Conductive film and conductive film manufacturing method

Abstract

The invention provides a conductive film and a method for manufacturing the conductive film. The conductive film contains an olefin resin and a conductive filler. The conductive film has a surface resistivity of 10000 [Omega] / square or less. In the conductive film, the Young's modulus of at least one of the MD (Mach Direct) and the TD (Traverse Direct) is more than 1200 MPa, and the Young's modulus of at least one of the MD (Mach Direct) and the TD (Traverse Direct) is more than 1200 MPa.

Description

Technical Field

[0001] The present invention relates to a conductive film and a method for producing the conductive film. Background Art

[0002] Japanese Patent Publication No. 2019-179732 (Patent Document 1) discloses a conductive film comprising a crystalline olefin resin, a thermoplastic elastomer, and a conductive filler. Prior art literature Patent Literature

[0003] Patent Document 1: Japanese Patent Publication No. 2019-179732 Summary of the invention Problems to be Solved by the Invention

[0004] As in the conductive film disclosed in the above-mentioned Patent Document 1, from the viewpoints of molding processability and chemical resistance, an olefin resin is sometimes contained in the conductive film. In addition, in order to improve the conductivity of the conductive film, it is necessary to contain a relatively large amount of conductive filler (e.g., conductive carbon filler) in the conductive film. However, since the conductive film containing an olefin resin and a relatively large amount of conductive filler is soft and easily deformed, the handling property is not necessarily good.

[0005] The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a conductive film having relatively good handleability and a method for producing the conductive film. Means for solving problems

[0006] A conductive film according to one aspect of the present invention comprises an olefin resin and a conductive filler. The surface resistivity of the conductive film is 10000Ω / □ or less. In the conductive film, the Young's modulus of at least one of MD (Machine Direction) and TD (Traverse Direction) is 1200MPa or more.

[0007] In the conductive film, the Young's modulus of at least one of MD (Machine Direction) and TD (Traverse Direction) is 1200 MPa or more. Therefore, according to the conductive film, since the Young's modulus of at least one of MD and TD is relatively high, the deformation of the conductive film during use is suppressed. As a result, according to the conductive film, the handleability of the conductive film can be improved.

[0008] In the conductive film, Young's modulus in both MD and TD may be 1200 MPa or more.

[0009] In the conductive film, the Young's modulus in both MD and TD is 1200 MPa or more. Therefore, according to the conductive film, since the Young's modulus in both MD and TD is relatively high, the deformation of the conductive film during use is suppressed. As a result, according to the conductive film, the handleability of the conductive film can be improved.

[0010] In the conductive film, the conductive filler may include a conductive carbon filler.

[0011] In addition, in the conductive film, the tear strength may be 30 kN / m or more.

[0012] According to this conductive film, since the tear strength is relatively high, it is possible to suppress the conductive film from being broken during use. As a result, according to this conductive film, it is possible to improve the handling property of the conductive film.

[0013] In addition, in the conductive film, the weight percentage concentration of the conductive filler may be 20 wt % or more and 50 wt % or less.

[0014] According to this conductive film, since the concentration of the conductive filler is sufficiently high, the resistance value of the conductive film can be suppressed.

[0015] The method for manufacturing a conductive film according to another aspect of the present invention includes: a step of manufacturing a molten material by heating and melting a material containing an olefin resin and a conductive filler; a step of extruding the molten material from a die; a step of pulling the molten material extruded from the die at a specified speed; and a step of manufacturing a conductive film by cooling the molten material by bringing the molten material extruded from the die into contact with a cooling roller. The above-mentioned specified speed is 3 m / min or more and 15 m / min or less. The temperature of the cooling roller is 50°C or more and 120°C or less. The surface resistivity of the conductive film is 10000 Ω / □ or less. The Young's modulus of at least one of the MD and TD of the conductive film is 1200 MPa or more.

[0016] In the manufacturing method of the conductive film, the pulling speed of the molten material extruded from the die head is slow to a certain extent, and the temperature of the cooling roller is high to a certain extent. As a result, according to the manufacturing method of the conductive film, the molten material can be gradually cooled, and a conductive film with relatively high crystallinity can be manufactured. According to the conductive film with high crystallinity, the deformation of the conductive film during use is suppressed. As a result, according to the conductive film manufactured by the manufacturing method, the handleability of the conductive film can be improved. Effects of the Invention

[0017] According to the present invention, a conductive film having relatively good handleability and a method for producing the conductive film can be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a diagram schematically showing a cross section of the conductive film according to Embodiment 1. Figure 2 It is a diagram schematically showing the configuration of a conductive film production apparatus. Figure 3 This is a diagram schematically showing a cross section of a conductive film according to the second embodiment. Figure 4 This is a diagram schematically showing a T-die included in the conductive film production apparatus according to the second embodiment. Figure 5 The figure schematically shows the shape of the sample used for the measurement of tear strength. DETAILED DESCRIPTION

[0019] An embodiment of one aspect of the present invention (hereinafter also referred to as "this embodiment") is described in detail using the accompanying drawings. In addition, the same or corresponding parts in the figures are marked with the same reference numerals and their descriptions are not repeated. In addition, for easy understanding, each figure appropriately omits or exaggerates the schematic depiction of the object.

[0020] [1. Implementation Method 1] <1-1. Configuration of Conductive Film> Figure 1 Schematic diagram of a cross section of the conductive film 10 according to the first embodiment. Figure 1 As shown, the conductive film 10 is a single-layer film. The thickness of the conductive film 10 is, for example, 25 μm or more and 100 μm or less.

[0021] The conductive film 10 is used as a charge film or a charge removal film for copy machines, printers, etc., or as various functional films for other electrical and electronic devices and parts. The conductive film 10 may or may not be subjected to surface processing such as corona, plasma, coating, or sputtering.

[0022] The conductive film 10 includes an olefin resin and a conductive carbon filler. In addition, the conductive film 10 may also include a part or all of additives such as a dispersant, an antioxidant, an anti-blocking agent, and an ultraviolet light blocking agent. Examples of olefin resins include polypropylene, polymethylpentene, and cyclic polyolefins. Examples of polypropylene include homopolypropylene, random polypropylene, block polypropylene, polypropylene with a long chain branch structure, and acid-modified polypropylene.

[0023] Cyclic polyolefin (cyclic olefin resin) contains a cyclic olefin component as a copolymer component, and there is no particular limitation as long as it is a polyolefin resin containing a cyclic olefin component in the main chain. As an example of a cyclic polyolefin, an addition polymer of a cyclic olefin or a hydrogenation product thereof, an addition copolymer of a cyclic olefin and an α-olefin or a hydrogenation product thereof, etc. can be cited. In addition, as a cyclic polyolefin, it includes a substance obtained by further grafting and / or copolymerizing an unsaturated compound having a hydrophilic group to the above-mentioned polymer.

[0024] As polar groups, carboxyl, anhydride, epoxy, amino, amide, ester, hydroxyl, sulfonic, phosphonyl and phosphino groups can be cited. As unsaturated compounds having polar groups, (meth) acrylic acid, maleic acid, maleic anhydride, itaconic anhydride, glycidyl (meth) acrylate, (meth) alkyl acrylate (carbon number 1 to 10), maleic acid alkyl (carbon number 1 to 10), (meth) acrylamide and (meth) 2-hydroxyethyl acrylate can be cited. Carboxyl, anhydride, epoxy, amino, amide, ester, hydroxyl, sulfonic, phosphonyl and phosphino groups are preferred. As cyclic olefin resins, addition copolymers of cyclic olefins and α-olefins or hydrogenated products thereof are preferred.

[0025] As an example of the conductive carbon filler, for example, graphite, carbon black (acetylene black, Ketjen black, furnace black, channel black, hot lamp black, etc.), carbon nanotubes and mixtures thereof can be cited. As an example of the shape of the conductive carbon filler, powder and fiber can be cited. As an example of a powdery conductive carbon filler, carbon black and graphite can be cited. In addition, as an example of a fibrous conductive carbon filler, nanotubes and carbon fibers can be cited.

[0026] From the viewpoint of molding processability and chemical resistance, the conductive film 10 contains an olefin resin. In addition, in order to improve conductivity, the conductive film 10 contains a relatively large amount of conductive carbon filler. For example, the weight percentage concentration of the conductive carbon filler in the conductive film 10 is 20wt% or more and 50wt% or less. However, in general, a conductive film containing an olefin resin and a relatively large amount of conductive carbon filler is soft and easily deformed, and therefore tends to have poor handling properties.

[0027] The present inventors have found that it is possible to produce a conductive film 10 having good handleability by devising a production method as described below. The conductive film 10 of the first embodiment achieves good handleability and specifically has the following features.

[0028] The surface resistivity of the conductive film 10 of the first embodiment is 10000Ω / □ or less, preferably 6000Ω / □ or less, more preferably 4500Ω / □ or less, and further preferably 3500Ω / □. That is, the conductive film 10 has sufficient conductivity.

[0029] In addition, the Young's modulus of at least one of the MD (Machine Direction) and TD (Traverse Direction) of the conductive film 10 is 1200 MPa or more, preferably 1300 MPa or more, more preferably 1500 MPa or more, and more preferably 1600 MPa or more. In addition, it is more preferred that the Young's modulus of both the MD and TD of the conductive film 10 is 1200 MPa or more. According to the conductive film 10, since the elasticity of at least one of the MD and TD is relatively high, the deformation of the conductive film 10 during use is suppressed. As a result, according to the conductive film 10, the handleability of the conductive film can be improved.

[0030] In addition, the tear strength of at least one of the MD and TD of the conductive film 10 is 30 kN / m or more, preferably 40 kN / m or more, more preferably 80 kN / m or more, and more preferably 110 kN / m or more. According to the conductive film 10, since the tear strength is relatively high, the conductive film 10 can be prevented from being broken during use. As a result, according to the conductive film 10, the handleability of the conductive film can be improved.

[0031] <1-2. Method for producing conductive film> Figure 2 2 is a diagram schematically showing the structure of a manufacturing apparatus 20 for a conductive film 10. Figure 2 As shown, the manufacturing device 20 includes a T-die 200 , casting rolls 210 , 220 , and a take-up roll 230 .

[0032] The T-die 200 is configured to heat and melt a material including an olefin resin and a conductive carbon filler to produce a molten material, and to extrude the molten material. The casting rolls 210 and 220 are configured to cool the extruded molten material and convey it downstream. The winding roll 230 is configured to pull and wind up the molten material cooled by the casting rolls 210 and 220 at a predetermined speed. Through the manufacturing process of the manufacturing device 20, a winding body of the conductive film 10 is manufactured.

[0033] For example, the temperature of the casting roll 210 is 50° C. to 120° C., preferably 80° C. to 120° C. In addition, for example, the predetermined speed at which the molten material is pulled by the take-up roll 230 is 3 m / min. to 15 m / min., preferably 9 m / min. to 13 m / min.

[0034] In the manufacturing device 20, the pulling speed of the molten material extruded from the T-die 200 is slow to some extent, and the temperature of the casting roll 210 is high to some extent. As a result, according to the manufacturing device 20, the molten material can be gradually cooled, and the conductive film 10 with relatively high crystallinity can be manufactured. According to the conductive film 10 with high crystallinity, the deformation of the conductive film 10 during use is suppressed. As a result, according to the conductive film 10 manufactured by the manufacturing device 20, the handleability of the conductive film can be improved.

[0035] <1-3. Features> As described above, in the conductive film 10 of the first embodiment, the Young's modulus of at least one of MD and TD is 1200 MPa or more. Therefore, according to the conductive film 10, at least one of MD and TD has relatively high elasticity, so deformation of the conductive film 10 during use is suppressed. As a result, according to the conductive film 10, the handleability of the conductive film can be improved.

[0036] [2. Implementation Method 2] The conductive film 10 of the first embodiment is a single-layer film. However, the conductive film 10A of the second embodiment is not a single-layer film but includes a plurality of layers. The following description will focus on the differences from the conductive film 10 of the first embodiment.

[0037] <2-1. Configuration of Conductive Film> Figure 3 Schematically shows a cross section of the conductive film 10A according to the second embodiment. Figure 3 As shown, the conductive film 10A includes a first layer 100A, a second layer 110A, and an intermediate layer 120A sandwiched between the first layer 100A and the second layer 110A. The thickness of the conductive film 10A is, for example, 25 μm or more and 100 μm or less.

[0038] Each of the first layer 100A and the second layer 110A contains, for example, an olefin resin and a conductive carbon filler. The same substances as those listed in the above-mentioned embodiment 1 can be applied to each of the olefin resin and the conductive carbon filler. In addition, each of the first layer 100A and the second layer 110A may further contain a part or all of additives such as a dispersant, an antioxidant, an anti-blocking agent, and an ultraviolet light blocking agent.

[0039] The middle layer 120A, for example, includes a resin having higher flexibility than the olefin resin included in each layer of the first layer 100A and the second layer 110A, and a conductive carbon filler. As for the conductive carbon filler, the same conductive carbon filler as that listed in the above-mentioned embodiment 1 can be applied. As an example of a resin having higher flexibility than the olefin resin included in the first layer 100A and the second layer 110A, for example, LDPE (Low Density Polyethylene) and LLDPE (Linear Low Density Polyethylene) can be cited. The middle layer 120A may also include a part or all of additives such as a dispersant, an antioxidant, an anti-blocking agent, and an ultraviolet light inhibitor, and at least one of the other resins.

[0040] The surface resistivity of the conductive film 10A of the second embodiment is 10000Ω / □ or less, preferably 6000Ω / □ or less, more preferably 4500Ω / □ or less, and further preferably 3500Ω / □. That is, the conductive film 10A has sufficient conductivity.

[0041] In addition, the Young's modulus of at least one of the MD and TD of the conductive film 10A is 1200 MPa or more, preferably 1300 MPa or more, more preferably 1500 MPa or more, and more preferably 1600 MPa or more. In addition, the Young's modulus of both the MD and TD of the conductive film 10A is more preferably 1200 MPa or more. According to the conductive film 10A, since the elasticity of at least one of the MD and TD is relatively high, the deformation of the conductive film 10A during use is suppressed. As a result, according to the conductive film 10A, the handling property of the conductive film can be improved.

[0042] In addition, the tear strength of at least one of the MD and TD of the conductive film 10A is 30 kN / m or more, preferably 40 kN / m or more, more preferably 80 kN / m or more, and more preferably 110 kN / m or more. According to the conductive film 10A, since the tear strength is relatively high, the conductive film 10A can be prevented from being broken during use. As a result, according to the conductive film 10A, the handleability of the conductive film can be improved.

[0043] <2-2. Method for producing conductive film> The manufacturing apparatus of the conductive film 10A of the second embodiment is different from the manufacturing apparatus 20 ( Figure 2 ) compared to the T-die 200, the structure of the T-die 200 is different.

[0044] Figure 42 is a diagram schematically showing a T-die 200A included in the manufacturing apparatus of the conductive film 10A according to the second embodiment. Figure 4 As shown, the T-die 200A includes a T-die body 201 and raw material input parts 240 , 250 , and 260 .

[0045] The raw material for forming the first layer 100A is put into the raw material input part 240. For example, an olefin resin and a conductive carbon filler are put into the raw material input part 240. The raw material for forming the second layer 110A is put into the raw material input part 260. For example, an olefin resin and a conductive carbon filler are put into the raw material input part 260. The raw material for forming the intermediate layer 120A is put into the raw material input part 250. For example, a resin (such as LDPE) having higher flexibility than the olefin resin contained in each layer of the first layer 100A and the second layer 110A and a conductive carbon filler are put into the raw material input part 250.

[0046] The T-die body 201 is configured to co-extrude the raw materials fed through the raw material feeding parts 240, 250, and 260, so that the melted materials fed into each raw material feeding part fuse with each other to form an integrated film (molten material). The molten material co-extruded by the T-die body 201 passes through the casting rollers 210 and 220 ( Figure 2 ) is cooled and pulled by the take-up roller 230 to produce the conductive film 10A. In this way, for example, the conductive film 10A is produced by laminating the first layer 100A, the intermediate layer 120A and the second layer 110A using a manufacturing device including a T-die 200A.

[0047] In the manufacturing apparatus including the T-die 200A, for example, the temperature of the casting roll 210 is 50° C. to 120° C., preferably 80° C. to 120° C. In addition, for example, the predetermined speed at which the molten material is pulled by the take-up roll 230 is 3 m / min to 15 m / min, preferably 3 m / min to 12 m / min.

[0048] In this manufacturing apparatus, the pulling speed of the molten material extruded from the T-die 200A is somewhat slow, and the temperature of the casting roll 210 is somewhat high. As a result, according to this manufacturing apparatus, the molten material can be gradually cooled, and a conductive film 10A with relatively high crystallinity can be manufactured. According to the conductive film 10A with high crystallinity, deformation of the conductive film 10A during use is suppressed. As a result, according to the conductive film 10A manufactured by this manufacturing apparatus, the handleability of the conductive film can be improved.

[0049] <2-3. Features> As described above, in the conductive film 10A of the second embodiment, the Young's modulus of at least one of MD and TD is 1200 MPa or more. Therefore, according to the conductive film 10A, since at least one of MD and TD has relatively high elasticity, deformation of the conductive film 10A during use is suppressed. As a result, according to the conductive film 10A, the handling property of the conductive film can be improved.

[0050] [3. Other embodiments] The concept of the above-described embodiment is not limited to the above-described embodiment. Hereinafter, an example of another embodiment to which the concept of the above-described embodiment can be applied will be described.

[0051] <3-1> In the above-mentioned first embodiment, the conductive film 10 may further contain at least one of LDPE and LLDPE.

[0052] <3-2> In addition, the conductive film 10 of the first embodiment is a single-layer film, and the conductive film 10A of the second embodiment is a three-layer film, but the layer structure of the conductive film is not limited thereto. The conductive film may be a two-layer film, or a film of four or more layers. The layer structure may be any structure as long as the surface resistivity is 10000Ω / □ and the Young's modulus of at least one of MD and TD is 1200MPa or more.

[0053] The embodiments of the present invention are described above by way of example. That is, for the purpose of illustrative description, the detailed description and the drawings are disclosed. Therefore, the constituent elements recorded in the detailed description and the drawings sometimes include constituent elements that are not necessary for solving the problem. Therefore, although those non-essential constituent elements are recorded in the detailed description and the drawings, it should not be directly determined that those non-essential constituent elements are essential.

[0054] In addition, the above-mentioned embodiment is merely an illustration of the present invention in all aspects. The above-mentioned embodiment can be variously improved and changed within the scope of the present invention. That is, when implementing the present invention, a specific configuration can be appropriately adopted according to the embodiment. Example

[0055] The following describes examples of the present invention. However, the present invention is not limited to the following examples.

[0056] [1. Example] use Figure 2The manufacturing device 20 shown in the figure manufactured the conductive films of Examples 1 to 7. Each of PPA, PPB, PPC, and PPD shown below is polypropylene and has different melting points. Specifically, the melting point of PPA is "167.2", the melting point of PPB is "156.2", the melting point of PPC is "158.5", and the melting point of PPD is "161.0". In addition, CB a is acetylene black, and CBb is furnace black.

[0057] In addition, the melting point was determined by differential scanning calorimetry (DSC) according to "JIS K7122-2012 Plastics Transition Heat Determination Method" for each resin, and the top of the endothermic peak was taken as the melting point. In addition, when two peaks were observed, the higher temperature side was taken as the melting point.

[0058] The conductive film of Example 1 was manufactured by heating and melting PP B and C Ba and extruding them. The conductive films of each layer of Examples 2-4 were manufactured by heating and melting PP B and C Ba and extruding them. The conductive film of Example 5 was manufactured by heating and melting PPC and C Ba and extruding them. The conductive film of Example 6 was manufactured by heating and melting PP D and C Ba and extruding them. The conductive film of Example 7 was manufactured by heating and melting PP B, LDPE and C Ba and extruding them.

[0059] Use includes Figure 4 The manufacturing apparatus of the T-die 200A shown in the figure (having Figure 2 The conductive film of Example 8 was manufactured by using a manufacturing device 20 having the structure shown in FIG. 1 . Specifically, the conductive film of Example 8 was manufactured by coextrusion. The first layer and the second layer of the conductive film of Example 8 were formed by using PPB and CBa. The intermediate layer of the conductive film of Example 8 was formed by using PPB, LDPE and CBa.

[0060] The values ​​of the weight percentage concentration (wt%) of the filler of each conductive film in Examples 1-8, the layer composition of the conductive film, the total thickness (μm) of the conductive film, the pulling speed (m / min) of the winding roller 230, and the temperature (°C) of the casting roller (cooling roller) 210 are shown in Table 1 below.

[0061] [Table 1]

[0062] [2. Comparative Example] use Figure 2The manufacturing apparatus 20 shown in the figure manufactured the conductive films of Comparative Examples 1 and 2. The conductive film of Comparative Example 1 was manufactured by heating and melting LDPE and CBa and then extruding them. The conductive film of Comparative Example 2 was manufactured by heating and melting PPA and CBa and then extruding them.

[0063] The values ​​of the weight percentage concentration (wt%) of the filler of each conductive film in Comparative Examples 1 and 2, the layer composition of the conductive film, the total thickness (μm) of the conductive film, the pulling speed (m / min) of the winding roller 230, and the temperature (°C) of the casting roller (cooling roller) 210 are shown in Table 2 below.

[0064] [Table 2]

[0065] [3. Various measurements] <3-1. Measurement of surface resistivity> The surface resistivity of each conductive film of Examples 1 to 8 and Comparative Examples 1 and 2 was measured. Specifically, the surface resistance of each conductive film was measured by the following method. A 30 mm square test piece was cut out, and the surface resistance was measured using a simple low resistance meter Loresta AX MCP-T370 manufactured by Nittoseiko Analytech Co., Ltd. As a probe, a PSP probe MCP-TP06P RMH112 was used. The value obtained by multiplying the resistance value (Ω) measured by the low resistance meter with the correction coefficient (4.532) was used as the surface resistivity (Ω / □).

[0066] <3-2. Measurement of Young's modulus> For each conductive film of Examples 1-8 and Comparative Examples 1 and 2, the Young's modulus of MD and TD was measured. The tensile stress when the sample was elongated by 2% was measured according to the method of JIS K 6732, and the Young's modulus was obtained by dividing the tensile stress by 0.02. In addition, the size of the sample was 10 mm in width and 100 mm in length. AUTOGRAPH (Shimadzu precision universal testing machine AUTOGRAPH AG-X 500N) was used for specific measurements. The tensile speed at this time was 200 mm / min, the chart speed was 200 mm / min, and the clamp interval was 40 mm.

[0067] <3-3. Measurement of tear strength> The tear strength in MD was measured for each conductive film of Examples 1 to 8 and Comparative Examples 1 and 2. Specifically, the tear strength of each conductive film was measured by a method in accordance with JIS K 6732.

[0068] Figure 5 The figure schematically shows the shape of the test piece (sample) used for the measurement of tear strength. In the measurement of tear strength, the right-angle tear strength is measured. Specifically, the axial direction of the test piece is aligned with the direction of the clamp of the testing machine. Figure 5 The test piece cut out as shown was correctly mounted on the tensile tester. As a measuring machine, AUTOGRAPH (Shimadzu precision universal testing machine AUTOGRAPH AG-X 500N) was used. The test speed was 200 mm / min, and the strength of the test piece when cut was measured.

[0069] [4. Measurement results] The results of various measurements are shown in Table 3 below.

[0070] [Table 3]

[0071] As shown in Table 3, in each conductive film of Examples 1 to 8, a higher Young's modulus and a higher tear strength were obtained than those of each conductive film of Comparative Examples 1 and 2. In addition, in each conductive film of Examples 1 to 8, the surface resistivity was 10000 Ω / □ or less, and the Young's modulus of at least one of MD and TD was 1200 MPa or more. Description of reference numerals:

[0072] 10, 10A: conductive film; 20: manufacturing device; 100A: first layer; 110A: second layer; 120A: intermediate layer; 200, 200A: T-die; 201: T-die body; 210, 220: casting roller; 230: winding roller; 240, 250, 260: raw material input part.

Claims

1. A conductive film, wherein: The conductive film comprises an olefin resin and a conductive filler. The surface resistivity is below 10000Ω / □. The Young's modulus in at least one of the longitudinal direction and the transverse direction is 1200 MPa or more.

2. The conductive film according to claim 1, wherein The Young's modulus in both the longitudinal direction and the transverse direction is 1200 MPa or more.

3. The conductive film according to claim 1 or 2, wherein The conductive filler includes a conductive carbon filler.

4. The conductive film according to claim 1 or 2, wherein The tear strength is 30 kN / m or more.

5. The conductive film according to claim 1 or 2, wherein The weight percentage concentration of the conductive filler in the conductive film is greater than or equal to 20 wt % and less than or equal to 50 wt %.

6. A method for producing a conductive film, wherein: The method for manufacturing the conductive film comprises: A step of preparing a molten material by heating and melting a material including an olefin resin and a conductive filler; The step of extruding the molten material from a die; The step of pulling the molten material extruded from the die head at a specified speed; and a step of manufacturing a conductive film by cooling the molten material extruded from the die head by bringing the molten material into contact with a cooling roller, The prescribed speed is 3 m / min or more and 15 m / min or less. The temperature of the cooling roller is 50° C. or higher and 120° C. or lower. The surface resistivity of the conductive film is 10000Ω / □ or less. The Young's modulus of the conductive film in at least one of a longitudinal direction and a lateral direction is 1200 MPa or more.

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