Luminous spike capable of improving visibility
By compactly configuring the lath nails of the shell part, main light emitting part, solar cell and light guide plate, the problems of existing lath nails are easily corrosive and low light guide efficiency in the natural environment, and the volume is minimized and the light guide efficiency is maximized. effect.
Patent Information
- Application Number
- CN202280097158.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2022-06-20
- Filing Date
- 2022-12-07
- Publication Date
- 2025-02-07
AI Technical Summary
Existing track nails are susceptible to corrosion and damage in the natural environment, resulting in a reduced life and brightness, and their size is large, resulting in a reduced light guide efficiency.
A compact configuration of the staple is designed, including a housing part, a main light emitting part, a solar cell and a light guide plate, which is powered to the main light emitting part by charging the solar cell, and the light guide plate is used to improve visibility.
The minimization of volume and maximum light guide efficiency are achieved, extending the life of the staple and improving its visibility at night.
Smart Images

Figure CN119403980A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a road spike, and more particularly to a road spike that is charged by a solar cell and emits light using the solar cell. Background Art
[0002] Generally, road studs are one of the safety sign mechanisms installed on the road. They are installed in the center line of the road, the lane dividing line or the safety zone of the branch road, in front of the crosswalk and the anti-speeding zone, etc., to ensure safe operation. When driving at night, they reflect the light of the vehicle's headlights to ensure the driver's vision of the lane line to ensure safe operation.
[0003] The road studs used in this manner have reflectors applied or attached to the front and rear surfaces in various forms, and are protrudingly provided on the road surface in order to ensure visibility of the road surface.
[0004] Therefore, the road studs are not only unable to exert their functions because the protruding reflectors are coated with dust and dirt ejected from vehicles, but also corroded or damaged by sunlight, snow, rain and various foreign objects on the road in the natural environment, resulting in a reduced lifespan and reduced brightness, thus causing problems of being unable to exert their own lifespan and functions.
[0005] Therefore, recently, a solar road stud using a light emitting diode light source charged by sunlight has been developed and installed so as to be embedded in the surface of the road without being protruding and to facilitate ensuring visibility at night.
[0006] On the other hand, Korean Patent Registration No. 10-1330858 discloses a road stud that is charged by sunlight through a solar cell panel 3 and has a light guide plate 5 to improve visibility.
[0007] However, since the configuration of the structural elements constituting the road stud is not compact, the volume of the road stud itself increases, which leads to a problem of reducing the light guiding efficiency. Summary of the invention
[0008] Technical issues
[0009] The present invention is proposed to solve the above-mentioned problems, and provides a road stud that can compactly arrange various structural elements, minimize the volume, and maximize the efficiency of light guide.
[0010] The problems to be solved by the present invention are not limited to the above-mentioned problems, and a person skilled in the art can clearly understand the unmentioned problems from this specification and the attached drawings.
[0011] Technical Solution
[0012] A road spike according to an embodiment of the present invention may include: an outer shell forming an inner space; a main light-emitting portion disposed in the inner space and emitting light; a solar cell disposed in the inner space and generating electricity through sunlight so as to supply electricity to the main light-emitting portion; and a light guide plate disposed in the inner space and disposed on the upper side in the height direction of the solar cell.
[0013] Effects of the Invention
[0014] The road spike according to an embodiment of the present invention has the advantages of being able to compactly configure various structural elements, minimize the volume, and maximize the efficiency of light guiding.
[0015] The effects of the present invention are not limited to the above-mentioned effects, and those skilled in the art can clearly understand the unmentioned effects from this specification and the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 FIG. 1 is a simplified three-dimensional diagram of a road spike according to an embodiment of the present invention.
[0017] Figure 2 FIG. 1 is a simplified exploded perspective view of a road spike according to an embodiment of the present invention.
[0018] Figure 3 is a simplified three-dimensional diagram of the covering portion of a road spike according to an embodiment of the present invention. Figure 3 Part (a) is a three-dimensional view of the upper side of the cover portion. Figure 3 Part (b) is a three-dimensional view of the lower side of the cover portion.
[0019] Figure 4 The figure is a simplified three-dimensional diagram of a main light-emitting portion, a main PCB substrate, a sub-light-emitting portion and a sub-PCB substrate of a road stud according to an embodiment of the present invention.
[0020] Figure 5 FIG. 1 is a simplified three-dimensional diagram of a solar cell of a road spike according to an embodiment of the present invention.
[0021] Figure 6 FIG. 1 is a simplified three-dimensional diagram of a light guide plate of a road stud according to an embodiment of the present invention.
[0022] Figure 7 The schematic top view is a diagram showing a solar cell of a road spike according to an embodiment of the present invention being arranged on a main PCB substrate.
[0023] Figure 8 FIG. 1 is a schematic top view showing a light guide plate of a road stud configured on a solar cell according to an embodiment of the present invention.
[0024] Fig. 9 The schematic side cross-sectional view is a road spike according to an embodiment of the present invention cut along a direction crossing the main light emitting portion.
[0025] Fig.10 FIG. 1 is a schematic side cross-sectional view of a road spike according to an embodiment of the present invention, cut along a direction crossing the sub-light emitting portion. DETAILED DESCRIPTION
[0026] The specific embodiments of the present invention are described in detail below with reference to the accompanying drawings. However, the concept of the present invention is not limited to the embodiments provided, and a person skilled in the art who understands the concept of the present invention can easily propose other inventions or other embodiments included in the concept of the present invention by adding, changing, or deleting other structural elements within the same concept, and these also belong to the concept of the present application.
[0027] A road spike according to an embodiment of the present invention may include: an outer shell forming an inner space; a main light-emitting portion disposed in the inner space and emitting light; a solar cell disposed in the inner space and generating electricity through sunlight so as to supply electricity to the main light-emitting portion; and a light guide plate disposed in the inner space and disposed on the upper side in the height direction of the solar cell.
[0028] Furthermore, the present invention may further include a main PCB substrate for supplying power to the main light-emitting portion, wherein the main light-emitting portion protrudes from the upper side of the main PCB substrate in the height direction, and the solar cell is arranged on the upper side of the main PCB substrate in the height direction and is placed on the main light-emitting portion so as to be separated from the main PCB substrate.
[0029] Furthermore, the present invention may further include a main PCB substrate for supplying power to the main light-emitting portion, and the solar cell may further include: a sub-PCB substrate, which is arranged on the upper side of the main PCB substrate in the height direction and protrudes from the main PCB substrate toward the upper side in the height direction; and a sub-light-emitting portion, which receives power from the sub-PCB substrate to emit light.
[0030] Furthermore, the side surfaces of the solar cell and the light guide plate may face the sub-PCB substrate, and the movement in the horizontal direction may be restricted by the server PCB substrate.
[0031] Furthermore, the main light emitting portion may be formed by protruding from the upper side of the main PCB substrate toward the height direction, and the light guide plate may form a through space, which is a space through which the main light emitting portion penetrates toward the height direction.
[0032] Furthermore, in the light guide plate, at least a portion may overlap with the main light emitting portion in a horizontal direction, and at least a portion may overlap with the sub-light emitting portion in the horizontal direction.
[0033] Furthermore, the sub-light emitting portion may protrude in a horizontal direction from a side surface of the sub-PCB substrate, and the light guide plate may have a height difference portion, which surrounds at least a portion of the sub-PCB substrate in the horizontal direction and surrounds the sub-light emitting portion in the horizontal direction.
[0034] Furthermore, the present invention may further include a covering portion, which covers the internal space and transmits light, and the covering portion may have: a transmitting portion for transmitting light; and a supporting portion, which extends from the transmitting portion to the lower side in the height direction and is used to support the sub-PCB substrate.
[0035] The same reference numerals are used to describe the same functional components within the scope of the same concept shown in the drawings of the various embodiments.
[0036] Figure 1 FIG. 1 is a simplified three-dimensional diagram of a road spike according to an embodiment of the present invention.
[0037] Figure 2 FIG. 1 is a simplified exploded perspective view of a road spike according to an embodiment of the present invention.
[0038] Figure 3 is a simplified three-dimensional diagram of the covering portion of a road spike according to an embodiment of the present invention. Figure 3 Part (a) is a three-dimensional view of the upper side of the cover portion. Figure 3 Part (b) is a three-dimensional view of the lower side of the cover portion.
[0039] Figure 4 The figure is a simplified three-dimensional diagram of a main light-emitting portion, a main PCB substrate, a sub-light-emitting portion and a sub-PCB substrate of a road stud according to an embodiment of the present invention.
[0040] Figure 5 FIG. 1 is a simplified three-dimensional diagram of a solar cell of a road spike according to an embodiment of the present invention.
[0041] Figure 6 FIG. 1 is a simplified three-dimensional diagram of a light guide plate of a road stud according to an embodiment of the present invention.
[0042] Figure 7 The schematic top view is a diagram showing a solar cell of a road spike according to an embodiment of the present invention being arranged on a main PCB substrate.
[0043] Figure 8 FIG. 1 is a schematic top view showing a light guide plate of a road stud configured on a solar cell according to an embodiment of the present invention.
[0044] Fig. 9 The schematic side cross-sectional view is a road spike according to an embodiment of the present invention cut along a direction crossing the main light emitting portion.
[0045] Fig.10FIG. 1 is a schematic side cross-sectional view of a road spike according to an embodiment of the present invention, cut along a direction crossing the sub-light emitting portion.
[0046] In order to further clearly express the technical concept of the present invention, the attached drawings simplify or omit parts that reduce the relevance to the technical concept of the present invention or that can be easily derived by ordinary technicians.
[0047] Throughout the specification, when it is stated that a part is "connected" to another part, this includes not only the case of "direct connection" but also the case of "electrical connection" with other elements in between. In addition, it should be understood that when it is stated that a part "includes" a structural element, unless otherwise stated, it means that other structural elements may also be included, not that other structural elements are removed, and it does not preclude the existence or additional possibility of one or more other features or numbers, steps, actions, structural elements, components or combinations thereof.
[0048] In this specification, a "unit" includes a unit realized by hardware, a unit realized by software, and a unit realized by using both. Furthermore, one unit may be realized by two or more hardwares, and two or more units may be realized by one hardware.
[0049] Below, refer to Figures 1 to 10 A road spike 10 according to an embodiment of the present invention is described in detail.
[0050] As an example, the road stud 10 may be a device installed on a road to display lane lines, crosswalks, road boundaries, etc. for the safety of drivers and / or pedestrians.
[0051] As an example, at least a portion of the road spike 10 may be buried in the road and fixedly installed.
[0052] As an example, the road spike 10 may include a shell portion 100, a base portion B, a fixing ring R, a main light-emitting portion 300, a main PCB substrate 400, a sub-light-emitting portion 500, a sub-PCB substrate 600, a solar cell 700, a light guide plate 800 and a cover portion 200, which will be described in detail below. Although not shown in the drawings, it may also include a battery for storing electricity generated by the solar cell 700, a communication portion for communicating with external equipment, etc.
[0053] Right now, Figures 1 to 10 In order to clearly illustrate the core technical concept of the present invention, some structures are omitted and briefly described.
[0054] The core technical concept of the road spike 10 is described in detail below.
[0055] As an example, the outer shell 100 may be a structure that forms a predetermined internal space S1, or may be a structure that protects the structure disposed in the internal space S1 from the external environment (rainwater, mud, etc.).
[0056] As an example, the base portion B may be disposed in the internal space S1 and fastened to the cover portion 200 described in detail below by a fixing member A such as bolts or threads, thereby supporting the cover portion 200 in the internal space S1 without swinging.
[0057] As an example, the fixing ring R may be placed in the cover portion 200 disposed in the internal space S1 and fastened to the outer shell 100 by a fastening member T such as a bolt or a thread to prevent the cover portion 200 from being separated from the outer shell 100 .
[0058] As an example, the main light emitting unit 300 may be disposed in the internal space S1 and may emit light with the aid of electricity, and may be an LED, but is not limited thereto.
[0059] As an example, the main PCB substrate 400 can be a structure that receives power from the solar cell 700 and / or the battery to supply power to the main light-emitting unit 300, can be a structure that can control the turning on and off of the main light-emitting unit 300, and can be configured in the internal space S1 and separated from the base unit B by a specified distance.
[0060] As an example, the sub-light-emitting portion 500 may be a structure disposed in the internal space S1, which emits light with the aid of electricity, and may be an LED, but is not limited thereto. Relatively speaking, as a structure that emits a small amount of light with less electricity than the main light-emitting portion 300, it may be a structure that emits light toward a light guide plate 800 to be described below.
[0061] As an example, the sub-PCB substrate 600 can be a structure that receives power from the solar cell 700 and / or the battery to supply power to the sub-light-emitting unit 500, can be a structure that can control the turning on and off of the sub-light-emitting unit 500, and can be configured in the internal space S1.
[0062] As an example, the solar cell 700 may be disposed in the internal space S1 and may generate electricity through sunlight to supply electricity to the main light emitting unit 300 .
[0063] As an example, the light guide plate 800 can be a structure that evenly disperses light. Although not shown in the accompanying drawings, fine grooves or bumps can be formed on the surface, and it can be made of a transparent or translucent material. It can be arranged on the upper side of the solar cell 700 in the height direction of the internal space S1.
[0064] As an example, the covering portion 200 is a structure that covers the internal space S1 and transmits the light emitted by the main light-emitting portion 300 and / or the sub-light-emitting portion 500 to the outside, and can be made of a transparent or translucent material.
[0065] Hereinafter, the arrangement relationship of the components constituting the rail spike 10 will be described in detail.
[0066] As an example, the main PCB substrate 400 may be arranged in the inner space S1 to be separated from the base portion B by a fixing component A such as a bolt or a thread.
[0067] That is, a separation space may be formed between the main PCB substrate 400 and the base portion B.
[0068] As a result, heat generated at the main PCB substrate 400 may be easily released through the partitioned space.
[0069] As an example, the main light emitting portion 300 may protrude from the main PCB substrate 400 toward the height direction, or may protrude from the main PCB substrate 400 at a predetermined angle. As an example, a plurality of main light emitting portions 300 may be spaced apart in a horizontal direction perpendicular to the height direction.
[0070] As an example, the main light-emitting portion 300 may include: a light-emitting body portion 310, which is electrically connected to the main PCB substrate 400 and protrudes from the main PCB substrate 400; and a light-emitting unit 320, which receives power from the light-emitting body portion 310 and is formed at the end of the light-emitting body portion 310 to emit light.
[0071] As an example, the light emitting body 310 may be made of synthetic resin and / or metal, and the light emitting unit 320 needs to transmit light, and therefore, may be made of transparent synthetic resin and / or metal.
[0072] On the other hand, as an example, the solar cell 700 may be disposed on the upper side of the main PCB substrate 400 in the height direction, and may be disposed apart from the main PCB substrate 400 .
[0073] That is, a separation space d1 may be formed between the solar cell 700 and the main PCB substrate 400 .
[0074] As a result, heat generated in the solar cell 700 and / or the main PCB substrate 400 may be released through the partitioned space d1, thereby minimizing thermal interference between the solar cell 700 and the main PCB substrate 400.
[0075] As an example, the solar cell 700 may be placed on the main light emitting portion 300 protruding from the main PCB substrate 400 , and may be configured to be separated from the main PCB substrate 400 .
[0076] As an example, the solar cell 700 may be placed in the light-emitting body portion 310 of the main light-emitting portion 300 , and configured to be separated from the main PCB substrate 400 .
[0077] On the other hand, the sub-PCB substrate 600 may be formed by protruding from the upper side of the main PCB substrate 400 in the height direction.
[0078] As an example, a plurality of the sub-PCB substrates 600 may be spaced apart from each other in the horizontal direction.
[0079] As an example, the sub-light emitting unit 500 is a structure that receives power from the sub-PCB substrate 600 and emits light, and can be formed by protruding from the inner surface of the sub-PCB substrate 600 toward the horizontal direction.
[0080] As an example, the side surfaces of the solar cell 700 and the light guide plate 800 may face the sub-PCB substrate 600 , and the movement in the horizontal direction may be restricted by the server PCB substrate.
[0081] This is further described in detail as follows: the solar cell 700 is configured in a manner that its side faces the inner surface of the sub-PCB substrate 600, so that the swing in the inner space S1 is minimized, and ultimately the movement toward the sub-PCB substrate 600 in the horizontal direction can be restricted.
[0082] As an example, the solar cell 700 may include a solar cell main body 710 for generating electricity from sunlight, and a solar cell extension part 720 protrudingly extending from the solar cell main body 710 toward the horizontal direction.
[0083] The solar extension portion 720 is configured in such a manner that its side surface faces the inner surface of the sub-PCB substrate 600 , so that the swing in the inner space S1 is minimized.
[0084] Furthermore, the solar cell 700 is placed on the main light emitting portion 300 that is obliquely protruded from the main PCB substrate 400 , thereby ultimately limiting the movement of the main light emitting portion 300 in the horizontal direction.
[0085] On the other hand, the light guide plate 800 is arranged with its side facing the inner surface of the sub-PCB substrate 600, so that the swing in the inner space S1 is minimized, and finally the movement of the sub-PCB substrate 600 toward the horizontal direction can be restricted.
[0086] Of course, the light guide plate 800 can be fastened to the fixing component A to limit the movement in the horizontal direction. However, depending on the situation, when the fixing component A is damaged or may swing due to tolerance, the sub-PCB substrate 600 is facing the side of the light guide plate 800 in the horizontal direction, thereby limiting the movement of the light guide plate 800 in the horizontal direction.
[0087] Furthermore, as an example, the light guide plate 800 may form a through space S3, and the through space S3 is a space through which the main light emitting portion 300 penetrates toward the height direction.
[0088] As an example, in the through space S3, a portion of the side surface of the light guide plate 800 may be recessed toward the inside in the horizontal direction.
[0089] Likewise, as the side surface of the through space S3 is arranged toward the horizontal direction and facing the main light emitting portion 300 , the light guide plate 800 can be eventually restricted from moving toward the main light emitting portion 300 in the horizontal direction.
[0090] Furthermore, the light guide plate 800 may include: a light guide body portion 810 for dispersing light; and a height difference portion 820, which is formed in a manner of having a height difference from the light guide body portion 810 toward the horizontal direction, and surrounds at least a portion of the sub-PCB substrate 600 toward the horizontal direction, and surrounds the sub-light-emitting portion 500 toward the horizontal direction.
[0091] That is, as the height difference portion 820 faces the inner surface and at least a portion of the side surface of the sub-PCB substrate 600 in the horizontal direction, the height difference portion 820 can surround the inner surface and the side surface of the sub-PCB substrate 600, thereby limiting movement in the horizontal direction.
[0092] Furthermore, as an example, at least a portion of the light guide plate 800 may overlap with the main light emitting portion 300 in the horizontal direction by d2, and at least a portion of the light guide plate 800 may overlap with the sub-light emitting portion 500 in the horizontal direction.
[0093] This is further explained in detail as follows: at least a portion of the light guide plate 800 can overlap with the sub-light emitting portion 500 in the horizontal direction, thereby receiving the light emitted by the sub-light emitting portion 500 and dispersing it, and at least a portion can overlap d2 with the light emitting unit 320 of the main light emitting portion 300 in the horizontal direction, thereby receiving the light emitted by the light emitting unit 320 of the main light emitting portion 300 and dispersing it, which can ultimately further maximize the visibility of the user.
[0094] On the other hand, the covering portion 200 may include: a transmitting portion 210 for transmitting to the outside the light emitted by the main light-emitting portion 300, the light emitted by the sub-light-emitting portion 500 and the light dispersed by the light guide plate 800; and a supporting portion 230 extending from the transmitting portion 210 to the lower side in the height direction and supporting the sub-PCB substrate 600.
[0095] This is further described in detail as follows: the support portion 230 can extend from the transmission portion 210 to the lower side in the height direction, and be configured in a manner facing the outer surface of the sub-PCB substrate 600 in the horizontal direction, and can cover the sub-PCB substrate 600 in the horizontal direction.
[0096] As a result, the sub-PCB substrate 600 can be prevented from being shaken or damaged due to external force.
[0097] Furthermore, as an example, the covering portion 200 can be formed by being recessed by at least a portion of the transparent portion 210, and can be inserted into a recessed space S2 in which the main light-emitting portion 300 is configured. It can also have a covering extension portion 220, which extends from the transparent portion 210 to the lower side in the height direction and contacts the base portion B, thereby covering the internal space S1 from the outside.
[0098] On the other hand, a plurality of the above-mentioned fixing components A (for example, 4) may be configured, wherein a portion (for example, 2) may be fastened to the covering portion 200 via the base portion B, the main PCB substrate 400 and the light guide plate 800, and the remaining portion (for example, 2) may only be fastened to the base portion B and the main PCB substrate 400.
[0099] Furthermore, as another embodiment, the fixing component A mentioned above may not fix the light guide plate 800, but may only be fastened to the covering part 200 through the base part B and the main PCB substrate 400, or may only fasten the base part B and the main PCB substrate 400.
[0100] As described above, the road stud 10 according to an embodiment of the present invention can compactly configure various structures, thereby minimizing its volume and maximizing visibility through the main light emitting unit 300 , the sub-light emitting unit 500 and the light guide plate 800 .
[0101] Although the structure and features of the present invention are described above based on the embodiments of the present invention, the present invention is not limited thereto, and various changes or modifications can be made within the concept and scope of the present invention. This is obvious to ordinary technicians in the technical field to which the present invention belongs. Therefore, such changes or modifications belong to the attached claims.
Claims
1. A road spike, characterized in that: include: An outer shell portion, forming an inner space; A main light emitting part is arranged in the internal space and emits light; A solar cell is disposed in the internal space and generates electricity through sunlight to supply electricity to the main light emitting portion; as well as The light guide plate is arranged in the internal space and arranged on the upper side of the solar cell in the height direction.
2. The road spike according to claim 1, characterized in that: It also includes a main PCB substrate for supplying power to the main light-emitting portion. The main light emitting portion is formed by protruding from the upper side of the main PCB substrate toward the height direction. The solar cell is arranged on the upper side of the main PCB substrate in the height direction and is placed on the main light emitting portion so as to be separated from the main PCB substrate.
3. The road spike according to claim 1, characterized in that: It also includes a main PCB substrate for supplying power to the main light-emitting portion. The solar cell further comprises: a sub-PCB substrate, which is arranged on the upper side of the main PCB substrate in the height direction and protrudes from the main PCB substrate toward the upper side in the height direction; and The sub-light emitting unit receives power from the sub-PCB substrate to emit light.
4. The road spike according to claim 3, characterized in that: The solar cell and the side surfaces of the light guide plate face the sub-PCB substrate, and the server PCB substrate is used to restrict the movement in the horizontal direction.
5. The road spike according to claim 3, characterized in that: The main light emitting portion is formed by protruding from the upper side of the main PCB substrate toward the height direction. The light guide plate forms a through space, and the through space is a space through which the main light emitting portion penetrates toward the height direction.
6. The road spike according to claim 3, characterized in that: In the light guide plate, At least a portion thereof overlaps with the main light emitting portion in the horizontal direction, At least a portion overlaps with the sub-light emitting portion in the horizontal direction.
7. The road spike according to claim 3, characterized in that: The sub-light emitting portion is formed by protruding in a horizontal direction from the side surface of the sub-PCB substrate. The light guide plate has a height difference portion, and the height difference portion surrounds at least a portion of the sub-PCB substrate in the horizontal direction and surrounds the sub-light emitting portion in the horizontal direction.
8. The road spike according to claim 3, characterized in that: Also included is a covering portion, the covering portion covers the inner space and transmits light, The covering portion has: a transmission portion for transmitting light; and The supporting portion extends from the transmitting portion toward the lower side in the height direction and is used to support the sub-PCB substrate.