labor required for the chip KZ recovery operation.

[0102] (Implementation method 2)

[0103] Next, refer to Fig.11A , Fig. 11B The chip recovery device of the second embodiment of the present invention is described. The chip recovery device of the second embodiment has the same structure as that of the first embodiment except that the position of the hinge 61 for swinging the opening and closing plate 60 is different. In the second embodiment, the hinge 61 for swinging the opening and closing plate 60 is provided on the inner surface of the receiving portion 42 instead of the inner surface of the first vertical wall 41E of the recovery path 41. Even in such a case, the opening and closing plate 60 plays the same role as that of the first embodiment, so the same effect as that of the first embodiment can be obtained.

[0104] (Implementation method 3)

[0105] Next, refer to Figures 12A to 13C The chip recovery device of the third embodiment of the present invention is described. The chip recovery device of the third embodiment has the same structure as the first embodiment except that the structure of the baffle member is different. In the first embodiment, the opening and closing plate 60 as the baffle member is a flat plate-shaped member. In contrast, in the actual scheme 3, Fig. 12A , Fig. 12B The bending type opening and closing plate (hereinafter referred to as the opening and closing plate) 160 shown functions as a shutter member.

[0106] The opening and closing plate 160 has a first plate-shaped portion 162, an intermediate hinge 161, and a second plate-shaped portion 163. The first plate-shaped portion 162 includes a base end portion KT mounted on the inner surface of the first vertical wall 41E of the recovery path 41 via a hinge 61. The second plate-shaped portion 163 includes a front end portion ST on the opposite side of the base end portion KT in the opening and closing plate 160 as a whole. The intermediate hinge 161 connects the first plate-shaped portion 162 and the second plate-shaped portion 163. The intermediate hinge 161 is located in the middle portion between the base end portion KT and the front end portion ST, and has an axis parallel to the hinge 61. That is, the portion from the base end portion KT to the intermediate hinge 161 is the first plate-shaped portion 162, and the portion from the intermediate hinge 161 to the front end portion ST is the second plate-shaped portion 163. Therefore, the opening and closing plate 160 of the third embodiment can swing (bend) around an axis parallel to the axis of the hinge 61 and extending vertically not only at the base end KT but also at the intermediate portion between the base end KT and the tip end ST.

[0107] like Fig. 12A As shown in FIG. 4 , when the opening 41K is closed, the first plate-shaped portion 162 and the second plate-shaped portion 163 are in a posture extending in the same plane. Fig. 12BAs shown, when the opening 41K is opened, the first plate portion 162 extends along the Y axis substantially across the recovery path 41. The second plate portion 163 is bent relative to the first plate portion 162 so that the front end ST of the second plate portion 163 abuts against the second vertical wall 41F.

[0108] In the third embodiment, as in the first embodiment, when the chips KZ are Fig.13A After being received into the receiving portion 42 as shown, Fig. 13B As shown by the dotted line FD, the management device 73 supplies positive pressure to the pipeline 52, and air is blown out from the air blower 51 in the receiving portion 42. Fig. 13B As shown in FIG. 1 , the opening 41K is opened by being pressed by air and bent at the middle hinge 161, so that the opening 41K becomes an open state. In addition, under the action of the air blown from the air blower 51, the chips KZ in the receiving part 42 enter the recovery path 41 from the opening 41K. That is, the chips KZ in the receiving part 42 are transferred to the recovery path 41.

[0109] After the chips KZ in the receiving portion 42 are transferred to the recovery path 41, the management device 73 stops the supply of positive pressure to the pipeline 52, thereby stopping the blowing of air from the air blower 51. Fig. 13C As shown by the arrow P, positive pressure is supplied to the air inlet 41A of the recovery path 41. As a result, an air flow from the air inlet 41A toward the air outlet 41B is formed in the recovery path 41, and the chips KZ moving into the recovery path 41 are pressed toward the air outlet 41B. At this time, the opening and closing plate 160 is pressed by the air flowing in the recovery path 41 to close the opening 41K, so the movement of the chips KZ in the recovery path 41 is not hindered by the opening and closing plate 160.

[0110] Thus, in the chip recovery device of the third embodiment, the same effect as that of the chip recovery device 1 of the first embodiment can be obtained. Fig. 13B It can be seen that the area of ​​the opening 41K opened when the opening and closing plate 160 is in the state of opening the opening 41K is larger than that in the case of the first embodiment (see Figure 8B Therefore, the chips KZ are transferred from the receiving portion 42 to the recovery path 41 more smoothly.

[0111] (Implementation method 4)

[0112] Next, refer to Figure 14 to Figure 17 The chip recovery device of the fourth embodiment is described. Fig.14As shown in FIG. 1 , the chip recovery device of the fourth embodiment has the same structure as that of the first embodiment except that a plate-shaped member 260 is provided instead of the shutter member (opening and closing plate 60 ) of the first embodiment.

[0113] like Fig.14 as well as Fig.15A , Fig. 15B As shown, the plate-like member 260 fixes the base end KT to the inner surface of the first vertical wall 41E of the recovery path 41 and is supported in a cantilever state. The base end KT is fixed at a position upstream of the opening 41K in the air flow. The front end ST is the end on the side opposite to the base end KT. The area from the base end KT to the front end ST extends obliquely toward the second vertical wall 41F as it moves from the upstream to the downstream of the air flow in the recovery path 41. That is, the front end ST, therefore, the plate-like member 260 makes the flow path cross-sectional area of ​​the air in the recovery path 41 smaller as it moves from the upstream to the downstream. Furthermore, the front end ST of the plate-like member 260 is separated from the inner surface of the recovery path 41. Therefore, the front end ST is separated from both the inner surface of the first vertical wall 41E and the inner surface of the second vertical wall 41F.

[0114] In this way, the base end KT of the plate-like member 260 is installed on the inner surface of the recovery path 41 and is located upstream of the air flow than the opening 41K, and the front end ST on the opposite side of the base end KT of the air flow is located downstream of the air flow than the base end KT and is separated from the inner surface of the recovery path 41.

[0115] In the fourth embodiment, as in the first embodiment, the management device 73 first performs Fig.15A Air is blown out from the air blower 51 as shown by the dotted line FD, and the chips KZ in the receiving portion 42 are transferred to the recovery path 41. At this time, the chips KZ in the receiving portion 42 enter the recovery path 41 from the area between the inner surface of the recovery path 41 (the inner surface of the first vertical wall 41E) and the plate-shaped member 260.

[0116] After the chips KZ in the receiving portion 42 are transferred to the recovery path 41, the management device 73 stops blowing air from the air blower 51, as shown in FIG. Fig. 15B As shown by arrow P, positive pressure is supplied to the air inlet 41A of the recovery passage 41 . Thus, an air flow from the air inlet 41A toward the air outlet 41B is formed in the recovery passage 41 , and the chips KZ are pressure-fed toward the air outlet 41B of the recovery passage 41 .

[0117] In the air flow formed in the recovery path 41, the cross-sectional area of ​​the air flow path is locally reduced at the portion where the plate-like member 260 is provided, so that the flow velocity is slowed down and the pressure is increased. As a result, the cross-sectional area of ​​the air flow path is locally reduced in the area between the second vertical wall 41F and the plate-like member 260 on the front side of the front end ST of the plate-like member 260, that is, the front side area HG. Therefore, pressure loss occurs downstream of the plate-like member 260. As a result, in the area between the plate-like member 260 and the receiving portion 42 on the back side of the front end ST of the plate-like member 260, that is, the back side area RG, the pressure is relatively lower than that in the front side area HG.

[0118] In this way, the pressure of the back region RG is relatively low compared with the pressure of the front region HG. However, the air in the recovery path 41 hardly flows from the front region HG of the plate-shaped member 260 to the back region RG. This is because the plate-shaped member 260 extends obliquely toward the second vertical wall 41F as it moves from the upstream to the downstream of the air flow in the recovery path 41. Even if the air contacts the plate-shaped member 260, as a whole, the flow direction of the air is roughly maintained from the upstream to the downstream. In addition, since the pressure of the back region RG is relatively low compared with the pressure of the front region HG, the pressure inside the receiving portion 42 is relatively high compared with the pressure of the back region RG. As a result, the air inside the receiving portion 42 is introduced into the recovery path 41. Therefore, even if the back region RG is connected to the internal space of the receiving portion 42, the air in the recovery path 41 will not flow toward the receiving portion 42. Therefore, the chips KZ transferred to the recovery path 41 will not return to the chute 32 (backflow) from the receiving portion 42, but will be sent to the downstream of the recovery path 41.

[0119] Thus, in the chip recovery device of the fourth embodiment, the same effect as that of the first embodiment can be obtained. In addition, in the fourth embodiment, there is no movable member like the opening and closing plate 60 of the first embodiment, and a simple structure is obtained. It should be noted that in the fourth embodiment, the plate-like member 260 functions as a backflow prevention portion that prevents the air in the recovery path 41 from flowing back toward the receiving portion 42.

[0120] However, when positive pressure is supplied to the air inlet 41A, the pressure in the recovery path 41 gradually decreases from the air inlet 41A toward the air outlet 41B. Fig.16A , Fig. 16BAs shown, when a plurality of openings 41K are arranged in a row along the direction of the air flow of the recovery path 41, the distance between the front end ST of the plate-like member 260 and the inner surface of the first vertical wall 41E, i.e., the separation distance RK, can be gradually reduced as it approaches the downstream of the air. That is, the plate-like member 260 can be installed in a manner that satisfies T1>T2>T3. In this way, the pressure difference between the front side and the back side of the front end ST of the plate-like member 260 can be made substantially the same.

[0121] The separation distance RK can be Fig.17 The length L of the plate-like member 260 shown in the figure and the angle θ of the plate-like member 260 opened from the first vertical wall 41E are adjusted. The length L is the length from the base end KT to the front end ST. Therefore, in order to gradually reduce the separation distance RK along the air flow, the separation distance RK of the plate-like member 260 is made smaller as it is located downstream of the air flow. That is, when a plurality of openings 41K are arranged in the direction of the air flow, when two plate-like members 260 are arbitrarily selected, the separation distance RK of the downstream plate-like member 260 is smaller than the separation distance RK of the upstream plate-like member 260.

[0122] And, specifically, if Fig.16A As shown, the lengths L of the plurality of plate-like members 260 are made the same, and the angle θ opened from the inner surface of the recovery path 41 is made smaller as the position is located downstream of the air flow. That is, when two plate-like members 260 are arbitrarily selected, the angle opened from the inner surface of the recovery path 41 by the downstream plate-like member 260 is smaller than the angle opened from the inner surface of the recovery path 41 by the upstream plate-like member 260.

[0123] Or, if Fig. 16B As shown, the angle θ of the opening of the plurality of plate-like members 260 from the inner surface of the recovery path 41 is made the same, and the length L is made smaller as the position is located downstream of the air flow. That is, when two plate-like members 260 are arbitrarily selected, the length L of the downstream plate-like member 260 is smaller than the length L of the upstream plate-like member 260.

[0124] (Implementation method 5)

[0125] Next, refer to Fig.18The chip recovery device of the fifth embodiment is described. The chip recovery device of the fifth embodiment has the same structure as that of the first embodiment except for the arrangement of the pipeline 52. In the first embodiment, the three air blowers 51 in the three receiving parts 42 arranged along the X-axis are connected in series by a pipeline 52. In contrast, in the fifth embodiment, the three air blowers 51 are directly connected to the positive pressure supply part 43 through separate pipelines 52, so that the positive pressure is directly supplied to each air blower 51 from the positive pressure supply part 43. It should be noted that the downstream end of each air flow of the pipeline 52 is blocked.

[0126] As for the pressure in the pipe 52 to which the positive pressure is applied from the positive pressure supply unit 43, the pressure becomes higher as it approaches the downstream of the air flow. Therefore, the more downstream the receiving unit 42 is, the higher the high-pressure air is blown out from the air blower 51. In contrast, in Embodiment 5, air of substantially the same pressure can be blown out from the positive pressure supply unit 43 to each air blower 51. Therefore, the blowing flow rate of the air when the chips KZ are transferred from each receiving unit 42 to the recovery path 41 can be substantially the same. It should be noted that this structure can be applied not only to Embodiment 1 but also to Embodiments 2 to 4.

[0127] (Implementation method 6)

[0128] Next, refer to Fig.19 , Fig. 20 The chip recovery device of embodiment 6 is described. Fig.19 As shown, except for the setting mode of the pipeline 52, the chip recovery device of embodiment 6 has the same structure as embodiment 1. In embodiment 1, the direction of the air flowing in the pipeline 52 is the same as the direction of the air supplied to the recovery path 41. In contrast, in embodiment 6, the direction of the air flowing in the pipeline 52 is opposite to the direction of the air supplied to the recovery path 41. That is, in embodiment 6, in a top view, three air blowers 51 are connected in series by a pipeline 52, and the pipeline 52 is arranged roughly parallel to the recovery path 41. The downstream end of the air flow in the pipeline 52 is blocked. The direction of the air flow supplied to the pipeline 52 is opposite to the air supplied to the recovery path 41. The pipeline 52 is arranged roughly parallel to the recovery path 41, which means that the angle formed by the pipeline 52 and the recovery path 41 is, for example, greater than 0 degrees and less than 45 degrees. The angle is more preferably greater than 0 degrees and less than 10 degrees, and further preferably greater than 0 degrees and less than 5 degrees.

[0129] The pressure in the pipe 52 to which the positive pressure is applied from the positive pressure supply unit 43 increases toward the downstream of the air flow. Similarly, in one air blower 51, the pressure of the air blown out from the plurality of air outlets 51N increases as the air outlet 51N is located downstream of the air flow in the pipe 52. Fig. 20 In the structure shown, the air outlet 51N located upstream of the air flow in the recovery path 41 blows out higher pressure air. Therefore, a pressure gradient is generated in the air blown out from the air blower 51 in the receiving portion 42. That is, the pressure is higher the further upstream the air flow in the recovery path 41 is. Fig. 20 As shown in FIG. 1 , the direction of the air flow blown from the receiving portion 42 into the recovery path 41 is an inclined direction having a component of the direction in which the air flows in the recovery path 41. The direction in which the air flows in the recovery path 41 is from the air inlet 41A toward the air outlet 41B. Fig. 20 The middle is the direction from left to right.

[0130] As described above, the flow direction of the air blown from the receiving portion 42 into the recovery path 41 has a component of the direction in which the air flows in the recovery path 41, so the chips KZ transferred from the receiving portion 42 to the recovery path 41 are not easy to move upstream in the recovery path 41. In addition, since the strength of the air blown out from the plurality of air outlets 51N is different, even if a block of chips KZ is formed in the receiving portion 42, the block of chips KZ will disperse. Therefore, the chips KZ in the receiving portion 42 are smoothly transferred to the recovery path 41. Then, when air is supplied to the recovery path 41, the chips KZ will not stagnate in the recovery path 41 and cause blockage, but will be transported downstream. It should be noted that this structure can be applied not only to embodiment 1 but also to embodiments 2 to 4.

[0131] (Implementation method 7)

[0132] Next, refer to Fig.21 The chip recovery device of the seventh embodiment is described. The chip recovery device of the seventh embodiment has the same structure as the first embodiment except for the arrangement of the pipeline 52. In the first embodiment, the three air blowers 51 in the three receiving parts 42 arranged along the X-axis are connected in series by one pipeline 52. Fig.18 Similarly to the embodiment 5 shown in the figure, the three air blowers 51 are directly connected to the positive pressure supply unit 43 through separate pipes 52, so that the positive pressure supply unit 43 directly supplies positive pressure to the three air blowers 51 arranged along the X axis. Fig.19In the case of the sixth embodiment shown, the direction of the air flowing through the duct 52 is similarly opposite to the direction of the air supplied to the recovery path 41. It should be noted that the downstream end of each duct 52 in the air flow is closed.

[0133] In Embodiment 7, similarly to Embodiment 6, regarding the pressure in the pipeline 52 to which positive pressure is applied from the positive pressure supply unit 43, the pressure becomes higher as it approaches the downstream of the air flow. Similarly, regarding the pressure of the air blown out from a plurality of air outlets 51N possessed by an air blower 51, the pressure of the air blown out becomes higher as the air outlet 51N is located downstream of the air flow in the pipeline 52. That is, the higher the pressure of the air blown out is as the air outlet 51N is located upstream of the air flow in the recovery path 41. Therefore, a gradient is generated in the pressure of the air blown out from the air blower 51 in the receiving portion 42. That is, the pressure becomes higher as it approaches the upstream of the air flow in the recovery path 41. As shown in FIG. Fig. 20 As shown, the direction of the air flow blown from the receiving portion 42 into the recovery path 41 is an inclined direction having a component of the direction in which the air flows in the recovery path 41. Therefore, in the seventh embodiment, the same effects as those of the sixth embodiment can be obtained.

[0134] In addition, in the seventh embodiment, as in the case of the fifth embodiment, the air blowers 51 are directly connected to the positive pressure supply unit 43 through separate pipes 52. Therefore, positive pressure is directly supplied from the positive pressure supply unit 43 to the three air blowers 51 arranged along the X axis. Therefore, the blowing flow rate of the air when the chips KZ are transferred from each receiving unit 42 to the recovery path 41 can be made substantially the same, so that the same effect as in the fifth embodiment can be obtained.

[0135] (Implementation method 8)

[0136] Next, refer to Fig. 22 , Fig.23 The chip recovery device of the eighth embodiment is described. Fig. 22 As shown in the figure, the chip recovery device of the eighth embodiment has the same structure as the first embodiment except for the arrangement of the pipeline 52. In the first embodiment, the three air blowers 51 in the three receiving parts 42 arranged along the X axis are respectively connected in series by a pipeline 52. Fig.18 The situation of the fifth embodiment shown and Fig.21 Similarly to the embodiment 7 shown in the figure, the three air blowers 51 are directly connected to the positive pressure supply unit 43 through separate pipes 52. Therefore, positive pressure is directly supplied from the positive pressure supply unit 43 to the three air blowers 51 arranged along the X axis. Fig.23As shown, air is supplied from the outside of the air blower 51. That is, when viewed from the air blower 51, air is supplied from the outside on the Y axis. Therefore, positive pressure is uniformly applied to the multiple (here, 3) air outlets 51N of the air blower 51. Therefore, the air blowing flow rate when the chips KZ are transferred from the receiving portion 42 to the recovery path 41 can be made substantially the same at the multiple air outlets 51N.

[0137] (Implementation method 9)

[0138] Next, refer to Figure 24 to Figure 26B The chip recovery device of the ninth embodiment is described. In the chip recovery device of the ninth embodiment, the opening 41K is provided on the upper surface of the recovery path 41, and the receiving portion 42 and the air blower 51 are not provided. In addition, the opening 41K functions as a chip receiving opening. The other structures are the same as those of the first embodiment.

[0139] In the ninth embodiment, the same plate-like member 260 as in the fourth embodiment is also used. The base end portion KT of the plate-like member 260 is fixed to the inner surface of the upper wall 41C of the recovery path 41. Figure 25 to Figure 26B As shown, the base end KT of the plate member 260 is fixed upstream of the opening 41K in the air flow. The plate member 260 extends obliquely downward so that the flow path cross-sectional area in the recovery path 41 decreases from upstream to downstream in the air flow in the recovery path 41.

[0140] As previously mentioned Figure 2 , Figure 3 As described above, the chips KZ fall from the chute 32 provided in the feeder carriage 15 of the component mounting device 3 due to their own weight. Fig.24 , Fig.26A As shown in the figure, in the ninth embodiment, the chips KZ falling from the chute 32 due to their own weight directly enter the recovery path 41 from the opening 41K. Therefore, the air blower 51 as in the first embodiment is not provided, and the positive pressure supply unit 43 can supply positive pressure to the air inlet 41A of the recovery path 41 at any time. When the positive pressure is supplied to the air inlet 41A of the recovery path 41, as shown in the figure, the air blower 51 is not provided, and the positive pressure supply unit 43 can supply positive pressure to the air inlet 41A of the recovery path 41 at any time. Fig.26B As shown by arrow P, an air flow from the air inlet 41A toward the air outlet 41B is formed in the recovery passage 41. The chips KZ in the recovery passage 41 are pressure-fed toward the air outlet 41B.

[0141] In the air flow from the air inlet 41A toward the air outlet 41B in the recovery path 41, the flow path cross-sectional area is locally reduced at the location where the plate-shaped member 260 is provided, so that the flow velocity is slowed down and the pressure is increased. In this way, the flow path cross-sectional area of ​​the air is locally reduced in the area on the surface side of the front end ST of the plate-shaped member 260 and the lower side of the plate-shaped member 260, that is, the surface side area HG. Therefore, pressure loss is generated downstream of the plate-shaped member 260. As a result, the pressure in the area on the back side of the front end ST of the plate-shaped member 260 and the upper side of the plate-shaped member 260, that is, the back side area RG, is relatively reduced compared with the surface side area HG. Therefore, based on the same reasons as the case of embodiment 4, the air in the recovery path 41 hardly flows from the surface side area HG of the plate-shaped member 260 to the back side area RG. Therefore, even if the back side area RG is connected to the internal space of the receiving portion 42, the air in the recovery path 41 will not flow toward the receiving portion 42. As a result, the chips KZ transferred into the recovery passage 41 are sent downstream of the recovery passage 41 without returning from the receiving portion 42 to the chute 32 (backflow).

[0142] In this way, the chips KZ falling into the recovery passage 41 are pressed toward the air outlet 41B by the positive pressure supplied from the air inlet 41A of the recovery passage 41. Therefore, in the ninth embodiment, the same effect as that of the first embodiment can be obtained. It should be noted that in the ninth embodiment, the plate-shaped member 260 also functions as a backflow prevention portion that prevents the air in the recovery passage 41 from flowing back toward the receiving portion 42.

[0143] As described above, the chip recovery device 1 of the first to ninth embodiments has a tubular recovery path 41, which has an air inlet 41A at the first end and an air outlet 41B at the second end, and has an opening 41K on the side wall for the chips KZ discharged from the component assembly device 3 to enter. In addition, a positive pressure is supplied to the air inlet 41A to form an air flow from the air inlet 41A toward the air outlet 41B, whereby the chips KZ entering the inside of the recovery path 41 through the opening 41K are pressed toward the air outlet 41B. In the chip recovery device 1 of the first to ninth embodiments, the chips KZ are pressed only by the positive pressure, so that a negative pressure generating device is not required, and the chips KZ of the carrier 18 can be automatically recovered with an inexpensive structure.

[0144] So far, the embodiments of the present invention have been described, but the present invention is not limited to the above contents, and various modifications are possible. For example, the storage section 44 may also adopt a structure in which a storage box 87 is provided below the air outlet 41B of each recovery path 41. In this case, the height of the storage box 87 is limited to be less than the height of the air outlet 41B. In this regard, according to embodiments 1 to 9, as long as the height of the discharge area R1 of the belt 82B constituting the storage section 44 is less than the height of the air outlet 41B, the height of the storage box 87 itself may also be higher, and a large-capacity storage box 87 may be used.

[0145] In addition, in embodiments 1 to 8, the transfer section adopts a structure that blows air to transfer the chips KZ in the receiving section 42 to the recovery path 41. In addition to this, a conveying device or the like may be provided in the receiving section 42. The conveying device or the like functions as a transfer section that transfers the chips KZ in the receiving section 42 to the recovery path 41. Alternatively, air may be transported by an air supply device using an electric motor. In this case, the air supply device functions as a transfer section. In addition, in the above-mentioned embodiments 1 to 9, the recovery path 41 is provided with two at the front and rear, but in the component assembly device 3, only one is provided. Figure 2 In the case of a left-right single-side structure from the center, the recovery path 41 may be one. In addition, in the above-mentioned embodiments 1 to 9, three component assembly devices 3 each including two belt feeders 16 are arranged in series, and the recovery path 41 extends linearly in the area below the component assembly device 3. However, the number of component assembly devices 3 is not limited to three. It may be one, two, or more than four.

[0146] Industrial Applicability

[0147] The present invention provides a chip recovery device capable of automatically recovering chips of a tape member with an inexpensive structure. Therefore, the device is useful in a component mounting device that supplies components using a tape feeder and mounts the components on a substrate or the like.

Claims

1. A chip recovery device for recovering chips of a tape member discharged from a tape feeder using a tape member supplying means, wherein: The chip recovery device comprises: a plurality of tubular recovery paths extending in a straight line and having a first end and a second end, and a chip entry opening for the chips discharged from the belt feeder to enter is provided in a region between the first end and the second end; as well as A positive pressure supply unit supplies positive pressure to each of the plurality of recovery paths arranged in an array, and forms an air flow toward the second end in the plurality of recovery paths, thereby pressing the chips entering the plurality of recovery paths through the chip inlet opening to the second end.

2. The chip recovery device according to claim 1, wherein: A plurality of component assembly devices each having the tape feeder are arranged in series, The plurality of recovery paths extend linearly in regions below the plurality of component mounting devices, respectively.

Images