Preparation process of polishing solution based on sapphire silicon wafer

Abstract

The invention provides a sapphire silicon wafer-based polishing solution preparation process, which comprises a bottom plate, and the bottom plate is provided with a clamping unit, an external polishing unit and a polishing unit; the clamping unit is used for clamping the sapphire silicon wafer, and the external polishing unit is used for polishing the outer part of the sapphire silicon wafer; and the polishing unit enters from the narrow opening part. A plurality of groups of folded swing rods a and a plurality of groups of arc-shaped protective shells a are driven to enter from a narrow opening part of the upper shell, a plurality of groups of folded swing rods b and a plurality of groups of arc-shaped protective shells b are driven to enter from a narrow opening part of the upper shell, and then the plurality of groups of swing rods a and the plurality of groups of arc-shaped protective shells a are driven to be unfolded, and the plurality of groups of swing rods b and the plurality of groups of arc-shaped protective shells b are driven to be unfolded; the sapphire silicon wafer polishing solution is prepared, the semi-arc-shaped shell is filled with nitrogen through the air inlet pipe a, air is exhausted through the air exhaust pipe a, when the polishing nozzle b conducts external polishing, atmosphere protection is conducted, the oxygen content is reduced, and the problem that polishing is difficult to conduct is solved.

Description

Technical Field

[0001] The invention relates to the technical field of polishing, and in particular to a process for preparing a sapphire silicon wafer polishing liquid. Background Art

[0002] With the development of science and technology, society has higher and higher requirements for the surface quality of various materials. Sapphire crystal, quartz, diamond, silicon wafer, tungsten alloy materials play an important role in aerospace, national defense, and processing and manufacturing due to their unique physical and chemical properties. Chemical mechanical polishing, as the only ultra-precision processing technology that can achieve global flatness, is widely used in the final processing of materials.

[0003] However, in the prior art, since the SiO2 produced by physical vapor deposition is a SiO2 film formed by a large number of particles connected together at the microscopic level, while the SiO2 produced by vapor deposition is similar to a sheet film stacked layer by layer at the microscopic level, the polishing effects of the SiO2 films grown by the two different methods are very different under the same polishing conditions, and the space is relatively narrow, making it difficult for workers to polish. In order to solve this problem, we propose a preparation process for sapphire silicon wafer polishing liquid. Summary of the invention

[0004] The purpose of the present invention is to address the deficiencies in the prior art and to provide a process for preparing polishing liquid for sapphire silicon wafers, by driving multiple groups of folded swing arms a and multiple groups of arc-shaped protective shells a to enter from the narrow mouth of the upper shell body, driving multiple groups of folded swing arms b and multiple groups of arc-shaped protective shells b to enter from the narrow mouth of the upper shell body, and then driving multiple groups of swing arms a and multiple groups of arc-shaped protective shells a to unfold, and multiple groups of swing arms b and multiple groups of arc-shaped protective shells b to unfold, so as to realize the preparation of polishing liquid for sapphire silicon wafers and solve the problem of difficulty in polishing.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A process for preparing a sapphire silicon wafer polishing liquid comprises a bottom plate, on which a clamping unit, an external polishing unit and a polishing unit are arranged; the clamping unit clamps the sapphire silicon wafer, and the external polishing unit polishes the outside of the sapphire silicon wafer; the polishing unit enters from a narrow opening to prepare a sapphire silicon wafer polishing liquid;

[0007] Furthermore, the polishing unit includes a moving rod a arranged on one side of the base plate, a moving block a is installed on the moving rod a, multiple groups of mounting blocks a are installed on the outside of the moving block a, a groove a is opened in the mounting block a, a swing rod a is rotatably arranged in the groove a, an arc-shaped protective shell a is installed on the swing rod a, a polishing nozzle a is installed on one of the arc-shaped protective shells a, a driving component a is provided on the moving block a, and a moving component is provided on one side of the base plate; the driving component a drives the swing rod a to rotate, thereby folding multiple groups of the swing rods a and multiple groups of the arc-shaped protective shells a, and the moving component drives the folded multiple groups of the swing rods a and multiple groups of the arc-shaped protective shells a to enter from the narrow mouth.

[0008] Preferably, the clamping unit includes a clamping block a installed on the base plate, a placement groove a for placing the upper shell is provided in the clamping block a, a linear drive component c is installed on the base plate, a clamping block b is installed on the output end of the linear drive component c, a placement groove b for placing the lower shell is provided in the clamping block b, rolling balls are rotatably provided in the placement grooves a and b, the rolling balls are in contact with the outer wall of the sapphire silicon wafer, and a rotating component for driving the sapphire silicon wafer to rotate simultaneously is provided on the base plate.

[0009] Furthermore, the present invention also includes an atmosphere protection unit, which simultaneously provides atmosphere protection to the external polishing area and the polishing area to prevent oxidation of the polishing area.

[0010] Preferably, the atmosphere protection unit comprises an external protection component and a protection component, wherein the external protection component performs atmosphere protection on the external polishing area, and the protection component performs atmosphere protection on the polishing area;

[0011] Furthermore, the external protection component includes a fixed block installed on both sides of the base plate, a sliding groove is opened in the fixed block, two sliding blocks are slidably arranged in the sliding groove, a moving bar is installed on the sliding block, and a semi-arc shell is installed on the moving bar; the external polishing unit includes a polishing nozzle b, and the polishing nozzle b is installed in one of the semi-arc shells, and the positions of the polishing nozzle b and the polishing nozzle a correspond.

[0012] Preferably, the motion component includes a base arranged on the ground, a linear drive member d is installed on the base, and the output end of the linear drive member d is connected to the motion rod a; the protection component includes a linear drive member e installed on the base, a connecting plate is installed on the output end of the linear drive member e, a sleeve rod is installed on the connecting plate, the sleeve rod is sleeved on the outside of the motion rod a, a motion block b is installed on the sleeve rod, a plurality of groups of mounting blocks b are installed on the outside of the motion block b, a groove b is opened in the mounting block b, a swing rod b is rotatably provided in the groove b, an arc-shaped protective shell b is installed on the swing rod b, and a driving part is provided on the motion block b; the driving part drives the swing rod b to rotate, thereby folding the plurality of groups of swing rods b and the plurality of groups of arc-shaped protective shells b.

[0013] Furthermore, the driving component a includes a rotating shaft a installed on the swing rod a, a bevel gear a is installed on the rotating shaft a, a fixed plate a is installed on the mounting block a, a center shaft a is rotatably provided on the fixed plate a, a bevel gear c is installed at one end of the center shaft a, the bevel gear a is meshed with the bevel gear c, a gear h is installed at the other end of the center shaft a, a gear ring a is rotatably provided on the moving block a, and the gear ring a is meshed with the gear h.

[0014] Preferably, the driving part includes a rotating shaft b installed on the swing rod b, a bevel gear b is installed on the rotating shaft b, a fixed plate b is installed on the moving block b, a center shaft b is rotatably provided on the fixed plate b, a bevel gear d is installed at one end of the center shaft b, the bevel gear d is meshed with the bevel gear b, a gear k is installed at the other end of the center shaft b, a gear ring b is rotatably provided on the moving block b, and the gear ring b is meshed with the gear k.

[0015] Furthermore, the rotating assembly includes a connecting block installed on the semi-arc shell, avoidance grooves are provided on both sides of the connecting block, and multiple rotating shafts e are rotatably provided in the avoidance grooves, and a driving wheel is installed on the rotating shaft e, and a fitting groove is provided in the connecting block, and a gear f is installed on the rotating shaft e, and a flexible belt is slidably provided in the fitting groove, and a tooth block is provided on the inner side of the flexible belt, and the tooth block is meshed with multiple groups of the gears f, and a rotating driving member c is installed on the semi-arc shell, and a transmission shaft is installed on the output end of the rotating driving member c, and two gears g are installed on the transmission shaft, and the gear g is meshed with the tooth block, and an intake pipe a is installed on one of the semi-arc shells, and an exhaust pipe a is installed on the other semi-arc shell, and an intake pipe b is installed on one of the arc protective shells b, and an exhaust pipe b is installed on the other arc protective shell.

[0016] Preferably, an installation groove is opened in the fixed block, a rack plate a is installed on one of the sliders, a rack plate b is installed on the other slider, a connecting rod is rotatably provided in the installation groove, a gear m is installed on the connecting rod, the gear m is meshed with the rack plate b and the rack plate a, a linear drive member u is installed in the installation groove, and the output end of the linear drive member u is connected to the rack plate b.

[0017] The present invention provides a method for using a sapphire silicon wafer polishing solution preparation process, comprising the following steps:

[0018] Step 1: Loading process: Place the upper shell into the placement groove a, and then place the lower shell into the placement groove b, so that the bottom of the upper shell contacts the top of the lower shell to achieve positioning;

[0019] Step 2: Clamping process: driving two groups of unfolded semi-arc shells to clamp the sapphire silicon wafer from both sides at the same time to clamp the sapphire silicon wafer;

[0020] Step 3, entry process: the linear drive member d drives the motion block a to move along the -X direction, driving the folded multiple swing rods a and multiple arc-shaped protective shells a to enter from the narrow opening of the upper shell; the linear drive member e drives the motion block b to move along the -X direction, driving the folded multiple swing rods b and multiple arc-shaped protective shells b to enter from the narrow opening of the upper shell;

[0021] Step 4, unfolding process: drive the gear ring a to rotate, drive the swing rod a to rotate and align; drive the gear ring b to rotate, drive the swing rod b to rotate and align;

[0022] Step 5, interlacing and combining process: the linear driving member d drives the moving block a to move along the X direction, and the linear driving member e drives the moving block b to move along the -X direction, so that the multiple groups of unfolded arc-shaped protective shells a and the multiple groups of unfolded arc-shaped protective shells b are interlaced and combined together, so that the multiple groups of arc-shaped protective shells a and the multiple groups of arc-shaped protective shells b form a completed inner ring protective cover;

[0023] Step 6: Inflation protection process: nitrogen is filled into the semi-arc shell, and nitrogen is filled into the arc-shaped protective shell b;

[0024] Step 7, polishing process: Rotate the drive member c to drive the transmission shaft to rotate, which drives the drive wheels to rotate. Since one set of drive wheels clamps the upper shell and the other set of drive wheels clamps the lower shell, the upper shell and the lower shell rotate synchronously while the drive wheels rotate. At this time, the polishing nozzle a prepares the polishing liquid for the sapphire silicon wafer, and the polishing nozzle b polishes the outside of the sapphire silicon wafer.

[0025] The beneficial effects of the present invention are:

[0026] (1) The present invention drives the folded multiple groups of swing arms a and multiple groups of arc-shaped protective shells a to enter from the narrow opening of the upper shell body, drives the folded multiple groups of swing arms b and multiple groups of arc-shaped protective shells b to enter from the narrow opening of the upper shell body, and then drives the multiple groups of swing arms a and multiple groups of arc-shaped protective shells a to unfold, and the multiple groups of swing arms b and multiple groups of arc-shaped protective shells b to unfold, thereby preparing the polishing liquid for the sapphire silicon wafer, thereby solving the problem that it is difficult to perform polishing.

[0027] (2) The present invention fills nitrogen into the semi-arc shell through the air inlet pipe a and exhausts air through the exhaust pipe a, and performs atmosphere protection when the polishing nozzle b is performing external polishing to reduce the oxygen content; fills nitrogen into the arc-shaped protective shell b through the air inlet pipe b and exhausts air through the exhaust pipe b, and performs atmosphere protection when the polishing nozzle a is polishing to reduce the oxygen content, thereby preventing oxidation at the high-temperature polishing site caused by excessive oxygen, and improving the polishing quality.

[0028] (3) The present invention drives the transmission shaft to rotate by rotating the driving member c, which drives the two gears g to rotate, drives the flexible belt to slide in the fitting groove, and drives the driving wheels to rotate. Since one group of driving wheels clamps the upper shell body and the other group of driving wheels clamps the lower shell body, when the driving wheels rotate, the upper shell body and the lower shell body are driven to rotate synchronously, thereby ensuring the synchronous rotation of the upper shell body and the lower shell body, and ensuring the quality of polishing.

[0029] (4) The present invention first shortens the length of the swing rod a, and then drives the swing rod a to rotate and align. At this time, the arc-shaped protective shell a will not interfere with the inner wall. Then, the length of the swing rod a is extended to drive the arc-shaped protective shell a to contact the inner wall of the container, which is convenient for the subsequent interlaced assembly process. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0031] Figure 2 It is a structural schematic diagram in the prior art;

[0032] Figure 3 It is a schematic diagram of the structure of the placement slot a and the placement slot b of the present invention;

[0033] Figure 4 This is a schematic diagram of the polishing unit structure of the present invention;

[0034] Figure 5 For the present invention Figure 4 The enlarged schematic diagram of point A in the middle;

[0035] Figure 6 For the present invention Figure 4 The enlarged schematic diagram of point B in the middle;

[0036] Figure 7 This is a schematic diagram of the structure of the external protection component of the present invention;

[0037] Figure 8 It is a cross-sectional schematic diagram of a fixing block of the present invention;

[0038] Fig. 9 This is a schematic diagram of the arc-shaped protective shell a and the arc-shaped protective shell b in the unfolded state of the present invention;

[0039] Fig.10 This is a schematic diagram of the interlaced combination state of the arc-shaped protective shell a and the arc-shaped protective shell b of the present invention;

[0040] Fig.11 It is a schematic diagram of the structure of the rotating assembly of the present invention;

[0041] Fig.12 It is a schematic diagram of the structure of some parts of the rotating assembly of the present invention;

[0042] Fig.13 This is a schematic diagram of the cross-sectional structure of the connecting block of the present invention;

[0043] Fig.14 This is a schematic diagram of the structure of the polishing nozzle a of the present invention;

[0044] Fig.15 It is a schematic diagram of the state of the present invention during polishing;

[0045] Fig.16 It is a schematic diagram of the positions of the gear n and the gear ring a of the present invention;

[0046] Fig.17 This is a structural schematic diagram of the swing rod b of the present invention;

[0047] Fig.18 This is a schematic diagram of the first straightening state of the swing rod b of the present invention;

[0048] Fig.19 This is a schematic diagram of the second straightening state of the swing rod b of the present invention;

[0049] Fig. 20 This is a schematic diagram of the swing rod b in the third straightening state of the present invention;

[0050] Fig.21 It is a schematic diagram of the fourth straightening state of the swing rod b of the present invention.

[0051] Reference numerals

[0052] 1. Bottom plate; 2. Clamping unit; 21. Clamping block a; 211. Placement slot a; 22. Linear drive member c; 23. Clamping block b; 231. Placement slot b; 24. Rolling ball; 25. Rotation assembly; 251. Connecting block; 2511. Avoidance slot; 2512. Fitting slot; 252. Rotation axis e; 253. Driving wheel; 254. Gear f; 255. Flexible belt; 256. Tooth block; 257. Rotation drive member c; 258. Transmission shaft; 259. Gear g; 3. External polishing unit; 31. Polishing nozzle b; 4 , polishing unit; 41, moving rod a; 42, moving block a; 43, mounting block a; 431, groove a; 44, swing rod a; 441, fixed rod a; 442, telescopic rod a; 45, arc-shaped protective shell a; 46, polishing nozzle a; 47, drive assembly a; 471, rotating shaft a; 472, bevel gear a; 473, fixed plate a; 474, center axis a; 475, bevel gear c; 476, gear h; 477, gear ring a; 4770, gear n; 48, moving assembly; 481, base; 482, linear Driving member d; 5, atmosphere protection unit; 51, external protection assembly; 510, slider; 511, fixing block; 5111, sliding groove; 5112, mounting groove; 512, moving bar; 513, semi-arc shell; 5131, air inlet pipe a; 5132, exhaust pipe a; 515, rack plate a; 516, rack plate b; 517, connecting rod; 518, gear m; 519, linear driving member u; 52, protection assembly; 521, linear driving member e; 523, connecting plate; 524, sleeve rod; 525, moving block b; 526. mounting block b; 5261. groove b; 527. swing rod b; 5271. fixing rod b; 5272. telescopic rod b; 528. arc-shaped protective shell b; 5281. air intake pipe b; 5282. exhaust pipe b; 529. driving unit; 5291. rotating shaft b; 5292. bevel gear b; 5293. fixing plate b; 5294. center shaft b; 5295. bevel gear d; 5296. gear k; 5297. gear ring b; 101. upper section; 102. middle section; 103. lower section; 104. ventilation pipe. DETAILED DESCRIPTION

[0053] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0054] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0055] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0056] Embodiment 1

[0057] like Figure 1-Figure 16 As shown, this embodiment provides a process for preparing a polishing liquid based on a sapphire silicon wafer, including a bottom plate 1. It should be noted that the upper shell in this embodiment is a combination of the upper section 101 and the middle section 102 after polishing, and the lower shell is the lower section 103. This polishing device is mainly used to prepare a polishing liquid for a sapphire silicon wafer. In this embodiment, a clamping unit 2, an external polishing unit 3, and a polishing unit 4 are provided on the bottom plate 1; wherein the clamping unit 2 clamps the sapphire silicon wafer, and the external polishing unit 3 polishes the outside of the sapphire silicon wafer; the polishing unit 4 enters from a narrow mouth to prepare a polishing liquid for a sapphire silicon wafer;

[0058] Preferably, Figure 1-Figure 3 As shown, the clamping unit 2 includes a clamping block a21 mounted on the bottom plate 1, a placement groove a211 for placing the upper shell is provided in the clamping block a21, a linear drive member c22 is installed on the bottom plate 1, a clamping block b23 is installed on the output end of the linear drive member c22, a placement groove b231 for placing the lower shell is provided in the clamping block b23, a rolling ball 24 is rotatably provided in the placement groove a211 and the placement groove b231, the rolling ball 24 contacts the outer wall of the sapphire silicon wafer, and a rotating component 25 for driving the sapphire silicon wafer to rotate simultaneously is provided on the bottom plate 1;

[0059] In this embodiment, the upper shell is placed in the placement groove a211, and then the lower shell is placed in the placement groove b231. The linear drive member c22 drives the clamping block b23 to move along the X direction, driving the lower shell to move along the X direction, so that the bottom of the upper shell contacts the top of the lower shell to achieve positioning, which is convenient for the subsequent polishing process;

[0060] Further, such as Figure 4-Figure 6 As shown, the polishing unit 4 includes a moving rod a41 arranged on one side of the base plate 1, a moving block a42 is installed on the moving rod a41, a plurality of mounting blocks a43 are installed outside the moving block a42, a groove a431 is provided in the mounting block a43, a swing rod a44 is rotatably arranged in the groove a431, an arc-shaped protective shell a45 is installed on the swing rod a44, a polishing nozzle a46 is installed on one of the arc-shaped protective shells a45, a driving assembly a47 is provided on the moving block a42, and a moving assembly 48 is provided on one side of the base plate 1;

[0061] Preferably, Figure 5 As shown, the driving component a47 drives the swing rod a44 to rotate, thereby folding the multiple groups of swing rods a44 and the multiple groups of arc-shaped protective shells a45, and the motion component 48 drives the folded multiple groups of swing rods a44 and the multiple groups of arc-shaped protective shells a45 to enter from the narrow mouth. Specifically, the motion component 48 includes a base 481 arranged on the ground, and a linear driving component d482 is installed on the base 481, and the output end of the linear driving component d482 is connected to the motion rod a41.

[0062] Preferably, Figure 5 As shown, the driving assembly a47 includes a rotating shaft a471 mounted on the swing rod a44, a bevel gear a472 is mounted on the rotating shaft a471, a fixing plate a473 is mounted on the mounting block a43, a central shaft a474 is rotatably provided on the fixing plate a473, a bevel gear c475 is mounted on one end of the central shaft a474, the bevel gear a472 is meshed with the bevel gear c475, a gear h476 is mounted on the other end of the central shaft a474, a gear ring a477 is rotatably provided on the moving block a42, and the gear ring a477 is meshed with the gear h476;

[0063] In this embodiment, in the initial state, the multiple groups of swing rods b527 and the multiple groups of arc-shaped protective shells b528 are folded, and the multiple groups of swing rods a44 and the multiple groups of arc-shaped protective shells a45 are also folded. Figure 1 and Figure 4 As shown,

[0064] The linear driving component d482 drives the moving block a42 to move along the -X direction through the moving rod a41, driving the multiple groups of folded swing rods a44 and multiple groups of arc-shaped protective shells a45 to enter from the narrow opening of the upper shell body. The linear driving component e521 drives the moving block b525 to move along the -X direction through the sleeve rod 524, driving the multiple groups of folded swing rods b527 and multiple groups of arc-shaped protective shells b528 to enter from the narrow opening of the upper shell body, which is convenient for the subsequent polishing process.

[0065] Specifically, Figure 4-Figure 7As shown, this embodiment also includes an atmosphere protection unit 5, which performs atmosphere protection on the external polishing area and the polishing area at the same time to prevent oxidation of the polishing area. The atmosphere protection unit 5 includes an external protection component 51 and a protection component 52. The external protection component 51 performs atmosphere protection on the external polishing area, and the protection component 52 performs atmosphere protection on the polishing area.

[0066] like Figure 7 As shown, the external protection component 51 includes a fixed block 511 installed on both sides of the bottom plate 1, a sliding groove 5111 is opened in the fixed block 511, two sliders 510 are slidably arranged in the sliding groove 5111, a moving bar 512 is installed on the slider 510, and a semi-arc shell 513 is installed on the moving bar 512; the external polishing unit 3 includes a polishing nozzle b31, and the polishing nozzle b31 is installed in one of the semi-arc shells 513, and the polishing nozzle b31 corresponds to the polishing nozzle a46 in position;

[0067] like Figure 7 and Figure 8 As shown, a mounting groove 5112 is provided in the fixed block 511, a rack plate a515 is installed on one of the sliders 510, a rack plate b516 is installed on the other slider 510, a connecting rod 517 is rotatably provided in the mounting groove 5112, a gear m518 is installed on the connecting rod 517, the gear m518 is meshed with the rack plate b516 and the rack plate a515, a linear drive member u519 is installed in the mounting groove 5112, and an output end of the linear drive member u519 is connected to the rack plate b516;

[0068] In this embodiment, the rack plate b516 is driven upward by the linear drive member u519, and the rack plate a515 is driven downward by the gear m518, thereby driving the two sets of unfolded semi-arc shells 513 to clamp the sapphire silicon wafer from both sides at the same time, and clamp the sapphire silicon wafer. At this time, the polishing nozzle b31 is aimed at the outside of the sapphire silicon wafer (the state is as shown in FIG. Fig.15 As shown), at the same time, one set of driving wheels 253 clamps the upper shell, and another set of driving wheels 253 clamps the lower shell.

[0069] like Figure 4 and Figure 6As shown, the protection component 52 includes a linear drive member e521 installed on the base 481, and a connecting plate 523 is installed at the output end of the linear drive member e521, a sleeve rod 524 is installed on the connecting plate 523, the sleeve rod 524 is sleeved on the outside of the moving rod a41, a moving block b525 is installed on the sleeve rod 524, and multiple groups of mounting blocks b526 are installed on the outside of the moving block b525, a groove b5261 is opened in the mounting block b526, a swing rod b527 is rotatably arranged in the groove b5261, an arc-shaped protective shell b528 is installed on the swing rod b527, and a driving part 529 is provided on the moving block b525; the driving part 529 drives the swing rod b527 to rotate, thereby folding the multiple groups of swing rods b527 and the multiple groups of arc-shaped protective shells b528.

[0070] like Figure 4 and Figure 6 As shown, the driving part 529 includes a rotating shaft b5291 installed on the swing rod b527, a bevel gear b5292 is installed on the rotating shaft b5291, a fixed plate b5293 is installed on the moving block b525, a central shaft b5294 is rotatably provided on the fixed plate b5293, a bevel gear d5295 is installed on one end of the central shaft b5294, the bevel gear d5295 is meshed with the bevel gear b5292, a gear k5296 is installed on the other end of the central shaft b5294, a gear ring b5297 is rotatably provided on the moving block b525, and the gear ring b5297 is meshed with the gear k5296.

[0071] In this embodiment, the gear ring a477 is driven to rotate, which drives the gear h476 to rotate, drives the bevel gear c475, bevel gear a472, and rotating shaft a471 to rotate, and then drives the swing rod a44 to rotate and align (its state is as shown in FIG. Fig. 9 shown);

[0072] At the same time, the gear ring b5297 is driven to rotate, which drives the gear k5296 to rotate, drives the bevel gear d5295, bevel gear b5292, and rotating shaft b5291 to rotate, and then drives the swing rod b527 to rotate and align (its state is as follows Fig. 9 At this time, the multiple groups of swing rods a44 and the multiple groups of arc-shaped protective shells a45 are in the unfolded state, and the multiple groups of swing rods b527 and the multiple groups of arc-shaped protective shells b528 are in the unfolded state;

[0073] It should be noted that: How to drive the gear ring a477 to rotate, such as Fig.16 As shown, the inner ring of the gear ring a477 is provided with ring teeth, and a driving motor is arranged in the moving block a42. The output shaft of the driving motor is installed with a gear n4770, and the gear n4770 is meshed with the ring teeth of the inner ring of the gear ring a477. The driving motor can drive the gear ring a477 to rotate. Similarly, the rotation of the gear ring b5297 is also driven in this way, which will not be described in detail here.

[0074] The linear drive d482 drives the motion block a42 to move along the X direction, and the linear drive e521 drives the motion block b525 to move along the -X direction, driving the multiple groups of unfolded arc protection shells a45 and the multiple groups of unfolded arc protection shells b528 to be interlaced and combined together, so that the multiple groups of arc protection shells a45 and the multiple groups of arc protection shells b528 form a completed inner ring protection cover, and drive the inner ring protection cover to move, so that the sapphire silicon wafer junction gap is located in the inner ring protection cover, and at the same time the polishing nozzle a46 is located on the sapphire silicon wafer (state as shown in FIG. Fig.15 shown);

[0075] like Figure 11-13 As shown, the rotating assembly 25 includes a connecting block 251 installed on the semi-arc shell 513, and avoidance grooves 2511 are provided on both sides of the connecting block 251. A plurality of rotating shafts e252 are rotatably provided in the avoidance grooves 2511, and a driving wheel 253 is installed on the rotating shaft e252. A fitting groove 2512 is provided in the connecting block 251, and a gear f254 is installed on the rotating shaft e252. A flexible belt 255 is slidably provided in the fitting groove 2512, and a tooth block 256 is provided on the inner side of the flexible belt 255, and the tooth block 256 meshes with the plurality of gears f254. A rotating driving member c257 is installed on the semi-arc shell 513, and a transmission shaft 258 is installed on the output end of the rotating driving member c257. Two gears g259 are installed on the transmission shaft 258, and the gear g259 is meshed with the gear block 256. An intake pipe a5131 is installed on one of the semi-arc shells 513, and an exhaust pipe a5132 is installed on the other semi-arc shell 513. An intake pipe b5281 is installed on one of the arc-shaped protective shells b528, and an exhaust pipe b5282 is installed on the other arc-shaped protective shell b528.

[0076] In this embodiment, nitrogen is filled into the semi-arc shell 513 through the air inlet pipe a5131, and the air is discharged through the exhaust pipe a5132. When the polishing nozzle b31 is performing external polishing, atmosphere protection is performed to reduce the oxygen content; nitrogen is filled into the arc-shaped protective shell b528 through the air inlet pipe b5281, and the air is discharged through the exhaust pipe b5282. When the polishing nozzle a46 is polishing, atmosphere protection is performed to reduce the oxygen content, prevent excessive oxygen from causing oxidation at the high-temperature polishing area, and improve the polishing quality.

[0077] It should be noted that the polishing nozzle a46 and the polishing nozzle b31 need to be powered by wires, which is a common technical means, so the wires are not drawn in the figure and will not be described in detail here.

[0078] Embodiment 2

[0079] like Fig.18As shown, when the length of the swing rod a44 is not adjustable, the arc-shaped protective shell a45 will interfere with the inner wall during the alignment process, causing the swing rod a44 to be unable to rotate and align. Therefore, this embodiment aims to solve the problem that the swing rod a44 cannot be rotated and aligned;

[0080] The swing rod a44 in this embodiment includes a fixed rod a441 and a telescopic rod a442. The fixed rod a441 is provided with a vent pipe 104. Positive pressure is introduced into the vent pipe 104 to drive the telescopic rod a442 to extend outward, thereby extending the length of the swing rod a44. Negative pressure is introduced into the vent pipe 104 to drive the telescopic rod a442 to retract inward, thereby shortening the length of the swing rod a44.

[0081] In this embodiment, first shorten the length of the swing rod a44 (such as Fig.19 After that, the swing rod a44 is rotated and aligned (as shown in Fig. 20 As shown), at this time, the arc-shaped protective shell a45 will not interfere with the inner wall, and the length of the swing rod a44 is further extended to drive the arc-shaped protective shell a45 to contact the inner wall of the container, which is convenient for the subsequent interlaced combination process.

[0082] Similarly, the swing rod b527 includes a fixed rod b5271 and a telescopic rod b5272. The fixed rod b5271 is also provided with a vent pipe 104, so that the swing rod b527 can be rotated and aligned.

[0083] In this embodiment, the ventilation pipe 104, as well as the exhaust pipe b5282, the intake pipe b5281, the exhaust pipe a5132, and the intake pipe a5131 provided in the first embodiment are all soft tubes, which can be deformed and wound within a certain limit. They are reasonably arranged according to the needs of the equipment, and for the sake of simplicity of the drawings, the pipes are not drawn in some of the drawings.

[0084] Embodiment 3

[0085] This embodiment provides a method for using a sapphire silicon wafer polishing solution preparation process, comprising the following steps:

[0086] Step 1, loading process: put the upper shell into the placement groove a211, and then put the lower shell into the placement groove b231, the linear drive member c22 drives the clamping block b23 to move along the X direction, driving the lower shell to move along the X direction, so that the bottom of the upper shell contacts the top of the lower shell to achieve positioning. At this time, the two groups of unfolded semi-arc shells 513 are located on the outside of the sapphire silicon wafer, which is convenient for the subsequent polishing process;

[0087] Step 2: Clamping process: The linear drive u519 drives the rack plate b516 to move upward, and the gear m518 drives the rack plate a515 to move downward, thereby driving the two sets of unfolded semi-arc shells 513 to clamp the sapphire silicon wafer from both sides at the same time, and clamp the sapphire silicon wafer. At this time, the polishing nozzle b31 is aimed at the outside of the sapphire silicon wafer (the state is as follows Fig.15 As shown), at the same time, one set of driving wheels 253 clamps the upper shell, and another set of driving wheels 253 clamps the lower shell;

[0088] Step 3, enter the process: In the initial state, the multiple swing rods b527 and the multiple arc protective shells b528 are folded, and the multiple swing rods a44 and the multiple arc protective shells a45 are also folded. Figure 1 and Figure 4 As shown; the linear driving member d482 drives the moving block a42 to move along the -X direction through the moving rod a41, driving the folded multiple sets of swing rods a44 and multiple sets of arc-shaped protective shells a45 to enter from the narrow opening of the upper shell body; the linear driving member e521 drives the moving block b525 to move along the -X direction through the sleeve rod 524, driving the folded multiple sets of swing rods b527 and multiple sets of arc-shaped protective shells b528 to enter from the narrow opening of the upper shell body, which is convenient for the subsequent polishing process;

[0089] Step 4, expansion process: by driving the gear ring a477 to rotate, the gear h476 is driven to rotate, the bevel gear c475, the bevel gear a472, and the rotating shaft a471 are driven to rotate, and then the swing rod a44 is driven to rotate and align (its state is as shown in Fig. 9 shown);

[0090] At the same time, the gear ring b5297 is driven to rotate, which drives the gear k5296 to rotate, drives the bevel gear d5295, bevel gear b5292, and rotating shaft b5291 to rotate, and then drives the swing rod b527 to rotate and align (its state is as follows Fig. 9 At this time, the multiple groups of swing rods a44 and the multiple groups of arc-shaped protective shells a45 are in the unfolded state, and the multiple groups of swing rods b527 and the multiple groups of arc-shaped protective shells b528 are in the unfolded state;

[0091] Step 5, interlaced combination process: the linear drive member d482 drives the motion block a42 to move along the X direction, and the linear drive member e521 drives the motion block b525 to move along the -X direction, driving the multiple groups of unfolded arc protection shells a45 and the multiple groups of unfolded arc protection shells b528 to interlace and combine together, so that the multiple groups of arc protection shells a45 and the multiple groups of arc protection shells b528 form a completed inner ring protection cover, and drive the inner ring protection cover to move, so that the sapphire silicon wafer junction gap is located in the inner ring protection cover, and at the same time the polishing nozzle a46 is located on the sapphire silicon wafer (state as shown in FIG. Fig.15 shown);

[0092] Step 6, gas filling protection process: nitrogen is filled into the semi-arc shell 513 through the air inlet pipe a5131, and the air is discharged through the exhaust pipe a5132. When the polishing nozzle b31 is performing external polishing, atmosphere protection is performed to reduce the oxygen content; nitrogen is filled into the arc-shaped protective shell b528 through the air inlet pipe b5281, and the air is discharged through the exhaust pipe b5282. When the polishing nozzle a46 is polishing, atmosphere protection is performed to reduce the oxygen content, prevent excessive oxygen from causing oxidation at the high-temperature polishing area, and improve the polishing quality;

[0093] Step seven, polishing process: the rotating driving member c257 drives the transmission shaft 258 to rotate, driving the two gears g259 to rotate, driving the flexible belt 255 to slide in the fitting groove 2512, and the tooth block 256 is engaged with the gear f254, thereby driving the gear f254 to rotate, driving the driving wheel 253 to rotate, and since one group of driving wheels 253 clamps the upper shell body and the other group of driving wheels 253 clamps the lower shell body, when the driving wheels 253 rotate, the upper shell body and the lower shell body are driven to rotate synchronously. At this time, the polishing nozzle a46 prepares the polishing liquid for the sapphire silicon wafer, and the polishing nozzle b31 polishes the outside of the sapphire silicon wafer, which greatly improves the polishing intensity.

[0094] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A process for preparing a sapphire silicon wafer polishing liquid, comprising a base plate (1), characterized in that: The base plate (1) is provided with a clamping unit (2), an external polishing unit (3) and a polishing unit (4); the clamping unit (2) clamps the sapphire silicon wafer, the external polishing unit (3) polishes the outside of the sapphire silicon wafer; the polishing unit (4) enters from a narrow opening to prepare a polishing liquid for the sapphire silicon wafer; The polishing unit (4) comprises a moving rod a (41), the moving rod a (41) being arranged on one side of the base plate (1), a moving block a (42) being mounted on the moving rod a (41), a plurality of mounting blocks a (43) being mounted on the outer side of the moving block a (42), a groove a (431) being provided in the mounting block a (43), a swing rod a (44) being rotatably arranged in the groove a (431), an arc-shaped protective shell a (45) being mounted on the swing rod a (44), a polishing nozzle a (46) being mounted on one of the arc-shaped protective shells a (45), a driving assembly a (47) being mounted on the moving block a (42), and a moving assembly (48) being arranged on one side of the base plate (1); The driving component a (47) drives the swing rod a (44) to rotate, thereby folding multiple groups of the swing rods a (44) and multiple groups of the arc-shaped protective shells a (45), and the motion component (48) drives the folded multiple groups of the swing rods a (44) and multiple groups of the arc-shaped protective shells a (45) to enter from the narrow mouth.

2. A process for preparing a sapphire silicon wafer polishing liquid according to claim 1, characterized in that: The clamping unit (2) comprises a clamping block a (21), the clamping block a (21) being mounted on the base plate (1), a placement groove a (211) for placing an upper shell being provided in the clamping block a (21), a linear drive member c (22) being mounted on the base plate (1), a clamping block b (23) being mounted at the output end of the linear drive member c (22), a placement groove b (231) for placing a lower shell being provided in the clamping block b (23), a plurality of groups of rolling balls (24) being rotatably provided in the placement groove a (211) and the placement groove b (231), the rolling balls (24) being in contact with the outer wall of the sapphire silicon wafer, and a rotating assembly (25) for driving the sapphire silicon wafer to rotate simultaneously being provided on the base plate (1).

3. A process for preparing a sapphire silicon wafer polishing liquid according to claim 2, characterized in that: It also comprises an atmosphere protection unit (5), wherein the atmosphere protection unit (5) simultaneously provides atmosphere protection to the external polishing area and the polishing area to prevent oxidation of the polishing area.

4. A process for preparing a sapphire silicon wafer polishing liquid according to claim 3, characterized in that: The atmosphere protection unit (5) comprises an external protection component (51) and a protection component (52), wherein the external protection component (51) performs atmosphere protection on the external polishing area, and the protection component (52) performs atmosphere protection on the polishing area; The external protection component (51) comprises a fixed block (511), the fixed block (511) is mounted on both sides of the bottom plate (1), a sliding groove (5111) is provided in the fixed block (511), two sliding blocks (510) are slidably arranged in the sliding groove (5111), a moving bar (512) is mounted on the sliding block (510), and a semi-arc shell (513) is mounted on the moving bar (512); The external polishing unit (3) comprises a polishing nozzle b (31), which is installed in one of the semi-arc-shaped shells (513), and the polishing nozzle b (31) and the polishing nozzle a (46) correspond in position.

5. A process for preparing a sapphire silicon wafer polishing liquid according to claim 4, characterized in that: The motion assembly (48) comprises a base (481) disposed on the ground, a linear drive member d (482) is mounted on the base (481), and an output end of the linear drive member d (482) is connected to the motion rod a (41); The protection component (52) comprises a linear drive member e (521), the linear drive member e (521) is mounted on the base (481), a connecting plate (523) is mounted on the output end of the linear drive member e (521), a sleeve rod (524) is mounted on the connecting plate (523), the sleeve rod (524) is sleeved on the outside of the motion rod a (41), a motion block b (525) is mounted on the sleeve rod (524), a plurality of mounting blocks b (526) are mounted on the outside of the motion block b (525), a groove b (5261) is formed in the mounting block b (526), ​​a swing rod b (527) is rotatably arranged in the groove b (5261), an arc-shaped protective shell b (528) is mounted on the swing rod b (527), and a driving part (529) is provided on the motion block b (525); The driving unit (529) drives the swinging rod b (527) to rotate, thereby folding multiple groups of the swinging rods b (527) and multiple groups of the arc-shaped protective shells b (528).

6. A process for preparing a sapphire silicon wafer polishing liquid according to claim 5, characterized in that: The driving assembly a (47) includes a rotating shaft a (471), the rotating shaft a (471) is mounted on the swing rod a (44), a bevel gear a (472) is mounted on the rotating shaft a (471), a fixing plate a (473) is mounted on the mounting block a (43), a central shaft a (474) is rotatably provided on the fixing plate a (473), a bevel gear c (475) is mounted on one end of the central shaft a (474), the bevel gear a (472) is meshed with the bevel gear c (475), a gear h (476) is mounted on the other end of the central shaft a (474), a gear ring a (477) is rotatably provided on the moving block a (42), and the gear ring a (477) is meshed with the gear h (476).

7. A process for preparing a sapphire silicon wafer polishing liquid according to claim 6, characterized in that: The driving part (529) includes a rotating shaft b (5291), wherein the rotating shaft b (5291) is mounted on the swing rod b (527), a bevel gear b (5292) is mounted on the rotating shaft b (5291), a fixing plate b (5293) is mounted on the moving block b (525), a central shaft b (5294) is rotatably provided on the fixing plate b (5293), a bevel gear d (5295) is mounted on one end of the central shaft b (5294), the bevel gear d (5295) is meshed with the bevel gear b (5292), a gear k (5296) is mounted on the other end of the central shaft b (5294), a gear ring b (5297) is rotatably provided on the moving block b (525), and the gear ring b (5297) is meshed with the gear k (5296).

8. A process for preparing a sapphire silicon wafer polishing liquid according to claim 7, characterized in that: The rotating assembly (25) comprises a connecting block (251), the connecting block (251) being mounted on the semi-arc shell (513), avoidance grooves (2511) being provided on both sides of the connecting block (251), a plurality of rotating shafts e (252) being rotatably provided in the avoidance grooves (2511), a driving wheel (253) being mounted on the rotating shafts e (252), a fitting groove (2512) being provided in the connecting block (251), a gear f (254) being mounted on the rotating shaft e (252), a flexible belt (255) being slidably provided in the fitting groove (2512), a tooth block (256) being provided on the inner side of the flexible belt (255), the tooth block (256) being rotatably connected to the plurality of groups of gears. The semi-arc-shaped shell (513) is meshed with a wheel f (254), a rotating driving member c (257) is installed on the semi-arc-shaped shell (513), a transmission shaft (258) is installed on the output end of the rotating driving member c (257), two gears g (259) are installed on the transmission shaft (258), and the gears g (259) are meshed with the gear block (256), one of the semi-arc-shaped shells (513) is installed with an intake pipe a (5131), and the other semi-arc-shaped shell (513) is installed with an exhaust pipe a (5132), one of the arc-shaped protective shells b (528) is installed with an intake pipe b (5281), and the other arc-shaped protective shell b (528) is installed with an exhaust pipe b (5282).

9. A process for preparing a sapphire silicon wafer polishing liquid according to claim 8, characterized in that: The fixed block (511) is provided with a mounting groove (5112), one of the sliders (510) is provided with a rack plate a (515), and the other slider (510) is provided with a rack plate b (516). A connecting rod (517) is rotatably provided in the mounting groove (5112), and a gear m (518) is provided on the connecting rod (517). The gear m (518) is respectively meshed with the rack plate b (516) and the rack plate a (515). A linear drive member u (519) is provided in the mounting groove (5112), and an output end of the linear drive member u (519) is connected to the rack plate b (516).

10. A method for using a sapphire silicon wafer polishing liquid preparation process according to any one of claims 1 to 9, characterized in that: The following steps are involved: Step 1, loading process: put the upper shell into the placement groove a (211), and then put the lower shell into the placement groove b (231), so that the bottom of the upper shell contacts the top of the lower shell to achieve positioning; Step 2, clamping process: driving two groups of unfolded semi-arc shells (513) to clamp the sapphire silicon wafer from both sides at the same time, and clamping the sapphire silicon wafer; Step 3, entry process: the linear drive member d (482) drives the motion block a (42) to move along the -X direction, driving the folded multiple swing rods a (44) and multiple arc-shaped protective shells a (45) to enter from the narrow opening of the upper shell body; the linear drive member e (521) drives the motion block b (525) to move along the -X direction, driving the folded multiple swing rods b (527) and multiple arc-shaped protective shells b (528) to enter from the narrow opening of the upper shell body; Step 4, unfolding process: drive the gear ring a (477) to rotate, drive the swing rod a (44) to rotate and align; drive the gear ring b (5297) to rotate, drive the swing rod b (527) to rotate and align; Step 5, interlacing and combining process: the linear driving member d (482) drives the moving block a (42) to move along the X direction, and the linear driving member e (521) drives the moving block b (525) to move along the -X direction, so that the multiple groups of unfolded arc-shaped protective shells a (45) and the multiple groups of unfolded arc-shaped protective shells b (528) are interlaced and combined together, so that the multiple groups of arc-shaped protective shells a (45) and the multiple groups of arc-shaped protective shells b (528) form a completed inner ring protective cover; Step 6, gas filling protection process: filling nitrogen into the semi-arc shell (513), and filling nitrogen into the arc-shaped protective shell b (528); Step 7, polishing process: the rotating driving member c (257) drives the transmission shaft (258) to rotate, drives the driving wheel (253) to rotate, drives the upper shell and the lower shell to rotate synchronously, at this time, the polishing nozzle a (46) prepares the sapphire silicon wafer polishing liquid, and the polishing nozzle b (31) polishes the outside of the sapphire silicon wafer.

Images