A solder ball centrifugal screening device

Abstract

The present application provides a tin ball centrifugal screening device, including a feeding part and a centrifugal screening part. The feeding part contains tin balls to be screened; the centrifugal screening part is arranged below the feeding part, and the centrifugal screening part includes a concave disk and a receiving block, the receiving block is arranged at the center of the concave disk, a good product channel is arranged on one side of the receiving block, and a defective product collection tank is arranged between the other side of the receiving block and the concave disk; the tin balls discharged from the feeding part enter the centrifugal screening part, and the tin balls move along the concave surface of the concave disk. The tin balls are screened by using the principle that the centrifugal force of tin balls of different sizes is different because of their different masses, so that the tin balls that meet the requirements enter the good product channel of the receiving block, and the tin balls that do not meet the requirements enter the defective product collection tank. The tin ball centrifugal screening device provided by the present application realizes efficient and accurate screening of tin balls by utilizing the differences in the motion characteristics of tin balls of different sizes under the action of centrifugal force.

Description

Technical Field

[0001] The invention relates to the technical field of solder ball production, and in particular to a solder ball centrifugal screening device. Background Art

[0002] In the field of solder ball processing and packaging, the ball diameter, tolerance control, roundness and anti-oxidation performance of the solder balls are key factors to ensure product quality. Among them, the roundness screening of solder balls is one of the important processes, which is directly related to the true sphericity and reliability of the final product. Traditional solder ball screening methods mostly use mechanical vibration screening or airflow screening. Although these methods can achieve solder ball separation to a certain extent, they often have problems such as low screening efficiency, insufficient grading accuracy, and easy damage to the solder ball surface.

[0003] Especially in the field of high-precision electronic packaging, such as ball grid array (BGA) packaging, the roundness requirements for solder balls are extremely strict. Traditional screening methods are difficult to meet the dual requirements of efficiency and precision in large-scale production, and it is difficult to accurately distinguish the roundness of solder balls with extremely small differences, resulting in a decrease in yield and an increase in production costs.

[0004] In recent years, with the continuous development of centrifugal technology, its application in the field of material screening has gradually received attention. Centrifugal concentrators, centrifugal separators and other equipment have been widely used in the separation and purification of materials such as ores and chemical raw materials, showing the advantages of high efficiency and precision. However, in the field of solder ball roundness screening, especially for BGA solder balls with high precision requirements, the application of centrifugal screening technology is still rare, and the existing technology lacks centrifugal screening devices designed specifically for the characteristics of solder balls. Summary of the invention

[0005] The object of the present invention is to provide a solder ball centrifugal screening device, which realizes efficient and accurate screening of solder balls by utilizing the difference in movement characteristics of solder balls of different sizes under the action of centrifugal force.

[0006] In order to achieve the above object, the technical solution adopted by the present invention is: to provide a solder ball centrifugal screening device, the solder ball centrifugal screening device comprising:

[0007] A material discharge section, wherein the material discharge section contains solder balls to be screened;

[0008] A centrifugal screening part, which is arranged below the material discharge part, and comprises a concave disk and a material receiving block, wherein the material receiving block is arranged at the center of the concave disk, a good product channel is arranged on one side of the material receiving block, and a defective product collecting tank is arranged between the other side of the material receiving block and the concave disk;

[0009] The solder balls discharged from the discharge part enter into the centrifugal screening part, and move along the concave surface of the concave plate. The solder balls are screened by utilizing the principle that the centrifugal forces of solder balls of different sizes are different due to their different masses, so that the solder balls that meet the requirements enter into the good product channel of the receiving block, and the solder balls that do not meet the requirements enter into the defective product collection tank.

[0010] In one embodiment, the receiving block is semi-cylindrical, the good product channel is provided on the plane side of the receiving block, the plane side of the receiving block is close to the concave disk, and the defective product collection groove is an annular groove surrounding the cylindrical side of the receiving block.

[0011] In one embodiment, a good product outlet is disposed at the bottom end of the good product channel, the defective product collecting groove passes through the concave disk, and a defective product outlet is disposed at the bottom of the defective product collecting groove.

[0012] In one embodiment, the blanking portion comprises:

[0013] The outer shell is cylindrical, a top plate is arranged on the top of the outer shell, and a discharge port is arranged on the bottom of the outer shell;

[0014] A bottom plate, the bottom plate can be rotatably arranged at the bottom of the shell, the bottom plate is closely attached to the inner wall of the shell, a plurality of grooves are arranged around the edge of the bottom plate, and a solder ball can be accommodated in the groove; a connecting hole is opened on the outer side of the groove, and the aperture of the connecting hole is larger than the diameter of the solder ball; the discharge port is flush with the connecting hole;

[0015] A feeding tube, one end of which is connected to the discharge port, the other end of which is in close contact with the concave surface of the concave disk, and the diameter of which is larger than the diameter of the solder ball;

[0016] A rotating power mechanism is arranged on the top plate, and the rotating power mechanism drives the bottom plate to rotate at a constant speed.

[0017] In one embodiment, the feed tube is arc-shaped, and the outlet direction of the feed tube is consistent with the tangent direction of the concave surface of the concave disk.

[0018] In one embodiment, the material discharging portion further includes a dispersion plate, and the dispersion plate is arranged on the upper surface of the bottom plate, and the upper surface of the dispersion plate is an upwardly convex curved surface structure.

[0019] In one embodiment, the material discharging part further includes a solder ball polishing part, and the solder ball polishing part includes:

[0020] A mounting ring, the mounting ring being arranged on the inner wall of the housing and being located above the bottom plate;

[0021] A grinding sheet, one end of which is hinged to the mounting ring, and the other end of which hangs down to a position close to the groove;

[0022] An elastic member, one end of which is connected to the mounting ring, and the other end of which is connected to the polishing sheet;

[0023] The depth of the groove is less than the diameter of the solder ball. When the solder ball is located in the groove, the top of the solder ball is exposed outside the groove.

[0024] In one embodiment, the polishing surface of the polishing sheet is provided with an arc-shaped concave surface adapted to the solder ball.

[0025] In one embodiment, the solder ball polishing part also includes a dust removal pipe, which is arranged on the outer shell, one end of the dust removal pipe is connected to the interior of the outer shell, and the dust removal pipe is flush with the connecting hole, the aperture size of the dust removal pipe is smaller than the diameter of the solder ball, and the other end of the dust removal pipe is connected to a dust suction pump.

[0026] In one embodiment, the inner wall of the groove is provided with a polishing layer.

[0027] One or more of the above technical solutions in the embodiments of the present invention have at least the following technical effects or advantages:

[0028] The solder ball centrifugal screening device provided by the embodiment of the present invention uses centrifugal screening to quickly separate the solder balls under the action of their own centrifugal force when they move along the concave surface of the concave disk. Compared with the traditional vibration screening or airflow screening method, the screening efficiency is significantly improved, the production cycle is shortened, and the screening efficiency is improved. In addition, by utilizing the difference in the motion characteristics of solder balls of different sizes under the action of centrifugal force, the device can achieve more accurate screening, effectively distinguish solder balls that meet the requirements from defective products that do not meet the requirements, improve the product yield, and improve the screening accuracy. The device is particularly suitable for the field of high-precision electronic packaging, such as BGA packaging, and can meet the strict requirements of solder ball roundness (the roundness of the solder ball will affect the movement distance of the solder ball on the concave disk, so the solder ball centrifugal screening device provided by this embodiment can also screen the solder ball roundness), size and other parameters, thereby improving the reliability and quality of the packaged products. In addition, the device integrates the feeding part to the top of the centrifugal screening part, and sets the two parts into a vertical structure, thereby greatly reducing the workshop area occupied by the solder ball centrifugal screening device. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0030] Figure 1 A schematic diagram of the structure of a solder ball centrifugal screening device provided in an embodiment of the present invention;

[0031] Figure 2 A schematic diagram of the structure of the top of the centrifugal screening unit provided by an embodiment of the present invention;

[0032] Figure 3 A schematic diagram of the structure of the bottom of the centrifugal screening unit provided by an embodiment of the present invention;

[0033] Figure 4 A cross-sectional view of a blanking portion provided in an embodiment of the present invention;

[0034] Figure 5 A schematic structural diagram of a solder ball polishing unit provided in an embodiment of the present invention.

[0035] The respective reference numerals are as follows:

[0036] 1. Feeding section; 2. Centrifugal screening section; 11. Casing; 12. Bottom plate; 13. Feeding tube; 14. Rotating power mechanism; 15. Dispersing plate; 16. Solder ball grinding section; 17. Top plate; 21. Concave plate; 22. Receiving block; 111. Feeding port; 121. Groove; 161. Mounting ring; 162. Grinding sheet; 163. Elastic part; 164. Dust removal tube; 171. Feeding port; 211. Defective product collecting tank; 221. Good product channel; 2111. Defective product output port; 2211. Good product output port. DETAILED DESCRIPTION

[0037] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0038] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0039] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0040] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0041] See also Figures 1 to 4 The embodiment of the present application provides a solder ball centrifugal screening device, comprising a feeding part 1 and a centrifugal screening part 2. The feeding part 1 contains solder balls to be screened; the centrifugal screening part 2 is arranged below the feeding part 1, and the centrifugal screening part 2 comprises a concave disk 21 and a receiving block 22, the receiving block 22 is arranged at the center of the concave disk 21, a good product channel 221 is arranged on one side of the receiving block 22, and a defective product collecting tank 211 is arranged between the other side of the receiving block 22 and the concave disk 21; the solder balls fed from the feeding part 1 enter the centrifugal screening part 2, and the solder balls move along the concave surface of the concave disk 21. The solder balls are screened by using the principle that the mass of solder balls of different sizes is different and the magnitude of their centrifugal force is also different, so that the solder balls that meet the requirements enter the good product channel 221 of the receiving block 22, and the solder balls that do not meet the requirements enter the defective product collecting tank 211.

[0042] Specifically, the unloading part 1 unloads the solder balls onto the concave surface of the concave disk 21 at a uniform speed (the speed direction is not toward the center of the concave disk 21). During the movement of the solder balls on the concave surface of the concave disk 21, the solder balls gradually approach the center of the concave disk 21 along a curved trajectory. Only solder balls that meet the weight requirements can move from the good product channel 221 of the receiving block 22 to the center of the concave disk 21 after moving a certain distance, and then enter the good product channel 221 of the receiving block 22 (such as Figure 4 As shown in FIG. 2 ). The solder balls that do not meet the weight requirements move a longer / shorter distance on the concave surface of the concave plate 21, causing the solder balls to move from other positions to the center of the concave plate 21 and then fall into the defective collection slot 211. By concentrating the solder balls that meet the weight requirements into the good product channel 221 and concentrating the solder balls that do not meet the weight requirements into the defective collection slot 211, the solder balls can be screened according to their weight.

[0043] In one embodiment, the receiving block 22 is semi-cylindrical, a good product channel 221 is provided on the plane side of the receiving block 22, the plane side of the receiving block 22 is close to the concave disk 21, and the defective product collection groove 211 is an annular groove surrounding the cylindrical side of the receiving block 22. The axis of the semi-cylindrical receiving block 22 coincides with the center of the concave disk 21, the bottom of the receiving block 22 passes through the concave disk 21, and extends out from the bottom of the concave disk 21, so that the solder balls entering the good product channel 221 are output outward along the receiving block 22, so that the centrifugal screening part 2 can continuously perform screening work.

[0044] Optionally, the receiving block 22 can also be changed into other columnar structures with fan-shaped cross-sections according to the specific weight accuracy requirements of the solder balls. When the accuracy requirements of the solder balls are increased, the angle of the fan-shaped cross-section can be increased (that is, the cylindrical side of the receiving block 22 is enlarged, that is, the coverage angle of the defective collection slot 211 is increased), thereby making the entrance angle of the good product channel 221 smaller, thereby narrowing the mass weight range of the solder balls entering the good product channel 221, so as to improve the weight accuracy of the good solder balls after screening.

[0045] In one embodiment, a good product outlet 2211 may be provided at the bottom of the good product channel 221, the defective product collection groove 211 passes through the concave plate 21, and a defective product outlet 2111 (such as Figure 3 By providing a good product output port 2211 and a defective product output port 2111, the screened good solder balls and defective solder balls can be output from the good product output port 2211 and the defective product output port 2111 respectively, so as to facilitate the separate storage of the good solder balls and the defective solder balls.

[0046] like Figure 4-5As shown, in one embodiment, the unloading part 1 includes a shell 11, a bottom plate 12, a unloading pipe 13, and a rotating power mechanism 14. The shell 11 is cylindrical, a top plate 17 is arranged on the top of the shell 11, and a discharge port 111 is arranged on the bottom of the shell 11. The bottom plate 12 is rotatably arranged at the bottom of the shell 11, the bottom plate 12 is close to the inner wall of the shell 11, and a plurality of grooves 121 are arranged around the edge of the bottom plate 12, and the grooves 121 can accommodate a solder ball; a connecting hole is opened on the outer side of the groove 121, and the aperture of the connecting hole is larger than the diameter of the solder ball; the discharge port 111 is flush with the connecting hole; one end of the unloading pipe 13 is connected to the discharge port 111, and the other end of the unloading pipe 13 is close to the concave surface of the concave disk 21, and the diameter of the unloading pipe 13 is larger than the diameter of the solder ball; the rotating power mechanism 14 is arranged on the top plate 17, and the rotating power mechanism 14 drives the bottom plate 12 to rotate at a constant speed.

[0047] When unloading, the rotating power mechanism 14 (specifically, it may include a motor and a transmission shaft, the motor is installed on the top plate 17, one end of the transmission shaft is connected to the output end of the motor, and the other end of the transmission shaft is connected to the bottom plate 12) drives the bottom plate 12 to rotate at a constant speed, so that the tin balls on the bottom plate 12 move toward the edge of the bottom plate 12 under the action of centrifugal force (the direction of the centrifugal force is from the center of the bottom plate 12 toward the edge of the bottom plate 12) until the tin balls enter the grooves 121. The tin balls entering the grooves 121 rotate with the rotation of the bottom plate 12 until the connecting hole of the groove 121 is aligned with the discharge port 111. At this time, the tin balls in the groove 121 will enter the unloading pipe 13 from the connecting hole through the discharge port 111 under the action of centrifugal force, and then the tin balls enter the concave disk 21 below along the unloading pipe 13. After the solder balls in the groove 121 are discharged from the discharge pipe 13 , during the rotation of the bottom plate 12 , the solder balls on the bottom plate 12 will enter the groove 121 again under the action of centrifugal force for continuous discharge.

[0048] The unloading part 1 in this embodiment controls the rotation speed of the rotating power mechanism 14, thereby controlling the rotation speed of the bottom plate 12, and then controlling the initial velocity of the solder balls when entering the unloading tube 13, so as to control the initial velocity of the solder balls falling into the concave disk 21. Then, by maintaining the rotation speed of the rotating power mechanism 14, the initial velocity of the solder balls falling into the concave disk 21 can be ensured to be consistent, thereby improving the screening accuracy of the centrifugal screening part 2.

[0049] In addition, since the groove 121 can only accommodate one solder ball, and only when each groove 121 rotates its connecting hole to align with the discharge port 111, the solder ball in the groove 121 will enter the discharge tube 13. Therefore, during the discharge process, the solder ball enters the discharge tube 13 and moves in the concave disk 21. Therefore, the front and rear solder balls will maintain a certain distance and enter the discharge tube 13 and the concave disk 21 in an orderly manner, without collision and friction between each other, thereby avoiding mutual interference between solder balls and affecting the screening accuracy. And avoid deformation and damage of solder balls due to collision between solder balls during the screening process.

[0050] Finally, the rotating bottom plate 12 can ensure that the solder balls in a certain groove 121 can be replenished in time after being discharged from the discharge tube 13 under the action of centrifugal force, so that the solder ball discharge process can be carried out continuously and stably, avoiding the blockage of the discharge part 1 during the discharge process.

[0051] Optionally, the grooves 121 may be evenly distributed at an equal distance on the edge of the bottom plate 12 (specifically, the spacing between each groove 121 may be set according to actual needs), so that the unloading speed of the unloading part 1 is stable.

[0052] Optionally, in order to facilitate the addition of solder balls to be screened into the lower feeding part 1, a feed port 171 can be opened on the top plate 17. When it is necessary to add material to the lower feeding part 1, the material can be added to the lower feeding part 1 conveniently by simply extending the material through the feed port 171 into the interior of the outer shell 11.

[0053] In one embodiment, the feed tube 13 is arc-shaped, and the outlet direction of the feed tube 13 is consistent with the tangent direction of the concave surface of the concave disk 21. The arc-shaped pipeline can make the solder balls move more smoothly in the feed tube 13, and the solder balls are not easy to have violent impacts and collisions with the inner wall of the pipeline, so as to avoid the solder balls being blocked in the feed tube 13 or having violent impacts with the pipeline, causing the solder balls to be damaged and deformed. By setting the outlet direction of the feed tube 13 to be consistent with the tangent direction of the concave surface of the concave disk 21, the solder balls can smoothly enter the concave disk 21 after being output from the feed tube 13 and continue to move along the concave surface of the concave disk 21, so as to avoid the solder balls bouncing when contacting the concave surface of the concave disk 21, which affects the screening accuracy of the solder balls.

[0054] In one embodiment, the unloading part 1 further includes a dispersion plate 15, which is disposed on the upper surface of the bottom plate 12, and the upper surface of the dispersion plate 15 is a curved surface structure that bulges upward. The dispersion plate 15 is fixedly connected to the bottom plate 12, and the bulging curved surface structure on the upper surface of the dispersion plate 15 can make the solder balls on the surface of the dispersion plate 15 automatically move toward the edge of the bottom plate 12 under the action of their own gravity, thereby making it easier for the solder balls to enter the groove 121 at the edge of the bottom plate 12.

[0055] Optionally, the dispersion plate 15 may be made of an elastic material, specifically rubber or the like. The dispersion plate 15 made of the elastic material may reduce the impact force between the solder balls and the bottom plate 12 when feeding the lower material portion 1, thereby preventing the solder balls from being deformed and damaged.

[0056] In order to reduce the roughness of the solder ball surface, increase the glossiness of the solder ball, make the solder ball more visually beautiful, improve the overall appearance texture, and make the solder ball surface more uniform and dense, improve its corrosion resistance, reduce surface oxidation or corrosion problems caused by environmental factors, and thus improve the quality of the solder ball.

[0057] In one embodiment, the unloading part 1 further includes a solder ball grinding part 16, which includes a mounting ring 161, a grinding sheet 162, and an elastic member 163 (specifically, a spring, a spring, or other structures). The mounting ring 161 is arranged on the inner wall of the housing 11, and the mounting ring 161 is located above the bottom plate 12; one end of the grinding sheet 162 is hinged to the mounting ring 161, and the other end of the grinding sheet 162 is drooped to a position close to the groove 121; one end of the elastic member 163 is connected to the mounting ring 161, and the other end of the elastic member 163 is connected to the grinding sheet 162; the depth of the groove 121 is lower than the diameter of the solder ball, and when the solder ball is located in the groove 121, the top of the solder ball is exposed outside the groove 121.

[0058] When the tin ball in the groove 121 rotates to the bottom of the tin ball polishing part 16 along with the bottom plate 12, the polishing sheet 162 can polish the tin ball below (during polishing, the tin ball can rotate in the groove 121, so that the polishing sheet 162 can polish the entire tin ball). In conjunction with the rotation of the bottom plate 12, the tin ball polishing part 16 can polish the tin balls that enter the discharge tube 13 one by one to avoid missing unpolished tin balls. And because one end of the polishing sheet 162 is hingedly fixed on the mounting ring 161, and the other end is connected to the mounting ring 161 through the elastic member 163, when the polishing sheet 162 is polishing the tin ball, the polishing sheet 162 has a certain degree of concession to avoid excessive force of the polishing sheet 162 on the tin ball, resulting in excessive polishing of the tin ball. After polishing, the tin ball is still discharged through the discharge tube 13.

[0059] Optionally, a plurality of grinding sheets 162 may be provided on the mounting ring 161 to improve the grinding effect.

[0060] Optionally, in order to prevent the solder balls in the housing 11 from staying on the mounting ring 161, so that the solder balls on the mounting ring 161 cannot be discharged into the centrifugal screening part 2 for screening, the upper surface of the mounting ring 161 is set to be an inclined surface inclined downward toward the center, so that the solder balls thereon can automatically fall to the bottom plate 12 below, ensuring the completeness of the discharge of the discharge part 1.

[0061] Optionally, in order to prevent the solder ball that is not in the groove 121 from interfering with the grinding work of the solder ball grinding unit 16 when the solder ball grinding unit 16 is grinding the solder ball in the groove 121, a baffle (the bottom end height of the baffle is higher than the top height of the solder ball in the groove 121) can be set on the mounting ring 161 around the grinding sheet 162. The baffle can block the remaining solder balls outside the groove 121 to ensure that the grinding work of the solder balls by the grinding sheet 162 can be carried out normally.

[0062] In one embodiment, the polishing surface of the polishing sheet 162 is provided with an arc-shaped concave surface adapted to the solder ball. By providing the polishing surface of the polishing sheet 162 as an arc-shaped concave surface adapted to the solder ball, when the polishing sheet 162 polishes the solder ball, the effective polishing area on the polishing sheet 162 (the contact area between the polishing sheet 162 and the solder ball) is increased, thereby improving the polishing effect of the solder ball polishing portion 16.

[0063] In one embodiment, the solder ball grinding unit 16 further includes a dust removal pipe 164, which is disposed on the housing 11, one end of which is connected to the interior of the housing 11, and the dust removal pipe 164 is flush with the height of the connecting hole, the aperture of the dust removal pipe 164 is smaller than the diameter of the solder ball (to prevent the solder ball from being discharged from the dust removal pipe 164), and the other end of the dust removal pipe 164 is connected to a dust suction pump. When the dust suction pump is working, it can generate vacuum suction, thereby sucking out the tin powder generated when the solder ball grinding unit 16 grinds the solder ball from the groove 121, and preventing the tin powder from entering the feeding tube 13 or the centrifugal screening unit 2 and affecting the screening of the solder balls. Specifically, the dust removal pipe 164 can be disposed on the housing 11 between the solder ball grinding sheet 162 and the feeding tube 13, so that the polished solder ball is first dusted by the dust removal pipe 164 and then discharged through the feeding tube 13.

[0064] In one embodiment, the inner wall of the groove 121 is provided with a grinding layer (specifically, it may be composed of abrasives attached to the inner wall of the groove 121, and the abrasives may specifically be aluminum oxide, silicon carbide, etc.). When the grinding sheet 162 grinds the solder ball, the solder ball will rotate in the groove 121 and rub against the inner wall of the groove 121, and then the inner wall of the groove 121 is provided with a grinding layer, thereby improving the grinding effect of the solder ball.

[0065] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A solder ball centrifugal screening device, characterized in that: The solder ball centrifugal screening device comprises: A material discharge section, wherein the material discharge section contains solder balls to be screened; A centrifugal screening part, which is arranged below the material discharge part, and comprises a concave disk and a material receiving block, wherein the material receiving block is arranged at the center of the concave disk, a good product channel is arranged on one side of the material receiving block, and a defective product collecting tank is arranged between the other side of the material receiving block and the concave disk; The solder balls discharged from the discharge part enter the centrifugal screening part, and the solder balls move along the concave surface of the concave plate. The solder balls are screened by using the principle that the centrifugal forces of solder balls of different sizes are different due to their different masses, so that the solder balls that meet the requirements enter the good product channel of the receiving block, and the solder balls that do not meet the requirements enter the defective product collection tank; The blanking part comprises: The outer shell is cylindrical, a top plate is arranged on the top of the outer shell, and a discharge port is arranged on the bottom of the outer shell; A bottom plate, the bottom plate can be rotatably arranged at the bottom of the shell, the bottom plate is closely attached to the inner wall of the shell, a plurality of grooves are arranged around the edge of the bottom plate, and a solder ball can be accommodated in the groove; a connecting hole is opened on the outer side of the groove, and the aperture of the connecting hole is larger than the diameter of the solder ball; the discharge port is flush with the connecting hole; A feeding tube, one end of which is connected to the discharge port, the other end of which is in close contact with the concave surface of the concave disk, and the diameter of which is larger than the diameter of the solder ball; A rotating power mechanism, the rotating power mechanism is arranged on the top plate, and the rotating power mechanism drives the bottom plate to rotate at a constant speed; The unloading part also includes a solder ball polishing part, and the solder ball polishing part includes: A mounting ring, the mounting ring being arranged on the inner wall of the housing and being located above the bottom plate; A grinding sheet, one end of which is hinged to the mounting ring, and the other end of which hangs down to a position close to the groove; An elastic member, one end of which is connected to the mounting ring, and the other end of which is connected to the polishing sheet; The depth of the groove is less than the diameter of the solder ball. When the solder ball is located in the groove, the top of the solder ball is exposed outside the groove.

2. The solder ball centrifugal screening device according to claim 1, characterized in that: The receiving block is semi-cylindrical, the plane side of the receiving block is provided with the good product channel, the plane side of the receiving block is close to the concave disk, and the defective product collecting groove is an annular groove surrounding the cylindrical side of the receiving block.

3. The solder ball centrifugal screening device according to claim 1, characterized in that: A good product outlet is provided at the bottom end of the good product channel, the bad product collecting groove passes through the concave disk, and a bad product outlet is provided at the bottom of the bad product collecting groove.

4. The solder ball centrifugal screening device according to claim 1, characterized in that: The feed tube is arc-shaped, and the outlet direction of the feed tube is consistent with the tangent direction of the concave surface of the concave disk.

5. The solder ball centrifugal screening device according to claim 1, characterized in that: The material discharging portion further comprises a dispersion plate, which is arranged on the upper surface of the bottom plate, and the upper surface of the dispersion plate is a curved surface structure convex upward.

6. The solder ball centrifugal screening device according to claim 1, characterized in that: The polishing surface of the polishing sheet is provided with an arc-shaped concave surface adapted to the solder ball.

7. The solder ball centrifugal screening device according to claim 1, characterized in that: The solder ball polishing part also includes a dust removal pipe, which is arranged on the outer shell. One end of the dust removal pipe is connected to the inside of the outer shell, and the dust removal pipe is flush with the connecting hole. The aperture size of the dust removal pipe is smaller than the diameter of the solder ball, and the other end of the dust removal pipe is connected to a dust suction pump.

8. The solder ball centrifugal screening device according to claim 1, characterized in that: The inner wall of the groove is provided with a polishing layer.

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