Hot plate structure for film formation of display panel

Abstract

The invention discloses a hot plate structure for display panel film forming, which comprises a heating plate, a temperature compensation assembly and a temperature adjusting device, and is characterized in that the heating plate is used for placing a glass substrate and heating the glass substrate; the temperature compensation assembly is arranged at the bottom of the heating plate, a mounting surface is arranged on the temperature compensation assembly, the mounting surface comprises a central part, a transition part and an edge part, at least one communicating pipe is arranged on each of the central part, the transition part and the edge part, each communicating pipe is provided with an input port and an output port which extend outwards, and the temperature adjusting device is arranged at the input port; the temperature compensation assembly and the temperature adjusting device are arranged and can be applied to temperature compensation of the heating plate, the heating power of different heat pipes in the heating pipe does not need to be adjusted, the temperature of the center part can be adjusted to a set value in time, and the temperatures of different areas are more uniform when the heating plate heats; and the device can be flexibly applied to scenes needing heating or cooling of the heating plate, and the temperature adjusting efficiency is high.

Description

Technical Field

[0001] The present application belongs to the technical field of display panel manufacturing, and in particular, relates to a hot plate structure used for film formation of display panels. Background Art

[0002] Inkjet printing provides a method for manufacturing OLED (Organic Light-Emitting Diode) display panels. In the inkjet printing process, the baking and curing process after the ink droplets enter the pixel slot is crucial. In other words, each pixel slot on the substrate must be evenly baked and cured at high temperature to form a film. If the ink droplets are not evenly deposited, the OLED will have a shorter lifespan, and its thinner areas will generate higher currents, resulting in rapid aging.

[0003] In related technical solutions, multiple heating pipes are often embedded in the heating plate, and the product substrate is baked by heating the heating pipes. However, when it is found that the temperature of the heating plate is uneven, temperature compensation cannot be performed, resulting in a large temperature difference between the center and the edge, and the temperature cannot be adjusted to the set value in time. Summary of the invention

[0004] The purpose of the present application is to provide a hot plate structure for display panel film formation, which can solve at least one of the above problems.

[0005] The embodiment of the present application provides a heat plate structure for display panel film formation, comprising: a heating plate, a temperature compensation component and a temperature adjustment device; A heating plate for placing the panel and heating it; A temperature compensation component is arranged at the bottom of the heating plate. A mounting surface is provided on the temperature compensation component. The mounting surface includes a central portion, a transition portion and an edge portion arranged in sequence from the inside to the outside. At least one connecting pipe is respectively provided on the central portion, the transition portion and the edge portion. The connecting pipe is provided with an input port and an output port extending outward.

[0006] The temperature regulating device is arranged at the input port and is used for regulating the temperature of the gas passing into the connecting pipe.

[0007] The beneficial effects of the present application are: by providing a temperature compensation component and a temperature control device, it can be applied to the heating plate for temperature compensation, and there is no need to adjust the heating power of different heat pipes in the heating plate. The temperature of the center part can be adjusted to the set value in time, so that the temperature of different areas of the heating plate is more uniform when heating. It can also be flexibly applied to scenarios where the heating plate needs to be heated or cooled, and the temperature control efficiency is high.

[0008] According to some embodiments of the present application, the temperature control device includes a condenser and a heater, and the condenser and the heater are connected in parallel through pipelines and a control switch is provided on each pipeline. Thus, the temperature of the gas introduced can be controlled by the condenser and the heater connected in parallel.

[0009] According to some embodiments of the present application, the central portion, the transition portion and the edge portion are respectively provided with mounting grooves, the connecting pipe is embedded in the mounting grooves, and a fastening layer is provided between the connecting pipe and the mounting grooves. Thus, the heating pipe can be fixed, the gap between the heating pipe and the body can be filled, and the heating pipe cannot be moved when the heating plate is in use.

[0010] According to some embodiments of the present application, a heat insulation board is further provided at the bottom of the temperature compensation component, and the heat insulation board is in close contact with the temperature compensation component, thereby preventing heat from being lost from the bottom of the temperature compensation component.

[0011] Furthermore, the heating plate is provided with a heat dissipation layer, and the heat dissipation layer is in contact with the heating plate, thereby ensuring that the heat is dissipated from the heat dissipation plate, and the product placed on the heat dissipation plate is heated more evenly.

[0012] According to some embodiments of the present application, a heat conducting layer is further provided between the heating plate and the temperature compensation component, thereby reducing the gap between the temperature compensation component and the heating plate and improving the heat conduction efficiency.

[0013] According to some embodiments of the present application, the heating plate is embedded with a plurality of heat pipes, the plurality of heat pipes are distributed in a ring shape, and the positions of the plurality of heat pipes and the connecting pipe correspond to each other. Thus, the temperature compensation efficiency can be improved by the corresponding arrangement of the heat pipes and the connecting pipe.

[0014] According to some embodiments of the present application, temperature sensors are respectively provided on the central portion, the transition portion and the edge portion, and the temperature sensors are used to monitor the actual temperature of the area where the sensors are located. Thus, the actual temperatures of multiple areas can be monitored in real time.

[0015] According to some embodiments of the present application, the top surface of the heating plate is further provided with a guide seat, and the heating plate is provided with a guide hole that cooperates with the guide seat. Thus, the guide seat can be installed in the guide seat, and the product can be positioned according to the position of the guide seat when placed.

[0016] According to some embodiments of the present application, there are multiple guide seats, which are distributed on the outer edge of the heating plate, and the guide seats are provided with inclined surfaces. Therefore, by providing the guide seats with inclined surfaces, it is beneficial for the product to be automatically straightened when it is placed at an angle. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A schematic diagram of the structure of the heat plate provided in the embodiment of the present application; Figure 2 A schematic diagram of the structure of a temperature compensation component provided in an embodiment of the present application; Figure 3 A schematic diagram of the structure of a heating plate provided in an embodiment of the present application; Figure 4 A schematic diagram of the structure of the guide seat provided in an embodiment of the present application. DETAILED DESCRIPTION

[0018] The following description provides specific application scenarios and requirements of this specification, with the purpose of enabling those skilled in the art to make and use the contents of this specification. Various local modifications to the disclosed embodiments will be apparent to those skilled in the art, and the general principles defined herein may be applied to other embodiments and applications without departing from the spirit and scope of this specification. Therefore, this specification is not limited to the embodiments shown, but to the widest scope consistent with the claims.

[0019] The terms used herein are for the purpose of describing specific example embodiments only and are not intended to be limiting. For example, as used herein, the singular forms "a", "an", and "the" may also include the plural forms unless the context clearly indicates otherwise. The terms "first", "second", etc. are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features.

[0020] In view of the following description, these and other features of the present specification, as well as the operation and function of the related elements of the structure, and the economy of the combination and manufacture of the parts can be significantly improved. Reference is made to the accompanying drawings, all of which form a part of this specification. However, it should be clearly understood that the drawings are for illustration and description purposes only and are not intended to limit the scope of this specification. It should also be understood that the drawings are not drawn to scale.

[0021] The present application is described in detail below through specific embodiments.

[0022] In the related technical scheme, a plurality of heating pipes are often embedded in the heating plate, and the temperature of the heating plate is increased by heating through the heating pipes to bake the product. However, when it is found that the temperature of the heating plate is uneven, temperature compensation cannot be performed. Specifically, the heating plate is installed inside the heating cavity, and the heat at the edge of the heating plate is easily dissipated, while the heat in the center of the heating plate is easily accumulated, resulting in high temperature in the center and low temperature at the edge. When encountering this problem, the heating power of the heating pipe at the edge of the heating plate is generally increased, and the heating power of the pipe in the center is reduced. However, the heating power of the heating plate is generally very high when baking, and the heating power of a single heating pipe can reach several kilowatts. That is to say, in this way, although the heating power of the central heating area is reduced, the heating power is still very large, and the accumulated heat is still difficult to dissipate. The temperature of the center cannot be adjusted to the set value in time, resulting in low temperature adjustment efficiency. The temperature of different areas of the heating plate takes a long time to adjust.

[0023] Based on the above, see Figure 1~Figure 3 : An embodiment of the present application provides a hot plate structure for display panel film formation, including: a heating plate 200, a temperature compensation component 100 and a temperature adjustment device 300.

[0024] Among them, the heating plate 200 is used to place the panel and heat it; the temperature compensation component 100 is arranged at the bottom of the heating plate 200, and the temperature compensation component 100 is provided with a mounting surface 120, and the mounting surface 120 includes a central portion 150, a transition portion 140 and an edge portion 130 arranged in sequence from the inside to the outside, and at least one connecting pipe 110 is respectively provided on the central portion 150, the transition portion 140 and the edge portion 130, that is, at least one connecting pipe 110 is installed in each of the three areas, wherein the heat pipe of the central portion is located within the central area boundary line 151, the heat pipe of the transition portion is located between the central area boundary line 151 and the transition area boundary line 141, and the edge heating pipe is located between the transition area boundary line 141 and the edge area boundary line 131, and each connecting pipe 110 is provided with an input port 170 and an output port 160 extending outward. The temperature control device 300 is provided at the input port 170 and is used to control the temperature of the gas introduced into the connecting pipe 110. A heater 320 or a condenser 310 may be installed at the input port 170 as required to control the temperature of the introduced gas.

[0025] The temperature compensation component 100 can use a plate to support and install the pipeline, so that the temperature compensation component 100 and the heating plate 200 are more flat after being installed together, and the gap between the two is reduced. The pipeline in the temperature compensation component 100 is directly below the heating pipeline of the heating plate 200. The center part 150, the transition part 140 and the edge part 130 of the temperature compensation component 100 are respectively provided with connecting pipes 110. The temperature of the internal pipeline gas can be independently adjusted through the connecting pipes 110 in the three areas, so that temperature compensation of different areas of the heating plate 200 can be conveniently performed.

[0026] Therefore, by providing the temperature control device 300, the temperature of the normal temperature gas introduced can be adjusted, and then the temperature-controlled gas is sent to the temperature compensation plate. By providing the temperature compensation plate, when it is found that the temperature of the central part 150 area of ​​the heating plate 200 is too high, the power of the heat pipe of the heating plate 200 can be changed without changing it, but condensed gas can be introduced into the airflow duct in the central area of ​​the temperature compensation component 100 through the temperature compensation component 100, and the condensed gas can take away the excess heat in the central area of ​​the heating plate 200. Similarly, when it is found that the temperature of the edge area of ​​the heating plate 200 is too low, heated gas can be introduced into the airflow duct in the edge area of ​​the temperature compensation plate to slightly compensate the temperature of the edge area.

[0027] According to some embodiments of the present application, the temperature control device 300 includes a condenser 310 and a heater 320 . The condenser 310 and the heater 320 are connected in parallel via a pipeline 340 , and a control switch 330 is provided on each pipeline 340 .

[0028] When in use, normal temperature gas is introduced from the pipeline inlet 341. When the pipeline needs to heat the gas, the valve of the gas control switch 330 corresponding to the condenser 310 is closed, and the valve of the gas control switch 330 corresponding to the heater 320 is opened. The gas flows through the heater 320, and the gas is heated to the set temperature and flows into the temperature compensation plate. Similarly, when a certain area in the high-temperature baking heating plate 200 needs to be slightly cooled, the valve of the gas control switch 330 corresponding to the condenser 310 is opened, and the valve of the gas control switch 330 corresponding to the heater 320 is closed, and the gas flows through the condenser 310. The condensed gas can be introduced into the connecting pipe 110 to slightly cool the heating plate 200. Therefore, when the heating plate 200 needs to be cooled, the condensed gas is fully introduced into the temperature compensation plate, which can quickly take away the heat, quickly reduce the temperature of the heating plate 200, and improve the cooling efficiency.

[0029] According to some embodiments of the present application, mounting grooves are respectively provided on the central portion 150, the transition portion 140 and the edge portion 130, the connecting pipe 110 is embedded in the mounting groove, and a fastening layer is provided between the connecting pipe 110 and the mounting groove. Optionally, the fastening layer can be filled with thermal conductive silicone grease. After filling, the connecting pipe 110 can be fixed, and the gap between the connecting pipe 110 and the mounting groove can be filled to ensure that the heating pipe cannot move when the heating plate 200 is in use; secondly, the thermal conductivity between the heating pipe and the temperature compensation plate can be improved to prevent uneven heat transfer between the heating pipe and the temperature compensation plate. This helps to improve the temperature uniformity during heating.

[0030] Similarly, in the heating plate 200 , after the pipe is embedded in the plate body, it is also filled with thermal conductive silicone grease, which has the same function as that in the temperature compensation component 100 .

[0031] According to some embodiments of the present application, a heat insulation plate 600 is further provided at the bottom of the temperature compensation component 100, and the heat insulation plate 600 is fitted with the temperature compensation component 100. The heat insulation plate can prevent heat from being lost from the bottom. Furthermore, a heat dissipation layer 400 is also provided on the heating plate 200, and the heat dissipation layer 400 is installed on the upper surface of the heating plate 200. Optionally, the heat dissipation layer 400 can be made of heat dissipation powder or heat dissipation film, wherein the heat dissipation powder can be plated on the upper surface of the heating plate 200 by coating, or a heat dissipation film can be attached to the upper surface of the heating plate 200. Through the design of the heat insulation plate and the heat dissipation layer 400, the heat dissipation direction of the heating plate 200 can be ensured, and the heat is dissipated from the heat dissipation plate.

[0032] According to some embodiments of the present application, a heat-conducting layer 500 is further provided between the heating plate 200 and the temperature compensation assembly 100. The gap between the heating plate 200 and the temperature compensation plate can be reduced, and the heat conduction efficiency can be improved. Optionally, the heat-conducting layer 500 is a material with good thermal conductivity, such as a thermally conductive film, thermally conductive silicone grease, or a thermally conductive pad. In actual settings, the thickness of the heat-conducting layer 500 can be set relatively thin, for example, 0.1 mm to 1 mm.

[0033] According to some embodiments of the present application, see Figure 3, the heating plate 200 is embedded with a plurality of heat pipes 220, and the plurality of heat pipes are distributed in an annular manner, and the positions of the plurality of heat pipes and the connecting pipe 110 correspond. Specifically, the heat pipe 220 is embedded in the body of the heating plate 200, and is installed in a serpentine or circumferential manner in the plate body. The positions of the heat pipe 220 and the connecting pipe 110 correspond, so that the plurality of heat pipes are also divided into a central area heat pipe 223, a transition area heat pipe 222 and an edge area heat pipe 221 according to the installation position. From the central heating area to the transition heating area and the edge heating area, the spacing between adjacent heating pipes is from large to small. The closer to the edge, the faster the heat dissipation, and the smaller the spacing between the heating pipes arranged in this area. Optionally, as the size of the heating plate 200 increases, the number of the central heating area, the transition heating area and the edge heating area can be set to multiple. Further, temperature sensors 240 are respectively provided on the central part 150, the transition part 140 and the edge part 130, and the temperature sensor 240 is used to monitor the actual temperature of the area where the sensor is located.

[0034] According to some embodiments of the present application, see Figure 4 A guide seat 210 is also provided on the top surface of the heating plate 200, and a guide hole 230 is provided on the heating plate 200 to cooperate with the guide seat 210. There are multiple guide seats 210, and the multiple guide seats 210 are distributed on the outer edge of the heating plate 200. An inclined surface 211 is provided on the guide seat 210. The inclined surface 211 is used as a guide surface when the product is placed. By providing the inclined surface 211, the guide seat 210 is in a slope shape. Specifically, the guide member is made of a low-friction material, such as a very smooth material such as Teflon or PEEK material. This slope structure and smooth surface are conducive to the automatic correction of the product when it is placed at an angle.

[0035] In a pair of proportions, by setting up double-layer heating plates up and down, the second layer of heating plates can heat the first layer of heating plates synchronously to compensate for the heat at the edge. However, the heat in the center of the first layer of heating plates is still easy to accumulate, resulting in high temperature in the center and low temperature at the edge. The temperature can only be reduced through natural heat dissipation, and the temperature of the entire plate cannot be adjusted in time.

[0036] In summary, the hot plate structure provided in this specification can be applied to the heating plate for temperature compensation. There is no need to adjust the heating power of different heat pipes in the heating tube. The temperature of the center part can be adjusted to the set value in time, so that the temperature of different areas is more uniform when the heating plate is heated. It can also be flexibly applied to scenarios where the heating plate needs to be heated or cooled, and the temperature control efficiency is high.

[0037] The above is a description of a specific embodiment of the present specification. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in an order different from that in the embodiments and still achieve the desired results. In addition, the processes depicted in the drawings do not necessarily require a specific order or a continuous order to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0038] In addition, certain terms in this specification have been used to describe embodiments of this specification. For example, "one embodiment", "an embodiment" and / or "some embodiments" mean that a particular feature, structure or characteristic described in conjunction with the embodiment may be included in at least one embodiment of this specification. Therefore, it can be emphasized and should be understood that two or more references to "an embodiment" or "one embodiment" or "an alternative embodiment" in various parts of this specification do not necessarily refer to the same embodiment. In addition, specific features, structures or characteristics may be appropriately combined in one or more embodiments of this specification.

[0039] Finally, it should be understood that the embodiments of the application disclosed herein are explanations of the principles of the embodiments of this specification. Other modified embodiments are also within the scope of this specification. Therefore, the embodiments disclosed in this specification are only used as examples and not as limitations. Those skilled in the art can adopt alternative configurations according to the embodiments in this specification to implement the application in this specification. The embodiments of this specification are not limited to the embodiments accurately described in the application.

Claims

1. A hot plate structure for display panel film formation, characterized in that: include: A heating plate for placing the panel and heating it; A temperature compensation component is arranged at the bottom of the heating plate, and a mounting surface is arranged on the temperature compensation component, and the mounting surface includes a central portion, a transition portion and an edge portion arranged in sequence from the inside to the outside, and at least one connecting pipe is respectively arranged on the central portion, the transition portion and the edge portion, and the connecting pipe is provided with an input port and an output port extending outward; The temperature regulating device is arranged at the input port and is used for regulating the temperature of the gas passing into the connecting pipe.

2. The hot plate structure for display panel film formation according to claim 1, characterized in that: The temperature regulating device comprises a condenser and a heater. The condenser and the heater are connected in parallel through pipelines and a control switch is arranged on each pipeline.

3. The hot plate structure for display panel film formation according to claim 1, characterized in that: The central portion, the transition portion and the edge portion are respectively provided with mounting grooves, the connecting pipe is embedded in the mounting grooves, and a fastening layer is provided between the connecting pipe and the mounting grooves.

4. The hot plate structure for display panel film formation according to claim 1, characterized in that: A heat insulation board is also provided at the bottom of the temperature compensation component, and the heat insulation board is fitted with the temperature compensation component. 5 . The hot plate structure for display panel film formation according to claim 4 , wherein a heat dissipation layer is further provided on the heating plate, and the heat dissipation layer is in contact with the heating plate.

6. The hot plate structure for display panel film formation according to claim 1, characterized in that: A heat conducting layer is also provided between the heating plate and the temperature compensation component.

7. The hot plate structure for display panel film formation according to any one of claims 1 to 6, characterized in that: A plurality of heat pipes are embedded in the heating plate, and the plurality of heat pipes are distributed in a ring shape, and positions of the plurality of heat pipes and the connecting pipe correspond to each other.

8. The hot plate structure for display panel film formation according to claim 7, characterized in that: Temperature sensors are respectively arranged on the central portion, the transition portion and the edge portion, for monitoring the actual temperature of the area where the sensors are located.

9. The hot plate structure for display panel film formation according to claim 1, characterized in that: A guide seat is also provided on the top surface of the heating plate, and a guide hole which is matched and connected with the guide seat is provided on the heating plate.

10. The hot plate structure for display panel film formation according to claim 9, characterized in that: There are a plurality of guide seats, which are distributed on the outer edge of the heating plate, and an inclined surface is provided on the guide seat.

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