Quartz circuit substrate production process

Abstract

The invention discloses a quartz circuit substrate production process, which comprises the following steps: preparing tools and materials, namely a quartz plate, a copper foil, photosensitive glue, an ultraviolet exposure lamp, a chemical solution and a punching tool, cleaning the quartz plate, adopting a class 3 cleaning process to ensure that the surface is clean and dust-free, preparing a circuit pattern, designing the circuit pattern by using a computer, printing the circuit pattern on a transparent film, and forming the circuit pattern on the transparent film. The photosensitive glue is evenly smeared on the surface of the quartz plate, then the transparent film is covered with the circuit pattern printed on the transparent film, and the transparent film covered with the circuit pattern and the quartz plate are placed under an ultraviolet exposure lamp to be exposed. According to the production process of the quartz circuit substrate, the quartz glass is adopted as a production base material of the circuit substrate, so that the quartz circuit substrate is excellent in high temperature resistance, high in chemical stability, excellent in thermal conductivity, excellent in light permeability and dimensional stability, capable of providing a stable and reliable working environment and suitable for harsh application scenes such as high temperature and high frequency.

Description

Technical Field

[0001] The invention relates to the technical field related to the production of quartz circuit substrates, and in particular to a production process of quartz circuit substrates. Background Art

[0002] Circuit substrate refers to the basic material for manufacturing printed circuit boards. It connects various electronic components through different wires and spacers to achieve signal transmission and processing. It can also provide functions such as power distribution, signal amplification and timing control. Circuit boards are used in a wide range of scenarios, such as communications, automotive electronics, industrial automation, medical equipment, consumer electronics, computer hardware, etc.

[0003] However, the commonly used quartz circuit substrate production process has the following shortcomings:

[0004] 1. Most of the existing circuit substrates are made of epoxy resin, which has a relatively complex production process, poor high temperature resistance, poor thermal conductivity, good light transmittance and low dimensional stability, and has limitations in use in harsh application scenarios such as high temperature and high frequency;

[0005] 2. In the existing production process of circuit substrates, during the punching process, since the sizes of circuit substrates are different, different processing molds need to be replaced during the processing to position circuit substrates of different sizes. The operation is relatively complicated and cumbersome. When it is necessary to punch holes at different positions on the circuit substrate, the circuit substrate needs to be frequently disassembled and adjusted and then re-fixed. There are many operation steps, which affects the actual processing efficiency of the circuit substrate.

[0006] 3. The existing circuit substrate production process will generate some dust during the punching process. During the processing of the circuit substrate, a high dust-free environment is required, and it is inconvenient to adsorb and clean the dust.

[0007] Therefore, we propose a quartz circuit substrate production process to solve the above problems. Summary of the invention

[0008] The purpose of the present invention is to provide a quartz circuit substrate production process to solve the problem that most of the existing circuit substrates proposed in the above background technology are produced by epoxy resin, the production process is relatively complicated, the high temperature resistance is poor, the thermal conductivity, light transmittance and dimensional stability are not high, and the use is limited in harsh application scenarios such as high temperature and high frequency. In addition, during the punching process, due to the different sizes of the circuit substrates, different processing molds need to be replaced during the processing to position circuit substrates of different sizes, and the operation is relatively complicated and cumbersome. During processing, when it is necessary to punch holes at different positions on the circuit substrate, the circuit substrate needs to be frequently disassembled and adjusted and then re-fixed. There are many operating steps, which affects the actual processing efficiency of the circuit substrate. During the punching process, some dust will be generated, and during the processing of the circuit substrate, a high dust-free environment is required, and it is inconvenient to adsorb and clean the dust.

[0009] To achieve the above-mentioned object, the present invention provides the following technical solutions: a quartz circuit substrate production process, including preparing tools and materials, namely, a quartz plate, a copper foil, a photosensitive adhesive, an ultraviolet exposure lamp, a chemical solution and a punching tool;

[0010] It is characterized by further comprising:

[0011] Cleaning the quartz plate: Use class 3 cleaning process to ensure the surface is clean and dust-free;

[0012] Prepare circuit pattern: Design the circuit pattern using a computer and print it onto a transparent film;

[0013] Apply photosensitive adhesive: Apply photosensitive adhesive evenly on the surface of the quartz plate, and then cover it with the circuit pattern printed on the transparent film;

[0014] Exposure: Place the transparent film and quartz plate covered with the circuit pattern under an ultraviolet exposure lamp for exposure;

[0015] Development: Use chemical solution to remove the unexposed part of the photosensitive resin to expose the quartz;

[0016] Etching: Immerse the quartz plate in a hydrofluoric acid solution to etch away the quartz not protected by the photosensitive adhesive to form a circuit groove;

[0017] Copper coating: Ion spraying is used, and then copper is vacuum plated into the circuit groove of the quartz plate;

[0018] Processing table, operating table, fixing mechanism and dust collection mechanism.

[0019] Preferably, a support frame is fixed behind the upper end of the processing table, and an electric telescopic rod is installed on the upper end of the support frame, and a puncher is fixedly installed on the output end of the electric telescopic rod;

[0020] At the same time, the left and right sides of the upper end of the processing table are fixedly connected with side plates, and the middle part of the side plate is rotatably connected with an adjusting screw, and the adjusting screw is threadedly connected to the movable adjusting block, and the front and rear ends of the movable adjusting block are fixedly connected with stabilizing rods.

[0021] Preferably, the front and rear ends of the movable adjustment block are fitted with side rails, and the side rails are fixedly connected to the middle of the upper end of the processing table, and the side rails are connected to the stabilizing bar by a slot, and the front and rear sides of the upper end of the movable adjustment block are fixedly connected with convex rods.

[0022] Preferably, a left-right sliding structure is formed between the convex rod and the movable frame, a spring is provided between the movable frame and the movable adjustment block, and a fixing rod is provided through the right end of the movable frame, and the fixing rod is fixedly connected to the right end of the movable adjustment block;

[0023] At the same time, the outer surface of the fixing rod is threadedly connected with a fixing cap, and the fixing cap is fitted on the right end of the movable frame, and the upper left end of the movable frame is fixedly connected with a limiting block, and the movable frame drives the limiting block to form a telescopic structure on the left side of the movable adjustment block;

[0024] Wherein, the upper end of the limit block is inserted into the fixed plug block at the corresponding position, and the fixed plug block is opened at the outer surface of the support column at the same angle.

[0025] Preferably, the fixing mechanism is arranged at an equal angle on the upper end of the operating table, and the fixing mechanism is used to press and fix the punched quartz circuit substrate;

[0026] Among them, the fixing mechanism includes a fixing bolt for adjustment, an auxiliary plate for connection, a support plate fixedly connected to the inner bottom of the auxiliary plate, a mounting plate fixedly connected to the inner upper end of the auxiliary plate, a connecting bolt threadedly connected to the upper end of the mounting plate and a fixed pressure block for clamping and fixing.

[0027] Preferably, the fixing bolt is threadedly connected to the side block, and the side block is fixedly connected to the edge of the upper end of the operating table, and a sliding structure is formed between the operating table and the auxiliary plate, and the auxiliary plate drives the support plate to form a telescopic structure at the upper end of the operating table;

[0028] The lower end of the operating table is fixedly connected with a support column, and the support column is rotatably connected to the upper end of the movable adjustment block, and the movable adjustment block forms a relative sliding structure at the upper end of the processing table.

[0029] Preferably, a rotating structure is formed between the lower end of the connecting bolt and the fixed pressing block, and the connecting bolt drives the fixed pressing block to form a telescopic structure at the upper end of the support plate, and soft rubber pads are provided at the upper end of the support plate and the lower end of the fixed pressing block.

[0030] Preferably, the dust suction mechanism is arranged at the rear end of the processing table, and the dust suction mechanism includes a suction device fixedly installed at the rear end of the processing table, a dust hood connected to the suction end of the suction device, a dustproof net plugged into the middle of the dust hood, and a positioning block for limiting.

[0031] Preferably, a sealing gasket is fitted at the connection between the dustproof net and the dust hood, and a positioning block is rotatably connected to the upper end of the dust hood, and a torsion spring is provided at the connection between the positioning block and the dust hood, and the positioning block is fitted at the upper end of the dustproof net.

[0032] This solution also provides another technical solution, a quartz circuit substrate production process, the quartz circuit substrate production process comprises the following steps:

[0033] Step 1: Press and fix quartz circuit substrates of different sizes, and adjust them to corresponding punching positions;

[0034] Step 2: Use the electric telescopic rod to drive the punching machine to move downward to punch holes in the quartz circuit substrate;

[0035] Step 3: During the drilling process, the dust generated during the drilling process can be adsorbed and cleaned by setting a dust suction mechanism;

[0036] Step 4: After the drilling is completed, the quartz circuit substrate is cleaned, the circuit pattern is prepared, the photosensitive adhesive is applied, and the exposure, development, etching and copper coating operations are performed.

[0037] Compared with the prior art, the beneficial effects of the present invention are as follows: the quartz circuit substrate production process adopts quartz glass as the production substrate of the circuit substrate, which has excellent high temperature resistance, high chemical stability, excellent thermal conductivity, excellent light transmittance and dimensional stability, so that quartz glass as the circuit substrate can provide a stable and reliable working environment, and is suitable for demanding application scenarios such as high temperature and high frequency. Moreover, through the setting of the fixing mechanism, it is convenient to press and position quartz circuit substrates of different sizes, and there is no need to replace different molds according to different models and sizes of the quartz circuit substrate, which improves the convenience in the processing process. In combination with the movable adjustment block moving left and right at the upper end of the processing table, and the support column and the upper end of the movable adjustment block rotating, the operating table drives the punching position of the quartz circuit substrate to adjust, and there is no need to frequently disassemble, adjust and re-fix the quartz circuit substrate, which saves actual operation steps, thereby improving the processing efficiency of the quartz circuit substrate. In addition, in combination with the setting of the dust collection mechanism, it is convenient to adsorb and clean the dust generated during the punching process, so as to keep the processing environment in accordance with the requirements of dust-free processing.

[0038] 1. The movable adjustment block and the support column are provided. The movable adjustment block moves on the upper end of the processing table, and the support column rotates on the upper end of the movable adjustment block, so that the operating table drives the punching position of the quartz circuit substrate to be adjusted. There is no need to disassemble and adjust the quartz circuit substrate multiple times according to the different punching positions during the processing, and then re-fix it, which greatly simplifies the actual operation steps and improves the processing efficiency of the quartz circuit substrate;

[0039] 2. A fixing mechanism is provided, which is arranged at an equal angle on the upper end of the operating table, and includes a fixing bolt, an auxiliary plate, a support plate, a mounting plate, a connecting bolt and a fixing block. Through the setting of the fixing mechanism, it is convenient to press and fix the quartz circuit substrates of different sizes and models to be processed, without changing different molds;

[0040] 3. A dust suction mechanism is provided, which is arranged at the rear end of the processing table, and the dust suction mechanism includes a suction device, a dust hood, a dustproof net and a positioning block. Through the setting of the dust suction mechanism, it is convenient to adsorb and clean the dust generated during the processing, prevent the dust from polluting the surrounding environment, and make the processing environment meet the dust-free requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0042] Figure 2 It is a rear view structural schematic diagram of the present invention;

[0043] Figure 3 It is a front view structural schematic diagram of the present invention;

[0044] Figure 4 This is a schematic diagram of the upward-looking structure of the movable adjustment block, the side rails and the operating table of the present invention;

[0045] Figure 5 This is a schematic diagram of the overall structure of the adjustment screw, the movable adjustment block, the stabilizing rod and the side rails connected to each other in the present invention;

[0046] Figure 6 This is a front view structural diagram of the movable adjustment block, the support column, the movable frame and the limit block of the present invention;

[0047] Figure 7 It is a front view structural diagram of the movable frame, the fixing rod, the fixing cap and the limiting block of the present invention;

[0048] Figure 8 It is a schematic diagram of the top view of the connection structure of the operating table, side blocks, fixing bolts and auxiliary plates of the present invention;

[0049] Fig. 9 It is a schematic diagram of the overall structure of the fixing mechanism of the present invention;

[0050] Fig.10 It is a schematic diagram of the overall structure of the dust collection mechanism of the present invention;

[0051] Fig.11 This is a schematic diagram of the front view structure of the dust cover and the dustproof net connected to each other in the present invention;

[0052] Fig.12 The figure is a schematic diagram of the process flow of the quartz circuit substrate processing of the present invention.

[0053] In the figure: 1. processing table; 2. support frame; 3. electric telescopic rod; 4. punching machine; 5. side panel; 6. adjusting screw; 7. movable adjusting block; 8. stabilizing rod; 9. side rail; 10. supporting column; 11. movable frame; 12. protruding rod; 13. spring; 14. fixing rod; 15. fixing cap; 16. limiting block; 17. fixing plug block; 18. operating table; 19. side block; 20. fixing mechanism; 21. fixing bolt; 22. auxiliary plate; 23. supporting plate; 24. mounting plate; 25. connecting bolt; 26. fixing pressure block; 27. dust suction mechanism; 28. air suction equipment; 29. ​​dust suction hood; 30. dustproof net; 31. positioning block. DETAILED DESCRIPTION

[0054] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0055] See also Figure 1-12 The present invention provides a technical solution: a quartz circuit substrate production process, including a processing table 1, a support frame 2, an electric telescopic rod 3, a punch 4, a side plate 5, an adjustment screw 6, an active adjustment block 7, a stabilizing rod 8, a side rail 9, a support column 10, a movable frame 11, a convex rod 12, a spring 13, a fixing rod 14, a fixing cap 15, a limit block 16, a fixing plug 17, an operating table 18, a side block 19, a fixing mechanism 20, a fixing bolt 21, an auxiliary plate 22, a support plate 23, a mounting plate 24, a connecting bolt 25, a fixing pressure block 26, a dust suction mechanism 27, a suction device 28, a dust suction cover 29, a dustproof net 30 and a positioning block 31.

[0056] When drilling holes in a quartz circuit substrate, Figure 1 , Figure 3 , Figure 8 and Fig. 9As shown, an operating table 18 is arranged above the processing table 1, and a side block 19 is fixedly connected to the edge of the upper end of the operating table 18, and a fixing mechanism 20 is arranged at an equal angle at the upper end of the operating table 18, and the fixing mechanism 20 includes a fixing bolt 21 for adjustment, an auxiliary plate 22 for connection, a support plate 23 fixedly connected to the inner bottom of the auxiliary plate 22, a mounting plate 24 fixedly connected to the inner upper end of the auxiliary plate 22, a connecting bolt 25 threadedly connected to the upper end of the mounting plate 24 and a fixed pressing block 26 for pressing and fixing. First, according to the The sizes and models of the processed quartz circuit substrates are different. By rotating the fixing bolt 21 threadedly connected to the middle of the side block 19, the fixing bolt 21 and the auxiliary plate 22 are rotated, thereby driving the auxiliary plate 22 and the side block 19 to slide, so that the auxiliary plate 22 drives the support plate 23 to extend and retract at the upper end of the operating table 18, and the position of the support plate 23 is adjusted, so that it is convenient to clamp and fix quartz circuit substrates of different sizes, and there is no need to replace different molds to achieve positioning when processing quartz circuit substrates of different sizes and models;

[0057] After the adjustment is completed, the processed quartz circuit substrate is directly placed on the support plate 23. At the same time, the upper end of the support plate 23 and the lower end of the fixed pressing block 26 are provided with soft rubber pads, which can play a good buffering and protective role during clamping to prevent damage to the quartz circuit substrate. Then, the connecting bolt 25 at the upper end of the threaded connection mounting plate 24 is directly rotated, and the lower end of the connecting bolt 25 is rotatably connected to the fixed pressing block 26. The connecting bolt 25 drives the fixed pressing block 26 to extend and retract at the upper end of the support plate 23, so that the fixed pressing block 26 moves downward to press and fix the quartz circuit substrate at the upper end of the support plate 23, thereby realizing the positioning of the quartz circuit substrate and preventing the quartz circuit substrate from being offset during the punching process.

[0058] Then, the electric telescopic rod 3 and the punching machine 4 installed at the upper end of the support frame 2 are started, and the electric telescopic rod 3 drives the punching machine 4 to move downward to punch holes in the quartz circuit substrate. Figure 2 , Fig.10 and Fig.11 As shown, a dust suction mechanism 27 is provided at the rear end of the processing table 1, and the dust suction mechanism 27 includes a suction device 28 fixedly installed at the rear end of the processing table 1, a dust hood 29 connected to the suction end of the suction device 28, a dustproof net 30 plugged into the middle of the dust hood 29, and a positioning block 31 for limiting. The suction device 28 performs suction, and at this time, the dust generated during the punching process can be adsorbed into the dust hood 29 for collection. The dustproof net 30 is plugged into the dust hood 29 to prevent dust from entering the suction device 28. Through the above operation, the entire processing environment can meet the requirements of dust-free processing.

[0059] When it is necessary to drill holes at different locations on the quartz circuit substrate, such as Figure 3, Figure 4 , Figure 5 , Figure 6 and Figure 7 As shown, by rotating the adjusting screw 6, the adjusting screw 6 rotates in the middle of the side plate 5, and the adjusting screw 6 is threadedly connected to the movable adjusting block 7, thereby driving the movable adjusting block 7 to move on the upper end of the processing table 1. At the same time, the front and rear ends of the movable adjusting block 7 are fixedly connected with the stabilizing rod 8, and the stabilizing rod 8 is connected with the side rail 9 by a slot. When the movable adjusting block 7 moves left and right, it drives the stabilizing rod 8 and the side rail 9 to slide, thereby improving the stability of the movable adjusting block 7 moving on the upper end of the processing table 1. The movable adjusting block 7 can make the operating table 18 drive the quartz circuit substrate to move, so as to adjust the punching position, and the fixing cap 15 threadedly connected to the outer surface of the fixing rod 14 can be rotated. The fixing cap 15 and the movable frame 11 are fitted together, and the fixing cap 15 pushes the movable frame 11 to move leftward. At this time, the movable frame 11 slides with the convex rod 12, thereby improving the stability of the movable frame 11 during the movement.

[0060] During the movement of the movable frame 11 to the left, the spring 13 is squeezed, so that the spring 13 is elastically deformed, and the upper left end of the movable frame 11 is fixedly connected to the limit block 16. The movable frame 11 drives the limit block 16 to move to the left and is pulled out from the fixed plug block 17, thereby loosening the limit between the support column 10 and the movable adjustment block 7, and then the operating table 18 is dialed. The operating table 18 is fixedly connected to the support column 10, and the operating table 18 drives the support column 10 to rotate at the upper end of the movable adjustment block 7, thereby driving the quartz circuit substrate to rotate and adjust, so as to adjust the punching position of the quartz circuit substrate. Under the punching machine 4, after the adjustment is completed, the fixing cap 15 is rotated in the opposite direction, and the fixing cap 15 moves to the right. At this time, the spring 13 restores its elastic deformation, pushing the movable frame 11 to move to the right, and the movable frame 11 slides with the fixing rod 14. The outer surface of the support column 10 is provided with a fixed plug 17 at an equal angle. At this time, the movable frame 11 drives the limit block 16 to engage in the fixed plug 17 at the corresponding position, thereby facilitating the limit between the support column 10 and the movable adjustment block 7. After the adjustment is completed, the punching machine 4 is driven downward by the electric telescopic rod 3 to perform the punching operation on the corresponding position of the quartz circuit substrate;

[0061] Then repeat the above operation to process the quartz circuit substrate in batches. After the processing is completed, Fig.10 and Fig.11As shown, by rotating the positioning stopper 31, the positioning stopper 31 rotates at the upper end of the dust hood 29, and the torsion spring at the connection between the positioning stopper 31 and the dust hood 29 is elastically deformed, and the positioning stopper 31 is disengaged from the upper end of the dustproof net 30, thereby loosening the limit between the dustproof net 30 and the dust hood 29, and then the dustproof net 30 is pulled upward to be taken out from the middle of the dust hood 29, so that the dustproof net 30 is easy to disassemble and clean;

[0062] In addition, after the punching operation of the quartz circuit substrate is completed, the quartz circuit substrate is subsequently processed. First, the quartz plate is cleaned, and a class 3 cleaning process is used to ensure that the surface is clean and dust-free. Then, the circuit pattern is prepared, and the circuit pattern is designed using a computer and printed on a transparent film. Then, photosensitive glue is applied, and the photosensitive glue is evenly applied on the surface of the quartz plate, and then the circuit pattern printed on the transparent film is covered. Then, exposure is performed, and the transparent film covered with the circuit pattern and the quartz plate are placed under an ultraviolet exposure lamp for exposure, and then development is performed. The photosensitive glue of the unexposed part is removed with a chemical solution to expose the quartz, and then etching is performed. The quartz plate is immersed in a hydrofluoric acid solution to etch away the quartz that is not protected by the photosensitive glue to form a circuit groove, and finally copper is coated, and ion spraying is used, and then copper is vacuum plated into the circuit groove of the quartz plate;

[0063] Finally, the processing of the quartz substrate is completed.

[0064] The contents not described in detail in this specification belong to the prior art known to professional and technical personnel in the field. The standard parts used in the present invention can be purchased from the market, and special-shaped parts can be customized according to the description in the specification and the drawings. The specific connection methods of each part adopt the conventional means such as mature bolts, rivets, welding, etc. in the prior art. The machinery, parts and equipment adopt the conventional models in the prior art, and the circuit connection adopts the conventional connection method in the prior art, which will not be described in detail here.

[0065] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A quartz circuit substrate production process, including preparing tools and materials, namely quartz plate, copper foil, photosensitive adhesive, ultraviolet exposure lamp, chemical solution and punching tool; It is characterized in that Also includes: Cleaning the quartz plate: Use class 3 cleaning process to ensure the surface is clean and dust-free; Prepare circuit pattern: Design the circuit pattern using a computer and print it onto a transparent film; Apply photosensitive adhesive: Apply photosensitive adhesive evenly on the surface of the quartz plate, and then cover it with the circuit pattern printed on the transparent film; Exposure: Place the transparent film and quartz plate covered with the circuit pattern under an ultraviolet exposure lamp for exposure; Development: Use chemical solution to remove the unexposed part of the photosensitive resin to expose the quartz; Etching: Immerse the quartz plate in a hydrofluoric acid solution to etch away the quartz not protected by the photosensitive adhesive to form a circuit groove; Copper coating: Ion spraying is used, and then copper is vacuum plated into the circuit groove of the quartz plate; A processing table (1), an operating table (18), a fixing mechanism (20) and a dust collecting mechanism (27).

2. A quartz circuit substrate production process according to claim 1, characterized in that: A support frame (2) is fixed behind the upper end of the processing table (1), an electric telescopic rod (3) is installed on the upper end of the support frame (2), and a punching machine (4) is fixedly installed on the output end of the electric telescopic rod (3); At the same time, the left and right sides of the upper end of the processing table (1) are fixedly connected to side plates (5), and the middle part of the side plates (5) is rotatably connected to an adjusting screw (6), and the adjusting screw (6) is threadedly connected to the movable adjusting block (7), and the front and rear ends of the movable adjusting block (7) are fixedly connected to stabilizing rods (8).

3. A quartz circuit substrate production process according to claim 2, characterized in that: The front and rear ends of the movable adjustment block (7) are fitted with side rails (9), and the side rails (9) are fixedly connected to the middle of the upper end of the processing table (1), and the side rails (9) are connected to the stabilizing rod (8) by a slot, and the front and rear sides of the upper end of the movable adjustment block (7) are fixedly connected with convex rods (12).

4. A quartz circuit substrate production process according to claim 3, characterized in that: A left-right sliding structure is formed between the protruding rod (12) and the movable frame (11), a spring (13) is provided between the movable frame (11) and the movable adjustment block (7), a fixing rod (14) is provided through the right end of the movable frame (11), and the fixing rod (14) is fixedly connected to the right end of the movable adjustment block (7); At the same time, a fixing cap (15) is threadedly connected to the outer surface of the fixing rod (14), and the fixing cap (15) is fitted on the right end of the movable frame (11), and the upper left end of the movable frame (11) is fixedly connected to a limiting block (16), and the movable frame (11) drives the limiting block (16) to form a telescopic structure on the left side of the movable adjustment block (7); The upper end of the limit block (16) is inserted into a fixed plug block (17) at a corresponding position, and the fixed plug block (17) is provided at an equal angle on the outer surface of the support column (10).

5. The quartz circuit substrate production process according to claim 1, characterized in that: The fixing mechanism (20) is arranged at an equal angle on the upper end of the operating table (18), and the fixing mechanism (20) is used to press and fix the punched quartz circuit substrate; The fixing mechanism (20) comprises a fixing bolt (21) for adjustment, an auxiliary plate (22) for connection, a support plate (23) fixedly connected to the inner bottom of the auxiliary plate (22), a mounting plate (24) fixedly connected to the inner upper end of the auxiliary plate (22), a connecting bolt (25) threadedly connected to the upper end of the mounting plate (24), and a fixing block (26) for clamping and fixing.

6. A quartz circuit substrate production process according to claim 5, characterized in that: The fixing bolt (21) is threadedly connected to the side block (19), and the side block (19) is fixedly connected to the edge of the upper end of the operating table (18), and a sliding structure is formed between the operating table (18) and the auxiliary plate (22), and the auxiliary plate (22) drives the support plate (23) to form a telescopic structure at the upper end of the operating table (18); The lower end of the operating table (18) is fixedly connected to a support column (10), and the support column (10) is rotatably connected to the upper end of a movable adjustment block (7), and the movable adjustment block (7) forms a relative sliding structure at the upper end of the processing table (1).

7. The quartz circuit substrate production process according to claim 5, characterized in that: A rotating structure is formed between the lower end of the connecting bolt (25) and the fixed pressing block (26), and the connecting bolt (25) drives the fixed pressing block (26) to form a telescopic structure at the upper end of the supporting plate (23), and soft rubber pads are provided at the upper end of the supporting plate (23) and the lower end of the fixed pressing block (26).

8. The quartz circuit substrate production process according to claim 1, characterized in that: The dust suction mechanism (27) is arranged at the rear end of the processing table (1), and comprises a suction device (28) fixedly mounted at the rear end of the processing table (1), a dust suction hood (29) connected to the suction end of the suction device (28), a dustproof net (30) plugged into the middle of the dust suction hood (29), and a positioning block (31) for limiting position.

9. A quartz circuit substrate production process according to claim 8, characterized in that: A sealing gasket is fitted at the connection between the dustproof net (30) and the dust hood (29), and a positioning stopper (31) is rotatably connected to the upper end of the dust hood (29), and a torsion spring is provided at the connection between the positioning stopper (31) and the dust hood (29), and the positioning stopper (31) is fitted at the upper end of the dustproof net (30).

10. A quartz circuit substrate production process as claimed in claim 1, characterized in that: The quartz circuit substrate production process comprises the following steps: Step 1: Press and fix quartz circuit substrates of different sizes, and adjust them to corresponding punching positions; Step 2: The electric telescopic rod (3) drives the punching machine (4) to move downward to perform a punching operation on the quartz circuit substrate; Step 3: During the drilling process, the dust generated during the drilling process can be adsorbed and cleaned by setting a dust suction mechanism (27); Step 4: After the drilling is completed, the quartz circuit substrate is cleaned, the circuit pattern is prepared, the photosensitive adhesive is applied, and the exposure, development, etching and copper coating operations are performed.

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