A temporary bonding device for image sensor manufacturing

Abstract

The present invention relates to the field of semiconductors, and provides a method for thinning a silicon layer for making an image sensor, comprising the following steps: temporarily bonding a wafer and a temporary substrate carrier by using a temporary bonding device; the temporary bonding device comprises a base, a stand, a high-speed rotation drive device, a support, a lifting drive device, a heater, a pressing plate, a motor, a first gear and a supporting toothed plate, a first vacuum negative pressure device is provided on the support, the lifting drive device and the motor are both fixedly connected to the stand, the heater is fixedly connected to the lifting drive device, the pressing plate is fixedly connected to the heater, a second vacuum negative pressure device is provided on the pressing plate, the first gear is fixedly connected to the first gear output shaft, the supporting toothed plate is slidably connected to the stand, the supporting toothed plate is meshed with the first gear; a wind dust removal component and an automatic liquid coating component are provided on the supporting toothed plate. The present invention automatically causes a quantitative amount of bonding liquid to drip onto the surface of the wafer without manual dripping.

Description

Technical Field

[0001] The invention relates to the field of semiconductor technology, and in particular to a temporary bonding device for manufacturing an image sensor. Background Art

[0002] Image sensors are devices that convert subject information received through a lens into electronic image signals, and wafers are essential components in the production of image sensors.

[0003] There is a silicon layer in the wafer. In order to increase the integration and reduce the chip volume, the silicon layer needs to be thinned. In the prior art, the Chinese authorized invention patent with publication number CN113690183B discloses a wafer thinning method, which relates to the field of semiconductor technology and is used to solve the problems of low yield, complex process and high preparation cost of SiC power devices. The wafer can be understood as a composite substrate, including a first silicon carbide layer, a dielectric layer and a second silicon carbide layer stacked in layers. The wafer has a first side and a second side opposite to each other, and the side of the second silicon carbide layer away from the first silicon carbide layer is the first side of the wafer. The wafer thinning method includes: temporarily bonding a temporary substrate carrier to the wafer on the second side; irradiating the wafer with a laser from the first side so that the energy of the laser is focused and ablated at the interface between the second silicon carbide layer and the dielectric layer, so that the second silicon carbide layer is separated from the dielectric layer.

[0004] However, when the temporary substrate carrier of the above-mentioned patent is temporarily bonded to the wafer, it is generally necessary to manually apply the bonding liquid, which reduces the bonding efficiency. Summary of the invention

[0005] In view of the above technical problems, the present invention aims to provide a temporary bonding device for image sensor manufacturing. To solve the above technical problems, the present invention adopts the following technical solutions:

[0006] A temporary bonding device for image sensor manufacturing, comprising the following steps:

[0007] Temporarily bonding the wafer and the temporary substrate carrier using a temporary bonding device;

[0008] The temporary bonding device includes a base, a stand, a high-speed rotation drive device, a support platform, a lifting drive device, a heater, a pressing plate, a motor, a first gear and a supporting toothed plate. The stand and the high-speed rotation drive device are both fixedly connected to the top wall of the base, the support platform is fixedly connected to the output shaft of the high-speed rotation drive device, a first vacuum negative pressure device is arranged on the support platform, the lifting drive device and the motor are both fixedly connected to the stand, the heater is fixedly connected to the lifting drive device, the pressing plate is fixedly connected to the heater, a second vacuum negative pressure device is arranged on the pressing plate, the first gear is fixedly connected to the output shaft of the motor, the supporting toothed plate is slidably connected to the stand, and the supporting toothed plate is meshed with the first gear;

[0009] A wind dust removal component and an automatic liquid coating component are arranged on the supporting tooth plate.

[0010] Furthermore, the supporting tooth plate is provided with an air production channel and an air outlet channel, the air production channel and the air outlet channel are connected, and the air outlet channel is connected to the top wall and the bottom wall of the supporting tooth plate;

[0011] The wind dust removal assembly includes a fan blade, an accelerator and a second gear. The fan blade is fixedly connected to the output shaft of the accelerator, the second gear is fixedly connected to the input shaft of the accelerator, the accelerator is fixedly connected to the supporting gear plate, the second gear is located outside the supporting gear plate, the fan blade is located inside the wind production channel, and the first transmission rack is fixedly connected to the vertical frame. The second gear can engage and disengage with the first transmission rack when moving.

[0012] Furthermore, the supporting tooth plate is provided with a liquid storage cavity and a gear cavity, the top wall of the liquid storage cavity is connected to the top wall of the supporting tooth plate through a first channel, the bottom wall of the liquid storage cavity is connected to the top wall of the gear cavity through a second channel, the gear cavity is connected to the outer wall of the supporting tooth plate, and the liquid storage cavity is filled with bonding liquid;

[0013] The automatic liquid coating assembly includes a third gear, an anti-blocking rack, an extension piece, a first elastic member, a fourth gear and a stirring rod. The third gear is rotatably connected to the inner wall of the gear cavity, the third gear extends to the outside of the supporting tooth plate, a gear through hole is provided on the third gear, the anti-blocking rack is slidably connected to the supporting tooth plate, the upper end of the anti-blocking rack extends to above the supporting tooth plate, the lower end of the anti-blocking rack extends into the liquid storage cavity, the extension piece is fixedly connected to the anti-blocking rack, the extension piece is connected to the top wall of the supporting tooth plate through the first elastic member, the fourth gear is rotatably connected to the inner wall of the liquid storage cavity, the fourth gear is meshed with the anti-blocking rack, the stirring rod is fixedly connected to the fourth gear, a transmission seat and a second transmission rack are fixedly connected to the stand, and a wavy surface is provided on the bottom wall of the transmission seat.

[0014] Furthermore, a liquid adding component is provided on the stand.

[0015] Furthermore, the liquid adding component includes a hollow block, a transmission bar, a first wedge block, a baffle, a sponge block, a second elastic member, a second wedge block, and a liquid adding box. The hollow block is slidably connected to the inner wall of the liquid storage cavity. The transmission bar is fixedly connected to the top wall of the hollow block. The transmission bar extends above the supporting tooth plate. The first wedge block is fixedly connected to the transmission bar. The first wedge block is located outside the supporting tooth plate. A plate groove is provided on the supporting tooth plate. The plate groove is connected to the first channel. The baffle is slidably connected to the inner wall of the plate groove. The baffle is connected to the inner wall of the plate groove through the second elastic member. The second wedge block is fixedly connected to the baffle. The baffle and the inner wall of the first channel are abutted. The sponge block is fixedly connected to the top wall of the supporting tooth plate. The liquid adding box is fixedly connected to the stand. A reserve liquid cavity is provided on the liquid adding box. The reserve liquid cavity is filled with The standby bonding liquid is filled, and the bottom wall of the standby liquid cavity is connected with the bottom wall of the liquid adding box through the liquid outlet channel. A third channel is provided on the side wall of the liquid outlet channel, and a transmission groove is provided on the bottom wall of the liquid adding box. The inner wall of the transmission groove is slidably connected with a first L-shaped plate and a second L-shaped plate. The first L-shaped plate is connected to the inner wall of the transmission groove through a third elastic member, and the horizontal section of the first L-shaped plate extends into the transmission groove. The first L-shaped plate and the inner wall of the liquid outlet channel are abutted against each other, and the vertical section of the first L-shaped plate extends to the bottom of the liquid adding box. The second L-shaped plate is connected to the inner wall of the transmission groove through a fourth elastic member, and a plate through hole is provided on the second L-shaped plate. The horizontal section of the second L-shaped plate extends into the third channel, and the vertical section of the second L-shaped plate extends to the bottom of the liquid adding box. The lowest point of the vertical section of the second L-shaped plate is higher than the lowest point of the vertical section of the first L-shaped plate.

[0016] Furthermore, a roller is rotatably connected to the anti-blocking rack.

[0017] Furthermore, the anti-blocking rack, the fourth gear and the stirring rod are all made of stainless steel.

[0018] Furthermore, the anti-blocking rack is located directly above the second channel, and the anti-blocking rack can be inserted into the second channel when it moves.

[0019] Furthermore, a baffle frame is fixedly connected to the top wall of the base, and the support platform is located in the baffle frame.

[0020] Furthermore, an annular recovery box is detachably connected to the inner wall of the baffle frame, and a recovery cavity is provided on the annular recovery box.

[0021] The present invention has the following beneficial effects:

[0022] The present invention can temporarily support the substrate carrier by the supporting tooth plate, and when the supporting tooth plate releases the support for the substrate carrier, a certain amount of bonding liquid is automatically dripped onto the wafer surface without manual dripping, thereby improving bonding efficiency and reducing resource waste. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The present invention is further described using the accompanying drawings, but the embodiments in the accompanying drawings do not constitute any limitation to the present invention. A person skilled in the art can obtain other drawings based on the following drawings without creative work.

[0024] Figure 1 It is a structural schematic diagram of a temporary bonding device for manufacturing an image sensor according to the present invention;

[0025] Figure 2 The present invention Figure 1 A schematic diagram of the structure of the middle baffle frame;

[0026] Figure 3 The present invention Figure 1 The enlarged view of point A in the middle;

[0027] Figure 4 The present invention Figure 3 Exploded view of the fourth gear and stirring rod;

[0028] Figure 5 The present invention Figure 1 The enlarged view of point B in the middle;

[0029] Figure 6 The present invention Figure 5 The structural diagram of the middle liquid filling tank;

[0030] Figure 7 The present invention Figure 1 The structural diagram of the supporting tooth plate is omitted.

[0031] Figure numerals: 1, base; 2, stand; 3, high-speed rotation drive device; 4, support platform; 5, baffle frame; 6, lifting drive device; 7, heater; 8, pressure plate; 9, motor; 10, first gear; 11, supporting gear plate; 12, transmission seat; 13, first transmission rack; 14, second transmission rack; 15, air production channel; 16, air outlet channel; 17, fan blade; 18, accelerator; 19, second gear; 20, liquid storage chamber; 21, first channel; 22, second channel; 23, gear chamber; 24, third gear; 25, gear through hole; 26, roller; 27, anti-blocking Rack; 28. Extension piece; 29. ​​First elastic member; 30. Fourth gear; 31. Stirring rod; 32. Hollow block; 33. Transmission bar; 34. First wedge block; 35. Baffle; 351. Sponge block; 36. Second elastic member; 37. Second wedge block; 38. Plate slot; 39. Bonding liquid; 40. Liquid adding box; 41. Liquid reserve chamber; 42. Transmission slot; 43. Liquid outlet channel; 44. First L-shaped plate; 45. Third elastic member; 46. Second L-shaped plate; 47. Plate through hole; 48. Fourth elastic member; 49. Third channel; 50. Annular recovery box; 51. Recovery chamber. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] In the description of the present invention, it should be noted that the terms "vertical", "upper", "lower", "horizontal", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, "first", "second", "third", and "fourth" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0034] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection, it can be a mechanical connection, it can be an electrical connection, it can be a direct connection, it can be connected through an intermediate medium, and it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0035] like Figure 1 , 3 , 4, and 7, a temporary bonding device for image sensor manufacturing includes the following steps:

[0036] Temporarily bonding the wafer and the temporary substrate carrier using a temporary bonding device;

[0037] The temporary bonding device includes a base 1, a stand 2, a high-speed rotating drive device 3, a support 4, a lifting drive device 6, a heater 7, a pressing plate 8, a motor 9, a first gear 10 and a supporting tooth plate 11. The stand 2 and the high-speed rotating drive device 3 are fixedly connected to the top wall of the base 1, the support 4 is fixedly connected to the output shaft of the high-speed rotating drive device 3, the support 4 is provided with a first vacuum negative pressure device, the lifting drive device 6 and the motor 9 are fixedly connected to the stand 2, the heater 7 is fixedly connected to the lifting drive device 6, the heater 7 is heated by an internal heating wire, the pressing plate 8 is fixedly connected to the heater 7, and the pressing plate 8 is fixedly connected to the heater 7. A second vacuum negative pressure device is provided on the plate 8, and the second vacuum negative pressure device can generate negative pressure. The first gear 10 is fixedly connected to the output shaft of the motor 9, and the supporting gear plate 11 is slidably connected to the stand 2. The supporting gear plate 11 is meshed with the first gear 10. The first vacuum negative pressure device and the second vacuum negative pressure device are both devices that use the negative pressure principle to adsorb and fix objects. They are widely used in medical, industrial, scientific research and other fields. Here, they are used in the field of wafer preparation. The working principle is to use a vacuum pump to extract the air inside the device to form a negative pressure environment, thereby adsorbing objects under the action of external atmospheric pressure;

[0038] The supporting tooth plate 11 is provided with a wind dust removal component and an automatic liquid coating component.

[0039] like Figure 1 , 7 As shown, according to an optional embodiment of the present invention, the supporting tooth plate 11 is provided with an air production channel 15 and an air outlet channel 16, the air production channel 15 and the air outlet channel 16 are connected, and the air outlet channel 16 is connected to the top wall and the bottom wall of the supporting tooth plate 11;

[0040] The wind dust removal assembly includes a fan blade 17, an accelerator 18 and a second gear 19. The fan blade 17 is fixedly connected to the output shaft of the accelerator 18, the second gear 19 is fixedly connected to the input shaft of the accelerator 18, and the accelerator 18 is fixedly connected to the supporting gear plate 11. The accelerator 18 can adopt a planetary gear accelerator. The planetary gear accelerator realizes the speed change function through the internal sun gear, planetary gear and ring gear and other mechanisms. The second gear 19 is located outside the supporting gear plate 11, and the fan blade 17 is located inside the wind production channel 15. The first transmission rack 13 is fixedly connected to the stand 2, and the second gear 19 can engage and disengage with the first transmission rack 13 when moving.

[0041] like Figure 1 , 3 7, according to an optional embodiment of the present invention, the support tooth plate 11 is provided with a liquid storage chamber 20 and a gear chamber 23, the top wall of the liquid storage chamber 20 is connected to the top wall of the support tooth plate 11 through the first channel 21, the bottom wall of the liquid storage chamber 20 is connected to the top wall of the gear chamber 23 through the second channel 22, the gear chamber 23 is connected to the outer wall of the support tooth plate 11, and the liquid storage chamber 20 is filled with a bonding liquid 39;

[0042] The automatic coating assembly includes a third gear 24, an anti-blocking rack 27, an extension piece 28, a first elastic member 29, a fourth gear 30 and a stirring rod 31. The third gear 24 is rotatably connected to the inner wall of the gear cavity 23, the third gear 24 extends to the outside of the supporting toothed plate 11, a gear through hole 25 is provided on the third gear 24, the anti-blocking rack 27 is slidably connected to the supporting toothed plate 11, the upper end of the anti-blocking rack 27 extends above the supporting toothed plate 11, the lower end of the anti-blocking rack 27 extends into the liquid storage cavity 20, and the extension piece 28 It is fixed on the anti-blocking rack 27, the extension piece 28 is connected to the top wall of the supporting tooth plate 11 through the first elastic member 29, the fourth gear 30 is rotatably connected to the inner wall of the liquid storage chamber 20, the fourth gear 30 is meshed with the anti-blocking rack 27, the stirring rod 31 is fixed to the fourth gear 30, the stand 2 is fixed with a transmission seat 12 and a second transmission rack 14, the bottom wall of the transmission seat 12 is provided with a wavy surface, and the anti-blocking rack 27 can be against the wavy surface of the transmission seat 12 when it moves horizontally, so that the anti-blocking rack 27 can reciprocate up and down.

[0043] like Figure 1 , 3 As shown in Figures 5, 6 and 7, according to an optional embodiment of the present invention, a liquid adding component is provided on the stand 2, and the liquid adding component can automatically add spare bonding liquid into the liquid storage cavity 20.

[0044] like Figure 1 , 3, 5, 6, and 7, according to an optional embodiment of the present invention, the liquid adding component includes a hollow block 32, a transmission bar 33, a first wedge block 34, a baffle 35, a sponge block 351, a second elastic member 36, a second wedge block 37, and a liquid adding box 40, the hollow block 32 is slidably connected to the inner wall of the liquid storage chamber 20, the hollow block 32 can float on the surface of the bonding liquid 39, and move up and down according to the height of the bonding liquid 39, the transmission bar 33 is fixed to the top wall of the hollow block 32, and the transmission bar 33 extends to the inner wall of the liquid storage chamber 20. Above the supporting toothed plate 11, a first wedge block 34 is fixedly connected to the transmission bar 33, the first wedge block 34 is located outside the supporting toothed plate 11, a plate groove 38 is opened on the supporting toothed plate 11, the plate groove 38 is communicated with the first channel 21, a baffle 35 is slidably connected to the inner wall of the plate groove 38, the baffle 35 is connected to the inner wall of the plate groove 38 through a second elastic member 36, a second wedge block 37 is fixedly connected to the baffle 35, the baffle 35 and the inner wall of the first channel 21 are against each other, a sponge block 351 is fixedly connected to the top wall of the supporting toothed plate 11, and a liquid adding box 40 is fixedly connected to the supporting toothed plate 11. On the stand 2, a liquid adding box 40 is provided with a liquid reserve chamber 41, and the liquid reserve chamber 41 is filled with a liquid reserve bonding liquid, and the composition of the liquid reserve bonding liquid and the bonding liquid 39 is the same. The bottom wall of the liquid reserve chamber 41 is connected to the bottom wall of the liquid adding box 40 through a liquid outlet channel 43, and a third channel 49 is provided on the side wall of the liquid outlet channel 43. The bottom wall of the liquid adding box 40 is provided with a transmission groove 42, and the inner wall of the transmission groove 42 is slidably connected with a first L-shaped plate 44 and a second L-shaped plate 46. The first L-shaped plate 44 is connected to the inner wall of the transmission groove 42 through a third elastic member 45. The first L-shaped plate 44 is connected to the inner wall of the transmission groove 42 through a third elastic member 45. The horizontal section of the L-shaped plate 44 extends into the transmission groove 42, the first L-shaped plate 44 abuts against the inner wall of the liquid outlet channel 43, the vertical section of the first L-shaped plate 44 extends to the bottom of the liquid adding box 40, the second L-shaped plate 46 is connected to the inner wall of the transmission groove 42 through the fourth elastic member 48, the second L-shaped plate 46 is provided with a plate through hole 47, the horizontal section of the second L-shaped plate 46 extends into the third channel 49, the vertical section of the second L-shaped plate 46 extends to the bottom of the liquid adding box 40, and the lowest point of the vertical section of the second L-shaped plate 46 is higher than the lowest point of the vertical section of the first L-shaped plate 44.

[0045] like Figure 1 , 3 As shown in FIG. 7 , according to an optional embodiment of the present invention, a roller 26 is rotatably connected to the anti-blocking rack 27, and the roller 26 can reduce the friction between the extension piece 28 and the wavy surface, so that the extension piece 28 can move more smoothly.

[0046] like Figure 1 , 3 As shown in FIG. 7 , according to an optional embodiment of the present invention, the anti-blocking rack 27, the fourth gear 30 and the stirring rod 31 are all made of stainless steel. Stainless steel contains a high proportion of chromium. Chromium combines with oxygen to form an extremely thin but very strong and dense chromium oxide film, which has good corrosion resistance and prevents corrosion by the bonding liquid 39.

[0047] like Figure 1 , 3 As shown in FIG. 7 , according to an optional embodiment of the present invention, the anti-blocking rack 27 is located directly above the second channel 22, and the anti-blocking rack 27 can be inserted into the second channel 22 when moving.

[0048] like Figure 1 , 2 As shown in 7, according to an optional embodiment of the present invention, a baffle frame 5 is fixedly connected to the top wall of the base 1, and the support platform 4 is located in the baffle frame 5. The baffle frame 5 can prevent the bonding liquid 39 from splashing everywhere during spin coating, causing difficulty in subsequent cleaning.

[0049] like Figure 1 , 2 As shown in Figures 7, according to an optional embodiment of the present invention, the inner wall of the baffle frame 5 is detachably connected to a ring-shaped recovery box 50, and a recovery chamber 51 is provided on the ring-shaped recovery box 50. The recovery chamber 51 can recycle the splashed bonding liquid 39, saving resources and preventing waste.

[0050] Implementation process:

[0051] When making an image sensor, a wafer needs to be made. During the wafer making process, the silicon layer needs to be thinned. The thinning step refers to the Chinese authorized invention patent with publication number CN113690183B. In addition, the method of temporarily bonding the substrate carrier and the wafer in the patent is innovated by using a temporary bonding device for automatic bonding. The working principle of the temporary bonding device is as follows:

[0052] In the initial state, the first L-shaped plate 44 blocks the liquid outlet channel 43, the plate through hole 47 is connected to the liquid outlet channel 43, the highest point of the transmission bar 33 is higher than the lowest point of the second L-shaped plate 46, the anti-blocking rack 27 is located on the left side of the transmission seat 12, and the baffle 35 blocks the first channel 21 to prevent the bonding liquid 39 from spilling out and being contaminated by external substances.

[0053] The wafer is placed on the top wall of the support platform 4, and the substrate carrier is placed on the top wall of the supporting tooth plate 11. The substrate carrier is located below the pressure plate 8. The first vacuum negative pressure device on the support platform 4 and the second vacuum negative pressure device on the pressure plate 8 are turned on. The first vacuum negative pressure device adsorbs and fixes the wafer, and the second vacuum negative pressure device adsorbs and fixes the substrate carrier. The substrate carrier is separated from the supporting tooth plate 11, and the heater 7 is operated to generate heat. The motor 9 is turned on to drive the first gear 10 to rotate clockwise, so that the supporting tooth plate 11 moves rightward. During the movement of the supporting tooth plate 11 to the right, The roller 26 will abut against the wavy surface on the transmission seat 12. Under the guidance of the wavy surface and the elastic force of the first elastic member 29, the anti-blocking rack 27 will reciprocate up and down, thereby continuously inserting into the second channel 22 to prevent the bonding liquid 39 in the second channel 22 from solidifying and blocking the second channel 22, and preventing the bonding liquid 39 from smoothly entering the gear through hole 25. The movement of the anti-blocking rack 27 will drive the fourth gear 30 to reciprocate, thereby causing the stirring rod 31 to reciprocate and stir the bonding liquid 39, further preventing the bonding liquid from solidifying.

[0054] When the supporting gear plate 11 moves to the right, the second gear 19 and the first transmission rack 13 are meshed, and the first transmission rack 13 drives the second gear 19 to rotate. After the second gear 19 is accelerated by the accelerator 18, the fan blade 17 rotates rapidly. The rapid rotation of the fan blade 17 generates wind, and the wind passes through the wind production channel 15 and enters the air outlet channel 16. The wind is ejected from the upper and lower ends of the air outlet channel 16. When the air outlet channel 16 passes between the wafer and the substrate carrier, the wind will blow off the dust on the wafer and the substrate carrier to prevent the dust from affecting the bonding quality.

[0055] When the third gear 24 moves to mesh with the second transmission rack 14, the second transmission rack 14 drives the third gear 24 to rotate, and a small amount of bonding liquid 39 exists in the gear through hole 25. The first elastic member 29 in the gear through hole 25 will be driven to the outside of the supporting tooth plate 11 and then fall to the top wall of the wafer under the action of gravity, thereby automatically adding the bonding liquid 39 without manual addition, and the coating amount can be accurately controlled.

[0056] The supporting tooth plate 11 continues to move right, and the transmission bar 33 will first push the vertical section of the second L-shaped plate 46 so that the second L-shaped plate 46 overcomes the elastic force of the fourth elastic member 48 and moves right, so that the second L-shaped plate 46 blocks the liquid outlet channel 43, and then the transmission bar 33 pushes the first L-shaped plate 44 to overcome the elastic force of the third elastic member 45 and moves right, so that the first L-shaped plate 44 is separated from the liquid outlet channel 43. Since the second L-shaped plate 46 blocks the liquid outlet channel 43, the standby bonding liquid in the standby liquid chamber 41 will not pass through the liquid outlet channel 43.

[0057] When the supporting tooth plate 11 moves to the right side of the supporting platform 4, the high-speed rotation drive device 3 is turned on to make the supporting platform 4 rotate at high speed, so that the wafer is rotated at high speed for spin coating, so that the bonding liquid 39 on the wafer is evenly distributed on the top wall of the wafer, and the splashed bonding liquid 39 is blocked by the baffle frame 5 and slides into the recovery chamber 51 for recovery to prevent waste of resources, and the lifting drive device 6 is started to move the pressure plate 8 downward, so as to perform hot pressing bonding on the substrate carrier and the wafer for 2-5s.

[0058] Each time bonding is performed, a certain amount of bonding liquid 39 in the liquid storage chamber 20 is consumed, so that the liquid level of the bonding liquid 39 in the liquid storage chamber 20 gradually decreases. The hollow block 32 decreases with the liquid level of the bonding liquid 39. After the transmission bar 33 decreases to a certain extent, the first wedge block 34 drags the second wedge block 37 to move rightward, so that the baffle 35 moves rightward. The top wall of the baffle 35 and the bottom wall of the sponge block 351 are against each other, and the baffle 35 releases the blockage of the first channel 21. When the transmission bar 33 moves rightward, it will not push the second L-shaped plate 46 to move rightward, but the transmission bar 33 will push the first L-shaped plate 44 to move rightward and then stop moving. The first L-shaped plate 44 releases the blockage of the liquid outlet channel 46. 3, so that the standby bonding liquid in the standby liquid chamber 41 passes through the liquid outlet channel 43 under the action of its own gravity and falls into the first channel 21 and then enters the liquid storage chamber 20, replenishing the bonding liquid in the liquid storage chamber 20, and the liquid level in the liquid storage chamber 20 moves up, the hollow block 32 and the first wedge block 34 move up, the first wedge block 34 breaks away from the resistance of the second wedge block 37, and the baffle plate 35 slowly moves to the left and resets under the elastic force of the second elastic member 36 and the friction force of the sponge block 351, so that the baffle plate 35 blocks the first channel 21 only after all the standby bonding liquid in the standby liquid chamber 41 falls into the liquid storage chamber 20.

[0059] The present invention can temporarily support the substrate carrier through the supporting tooth plate 11. When the supporting tooth plate 11 releases the support for the substrate carrier, the fan blades 17 can generate wind to clean the surface of the substrate carrier and the wafer by wind power to prevent dust from affecting the bonding quality. The anti-blocking rack 27 and the stirring rod 31 can be moved to prevent the bonding liquid 39 from solidifying and blocking the second channel 22. A certain amount of bonding liquid 39 is automatically dripped onto the surface of the wafer without manual dripping, thereby improving the bonding efficiency and reducing the waste of resources. The liquid level of the bonding liquid 39 can be automatically detected by the hollow block 32, so that when the bonding liquid 39 is about to be exhausted, the liquid adding box 40 can automatically replenish the liquid storage chamber 20 with spare bonding liquid without manual replenishment, thereby improving the bonding efficiency. The cooperation of the baffle frame 5 and the annular recovery box 50 can block and recover the splashed bonding liquid 39, thereby saving resources and preventing subsequent cleaning difficulties.

[0060] The components, modules, mechanisms and devices not described in detail in the present invention are all universal standard parts or components known to those skilled in the art, and their structures and principles can be known to those skilled in the art through technical manuals or conventional experimental methods.

[0061] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention, rather than to limit the scope of protection of the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solution of the present invention can be modified or replaced by equivalents without departing from the essence and scope of the technical solution of the present invention.

Claims

1. A temporary bonding device for image sensor manufacturing, characterized in that: The temporary bonding device is used to temporarily bond the wafer and the temporary substrate carrier; The temporary bonding device comprises a base (1), a stand (2), a high-speed rotation drive device (3), a support platform (4), a lifting drive device (6), a heater (7), a pressing plate (8), a motor (9), a first gear (10) and a supporting toothed plate (11); the stand (2) and the high-speed rotation drive device (3) are both fixedly connected to the top wall of the base (1); the support platform (4) is fixedly connected to the output shaft of the high-speed rotation drive device (3); a first vacuum negative pressure device is provided on the support platform (4); the lifting drive device (6) and the motor (9) are both fixedly connected to the front wall of the stand (2); the heater (7) is fixedly connected to the bottom wall of the lifting drive device (6); the pressing plate (8) is fixedly connected to the bottom wall of the heater (7); a second vacuum negative pressure device is provided on the pressing plate (8); the first gear (10) is fixedly connected to the output shaft of the motor (9); the supporting toothed plate (11) is slidably connected to the front wall of the stand (2); and the supporting toothed plate (11) is meshed with the first gear (10); A wind dust removal component and an automatic liquid coating component are arranged on the supporting tooth plate (11).

2. A temporary bonding device for image sensor manufacturing according to claim 1, characterized in that: The supporting tooth plate (11) is provided with an air generation channel (15) and an air outlet channel (16), the air generation channel (15) and the air outlet channel (16) are connected, and the air outlet channel (16) is connected to the top wall and the bottom wall of the supporting tooth plate (11); The wind dust removal component comprises a fan blade (17), an accelerator (18) and a second gear (19); the fan blade (17) is fixedly connected to the output shaft of the accelerator (18); the second gear (19) is fixedly connected to the input shaft of the accelerator (18); the accelerator (18) is fixedly connected to the inside of the supporting gear plate (11); the second gear (19) is located outside the supporting gear plate (11); the fan blade (17) is located inside the wind generating channel (15); a first transmission rack (13) is fixedly connected to the stand (2); and the second gear (19) engages with and disengages from the first transmission rack (13) when moving.

3. A temporary bonding device for image sensor manufacturing according to claim 2, characterized in that: The supporting tooth plate (11) is provided with a liquid storage chamber (20) and a gear chamber (23); the top wall of the liquid storage chamber (20) is connected to the top wall of the supporting tooth plate (11) through a first channel (21); the bottom wall of the liquid storage chamber (20) is connected to the top wall of the gear chamber (23) through a second channel (22); the gear chamber (23) is connected to the outer wall of the supporting tooth plate (11); and the liquid storage chamber (20) is filled with bonding liquid (39); The automatic coating assembly comprises a third gear (24), an anti-blocking rack (27), an extension sheet (28), a first elastic member (29), a fourth gear (30) and a stirring rod (31); the third gear (24) is rotatably connected to the inner wall of the gear cavity (23); the third gear (24) extends to the outside of the supporting toothed plate (11); a gear through hole (25) is provided on the third gear (24); the anti-blocking rack (27) is slidably connected to the supporting toothed plate (11); the upper end of the anti-blocking rack (27) extends to the upper side of the supporting toothed plate (11); The lower end of the rack (27) extends into the liquid storage chamber (20), the extension piece (28) is fixedly connected to the anti-blocking rack (27), the extension piece (28) is connected to the top wall of the supporting toothed plate (11) through the first elastic member (29), the fourth gear (30) is rotatably connected to the inner wall of the liquid storage chamber (20), the fourth gear (30) is meshed with the anti-blocking rack (27), the stirring rod (31) is fixedly connected to the fourth gear (30), the stand (2) is fixedly connected to a transmission seat (12) and a second transmission rack (14), and the bottom wall of the transmission seat (12) is provided with a wavy surface.

4. A temporary bonding device for image sensor manufacturing according to claim 3, characterized in that: A liquid adding component is arranged on the stand (2).

5. A temporary bonding device for image sensor manufacturing according to claim 4, characterized in that: The liquid adding assembly comprises a hollow block (32), a transmission bar (33), a first wedge block (34), a baffle (35), a sponge block (351), a second elastic member (36), a second wedge block (37), and a liquid adding box (40). The hollow block (32) is slidably connected to the inner wall of the liquid storage chamber (20). The transmission bar (33) is fixedly connected to the top wall of the hollow block (32). The transmission bar (33) extends to the upper part of the supporting tooth plate (11). The first wedge block (34) is fixedly connected to the transmission bar (33). The first wedge block (34) is located on the supporting tooth plate (11). 1) outside, a plate groove (38) is provided on the supporting tooth plate (11), the plate groove (38) and the first channel (21) are communicated, a baffle (35) is slidably connected to the inner wall of the plate groove (38), the baffle (35) is connected to the inner wall of the plate groove (38) through a second elastic member (36), a second wedge block (37) is fixedly connected to the baffle (35), the baffle (35) and the inner wall of the first channel (21) are abutted against each other, a sponge block (351) is fixedly connected to the top wall of the supporting tooth plate (11), a liquid adding box (40) is fixedly connected to the stand (2), and a liquid reserve chamber is provided on the liquid adding box (40) (41), the reserve liquid chamber (41) is filled with a reserve bonding liquid, the bottom wall of the reserve liquid chamber (41) is connected to the bottom wall of the liquid adding box (40) through a liquid outlet channel (43), a third channel (49) is provided on the side wall of the liquid outlet channel (43), a transmission groove (42) is provided on the bottom wall of the liquid adding box (40), a first L-shaped plate (44) and a second L-shaped plate (46) are slidably connected to the inner wall of the transmission groove (42), the first L-shaped plate (44) is connected to the inner wall of the transmission groove (42) through a third elastic member (45), and a horizontal section of the first L-shaped plate (44) extends into the transmission groove (42) The first L-shaped plate (44) and the inner wall of the liquid outlet channel (43) are in contact with each other, the vertical section of the first L-shaped plate (44) extends to the bottom of the liquid adding box (40), the second L-shaped plate (46) is connected to the inner wall of the transmission groove (42) through a fourth elastic member (48), a plate through hole (47) is provided on the second L-shaped plate (46), the horizontal section of the second L-shaped plate (46) extends into the third channel (49), the vertical section of the second L-shaped plate (46) extends to the bottom of the liquid adding box (40), and the lowest point of the vertical section of the second L-shaped plate (46) is higher than the lowest point of the vertical section of the first L-shaped plate (44).

6. A temporary bonding device for image sensor manufacturing according to claim 5, characterized in that: The anti-blocking rack (27) is rotatably connected to a roller (26).

7. A temporary bonding device for image sensor manufacturing according to claim 6, characterized in that: The anti-blocking rack (27), the fourth gear (30) and the stirring rod (31) are all made of stainless steel.

8. A temporary bonding device for image sensor manufacturing according to claim 7, characterized in that: The anti-blocking rack (27) is located directly above the second channel (22), and the anti-blocking rack (27) can be inserted into the second channel (22) when moving.

9. A temporary bonding device for image sensor manufacturing according to any one of claims 1 to 8, characterized in that: A retaining frame (5) is fixedly connected to the top wall of the base (1), and the support platform (4) is located inside the retaining frame (5).

10. A temporary bonding device for image sensor manufacturing according to claim 9, characterized in that: An annular recovery box (50) is detachably connected to the inner wall of the baffle frame (5), and a recovery chamber (51) is provided on the annular recovery box (50).

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