Power module packaging structure and power module

Abstract

The invention discloses a power module packaging structure and a power module, which are applied to the technical field of power devices, a plurality of unitized power modules are arranged on the surface of a bottom plate, a gap is formed between every two adjacent unitized power modules, every two adjacent unitized power modules are electrically connected with each other through a connecting part, and the connecting parts are arranged above the bottom plate in a spanning manner; an isolation plate is arranged on the surface of the bottom plate corresponding to the gap, and the surface of one side, facing the edge of the unitized power module, of the isolation plate is an insulating surface; and the projection positions of the edges forming the gaps in the adjacent unitized power modules on the surface of the bottom plate are positioned in the insulating surface. Through the arrangement of the isolation plate, the creepage path of the unitized power module cannot directly extend downwards to the bottom plate at the edge of the unitized power module along the thickness direction, creepage to the outer side of the insulating surface at the edge of the unitized power module along the horizontal direction is needed, and then creepage to the bottom plate along the thickness direction is needed, so that the creepage distance of the unitized power module is greatly increased; and the power module is ensured to have enough insulation capability.

Description

Technical Field

[0001] The present invention relates to the technical field of high-voltage and large-capacity power devices, and in particular to a power module packaging structure and a power module. Background Art

[0002] Traditional power modules generally use copper metal base plates as a carrier for mechanical support and efficient heat conduction. However, large-scale parallel connection of chips in high-voltage and large-capacity power modules requires the use of ultra-large-area metal base plates as structural carriers.

[0003] In the prior art, a plurality of unitized power modules can be provided for a high-voltage and large-capacity power module, each unitized power module having its own small-area insulating substrate, and different unitized power modules are electrically connected to form a complete power module. However, for the unitized power module, how to ensure that it has sufficient insulation performance is an urgent problem to be solved by those skilled in the art. Summary of the invention

[0004] An object of the present invention is to provide a power module packaging structure, which can ensure that the power module has sufficient insulation capacity; another object of the present invention is to provide a power module, which can ensure that the power module has sufficient insulation capacity.

[0005] In order to solve the above technical problems, the present invention provides a power module packaging structure, including a base plate, an isolation plate, and a plurality of unitized power modules;

[0006] A plurality of the unitized power modules are arranged on the surface of the bottom plate, and there are gaps between adjacent unitized power modules. Adjacent unitized power modules are electrically connected to each other through connecting components, and the connecting components are placed above the bottom plate;

[0007] The isolation plate is arranged at a position on the bottom plate surface corresponding to the gap, and the surface of the isolation plate on one side facing the edge of the unitized power module is an insulating surface; the projection position of the edge forming the gap in the adjacent unitized power module on the bottom plate surface along the thickness direction is located within the insulating surface.

[0008] Optionally, the isolation plate is located below the gap, and the insulating surface covers a projection of the gap on the bottom plate.

[0009] Optionally, the unitized power module has a substrate, the substrate is fixedly connected to the bottom plate via an adhesive layer, the edge of the substrate is suspended above the bottom plate, and the gap is formed between adjacent substrates;

[0010] The edge of the insulating surface is located within the projection range of the base plate along the thickness direction, and is outside the projection range of the bonding layer along the thickness direction.

[0011] Optionally, a groove is provided on the surface of the area where the base plate contacts the adhesive layer.

[0012] Optionally, the plurality of unitized power modules are arranged in sequence along a first direction on the surface of the base plate, and the plurality of isolation plates are arranged in sequence along the first direction on the base plate.

[0013] Optionally, the base plate includes a heat dissipation layer and a core layer along the thickness direction, and the thermal expansion coefficient of the core layer is smaller than the thermal expansion coefficient of the heat dissipation layer.

[0014] Optionally, the base plate includes a first heat dissipation layer, a first connection layer, a core layer, a second connection layer and a second heat dissipation layer which are sequentially arranged along a thickness direction, and the unitized power module is located on a surface of the first heat dissipation layer.

[0015] Optionally, a groove is provided on the surface of the bottom plate, and the isolation plate is located in the groove.

[0016] Optionally, the groove is filled with insulating material covering the isolation plate.

[0017] Optionally, the groove extends from the first heat dissipation layer to the first connection layer, and the isolation plate is fixedly connected to the first connection layer in the groove.

[0018] Optionally, the isolation plate includes a solder layer, a metal layer and an insulating ceramic layer arranged in sequence along a thickness direction, and the solder layer is fixedly connected to the first connecting layer.

[0019] The present invention also provides a power module, comprising the power module packaging structure as described in any one of the above items.

[0020] A power module packaging structure provided by the present invention comprises a base plate, an isolation plate, and a plurality of unitized power modules; a plurality of unitized power modules are arranged on the surface of the base plate, gaps are provided between adjacent unitized power modules, adjacent unitized power modules are electrically connected to each other via connecting components, and the connecting components are placed across the base plate; an isolation plate is arranged at a position corresponding to the gap on the surface of the base plate, and a surface of the isolation plate on one side facing the edge of the unitized power module is an insulating surface; the projection position of the edge forming the gap between adjacent unitized power modules on the surface of the base plate is located within the insulating surface.

[0021] By arranging an isolation plate on the surface of the base plate, and making the projection positions of the relative edges of adjacent unitized power modules on the base plate surface along the thickness direction be located within the insulating surface of the isolation plate, the creepage path of the unitized power module cannot directly extend downward to the base plate along the thickness direction at its edge, but needs to first creep horizontally to the outside of the insulating surface at its edge, and then creep to the base plate along the thickness direction, thereby greatly increasing the creepage distance of the unitized power module and ensuring that the power module has sufficient insulation capacity.

[0022] The present invention also provides a power module, which also has the above-mentioned beneficial effects, and will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present invention or the technical solutions of the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0024] FIG1 is a schematic structural diagram of a power module packaging structure provided by an embodiment of the present invention;

[0025] FIG2 is a schematic diagram of the structure of the unitized power module in FIG1 ;

[0026] FIG3 is a schematic diagram of the top view of the bottom plate in FIG1 ;

[0027] Figure 4 It is a partial diagram of Figure 1;

[0028] Figure 5 The creepage path diagram of the unitized power module in Figure 1;

[0029] Figure 6 A schematic diagram of a side view structure of a specific bottom plate provided by an embodiment of the present invention;

[0030] Figure 7 A schematic side structural diagram of a specific isolation plate provided in an embodiment of the present invention.

[0031] In the figure: 1. Unitized power module, 101. Source copper clad layer, 102. Drain copper clad layer, 103. Control signal ceramic copper clad substrate, 104. Power chip, 105. Power bonding wire, 106. Gate control terminal of main power chip, 107. Source control terminal of main power chip, 108. Gate control terminal of auxiliary power chip, 109. Source control terminal of auxiliary power chip, 110. Power module drain side capacitor terminal, 111. Power module source side capacitor terminal, 112. Control bonding wire, 113. Substrate;

[0032] 2. bottom plate, 21. core layer, 22. first heat dissipation layer, 23. second heat dissipation layer, 24. first connection layer, 25. second connection layer, 201. groove;

[0033] 3. Isolation board, 301. Insulating ceramic layer, 302. Metal layer, 303. Solder layer;

[0034] 4. Connecting parts. DETAILED DESCRIPTION

[0035] The core of the present invention is to provide a power module packaging structure. In the prior art, a plurality of unitized power modules can be set for a high-voltage and large-capacity power module, each unitized power module has its own small-area insulating substrate, and different unitized power modules are electrically connected to form a complete power module. However, for the unitized power module, its creepage distance is only from the edge of the insulating substrate vertically downward to the bottom plate, and the creepage distance is relatively short, which makes the insulation performance of the substrate in the unitized power module poor.

[0036] The present invention provides a power module packaging structure, including a base plate, an isolation plate, and a plurality of unitized power modules; a plurality of unitized power modules are arranged on the surface of the base plate, gaps are provided between adjacent unitized power modules, adjacent unitized power modules are electrically connected to each other through connecting components, and the connecting components are placed across the base plate; an isolation plate is arranged at a position corresponding to the gap on the surface of the base plate, and a surface of the isolation plate facing the edge of the unitized power module is an insulating surface; the projection position of the edge of the gap formed in adjacent unitized power modules on the surface of the base plate is located within the insulating surface.

[0037] By arranging an isolation plate on the surface of the base plate, and making the projection positions of the relative edges of adjacent unitized power modules on the base plate surface along the thickness direction be located within the insulating surface of the isolation plate, the creepage path of the unitized power module cannot directly extend downward to the base plate along the thickness direction at its edge, but needs to first creep horizontally to the outside of the insulating surface at its edge, and then creep to the base plate along the thickness direction, thereby greatly increasing the creepage distance of the unitized power module and ensuring that the power module has sufficient insulation capacity.

[0038] In order to enable those skilled in the art to better understand the scheme of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0039] Embodiment 1

[0040] Please refer to Figures 1 to Figure 5 , FIG. 1 is a schematic diagram of a power module packaging structure provided by an embodiment of the present invention; FIG. 2 is a schematic diagram of the structure of the unitized power module in FIG. 1 ; FIG. 3 is a schematic diagram of the top view of the bottom plate in FIG. 1 ; Figure 4 It is a partial diagram of Figure 1; Figure 5 Figure 1 shows the creepage path diagram of the unitized power module.

[0041] Referring to Figure 1, in an embodiment of the present invention, the power module packaging structure includes a base plate 2, an isolation plate 3, and a plurality of unitized power modules 1; a plurality of the unitized power modules 1 are arranged on the surface of the base plate 2, and there are gaps between adjacent unitized power modules 1, and adjacent unitized power modules 1 are electrically connected to each other through a connecting component 4, and the connecting component 4 is placed across the base plate 2; the isolation plate 3 is arranged at a position corresponding to the gap on the surface of the base plate 2, and the surface of the isolation plate 3 facing the edge of the unitized power module 1 is an insulating surface; the projection position of the edge of the adjacent unitized power modules 1 forming the gap on the surface of the base plate 2 along the thickness direction is located within the insulating surface.

[0042] The base plate 2 is a heat sink for the entire power module packaging structure, which mainly performs the heat dissipation function. The specific structure of the base plate 2 will be described in detail in the following embodiments of the invention, and will not be repeated here. The unitized power module 1 is arranged on the surface of the base plate 2, and each unitized power module 1 usually includes a substrate 113 and a functional structure located on the surface of the substrate 113. The base plate 2 is usually a large-area base plate 2, and the substrate 113 is usually a small-area substrate 113 relative to the base plate 2, and a plurality of substrates 113 are usually arranged on the surface of the base plate 2.

[0043] Referring to FIG. 2 , a functional structure is usually arranged on the surface of each substrate 113, and the functional structure usually includes any one or any combination of the following: source copper clad layer 101, drain copper clad layer 102, control signal ceramic copper clad substrate 103, power chip 104, power bonding wire 105, gate control terminal 106 of main power chip, source control terminal 107 of main power chip, gate control terminal 108 of auxiliary power chip, source control terminal 109 of auxiliary power chip, power module drain side capacitor terminal 110, power module source side capacitor terminal 111, control bonding wire 112, etc. The specific content of the functional structure can be set according to the actual situation, and is not specifically limited here.

[0044] In this embodiment, there is a gap between adjacent unitized power modules 1, and the unitized power modules 1 need to be electrically connected to form the function of a complete high-voltage and large-capacity power module. In this embodiment, the adjacent unitized power modules 1 can be electrically connected to each other across the gap through a connecting component 4. Obviously, the connecting component 4 will be placed above the bottom plate 2. The specific structure of the connecting component 4 can refer to the prior art and will not be repeated here. The connecting component 4 can be a bridge or a bonding wire, etc., which is not specifically limited here.

[0045] Referring to FIG. 3 , an isolation plate 3 is provided at a position on the surface of the bottom plate 2 corresponding to the above-mentioned gap. The isolation plate 3 is usually located below the substrate 113 in the unitized power module 1 along the thickness direction. The isolation plate 3 is specifically provided corresponding to the position of the gap. The surface of the isolation plate 3 on one side facing the edge of the unitized power module 1 needs to be an insulating surface, that is, the upper surface of the isolation plate 3 is usually an insulating surface, which is a non-conductive surface and is usually formed of an insulating material.

[0046] In this embodiment, the projection position of the edge forming the gap in the adjacent unitized power modules 1 on the surface of the base plate 2 along the thickness direction is located within the insulating surface. The above-mentioned gap is located between adjacent unitized power modules 1, so the gap is specifically formed by two adjacent edges in the adjacent unitized power modules 1, and the edges are usually adjacent edges in two adjacent substrates, and the above-mentioned gap is formed between the above-mentioned two edges. The projection of the above-mentioned edge along the thickness direction specifically needs to be located within the above-mentioned insulating surface, that is, the directly below the above-mentioned edge needs to fall within the above-mentioned insulating surface, so that the creepage path of the unitized power module 1 cannot contact the base plate 2 vertically downward at the edge of the unitized power module 1.

[0047] The above-mentioned unitized power module 1 can be welded and manufactured separately, and can also be independently tested, so as to avoid the situation where all components are welded on a whole large substrate 113 and a single component is damaged after completing the required process, resulting in the entire component being scrapped.

[0048] In this embodiment, one isolation plate 3 is provided for each gap, and each isolation plate 3 has an insulating surface. The isolation plate 3 may be located below the gap, and the insulating surface covers the projection of the gap on the bottom plate 2. At this time, the size of the insulating surface is usually not less than the size of the gap, and the projections of the two edges of the same gap along the thickness direction may fall on the same insulating surface. At this time, only one isolation plate 3 needs to be provided between adjacent unitized power modules 1.

[0049] See also Figure 4In this embodiment, the unitized power module 1 has a substrate 113, and the substrate 113 is fixedly connected to the bottom plate 2 through an adhesive layer. The edge of the substrate 113 is suspended above the bottom plate 2, and the gap is formed between adjacent substrates 113; the edge of the insulating surface is located within the projection range of the substrate 113 along the thickness direction of the bottom plate 2, and is located outside the projection of the adhesive layer along the thickness direction. The above-mentioned substrate 113 can be a ceramic copper-clad substrate 113, or a substrate 113 of a metal-insulation-metal sandwich structure, which is not specifically limited here.

[0050] The above-mentioned substrate 113 and the bottom plate 2 usually need to be fixedly connected by an adhesive layer, and the adhesive layer can specifically be a layered structure formed by materials such as solder. Since the adhesive layer has a certain thickness, the edge of the substrate 113 in this embodiment can be suspended above the bottom plate 2, and the above-mentioned gap is formed between adjacent substrates 113. In this embodiment, the edge of the above-mentioned insulating surface can specifically be located within the projection range of the substrate 113 along the thickness direction, that is, the insulating surface can extend below the substrate 113, that is, the above-mentioned isolation plate 3 can extend below the substrate 113; however, the insulating surface needs to be located outside the projection of the adhesive layer along the thickness direction, that is, the insulating surface usually does not extend below the adhesive layer, and the above-mentioned isolation plate 3 usually does not extend below the adhesive layer, so as to ensure the firm connection between the unitized power module 1 and the bottom plate 2.

[0051] In this embodiment, the creepage requirement of the power module 1 to the base plate 2 is higher, such as Figure 5 As shown, the specific creepage path of this embodiment is as follows: starting from the right edge of the source copper clad layer 101 of the first unitized power module 1, creeping along the upper surface of the substrate 113 perpendicular to the right side of the substrate 113 to the right edge, then creeping along the right side of the substrate 113 perpendicular to the lower surface of the substrate 113 to the right edge of the lower surface of the substrate 113, and finally creeping along the lower surface of the substrate 113 perpendicular to the right side of the lower copper clad layer of the substrate 113 to the intersection of the substrate 113 and the bottom plate 2, forming the shortest creepage path from the first power module 1 to the bottom plate 2. Obviously, the provision of the isolation plate 3 can greatly increase the creepage distance and prevent the creepage path from creeping directly downward from the edge of the substrate 113 to the bottom plate 2.

[0052] In this embodiment, a groove 201 is provided on the surface of the area where the bottom plate 2 contacts the adhesive layer. The groove 201 is usually provided on the surface of the bottom plate 2. When the bottom plate 2 is a multi-layer laminate composite structure, the groove 201 is provided on the surface of the topmost plate of the floor. The groove 201 is specifically provided in the area where the bottom plate 2 and the adhesive layer meet, that is, the adhesive layer is fixedly connected to the bottom plate 2 at the place where the groove 201 meets. Since the bottom plate 2 is fixedly connected to a plurality of unitized power modules 1 in this embodiment, there are a plurality of areas on the surface of the bottom plate 2 in contact with the adhesive layer. In each area where the bottom plate 2 contacts the adhesive layer, at least one groove 201 is provided, and a plurality of grooves 201 are usually provided, and the plurality of grooves 201 are usually parallel to each other and are distributed at equal intervals in the area where the bottom plate 2 contacts the adhesive layer. The groove 201 is used to absorb and accommodate the warping deformation caused by thermal stress between the bottom plate 2 and the adhesive layer during use, and ensure the temperature connection between the bottom plate 2 and the substrate 113.

[0053] Typically, in this embodiment, the plurality of unitized power modules 1 are sequentially arranged along a first direction on the surface of the bottom plate 2, and the plurality of isolation plates 3 are sequentially arranged along the first direction on the bottom plate 2. The first direction is usually the long side direction of the bottom plate 2, and the plurality of isolation plates are distributed in parallel, dividing the bottom plate 2 into a plurality of regions fixedly connected to the corresponding unitized power modules 1.

[0054] The power module packaging structure provided in this embodiment is provided with an isolation plate 3 on the surface of the bottom plate 2, and the projection position of the relative edges of the adjacent unitized power modules 1 on the surface of the bottom plate 2 along the thickness direction is located within the insulating surface of the isolation plate 3, so that the creepage path of the unitized power module 1 cannot extend directly downward to the bottom plate 2 along the thickness direction at its edge, but needs to creep horizontally to the outside of the insulating surface at its edge, and then creep to the bottom plate 2 along the thickness direction, thereby greatly increasing the creepage distance of the unitized power module 1 and ensuring that the power module has sufficient insulation capacity. The use of local reinforced insulation can further reduce thermal resistance and reduce process difficulty.

[0055] The specific contents of a power module packaging structure provided by the present invention will be described in detail in the following invention embodiments.

[0056] Embodiment 2

[0057] Please refer to Figure 6 as well as Figure 7 , Figure 6 A schematic diagram of a side view structure of a specific bottom plate provided by an embodiment of the present invention; Figure 7 A schematic side structural diagram of a specific isolation plate provided in an embodiment of the present invention.

[0058] Different from the above-mentioned invention embodiment, the present invention embodiment further defines the structure of the bottom plate 2 on the basis of the above-mentioned invention embodiment. The rest of the contents have been described in detail in the above-mentioned invention embodiment and will not be repeated here.

[0059] See also Figure 6 In an embodiment of the present invention, the base plate 2 includes a heat dissipation layer and a core layer 21 along the thickness direction, and the thermal expansion coefficient of the core layer 21 is smaller than the thermal expansion coefficient of the heat dissipation layer. In this embodiment, a composite board is specifically used as the base plate 2, and the base plate 2 is specifically formed by a heat dissipation layer and a core layer 21 composited along the thickness direction. The thermal expansion coefficient of the core layer 21 needs to be smaller than the thermal expansion coefficient of the heat dissipation layer, so as to reduce the thermal expansion coefficient of the bulk base plate 2 through the core layer 21. The heat dissipation layer is mainly used for heat dissipation, while the core layer 21 is mainly used to reduce the thermal expansion coefficient of the base plate 2, so as to avoid deformation such as warping of the base plate 2 during use. Normally, the board layer on the side of the base plate 2 facing the unitized power module 1 is a heat dissipation layer, so that the heat can be conducted out of the unitized power module 1 in a timely manner.

[0060] Specifically, in this embodiment, the bottom plate 2 includes a first heat dissipation layer 22, a first connection layer 24, a core layer 21, a second connection layer 25, and a second heat dissipation layer 23 sequentially arranged along the thickness direction, and the unitized power module 1 is located on the surface of the first heat dissipation layer 22. That is, in this embodiment, the core layer 21 is used as the middle layer of the bottom plate 2, and the first heat dissipation layer 22 is arranged on the side facing the unitized power module 1, and the first heat dissipation layer 22 and the core layer 21 are fixedly connected through the first connection layer 24; the second heat dissipation layer 23 is arranged on the side of the core layer 21 facing away from the unitized power module 1, and the second heat dissipation layer 23 and the core layer 21 are fixedly connected through the second connection layer 25. Specifically, the core layer 21 can be an aluminum silicon carbide (AlSiC) layer, the first heat dissipation layer 22 and the second heat dissipation layer 23 can be copper layers, and the first connection layer 24 and the second connection layer 25 can be sintered silver layers or low-temperature sintered copper layers.

[0061] When preparing the above-mentioned base plate 2, a metal deposition method such as electroplating, evaporation, magnetron sputtering, etc. can be specifically used to first deposit 5 microns to 100 microns of copper, silver, gold or other metals on the surface of a low thermal expansion coefficient (CTE) core layer 21 such as silicon carbide aluminum, molybdenum, molybdenum copper, tungsten copper and other low CTE metal, non-metal or alloy material as part of the first connecting layer 24 and part of the second connecting layer 25, and 5 microns to 100 microns of copper, silver or gold or other metals are deposited on the surface of a high thermal conductivity metal such as high thermal conductivity metal copper or aluminum as part of the first connecting layer 24 and part of the second connecting layer 25.

[0062] Afterwards, low-temperature copper sintering, low-temperature silver sintering, low-temperature liquid phase diffusion technology or soft soldering method is used to sinter or weld the low-CTE core layer 21, the high-thermal-conductivity first heat dissipation layer 22, and the second heat dissipation layer 23 together in sequence to form a multilayer structure. The sintering temperature is usually less than 250°C, the sintering time is usually less than 60 minutes, and the sintering pressure is usually less than 20 MPa to form the above-mentioned base plate 2.

[0063] In this embodiment, a groove is provided on the surface of the base plate 2, and the isolation plate 3 is located in the groove. The groove is used to hold the isolation plate 3, so the position of the groove needs to correspond to the position of the isolation plate 3, and the groove usually needs to be set corresponding to the position of the gap. Specifically, in this embodiment, the groove extends from the first heat dissipation layer 22 to the first connecting layer 24, and the isolation plate 3 is fixedly connected to the first connecting layer 24 in the groove. When setting the groove, when preparing the first heat dissipation layer 22, it can be prepared according to the area of ​​the base plate 2 that needs to contact the adhesive layer, and when bonding the core layer 21 and the first heat dissipation layer 22, the first heat dissipation layer 22 and the core layer 21 will be connected to each other according to the position of the unitized power module 1, so as to form the groove between adjacent first heat dissipation layers 22. This method can avoid high-depth etching of the first heat dissipation layer 22 and simplify the preparation process. The depth of the groove is usually 0.05 mm to 1 mm, which is used to adjust the copper coating amount of the first heat dissipation layer 22 on the base plate 2 in the plane and vertical directions, adjust its thermomechanical stress, and minimize the residual stress when the base plate 2 is connected to the unitized substrate 113 over a large area in the subsequent process.

[0064] In this embodiment, the isolation plate 3 can be specifically arranged in the above-mentioned groove, and the isolation plate 3 is usually fixedly connected to the bottom surface of the above-mentioned groove, that is, the isolation plate 3 is usually bonded to the first connection layer 24. The above-mentioned groove is usually filled with an insulating material covering the isolation plate 3 to ensure the insulation performance of the isolation plate 3. The above-mentioned insulating material can be specifically PI (polyimide) material, etc., and its specific material is not specifically limited in this embodiment.

[0065] See also Figure 7 In this embodiment, the isolation plate 3 includes a solder layer 303, a metal layer 302 and an insulating ceramic layer 301 arranged in sequence along the thickness direction, and the solder layer 303 is fixedly connected to the first connecting layer 24. The insulating ceramic layer 301 is used to form an insulating surface, the metal layer 302 is mainly used for the fixed connection between the solder layer 303 and the insulating ceramic layer 301, and the solder layer 303 is mainly used for the fixed connection between the isolation plate 3 and the bottom plate 2. The process of bonding the isolation plate 3 and the first connecting layer 24 can refer to the process of fixedly connecting the first heat dissipation layer 22 and the core layer 21, and will not be repeated here.

[0066] A power module packaging structure provided in this embodiment is suitable for 1200V SiC MOSFETs chips, 3.3kV, 6.5kV and 10kV SiC high-voltage devices or silicon-based power devices, etc. The use of a base plate 2 with a core layer 21 can effectively solve the problem of warping of the base plate 2 during use due to the excessive thermal expansion coefficient of the base plate 2. Since the groove is used to accommodate the isolation plate 3, an array groove is formed in the base plate 2. The array groove design can regulate the thermomechanical stress of the multi-layer structure base plate 2 and the residual stress of the large-area connection.

[0067] Embodiment 3

[0068] Different from the above-mentioned invention embodiment, the present invention embodiment further introduces the power module on the basis of the above-mentioned invention embodiment. The specific structure of the power module can correspond to the structure of the above-mentioned power module packaging structure.

[0069] In an embodiment of the present invention, the power module includes the power module packaging structure as described in the above embodiment. The specific structure of the power module packaging structure has been described in detail in the above invention embodiment, and will not be repeated here. The power module provided in this embodiment is provided with the above power module packaging structure, and can have sufficient insulation capacity.

[0070] In this specification, each embodiment is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be referred to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part.

[0071] Finally, it should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0072] The above is a detailed introduction to a power module packaging structure and a power module provided by the present invention. Specific examples are used in this article to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. It should be pointed out that for ordinary technicians in this technical field, without departing from the principle of the present invention, several improvements and modifications can be made to the present invention, and these improvements and modifications also fall within the scope of protection of the claims of the present invention.

Claims

1. A power module packaging structure, characterized in that: It includes a base plate, an isolation plate, and a plurality of unitized power modules; A plurality of the unitized power modules are arranged on the surface of the bottom plate, and there are gaps between adjacent unitized power modules. Adjacent unitized power modules are electrically connected to each other through connecting components, and the connecting components are placed above the bottom plate; The isolation plate is arranged at a position on the bottom plate surface corresponding to the gap, and the surface of the isolation plate on one side facing the edge of the unitized power module is an insulating surface; the projection position of the edge forming the gap in the adjacent unitized power module on the bottom plate surface along the thickness direction is located within the insulating surface.

2. The power module packaging structure according to claim 1, characterized in that: The isolation plate is located below the gap, and the insulating surface covers the projection of the gap on the bottom plate.

3. The power module packaging structure according to claim 2, characterized in that: The unitized power module comprises a substrate, which is fixedly connected to the bottom plate via an adhesive layer, the edge of the substrate is suspended above the bottom plate, and the gap is formed between adjacent substrates; the edge of the insulating surface is located within the projection range of the substrate along the thickness direction of the bottom plate and outside the projection of the adhesive layer along the thickness direction.

4. The power module packaging structure according to claim 3, characterized in that: A groove is arranged on the surface of the bottom plate in a region where the bottom plate contacts the adhesive layer.

5. The power module packaging structure according to claim 2, characterized in that: The plurality of unitized power modules are arranged in sequence along a first direction on the surface of the bottom plate, and the plurality of isolation plates are arranged in sequence along the first direction on the bottom plate.

6. The power module packaging structure according to claim 1, characterized in that: The bottom plate comprises a heat dissipation layer and a core layer along a thickness direction, and a thermal expansion coefficient of the core layer is smaller than a thermal expansion coefficient of the heat dissipation layer.

7. The power module packaging structure according to claim 6, characterized in that: The base plate includes a first heat dissipation layer, a first connection layer, a core layer, a second connection layer and a second heat dissipation layer which are arranged in sequence along the thickness direction, and the unitized power module is located on the surface of the first heat dissipation layer.

8. The power module packaging structure according to claim 7, characterized in that: A groove is arranged on the surface of the bottom plate, the isolation plate is located in the groove, and the groove is filled with an insulating material covering the isolation plate.

9. The power module packaging structure according to claim 8, characterized in that: The groove extends from the first heat dissipation layer to the first connection layer, the isolation plate is fixedly connected to the first connection layer in the groove, the isolation plate includes a solder layer, a metal layer and an insulating ceramic layer arranged in sequence along the thickness direction, and the solder layer is fixedly connected to the first connection layer.

10. A power module, characterized in that: The invention comprises a power module packaging structure as claimed in any one of claims 1 to 9.

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