Full-automatic cleaning machine for 12-inch semiconductor wafer

Abstract

The invention relates to the technical field of semiconductor manufacturing, and discloses a 12-inch semiconductor wafer full-automatic cleaning machine which comprises an equipment shell, a touch screen is fixedly installed on the outer surface of the front side of the equipment shell, and a button panel is fixedly installed on the left side, away from the touch screen, of the outer surface of the front side of the equipment shell. A material box taking and placing door is arranged on the lower side, away from the touch screen, of the outer surface of the front side of the equipment shell, and an observation door is arranged on the outer surface of the right side of the equipment shell. According to the full-automatic cleaning machine for the 12-inch semiconductor wafer, a latest two-fluid mixed cleaning scheme is adopted, strong shock waves can be formed through two fluids, fine dust on the surface of an object is effectively and thoroughly cleaned, a centrifugal automatic grasping lock catch device is adopted to be matched with vacuum adsorption, efficient and reliable adsorption of a workpiece is achieved, and the cleaning efficiency is improved. The cleaning agent can be used for cleaning various materials such as wafers, QFN, glass, substrates, mobile phone modules and ceramics.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and in particular to a fully automatic cleaning machine for 12-inch semiconductor wafers. Background Art

[0002] In the semiconductor manufacturing process, the surface cleanliness of the wafer after dicing has a crucial impact on product quality and yield. Therefore, wafer cleaning has become an indispensable part of the semiconductor production process. The semiconductor wafer automatic cleaning machine uses a nozzle to evenly spray the cleaning liquid onto the wafer surface to remove attached contaminants and clean the wafer surface, while using the high-speed rotating wafer to achieve drying.

[0003] The existing fully automatic semiconductor wafer cleaning machines on the market have shortcomings such as too simple cleaning nozzle function, single wafer fixing method, single cleaning function, and inconvenient operation, which have brought certain adverse effects to people's use process.

[0004] In order to solve the above problems, we propose a 12-inch semiconductor wafer fully automatic cleaning machine. Summary of the invention

[0005] In view of the shortcomings of the prior art, the present invention provides a 12-inch semiconductor wafer fully-automatic cleaning machine to solve the problems mentioned in the above background technology that the existing semiconductor wafer fully-automatic cleaning machines on the market have the shortcomings of too simple cleaning nozzle function, single wafer fixing method, single cleaning function, inconvenient operation, etc., which bring certain adverse effects to people's use process.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a 12-inch semiconductor wafer fully automatic cleaning machine, comprising an equipment housing, a touch screen is fixedly installed on the front outer surface of the equipment housing, a button panel is fixedly installed on the left side of the front outer surface of the equipment housing away from the touch screen, a material box picking and placing door is arranged on the lower side of the front outer surface of the equipment housing away from the touch screen, an observation door is arranged on the right outer surface of the equipment housing, the right end of the observation door is movably connected to the inner surface of the equipment housing, an alarm light is fixedly installed on the top of the equipment, an electrical control box is arranged on the upper left side of the rear outer surface of the equipment housing, a pressure surface panel is arranged on the lower side of the rear side of the equipment housing away from the electrical controller box, an air intake and water inlet main valve joint is arranged below the pressure surface panel, a valve island is arranged on the right side of the air intake and water inlet main valve joint, a liquid flow meter panel is arranged above the valve island, and an exhaust and drainage interface is arranged at the rear end of the equipment housing; An equipment frame is fixedly installed inside the equipment shell, a material box lifting platform is fixedly installed on the left end inside the equipment frame, a UV degumming chamber is arranged at the lower side of the material box lifting platform, a pre-alignment platform is arranged on the right side of the equipment frame away from the material box lifting platform, and a cleaning chamber is arranged on the right side of the equipment frame away from the pre-alignment platform; A wastewater tank is fixedly installed below the cleaning chamber, an upper transport arm is arranged below the electrical control box, a lower transport arm is arranged below the upper transport arm, a wafer grabbing arm is arranged below the lower transport arm, a lifting device is fixedly installed on the lower side of the cleaning chamber, a cleaning motor is installed above the lifting device, an air slip ring is installed above the cleaning motor, a workpiece cleaning table is installed above the air slip ring, workpiece centrifugal grippers are installed around the workpiece cleaning table, and a cleaning swing arm is installed inside the cleaning chamber.

[0007] Preferably, one side of the left end of the material box access door is movably connected to the inner surface of the equipment housing, the right end of the touch screen industrial computer is movably connected to the inner surface of the material box access door, and the button panel is fixedly connected to the inner surface of the material box access door.

[0008] By adopting the above technical solution, the left end of the material box access door is movably connected to the inner surface of the equipment shell, so that the material box access door can be opened, and the right end of the touch screen industrial computer 2 is movably connected to the inner surface of the material box access door 4, so that the touch screen industrial computer can be opened.

[0009] Preferably, the upper and lower outer surfaces of the UV degumming chamber are fixedly connected to the inner outer surface of the material box lifting platform.

[0010] By adopting the above technical solution, the upper and lower outer surfaces of the UV degumming chamber are fixedly connected to the inner outer surface of the material box lifting platform. The vertical movement of the material box lifting platform can move the workpiece in the UV degumming chamber to the wafer grabbing arm clamping position. Preferably, the inner side of the device housing is fixedly connected to the outer surface of the device frame by rivets, and the lower end of the device frame is provided with universal wheels and shock-absorbing foot pads. By adopting the above technical solution, by arranging universal wheels and shock-absorbing foot pads at the lower end of the equipment frame, the equipment can be made easier to move and at the same time have a shock-absorbing and protective effect on the equipment.

[0011] Preferably, the UV degumming chamber is composed of a UV degumming lamp group, a UV irradiation sensor and a controller.

[0012] By adopting the above technical solution, the UV degumming chamber is set to control the irradiation time of the UV degumming lamp group to achieve the degumming of the UV film attached to the workpiece in the chamber.

[0013] Preferably, the wafer grabbing arm is composed of a wafer clamp and a grabbing arm motion control device, the wafer clamp is equipped with a cylinder, a clamp and a distance sensor, and the grabbing arm motion control device includes a motor, a lead screw and a guide rail.

[0014] By adopting the above technical solution, the grabbing arm motion control device is set to move in the horizontal direction through the motor, lead screw and guide rail. The wafer grabbing arm can achieve the following by moving in the horizontal direction: extending the wafer clamp into the material box to clamp / put down the workpiece, extending into the UV degumming chamber to clamp / put down the workpiece, and putting down and clamping the workpiece from the pre-alignment table.

[0015] Preferably, the pre-alignment platform is composed of a pre-alignment frame and a pre-alignment platform motion control device. The pre-alignment frame is composed of two frames that move in opposite directions and carry workpieces. The pre-alignment platform motion control device is composed of a motor, a lead screw and a guide rail.

[0016] By adopting the above technical solution, the pre-alignment frame can be controlled to move in opposite directions through the pre-alignment table motion control device via the motor, the lead screw and the guide rail. The pre-alignment frame of the pre-alignment table moves in opposite directions, so that the workpiece placed on the pre-alignment frame can be clamped and positioned.

[0017] Preferably, the upper transport arm is composed of an upper transport arm vacuum suction cup arm and an upper transport arm horizontal motion control device, and the upper transport arm vacuum suction cup arm is composed of a vacuum suction cup arm and an upper transport arm vertical cylinder.

[0018] By adopting the above technical scheme, the upper transport arm vacuum suction cup arm can move in the vertical direction through the upper transport arm vertical cylinder, and the upper transport arm vacuum suction cup arm can use vacuum to suck the workpiece to realize the suction, release, lifting and lowering of the workpiece; the upper transport arm horizontal motion control device can move in the horizontal direction through the linear cylinder and the guide rail.

[0019] Preferably, the lower transport arm is composed of a lower transport arm vacuum suction cup arm and a lower transport arm horizontal motion control device, and the lower transport arm vacuum suction cup arm is composed of a vacuum suction cup arm and a two-stage lower transport arm vertical cylinder.

[0020] By adopting the above technical scheme, the vertical movement of the vacuum suction cup arm of the lower transport arm is realized through the two-stage lower transport arm vertical cylinder, and the vacuum suction cup arm of the lower transport arm uses vacuum to suck the workpiece to realize the absorption, release, lifting and lowering of the workpiece; the horizontal movement control device of the lower transport arm can move in the horizontal direction through the linear cylinder and the guide rail.

[0021] Compared with the prior art, the present invention has the following beneficial effects: 1. This 12-inch semiconductor wafer fully automatic cleaning machine adopts the latest two-fluid mixed cleaning solution. The two fluids can form a powerful shock wave to effectively and thoroughly clean the fine dust on the surface of the object. It uses a centrifugal automatic gripping and locking device with vacuum adsorption to achieve efficient and reliable adsorption of the workpiece. It can be used to clean wafers, QFN, glass, substrates, mobile phone modules, ceramics and other materials.

[0022] 2. The 12-inch semiconductor wafer fully automatic cleaning machine uses stainless steel in the cleaning chamber water tank to prevent rust and corrosion. The exhaust device can quickly exhaust the water mist generated during cleaning to avoid water vapor accumulation in the equipment and shorten the life of the equipment.

[0023] 3. The 12-inch semiconductor wafer fully automatic cleaning machine is equipped with a UV degumming chamber, which can directly perform UV degumming after cleaning, increasing the versatility of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the front view of the three-dimensional structure of the present invention; Figure 2 It is a rear-view stereoscopic structural schematic diagram of the present invention; Figure 3 It is a schematic diagram of the front view and cross-section of the three-dimensional structure of the present invention; Figure 4 This is a schematic diagram of the three-dimensional structure of the cleaning bin of the present invention; Figure 5 It is a schematic diagram of the cross-sectional structure of the cleaning chamber of the present invention.

[0025] In the figure: 1. Equipment housing; 2. Touch screen; 3. Button panel; 4. Material box loading and unloading door; 5. Observation door; 6. Alarm light; 7. Liquid flow meter panel; 8. Electrical control box; 9. Pressure gauge panel; 10. Valve island; 11. Water inlet main valve connector; 12. Exhaust and drainage interface; 13. Material box lifting platform; 14. UV degumming chamber; 15. Pre-alignment table; 16. Wafer grabbing arm; 17. Upper transport arm; 18. Lower transport arm; 19. Cleaning chamber; 20. Cleaning swing arm; 21. Wastewater tank; 22. Equipment frame; 23. Workpiece cleaning table; 24. Centrifugal gripper; 25. Air slip ring; 26. Cleaning motor; 27. Lifting device. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] Please refer to Figures 1-4. In order to solve the problems that the existing semiconductor wafer automatic cleaning machines on the market have shortcomings such as too simple cleaning nozzle function, single wafer fixing method, single cleaning function, inconvenient operation, etc., which have brought certain adverse effects to people's use process, a touch screen 2 is fixedly installed on the front outer surface of the device housing 1, a button panel 3 is fixedly installed on the left side of the front outer surface of the device housing 1 away from the touch screen 2, a material box picking and placing door 4 is arranged on the lower side of the front outer surface of the device housing 1 away from the touch screen 2, an observation door 5 is arranged on the right outer surface of the device housing 1, and the right end of the observation door 5 is movably connected to the inner surface of the device housing 1, an alarm light 6 is fixedly installed on the top of the device, an electrical control box 8 is arranged on the upper left of the rear outer surface of the device housing 1, a pressure surface panel 9 is arranged below the rear side of the device housing 1 away from the electrical controller box, an air intake and water inlet main valve joint 11 is arranged below the pressure surface panel 9, a valve island 10 is arranged on the right side of the air intake and water inlet main valve joint 11, a liquid flow meter panel 7 is arranged above the valve island 10, and an exhaust and drainage interface 12 is arranged at the rear end of the device housing 1; An equipment frame 22 is fixedly installed inside the equipment housing 1, a material box lifting platform 13 is fixedly installed on the left end inside the equipment frame 22, a UV degumming chamber 14 is arranged on the lower side of the material box lifting platform 13, a pre-alignment platform 15 is arranged on the right side of the equipment frame 22 away from the material box lifting platform 13, and a cleaning chamber 19 is arranged on the right side of the equipment frame 22 away from the pre-alignment platform 15; A waste water tank 21 is fixedly installed below the cleaning chamber 19, an upper transport arm 17 is arranged below the electrical control box 8, a lower transport arm 18 is arranged below the upper transport arm 17, and a wafer grabbing arm 16 is arranged below the lower transport arm 18. A lifting device 27 is fixedly installed on the lower side of the cleaning chamber 19, a cleaning motor 26 is installed above the lifting device 27, an air slip ring 25 is installed above the cleaning motor 26, a workpiece cleaning table 23 is installed above the air slip ring 25, a workpiece cleaning table 23 is installed around the workpiece cleaning table 23, and a cleaning swing arm 20 is installed inside the cleaning chamber 19.

[0028] Working principle: The whole process consists of material taking - cleaning - degumming - unloading and other processes: Picking materials: Placing the material box. A material box can contain multiple workpieces: the operator opens the material box pick-up and placement door 4, places the material box on the material box lifting platform 13, closes the material box pick-up and placement door 4, selects the required cleaning program on the touch screen 2 industrial computer, and the material box lifting platform 13 moves vertically to the first workpiece picking position of the material box. The wafer grabbing arm 16 moves forward to extend the clamping claw into the material box and clamp the workpiece. The wafer grabbing arm 16 moves backward to the pre-alignment table 15, and the wafer grabbing arm 16 releases the workpiece and returns to the origin, and the lower transport arm The lower transport arm 18 moves forward to the top of the pre-alignment table 15, the lifting arm of the lower transport arm 18 descends and uses vacuum to suck the workpiece from the pre-alignment table 15, the lifting arm of the lower transport arm 18 is raised and the workpiece is grabbed at the same time, the lower transport arm 18 moves backward to the top of the cleaning bin 19, the workpiece cleaning table 23 in the cleaning bin 19 rises upward, the lifting arm of the lower transport arm 18 descends and places the workpiece on the workpiece cleaning table 23 and turns off the vacuum of the lower transport arm 18, the workpiece cleaning table 23 turns on the vacuum to suck the workpiece and then descends to the cleaning position; Cleaning: The cleaning swing arm 20 moves from the origin to the cleaning position, and the workpiece cleaning table 23 starts to rotate to cooperate with the swing of the cleaning swing arm 20 and the two-fluid cleaning agent sprayed from the cleaning nozzle at the front end of the cleaning swing arm 20 to clean the workpiece. After the cleaning is completed, the cleaning nozzle at the front end of the cleaning swing arm 20 sprays clean air and cooperates with the rotation of the workpiece cleaning table 23 to blow and dry the workpiece. After the workpiece is dry, the workpiece cleaning table 23 rises upward; Debonding: The lower transport arm 18 turns on the vacuum to absorb the workpiece, the workpiece cleaning table 23 turns off the vacuum of the workpiece, the lifting arm of the lower transport arm 18 is lifted and the workpiece is grabbed at the same time, the lower transport arm 18 moves forward with the workpiece to the top of the pre-alignment table 15, the lifting arm of the lower transport arm 18 descends and places the workpiece on the pre-alignment table 15, the material box lifting table 13 moves up and down to move the entrance of the UV debonding chamber 14 to the specified position, the wafer grabbing arm 16 grabs the workpiece from the pre-alignment table 15 and pushes it into the UV debonding chamber 14, and the UV debonding chamber 14 starts UV irradiation until the workpiece is completely debonded; Unloading: After the action, the wafer grabbing arm 16 moves forward to take out the workpiece from the UV degumming chamber 14, and the wafer grabbing arm 16 moves backward to place the workpiece on the pre-alignment table 15. The material box lifting platform 13 moves along the vertical direction to the unloading position of the first workpiece in the material box. The wafer grabbing arm 16 grabs the workpiece from the pre-alignment table 15 and pushes it into the material box. The cleaning of the first workpiece is completed.

[0029] The equipment is set up through the touch screen 2 of the industrial computer, and can repeat the operations of taking out materials - cleaning - degumming - unloading - taking out materials, etc. until all the workpieces in the material box are cleaned.

[0030] Compared with the related art, the 12-inch semiconductor wafer fully automatic cleaning machine provided by the present invention has the following beneficial effects: it adopts two fluids and a centrifugal automatic gripping and locking device in combination with vacuum adsorption to achieve efficient and reliable adsorption of workpieces, and can be used to clean wafers, QFNs, glass, substrates, mobile phone modules, ceramics and other materials.

[0031] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A 12-inch semiconductor wafer fully automatic cleaning machine, comprising a device housing (1), characterized in that: A touch screen (2) is fixedly mounted on the front outer surface of the device housing (1); a button panel (3) is fixedly mounted on the left side of the front outer surface of the device housing (1) away from the touch screen (2); a material box access door (4) is arranged on the lower side of the front outer surface of the device housing (1) away from the touch screen (2); an observation door (5) is arranged on the right outer surface of the device housing (1); the right end of the observation door (5) is movably connected to the inner surface of the device housing (1); an alarm light (6) is fixedly mounted on the top of the device; an electrical control box (8) is arranged on the upper left side of the rear outer surface of the device housing (1); a pressure surface panel (9) is arranged on the lower side of the rear side of the device housing (1) away from the electrical controller box; an air intake and water inlet main valve joint (11) is arranged below the pressure surface panel (9); a valve island (10) is arranged on the right side of the air intake and water inlet main valve joint (11); a liquid flow meter panel (7) is arranged above the valve island (10); and an exhaust and drainage interface (12) is arranged at the rear end of the device housing (1); An equipment frame (22) is fixedly installed inside the equipment housing (1), a material box lifting platform (13) is fixedly installed at the left end inside the equipment frame (22), a UV degumming chamber (14) is arranged at the lower side of the material box lifting platform (13), a pre-alignment platform (15) is arranged inside the equipment frame (22) on the right side away from the material box lifting platform (13), and a cleaning chamber (19) is arranged inside the equipment frame (22) on the right side away from the pre-alignment platform (15); A waste water tank (21) is fixedly installed below the cleaning chamber (19); an upper transport arm (17) is arranged below the electrical control box (8); a lower transport arm (18) is arranged below the upper transport arm (17); a wafer grabbing arm (16) is arranged below the lower transport arm (18); a lifting device (27) is fixedly installed on the lower side of the cleaning chamber (19); a cleaning motor (26) is installed above the lifting device (27); an air slip ring (25) is installed above the cleaning motor (26); a workpiece cleaning table (23) is installed above the air slip ring (25); a workpiece centrifugal gripper (24) is installed around the workpiece cleaning table (23); and a cleaning swing arm (20) is installed inside the cleaning chamber (19).

2. The 12-inch semiconductor wafer fully automatic cleaning machine according to claim 1 is characterized in that: The left end of the material box access door (4) is movably connected to the inner surface of the device housing (1), the right end of the touch screen (2) industrial computer is movably connected to the inner surface of the material box access door (4), and the button panel (3) is fixedly connected to the inner surface of the material box access door (4).

3. The 12-inch semiconductor wafer fully automatic cleaning machine according to claim 1, characterized in that: The upper outer surface of the UV degumming chamber (14) is fixedly connected to the inner outer surface of the material box lifting platform (13).

4. The 12-inch semiconductor wafer fully automatic cleaning machine according to claim 1, characterized in that: The inner side of the device housing (1) is fixedly connected to the outer surface of the device frame (22) by means of rivets, and the lower end of the device frame (22) is provided with universal wheels and shock-absorbing foot pads.

5. The 12-inch semiconductor wafer fully automatic cleaning machine according to claim 1, characterized in that: The UV degumming chamber (14) is composed of a UV degumming lamp group, a UV irradiation sensor and a controller.

6. The 12-inch semiconductor wafer fully automatic cleaning machine according to claim 1, characterized in that: The wafer grabbing arm (16) is composed of a wafer clamping claw and a grabbing arm motion control device, the wafer clamping claw is equipped with a cylinder, a clamping claw and a distance sensor, and the grabbing arm motion control device includes a motor, a lead screw and a guide rail.

7. The 12-inch semiconductor wafer fully automatic cleaning machine according to claim 1, characterized in that: The pre-alignment platform (15) is composed of a pre-alignment frame and a pre-alignment platform (15) motion control device. The pre-alignment frame is composed of two frames that move in opposite directions, and the frames carry workpieces. The pre-alignment platform (15) motion control device is composed of a motor, a lead screw and a guide rail.

8. The 12-inch semiconductor wafer fully automatic cleaning machine according to claim 1, characterized in that: The upper transport arm (17) is composed of an upper transport arm (17) vacuum suction cup arm and an upper transport arm (17) horizontal motion control device, and the upper transport arm (17) vacuum suction cup arm is composed of a vacuum suction cup arm and an upper transport arm (17) vertical cylinder.

9. The 12-inch semiconductor wafer fully automatic cleaning machine according to claim 1, characterized in that: The lower transport arm (18) is composed of a lower transport arm (18) vacuum suction cup arm and a lower transport arm (18) horizontal motion control device, and the lower transport arm (18) vacuum suction cup arm is composed of a vacuum suction cup arm and a two-stage lower transport arm (18) vertical cylinder.

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