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606results about How to "Increase shear force" patented technology

Method and apparatus for trimming buds and flowers

ActiveUS20120279193A1Enabling flowEnabling processingHedge trimming apparatusBud removersSprayerWaste collection
The present invention discloses an apparatus for trimming plants, in particular, buds and flowers, to remove unwanted plant material. A typical application would be to process a plant to leave only trimmed buds and flowers for use in potpourri, fragrant sashes, or as a prelude to further processing of essential oils. The invention enables faster and safer production of plant material than prior plant processing machines. The apparatus employs an original combination of a slotted metal drum and a lawn mower type cutting reel that are rotated in the same direction, but at different speeds, to create a cutting interface that shears the unwanted plant material off and then collect this debris though a novel vacuum manifold into a waste collection device. The cutting interface between the slotted drum and the cutting reel is adjustable to keep the distance between the two between 0.002 and 0.006 inches for a very sharp and clean cut. The invention includes a roller brush and sprayer system to keep the cutting interface clean, without buildup of oils and other organic plant material. The invention is built upon a frame that moves on wheels and that allows for adjustment for operation in a level or tilted configuration to best suit the processing of particular types of plant material. The manifold cover is easily removed for cleaning and for sharpening or adjustment of the cutting blades.
Owner:ETEROS TECH USA INC

Tackifier for drilling fluid, and preparation method and application thereof

The invention provides a tackifier for a drilling fluid, and a preparation method and application thereof. The tackifier is a quadripolymer formed by polymerization of four alkene monomers, wherein the four alkene monomers are selected from a temperature-resistant salt-tolerant monomer, a hydrated monomer and an adsorptive monomer; the temperature-resistant salt-tolerant monomer is selected from an alkenyl sulfonic acid monomer; the hydrated monomer is selected from alkenyl carboxylic acid, alkenyl alkane ketone and double-bond-containing quaternary ammonium salt compounds; and the adsorptive monomer is selected from an alkenyl amide monomer. The tackifier provided by the invention can resist a high temperature of no less than 180 DEG C, is resistant to saturated salt, has remarkable tackifying effect, is low in toxicity and environmentally friendly, and can obviously improve the dehydration and wall building capability of the drilling fluid, thereby effectively reducing the dehydration. The invention solves the downhole complexity possibly caused by the fact that the drilling fluid system can not carry and suspend rock debris and thus can not clear boreholes in time due to reduced viscosity shearing force as a result of poor temperature resistance and salt tolerance of the tackifier in deep well, ultradeep well, horizontal well and extended reach well operations.
Owner:BC P INC CHINA NAT PETROLEUM CORP +2

Pressure-sensitive adhesive for wafer grinding and preparation method thereof

The invention discloses a pressure-sensitive adhesive for wafer grinding and a preparation method thereof. The adhesive comprises a plastic base material, an adhesive layer coated on the base plastic material, and a release film which covers the adhesive layer. The preparation method of the pressure-sensitive adhesive comprises the following steps of: A) preparing a prepolymer; B) preparing an adhesive; C) preparing an adhesive tape. Compared with the prior art, the preparation method has the advantages that the dose and addition way of an initiating agent as well as the polymerizing temperature are controlled to realize the maximum molecular weight as well as high cohesive strength, and the problems of relatively high peeling strength and small shearing strength of the traditional pressure-sensitive adhesive are solved. In addition, a hard monomer added brings the pressure-sensitive adhesive with high shearing strength, and the demand on wafer grinding is met. The pressure-sensitive adhesive for wafer grinding is different from other adhesive tapes for wafer grinding in that a silane coupling agent bringing water resistance is directly polymerized onto a polymer molecular chain, instead of being directly added. Therefore, the migration of micromolecule in storage process is avoided, and the resulting influence to the effect or the resulting residue on a wafer is removed.
Owner:YANTAI DARBOND TECH
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