Display panel cutting method based on crack propagation

Abstract

The invention relates to the technical field of display panel cutting, in particular to a display panel cutting method based on crack propagation, and mainly solves the technical problems that an existing display panel cutting method is low in cutting yield, easy to cause cutting damage and high in cutting cost. According to the method, firstly, the starting point of a pre-cutting path is heated and softened through a laser beam, then a cutting wheel is used for pressing downwards to form a paddle-tumbler, then a hot crack is formed below the paddle-tumbler through the laser beam, and finally the hot crack is guided to move along the pre-cutting path through movement of the laser beam, so that the display panel is broken automatically. According to the method, only the cutter wheel and the display panel need to be in short contact to complete indentation treatment, transverse cracks caused by long-time contact of the cutter wheel and the display panel can be effectively avoided, and therefore the cutting yield can be increased; and meanwhile, the laser beams cannot generate dust in the cutting process, so that a complex dust removal and cleaning system does not need to be arranged, cutting damage can be avoided, and meanwhile the cutting cost is effectively reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of display panel cutting, and in particular to a display panel cutting method based on crack extension. Background Art

[0002] In the processing of display panels, cutting is a very important step. Cutting is mainly used to divide the display panel into multiple panel units of required sizes.

[0003] In the prior art, a cutter wheel cutting method or a laser cutting method is generally used to cut display panels. However, practice shows that the existing display panel cutting method has the following problems due to its own principle limitations: for the cutter wheel cutting method, during the cutting process, the cutter wheel needs to be in contact with the display panel for a long time, which easily causes transverse cracks in the display panel, resulting in a low cutting yield; for the laser cutting method, during the cutting process, a complex dust removal and cleaning system needs to be equipped, which on the one hand easily causes cutting damage, and on the other hand leads to high cutting costs. Based on this, it is necessary to invent a display panel cutting method to solve the problems of low cutting yield, easy cutting damage, and high cutting cost. Summary of the invention

[0004] In order to overcome the technical defects of the existing display panel cutting method, such as low cutting yield, easy cutting damage and high cutting cost, the present invention provides a display panel cutting method based on crack extension.

[0005] The display panel cutting method based on crack extension provided by the present invention comprises: S1. Fix the display panel and arrange the display panel horizontally; S2. irradiating the upper surface of the display panel with a laser beam emitted by a laser, and causing the formed spot to fall at the starting point of the pre-cutting path, so that the starting point of the pre-cutting path is heated and softened; S3. Using a cutter wheel to perform an indentation process at the starting point of the pre-cutting path to form a groove, and forming an initial microcrack below the groove; S4. irradiating the upper surface of the display panel with a laser beam emitted by a laser, and causing the formed light spot to fall on the groove, so as to induce thermal cracks below the initial microcracks; S5. irradiating the upper surface of the display panel with a laser beam emitted by a laser, and moving the formed light spot along the pre-cutting path from the groove, so that the thermal crack expands with the movement of the light spot until the display panel breaks by itself; S6. Repeat steps S1 to S5 until the display panel is cut into a plurality of panel units of required sizes.

[0006] Optionally, in step S1, the display panel is first supported on two cushion blocks, and then the display panel is pressed by two pressing blocks, so as to fix the display panel.

[0007] Optionally, in steps S2, S4 and S5, the power of the laser beam is less than 50 W, and the diameter of the light spot formed by the laser beam ranges from 0.1 mm to 0.5 mm.

[0008] Optionally, in step S5, the moving speed of the light spot formed by the laser beam is 0.1 mm / s to 1 mm / s.

[0009] Optionally, the focusing system of the laser adopts a 3D dynamic focusing system.

[0010] Optionally, the cutting wheel is a diamond cutting wheel.

[0011] The technical solution provided by the present invention has the following advantages compared with the prior art: The display panel cutting method based on crack extension provided by the present invention first uses a laser beam to heat and soften the starting point of the pre-cutting path, then uses a cutter wheel to press down to form a groove, then uses a laser beam to form a thermal crack below the groove, and finally uses a laser beam to move and guide the thermal crack along the pre-cutting path, so that the display panel breaks by itself. Compared with the cutter wheel cutting method, this method only needs to briefly contact the cutter wheel with the display panel to complete the indentation treatment, which can effectively avoid transverse cracks caused by long-term contact between the cutter wheel and the display panel, thereby improving the cutting yield; compared with the laser cutting method, this method only needs to soften the display panel, generate and guide thermal cracks, etc., and does not need to cut the display panel, so no dust will be generated during the cutting process, and there is no need to equip a complex dust removal and cleaning system, which can avoid cutting damage and effectively reduce the cutting cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0013] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0014] Figure 1 A flow chart showing a display panel cutting method according to an embodiment of the present invention; Figure 2 A schematic diagram showing step S1 in an embodiment of the present invention; Figure 3express Figure 2 Sectional view at AA in the middle; Figure 4 express Figure 2 A top view of Figure 5 A schematic diagram showing step S3 in an embodiment of the present invention; Figure 6 express Figure 5 Sectional view at the middle BB; Figure 7 express Figure 5 A top view of Figure 8 A schematic diagram showing step S4 in an embodiment of the present invention; Fig. 9 express Figure 8 Sectional view at CC; Fig.10 express Figure 8 A top view of Fig.11 A schematic diagram showing step S5 in an embodiment of the present invention; Fig.12 express Fig.11 Sectional view at DD in the middle; Fig.13 express Fig.11 Top view of the .

[0015] In the figure: 1. Display panel; 1.1. Scratches; 1.2. Initial microcracks; 1.3. Thermal cracks; 2. Pads; 3. Press blocks; 4. Light spots. DETAILED DESCRIPTION

[0016] In order to more clearly understand the above-mentioned objectives, features and advantages of the present invention, the scheme of the present invention will be further described below. It should be noted that the embodiments of the present invention and the features in the embodiments can be combined with each other without conflict.

[0017] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein; it is obvious that the embodiments in the specification are only part of the embodiments of the present invention, rather than all of the embodiments.

[0018] Combine the following Figures 1 to 13 The specific embodiments of the present invention are described in detail.

[0019] This embodiment provides a display panel cutting method based on crack extension, which is used to cut a 0.5 mm thick organic light emitting diode display panel, namely, an OLED display panel, and includes steps S1 to S6.

[0020] S1. Fix the display panel 1 and arrange the display panel 1 horizontally.

[0021] Specifically, in this embodiment, the display panel 1 is first supported on two cushion blocks 2, and then the display panel 1 is pressed by two pressing blocks 3, so as to fix the display panel 1. In order to ensure the stability of the fixation and avoid interference with the cutting operation, it is preferred that the left and right edges of the display panel 1 are overlapped on the two cushion blocks 2, and the two pressing blocks 3 are pressed on the left and right edges of the display panel 1, respectively, and the pressing blocks 3 correspond to the cushion blocks 2 up and down to clamp and fix the display panel 1. In other embodiments, two sets of clamps can be used to clamp the left and right edges of the display panel 1 respectively to fix the display panel 1; other commonly used fixing structures in the art can also be used to fix the display panel 1.

[0022] S2. irradiate the upper surface of the display panel 1 with a laser beam emitted by a laser, and make the formed light spot 4 fall on the starting point of the pre-cutting path, so that the starting point of the pre-cutting path is heated and softened.

[0023] It should be noted that the energy density of the laser beam can be adjusted by changing the power of the laser beam and the diameter of the light spot 4 formed, so that the laser beam has different functions. The adjustment of specific parameters is well known to those skilled in the art or can be obtained through limited experiments. For example, in this step, the function of the laser beam is to soften the display panel 1, and its power should be less than 50W, and the diameter of the light spot 4 formed by the laser beam should be limited to 0.1mm to 0.5mm.

[0024] Specifically, the power of the laser beam used in this embodiment in this step is 25W, and the diameter of the spot 4 formed by the laser beam is 0.5mm. In other embodiments, the power of the laser beam can also be 10W or 40W, and the diameter of the spot 4 formed by the laser beam can also be 0.1mm or 0.3mm.

[0025] S3. Using a cutter wheel to perform an indentation process at the starting point of the pre-cutting path to form a groove 1.1, and forming an initial microcrack 1.2 below the groove 1.1.

[0026] It is easy to understand that the indentation treatment is a process of applying downward pressure to the softened area of ​​the display panel 1 using a cutter wheel so as to form a groove 1.1 on the upper surface of the softened area of ​​the display panel 1.

[0027] Specifically, the cutter wheel used in this embodiment is a diamond cutter wheel. In other embodiments, the cutter wheel may also be an alloy cutter.

[0028] S4. The upper surface of the display panel 1 is irradiated with a laser beam emitted by a laser, and the formed light spot 4 is made to fall on the scribe groove 1.1, so as to induce the formation of a thermal crack 1.3 below the initial microcrack 1.2.

[0029] It should be noted that the function of the laser beam in this step is to induce the formation of thermal cracks 1.3 below the initial microcracks 1.2. The power should be less than 50W, and the diameter of the spot 4 formed by the laser beam should be limited to 0.1mm to 0.5mm.

[0030] Specifically, the power of the laser beam used in this embodiment in this step is 30W, and the diameter of the spot 4 formed by the laser beam is 0.5mm. In other embodiments, the power of the laser beam can also be 10W, 20W or 40W, and the diameter of the spot 4 formed by the laser beam can also be 0.1mm or 0.3mm.

[0031] S5. Use the laser beam emitted by the laser to irradiate the upper surface of the display panel 1, and make the formed light spot 4 move along the pre-cutting path starting from the groove 1.1, so that the thermal crack 1.3 expands with the movement of the light spot 4 until the display panel 1 breaks by itself.

[0032] It should be noted that the function of the laser beam in this step is to guide the thermal crack 1.3 to expand along the pre-cutting path. Its power should be less than 50W, the diameter of the spot 4 formed by the laser beam should be limited to 0.1mm to 0.5mm, and the moving speed of the spot 4 formed by the laser beam should be limited to 0.1mm / s to 1mm / s.

[0033] Specifically, in this embodiment, the power of the laser beam used in this step is 20W, and the diameter of the spot 4 formed by the laser beam is 0.5mm. In other embodiments, the power of the laser beam may also be 10W, 30W or 40W, and the diameter of the spot 4 formed by the laser beam may also be 0.1mm or 0.3mm.

[0034] Specifically, in this embodiment, the moving speed of the light spot 4 formed by the laser beam in this step is 0.1 mm / s. In other embodiments, the moving speed of the light spot 4 formed by the laser beam may also be 0.5 mm / s or 1 mm / s.

[0035] S6. Repeat steps S1 to S5 until the display panel 1 is cut into a plurality of panel units of required sizes.

[0036] Preferably, the focusing system of the laser in this embodiment adopts a 3D dynamic focusing system, which has the advantages of high precision, high real-time performance and strong adaptability.

[0037] It should be noted that the present embodiment is aimed at a 0.5 mm thick OLED display panel. In other embodiments, by selecting three parameter combinations within the three ranges of laser beam power less than 50 W, diameter range of the light spot 4 formed by the laser beam 0.1 mm to 0.5 mm, and moving speed range of the light spot 4 formed by the laser beam 0.1 mm / s to 1 mm / s, different energy densities can be adjusted for processing when the laser beam is working, thereby completing effective cutting of a display panel 1 with a thickness of 0.4 mm to 0.7 mm.

[0038] The above is only a specific implementation of the present invention, which enables those skilled in the art to understand or implement the present invention. Although detailed descriptions are given with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments, and they should all be covered by the protection scope of the claims.

Claims

1. A display panel cutting method based on crack extension, characterized in that: include: S1. Fixing the display panel (1) and arranging the display panel (1) horizontally; S2. irradiating the upper surface of the display panel (1) with a laser beam emitted by a laser, and causing the formed light spot (4) to fall at the starting point of the pre-cutting path, so that the starting point of the pre-cutting path is heated and softened; S3. Using a cutter wheel to perform an indentation process at the starting point of the pre-cutting path to form a groove (1.1), and forming an initial microcrack (1.2) below the groove (1.1); S4. irradiating the upper surface of the display panel (1) with a laser beam emitted by a laser, and causing the formed light spot (4) to fall on the groove (1.1), so as to induce the formation of a thermal crack (1.3) below the initial microcrack (1.2); S5. irradiating the upper surface of the display panel (1) with a laser beam emitted by a laser, and causing the formed light spot (4) to move along the pre-cutting path starting from the groove (1.1), so that the thermal crack (1.3) expands as the light spot (4) moves until the display panel (1) breaks by itself; S6. Repeat steps S1 to S5 until the display panel (1) is cut into a plurality of panel units of required sizes.

2. The display panel cutting method based on crack extension according to claim 1, characterized in that: In step S1, the display panel (1) is first supported on two cushion blocks (2), and then the display panel (1) is pressed by two pressing blocks (3), thereby fixing the display panel (1).

3. The display panel cutting method based on crack extension according to claim 1, characterized in that: In steps S2, S4 and S5, the power of the laser beam is less than 50W, and the diameter of the light spot (4) formed by the laser beam ranges from 0.1 mm to 0.5 mm.

4. The display panel cutting method based on crack extension according to claim 3, characterized in that: In step S5, the moving speed of the light spot (4) formed by the laser beam is 0.1 mm / s to 1 mm / s.

5. The display panel cutting method based on crack extension according to claim 3 or 4, characterized in that: The laser focusing system adopts a 3D dynamic focusing system.

6. The display panel cutting method based on crack extension according to claim 1, characterized in that: The cutter wheel is a diamond cutter wheel.

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