Injection mold structure for FOPLP packaging processing

Abstract

The invention discloses an injection mold structure for FOPLP packaging processing, and relates to the field of microelectronic chip packaging, the injection mold structure specifically comprises an upper mold and a lower mold, the upper mold comprises an upper mold base, an upper mold cavity, a main pouring gate, an auxiliary pouring gate, a top pouring gate and an exhaust insert, the bottom of the upper mold base is provided with the upper mold cavity, and the upper mold cavity is provided with an air outlet; top pouring gates are uniformly arranged at the top of the upper mold cavity, the auxiliary pouring gate is arranged above the upper mold cavity, the auxiliary pouring gate is communicated with the upper mold cavity through the top pouring gates, and an inner cavity of the auxiliary pouring gate is communicated with an inner cavity of the main pouring gate. According to the injection mold structure for FOPLP packaging processing, by optimizing the design of injection molding pouring gates and increasing the number of 8-inch panel pouring gates, simultaneous top injection molding and multi-section exhaust design of different positions of the whole panel are achieved, the exhaust speed is increased, holes are prevented from being generated after plastic packaging, it is guaranteed that after injection molding is finished, plastic packaging materials in all positions of the 8-inch panel are evenly distributed, and the product quality is improved. The problem of plastic package thickness consistency is solved, and the injection molding quality is improved.

Description

Technical Field

[0001] The invention relates to the field of microelectronic chip packaging, in particular to an injection mold structure for FOPLP packaging processing. Background Art

[0002] The panel-level fan-out advanced compression molding technology (FOPLP) generally consists of carrier materials (organic substrates, silicon substrates and glass substrates), plastic encapsulation materials, redistribution layers (RDL), passive devices and chips. The specific packaging process is as follows: Figure 1 As shown. Among them, the packaging designers choose different carrier materials to make the carrier board according to different product sizes, CTE and production capacity requirements. The choice of the carrier board directly determines the degree of warping and production capacity after packaging; the packaging designers choose the process route based on the hole opening process and directly determine the number of RDL layers and wiring accuracy. The use of FOPLP packaging can make the product thinner and lighter, which is 2.5 times the efficiency of TQFP packaging of the same size, has better electrical / thermal performance, and is convenient for device integration, thereby realizing 2.5D / 3D packaging.

[0003] At present, the post-Moore era has continuously increased the requirements for miniaturization and high integration of FOPLP products, which requires multiple compression molding to finally form the product. However, problems such as product warping, thickness uniformity, and chip displacement caused by shrinkage after multiple compression molding have led to a long process development cycle, becoming a major technical bottleneck in the R&D stage of FOPLP technology products.

[0004] In order to solve the above problems, people have proposed an ABF pressing material for chip embedding and multi-layer wiring to replace plastic packaging technology. This process is to fix the chip on the packaging substrate or wafer bonding mold, and then use a glue spreader to coat the chip with ABF, forming a layer of glue with uniform thickness through centrifugal force, or directly use ABF film for pressing and curing, and the ABF layers are interconnected by laser drilling combined with chemical plating process. However, this process is heavily dependent on ABF materials, and ABF materials are difficult to purchase and the cost is very high. Compared with EMC materials, its performance has poor thermal conductivity and moisture sensitivity. In addition, after ABF is used for chip embedding and wiring, it needs to be packaged to isolate the external environment and realize electrical interconnection with the outside world.

[0005] Another common solution for compression molding is to first encapsulate the chip through compression molding equipment combined with liquid or granular plastic encapsulation materials. The molding process generally uses compression molding equipment, granular / liquid plastic encapsulation materials, carriers and special molds to achieve chip-level packaging; then, combine photolithography technology, chemical plating / PVD sputtering technology and electroplating to form the RDL layer. However, for the early FOPLP proofing stage, compression molding and RDL technology not only have high equipment and mold procurement costs, but also the warpage problem is not easy to solve, the process is relatively complex, the development cycle is long and the initial investment cost is high.

[0006] In summary, the complex compression molding process and high initial investment cost in FOPLP have not been effectively solved. There are problems such as warping, thickness consistency and chip shifting caused by shrinkage. Although many solutions have been proposed, no solution can effectively solve the problems of short initial proofing cycle, stable process and low cost of FOPLP. Summary of the invention

[0007] In view of the problems of warping, consistency of plastic encapsulation thickness and chip displacement caused by shrinkage of plastic encapsulation materials in the compression molding process of FOPLP, the present invention provides an injection mold structure for FOPLP packaging processing. By redesigning the mold structure, top injection molding is achieved, thereby realizing 8-inch FOPLP high-reliability plastic encapsulation.

[0008] The present invention provides the following technical solution: an injection mold structure for FOPLP encapsulation processing, comprising an upper mold and a lower mold, the upper mold comprising an upper mold base, an upper mold cavity, a main runner, an auxiliary runner, a top runner and an exhaust insert, the upper mold cavity is arranged at the bottom of the upper mold base, the top runner is evenly arranged at the top of the upper mold cavity, the auxiliary runner is arranged above the upper mold cavity, the auxiliary runner is connected with the upper mold cavity through the top runner, the main runner is arranged at the bottom of the upper mold base, the inner cavity of the auxiliary runner is connected with the inner cavity of the main runner, and an air filter groove is arranged at the top of the auxiliary runner close to the main runner, and the auxiliary runner and the upper mold cavity are both provided with an exhaust insert on the side away from the main runner; The lower mold includes a lower mold base, a lower mold cavity adapted to the upper mold cavity, a floating device and a center runner arranged on the lower mold base, the lower mold cavity is arranged on the top of the lower mold base, the lower mold cavity and the upper mold cavity are sealed by a sealing ring, the top of the lower mold cavity is evenly and fixedly connected with a mold insert, the floating device is arranged below the lower mold cavity, the floating device includes a floating device arranged on the lower mold base and a floating block movably connected to the lower mold base, the floating device supports the floating block, and the top of the floating block is connected to the bottom of the lower mold cavity through a gasket.

[0009] In a specific implementation manner, the air filter groove is inwardly recessed, a flow gap is provided between the bottom of the air filter groove and the bottom of the inner cavity of the auxiliary runner, and the air filter groove is arranged on one side of the top runner close to the main runner.

[0010] In a specific possible implementation scheme, the outer ring of the bottom of the upper mold base is provided with an upper vacuum channel, the top of the upper vacuum channel is provided with an exhaust hole, the outlet end of the exhaust insert extends into the inner cavity of the upper vacuum channel, and the outer ring of the top of the lower mold base is provided with a lower vacuum channel adapted to the upper vacuum channel.

[0011] In a specific possible implementation manner, the top runner is a conical structure that is larger at the top and smaller at the bottom.

[0012] In a specific possible implementation scheme, the floating device includes multiple floating blocks, which are evenly distributed below the lower mold cavity. The upper cross-section of the floating block is larger than the lower cross-section, and the lower end of the floating block is sealed with the lower mold base by a sealing sheet.

[0013] In a specific possible implementation manner, the sealing ring is embedded in the bottom of the upper mold cavity close to the main runner.

[0014] In a specific possible implementation manner, the floating device comprises a compressed nitrogen support, the compressed nitrogen support supports the floating block, and all compressed nitrogen supports in the floating device are supplied with gas through the same channel.

[0015] In a specific possible implementation scheme, upper mold cavities are provided on both sides of the bottom of the upper mold base, the main runner is located between the two upper mold cavities, lower mold cavities are provided on both sides of the top of the lower mold, and the center runner is located in the middle of the lower mold.

[0016] In a specific embodiment, the width of the secondary runner located above the main runner is greater than the width of the secondary runner away from the main runner.

[0017] In a specific embodiment, the positions of the mold inserts are arranged according to the positions of the through holes between the layers.

[0018] In summary, the present invention has the following beneficial effects: 1. The injection mold structure for FOPLP packaging processing optimizes the injection runner design, increases the number of 8-inch panel runners, realizes simultaneous top injection molding at different positions of the entire panel, and has a multi-stage exhaust design to speed up the exhaust speed and avoid the generation of holes after plastic sealing. After the injection molding is completed, the plastic sealing material at each position of the 8-inch panel is evenly distributed, which solves the problem of consistency of plastic sealing thickness and improves the injection molding quality.

[0019] 2. The injection mold structure for FOPLP packaging processing is designed with a dynamic floating structure to assist the pressure to be uniformly applied to the substrate during the plastic packaging process, thereby alleviating the problem of plastic packaging warping and effectively preventing the problem of glue overflow caused by mold clamping pressure.

[0020] 3. The injection mold structure used for FOPLP packaging processing increases the pressure exerted on the substrate by the mold insert based on the thickness of the plastic-encapsulated product to prevent the chip from shifting during the plastic-encapsulation process, and directly forms a through hole, avoiding laser drilling or other methods to optimize the process. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the FOPLP packaging process flow in the prior art; Figure 2 It is a schematic diagram of the structure of a conventional transfer injection mold in the prior art; Figure 3 It is a front schematic diagram of the structure of the present invention; Figure 4 It is a schematic diagram of the mold on the structure of the present invention; Figure 5 This is a schematic diagram of the mold under the structure of the present invention; Figure 6 is a schematic diagram of a floating device in Embodiment 2 of the present invention; Figure 7 It is a schematic diagram of the combination of the mold insert and the silicone pad of the present invention.

[0022] Description of reference numerals: 1. Upper mold cavity; 2. Main runner; 3. Auxiliary runner; 4. Top runner; 5. Air filter groove; 6. Exhaust insert; 7. Sealing ring; 8. Upper vacuum channel; 9. Product; 10. Injection head; 11. Plastic packaging material; 12. Gasket; 13. Compressed nitrogen support; 14. Mold insert; 15. Lower mold cavity; 16. Floating block; 17. Upper mold base; 18. Lower mold base; 19. Center runner; 20. Lower vacuum channel; 21. Sealing sheet; 22. Spring; 23. Electromagnet 2; 24. Electromagnet 1. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0024] In view of the problems of warping, consistency of plastic encapsulation thickness and chip displacement caused by shrinkage of plastic encapsulation materials in the compression molding process of FOPLP, the present invention proposes an injection mold structure for FOPLP packaging processing. By redesigning the mold structure, top injection molding is achieved to realize 8-inch FOPLP high-reliability plastic encapsulation. The injection mold structure is mainly composed of an upper mold and a lower mold. Among them, the upper mold includes an upper mold base 17, an upper mold cavity 1, a main runner 2, a secondary runner 3, a top runner 4 and a vent insert 6; the lower mold includes a lower mold base 18, a lower mold cavity 15 adapted to the upper mold cavity 1, a floating device and a center runner 19 arranged on the lower mold base 18, such as Figure 3 As shown, the center runner 19 is a through hole, and the cross section of the center runner 19 is the same as the cross section of the main runner 2. The injection head 10 can inject the plastic encapsulation material into the main runner 2 through the center runner 19. In order to solve the problems of chip displacement caused by warping, consistency of plastic encapsulation thickness and shrinkage of plastic encapsulation material, the scheme is optimized from three aspects.

[0025] Example 1 By optimizing the injection runner design, the plastic molding compound is injected from the top of the product downwards, ensuring that the plastic molding compound is evenly distributed at all positions of the 8-inch panel after the injection molding is completed. Figure 4 As shown, an upper mold cavity 1 is provided at the bottom of the upper mold base 17, and a plurality of top runners 4 are provided at the top of the upper mold cavity 1, and the plurality of top runners 4 are evenly distributed. An auxiliary runner 3 is provided above the upper mold cavity 1, and the auxiliary runner 3 is connected with the upper mold cavity 1 through the top runner 4. A main runner 2 is provided at the bottom of the upper mold base 17, and an inner cavity of the auxiliary runner 3 is connected with an inner cavity of the main runner 2. When the injection mold structure is used, the plastic encapsulation material flows into the inner cavity of the auxiliary runner 3 through the main runner 2, and the plastic encapsulation material in the inner cavity of the auxiliary runner 3 flows into the inner cavity of the upper mold cavity 1 through the top runner 4, thereby realizing injection from the top multi-runner into the mold. Compared with the traditional side injection into the mold, this solution can encapsulate more complex products and a larger injection area, and the multi-runner design realizes simultaneous injection molding of different positions of the entire panel, thereby ensuring the density and quality of each position after injection molding.

[0026] The top runner 4 is a conical structure with a larger top and a smaller bottom, which can control the flow rate of the molding compound, reduce the impact of the molding compound on the product, optimize the flow of the molding compound, reduce the pressure loss in the flow channel, and improve the smoothness of the flow of the molding compound.

[0027] In addition, in order to avoid the increase of the internal void rate of the plastic package after plastic sealing due to the violent reaction of the plastic package material and the residual gas in the cavity during the high-temperature injection molding process, the scheme adopts a multi-stage exhaust design, such as Figure 4As shown, a "gas filter" design is added to the plastic encapsulation material flowing through the main runner to the auxiliary runner position, that is, a gas filter groove 5 is provided at the top of the auxiliary runner 3 near the main runner 2, and the gas filter groove 5 is in an inwardly concave state. The gas filter groove 5 is located on the side of the top runner 4 near the main runner 2. There is a flow gap between the bottom of the gas filter groove 5 and the bottom of the inner cavity of the auxiliary runner 3. By setting the gas filter groove 5, the speed of the plastic encapsulation material injected into the auxiliary runner can be slowed down, which can not only play a role in balancing the mold flow but also make the generated gas or impurities stay on the right side of the auxiliary runner. And the width of the area where the auxiliary runner 3 is located above the main runner 2 is greater than the width of the area away from the main runner 2, which is convenient for impurities or gas to stay.

[0028] In order to further increase the exhaust efficiency of the plastic encapsulation material, exhaust inserts 6 are provided on the side of the auxiliary runner 3 and the upper mold cavity 1 away from the main runner 2 to achieve exhaust. In addition, vacuum channels are added on both sides of the mold to assist in quickly exhausting gas, thereby avoiding the generation of holes after plastic encapsulation. Figure 3 As shown, the outer ring of the bottom of the upper mold base 17 is provided with an upper vacuum channel 8, the top of the upper vacuum channel 8 is provided with an exhaust hole, the outlet end of the exhaust insert 6 extends into the inner cavity of the upper vacuum channel 8, and the outer ring of the top of the lower mold base 18 is provided with a lower vacuum channel 20 adapted to the upper vacuum channel 8.

[0029] From the above description, it can be seen that this solution solves the problem of plastic encapsulation thickness consistency and improves injection molding quality through the top multi-runner injection into the mold and multi-stage exhaust design. In addition, the runner design, gate design and exhaust design of the upper mold in the top injection mold design can adjust the secondary runner size, the number of top runners, the top runner size and the exhaust insert size according to the device distribution on the surface of the plastic encapsulated product and the thickness of the plastic encapsulation body. As long as the top plastic encapsulation material is smoothly filled into the 8-inch panel to complete the encapsulation by adjusting the above size or shape, it is included in the technical scope of the invention.

[0030] In order to alleviate the warping problem of plastic packaging, the lower mold structure is designed to avoid different pressures applied to the substrate by the mold due to inconsistent thickness of the substrates on both sides during the plastic packaging process. Due to the uneven pressure at different positions of the substrates on both sides during the plastic packaging process, the warping problem after plastic packaging is aggravated. In severe cases, the equipment will directly alarm, causing the mold product to be directly scrapped. Therefore, a dynamic floating structure is designed to assist the substrate in applying uniform pressure to the substrate during plastic packaging.

[0031] like Figure 3 and Figure 5As shown, the lower mold cavity 15 is arranged on the top of the lower mold base 18, and the floating device is arranged below the lower mold cavity 15. The floating device includes a floating device arranged on the lower mold base 18 and a floating block 16 movably connected to the lower mold base 18. The floating device includes a plurality of floating blocks 16, and the plurality of floating blocks 16 are evenly distributed below the lower mold cavity 15. A gasket 12 is arranged on the top of the floating block 16, and the top of the floating block 16 is connected to the bottom of the lower mold cavity 15 through the gasket 12. The gasket 12 is a high-temperature resistant rubber pad. The design of the high-temperature resistant pad plays a role in avoiding "hard contact" of metal and fine-tuning unevenness. The cross section of the upper end of the floating block 16 is larger than the cross section of the lower end.

[0032] The floating device is arranged below the floating block 16 to support the floating block 16. The floating device realizes floating within a certain range by controlling the auxiliary gasket through air pressure to compensate for the thickness loss due to product deformation and inconsistent thickness of products on both sides, thereby causing uneven pressure. The floating device includes a compressed nitrogen support 13. A floating groove adapted to the compressed nitrogen support 13 is arranged on the lower mold base 18. The bottom end of the floating block 16 is movably connected to the top end of the floating groove inner cavity. The other end of the floating groove inner cavity is provided with a compressed nitrogen support 13. The compressed nitrogen support 13 supports the floating block 16, and all compressed nitrogen supports 13 in the floating device are supplied with air through the same channel. The lower end of the floating block 16 and the floating groove are sealed by a sealing sheet 21, and the sealing sheet 21 is a high temperature resistant rubber sheet.

[0033] From the above description, it can be seen that the floating structure design of the lower mold assists in uniform stress distribution, alleviates the problem of plastic packaging warping, and effectively prevents the problem of glue overflow caused by mold clamping pressure. The above floating device design can be air pressure controlled, hydraulically controlled, or spring-controlled floating amount. As long as the floating is achieved by adjusting the support method of the lower mold to meet the packaging of substrates of different thicknesses, it is included in the technical scope of the invention.

[0034] In order to alleviate the chip shift problem caused by the shrinkage of plastic packaging materials or substrates, which makes it difficult to align the layers during the later rewiring, this solution is based on the thickness of the plastic packaging product and increases the pressure exerted on the substrate by the mold insert, such as Figure 5 As shown, the top of the lower mold cavity 15 is evenly fixedly connected with a mold insert 14. When the mold structure is used, the mold insert 14 supports and limits the product to prevent the chip from shifting during the plastic packaging process. In addition, the position of the mold insert 14 can be arranged according to the position of the through hole between the layers, so that the through hole is directly formed after the plastic packaging, the electrical interconnection between the layers is realized, and the laser drilling or other methods are avoided to optimize the process.

[0035] The mold insert for fixing the substrate or chip can be made of metal or silicone material according to the material of the substrate to be pressed, the pressing area, the chip material and the chip size. As long as it can play a role in pressure fixing and is resistant to high temperature, it is included in the technical scope of the invention. Figure 7 As shown, the mold insert 14 is combined with a silicone pad to directly apply pressure to the fixed structure on the chip surface, and the silicone can play a buffering role to prevent the chip from cracking.

[0036] The lower mold cavity 15 is sealed with the upper mold cavity 1 by a sealing ring 7, and the sealing ring 7 is embedded in the bottom of the upper mold cavity 1 near the main runner 2. Figure 3 and Figure 4 As shown, the sealing ring 7 can prevent the plastic sealing material from entering the mold cavity from the side. The sealing ring 7 can be made of high temperature resistant colloid, so that when the product thickness is different, the sealing ring 7 can be used to ensure the sealing between the lower mold cavity 15 and the upper mold cavity 1.

[0037] Example 2 The difference between Example 2 and Example 1 is that the structure of the floating device is different, and the floating device controls the floating amount through a spring, such as Figure 6 As shown, the floating device includes a spring 22, an electromagnet 1 24 and an electromagnet 23, one end of the spring 22 is fixedly connected to the bottom of the inner cavity of the floating groove, and the other end of the spring 22 is fixedly connected to the bottom of the floating block 16. The electromagnet 1 24 is fixed to the bottom of the inner cavity of the floating groove, and the electromagnet 2 23 is fixed to the bottom of the floating block 16. When the directions of the currents passed through the electromagnet 1 24 and the electromagnet 2 23 are the same, the electromagnet 1 24 and the electromagnet 2 23 are in a state of magnetic repulsion, and by controlling the magnitude of the current passed through the electromagnet 1 24 and the electromagnet 2 23, the magnitude of the repulsive force between the electromagnet 1 24 and the electromagnet 2 23 can be controlled, and thus the floating amount of the floating block 16 can be controlled. When the electromagnet 1 24 and the electromagnet 2 23 are in a power-off state, the floating block 16 can be reset under the action of the rebound force of the spring 22.

[0038] Example 3 The technical features of Example 3 that differ from Example 1 are as follows: the main runner 2 is arranged in the middle of the bottom of the upper mold base 17, both sides of the bottom of the upper mold base 17 are provided with an upper mold cavity 1, both sides of the top of the lower mold are provided with a lower mold cavity 15, and the center runner 19 is located in the middle of the lower mold, such as Figure 3 shown.

[0039] In summary: When the FOPLP encapsulation processing injection mold structure is used, the upper mold and the lower mold are in a mold-clamping state. Figure 3As shown, the injection head 10 is inserted into the inner cavity of the central runner 19, and the injection head 10 injects the plastic encapsulation material 11 into the inner cavity of the main runner 2. The plastic encapsulation material 11 in the inner cavity of the main runner 2 enters the inner cavity of the auxiliary runner 3, and the plastic encapsulation material 11 in the inner cavity of the auxiliary runner 3 is injected into the mold cavity through the top runner 4 to realize multi-runner casting operation. Increasing the number of runners for 8-inch panels enables simultaneous injection molding of different positions of the entire panel to ensure the density and quality of each position after injection molding. In this process, the mold insert 14 supports and limits the product 9 to avoid displacement of the product 9 during the plastic encapsulation process. The floating device assists the gasket 12 to achieve floating within a certain range, compensates for the uneven pressure caused by the deformation of the product 9 and the thickness loss of the products on both sides due to inconsistent thickness, and alleviates the problem of plastic encapsulation warping. The gas generated by the violent reaction of the plastic encapsulation material during high-temperature injection molding and the residual gas in the cavity are discharged through the exhaust insert 6.

[0040] The contents not described in detail in this specification belong to the prior art known to professional and technical personnel in the field. Although the embodiments of the present invention have been shown and described, it is understood by ordinary technicians in the field that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the attached claims and their equivalents.

Claims

1. An injection mold structure for FOPLP packaging processing, comprising an upper mold and a lower mold, characterized in that: The upper mold comprises an upper mold base (17), an upper mold cavity (1), a main runner (2), an auxiliary runner (3), a top runner (4) and an exhaust insert (6); the upper mold cavity (1) is provided at the bottom of the upper mold base (17); the top runner (4) is evenly provided at the top of the upper mold cavity (1); the auxiliary runner (3) is arranged above the upper mold cavity (1); the auxiliary runner (3) is connected to the upper mold cavity (1) through the top runner (4); the main runner (2) is arranged at the bottom of the upper mold base (17); the inner cavity of the auxiliary runner (3) is connected to the inner cavity of the main runner (2); and an air filter groove (5) is provided at the top of the auxiliary runner (3) on a side close to the main runner (2); and the auxiliary runner (3) and the upper mold cavity (1) are both provided with an exhaust insert (6) on a side away from the main runner (2); The lower mold comprises a lower mold base (18), a lower mold cavity (15) adapted to the upper mold cavity (1), a floating device and a center runner (19) arranged on the lower mold base (18); the lower mold cavity (15) is arranged on the top of the lower mold base (18); the lower mold cavity (15) and the upper mold cavity (1) are sealed by a sealing ring (7); the top of the lower mold cavity (15) is evenly and fixedly connected with a mold insert (14); the floating device is arranged below the lower mold cavity (15); the floating device comprises a floating device arranged on the lower mold base (18) and a floating block (16) movably connected to the lower mold base (18); the floating device supports the floating block (16); the top of the floating block (16) is connected to the bottom of the lower mold cavity (15) through a gasket (12).

2. The injection mold structure for FOPLP packaging processing according to claim 1, characterized in that: The air filter groove (5) is inwardly concave, and a material flow gap is provided between the bottom of the air filter groove (5) and the bottom of the inner cavity of the auxiliary runner (3). The air filter groove (5) is arranged on a side of the top runner (4) close to the main runner (2).

3. The injection mold structure for FOPLP packaging processing according to claim 1, characterized in that: An upper vacuum channel (8) is provided on the outer ring at the bottom of the upper die base (17), an exhaust hole is provided on the top of the upper vacuum channel (8), an exhaust end of the exhaust insert (6) extends into the inner cavity of the upper vacuum channel (8), and a lower vacuum channel (20) adapted to the upper vacuum channel (8) is provided on the outer ring at the top of the lower die base (18).

4. The injection mold structure for FOPLP packaging processing according to claim 1, characterized in that: The top pouring channel (4) is a conical structure that is larger at the top and smaller at the bottom.

5. The injection mold structure for FOPLP packaging processing according to claim 1, characterized in that: The floating device comprises a plurality of floating blocks (16), the plurality of floating blocks (16) being evenly distributed below the lower mold cavity (15), the cross section of the upper end of the floating block (16) being larger than the cross section of the lower end thereof, and the lower end of the floating block (16) and the lower mold base (18) being sealed via a sealing sheet (21).

6. The injection mold structure for FOPLP packaging processing according to claim 1, characterized in that: The sealing ring (7) is embedded in the bottom of the upper mold cavity (1) on one side close to the main runner (2).

7. The injection mold structure for FOPLP packaging processing according to claim 1, characterized in that: The floating device comprises a compressed nitrogen support (13), wherein the compressed nitrogen support (13) supports the floating block (16), and all compressed nitrogen supports (13) in the floating device use the same channel for gas supply.

8. The injection mold structure for FOPLP packaging processing according to claim 1, characterized in that: Upper mold cavities (1) are provided on both sides of the bottom of the upper mold base (17), the main runner (2) is located between the two upper mold cavities (1), lower mold cavities (15) are provided on both sides of the top of the lower mold, and the center runner (19) is located in the middle of the lower mold.

9. The injection mold structure for FOPLP packaging processing according to claim 8, characterized in that: The width of the auxiliary runner (3) in an area above the main runner (2) is greater than the width of the area away from the main runner (2).

10. The injection mold structure for FOPLP packaging processing according to claim 1, characterized in that: The positions of the mold inserts (14) are arranged according to the positions of the through holes between the layers.

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