Electronic device

Abstract

The invention discloses electronic equipment, and belongs to the technical field of electronic equipment, the electronic equipment comprises a loudspeaker, a frame body, a rear cover and a heat conduction part, the rear cover is connected with the frame body, the loudspeaker is installed on the frame body, the heat conduction part is clamped between the loudspeaker and the rear cover, and the heat conduction part is in heat conduction connection with the loudspeaker; the rear cover is provided with a first sound guide channel, the heat conduction piece is provided with a through hole, and the first sound guide channel is communicated with the loudspeaker through the through hole; in a plane perpendicular to the thickness direction of the rear cover, at least one part of the projection of the loudspeaker is located in the projection of the heat conduction piece, and one part of the projection of the heat conduction piece is located outside the projection of the loudspeaker.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic equipment, and specifically relates to an electronic equipment. Background Art

[0002] Speakers are important components in electronic devices such as mobile phones, and are influenced by user needs. Sound quality and volume are two main design directions of speakers. In order to improve the sound quality, the speaker outlet can usually be set on the back of the electronic device. However, since the volume will directly affect the heat generated by the speaker, in this case, the heat of the speaker will be directly conducted to the back cover of the electronic device, resulting in more concentrated heat in the area where the speaker is located on the back of the electronic device, which will have an adverse effect on the user's holding of the electronic device and will affect the heat dissipation efficiency and sound quality of the speaker. Summary of the invention

[0003] The purpose of the embodiments of the present application is to provide an electronic device to solve the problem that in current electronic devices, the heat is concentrated in the area where the speaker is located on the back, which has an adverse effect on the user's holding of the electronic device and affects the heat dissipation efficiency and sound quality of the speaker.

[0004] The embodiment of the present application discloses an electronic device, which includes a speaker, a frame, a back cover and a heat conducting member. The back cover is connected to the frame, the speaker is installed on the frame, the heat conductive member is sandwiched between the speaker and the back cover, and the heat conductive member is thermally connected to the speaker; the back cover is provided with a first sound conducting channel, the heat conductive member is provided with a through hole, and the first sound conducting channel is connected to the speaker through the through hole; In a plane perpendicular to the thickness direction of the rear cover, at least a portion of the projection of the speaker is located within the projection of the heat conductor, and a portion of the projection of the heat conductor is located outside the projection of the speaker.

[0005] An embodiment of the present application discloses an electronic device, wherein a back cover is connected to a frame, a speaker is installed in the frame, a heat conductor is sandwiched between the speaker and the back cover, and the heat conductor is thermally connected to the speaker. At the same time, in a plane perpendicular to the thickness direction of the back cover, at least a portion of the projection of the speaker is located within the projection of the heat conductor, so that the heat generated by the operation of the speaker can be conducted to the heat conductor, and in the aforementioned plane, by making a portion of the projection of the heat conductor outside the projection of the speaker, the heat conducted from the speaker to the heat conductor can be conducted to the area outside the speaker through the heat conductor, thereby preventing the problem of heat concentration in the area where the speaker is located on the back of the electronic device.

[0006] In addition, the back cover is provided with a first sound conducting channel, the heat conducting member is provided with a through hole, and the first sound conducting channel is connected with the speaker through the through hole, so that the sound waves generated by the speaker can be transmitted into the first sound conducting channel through the through hole, and conducted to the outside of the electronic device through the first sound conducting channel, thereby ensuring that the sound generated by the speaker can be transmitted to the outside of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings: Figure 1 A schematic diagram of the structure of an electronic device disclosed in an embodiment of the present application; Figure 2 A perspective schematic diagram of an electronic device disclosed in an embodiment of the present application; Figure 3 A schematic diagram of heat conduction of a heat conducting member in an electronic device disclosed in an embodiment of the present application; Figure 4 A cross-sectional schematic diagram of a structure of an electronic device disclosed in an embodiment of the present application; Figure 5 A cross-sectional schematic diagram of another structure of an electronic device disclosed in an embodiment of the present application; Figure 6 It is a schematic diagram of the exploded structure of part of the electronic device disclosed in the embodiment of the present application; Figure 7 It is a schematic diagram of the assembly of part of the structure of the electronic device disclosed in the embodiment of the present application.

[0008] Reference numerals: 100-speakers, 200-frame, 210-sound cavity, 220-second sound guide channel, 300-rear cover, 310-first sound guide channel, 400-heat conducting part, 410-through hole, 510-protective sheet, 511-sound hole, 520-dust screen, 530-double-sided tape, 540-seal, 600-Functional Devices, 700-Circuit Board. DETAILED DESCRIPTION

[0009] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0010] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0011] The present application embodiment discloses an electronic device, which may be a mobile phone or a tablet computer, etc., which is not limited in this document. Figure 1-Figure 7 As shown, the electronic device includes a speaker 100, a frame 200, a back cover 300 and a heat conductor 400. Of course, the electronic device may also include components such as a circuit board 700, which will not be introduced here one by one considering the brief introduction of this article.

[0012] Among them, the frame 200 and the back cover 300 can be formed of hard materials such as metal or plastic, and parameters such as the shapes and sizes of the two can be flexibly selected according to actual needs. The heat conductor 400 is formed of a heat conductive material. For example, the heat conductor 400 can be a metal structural member. In another embodiment of the present application, the heat conductor 400 can be formed of a graphite material to minimize the weight of the heat conductor 400 and facilitate the development of electronic equipment towards lightness and thinness. Accordingly, the heat conductor 400 can specifically be a sheet structure so that the area of ​​the heat conductor 400 can be relatively large, thereby increasing the thermal conductivity area and heat dissipation area of ​​the heat conductor 400.

[0013] In the process of assembling the electronic device, the back cover 300 is connected to the frame 200, and the speaker 100 is installed on the frame 200. Specifically, the speaker 100 and the frame 200 can be stably connected by screws and other connectors. Similarly, the back cover 300 and the frame 200 can also be fixedly connected. In other embodiments of the present application, the speaker 100 and the frame 200 can be fixedly connected and the back cover 300 and the frame 200 can be connected by bonding or other methods. In order to ensure that the speaker 100 can sound normally, it is usually necessary to form a sound cavity 210 in the electronic device. In the embodiment of the present application, the sound cavity 210 can be formed separately by the frame 200. In addition, the speaker 100 can be connected to the circuit board 700 to use the circuit board 700 to power the speaker 100. The two can be electrically connected by direct connection such as welding, or the speaker 100 can be electrically connected to the circuit board 700 by wires. This is not limited herein.

[0014] In order to prevent the problem of heat concentration in the area where the speaker 100 is located in the back of the electronic device disclosed in the embodiment of the present application, as shown in FIG. Figure 4 and Figure 5 As shown, the heat conductive member 400 is sandwiched between the speaker 100 and the back cover 300, and the heat conductive member 400 is connected to the speaker 100 by heat conduction. Of course, the heat conductive member 400 does not necessarily need to be in direct contact with the speaker 100 to enable the heat conductive member 400 to be connected to the speaker 100 by heat conduction. As above, the frame 200 can be provided with a sound cavity 210. In this case, the heat conductive member 400 is sandwiched between the frame 200 and the back cover 300. By making the heat conductive member 400 and the surface of the frame 200 facing the back cover 300 fit, it can also ensure that the heat generated by the speaker 100 during operation can be conducted to the heat conductive member 400 through the frame 200, so that the heat of the speaker 100 is absorbed by the heat conductive member 400. Alternatively, the heat conductive member 400 and the frame 200 can be enclosed to form a sound cavity 210 for installing the speaker 100. In this case, the heat generated by the speaker 100 can be directly conducted to the heat conductive member 400 through a gas such as air.

[0015] At the same time, in a plane perpendicular to the thickness direction of the back cover 300, at least a portion of the projection of the speaker 100 is located within the projection of the heat conductor 400, and a portion of the projection of the heat conductor 400 is located outside the projection of the speaker 100. In this case, the heat generated by the speaker 100 can be conducted to a portion of the heat conductor 400, and the heat can be conducted to outside the area where the speaker 100 is located through another portion of the heat conductor 400.

[0016] It should be noted that, in the embodiment of the present application, the portion of the heat conductive member 400 opposite to the speaker 100 and the portion of the heat conductive member 400 outside the speaker 100 are connected to each other. More intuitively, the heat conductive member 400 may include a first portion and a second portion connected to each other, wherein the first portion is opposite to the speaker 100 and the second portion is outside the speaker 100, that is, in a plane perpendicular to the thickness direction of the back cover 300, at least a portion of the projection of the speaker 100 is located within the projection of the first portion of the heat conductive member 400, and the projection of the second portion of the heat conductive member 400 is located outside the projection of the speaker 100. Optionally, the second portion of the heat conductive member 400 may be attached to the back cover 300 to conduct heat to other areas of the back cover 300. In other embodiments of the present application, the second portion of the heat conductive member 400 may also be attached to other functional devices 600 in the electronic device, so as to conduct the heat of the speaker 100 to the functional devices 600. For example, the functional device 600 may include a battery. Under low temperature conditions, the heat generated by the speaker 100 may provide a certain heating capacity for the battery to ensure that the battery can operate at a relatively suitable temperature, thereby improving the efficiency of the battery.

[0017] In addition, in order to ensure that the sound signal emitted by the speaker 100 can be transmitted to the outside of the electronic device, in the embodiment of the present application, the back cover 300 is provided with a first sound guide channel 310, and the heat conductive member 400 is provided with a through hole 410. During the design process, it is necessary to make the first sound guide channel 310 communicate with the through hole 410, so that the first sound guide channel 310 can be communicated with the speaker 100 through the through hole 410, so that the sound waves emitted by the speaker 100 can be transmitted to the outside of the electronic device through the through hole 410 and the first sound guide channel 310. That is, the through hole 410 is connected to the sound cavity 210 of the speaker 100, and one end of the first sound guide channel 310 is connected to the through hole 410, and the other end of the first sound guide channel 310 is connected to the outside of the electronic device. The cross-sectional shapes of the first sound guide channel 310 and the through hole 410 can both be circular, so as to prevent the sound waves from reflecting in the first sound guide channel 310 to generate clutter, which has an adverse effect on the sound effect of the speaker 100.

[0018] The embodiment of the present application discloses an electronic device, wherein a back cover 300 is connected to a frame 200, a speaker 100 is installed on the frame 200, a heat conductor 400 is sandwiched between the speaker 100 and the back cover 300, and the heat conductor 400 is thermally connected to the speaker 100. At the same time, in a plane perpendicular to the thickness direction of the back cover 300, at least a portion of the projection of the speaker 100 is located within the projection of the heat conductor 400, so that the heat generated by the speaker 100 during operation can be conducted to the heat conductor 400, and on the aforementioned plane, by making a portion of the projection of the heat conductor 400 outside the projection of the speaker 100, the heat conducted from the speaker 100 to the heat conductor 400 can be conducted to the area outside the speaker 100 through the heat conductor 400, thereby preventing the problem of heat concentration in the area where the speaker 100 is located on the back of the electronic device.

[0019] In addition, the back cover 300 is provided with a first sound guide channel 310, and the heat conductive member 400 is provided with a through hole 410. The first sound guide channel 310 is connected with the speaker 100 through the through hole 410, so that the sound waves generated by the speaker 100 can be transmitted into the first sound guide channel 310 through the through hole 410, and conducted to the outside of the electronic device through the first sound guide channel 310, thereby ensuring that the sound generated by the speaker 100 can be transmitted to the outside of the electronic device.

[0020] As described above, in a plane perpendicular to the thickness direction of the rear cover 300, a part of the projection of the speaker 100 can be located within the projection of the heat-conducting member 400, and correspondingly, another part of the projection of the speaker 100 can be located outside the heat-conducting member 400. For example, another part of the projection of the speaker 100 can be located outside the outer edge of the heat-conducting member 400. Alternatively, another part of the projection of the speaker 100 can also be located in the projection of the through hole 410 formed on the heat-conducting member 400. To put it simply, taking the rear cover 300 being located above the speaker 100 as an example, in this case, the through hole 410 is located directly above the speaker 100.

[0021] In order to maximize the thermal conductivity of the heat conducting member 400, in other embodiments of the present application, in a plane perpendicular to the thickness direction of the back cover 300, the projection of the speaker 100 can be located within the projection of the heat conducting member 400 as a whole, and correspondingly, the projection of the through hole 410 is located outside the projection of the speaker 100. This allows the heat conducting member 400 to cover the entire area directly above the speaker 100, making the thermal conductivity area of ​​the heat conducting member 400 in the area where the speaker 100 is located relatively larger, thereby further improving the heat dissipation efficiency of the speaker 100.

[0022] That is, in the embodiment of the present application, the thickness direction of the rear cover 300 is the subjective perspective, and the through hole 410 is located outside the speaker 100. When the number of through holes 410 is one, the thickness direction of the rear cover 300 is the up-down direction, and the through hole 410 can be located at the front side, the rear side, the left side or the right side of the speaker 100. In other embodiments of the present application, the number of through holes 410 can also be multiple, and the multiple through holes 410 are all connected to the speaker 100. Correspondingly, the first sound guide channel 310 can also be multiple, and the multiple first sound guide channels 310 can correspond to the multiple through holes 410 one by one, so as to ensure that each first sound guide channel 310 can transmit the sound emitted by the speaker 100 to the outside of the electronic device through the corresponding through hole 410. Alternatively, the number of the first sound guide channel 310 and the through hole 410 can be unequal, and two or three or more first sound guide channels 310 correspond to one through hole 410, or two or three or more through holes 410 correspond to one first sound guide channel 310. It should be noted that, when the number of through holes 410 is one, the through hole 410 cannot be a closed ring structure to prevent the portion of the heat conductive member 400 on the inside of the through hole 410 from being separated from the portion of the heat conductive member 400 on the outside of the through hole 410, making it difficult for the heat absorbed by the heat conductive member 400 to be conducted to the area outside the speaker 100.

[0023] As described above, a first sound guide channel 310 is provided on the back cover 300. Optionally, the first sound guide channel 310 may be a curved structure. In another embodiment of the present application, the first sound guide channel 310 is a straight structure, which can shorten the length of the first sound guide channel 310 as much as possible, thereby reducing the loss of sound in the first sound guide channel 310 and improving the sound effect of the speaker 100.

[0024] In order to further shorten the length of each of the multiple first sound guide channels 310, more specifically, the straight lines on which the axes of the first sound guide channels 310 lie and the straight line on which the thickness direction of the back cover 300 lies can be located in the same plane. This allows the extension length of the first sound guide channels 310 to be the shortest, so as to maximize the reduction in the path length of the sound from the speaker 100 to the outside of the electronic device, thereby reducing sound loss and preventing the sound from being reflected in the first sound guide channels 310 to generate noise, thereby adversely affecting the sound effect of the speaker 100.

[0025] In the above embodiment, the projection of the through hole 410 in the plane perpendicular to the thickness direction of the back cover 300 can be located outside the projection of the speaker 100 in the aforementioned plane, so that the through hole 410 is located on the periphery of the speaker 100 as a whole. Based on this, when the first sound guide channel 310 is a linear structure, the axial direction of the first sound guide channel 310 can be parallel to the thickness direction of the back cover 300, so that the path of the first sound guide channel 310 is basically minimized, thereby maximizing the reduction of sound loss. At the same time, since the magnetic field generated by the speaker 100 is basically concentrated in the area where the speaker 100 is located, the intensity of the magnetic field is relatively small in the surrounding area of ​​the speaker 100. Therefore, in the case of adopting the embodiment of the present application, since the end port of the first sound guide channel 310 away from the through hole 410 is also located at the periphery of the speaker 100, it can prevent impurities such as fine particles outside the electronic device from being affected by magnetic force and being sucked into the first sound guide channel 310, and prevent fine particles from blocking the first sound guide channel 310 and hindering the normal operation of the speaker 100.

[0026] In another embodiment of the present application, the straight line where the axis of the first sound guide channel 310 is located can also be set to be inclined relative to the thickness direction of the back cover 300. In this case, the first sound guide channel 310 can be extended relative to the through hole 410 in a direction away from the speaker 100, that is, the first sound guide channel 310 is extended in a diffuse shape with the speaker 100 as the center. In order to prevent the first sound guide channel 310 from hindering the installation and arrangement of other components of the electronic device as much as possible, the first sound guide channel 310 can be gradually extended from the end connected to the through hole 410 to the position close to the center of the speaker 100, that is, the first sound guide channel 310 is contracted inwardly relative to the speaker 100, so that the first sound guide channel 310 is still arranged as a whole around the area where the speaker 100 is located. In this case, when there are multiple first sound guide channels 310, each first sound guide channel 310 can be arranged in a contracted shape, so that the distance between the ports at one end of the multiple first sound guide channels 310 away from the speaker 100 is closer, which can make the sound output of the speaker 100 more concentrated, thereby improving the sound effect of the speaker 100 to a certain extent.

[0027] More specifically, in the embodiment of the present application, in a plane perpendicular to the thickness direction of the back cover 300, at least a portion of the projection of one end of the first sound guide channel 310 away from the through hole 410 can be located within the projection of the speaker 100. In this case, although the end of the first sound guide channel 310 away from the through hole 410 is basically located in a region where the magnetic field strength is relatively strong in the magnetic field generated by the speaker 100, since the axial direction of the first sound guide channel 310 is tilted relative to the thickness direction of the back cover 300, the airflow direction in the first sound guide channel 310 and the direction of action of the magnetic field are not parallel to each other, thereby preventing particles from being directly sucked into the first sound guide channel 310 by the force of the magnetic field to a certain extent.

[0028] As described above, the heat conductor 400 and the frame 200 can be used to enclose the sound cavity 210 of the speaker 100. Considering that the thickness of the heat conductor 400 is usually relatively small and can be formed of non-metallic materials such as graphite, the structural strength of the heat conductor 400 is usually relatively low. Furthermore, in a specific embodiment of the present application, the frame 200 can be provided with a sound cavity 210, and the speaker 100 can be located in the sound cavity 210. Accordingly, in order to ensure that the sound emitted by the speaker 100 can be normally transmitted to the outside of the sound cavity 210, the frame 200 is also provided with a second sound guide channel 220, and the second sound guide channel 220 is connected to the sound cavity 210. Correspondingly, the second sound guide channel 220 also needs to be connected to the through hole 410, so that the sound emitted by the speaker 100 can be transmitted from the sound cavity 210 to the outside of the electronic device through the second sound guide channel 220, the through hole 410 and the first sound guide channel 310. More specifically, the frame 200 and the circuit board 700 can be made to enclose a sound cavity 210 to reduce the difficulty of installing the speaker 100 and the difficulty of processing the frame 200. Of course, in order to ensure that the sound cavity 210 enclosed by the frame 200 and the circuit board 700 has relatively high airtightness, a seal 540 can be sandwiched between the frame 200 and the circuit board 700. The seal 540 can be formed of materials such as rubber.

[0029] Based on the above embodiment, the heat conductive member 400 can be attached to the side surface of the frame 200 facing the back cover 300, so that the heat generated by the speaker 100 can be conducted to the frame 200, and then conducted to the heat conductive member 400 through the frame 200, thereby achieving the purpose of transferring the heat from the speaker 100 to other areas of the electronic device by using the heat conductive member 400.

[0030] Similarly, in the case where the sound cavity 210 is formed on the frame 200, the number of the through holes 410 can also be multiple, so as to appropriately increase the sound output area of ​​the speaker 100. Correspondingly, the number of the first sound guide channel 310 and the second sound guide channel 220 can also be multiple, and the multiple first sound guide channels 310, the multiple through holes 410 and the multiple second sound guide channels 220 correspond one to one, ensuring that the sound emitted by the speaker 100 can be transmitted from any second sound guide channel 220 through the corresponding through hole 410 and the first sound guide channel 310 to the outside of the electronic device. Optionally, the number of the first sound guide channel 310, the second sound guide channel 220 and the through hole 410 can also be different, and correspond to each other in a many-to-one manner. Considering the simplicity of the text, it will not be repeated here.

[0031] In the case where there are multiple through holes 410, in order to maximize the sound quality of the speaker 100, the multiple through holes 410 can surround the speaker 100, so that the sound emitted by the speaker 100 can be transmitted to the outside of the sound cavity 210 through the surroundings of the speaker 100. More specifically, the multiple through holes 410 can be evenly arranged around the outside of the speaker 100. Of course, the shape and other parameters of the through holes 410 can also be flexibly selected according to actual needs.

[0032] In a specific embodiment of the present application, the outer edges of the ends of the first sound guide channel 310 and the second sound guide channel 220 connected to the through hole 410 can be located within the outer edge of the through hole 410. In this case, the sound can be prevented from being blocked due to the small size of the through hole 410, thereby adversely affecting the sound quality of the speaker 100. In addition, in this case, the assembly difficulty of the heat conductor 400 can be reduced. More specifically, the shapes of the ports of the ends of the first sound guide channel 310 and the second sound guide channel 220 connected to the through hole 410 can be the same as the shape of the through hole 410, for example, both can be circular. In this case, the diameter of the through hole 410 can be greater than the diameter of the ports of the ends of the first sound guide channel 310 and the second sound guide channel 220 connected to the through hole 410.

[0033] As described above, a first sound guide channel 310 is provided on the back cover 300, and the first sound guide channel 310 may be a linear structure. When a second sound guide channel 220 is provided on the frame 200, the second sound guide channel 220 may be a curved structure. Alternatively, in another embodiment of the present application, the second sound guide channel 220 is also a linear structure, which can shorten the length of the second sound guide channel 220 as much as possible, thereby reducing the sound loss in the second sound guide channel 220 and improving the sound effect of the speaker 100.

[0034] In order to further shorten the length of the second sound guide channel 220, more specifically, the straight line on which the axis of the second sound guide channel 220 lies and the straight line on which the thickness direction of the back cover 300 lies can be located in the same plane. This makes the extension length of the second sound guide channel 220 also at its shortest, so as to minimize the path length of the sound from the speaker 100 to the outside of the electronic device, thereby reducing the sound loss and preventing the sound from being reflected in the second sound guide channel 220 to generate noise, thereby adversely affecting the sound effect of the speaker 100.

[0035] As described above, the magnetic field generated by the speaker 100 may cause fine particles to enter the first sound guide channel 310. For this reason, in an embodiment of the present application, the electronic device may further include a protective sheet 510 and a dustproof net 520, wherein the protective sheet 510 is provided with a plurality of sound outlet holes 511. By making the cross-sectional area of ​​each sound outlet hole 511 smaller than the cross-sectional area of ​​the first sound guide channel 310, and connecting the protective sheet 510 to the side of the back cover 300 away from the frame 200, the end of the first sound guide channel 310 away from the through hole 410 can be connected to the sound outlet hole 511, thereby utilizing the sound outlet hole 511 with a relatively smaller cross-sectional area to further prevent fine particles from entering the first sound guide channel 310.

[0036] Specifically, the sound holes 511 can be evenly arranged on the dustproof sheet, and the distribution area of ​​the sound holes 511 can be set accordingly based on the distribution of the first sound guide channel 310. When the first sound guide channel 310 is arranged around the speaker 100, multiple sound holes 511 can form a sound output area, and the sound output area can be annular in structure as a whole, which can also improve the appearance performance of the electronic device. The protective sheet 510 can be specifically formed of a hard material such as metal or plastic, and the protective sheet 510 can be fixed to the back cover 300 by bonding or the like. More specifically, the protective sheet 510 can be fixedly connected to the back cover 300 by double-sided tape 530.

[0037] In order to further improve the dustproof effect of the electronic device and prevent fine particles from entering the first sound guide channel 310 or even the speaker 100, in the embodiment of the present application, a dustproof net 520 may be provided at both the sound outlet 511 and the through hole 410, and the aperture of the dustproof net 520 is smaller than the aperture of the sound outlet 511, so as to further reduce the probability of fine particles entering the first sound guide channel 310 or even the speaker 100. Of course, the dustproof net 520 may also be provided at the positions where the through hole 410 and the sound outlet 511 are located by bonding.

[0038] It should be noted that, in this article, the terms "comprise", "include" or any other variant thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise one..." do not exclude the presence of other identical elements in the process, method, article or device including the element. In addition, it should be pointed out that the scope of the methods and devices in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in reverse order according to the functions involved, for example, the described method may be performed in an order different from that described, and various steps may also be added, omitted, or combined. In addition, the features described with reference to certain examples may be combined in other examples.

[0039] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. An electronic device, characterized in that: It comprises a speaker (100), a frame (200), a back cover (300) and a heat conducting member (400), The back cover (300) is connected to the frame (200), the speaker (100) is installed on the frame (200), the heat conductive member (400) is sandwiched between the speaker (100) and the back cover (300), and the heat conductive member (400) is heat conductively connected to the speaker (100); the back cover (300) is provided with a first sound conductive channel (310), the heat conductive member (400) is provided with a through hole (410), and the first sound conductive channel (310) is connected to the speaker (100) through the through hole (410); In a plane perpendicular to the thickness direction of the back cover (300), at least a portion of the projection of the speaker (100) is located within the projection of the heat conducting member (400), and a portion of the projection of the heat conducting member (400) is located outside the projection of the speaker (100).

2. The electronic device according to claim 1, characterized in that: In a plane perpendicular to the thickness direction of the back cover (300), the projection of the speaker (100) is located within the projection of the heat conducting member (400), and the projection of the through hole (410) is located outside the projection of the speaker (100).

3. The electronic device according to claim 2, characterized in that: The first sound guide channel (310) is a linear structure, and the straight line where the axis of the first sound guide channel (310) is located and the straight line where the thickness direction of the back cover (300) is located are located in the same plane.

4. The electronic device according to claim 3, characterized in that: The straight line on which the axis of the first sound guide channel (310) lies is inclined relative to the thickness direction of the back cover (300), and in a plane perpendicular to the thickness direction of the back cover (300), at least a portion of the projection of an end of the first sound guide channel (310) away from the through hole (410) is located within the projection of the speaker (100).

5. The electronic device according to claim 1, characterized in that: The frame (200) is provided with a sound cavity (210) and a second sound guide channel (220) which are connected to each other, the speaker (100) is located in the sound cavity (210), the second sound guide channel (220) is connected to the through hole (410), and the heat conductive element (400) is attached to a surface of one side of the frame (200) facing the back cover (300).

6. The electronic device according to claim 5, characterized in that: The first sound guide channel (310), the through hole (410) and the second sound guide channel (220) are all multiple in number, and the three correspond to each other one by one, and the multiple through holes (410) are arranged at intervals around the speaker (100).

7. The electronic device according to claim 5, characterized in that: The outer edge of one end of the first sound guide channel (310) that is in communication with the through hole (410) is located within the outer edge of the through hole (410).

8. The electronic device according to claim 5, characterized in that: The outer edge of one end of the second sound guide channel (220) that is in communication with the through hole (410) is located within the outer edge of the through hole (410).

9. The electronic device according to claim 5, characterized in that: The second sound guide channel (220) is a linear structure, and the straight line on which the axis of the second sound guide channel (220) lies and the straight line on which the thickness direction of the rear cover (300) lies are located in the same plane.

10. The electronic device according to claim 5, characterized in that: The electronic device comprises a protective sheet (510) and a dustproof net (520); the protective sheet (510) is provided with a plurality of sound outlet holes (511); the cross-sectional area of ​​each of the sound outlet holes (511) is smaller than the cross-sectional area of ​​the first sound guide channel (310); the protective sheet (510) is connected to a side of the back cover (300) facing away from the frame (200); an end of the first sound guide channel (310) away from the through hole (410) is connected to the sound outlet hole (511); and the dustproof net (520) is provided at both the sound outlet hole (511) and the through hole (410).

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