Storage device for wafer transportation
By designing a storage device for wafer transportation that includes a variety of mechanisms such as supporting guide mechanisms and isolation mechanisms, the sliding friction problem caused by vibration during the transportation process is solved, and the non-destructive transportation of the wafer surface is achieved.
Patent Information
- Application Number
- CN202411379048.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-29
- Publication Date
- 2025-02-11
AI Technical Summary
In semiconductor production, wafers are prone to sliding friction during storage and transportation due to vibration, resulting in surface wear. The prior art is difficult to effectively prevent this situation.
A storage device for wafer transportation is designed, including a supporting guide mechanism, an isolation mechanism, an isometric scaling mechanism, a zoom adjustment mechanism, an isolation protection mechanism and a pressing mechanism. Through the synergy of these mechanisms, the gap between the isolation clamps can be adjusted, the wafer can be clamped stably, and the sliding friction can be avoided.
It effectively prevents sliding friction caused by vibration during transportation, avoids wafer surface wear, and ensures a close fit between the wafer and the device.
Smart Images
Figure CN119419151A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of semiconductor technology, in particular to a storage device for wafer transportation. Background Art
[0002] A wafer refers to a silicon chip used to make silicon semiconductor circuits. Its original material is silicon. High-purity polycrystalline silicon is dissolved and doped with silicon crystal seeds, which are then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing, and slicing, the silicon crystal rod forms a silicon wafer, or wafer.
[0003] During semiconductor production, batches of wafers generally need to be transported. Generally, wafers are stored in grooves to place them individually or directly stacked. However, the stacked wafers are too smooth and can easily slide between wafers. In order to ensure the placement and removal of wafers, it is difficult for independently placed wafers to fit tightly into the storage device. During transportation, the wafers can easily cause sliding friction inside the storage device due to vibration, which can easily cause wear on the wafer surface. Summary of the invention
[0004] In view of the deficiencies in the prior art, the present invention provides a storage device for wafer transportation, which solves the problems mentioned in the above background.
[0005] The present invention provides the following technical solution: a storage device for wafer transportation, comprising: a supporting and guiding mechanism, an isolation mechanism is installed inside the supporting and guiding mechanism, an equidistant scaling mechanism is arranged between the supporting and guiding mechanism and the isolation mechanism, a scaling adjustment mechanism is installed on the surface of the supporting and guiding mechanism, an isolation and protection mechanism is arranged on the surface of the supporting and guiding mechanism, and a pressing mechanism is arranged on the top of the supporting and guiding mechanism.
[0006] Preferably, the supporting and guiding mechanism includes side connecting plates, supporting slides, enclosing side plates and passing grooves, the number of the side connecting plates is two, and the two side connecting plates are relatively distributed, the number of the supporting slides is four, and the four supporting slides are fixedly connected between the two side connecting plates, and the four side connecting plates are distributed in parallel, the number of the enclosing side plates is two, and the two enclosing side plates are fixedly connected between the two side connecting plates, and the two enclosing side plates are distributed in parallel, and the passing grooves are opened on both sides of the enclosing side plates.
[0007] Preferably, the isolation mechanism includes a bottom support slide column, an isolation splint, a plate sliding hole, a buffer anti-skid pad, an anti-tightening block and a plate sliding mouth, the bottom support slide column is fixedly inserted between the two side connecting plates, and the number of the bottom support slide columns is two, and the two bottom support slide columns are distributed in parallel, the isolation splint is slidably connected to the surface of the bottom support slide column through the plate sliding hole, and the number of the isolation splints is multiple, and the multiple isolation splints are distributed in parallel, the buffer anti-skid pad is fixedly connected to both sides of the isolation splint, the anti-tightening block is integrally arranged at the four corners of the isolation splint, and the plate sliding mouth is opened through both sides of the isolation splint.
[0008] Preferably, the equidistant zoom mechanism includes a zoom synchronization spring, a protective sleeve, a connecting shell and a rotating shaft. The zoom synchronization spring is movably sleeved on the surface of the supporting slide cylinder, and the number of the zoom synchronization springs is four, and every two zoom synchronization springs form a group, and the two groups of zoom synchronization springs are relatively distributed, the protective sleeve is fixedly sleeved on the surface of the zoom synchronization spring, the connecting shell is fixedly sleeved on the surface of the protective sleeve, and the number of connecting shells is multiple, and the rotating shaft is fixedly installed on the surface of the connecting shell.
[0009] Preferably, the connecting shell is rotatably connected to the isolation splint via a rotating shaft, and the number of rotating shafts on the surface of each isolation splint is four, and every two rotating shafts form a group, and the two groups of rotating shafts are respectively located on both sides of the isolation splint.
[0010] Preferably, the scaling adjustment mechanism includes a parallel frame, an extrusion block, a guide slide hole, a threaded barrel, a pressure groove, a bidirectional threaded column and a torsion wheel. The number of the parallel frames is two, and the two parallel frames are both arranged on the surface of the supporting slide barrel, the extrusion block is fixedly connected to one side of the parallel frame, the guide slide hole is opened on both sides of the parallel frame and both sides of the extrusion block, and the parallel frame and the extrusion block are both slidably connected to the supporting slide barrel through the guide slide hole, the threaded barrel is fixedly connected to the inside of the parallel frame, the pressure groove is embedded in the side of the extrusion block away from the parallel frame, the surfaces of both ends of the protective sleeve are fixedly connected to the inner wall of the pressure groove, the bidirectional threaded column is rotatably connected between the two side connecting plates through a bearing, and the outer wall of the bidirectional threaded column is threadedly connected to the inner wall of the threaded barrel.
[0011] Preferably, the outer wall of the enclosed side plate is slidably connected to the inner wall of the plate sliding opening, and the parallel connection frame is located inside the through groove.
[0012] Preferably, the isolation and protection mechanism includes a box shell, an embedded groove, a holding groove, a bottom plate, an exhaust fan, a lifting foot and a buffer pad. The box shell is fixedly mounted on the surfaces of the two side connecting plates, the embedded groove is embedded in one side of the box shell, the twist wheel is located inside the embedded groove, the holding groove is embedded in both sides of the box shell, the bottom plate is fixedly connected to the inner wall of the bottom of the box shell, the exhaust fan is fixedly mounted in the middle of the bottom plate, and a dust-proof ventilation net is fixedly mounted on the lower surface of the exhaust fan, the lifting feet are integrally arranged at the four corners of the bottom of the bottom plate, and the buffer pad is fixedly fitted to the bottom of the lifting feet.
[0013] Preferably, the isolation and protection mechanism also includes a dust exhaust port, a cover plate, a slot, a block and an isolation platform. The dust exhaust port is opened through the surface of the base plate, the cover plate is rotatably connected to the inner wall of the dust exhaust port, the slot is embedded in one side of the cover plate, the block is integrally arranged on the inner wall of the dust exhaust port, the isolation platform is fixedly connected to the upper surface of the base plate, and a dust leakage hole is opened through the surface of the isolation platform.
[0014] Preferably, the clamping mechanism includes a top frame plate, a pressure rib, a spring sheet, a buffer pressure sleeve and an inner convex portion, the top frame plate is fixedly connected to the upper surfaces of the two side connecting plates, the pressure rib is rotatably connected to the upper surface of the top frame plate, and the number of the pressure ribs is two, and the two pressure ribs are relatively distributed, the spring sheet is fixedly connected to the upper surface of the top frame plate, the buffer pressure sleeve is fixedly sleeved on the surface of the pressure rib, the inner convex portion is integrally arranged inside the pressure rib, and the surface of the spring sheet is slidably connected to the surface of the inner convex portion.
[0015] Compared with the prior art, the present invention has the following beneficial effects:
[0016] 1. The storage device for wafer transportation, through the support and guiding mechanism, isolation mechanism, equidistant scaling mechanism, scaling adjustment mechanism, isolation protection mechanism and pressing mechanism, can adjust the scaling of the equidistant scaling mechanism through the scaling adjustment mechanism, and then indirectly adjust the size of the gap between the isolation clamps inside the isolation mechanism, so as to ensure that the wafer can be stably clamped when storing the wafer, ensure that the wafer and the device are closely fitted, and avoid the wafer surface wear caused by sliding friction due to vibration during transportation.
[0017] 2. The storage device for wafer transportation is equipped with side connecting plates, supporting slides, enclosing side plates and through grooves to form a stable support for the scaling synchronization spring to prevent the scaling synchronization spring from twisting and deforming outward when it contracts. At the same time, it can assist the isolation clamp to enclose the wafer to ensure protection and limitation of the wafer side.
[0018] 3. The wafer transport storage device can form isolation between each wafer by means of the bottom support slide column, isolation clamp, plate slide hole, buffer anti-skid pad, anti-tight block and plate slide mouth, so as to avoid mutual friction between adjacent wafers, and at the same time fix and buffer the surface of each wafer.
[0019] 4. The wafer transport storage device is provided with a zoom synchronization spring, a protective sleeve, a connecting shell and a rotating shaft, so that when the zoom synchronization spring contracts, the distance between each position can be close to the synchronous zooming characteristic to ensure that the gaps between each isolation clamp can be opened and shrunk nearly synchronously.
[0020] 5. The storage device for wafer transportation can form peripheral protection for the device through the box shell, embedded groove, holding groove, bottom plate, exhaust fan and lifting feet, and can clean the inside of the box shell by generating wind pressure through the exhaust fan before storing the wafer.
[0021] 6. The wafer transport storage device can open the cover at any time to clean the dust inside the device through the provided buffer pad, dust exhaust port, cover, card slot, card block and isolation table, so as to ensure the cleanliness of the inside of the device.
[0022] 7. The storage device for wafer transportation, through the top frame plate, pressure ribs, spring sheets, buffer pressure sleeves and inner convex parts, can press down the top of the wafer through the pressure ribs after the wafer is placed, so as to further ensure the stability of the wafer after placement. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] Figure 1 It is a schematic diagram of the structure of the present invention;
[0024] Figure 2 It is a front cross-sectional view of the present invention;
[0025] Figure 3 It is a side sectional view of the present invention;
[0026] Figure 4 This is a schematic diagram of the internal structure of the support and guide mechanism of the present invention;
[0027] Figure 5 A bottom view of the internal structure of the support and guide mechanism of the present invention;
[0028] Figure 6 This is a schematic diagram of the internal explosion structure of the support and guide mechanism of the present invention;
[0029] Figure 7 It is a schematic diagram of the structure of the pressing mechanism of the present invention;
[0030] Figure 8 This is a schematic diagram of the explosion structure at the bottom plate of the present invention;
[0031] Fig. 9It is a schematic diagram of the connection structure between the isometric zoom mechanism and the zoom adjustment mechanism of the present invention;
[0032] Fig.10 It is a schematic diagram of the connection structure between the isolation mechanism and the isometric zoom mechanism of the present invention;
[0033] Fig.11 It is a schematic diagram of the structure of the isolation splint position of the present invention;
[0034] Fig.12 It is a schematic diagram of the structure of the isometric zoom mechanism of the present invention.
[0035] In the figure: 101, side plate; 102, support slide; 103, enclosed side plate; 104, through groove; 201, bottom support slide column; 202, isolation splint; 203, plate slide hole; 204, buffer anti-skid pad; 205, anti-tightening block; 206, plate slide; 301, zoom synchronization spring; 302, protective sleeve; 303, connecting shell; 304, rotating shaft; 401, parallel frame; 402, extrusion block; 403, guide slide hole; 404, threaded cylinder ; 405, pressing groove; 406, two-way threaded column; 407, twist wheel; 501, box shell; 502, embedded groove; 503, holding groove; 504, bottom plate; 505, exhaust fan; 506, lifting foot; 507, buffer pad; 508, dust outlet; 509, cover plate; 510, card slot; 511, card block; 512, isolation table; 601, top frame plate; 602, pressing rib; 603, spring leaf; 604, buffer pressure sleeve; 605, inner convex part. DETAILED DESCRIPTION
[0036] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0037] See also Figure 1-12A storage device for wafer transportation comprises: a supporting and guiding mechanism, an isolating mechanism installed inside the supporting and guiding mechanism, an equidistant scaling mechanism arranged between the supporting and guiding mechanism and the isolating mechanism, a scaling adjustment mechanism installed on the surface of the supporting and guiding mechanism, an isolating and protecting mechanism arranged on the surface of the supporting and guiding mechanism, and a pressing mechanism arranged on the top of the supporting and guiding mechanism. By means of the supporting and guiding mechanism, the isolating mechanism, the equidistant scaling mechanism, the scaling adjustment mechanism, the isolating and protecting mechanism and the pressing mechanism, the scaling of the equidistant scaling mechanism can be adjusted through the scaling adjustment mechanism, and then the size of the gap between the isolating clamps 202 inside the isolating mechanism can be indirectly adjusted, so as to ensure that the wafer can be stably clamped when storing the wafer, ensure that the wafer is closely fitted to the device, and avoid the surface wear of the wafer caused by sliding friction due to vibration during transportation.
[0038] Among them; the supporting and guiding mechanism includes a side connecting plate 101, a supporting slide 102, an enclosing side plate 103 and a through groove 104, the number of the side connecting plates 101 is two, and the two side connecting plates 101 are relatively distributed, the number of the supporting slide 102 is four, and the four supporting slides 102 are fixedly connected between the two side connecting plates 101, and the four side connecting plates 101 are distributed in parallel, the number of the enclosing side plates 103 is two, and the two enclosing side plates 103 are fixedly connected between the two side connecting plates 101, and the two enclosing side plates 103 are distributed in parallel, and the through groove 104 is opened on both sides of the enclosing side plate 103, through the side connecting plates 101, the supporting slide 102, the enclosing side plates 103 and the through groove 104, so as to form a stable support for the scaling synchronization spring 301, avoid the outward twisting and deformation of the scaling synchronization spring 301 when it contracts, and at the same time, it can assist the isolation clamping plate 202 to form an enclosure for the wafer, to ensure the protection and limitation of the wafer side.
[0039] The isolation mechanism includes a bottom support column 201, an isolation splint 202, a plate sliding hole 203, a buffer anti-skid pad 204, an anti-tightening block 205 and a plate sliding opening 206. The bottom support column 201 is fixedly inserted between the two side connecting plates 101, and the number of the bottom support column 201 is two, and the two bottom support columns 201 are arranged in parallel. The isolation splint 202 is slidably connected to the surface of the bottom support column 201 through the plate sliding hole 203, and the number of the isolation splint 202 is multiple, and the multiple isolation splints 202 are arranged in parallel. The buffer and anti-skid pads 204 are fixedly connected to both sides of the isolation clamping plate 202, the anti-tightening blocks 205 are integrally arranged at the four corners of the isolation clamping plate 202, and the plate sliding openings 206 are opened on both sides of the isolation clamping plate 202. Through the bottom support sliding column 201, the isolation clamping plate 202, the plate sliding hole 203, the buffer and anti-skid pads 204, the anti-tightening blocks 205 and the plate sliding openings 206, isolation can be formed between each wafer to avoid friction between adjacent wafers, and at the same time, the surface of each wafer is fixed and buffered.
[0040] Among them; the equidistant scaling mechanism includes a scaling synchronization spring 301, a protective sleeve 302, a connecting shell 303 and a rotating shaft 304, the scaling synchronization spring 301 is movably sleeved on the surface of the supporting slide 102, and the number of the scaling synchronization springs 301 is four, and every two scaling synchronization springs 301 are a group, and the two groups of scaling synchronization springs 301 are relatively distributed, the protective sleeve 302 is fixedly sleeved on the surface of the scaling synchronization spring 301, the connecting shell 303 is fixedly sleeved on the surface of the protective sleeve 302, and the number of the connecting shells 303 is multiple, and the rotating shaft 304 is fixedly installed on the surface of the connecting shell 303, through the setting of the scaling synchronization spring 301, the spacing of each position can be close to the synchronous scaling when the scaling synchronization spring 301 is contracted to ensure that the gap between each isolation splint 202 can be opened and shrunk nearly synchronously.
[0041] Among them; the connecting shell 303 is rotatably connected to the isolation splint 202 through the rotating shaft 304, and the number of the rotating shafts 304 on the surface of each isolation splint 202 is four, and every two rotating shafts 304 form a group, and the two groups of rotating shafts 304 are respectively located on both sides of the isolation splint 202, so that each isolation splint 202 is positioned through two rotating axes to ensure that the surface connecting shell 303 can be slightly tilted with it when the scaling synchronization spring 301 is scaled.
[0042] The zoom adjustment mechanism includes a parallel frame 401, an extrusion block 402, a guide slide hole 403, a threaded cylinder 404, a pressing groove 405, a two-way threaded threaded column 406 and a torsion wheel 407. The number of parallel frames 401 is two, and the two parallel frames 401 are both arranged on the surface of the support slide 102. The extrusion block 402 is fixedly connected to one side of the parallel frame 401. The guide slide hole 403 runs through both sides of the parallel frame 401 and the extrusion block 402. The parallel frame 401 and the extrusion block 402 are connected to the support slide through the guide slide hole 403. 102 is slidably connected, the threaded cylinder 404 is fixedly connected to the inside of the parallel frame 401, the pressing groove 405 is embedded in the side of the extrusion block 402 away from the parallel frame 401, the surfaces at both ends of the protective sleeve 302 are fixedly connected to the inner wall of the pressing groove 405, the two-way threaded column 406 is rotatably connected between the two side connecting plates 101 through a bearing, and the outer wall of the two-way threaded column 406 is threadedly connected to the inner wall of the threaded cylinder 404, so that the spacing between the isolation clamps 202 inside the device can be adjusted by twisting the twist wheel 407 from the outside of the device.
[0043] The outer wall of the enclosed side plate 103 is slidably connected to the inner wall of the plate slide 206, and the connecting frame 401 is located inside the groove 104 to prevent the enclosed side plate 103 from affecting the sliding of the isolation splint 202 and the connecting frame 401 activities.
[0044] The isolation and protection mechanism includes a box shell 501, an embedded groove 502, a holding groove 503, a bottom plate 504, an exhaust fan 505, a lifting foot 506 and a buffer pad 507. The box shell 501 is fixedly installed on the surface of the two side connecting plates 101, the embedded groove 502 is embedded in one side of the box shell 501, the twist wheel 407 is located inside the embedded groove 502, the holding groove 503 is embedded in both sides of the box shell 501, the bottom plate 504 is fixedly connected to the inner wall of the bottom of the box shell 501, and the exhaust fan 505 is fixedly installed on the bottom plate 504. The box shell 501 includes a box body and a top cover. Through the box shell 501, the embedded groove 502, the holding groove 503, the bottom plate 504, the exhaust fan 505 and the lifting foot 506, the device can be protected from the outside, and the exhaust fan 505 can generate wind pressure to clean the inside of the box shell 501 before storing the wafer.
[0045] Among them; the isolation and protection mechanism also includes a dust exhaust port 508, a cover plate 509, a slot 510, a block 511 and an isolation platform 512. The dust exhaust port 508 is opened through the surface of the bottom plate 504, the cover plate 509 is rotatably connected to the inner wall of the dust exhaust port 508, the slot 510 is embedded on one side of the cover plate 509, the block 511 is integrally arranged on the inner wall of the dust exhaust port 508, the isolation platform 512 is fixedly connected to the upper surface of the bottom plate 504, and a dust leakage hole is opened through the surface of the isolation platform 512. Through the provided buffer pad 507, dust exhaust port 508, cover plate 509, slot 510, block 511 and isolation platform 512, the cover plate 509 can be opened at any time to clean the dust falling inside the device to ensure the cleanliness of the inside of the device.
[0046] Wherein; the pressing mechanism includes a top frame plate 601, a pressure rib 602, a spring 603, a buffer pressure sleeve 604 and an inner convex portion 605, the top frame plate 601 is fixedly connected to the upper surface of the two side connecting plates 101, the pressure rib 602 is rotatably connected to the upper surface of the top frame plate 601, and the number of the pressure rib 602 is two, and the two pressure ribs 602 are relatively distributed, the spring 603 is fixedly connected to the upper surface of the top frame plate 601, the buffer pressure sleeve 604 is fixedly sleeved on the surface of the pressure rib 602, and the inner convex portion 6 05 is integrally arranged inside the pressure rib 602, and the surface of the spring 603 is slidably connected with the surface of the inner protrusion 605. Through the arranged top frame plate 601, pressure rib 602, spring 603, buffer sleeve 604 and inner protrusion 605, the pressure rib 602 can be used to press down the top of the wafer after the wafer is placed, so as to further ensure the stability of the wafer after placement. When the top cover of the box shell 501 is closed, the buffer sleeve 604 can be used as a buffer between the top cover and the wafer.
[0047] Working principle: when in use, first open the top cover of the box shell 501, and then start the exhaust fan 505. The exhaust fan 505 generates wind pressure to pump the air at the bottom upward. At this time, the box shell 501 is tilted downward or inverted, and the air passes through the dust-proof ventilation net on the surface of the exhaust fan 505 and is filtered and enters the exhaust fan 505 to accelerate. The accelerated airflow is discharged into the interior of the isolation platform 512, and then passes through the isolation platform 512 to enter the interior of the device for cleaning, and then carries the dust inside the device out. After the dust is discharged, the two pressure ribs 602 are unfolded and the exhaust fan 505 is stopped, and then the twist wheel 407 is twisted forward to make the two-way threaded column 406 rotate. When the two-way threaded column 406 rotates, it pushes the two threaded cylinders 404 to move toward both ends. At this time, the two parallel frames 401 slide toward both ends along the supporting slide 102, and the distance between the two ends of the zoom synchronization spring 301 increases. The zoom synchronization spring 301 is unfolded. When the zoom synchronization spring 301 is unfolded, its internal spacing is synchronously expanded, so that the connection The connection shells 303 are equidistant from each other, and the gap between the isolation clamps 202 is equidistantly increased. When the gap is increased to a certain size, the twisting wheel 407 is stopped, and the wafer is placed in the gap between the isolation clamps 202. Then, the twisting wheel 407 is reversely twisted to rotate the bidirectional threaded column 406. When the bidirectional threaded column 406 rotates, it pushes the two threaded cylinders 404 to move toward the middle. At this time, the two parallel connection frames 401 slide toward the middle along the supporting slide 102, and the distance between the two ends of the scaling synchronization spring 301 is reduced. The scaling synchronization spring 301 contracts. When the scaling synchronization spring 301 contracts, its internal spacing is synchronously reduced, so that the connection shells 303 are equidistantly closer, and the gap between the isolation clamps 202 is equidistantly reduced until the wafer is stably clamped between the isolation clamps 202. Then, the twisting wheel 407 is stopped, and the pressure rib 602 is slowly released. The pressure rib 602 is pressed to close inward, so that the pressure rib 602 squeezes the wafer, and then the top cover of the box shell 501 is closed.
[0048] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A wafer transport storage device, characterized in that: include: A support and guide mechanism, wherein an isolation mechanism is installed inside the support and guide mechanism, an equidistant scaling mechanism is arranged between the support and guide mechanism and the isolation mechanism, a scaling adjustment mechanism is installed on the surface of the support and guide mechanism, an isolation and protection mechanism is arranged on the surface of the support and guide mechanism, and a pressing mechanism is arranged on the top of the support and guide mechanism.
2. A wafer transport storage device according to claim 1, characterized in that: The support and guiding mechanism comprises a side connecting plate (101), a supporting slide (102), an enclosing side plate (103) and a through groove (104); the number of the side connecting plates (101) is two, and the two side connecting plates (101) are relatively distributed; the number of the supporting slides (102) is four, and the four supporting slides (102) are all fixedly connected between the two side connecting plates (101), and the four side connecting plates (101) are distributed in parallel; the number of the enclosing side plates (103) is two, and the two enclosing side plates (103) are all fixedly connected between the two side connecting plates (101), and the two enclosing side plates (103) are distributed in parallel; and the through groove (104) is provided on both sides of the enclosing side plate (103).
3. A wafer transport storage device according to claim 2, characterized in that: The isolation mechanism comprises a bottom support slide column (201), an isolation clamping plate (202), a plate sliding hole (203), a buffer anti-skid pad (204), an anti-tightening block (205) and a plate sliding opening (206); the bottom support slide column (201) is fixedly inserted between the two side connecting plates (101), and the number of the bottom support slide columns (201) is two, and the two bottom support slide columns (201) are distributed in parallel; the isolation clamping plate (202) is slidably connected to the surface of the bottom support slide column (201) through the plate sliding hole (203), and the number of the isolation clamping plates (202) is multiple, and the multiple isolation clamping plates (202) are distributed in parallel; the buffer anti-skid pad (204) is fixedly connected to both sides of the isolation clamping plate (202); the anti-tightening block (205) is integrally arranged at the four corners of the isolation clamping plate (202), and the plate sliding opening (206) is opened through both sides of the isolation clamping plate (202).
4. A wafer transport storage device according to claim 3, characterized in that: The isometric zoom mechanism comprises a zoom synchronization spring (301), a protective sleeve (302), a connecting shell (303) and a rotating shaft (304); the zoom synchronization spring (301) is movably sleeved on the surface of the supporting slide cylinder (102); there are four zoom synchronization springs (301), and every two zoom synchronization springs (301) form a group, and the two groups of zoom synchronization springs (301) are relatively distributed; the protective sleeve (302) is fixedly sleeved on the surface of the zoom synchronization spring (301); the connecting shell (303) is fixedly sleeved on the surface of the protective sleeve (302), and there are multiple connecting shells (303); and the rotating shaft (304) is fixedly installed on the surface of the connecting shell (303).
5. The wafer transport storage device according to claim 4, characterized in that: The connecting shell (303) is rotatably connected to the isolation clamping plate (202) via a rotating shaft (304), and there are four rotating shafts (304) on the surface of each isolation clamping plate (202), and every two rotating shafts (304) form a group, and the two groups of rotating shafts (304) are respectively located on both sides of the isolation clamping plate (202).
6. The wafer transport storage device according to claim 4, characterized in that: The zoom adjustment mechanism comprises a parallel frame (401), an extrusion block (402), a guide sliding hole (403), a threaded cylinder (404), a pressing groove (405), a bidirectional threaded column (406) and a twist wheel (407). The parallel frame (401) is two in number, and both parallel frames (401) are arranged on the surface of the supporting slide cylinder (102). The extrusion block (402) is fixedly connected to one side of the parallel frame (401). The guide sliding hole (403) is opened on both sides of the parallel frame (401) and the extrusion block (402). The parallel frame (401) and the extrusion block (402) are connected to each other. The pressing blocks (402) are slidably connected to the supporting slide cylinder (102) through the guide sliding holes (403), the threaded cylinder (404) is fixedly connected to the inside of the parallel frame (401), the pressing groove (405) is embedded in the side of the extrusion block (402) away from the parallel frame (401), the surfaces at both ends of the protective sleeve (302) are fixedly connected to the inner wall of the pressing groove (405), the bidirectional threaded column (406) is rotatably connected between the two side connecting plates (101) through the bearing, and the outer wall of the bidirectional threaded column (406) is threadedly connected to the inner wall of the threaded cylinder (404).
7. The wafer transport storage device according to claim 6, characterized in that: The outer wall of the enclosed side plate (103) is slidably connected to the inner wall of the plate sliding opening (206), and the parallel connection frame (401) is located inside the through slot (104).
8. The wafer transport storage device according to claim 6, characterized in that: The isolation protection mechanism comprises a box shell (501), an embedded groove (502), a holding groove (503), a bottom plate (504), an exhaust fan (505), a lifting foot (506) and a buffer pad (507); the box shell (501) is fixedly mounted on the surfaces of the two side connecting plates (101); the embedded groove (502) is embedded in one side of the box shell (501); the twist wheel (407) is located inside the embedded groove (502); the holding foot (506) is provided on the bottom plate (504); the bottom plate (504) is provided on the bottom plate (505); the lifting foot (506) is provided on the bottom plate (506); and the buffer pad (507) is provided on the bottom plate (507). The grooves (503) are embedded in both sides of the box shell (501), the bottom plate (504) is fixedly connected to the inner wall at the bottom of the box shell (501), the exhaust fan (505) is fixedly installed in the middle of the bottom plate (504), and a dust-proof ventilation net is fixedly installed on the lower surface of the exhaust fan (505), the lifting feet (506) are integrally arranged at the four corners of the bottom of the bottom plate (504), and the buffer pad (507) is fixedly fitted to the bottom of the lifting feet (506).
9. The wafer transport storage device according to claim 8, characterized in that: The isolation protection mechanism further comprises a dust discharge port (508), a cover plate (509), a slot (510), a block (511) and an isolation platform (512); the dust discharge port (508) is provided through the surface of the bottom plate (504); the cover plate (509) is rotatably connected to the inner wall of the dust discharge port (508); the slot (510) is provided in an embedded manner on one side of the cover plate (509); the block (511) is integrally arranged on the inner wall of the dust discharge port (508); the isolation platform (512) is fixedly connected to the upper surface of the bottom plate (504); and a dust leakage hole is provided through the surface of the isolation platform (512).
10. The wafer transport storage device according to claim 2, characterized in that: The clamping mechanism comprises a top frame plate (601), a pressure rib (602), a spring sheet (603), a buffer pressure sleeve (604) and an inner convex portion (605); the top frame plate (601) is fixedly connected to the upper surfaces of the two side connecting plates (101); the pressure rib (602) is rotatably connected to the upper surface of the top frame plate (601); the number of the pressure ribs (602) is two, and the two pressure ribs (602) are relatively distributed; the spring sheet (603) is fixedly connected to the upper surface of the top frame plate (601); the buffer pressure sleeve (604) is fixedly sleeved on the surface of the pressure rib (602); the inner convex portion (605) is integrally arranged inside the pressure rib (602); and the surface of the spring sheet (603) is slidably connected to the surface of the inner convex portion (605).