Optical device

Abstract

The invention provides an optical device. The optical device comprises a shell, an optical chip, a light collecting assembly and a monitoring assembly. The monitoring assembly comprises a reflecting part and a monitoring part, the reflecting part is arranged between the plurality of optical chips and the light collecting assembly, and the monitoring part is arranged on the shell; part of light beams emitted by the optical chips are in a divergent light state, the reflecting part is used for reflecting the light beams emitted by the optical chips in the divergent light state to the monitoring part, and the monitoring part is used for receiving the light beams from the reflecting part and obtaining light beam information of the light beams. According to the optical device provided by the invention, the reflecting part is arranged between the optical chip and the light collecting assembly, and the monitoring part is arranged on the shell, so that the divergent light emitted by the optical chip can be arranged in the monitoring part through the reflecting part, and the monitoring part can obtain the light beam information of the light beam, so that the power and quality detection of the optical signal is realized, and the reliability of the optical device is improved.

Description

Technical Field

[0001] The present application belongs to the field of optical communication technology, and specifically relates to optical devices. Background Art

[0002] In the field of optical communications, in order to monitor the power and quality of optical signals and provide feedback information to ensure the stability and performance of the system, monitoring components are often set between the optical chip and the optical path of the light collecting component to improve the signal quality.

[0003] In the related art, in order to increase the rate of light transmission, a parallel optical system with an extremely short distance between the optical chip and the light collecting component is adopted. However, since the distance between the optical chip and the light collecting component is too small, it is impossible to set a monitoring device between the optical path of the optical chip and the light collecting component. The setting of the monitoring device is often omitted in the related art, resulting in the inability to detect the power and quality of the optical signal in the optical device, which in turn reduces the reliability of the optical device. Summary of the invention

[0004] In view of this, the present application provides an optical device, the optical device comprising:

[0005] A housing having a receiving space, wherein the housing further has an input port and an output port communicating with the receiving space;

[0006] A plurality of optical chips are disposed in the receiving space, each of the optical chips is used to emit a light beam of a different wavelength, and the plurality of optical chips are all connected to the input port;

[0007] a light collecting component, disposed in the receiving space and between the plurality of optical chips and the output port; the light collecting component is used to receive the plurality of light beams emitted by the plurality of optical chips, make the plurality of light beams parallel light, and then combine the plurality of light beams to form emission light, and the emission light is emitted from the output port; and

[0008] A monitoring component is arranged in the receiving space, and the monitoring component includes a reflecting component and a monitoring component. The reflecting component is arranged between the multiple optical chips and the light collecting component, and the monitoring component is arranged in the shell; the light beams emitted by some of the optical chips are in a divergent light state, and the reflecting component is used to reflect the light beams emitted from the optical chips in a divergent light state to the monitoring component, and the monitoring component is used to receive the light beams from the reflecting component and obtain the light beam information of the light beams.

[0009] Among them, the light collecting component includes a coupling lens arranged on one side of the multiple optical chips, and the coupling lens includes a plurality of sub-light-transmitting parts arranged in parallel and at intervals, one sub-light-transmitting part is arranged corresponding to one optical chip, and the sub-light-transmitting part is used to receive the light beam emitted by the optical chip and make the light beam in a parallel light state.

[0010] Among them, the number of the reflecting elements is the same as the number of the optical chips, the number of the monitoring elements is the same as the number of the optical chips, one reflecting element is arranged between one optical chip and one sub-transparent portion, multiple reflecting elements are arranged in parallel and at intervals, one monitoring element corresponds to one reflecting element, and multiple monitoring elements are arranged in parallel and at intervals.

[0011] Wherein, the monitoring component further includes a blocking member, which is disposed between two adjacent reflecting members and is used to block the light beam emitted from the optical chip not corresponding to the optical chip from reaching the reflecting member.

[0012] Wherein, the monitoring component also includes an electrically connected controller and a temperature sensor, the barrier is used to absorb light, the temperature sensor is used to obtain temperature information of the barrier, and the controller is used to receive the temperature information of the barrier and control the multiple optical chips.

[0013] Wherein, the reflecting component includes a reflecting surface for reflecting the light beam, the monitoring component includes a receiving surface for receiving the light beam, and the angle between the reflecting surface and the receiving surface is greater than or equal to 30° and less than 45°.

[0014] Wherein, the distance between the optical chip and the reflective element is a first distance, and the first distance is 250 μm-350 μm.

[0015] Among them, the distance between the optical chip and the reflective element is a first distance, the distance between the reflective element and the monitoring element is a second distance, and the ratio between the first distance and the second distance is 1:(2-6).

[0016] Wherein, the light collecting component further comprises a beam combining group arranged on a side of the coupling lens away from the plurality of optical chips, the beam combining group comprises a first light incident portion, a first reflecting portion, and a second light incident portion, the first light incident portion is arranged between one of the sub-light-transmitting portions and the first reflecting portion, and the second light incident portion is arranged corresponding to another of the sub-light-transmitting portions;

[0017] The multiple optical chips respectively emit a first light beam and a second light beam with different wavelengths; wherein the first light beam passes through one of the sub-light-transmitting portions and is incident toward the first light input portion, the first light input portion is used to receive the first light beam and make the first light beam incident to the first reflecting portion, and the first reflecting portion is used to reflect the first light beam to the second light input portion; the second light beam passes through another of the sub-light-transmitting portions and is incident toward the second light input portion, the second light input portion is used to receive the second light beam, and is also used to make the second light beam and the first light beam incident to the output port, thereby combining the first light beam and the second light beam to form the emitted light.

[0018] Wherein, the beam combining group also includes a fixing part, and the fixing part includes a first inner side wall and a second inner side wall that are arranged opposite to each other, the first inner side wall is closer to the coupling lens than the second inner side wall, the first inner side wall and the second inner side wall are both inclined, the first light incident part and the second light incident part are fixed to the first inner side wall, and the first reflecting part is fixed to the second inner side wall.

[0019] There is a first angle between the extension direction of the first inner side wall and the vertical direction, there is a second angle between the extension direction of the second inner side wall and the vertical direction, and both the first angle and the second angle are 3°-20°.

[0020] Wherein, the optical device further comprises a base arranged in the receiving space, the multiple optical chips are fixed on the base, and the multiple optical chips are arranged in parallel and at intervals.

[0021] The optical device further comprises an optical fiber and a receiving element arranged on one side of the housing, wherein the optical fiber is used to receive the emitted light emitted from the output port, and the optical fiber is also used to emit incident light, and the receiving element is used to receive the incident light.

[0022] There are multiple receiving elements, and the multiple receiving elements are arranged between the output port and the optical fiber. The multiple receiving elements are arranged in parallel and at intervals along the arrangement direction from the output port to the optical fiber.

[0023] Wherein, the optical device further comprises a light concentrator, which is arranged between the output port and the optical fiber, and is used for receiving and concentrating the emitted light, and also allows the concentrated emitted light to be emitted to the optical fiber.

[0024] Wherein, the optical device further includes an isolator, which is disposed between the output port and the optical fiber, and is used to block the light beams reflected back to the multiple optical chips through the light collecting component.

[0025] The optical device provided by the present application arranges a reflective component between the optical chip and the light collecting component, and arranges a monitoring component on the shell, so that the divergent light emitted by the optical chip can be arranged in the monitoring component through the reflective component. The monitoring component can obtain the light beam information of the light beam to realize the power and quality detection of the optical signal, thereby improving the reliability of the optical device.

[0026] Furthermore, the optical device provided in the present application optimizes the structure of the optical device by integrating multiple optical chips, light collecting components, and monitoring components into a housing, thereby reducing the number of components that need to be assembled, facilitating user assembly, reducing the difficulty of assembly, and reducing the overall size of the optical device, thereby providing more available space for other components.

[0027] In addition, the present application also provides a light-collecting component to combine multiple light beams into emitted light, thereby omitting at least one filter and lens in the related technology, reducing the preparation cost, reducing the light beam power loss, and improving the transmission performance of the optical device. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the implementation modes of the present application, the drawings required for use in the implementation modes of the present application will be described below.

[0029] Figure 1 A schematic diagram of the structure of an optical device provided in one embodiment of the present application.

[0030] Figure 2 A schematic diagram of the structure of an optical device provided for related technology.

[0031] Figure 3 A schematic structural diagram of an optical device provided in another embodiment of the present application.

[0032] Figure 4 A schematic diagram of the structure of an optical chip and a coupling lens provided in one embodiment of the present application.

[0033] Figure 5 A schematic diagram of the structure of an optical chip, a monitoring component, and a coupling lens provided in one embodiment of the present application.

[0034] Figure 6 A schematic structural diagram of an optical device provided in yet another embodiment of the present application.

[0035] Figure 7 A curve diagram showing a change in the light loss rate received by a monitoring component and a second spacing provided in one embodiment of the present application.

[0036] Figure 8 A schematic diagram of the structure of a beam combining group provided in one embodiment of the present application.

[0037] Fig. 9 A schematic structural diagram of a beam combining group provided in another embodiment of the present application.

[0038] Fig.10 This is a schematic structural diagram of a beam combining group provided in yet another embodiment of the present application.

[0039] Fig.11 A schematic diagram of the optical path of emitted light in an optical device provided in one embodiment of the present application.

[0040] Fig.12 A schematic diagram of the optical path of incident light of an optical device provided in one embodiment of the present application.

[0041] Explanation of reference numerals: optical device 1, shell 10, receiving space 11, input port 12, output port 13, optical chip 20, light collecting component 30, coupling lens 31, sub-light transmitting portion 311, beam combining group 32, first light incident portion 321, first reflecting portion 322, second light incident portion 323, second reflecting portion 324, third light incident portion 325, third reflecting portion 326, fourth light incident portion 327, fixing member 328, first inner side wall 3281, second inner side wall 3282, monitoring component 40, reflecting member 41, monitoring member 42, blocking member 43, temperature sensor 44, base 51, optical fiber 52, receiving member 53, light focusing member 54, isolating member 55. DETAILED DESCRIPTION

[0042] The following are preferred implementations of the present application. It should be noted that, for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application, and these improvements and modifications are also considered to be within the scope of protection of the present application.

[0043] In view of this, to solve the above problems, please refer to Figure 1-Figure 3 This embodiment provides an optical device 1, which includes a housing 10, an optical chip 20, a light collecting component 30, and a monitoring component 40. The housing 10 has a receiving space 11, and the housing 10 also has an input port 12 and an output port 13 connected to the receiving space 11. A plurality of optical chips 20 are arranged in the receiving space 11, each of the optical chips 20 is used to emit a light beam of a different wavelength, and the plurality of optical chips 20 are connected to the input port 12.

[0044] The light collecting component 30 is arranged in the receiving space 11 and between the multiple optical chips 20 and the output port 13; the light collecting component 30 is used to receive the multiple light beams emitted by the multiple optical chips 20, and make the multiple light beams in a parallel light state, and then combine the multiple light beams to form an emitted light, and the emitted light is emitted from the output port 13.

[0045] The monitoring component 40 is disposed in the receiving space 11. The monitoring component 40 includes a reflector 41 and a monitoring component 42, wherein the reflector 41 is disposed between the plurality of optical chips 20 and the light collecting component, and the monitoring component 42 is disposed in the housing 10; the light beams emitted by some of the optical chips 20 are in a divergent light state, and the reflector 41 is used to reflect the light beams emitted from the optical chips 20 in a divergent light state to the monitoring component 42, and the monitoring component 42 is used to receive the light beams from the reflector 41 and obtain the light beam information of the light beams.

[0046] The optical device 1 provided in this embodiment can be used in an optical communication system including an optical network terminal, an optical network unit, an optical distribution network, etc.

[0047] The housing 10 is used to fix and protect the components of the optical device 1. The housing 10 has a receiving space 11, and the optical chip 20 and the light collecting component 30 are both arranged in the receiving space 11. The housing 10 also has an input port 12 and an output port 13, the input port 12 is used to connect the optical chip 20 to other components, and the output port 13 is used to output the emitted light. Optionally, the input port 12, the optical chip 20, the light collecting component 30, and the output port 13 are arranged along the axial direction of the housing 10. Among them, the connection method between the optical chip 20 and the housing 10 can be an adhesive connection, a snap connection, a threaded connection, etc., which is not limited in this embodiment. The connection method between the light collecting component 30 and the housing 10 can be an adhesive connection, a snap connection, a threaded connection, etc., which is not limited in this embodiment.

[0048] The optical chip 20 is used to emit a light beam. The number of the optical chips 20 may be at least two, and specifically, for example, the number of the optical chips 20 is 2, 3, 4, 5, or 6. Optionally, the optical chip 20 is a laser emitter, and further optionally, the optical chip 20 may be an infrared emitter, or an ultraviolet emitter, etc. Each optical chip 20 can emit light beams of different wavelengths, and specifically, for example, the wavelength of the light beam emitted by the optical chip 20 may be 1342nm, 1490nm, or 1577nm, etc.

[0049] The light collecting component 30 is used to receive and reflect, and / or receive and transmit, and / or receive and filter the light beam emitted by the optical chip 20, so as to change the propagation direction of the light beam, so that multiple light beams are combined to form emission light, and then the emission light is emitted from the output port 13. The light path from the optical chip 20 through the light collecting component 30 is as follows: Figure 3 As shown in L3. The emitted light can also be emitted to a component that receives a light source signal, such as an optical fiber 52, a passive network, an active network, etc. Optionally, the light collecting component 30 includes a plurality of glass slides that can reflect and / or transmit light. The number of glass slides is 2-10. The specific structure of the light collecting component 30 will be described in detail below.

[0050] Optionally, the spacing between the multiple optical chips 20 and the light collecting component is 250μm-750μm, wherein the distance between the optical chip 20 and the light collecting component can be specifically exemplified as 250μm, or 300μm, or 350μm, or 400μm, or 450μm, or 500μm, or 550μm, or 600μm, or 650μm, or 700μm, or 750μm, etc.

[0051] The monitoring component 40 is used to detect the beam information of the light beam emitted by the optical chip 20, and the beam information includes the wavelength, power, energy, etc. of the light beam. The monitoring component 40 includes a reflector 41 and a monitoring component 42. The reflector 41 is used to reflect the light beam, and the monitoring component 42 is used to receive the light beam and obtain the beam information of the light beam. For example, the monitoring component 42 can be a photodiode, which works based on the photoelectric effect. When the incident light signal is irradiated on the monitoring component 42, an electric current will be generated. The current is proportional to the power of the incident light signal, and the power value of the incident light signal can be obtained by measuring the magnitude of the current. The monitoring component 42 is arranged on the inner cavity wall of the receiving space 11 of the shell 10. The connection method between the monitoring component 42 and the shell 10 can be an adhesive connection, a threaded connection, a snap-on connection, etc., which is not limited in this embodiment.

[0052] Specifically, the light beam emitted from the optical chip 20 in a divergent light state is emitted to the reflector 41, and the reflector 41 emits the light beam to the monitoring component 42. In other words, the monitoring component 42 receives the light beam emitted from the optical chip 20 and obtains the light beam information of the light beam, so that the monitoring component 42 monitors the light signal emitted by the optical chip 20. The optical path of the optical chip 20 to the reflector 41 and the monitoring component 42 is as follows: Figure 1 As shown in M.

[0053] Optionally, the reflector 41 is a concave mirror, and the reflector is also used to gather the light beam emitted from the optical chip 20 in a divergent light state. The reflector 41 not only has the function of reflecting the light beam, but also has the function of gathering the light beam, which can make more divergent light emitted from the optical chip 20 reflected to the monitoring element 42, thereby improving the monitoring accuracy of the monitoring element 42.

[0054] In summary, the optical device 1 provided in this embodiment, by arranging the reflective component 41 between the optical chip 20 and the light collecting component, and arranging the monitoring component 42 on the shell 10, allows the divergent light emitted by the optical chip 20 to be set in the monitoring component 42 through the reflective component 41, and the monitoring component 42 can obtain the light beam information of the light beam to realize the power and quality detection of the optical signal, thereby improving the reliability of the optical device 1.

[0055] 50G PON is the next generation PON standard after 10G PON. A single wavelength supports 50Gbps upstream and downstream. The bandwidth is five times that of 10GPON. It can coexist with 10G PON and is compatible with the network infrastructure that has been deployed. It should be noted that 50G PON is a technology based on optical fiber 52 communication. The "50G" in its name indicates its excellent data transmission speed, reaching 50Gbps (Gigabits per second), as a representative of the next generation PON (Passive Optical Network) technology.

[0056] Please refer to Figure 2 In the related art, a 50G COMBO PON OLT optical device is usually composed of three transmitters and three receivers 53, and uses a common optical fiber 52 to transmit and receive optical signals. The transmitter can also be understood as an optical chip 20. Figure 2 As shown in FIG. 1 , three transmitters (optical chips 20), three receivers 53, and one optical fiber 52 are usually assembled on an integrated component, and then the filter and lens on the integrated component are used to change the propagation path of light beams of different wavelengths. The optical path from the transmitter (optical chip 20) to the optical fiber 52 is as follows: Figure 2 As shown in L1, the optical path from the optical fiber 52 to the receiving element 53 is as follows Figure 2 As shown in L2.

[0057] However, when using the optical device 1 in the above-mentioned related technology, it is usually necessary to assemble different light emitters on an integrated component, and then pass through at least one filter in the integrated component to combine multiple light beams with different wavelengths into one emitted light. This leads to high assembly difficulty, large light beam power loss, the need to use multiple components, and high preparation cost.

[0058] In summary, the optical device 1 provided in this embodiment optimizes the structure of the optical device 1 by integrating multiple optical chips 20, a light collecting component 30, and a monitoring component 40 into a shell 10, reduces the number of parts that need to be assembled, facilitates user assembly, reduces the difficulty of assembly, and reduces the overall size of the optical device 1, thereby providing more available space for other components.

[0059] In addition, this embodiment also provides a light collecting component 30 to combine multiple light beams into emitted light, omitting at least one filter and lens in the related technology, thereby reducing the preparation cost, reducing the light beam power loss, and improving the transmission performance of the optical device 1.

[0060] Please refer to Figure 4 In one embodiment, the light collecting component 30 includes a coupling lens 31 disposed on one side of the multiple optical chips 20, and the coupling lens 31 includes a plurality of sub-light-transmitting portions 311 arranged in parallel and at intervals, and one of the sub-light-transmitting portions 311 is disposed corresponding to one of the optical chips 20, and the sub-light-transmitting portions 311 are used to receive the light beam emitted by the optical chip 20 and make the light beam in a parallel light state.

[0061] The coupling lens 31 is arranged facing the multiple optical chips 20. The multiple optical chips 20 are arranged in parallel and at intervals, and the arrangement direction of the multiple optical chips 20 is parallel to the arrangement direction of the multiple sub-light-transmitting portions 311 in the coupling lens 31. The multiple sub-light-transmitting portions 311 are individually coupled by using a coupling machine to obtain the coupling lens 31. In other words, the multiple sub-light-transmitting portions 311 are an integrated structural member. The sub-light-transmitting portion 311 can also be called a collimator, which is used to make the light beam emitted by the optical chip 20 in a parallel light state.

[0062] In summary, this embodiment optimizes the structure by setting a coupling lens 31, omits at least one filter and lens in the related technology, reduces the preparation cost, and makes multiple light beams in a parallel light state, thereby reducing the difficulty of subsequently combining multiple light beams to form an emitted light beam.

[0063] Please refer to Figure 1-Figure 5 In one embodiment, the number of the reflective elements 41 is the same as the number of the optical chips 20, the number of the monitoring elements 42 is the same as the number of the optical chips 20, one reflective element 41 is arranged between one optical chip 20 and one sub-light-transmitting portion 311, a plurality of the reflective elements 41 are arranged in parallel and at intervals, one monitoring element 42 corresponds to one reflective element 41, and a plurality of the monitoring elements 42 are arranged in parallel and at intervals.

[0064] A monitoring element 42 receives a light beam reflected by a reflective element 41, and obtains light beam information of a light beam emitted from an optical chip 20. Optionally, the arrangement direction of the plurality of optical chips 20 is parallel to the arrangement direction of the plurality of reflective elements 41. Optionally, the spacing between two adjacent optical chips 20 is equal to the spacing between two adjacent reflective elements 41. Optionally, the arrangement direction of the plurality of optical chips 20 is parallel to the arrangement direction of the plurality of monitoring elements 42. Optionally, the spacing between two adjacent optical chips 20 is equal to the spacing between two adjacent monitoring elements 42.

[0065] In summary, this embodiment avoids mutual interference of beam information of multiple optical chips 20 by limiting one reflector 41 to correspond to one optical chip 20 and one monitoring component 42 to monitor the light beam of one optical chip 20, thereby improving the monitoring accuracy of the monitoring component 40.

[0066] Please refer to Figure 1-Figure 5 In one embodiment, the monitoring component 40 further includes a blocking member 43 , which is disposed between two adjacent reflective members 41 , and is used to block a light beam emitted from a non-corresponding optical chip 20 from reaching the reflective member 41 .

[0067] Specifically, the blocking member 43 can absorb, reflect, or filter the light beam, so as to block the light beam emitted by the non-corresponding optical chip 20 from reaching the reflector 41. In other words, the material of the blocking member 43 includes but is not limited to a material that can absorb, reflect, or filter light of a preset wavelength. The light beam emitted by the non-corresponding optical chip 20 refers to the light beam emitted by the optical chip 20 that does not correspond to the reflector 41.

[0068] For example, the plurality of optical chips 20 include a first optical chip 20 for emitting a first light beam, and a second optical chip 20 for emitting a second light beam. The plurality of sub-light-transmitting portions 311 include a first sub-light-transmitting portion 311 corresponding to the first chip, and a second sub-light-transmitting portion 311 corresponding to the second chip. The plurality of reflectors 41 include a first reflector 41 for receiving and reflecting the first light beam, and a second reflector 41 for receiving and reflecting the second light beam. The plurality of monitoring components 42 include a first monitoring component 42 and a second monitoring component 42, the first monitoring component 42 being used to receive the first light beam and obtain the light beam information of the first light beam, and the second monitoring component 42 being used to receive the second light beam and obtain the light beam information of the second light beam. The first reflector 41 is located between the first optical chip 20 and the first sub-light-transmitting portion 311, and the second reflector 41 is located between the second optical chip 20 and the second sub-light-transmitting portion 311. A blocking member 43 is located between the first reflector 41 and the second reflector 41 , and is used to block the first light beam of the first optical chip 20 from being emitted to the second reflector 41 , and is also used to block the second light beam of the second optical chip 20 from being emitted to the first reflector 41 .

[0069] In summary, this embodiment sets a blocking member 43 between adjacent reflectors 41 to prevent the light beams of non-corresponding optical chips 20 from hitting the reflectors 41, thereby further avoiding mutual interference of light beam information of multiple optical chips 20 and further improving the monitoring accuracy of the monitoring component 40.

[0070] Please refer to Figure 1-Figure 5 In one embodiment, the monitoring component 40 also includes an electrically connected controller and a temperature sensor 44, the barrier 43 is used to absorb light, the temperature sensor 44 is used to obtain temperature information of the barrier 43, and the controller is used to receive the temperature information of the barrier 43 and control the multiple optical chips 20.

[0071] The temperature of the barrier 43 will rise after absorbing the light beam. The temperature of the barrier 43 can indirectly reflect the temperature of the optical chip 20 , and the temperatures of the plurality of barrier 43 can indirectly reflect the ambient temperature of the accommodating space 11 in the housing 10 .

[0072] Optionally, the temperature information of the plurality of barriers 43 is obtained, and if the difference between the maximum temperature and the minimum temperature in the plurality of barriers 43 is greater than or equal to the first preset value, the controller controls the two optical chips 20 adjacent to the barrier 43 with the maximum temperature to stop working. This setting can determine the optical chip 20 with an overly high operating temperature, stop the optical chip 20 from working in time, reduce the probability of damage to the optical chip 20, and improve the reliability of the optical device 1.

[0073] Optionally, the temperature information of multiple barriers 43 is obtained, and if the average temperature of all barriers 43 is greater than or equal to the second preset value, the controller controls all optical chips 20 to stop working. This setting can determine whether the ambient temperature in the housing 10 is too high, thereby determining whether the optical chip 20 is working normally, timely reducing the probability of damage to the optical chip 20, and improving the reliability of the optical device 1.

[0074] In summary, this embodiment sets a temperature sensor 44 for detecting the temperature information of the barrier 43 and cooperates with the controller to promptly handle various emergencies that may occur in the optical chip 20, thereby reducing the probability of damage to the optical chip 20 and improving the reliability of the optical device 1.

[0075] Please refer to Figure 1 In one embodiment, the reflective element 41 includes a reflective surface for reflecting the light beam, and the monitoring element 42 includes a receiving surface for receiving the light beam, and the angle between the reflective surface and the receiving surface is equal to 45°.

[0076] At this time, the light beam reflected from the reflecting surface to the receiving surface is perpendicular to the receiving surface. This method is simple and convenient, with a short light beam path, and can transmit the light beam of the optical chip 20 to the receiving surface.

[0077] However, since the light beam is incident vertically on the receiving surface, there is a certain probability that the light beam is re-reflected from the receiving surface to the reflector 41 , or even re-reflected to the optical chip 20 , thereby damaging the optical chip 20 .

[0078] Please refer to Figure 6 Preferably, the reflective element 41 includes a reflective surface for reflecting the light beam, and the monitoring element 42 includes a receiving surface for receiving the light beam, and the angle between the reflective surface and the receiving surface is greater than or equal to 30° and less than 45°.

[0079] The angle between the reflecting surface and the receiving surface may be specifically exemplified as 30°, 32.5°, 35°, 37.5°, 40°, 42.5°, 44.5°, etc.

[0080] In summary, this embodiment limits the angle between the reflecting surface and the receiving surface to be greater than or equal to 30° and less than 45° to avoid the light beam from being incident vertically on the receiving surface, and makes the light beam incident on the receiving surface at an angle to avoid the light beam being re-reflected onto the reflector 41 and the optical chip 20. This not only reduces the probability of damage to the optical chip 20 and improves the reliability of the optical device 1, but also allows more light to be received by the receiving surface, thereby improving the monitoring accuracy of the monitoring component 40.

[0081] Please refer to Figure 1-Figure 5 In one embodiment, the distance between the optical chip 20 and the reflector 41 is a first distance, and the first distance is 250 μm-350 μm. Figure 1 As shown in H1.

[0082] The first spacing may be specifically exemplified as 250 μm, 275 μm, 300 μm, 325 μm, 350 μm, etc. In this embodiment, the first spacing is limited to 250 μm-350 μm, so that the reflector 41 can reflect enough light beams to the monitoring component 42, so as to ensure that the monitoring component 42 can receive enough light beams, thereby improving the monitoring accuracy of the monitoring component 40.

[0083] Optionally, the distance between the reflector 41 and the sub-light-transmitting portion 311 is a third distance, and the third distance is 50 μm-150 μm. Figure 1 As shown in H3. The third spacing can be specifically exemplified as 50μm, 75μm, 100μm, 125μm, 150μm, etc. In this embodiment, the third spacing is limited to 50μm-150μm to avoid mutual interference between the reflector 41 and the sub-light-transmitting portion 311, and the spacing between the components is reduced as much as possible, thereby reducing the overall size of the optical device 1, which is conducive to miniaturization of the optical device 1.

[0084] Please refer to Figure 1-Figure 5 In one embodiment, the distance between the optical chip 20 and the reflector 41 is a first distance, the distance between the reflector 41 and the monitoring element 42 is a second distance, and the ratio between the first distance and the second distance is 1:(2-6). Figure 1 As shown in H1, the second spacing is Figure 1 As shown in H2.

[0085] The ratio between the first spacing and the second spacing may be specifically exemplified as 1:2, or 1:2.5, or 1:3, or 1:3.5, or 1:4, or 1:4.5, or 1:5, or 1:5.5, or 1:6, etc. Optionally, the third spacing is 600 μm-1900 μm, and the third spacing may be specifically exemplified as 600 μm, or 700 μm, or 800 μm, or 900 μm, or 1000 μm, or 1100 μm, or 1200 μm, or 1300 μm, or 1400 μm, or 1500 μm, or 1600 μm, or 1700 μm, or 1800 μm, or 1900 μm, etc.

[0086] If the second spacing is too large, the distance between the monitoring component 42 and the reflector 41 will be too far, the light loss received by the monitoring component 42 will be too large, and the monitoring component 42 will not be able to receive enough light beams, thereby reducing the accuracy of the light beam information and the monitoring accuracy of the monitoring component 40. If the second spacing is too small, the distance between the monitoring component 42 and the reflector 41 will be too close, and the monitoring component 42 will easily be too close to the light collecting component and the optical chip 20, which will easily cause interference between the components and damage the optical device 1.

[0087] Please refer to Figure 7 , the Y axis of the variation curve is the light loss rate received by the monitoring component 42, and the X axis is the change in the distance between the monitoring component 42 and the reflector 41. The X axis changes based on the distance between the monitoring component 42 and the reflector 41 being 1500μm. For example, when the change in the distance between the monitoring component 42 and the reflector 41 in the X axis is 0.4mm, the distance between the monitoring component 42 and the reflector 41 is 1500μm+400μm=1900μm, and the light loss rate received by the monitoring component 42 in the Y axis is 40%. Therefore, it can be seen from the variation curve that as the distance between the monitoring component 42 and the reflector 41 gradually increases, the light loss rate received by the monitoring component 42 gradually increases. This embodiment limits the second spacing to be less than or equal to 1900μm to ensure that the monitoring component 42 can receive enough light beams, thereby improving the monitoring accuracy of the monitoring component 40.

[0088] In summary, this embodiment limits the ratio between the first spacing and the second spacing to 1:(2-6), which can not only reduce the light loss received by the monitoring device 42, ensure that the monitoring device 42 can receive sufficient light beams, and improve the monitoring accuracy of the monitoring component 40, but also reduce the probability of mutual interference between the components of the optical device 1, thereby improving the reliability of the optical device 1.

[0089] Please refer to Figure 1-Figure 8In one embodiment, the light collecting component 30 also includes a beam combining group 32 disposed on the side of the coupling lens 31 away from the multiple optical chips 20, and the beam combining group 32 includes a first light incident portion 321, a first reflection portion 322, and a second light incident portion 323, the first light incident portion 321 is disposed between one of the sub-light transmitting portions 311 and the first reflection portion 322, and the second light incident portion 323 is disposed corresponding to the other sub-light transmitting portion 311.

[0090] The multiple optical chips 20 respectively emit a first light beam and a second light beam with different wavelengths; wherein the first light beam passes through one of the sub-light-transmitting portions 311 and is incident toward the first light input portion 321, the first light input portion 321 is used to receive the first light beam and make the first light beam incident to the first reflecting portion 322, the first reflecting portion 322 is used to reflect the first light beam to the second light input portion 323; the second light beam passes through another of the sub-light-transmitting portions 311 and is incident toward the second light input portion 323, the second light input portion 323 is used to receive the second light beam, and is also used to make the second light beam and the first light beam incident to the output port 13, thereby combining the first light beam and the second light beam to form the emitted light.

[0091] After passing through the coupling lens 31, the first light beam and the second light beam are in a parallel light state, and then the first light beam and the second light beam in a parallel light state are projected into the beam combining group 32. Optionally, the input port 12, the optical chip 20, the coupling lens 31, the beam combining group 32, and the output port 13 are arranged along the axial direction of the housing 10.

[0092] The first light input portion 321 is used to receive and transmit the first light beam, and the first light input portion 321 is also used to make the first light beam project to the first reflective portion 322. The first reflective portion 322 is used to reflect the first light beam to the second light input portion 323. The second light input portion 323 is used to receive and transmit the second light beam, and the second light input portion 323 is also used to receive and reflect the first light beam, and the second light input portion 323 is also used to combine the first light beam and the second light beam to form an emission light, and project it to the output port 13. Figure 8 As shown, the first beam is Figure 8 The second beam is shown as B1 in Figure 8 The emitted light is shown as B2 in Figure 8 As shown in B5.

[0093] Optionally, the first light incident portion 321 is arranged in parallel with the first reflective portion 322, and the second light incident portion 323 is arranged in parallel with the first reflective portion 322. Optionally, the plurality of optical chips 20 include a first optical chip 20 for emitting a first light beam, and a second optical chip 20 for emitting a second light beam. The plurality of sub-light-transmitting portions 311 include a first sub-light-transmitting portion 311 corresponding to the first chip, and a second sub-light-transmitting portion 311 corresponding to the second chip. The first sub-light-transmitting portion 311 is located between the first optical chip 20 and the first light incident portion 321, and the first reflective portion 322 is located on a side of the first light incident portion 321 away from the first sub-light-transmitting portion 311. The second sub-light-transmitting portion 311 is located between the second optical chip 20 and the second light incident portion 323.

[0094] In summary, this embodiment combines the first light beam and the second light beam into a beam of emitted light by setting a beam combining group 32 that cooperates with the coupling lens 31, thereby optimizing the structure, reducing the overall size of the optical device 1, simplifying the optical path, reducing the beam power loss, and improving the transmission performance of the optical device 1.

[0095] Please refer to Figure 1-Figure 7 ,and Fig. 9 In another embodiment, the optical path process of combining three light beams with different wavelengths to form an emission light is introduced. The beam combining group 32 also includes a second reflection portion 324 and a third light input portion 325. The second reflection portion 324 is arranged on the side of the second light input portion 323 away from another sub-light-transmitting portion 311, and the third light input portion 325 is arranged corresponding to another sub-light-transmitting portion 311. Multiple optical chips 20 also emit third light beams with different wavelengths. When the first light beam and the second light beam are emitted to the second light input portion 323, the second light input portion 323 is used to combine the first light beam and the second light beam and emit them to the second reflection portion 324, and the second reflection portion 324 then reflects the first light beam and the second light beam to the third light input portion 325. Then, the third light input portion 325 receives the third light beam passing through another sub-light-transmitting portion 311, and the third light input portion 325 combines the first light beam, the second light beam, and the third light beam to form an emission light, and emits it to the output port 13. As Fig. 9 As shown, the first beam is Fig. 9 The second beam is shown as B1 in Fig. 9 The third beam is shown as B2 in Fig. 9 The emitted light is shown as B3 in Fig. 9 As shown in B5.

[0096] Optionally, the second light incident portion 323 is arranged in parallel with the second reflective portion 324, and the third light incident portion 325 is arranged in parallel with the second reflective portion 324. Optionally, the plurality of optical chips 20 include a first optical chip 20 for emitting a first light beam, a second optical chip 20 for emitting a second light beam, and a third optical chip 20 for emitting a third light beam. The plurality of sub-light-transmitting portions 311 include a first sub-light-transmitting portion 311 corresponding to the first chip, a second sub-light-transmitting portion 311 corresponding to the second chip, and a third sub-light-transmitting portion 311 corresponding to the third chip. The first sub-light-transmitting portion 311 is located between the first optical chip 20 and the first light incident portion 321, and the first reflective portion 322 is located on a side of the first light incident portion 321 away from the first sub-light-transmitting portion 311. The second sub-light-transmitting portion 311 is located between the second optical chip 20 and the second light incident portion 323, and the second reflective portion 324 is located on a side of the second light incident portion 323 away from the second sub-light-transmitting portion 311. The third light-transmitting sub-portion 311 is located between the third optical chip 20 and the third light incident portion 325 .

[0097] And so on, please refer to Figure 1-Figure 7 ,and Fig.10 In another embodiment, the optical path process of combining four light beams with different wavelengths to form an emitted light is introduced. The beam combining group 32 also includes a third reflective portion 326 and a fourth light input portion 327. The third reflective portion 326 is arranged on the side of the third light input portion 325 away from another sub-light-transmitting portion 311, and the fourth light input portion 327 is arranged corresponding to another sub-light-transmitting portion 311. Multiple optical chips 20 also emit a fourth light beam with a different wavelength. When the first light beam, the second light beam, and the third light beam are incident on the third light input portion 325, the third light input portion 325 is used to combine the first light beam, the second light beam, and the third light beam and emit them to the third reflective portion 326, and the third reflective portion 326 then reflects the first light beam, the second light beam, and the third light beam to the fourth light input portion 327. Then, the fourth light incident portion 327 receives the fourth light beam passing through yet another sub-light-transmitting portion 311, and the fourth light incident portion 327 combines the first light beam, the second light beam, the third light beam, and the fourth light beam into an emission light, and emits the emission light to the output port 13. Fig.10 As shown, the first beam is Fig.10 The second beam is shown as B1 in Fig.10 The third beam is shown as B2 in Fig.10 The fourth beam is shown as B3 in Fig.10 The emitted light is shown as B4 in Fig.10 As shown in B5.

[0098] Optionally, the third light incident portion 325 is arranged in parallel with the third reflective portion 326, and the fourth light incident portion 327 is arranged in parallel with the third reflective portion 326. Optionally, the plurality of optical chips 20 include a first optical chip 20 for emitting a first light beam, a second optical chip 20 for emitting a second light beam, a third optical chip 20 for emitting a third light beam, and a fourth optical chip 20 for emitting a fourth light beam. The plurality of sub-light-transmitting portions 311 include a first sub-light-transmitting portion 311 corresponding to the first chip, a second sub-light-transmitting portion 311 corresponding to the second chip, a third sub-light-transmitting portion 311 corresponding to the third chip, and a fourth sub-light-transmitting portion 311 corresponding to the fourth chip. The first sub-light-transmitting portion 311 is located between the first optical chip 20 and the first light incident portion 321, and the first reflective portion 322 is located on a side of the first light incident portion 321 away from the first sub-light-transmitting portion 311. The second sub-light-transmitting portion 311 is located between the second optical chip 20 and the second light incident portion 323, and the second reflective portion 324 is located on a side of the second light incident portion 323 away from the second sub-light-transmitting portion 311. The third sub-light-transmitting portion 311 is located between the third optical chip 20 and the third light incident portion 325, and the third reflective portion 326 is located on a side of the third light incident portion 325 away from the third sub-light-transmitting portion 311. The fourth sub-light-transmitting portion 311 is located between the fourth optical chip 20 and the fourth light incident portion 327.

[0099] By analogy, the number and position of the light input parts, the number and position of the emitting parts, the angle between the light input parts and the horizontal plane, and the angle between the emitting parts and the horizontal plane can be adjusted according to the number of light beams to be combined to form an emitted light and product requirements to obtain a combined emitted light.

[0100] Please refer to Figure 8-Figure 10 In one embodiment, the beam combining group 32 also includes a fixing member 328, and the fixing member 328 includes a first inner wall 3281 and a second inner wall 3282 that are relatively arranged, the first inner wall 3281 is closer to the coupling lens 31 than the second inner wall 3282, the first inner wall 3281 and the second inner wall surface are both inclined, the first light incident portion 321 and the second light incident portion 323 are fixed to the first inner wall 3281, and the first reflecting portion 322 is fixed to the second inner wall 3282.

[0101] The fixing member 328 has a housing space, and the first light incident portion 321, the first reflective portion 322, and the second light incident portion 323 are all arranged on the cavity wall of the housing space, and the cavity wall of the housing space includes a first inner side wall 3281 and a second inner side wall 3282. Optionally, the first light incident portion 321, the second light incident portion 323, the third light incident portion 325, and the fourth light incident portion 327 are all arranged on the first inner side wall 3281, and are arranged in sequence. The first reflective portion 322, the second reflective portion 324, and the third reflective portion 326 are all arranged on the second inner side wall 3282, and are arranged in sequence. Among them, the connection method between the first light incident portion 321, the first reflective portion 322, and the second light incident portion 323 and the fixing member 328 can be an adhesive connection, a snap connection, a threaded connection, etc., which is not limited in this embodiment. The connection method between the fixing member 328 and the housing 10 can be an adhesive connection, a snap connection, a threaded connection, etc., which is not limited in this embodiment.

[0102] The first inner side wall 3281 is provided with a light inlet, the first light inlet portion 321 is arranged corresponding to the light inlet, and the second light inlet portion 323 is arranged corresponding to the light inlet. The light beam passing through the coupling lens 31 can be emitted from the light inlet to the first light inlet portion 321, and the light beam passing through the coupling lens 31 can also be emitted from the light inlet to the second light inlet portion 323. For example, the light inlet can be a through hole passing through the first inner side wall 3281, or a perspective window for allowing the light beam to pass through. The second inner side wall 3282 is provided with a light outlet, and the light outlet is arranged corresponding to the output port 13, and the light outlet is arranged corresponding to the second light inlet portion 323. The first light beam and the second light beam are combined to form an emitted light that is emitted from the light outlet to the output port 13. For example, the light outlet can be a through hole passing through the second inner side wall 3282, or a perspective window for allowing the light beam to pass through. It should be noted that the light inlet and the light outlet are in Figure 8 Not shown in the figure.

[0103] The first inner side wall 3281 and the second inner side wall 3282 are both inclined. In other words, there is a first angle between the extension direction of the first inner side wall 3281 and the vertical direction, and there is a second angle between the extension direction of the second inner side wall 3282 and the vertical direction. The shape of the fixing member 328 can also be approximately understood as a parallelogram, or a nearly parallelogram. Optionally, the first angle is equal to the second angle, in other words, the inclination direction of the first inner side wall 3281 is the same as the inclination direction of the second inner side wall 3282. The vertical direction is a direction perpendicular to the horizontal plane.

[0104] In summary, this embodiment can not only optimize the structure and improve the integration performance of the optical device 1, but also reduce the number of components that need to be assembled and the difficulty of assembling the optical device 1, by placing multiple light input parts and reflection parts in the fixing part 328, and reduce the overall size of the optical device 1, thereby providing more available space for other components; and by installing the light input part on the first inner wall 3281 and the reflection part on the second inner wall 3282, a beam combining group 32 can be obtained, which reduces the difficulty of assembling the beam combining group 32 and improves the yield rate of the optical device 1.

[0105] Please refer to Figure 8-Figure 10 In one embodiment, there is a first angle between the extension direction of the first inner side wall 3281 and the vertical direction, and there is a second angle between the extension direction of the second inner side wall 3282 and the vertical direction, and the first angle and the second angle are both 3°-20°.

[0106] The vertical direction is the direction perpendicular to the horizontal plane. Figure 8 As shown in α. Among them, the angle between the extension direction of the first light incident portion 321 and the vertical direction is equal to the first angle. The angle between the extension direction of the second light incident portion 323 and the vertical direction is equal to the first angle. The angle between the extension direction of the first reflective portion 322 and the vertical direction is equal to the second angle. Optionally, the first angle is equal to the second angle; or, the first angle is not equal to the second angle. Specifically, for example, the first angle can be 3°, or 5°, or 8°, or 10°, or 12°, or 15°, or 18°, or 20°, etc.; the second angle can be 3°, or 5°, or 8°, or 10°, or 12°, or 15°, or 18°, or 20°, etc.

[0107] In summary, this embodiment limits the range of the first angle and the second angle, thereby limiting the inclination degree of the first inner wall 3281 and the second inner wall 3282, thereby limiting the inclination degree of the first light incident portion 321, the first reflection portion 322, and the second reflection portion 324, so that multiple light beams in a parallel light state can be combined to form emitted light after passing through the beam combining group 32.

[0108] Please refer to Figure 1 and Figure 3 In one embodiment, the optical device 1 further includes a base 51 disposed in the receiving space 11, and the plurality of optical chips 20 are fixed to the base 51, and the plurality of optical chips 20 are arranged in parallel and at intervals.

[0109] The base 51 is fixed to the housing 10. The base 51 and the housing 10 may be connected by bonding, snap-fitting, threaded connection, etc., which is not limited in this embodiment. The plurality of optical chips 20 and the base 51 may be connected by bonding, snap-fitting, threaded connection, etc., which is not limited in this embodiment.

[0110] In summary, the present embodiment fixes the optical chip 20 by setting the base 51, thereby improving the connection performance between the optical chip 20 and the housing 10, so that the optical chip 20 is firmly fixed in the housing 10, and the reliability of the optical device 1 is improved. In addition, the present embodiment also defines the arrangement of the optical chip 20, which can not only make the propagation directions of multiple light beams in a parallel light state the same, thereby reducing the difficulty of combining multiple light beams to form a beam of emitted light, but also reduce the probability of mutual interference between multiple light beams, thereby further improving the reliability of the optical device 1.

[0111] Please refer to Figure 1-Figure 12 In one embodiment, the optical device 1 also includes an optical fiber 52 and a receiving element 53 arranged on one side of the shell 10, the optical fiber 52 is used to receive the emitted light emitted from the output port 13, the optical fiber 52 is also used to emit incident light, and the receiving element 53 is used to receive the incident light.

[0112] The receiving element 53 can also be called a receiving chip. The receiving element 53 can receive light and convert it into current. For example, each receiving element 53 can receive a light beam of one wavelength. For another example, the receiving element 53 can receive light beams of multiple different wavelengths. Specifically, the wavelength of the light beam received by the receiving element 53 can be 1270nm, 1286nm, or 1310nm. The optical path diagram of the emitted light is shown in FIG. Fig.11 As shown in FIG. 1 , the emitted light B5 emitted from the output port 13 is received by the optical fiber 52. The optical path diagram of the incident light is shown in FIG. Fig.12 As shown, the emitted light B6 emitted by the light beam is received by the receiving element 53 .

[0113] The number of receiving components 53 may be one or more. Optionally, the receiving component 53 may be an optoelectronic chip, an optoelectronic conversion structure, etc. Optionally, the optical fiber 52 is connected to the housing 10, for example, the optical fiber 52 is directly mounted on the housing 10, and for another example, the optical fiber 52 is connected to the housing 10 through other components. When the housing 10 is coupled with the optical fiber 52, the light source signal can be transmitted with other devices to achieve optoelectronic conversion. Optionally, the receiving component 53 is closer to the housing 10 than the optical fiber 52. Optionally, the receiving component 53 and the optical fiber 52 are arranged on the same side of the housing 10. Optionally, the receiving component 53 and the optical fiber 52 are arranged in parallel and at intervals.

[0114] In summary, this embodiment realizes the reception of the transmitted light signal and the transmission of the incident light signal by providing the optical fiber 52 and the receiving element 53, thereby simplifying the process of optical communication and greatly reducing the assembly cost and material cost.

[0115] Please refer to Figure 1-Figure 12 In one embodiment, the number of the receiving elements 53 is multiple, and the multiple receiving elements 53 are arranged between the output port 13 and the optical fiber 52, and the multiple receiving elements 53 are arranged in parallel and at intervals along the arrangement direction from the output port 13 to the optical fiber 52.

[0116] A plurality of receiving elements 53 are arranged in parallel and at intervals, and each receiving element 53 is used to receive light beams of different wavelengths. Specifically, for example, the number of receiving elements 53 is 2, 3, 4, 5, 6, etc. Optionally, the number of receiving elements 53 is equal to the number of optical chips 20.

[0117] In summary, this embodiment optimizes the optical path by limiting the position and arrangement of the receiving elements 53 , thereby reducing the probability of mutual interference between the receiving elements 53 , reducing light beam power loss, and improving the transmission performance of the optical device 1 .

[0118] Furthermore, the optical fiber 52 can transmit the incident light to the multiple receiving elements 53 in the form of parallel light, thereby reducing the divergence of the light path, further reducing the light beam power loss, and further improving the transmission performance of the optical device 1 .

[0119] Please refer to Figure 1-Figure 12 In one embodiment, the optical device 1 further includes a focusing element 54 , which is disposed between the output port 13 and the optical fiber 52 , and is used to receive and focus the emitted light, and to allow the focused emitted light to be emitted to the optical fiber 52 .

[0120] The light concentrator 54 is used to gather scattered light. For example, the light concentrator 54 is a convex lens, a concave lens, etc. Optionally, the output port 13, the light concentrator 54, and the optical fiber 52 are arranged in parallel and at intervals. Optionally, the central axes of the output port 13, the light concentrator 54, and the optical fiber 52 coincide. Optionally, the light concentrator 54 is arranged between the receiving member 53 and the optical fiber 52. For example, the receiving member 53, the light concentrator 54, and the optical fiber 52 are arranged in parallel and at intervals.

[0121] In summary, in this embodiment, the light focusing element 54 is provided to focus the emitted light, thereby increasing the intensity of the light source signal, reducing the light beam power loss, and improving the transmission performance of the optical device 1 .

[0122] Please refer to Figure 1-Figure 12In one embodiment, the optical device 1 further includes an isolator 55 , which is disposed between the output port 13 and the optical fiber 52 , and is used to block the light beams reflected back to the multiple optical chips 20 through the light collecting component 30 .

[0123] The isolator 55 is used to block the reflected light, thereby blocking the light beam reflected back to the optical chip 20 through the light collecting component 30. The isolator 55 is also used to transmit the emitted light, and the emitted light emitted from the output port 13 passes through the isolator 55 and is emitted to the optical fiber 52. Optionally, the isolator 55 is arranged between the output port 13 and the receiving element 53. Optionally, the output port 13, the isolator 55, the receiving element 53, the light focusing element 54, and the optical fiber 52 are arranged in parallel and at intervals. Optionally, the central axes of the output port 13, the isolator 55, the receiving element 53, the light focusing element 54, and the optical fiber 52 coincide.

[0124] In summary, this embodiment prevents reflected light from being reflected back to the optical chip 20 and from interfering with the optical chip 20 by providing the isolation member 55 , thereby protecting the optical chip 20 and improving the reliability and accuracy of the optical device 1 .

[0125] Unless otherwise specified or there is a contradiction, the terms and phrases used in this application have the following meanings:

[0126] In this application, "first", "second", etc. are used only for descriptive purposes and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features.

[0127] In this application, "one or several" refers to any one, any two or more of the listed items. Among them, "several" refers to any two or more of the listed items.

[0128] In the present application, it is necessary to understand that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0129] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be connected, detachably connected, or integrated. It can be mechanically connected or electrically connected. It can be directly connected or indirectly connected through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0130] Mentioning "embodiment" and "implementation method" in this application means that the specific features, structures or characteristics described in conjunction with the embodiment may be included in at least one embodiment of the present application. The appearance of the phrases in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described in this application can be combined with other embodiments. In addition, it should also be understood that the features, structures or characteristics described in the various embodiments of the present application can be arbitrarily combined to form another embodiment that does not deviate from the spirit and scope of the technical solution of the present application, provided that there is no contradiction between them.

[0131] The above is part of the implementation methods of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications are also considered to be within the scope of protection of the present application.

Claims

1. An optical device, characterized in that: The optical device comprises: A housing having a receiving space, wherein the housing further has an input port and an output port communicating with the receiving space; A plurality of optical chips are disposed in the receiving space, each of the optical chips is used to emit a light beam of a different wavelength, and the plurality of optical chips are all connected to the input port; a light collecting component, disposed in the receiving space and between the plurality of optical chips and the output port; the light collecting component is used to receive the plurality of light beams emitted by the plurality of optical chips, make the plurality of light beams parallel light, and then combine the plurality of light beams to form emission light, and the emission light is emitted from the output port; and A monitoring component is arranged in the receiving space, and the monitoring component includes a reflecting component and a monitoring component. The reflecting component is arranged between the multiple optical chips and the light collecting component, and the monitoring component is arranged in the shell; the light beams emitted by some of the optical chips are in a divergent light state, and the reflecting component is used to reflect the light beams emitted from the optical chips in a divergent light state to the monitoring component, and the monitoring component is used to receive the light beams from the reflecting component and obtain the light beam information of the light beams.

2. The optical device according to claim 1, characterized in that The light collecting component includes a coupling lens arranged on one side of the multiple optical chips, and the coupling lens includes a plurality of sub-light-transmitting portions arranged in parallel and at intervals, one of the sub-light-transmitting portions is arranged corresponding to one of the optical chips, and the sub-light-transmitting portions are used to receive the light beam emitted by the optical chip and make the light beam in a parallel light state.

3. The optical device according to claim 2, characterized in that: The number of the reflective elements is the same as the number of the optical chips, the number of the monitoring elements is the same as the number of the optical chips, one reflective element is arranged between one optical chip and one sub-light-transmitting portion, a plurality of the reflective elements are arranged in parallel and at intervals, one monitoring element corresponds to one reflective element, and a plurality of the monitoring elements are arranged in parallel and at intervals.

4. The optical device according to claim 3, characterized in that The monitoring component further includes a blocking member, which is disposed between two adjacent reflecting members and is used to block light beams emitted from non-corresponding optical chips from reaching the reflecting members.

5. The optical device according to claim 4, characterized in that: The monitoring component also includes an electrically connected controller and a temperature sensor, the barrier is used to absorb light, the temperature sensor is used to obtain temperature information of the barrier, and the controller is used to receive the temperature information of the barrier and control the multiple optical chips.

6. The optical device according to claim 2, characterized in that: The reflecting component includes a reflecting surface for reflecting the light beam, and the monitoring component includes a receiving surface for receiving the light beam. The angle between the reflecting surface and the receiving surface is greater than or equal to 30° and less than 45°.

7. The optical device according to claim 2, characterized in that: The distance between the optical chip and the reflector is a first distance, and the first distance is 250 μm-350 μm.

8. The optical device according to claim 2, characterized in that: The distance between the optical chip and the reflective element is a first distance, the distance between the reflective element and the monitoring element is a second distance, and the ratio between the first distance and the second distance is 1:(2-6).

9. The optical device according to claim 2, characterized in that: The light collecting component further includes a beam combining group disposed on a side of the coupling lens away from the plurality of optical chips, the beam combining group including a first light incident portion, a first reflecting portion, and a second light incident portion, the first light incident portion being disposed between one of the sub-light-transmitting portions and the first reflecting portion, and the second light incident portion being disposed correspondingly to another of the sub-light-transmitting portions; The multiple optical chips respectively emit a first light beam and a second light beam with different wavelengths; wherein the first light beam passes through one of the sub-light-transmitting portions and is incident toward the first light input portion, the first light input portion is used to receive the first light beam and make the first light beam incident to the first reflecting portion, and the first reflecting portion is used to reflect the first light beam to the second light input portion; the second light beam passes through another of the sub-light-transmitting portions and is incident toward the second light input portion, the second light input portion is used to receive the second light beam, and is also used to make the second light beam and the first light beam incident to the output port, thereby combining the first light beam and the second light beam to form the emitted light.

10. The optical device according to claim 9, characterized in that: The beam combining group also includes a fixing member, which includes a first inner side wall and a second inner side wall that are arranged opposite to each other, the first inner side wall is closer to the coupling lens than the second inner side wall, the first inner side wall and the second inner side wall are both inclined, the first light incident portion and the second light incident portion are fixed to the first inner side wall, and the first reflecting portion is fixed to the second inner side wall.

11. The optical device according to claim 10, characterized in that: There is a first angle between the extension direction of the first inner side wall and the vertical direction, there is a second angle between the extension direction of the second inner side wall and the vertical direction, and both the first angle and the second angle are 3°-20°.

12. The optical device according to claim 1, characterized in that: The optical device also includes a base arranged in the receiving space, the multiple optical chips are fixed on the base, and the multiple optical chips are arranged in parallel and at intervals.

13. The optical device according to claim 1, characterized in that: The optical device further comprises an optical fiber and a receiving element arranged on one side of the housing, wherein the optical fiber is used to receive the emitted light emitted from the output port, and the optical fiber is also used to emit incident light, and the receiving element is used to receive the incident light.

14. The optical device according to claim 13, characterized in that: There are multiple receiving elements, and the multiple receiving elements are arranged between the output port and the optical fiber. The multiple receiving elements are arranged in parallel and at intervals along the arrangement direction from the output port to the optical fiber.

15. The optical device according to claim 13, characterized in that: The optical device further comprises a light concentrator, which is arranged between the output port and the optical fiber. The light concentrator is used to receive and concentrate the emitted light, and also allows the concentrated emitted light to be emitted to the optical fiber.

16. The optical device according to claim 13, characterized in that: The optical device further comprises an isolator, which is arranged between the output port and the optical fiber, and is used to block the light beams reflected back to the plurality of optical chips through the light collecting component.

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