A high-light-efficiency LED light-emitting semiconductor and its preparation method

Abstract

The present invention belongs to the field of LED technology, solves the problem of poor light efficiency of LED in the prior art, and provides a high-light-efficiency LED light-emitting semiconductor and a preparation method thereof, which includes: an excitation chip and a phosphor. The phosphor includes a first phosphor, a second phosphor and a third phosphor, the peak wavelength of the first phosphor is located in a first wavelength range, the peak wavelength of the second phosphor is located in a second wavelength range, and the peak wavelength of the third phosphor is located in a third wavelength range; the first wavelength range is 540-550 nm, the second wavelength range is 625-635 nm, and the third wavelength range is 615-620 nm; the main wavelength of the LED excitation chip is located in a fourth wavelength range, and the fourth wavelength range is 440-470 nm. The present invention achieves higher light efficiency and stability through the synergy of the chip and the phosphor.

Description

Technical Field

[0001] The present invention relates to the field of LEDs, and in particular to a high-light-efficiency LED light-emitting semiconductor and a preparation method thereof. Background Art

[0002] With the rapid development of semiconductor lighting technology, LEDs (Light Emitting Diodes) have been widely used in general lighting, display backlighting, and other fields due to their advantages such as high efficiency, energy saving, and long life. However, traditional LED lighting devices still face certain technical bottlenecks in terms of luminous efficiency and color rendering. In particular, in applications with high color rendering requirements (such as display backlights and high color rendering index lamps), their luminous efficiency is generally low, failing to meet the demand for high-quality light sources. This is primarily because traditional LED devices rely on a single type of phosphor or a mixture of phosphors, which cannot precisely control the output ratio of different wavelengths. This results in reduced overall luminous efficiency and makes it difficult to achieve ideal lighting effects.

[0003] Specifically, the existing technology generally uses a blue light chip to excite a single or simply mixed phosphor system to obtain white light. However, due to the unreasonable ratio of light in different bands, it is difficult to balance the color rendering and luminous efficiency of LED devices. In particular, the effective output of the red light band is relatively weak, which makes the luminous quality of LEDs in high color rendering index applications unsatisfactory. In addition, existing phosphor materials may experience temperature quenching effects under high temperature working conditions, that is, the fluorescence efficiency decreases significantly at high temperatures, thereby further reducing the stability and reliability of LED devices. Therefore, how to improve the luminous efficiency and color rendering of LEDs and enhance their stability under high temperature conditions has become an important issue in the current technical field. Summary of the Invention

[0004] In view of this, an embodiment of the present invention provides a high-light-efficiency LED light-emitting semiconductor and a method for preparing the same, to solve the problems of poor light efficiency and stability in the existing full-spectrum white light LED implementation method.

[0005] In a first aspect, an embodiment of the present invention provides a high-light-efficiency LED light-emitting semiconductor, comprising: an LED excitation chip;

[0006] phosphors;

[0007] The phosphors include a first phosphor, a second phosphor, and a third phosphor. The peak wavelength of the first phosphor is within a first wavelength range, the peak wavelength of the second phosphor is within a second wavelength range, and the peak wavelength of the third phosphor is within a third wavelength range. The first wavelength range is 545-556 nm, the second wavelength range is 630-634 nm, and the third wavelength range is 615-617 nm.

[0008] The main wavelength of the LED excitation chip is in the fourth wavelength range, and the fourth wavelength range is 440-470 nm.

[0009] Preferably, the high-efficiency LED light-emitting semiconductor according to claim 1 is characterized in that the particle size of the first phosphor is between 23.0 and 26.0 µm, the particle size of the second phosphor is between 22.0 and 28.0 µm, and the particle size of the third phosphor is between 18.0 and 20.0 µm.

[0010] Preferably, the chemical formula of the first phosphor is Y3(Al,Ga)5O 12 :Ce, the chemical formula of the second phosphor is K2SiF6:Mn 4+ , the third phosphor is a nitride; compared with room temperature conditions, the temperature quenching rate of the third phosphor at 100°C is 93%; the internal quantum efficiency of the third phosphor is 0.97±0.02, and the external quantum efficiency of the third phosphor is 0.85±0.02.

[0011] Preferably, LED packaging glue is also included, the mass percentage of the first phosphor is 17.42%, the mass percentage of the second phosphor is 0.62%, the mass percentage of the third phosphor is 21.42%, and the mass percentage of the LED packaging glue is 60.54%.

[0012] In a second aspect, an embodiment of the present invention further provides a method for preparing a high-light-efficiency LED light-emitting semiconductor, which is used for the high-light-efficiency LED light-emitting semiconductor according to the first aspect of claim 1, and the preparation method comprises:

[0013] placing a first phosphor, a second phosphor, and a third phosphor weighed in a first preset ratio in a stirring container and uniformly mixing them to obtain a phosphor mixture;

[0014] Adding the phosphor mixture to the LED packaging adhesive according to a second preset ratio and continuing to stir to obtain a mixed colloid;

[0015] In response to a first spectroscopic test result of the mixed colloid satisfying a first preset condition, the mixed colloid is uniformly coated on a surface of the LED excitation chip according to preset spin coating parameters to form a fluorescent coating;

[0016] In response to the second spectroscopic test result of the fluorescent coating meeting the second preset condition, curing the LED excitation chip with the fluorescent coating according to the preset curing condition to obtain an initial light-emitting semiconductor;

[0017] If the third spectroscopic test result of the initial light-emitting semiconductor does not meet the preset finished product spectroscopic conditions, adjusting one or more of the first preset ratio, the second preset ratio, the preset spin coating parameters, and the preset curing conditions according to the first spectroscopic test result, the second spectroscopic test result, and the third spectroscopic test result;

[0018] If the third light emitting semiconductor test result meets the preset finished product light emitting condition, the initial light emitting semiconductor is used as the target light emitting semiconductor.

[0019] Preferably, the method for preparing a high-light-efficiency LED light-emitting semiconductor is characterized in that the phosphor mixture is added to the LED packaging glue according to the second preset ratio, and the mixture is continuously stirred to obtain a mixed colloid, comprising:

[0020] Preliminarily stirring the phosphor mixture and LED encapsulation adhesive at a first preset stirring speed according to a second preset ratio and for a first preset time;

[0021] Continuously stirring at a second preset stirring speed and maintaining the stirring for a second preset time to obtain an initial mixed colloid, wherein the second preset speed is greater than the first preset speed;

[0022] Sampling samples at different positions of the initial mixed colloid to obtain a first preset number of mixed colloid samples;

[0023] Performing a spectrophotometric test on each of the mixed colloid samples to obtain a corresponding first spectrophotometric test result, wherein the first spectrophotometric test result includes: luminous flux, color coordinate value, and color temperature;

[0024] According to each of the first spectrophotometric test results, obtaining the differences in color coordinate values, luminous flux, and color temperature values ​​between the two mixed colloid samples to obtain a difference value set, wherein the difference value set includes a color coordinate difference value set, a luminous flux difference value set, and a color temperature difference value set;

[0025] If the difference value set satisfies a first preset mixing condition, obtaining the standard deviation of the color coordinate value, the luminous flux value, and the color temperature value, respectively, based on each of the first spectroscopic test results, wherein the first preset mixing condition includes that each color coordinate difference value in the color coordinate difference value set is less than or equal to a preset color coordinate threshold value, each color luminous flux difference value in the luminous flux difference value is less than or equal to a preset luminous flux threshold value, and each color temperature difference value in the color temperature difference value set is less than or equal to a preset color temperature threshold value;

[0026] If none of the difference value sets satisfy the first preset mixing condition, or the standard deviation of the color coordinate values, luminous flux, or color temperature values ​​does not satisfy the second preset mixing condition, adjusting the second preset speed and / or the second preset time, and returning to the step of continuously stirring according to the second preset stirring speed and maintaining the stirring for the second preset time to obtain an initial mixed colloid, wherein the second preset mixing condition includes that the standard deviation of the color coordinates is less than or equal to a preset color coordinate standard deviation, the standard deviation of the color temperature values ​​is less than or equal to a preset color temperature standard deviation, and the standard deviation of the luminous flux is less than or equal to a preset luminous flux standard deviation;

[0027] If the standard deviations of the color coordinate values, the luminous flux, and the color temperature values ​​meet the second preset mixing condition, a mixed colloid meeting the first preset condition is obtained by initially mixing the colloid.

[0028] Preferably, in response to the first spectroscopic test result of the mixed colloid satisfying a first preset condition, the mixed colloid is uniformly coated on the surface of the LED excitation chip according to preset spin coating parameters to form a fluorescent coating, comprising:

[0029] obtaining the viscosity of the mixed colloid and the target thickness of the fluorescent coating;

[0030] Obtaining corresponding preset spin coating parameters according to the viscosity and the target thickness, wherein the preset spin coating parameters include a spin coating speed control curve, the spin coating speed control curve includes a plurality of stages, and different stages have different durations and / or spin coating speeds;

[0031] Add a preset amount of mixed colloid to the center of the LED excitation chip;

[0032] According to the spin coating speed control curve, the LED excitation chip is controlled to rotate so that the mixed colloid diffuses on the surface of the LED excitation chip to form an initial fluorescent coating;

[0033] Performing spectroscopic detection on different positions on the initial fluorescent coating to obtain a second preset number of second spectroscopic test results;

[0034] determining whether the fluorescent coating is uniform according to the degree of difference between the second spectroscopic test results;

[0035] If it is not uniform, adjusting the duration of the specified phase of the spin coating speed control curve and / or the spin coating speed according to the degree of the difference;

[0036] If it is uniform, a fluorescent coating that meets the second preset condition is obtained through the initial fluorescent coating.

[0037] Preferably, the spin coating speed control curve includes an initial stage, a main spin coating stage and an accelerated spin coating stage in sequence, and obtaining the preset spin coating parameters according to the viscosity and the target thickness includes:

[0038] Measuring the mixed colloid to obtain colloid parameters, wherein the colloid parameters include density and particle concentration of the mixed colloid;

[0039] Obtaining a first rotation speed and a first duration in the initial stage according to the viscosity of the mixed colloid, the preset drop amount, and the surface area of ​​the LED excitation chip, wherein the first rotation speed is positively correlated with the viscosity of the coating colloid and negatively correlated with the surface area; the first duration is positively correlated with the surface area and positively correlated with the preset drop amount;

[0040] Obtaining a second rotation speed and a second duration of the main spin coating stage according to the viscosity and density of the mixed colloid and the particle concentration, wherein the second rotation speed is positively correlated with the viscosity and density and negatively correlated with the particle concentration; the second duration is positively correlated with the target thickness and negatively correlated with the density;

[0041] According to the viscosity, density and particle concentration of the mixed colloid, a third rotation speed and a third duration of the accelerated spin coating stage are obtained, wherein the third rotation speed is positively correlated with the viscosity and density, and negatively correlated with the particle concentration; the third duration is positively correlated with the target thickness, and negatively correlated with the density.

[0042] Preferably, in response to the second spectroscopic test result of the fluorescent coating meeting the second preset condition, curing the LED excitation chip with the fluorescent coating according to the preset curing condition to obtain the initial light-emitting semiconductor includes:

[0043] Obtaining preset curing conditions corresponding to the type of the LED encapsulation adhesive, wherein the preset curing conditions include curing temperature and curing time;

[0044] According to the colloid parameters of the mixed colloid, the preset curing conditions are adjusted to obtain the target curing conditions.

[0045] Curing the LED excitation chip with the fluorescent coating according to the target curing conditions to obtain an initial light-emitting semiconductor;

[0046] Performing a spectroscopic test on the initial light-emitting semiconductor to obtain a third spectroscopic test result, wherein the third spectroscopic test result includes luminous flux, color coordinate values, and color temperature;

[0047] performing a weighted calculation on the difference between each parameter in the third spectral test result and the corresponding target spectral parameter threshold to obtain a spectral deviation degree of the initial light-emitting semiconductor, wherein the target spectral parameter threshold includes a luminous flux threshold, a color coordinate threshold, and a color temperature threshold; the weight value of the luminous flux is greater than or equal to the weight value of the color coordinate value, and the weight value of the color coordinate value is greater than the weight value of the color temperature;

[0048] If the degree of spectroscopic deviation is less than or equal to a preset deviation threshold, the third spectroscopic test result meets the preset finished product spectroscopic condition;

[0049] Otherwise, the third spectrophotometric test result does not meet the preset finished product spectrophotometric condition.

[0050] Preferably, if the third spectral test result of the initial light-emitting semiconductor does not meet the preset finished product spectral condition, adjusting one or more of the first preset ratio, the second preset ratio, the preset spin coating parameters, and the preset curing conditions according to the first spectral test result, the second spectral test result, and the third spectral test result, includes:

[0051] Obtaining deviations of the first spectroscopic test result, the second spectroscopic test result, and the third spectroscopic test result from a target spectroscopic parameter threshold value, respectively, and recording them as a first deviation degree, a second deviation degree, and a third deviation degree;

[0052] According to the preset deviation threshold, obtaining the allowable deviation thresholds of the first spectrophotometric test result, the second spectrophotometric test result, and the third spectrophotometric test result, wherein the allowable deviation thresholds of the first spectrophotometric test result, the second spectrophotometric test result, and the third spectrophotometric test result are increased in sequence;

[0053] Determining a main deviation stage according to the first deviation degree, the second deviation degree, the third deviation degree and corresponding allowable deviation thresholds, wherein the main deviation stage includes one of a mixing stage, a spin coating stage and a curing stage;

[0054] Determining parameters to be adjusted according to the main deviation stage, wherein the parameters to be adjusted in the mixing stage include a first preset ratio and a second preset ratio, the parameters to be adjusted in the spin coating stage include preset spin coating parameters, and the parameters to be adjusted in the curing stage include preset curing conditions;

[0055] determining an adjustment amount of the parameter to be adjusted according to the first spectroscopic test result, the second spectroscopic test result, the third spectroscopic test result, and the target spectroscopic parameter threshold;

[0056] The parameter to be adjusted is adjusted according to the adjustment amount.

[0057] In summary, the beneficial effects of the present invention are as follows:

[0058] The high-efficiency LED light-emitting semiconductor and its preparation method provided by the embodiments of the present invention utilize a blue LED excitation chip with a dominant wavelength between 440 and 470 nm. This effectively excites three phosphors of different wavelengths, maximizing the output of each phosphor's emitted light and minimizing luminescence loss. Furthermore, the wavelength ranges of the different phosphors are rationally selected to achieve a sufficient balance of blue and red light components, improving overall luminous efficiency and overcoming the significant light loss associated with conventional mixed phosphors.

[0059] The combination of three phosphors creates a more balanced ratio of light wavelengths, particularly increased red and green light, effectively improving the color rendering of the LED light source, making it suitable for applications requiring high color rendering. Furthermore, the specific wavelengths of green light (540-550 nm) and red light (625-635 nm, 615-620 nm) complement each other, improving spectral continuity, stabilizing color temperature and color rendering index, and enhancing light color quality.

[0060] In summary, this solution significantly improves the luminous efficiency, color rendering and stability of LED light-emitting semiconductors through a precisely designed three-band phosphor system and packaging structure, solving the problems of poor luminous efficiency, low color rendering and insufficient temperature stability of traditional LED light-emitting devices, and has high practical value. BRIEF DESCRIPTION OF THE DRAWINGS

[0061] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work, and these are all within the scope of protection of the present invention.

[0062] Figure 1 Graph showing the excitation and emission spectra of the first phosphor according to an embodiment of the present invention.

[0063] Figure 2 This is a thermal stability test chart of the first phosphor according to an embodiment of the present invention.

[0064] Figure 3 Graph showing the excitation and emission spectra of the second phosphor according to an embodiment of the present invention.

[0065] Figure 4 Graph showing the excitation and emission spectra of the third phosphor according to an embodiment of the present invention.

[0066] Figure 5a This is a table of spectroscopic test data of a high-efficiency LED light-emitting semiconductor in an embodiment of the present invention.

[0067] Figure 5bThis is a table of spectroscopic test data of a conventional LED light-emitting semiconductor in an embodiment of the present invention.

[0068] Figure 6 Schematic diagram of the preparation method in an embodiment of the present invention. DETAILED DESCRIPTION

[0069] The features and exemplary embodiments of various aspects of the present invention will be described in detail below. In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail below in conjunction with the accompanying drawings and Examples. It should be understood that the specific embodiments described herein are only configured to explain the present invention and are not configured to limit the present invention. For those skilled in the art, the present invention can be implemented without the need for some of these specific details. The following description of the embodiments is merely to provide a better understanding of the present invention by illustrating examples of the present invention.

[0070] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, the elements defined by the phrase "comprising..." do not exclude the presence of other identical elements in the process, method, article, or device comprising the elements.

[0071] Example 1

[0072] In a first aspect, an embodiment of the present invention provides a high-efficiency LED light-emitting semiconductor, comprising:

[0073] LED excitation chip;

[0074] phosphors;

[0075] The phosphors include a first phosphor, a second phosphor, and a third phosphor. The peak wavelength of the first phosphor is within a first wavelength range, the peak wavelength of the second phosphor is within a second wavelength range, and the peak wavelength of the third phosphor is within a third wavelength range. The first wavelength range is 540-550 nm, the second wavelength range is 625-635 nm, and the third wavelength range is 615-620 nm.

[0076] The main wavelength of the LED excitation chip is in the fourth wavelength range, and the fourth wavelength range is 440-470 nm.

[0077] Specifically, the light-emitting semiconductor includes an LED excitation chip whose main wavelength lies within the blue light band of 440-470 nm. Selecting a blue light chip within the 440-470 nm band helps efficiently excite the phosphors. The blue light chip has a good spectral match with the three phosphors, thereby improving the excitation efficiency of the phosphors. At the same time, blue light within this wavelength range can excite the phosphors to produce white light with high color rendering, making the light color emitted by the LED more uniform and natural. Furthermore, blue light LED chips offer advantages in luminous efficiency and power, generating less heat and achieving high efficiency, which helps improve overall luminous efficiency.

[0078] The light-emitting semiconductor uses three different phosphors: a first phosphor, a second phosphor, and a third phosphor. The peak wavelength of each phosphor is within a specific wavelength range to achieve different light color combinations, as follows:

[0079] The peak wavelength of the first phosphor is at 540-550 nm, which belongs to the green band;

[0080] The peak wavelength of the second phosphor is at 625-635 nm, which belongs to the red band;

[0081] The third phosphor has a peak wavelength of 615-620 nm, which belongs to the deeper band of red light;

[0082] See also Figure 1-4 The combination of three phosphors covers a wide spectral range, from blue (440-470 nm) to green (540-550 nm) and red (625-635 nm and 615-620 nm). The optimal ratio of red and green light makes the LED's emission spectrum more continuous and its color rendering index higher, making it more suitable for applications requiring high color rendering, such as high-quality lighting and display backlighting.

[0083] The proper complement of green and red light makes the white light emitted by the LED close to natural light, avoiding the cold light sensation caused by the uneven mixing of a single blue light chip and phosphor, helping to create a softer and more comfortable lighting environment and reduce visual fatigue.

[0084] By adjusting the ratio of the three phosphors, light color adjustment can be further achieved to adapt to the light color requirements in different application scenarios, such as warm white light or cool white light, making it widely applicable in commercial lighting, home lighting and other fields.

[0085] Through precise wavelength control, the luminous intensity of the phosphors in different wavelength bands is optimized, ensuring an appropriate ratio of green and red components in the spectrum, thereby enhancing the LED's light quality. This adjusted ratio of green and red light compensates for the insufficient red light output in traditional LEDs, resulting in a more balanced overall LED light output and improved color rendering. Within this specific wavelength range, blue light excitation is more effective, resulting in higher phosphor conversion efficiency and reduced light loss. This matched wavelength selection ensures efficient LED luminescence and maximizes the utilization of blue light energy. The wavelength selection not only considers luminous efficiency but also the stability of the phosphors at different temperatures. Precise wavelength control effectively reduces phosphor light decay, especially in high-temperature environments, helping to improve the long-term stability of LED devices.

[0086] By coating three phosphors with precise wavelength ranges on the blue light LED excitation chip, the technical bottleneck of insufficient luminous efficiency and color rendering of traditional LEDs is overcome, and an LED light-emitting semiconductor with high color rendering, high luminous efficiency and high temperature stability is achieved.

[0087] Preferably, the first wavelength range is 545-556 nm, the second wavelength range is 630-634 nm, and the third wavelength range is 615-617 nm.

[0088] Specifically, in this embodiment, the peak emission wavelength range of each phosphor is preferably further refined. The first wavelength range is 545-556 nm. This wavelength range is within the green light band and is further optimized to 545-556 nm compared to the broad 540-550 nm range. The green light component in this wavelength range is closer to the green light band of natural light, the range in which the human eye is most sensitive to green, helping to enhance the color rendering and visual comfort of the LED light source. Selecting a green light wavelength of 545-556 nm can better compensate for the band gap between blue and red light, making the spectrum more uniform. Green light in this range emits a relatively pure green light, which improves the overall color rendering index (CRI), making the green component in white light more saturated, and helping to enhance the visual experience.

[0089] The second wavelength range is 630-634 nm, which is at the upper end of the red light band. The red light component is richer within the 630-634 nm range. Compared to the broad 625-635 nm, this range more precisely locates the appropriate red light band, which helps to enhance color rendering. Choosing to emit light in the 630-634 nm red light band can improve the color rendering index of the LED light source, especially the color rendering of red objects. Compared with other red light bands, the red light output in this wavelength range is purer, avoiding the energy waste of long-wavelength red light. At the same time, the red light efficiency in this range is higher, which can improve the color rendering index without affecting the overall lighting effect, making the LED light source more realistic and natural in color performance, especially suitable for lighting scenes with high color rendering requirements.

[0090] The third wavelength range, 615-617 nm, lies at the lower end of red light and is slightly darker red than standard red. Selecting this narrower range (615-617 nm) enhances the richness of the spectrum, giving the LED white light a warmer and richer hue. Adding deep red light from 615-617 nm fills the luminous gap between the green and red bands, further smoothing the spectrum and improving the color transition of the light source. This deep red component softens the LED's color, making it particularly suitable for applications requiring warm white light. It also reduces the visual stimulation of cool white light while maintaining a high color rendering index, resulting in a softer light color.

[0091] Further optimized wavelength ranges (545-556 nm, 630-634 nm, and 615-617 nm) achieve a more uniform LED spectral distribution, effectively improving color rendering and visual comfort. Within these narrower wavelength ranges, phosphors achieve higher luminous efficiency and purer light colors, ultimately significantly improving the luminous efficiency, color rendering, and stability of LED light-emitting semiconductors. These improvements are ideal for applications requiring high color rendering and high-quality lighting.

[0092] Preferably, the particle size of the first phosphor is between 23.0 and 26.0 μm, the particle size of the second phosphor is between 22 and 28 μm, and the particle size of the third phosphor is between 18 and 20 μm.

[0093] Specifically, the particle size range of the first phosphor is selected to be 23.0~26.0 µm, which is more suitable for the optical properties of the green phosphor. A larger particle size can effectively reduce light scattering, making the luminous intensity of the green phosphor more concentrated, thereby improving its luminous efficiency. Green light plays an important role in color rendering. Therefore, precise control of the particle size can improve the brightness and purity of the green light and ensure the consistency of the luminous effect. At the same time, the particle size range of 23.0~26.0 µm can also reduce mutual occlusion between phosphor particles, maximize the luminous area, and improve the light output efficiency of the LED. The larger particle size can also enhance thermal stability, allowing the green phosphor to maintain good luminous performance even at high temperatures.

[0094] The second phosphor particle size is selected within the range of 22.0-28.0 µm, a slightly wider particle size range that is suitable for the luminescence characteristics of red phosphors. The luminous efficiency of red light is significantly affected by the phosphor particle size, so controlling it within this range can balance luminous efficiency and particle stability. Red light is particularly important for color rendering, so a particle size of 22-28 µm can make red light emission more uniform and stable, thereby improving the color rendering index of the LED. In addition, the wider particle size range adapts to the special needs of red light emission, effectively improving its stability at high temperatures and reducing temperature quenching, thereby ensuring the luminous efficiency and color stability of the LED during long-term operation.

[0095] The particle size of the third phosphor is set in the range of 18.0-20.0 µm, which is relatively small. The third phosphor is responsible for emitting deep red light. Phosphors in this wavelength range are more sensitive to particle size, and a smaller particle size contributes to higher luminous efficiency. A smaller particle size increases the luminous surface area of ​​the deep red light, enhancing luminous efficiency and concentrating the deep red light output, thus filling the spectral gap between red and green light and improving the spectral continuity of the light source. Furthermore, a small particle size helps reduce light scattering, resulting in a purer deep red light emission, which helps improve the overall color rendering and color stability of white light LEDs, especially important in warm white light modulation.

[0096] Optimizing particle size control ensures efficient excitation of different phosphors while maintaining purer and more stable luminescence, avoiding light loss and scattering issues associated with overly large or undersized particles. This precise particle size control also enhances the temperature stability of the LED, enabling it to maintain efficient luminescence and excellent color rendering even in high-temperature operating environments, making it suitable for high-quality LED lighting applications.

[0097] Preferably, the chemical formula of the first phosphor is Y3(Al,Ga)5O 12 :Ce;

[0098] Specifically, in this embodiment, the chemical formula of the first phosphor is preferably Y3(Al,Ga)5O 12 :Ce, the lanthanide element cerium (Ce 3+ ) doped aluminum gallium garnet (YAG) phosphor. Ce 3+ Ce ions are doped into the YAG matrix as an activator, and can emit green to yellow light spectrum when excited by blue light. 3+ The 4f-5d transition of Ce ions in this matrix exhibits high luminescence efficiency and wide luminescence bandwidth, making it suitable for LED applications. 3+ Doped YAG phosphor has a high quantum efficiency, especially when excited by a blue LED chip, it can efficiently convert blue light into green or yellow-green light, effectively improving the light efficiency of the LED. Compared with traditional green fluorescent materials, Y3(Al,Ga)5O 12 Ce has higher luminous efficiency and superior optical properties. By partially replacing aluminum (Al) with gallium (Ga), the emission wavelength of YAG phosphor can be tuned. The addition of Ga lowers the lattice energy, shifting the emission spectrum toward longer wavelengths and shifting the color of the emitted light from its original yellow-green to a purer green. The YAG matrix material has high thermal stability, maintaining stable luminescence performance under high-temperature conditions. In high-power LEDs, the thermal stability of the first phosphor reduces temperature quenching and maintains high luminous efficiency over extended periods. This is crucial for ensuring stable LED emission under high-temperature or high-power conditions. By adjusting the ratio of aluminum (Al) to gallium (Ga), the emission wavelength of the phosphor can be adjusted. The appropriate amount of gallium replacing aluminum can slightly red-shift the emission spectrum, adding a yellow component to the green light. This hue adjustment gives the white light produced by the LED a warmer, more natural hue. This characteristic makes the first phosphor highly adaptable to meet diverse LED white light color requirements. The chemical composition of the first phosphor provides high luminous efficiency, excellent thermal stability, and flexible emission spectrum tuning. This material can be efficiently converted into green light under the excitation of a blue light chip, and can adapt to high-temperature environments. It is suitable for LED lighting applications with high color rendering and high power requirements, greatly improving the overall luminous efficiency and color performance of LED light sources.

[0099] See also Figure 1-2, are the excitation and emission spectra of the first phosphor. The excitation spectrum shows that the optimal excitation wavelength range for the first phosphor is mainly concentrated between 440 nm and 470 nm. This means that it is suitable for excitation with blue light LEDs (this wavelength band is common in blue light LEDs). The emission spectrum shows that its emission peak is located near 545 nm, a wavelength in the yellow-green light region. This allows the phosphor to emit yellow-green light when excited by blue light. The relationship between temperature and relative intensity shows that the luminous intensity of the first phosphor decreases slightly with increasing temperature, but overall maintains a high degree of stability.

[0100] from Figure 2 As can be seen, the first phosphor maintains a relative luminous intensity retention of 97.4% at 100°C and room temperature, demonstrating its excellent thermal stability and suitability for use in higher temperature environments, such as high-color rendering lighting and LCD backlighting. Its thermal quenching performance indicates that the phosphor maintains its luminous properties over a wide temperature range, making it suitable for use in lighting devices requiring high reliability and long-term stability. In one embodiment, the room temperature condition is 25°C.

[0101] Preferably, the chemical formula of the second phosphor is K2SiF6:Mn 4+ .

[0102] Specifically, the second phosphor is based on a potassium fluorosilicate (K2SiF6) matrix doped with tetravalent manganese ions (Mn4+) to form a luminescent material. K2SiF6 is a compound of potassium, silicon and fluorine elements, commonly used in the manufacture of phosphors, laser materials and other optical applications. It is an inorganic compound with good chemical stability and high thermal stability, suitable for use in high temperature or harsh environments. The structure of K2SiF6 is usually composed of SiF6 2- ions and K+ ions. This structure provides a stable matrix that can host a variety of dopant ions. Tetravalent manganese ions possess unique optical properties, absorbing specific wavelengths of light and emitting light at different wavelengths. In this material, Mn4+ is typically responsible for luminescence under ultraviolet or blue light excitation, emitting red or orange spectra.

[0103] The luminous efficiency of the doped material is high, especially when the excitation wavelength is blue light or ultraviolet light, it can produce strong red light emission, which plays an important role in color adjustment and light efficiency optimization of LED light sources. K2SiF6 is a stable matrix that can provide good chemical stability and ensure performance stability in long-term use, especially in high temperature environments. The luminescent properties of Mn4+ enable this phosphor to play a key role in adjusting the color temperature of the light source and improving color performance, especially in applications that require red or orange spectral output. The choice of the second phosphor is mainly based on its stable chemical properties and excellent luminescent properties, which can provide the necessary color output and efficient light conversion effect for LED light-emitting semiconductors.

[0104] Preferably, the third phosphor is a nitride; the temperature quenching rate of the third phosphor at 100°C is 93% compared to that at 25°C; the internal quantum efficiency of the nitride is 0.97±0.02, and the external quantum efficiency of the nitride is 0.85±0.02.

[0105] Specifically, nitride phosphors generally refer to luminescent materials primarily composed of nitrogen, exhibiting exceptionally high optical properties and thermal stability. Common nitride phosphors include aluminum nitride (AlN), silicon nitride (Si3N4), and gallium nitride (GaN). Nitride materials typically exhibit a broad excitation and emission wavelength range, enabling color tuning, making them particularly suitable for high-efficiency LED lighting. Compared to other phosphor types, nitrides maintain excellent performance stability under temperature fluctuations, making them ideal for high-temperature environments. Temperature quenching refers to the decrease in luminescence efficiency at elevated temperatures. The light conversion efficiency of fluorescent materials tends to decrease with increasing temperature because high temperatures can lead to energy loss or thermal excitation of excited molecules. A temperature quenching rate of 93% means that when the temperature rises from 25°C to 100°C, the luminescence intensity of the nitride phosphor decreases to only 7% of its original value. Generally, materials with low low-temperature quenching rates are able to maintain high luminescence efficiency at higher temperatures, which is crucial for high-efficiency LED lighting applications. Although the luminous efficiency of this material decreases significantly at high temperatures, it still exhibits a certain degree of stability, indicating its suitability for use in high-temperature environments. LED chips typically generate heat, so temperature-resistant phosphors are crucial. Internal quantum efficiency refers to the proportion of photons absorbed by a material that are successfully converted into luminescence. An ideal luminescent material should have an internal quantum efficiency as close to 100%. In this case, the internal quantum efficiency of the nitride is 0.97±0.02, meaning that approximately 97% of the absorbed light energy is converted into luminescent energy. A high internal quantum efficiency indicates that the phosphor effectively converts light energy into luminescence, reducing energy loss and improving overall luminous efficiency. External quantum efficiency refers to the ratio of photons actually emitted by the luminescent material to the total number of photons absorbed. It is an important indicator of a material's luminous efficiency. The external quantum efficiency of the nitride is 0.85±0.02, meaning that approximately 85% of the internal luminescence is effectively released externally. A high external quantum efficiency indicates that the material effectively releases a large portion of the luminescent energy, reducing light loss due to reflection or absorption, further improving the overall light output efficiency of the LED. The characteristics of this nitride as a third phosphor enable it to exhibit excellent luminescence performance and high energy conversion efficiency in LED lighting applications. Its high internal and external quantum efficiencies ensure the brightness and efficiency of LED products. Its relatively high temperature quenching rate also means that it can maintain good performance under high temperature conditions, making it suitable for use in the high-temperature operating environments of LED chips. Although temperature fluctuations may affect its luminous efficiency, its high internal and external quantum efficiencies make this nitride a very suitable choice, capable of providing excellent brightness and color performance for LEDs, especially in applications that require an efficient and stable light source.

[0106] Preferably, the high-light-efficiency LED light-emitting semiconductor further includes LED packaging glue.

[0107] LED encapsulant (also known as encapsulation material or colloid material) is a key material used to firmly connect the LED chip to other components (such as phosphor, substrate and housing). Encapsulant plays multiple roles in LED assembly:

[0108] Encapsulant is typically transparent or has certain optical properties to protect the LED chip while ensuring efficient light emission. Its thermal conductivity helps dissipate heat, preventing damage to the LED chip due to overheating and extending its lifespan. It also isolates the LED chip from external circuits or other components, preventing electrical shorts. Encapsulant also provides additional physical protection, shielding the chip from external vibration or impact.

[0109] In high-efficiency LED light-emitting semiconductors, encapsulation glue is indispensable. It ensures effective coupling between the chip and the phosphor and can improve the overall luminous efficiency and stability.

[0110] In one embodiment, the LED encapsulation adhesive is AB glue. AB glue generally refers to a glue composed of two different components: component A and component B. This glue needs to be mixed in a specific ratio during use to achieve optimal performance. AB glue is widely used in LED packaging, electronic equipment, the automotive industry, building materials, and other fields. The curing time of the B glue can be adjusted as needed to adapt to different production and operating conditions. Different curing agent ratios can provide different curing speeds and strengths, suitable for rapid production or high-precision applications. In the manufacturing process of high-efficiency LED light-emitting semiconductors, LED encapsulation adhesive is not only a key structural material, ensuring the effective bonding of the chip and phosphor, but also provides necessary thermal management and mechanical protection. As a common encapsulation material, AB glue ensures the luminous efficiency, durability, and stability of the LED due to its high adhesion, adjustable curing characteristics, transparency, and thermal stability. At the same time, by designing anti-collision angles, the impact of external impact on the LED package can be effectively reduced, improving the reliability of the overall product.

[0111] Preferably, the mass percentage of the first phosphor is 17.42%, the mass percentage of the second phosphor is 0.62%, the mass percentage of the third phosphor is 21.42%, and the mass percentage of the LED encapsulation adhesive is 60.54%.

[0112] Specifically, phosphors in LEDs perform a photoconversion function, converting light emitted by the LED chip into visible light. Different types of phosphors can adjust the color temperature, brightness, and color rendering of an LED. The mass percentage of each phosphor determines its contribution to the overall light output. The second phosphor, with a mass percentage of 0.62%, is a relatively low percentage, typically indicating that it is used to adjust a narrow range of colors or brighten a specific spectral region. The second phosphor's function is to provide red or orange light, so its lower mass percentage ensures that the red or orange component of the light source is not overly strong, but sufficient to improve light quality and color balance. The third phosphor, with a mass percentage of 21.42%, is likely responsible for providing the red or orange emission of the LED. This configuration helps improve the LED's color reproduction and color temperature, adapting to different application requirements. Nitride phosphors (such as aluminum nitride and gallium nitride) generally have high efficiency and excellent temperature stability, so their relatively high mass percentage can provide better light output stability. LED encapsulation adhesive accounts for 60.54%, which is the largest part of the entire LED package. Encapsulation adhesive plays a very important role in LED packaging. In particular, its high proportion (60.54%) indicates that this material occupies most of the volume in the package, ensuring the stability, efficiency, mechanical and thermal performance of the LED.

[0113] Selecting the right phosphor ratio helps ensure the LED's color rendering, brightness, and spectral output. The mass percentages of these phosphors (e.g., 17.42%, 0.62%, and 21.42%) indicate their optimal placement within the overall package, ensuring both luminous efficacy and color balance. For example, the first phosphor has a higher ratio because it is responsible for a wider range of light conversion, while the second and third phosphors, at lower ratios, refine color modulation and enhance spectral quality. The encapsulant accounts for a high 60.54% because it not only secures the chip and distributes light, but also provides heat dissipation and protection. This ratio ensures that the LED maintains high energy efficiency while maintaining good heat dissipation and long-term stability.

[0114] These mass percentages are designed to optimize the overall performance of the LED, ensuring high luminous efficacy while maintaining color accuracy, stability, and light output efficiency. A larger proportion of encapsulant ensures mechanical protection, thermal management, and electrical isolation for the LED, while the phosphor ratio ensures color performance and luminous efficacy. Overall, this ratio contributes to the production of LED light-emitting semiconductors with high luminous efficacy, good stability, and long service life.

[0115] In a specific embodiment, the weight of the first phosphor is 19.0000g, the weight of the second phosphor is 0.6805g, the weight of the third phosphor is 23.3506g, and the weight of the LED encapsulation glue is 66.0000g. The spectrophotometric test report of the LED light-emitting semiconductor prepared by the above formula is as follows: Figure 5a As shown, Figure 5b As can be seen from the table, LED light-emitting semiconductors prepared from common phosphors on the market exhibit excellent luminous flux, luminous efficiency, and color rendering performance, with particular advantages in luminous efficiency enhancement and stability control. Therefore, this patented formula possesses significant market competitiveness.

[0116] Example 2

[0117] Based on the solution of Example 1, Example 2 of the present invention provides a method for preparing a high-light-efficiency LED light-emitting semiconductor, which is used for the high-light-efficiency LED light-emitting semiconductor in Example 1. The preparation method includes:

[0118] S1, placing a first phosphor, a second phosphor, and a third phosphor weighed in a first preset ratio in a stirring container and uniformly mixing them to obtain a phosphor mixture;

[0119] In this step, different types of phosphors (first, second, and third phosphors) must first be weighed according to a predetermined ratio (the "first preset ratio"). The first, second, and third phosphors may have different optical properties, such as emission wavelength, luminous efficacy, and color temperature. Therefore, the correct ratio is crucial. This ratio is typically selected based on experimental data, theoretical calculations, or predetermined requirements.

[0120] By placing these phosphors in a mixing container and mixing them evenly, a stable and uniform phosphor mixture is obtained. Uniform mixing ensures that the optical properties of the phosphors will not fluctuate significantly due to uneven proportions, thereby avoiding affecting the final LED light efficiency and color temperature.

[0121] S2. Add the phosphor mixture to the LED packaging adhesive according to a second preset ratio, and continue stirring to obtain a mixed colloid;

[0122] The key to this stage is adding the phosphor mixture obtained in the first step to the LED encapsulant according to the second preset ratio. Encapsulant is used to fix the phosphor to the surface of the LED chip. It usually has a certain viscosity and optical transparency to ensure that the phosphor is evenly distributed and does not affect the LED's lighting effect.

[0123] With continued stirring, the phosphor and encapsulating adhesive combine to form a colloid, achieving a uniform distribution. The stirring speed and duration need to be moderate to ensure uniform distribution of the phosphor while preventing stratification or sedimentation. The viscosity of the mixed colloid is also crucial, as it directly impacts the uniformity of the coating during the subsequent spin coating process.

[0124] S3, in response to the first spectroscopic test result of the mixed colloid meeting the first preset condition, uniformly coating the mixed colloid on the surface of the LED excitation chip according to preset spin coating parameters to form a fluorescent coating;

[0125] The primary purpose of this stage is to coat the mixed colloid on the surface of the LED excitation chip to form a uniform fluorescent coating. Spin coating is a commonly used coating method, particularly suitable for thin films. First, a first spectroscopic test is performed to evaluate the optical properties of the mixed colloid to check whether they meet the preset optical requirements, such as luminous flux, color temperature, and spectral peaks. If the test results of the mixed colloid meet the requirements, spin coating can begin.

[0126] The spin coating process controls the spin speed and time to evenly spread the colloid onto the surface of the LED chip and evenly coat it during the spin process, ultimately forming the desired fluorescent coating. This coating not only improves the LED's luminous efficiency but also adjusts the LED's luminous color and color temperature.

[0127] S4, in response to the second spectroscopic test result of the fluorescent coating meeting the second preset condition, curing the LED excitation chip with the fluorescent coating according to the preset curing condition to obtain an initial light-emitting semiconductor;

[0128] This step secures the phosphor coating to the LED chip surface. The curing process, using a specific temperature and time, creates a strong chemical bond between the encapsulant and the phosphor, forming a stable coating. The cured phosphor coating is highly durable and stable, resisting peeling.

[0129] Before curing, a second spectrophotometric test is performed to ensure that the optical properties of the phosphor coating meet the requirements, particularly regarding the spectral peak position and color temperature. If the second spectrophotometric test results meet the preset conditions, the curing process can proceed. Curing conditions (such as temperature and time) need to be adjusted according to the specific properties of the encapsulant to ensure coating quality.

[0130] S5. If the third spectroscopic test result of the initial light-emitting semiconductor does not meet the preset finished product spectroscopic condition, adjust one or more of the first preset ratio, the second preset ratio, the preset spin coating parameters, and the preset curing conditions based on the first spectroscopic test result, the second spectroscopic test result, and the third spectroscopic test result;

[0131] During this step, if the final initial light-emitting semiconductor fails to meet the preset optical requirements in the third spectral test, relevant process parameters need to be adjusted based on a comprehensive analysis of the first, second, and third spectral test results. These parameters include the phosphor ratio (first and second preset ratios), spin coating process parameters (such as speed and time), and curing conditions (temperature, time, etc.). The goal of these adjustments is to improve the optical performance of the final product by optimizing the process, particularly key parameters such as luminous flux, color temperature, and spectral peak.

[0132] S6. If the third spectroscopic test result of the initial light-emitting semiconductor meets the preset finished product spectroscopic condition, the initial light-emitting semiconductor is used as the target light-emitting semiconductor.

[0133] When the third spectrophotometric test results meet the pre-determined finished product optical conditions, the optical properties of the LED light-emitting semiconductor have met the desired targets. At this point, the initial light-emitting semiconductor can be taken to the next stage of production, prepared for packaging and shipment, as the final target light-emitting semiconductor. This step completes the entire production process, and the final product boasts high luminous efficacy, stable optical performance, and controlled color temperature.

[0134] Through this gradual testing and adjustment approach, every step in the manufacturing process can be optimized and improved to ensure that the performance of the final LED semiconductor meets the expected standards. Each step relies not only on the results of the initial process adjustments but also requires detailed analysis and feedback of test data to achieve precise control of various key performance indicators. This gradual feedback and adjustment process significantly improves the quality and consistency of the final product.

[0135] Preferably, the phosphor mixture is added to the LED packaging glue according to the second preset ratio, and the mixture is stirred to obtain a mixed colloid, comprising:

[0136] S21, preliminarily stirring the phosphor mixture and LED encapsulation adhesive at a first preset stirring speed according to a second preset ratio and for a first preset time;

[0137] In this step, the uniformly mixed phosphor mixture and LED encapsulant are first mixed according to a second preset ratio. This second preset ratio is typically optimized experimentally to ensure the optimal ratio of phosphor to encapsulant for achieving the desired optical performance. Next, initial stirring is performed at a first preset stirring speed, which is relatively slow to avoid over-agitation of the colloid, which could lead to precipitation or foaming.

[0138] The duration of the initial stirring is set to a first preset time. This time is usually determined during preliminary testing and ensures that the phosphor and encapsulant are initially mixed evenly, but not completely mixed to the ideal state. The purpose of this initial stirring is to provide a foundation for subsequent fine mixing.

[0139] S22, continuously stirring at a second preset stirring speed and maintaining the stirring for a second preset time to obtain an initial mixed colloid, wherein the second preset speed is greater than the first preset speed;

[0140] Following the first step, a higher-intensity stirring process is performed, using the second preset stirring speed. This second preset stirring speed is higher than the first preset speed to enhance mixing uniformity. This stirring intensity helps thoroughly mix the phosphor and encapsulant, avoiding variations in coating thickness caused by uneven stirring.

[0141] The second preset stirring time is also set based on previous process experience. The length of time affects the uniformity of the mixed colloid. Continuing high-intensity stirring for a longer period of time can ensure that the phosphor is evenly dispersed in the encapsulant, resulting in a uniform initial mixed colloid.

[0142] S23, extracting samples from different positions of the initial mixed colloid to obtain a first preset number of mixed colloid samples;

[0143] To ensure the homogeneity of the mixed colloid, samples should be taken from multiple locations. These samples should cover different areas of the initial mixed colloid. Because stirring can lead to different homogeneity in different locations within the container, the diversity of samples helps to fully assess the quality of the colloid.

[0144] Based on experience and actual needs, the first preset number of mixed colloid samples is generally selected to be 3-5 samples to ensure that the data is representative and does not cause excessive testing.

[0145] S24, performing a spectrophotometric test on each of the mixed colloid samples to obtain a corresponding first spectrophotometric test result, wherein the first spectrophotometric test result includes: luminous flux, color coordinate value, and color temperature;

[0146] Spectrophotometry is a key step in evaluating the optical performance of the mixed colloid at this stage. Each mixed colloid sample undergoes tests for luminous flux, color coordinates, and color temperature. These optical parameters can indicate whether the mixture of phosphor and encapsulant meets the desired optical performance.

[0147] The luminous flux test measures the total amount of light emitted by the LED, which directly affects the luminous efficiency; the color coordinate value and color temperature test reflect the color characteristics of the light, which is crucial for meeting specific optical requirements.

[0148] S25. Obtaining differences in color coordinate values, luminous flux values, and color temperature values ​​between each of the mixed colloid samples based on the first spectrophotometric test results to obtain a difference value set, wherein the difference value set includes a color coordinate difference value set, a luminous flux difference value set, and a color temperature difference value set;

[0149] In this phase, based on the results of the first spectrophotometric test, the pairwise differences between the mixed colloidal samples are calculated, including the differences in color coordinate values, luminous flux, and color temperature values. These differences form a color coordinate difference set, a luminous flux difference set, and a color temperature difference set, respectively, to determine the uniformity of the mixed colloidal sample. The size of the pairwise differences reflects the consistency of the samples in the test indicators; smaller differences indicate better mixing uniformity.

[0150] S26. If the difference value set satisfies a first preset mixing condition, obtaining standard deviations of the color coordinate values, the luminous flux values, and the color temperature values, respectively, based on each of the first spectroscopic test results, wherein the first preset mixing condition includes that each color coordinate difference value in the color coordinate difference value set is less than or equal to a preset color coordinate threshold value, each color luminous flux difference value in the luminous flux difference value set is less than or equal to a preset luminous flux threshold value, and each color temperature difference value in the color temperature difference value set is less than or equal to a preset color temperature threshold value.

[0151] The purpose of this step is to initially screen the homogeneity of the mixed colloids. If the pairwise differences are both below the threshold, it indicates that the overall consistency of the colloid mixture is good, and further analysis can be performed using standard deviation.

[0152] Specifically, the first preset mixing condition includes:

[0153] Each color coordinate difference in the color coordinate difference set is less than or equal to a preset color coordinate threshold;

[0154] Each luminous flux difference value in the luminous flux difference value set is ≤ a preset luminous flux threshold value;

[0155] Each color temperature difference value in the color temperature difference value set is ≤ a preset color temperature threshold.

[0156] The setting of preset color coordinate thresholds, luminous flux thresholds, and color temperature thresholds should be based on actual production needs, product performance goals, and statistical analysis of test data. Initially, the thresholds can be set more strictly to ensure high uniformity of the mixed colloid. As production stabilizes, the thresholds can be gradually optimized to improve production efficiency.

[0157] When the differences between all samples are less than or equal to the corresponding preset threshold, the homogeneity of the mixed colloid is good. At this point, it is necessary to further calculate the standard deviation of the color coordinate values, luminous flux, and color temperature. If the standard deviation is small, it means that the optical properties of the mixed colloid are consistent and it is safe to proceed to the next steps.

[0158] The calculation of standard deviation is an important method to measure the volatility of test results. If the standard deviations of color coordinate values, luminous flux, and color temperature are all less than the preset thresholds, it indicates that the optical performance of the mixed colloid is stable and in line with expectations.

[0159] S27. If none of the difference value sets satisfy the first preset mixing condition, or the standard deviation of the color coordinate values, luminous flux, or color temperature values ​​does not satisfy the second preset mixing condition, adjust the second preset speed and / or the second preset time, and return to the step of continuously stirring at the second preset stirring speed and for the second preset time to obtain an initial mixed colloid, wherein the second preset mixing condition includes that the standard deviation of the color coordinates is less than or equal to a preset color coordinate standard deviation, the standard deviation of the color temperature values ​​is less than or equal to a preset color temperature standard deviation, and the standard deviation of the luminous flux is less than or equal to a preset luminous flux standard deviation;

[0160] Specifically, the standard deviation reflects the degree of dispersion of each indicator in the mixed sample. If the differences between some samples are too large (i.e., the standard deviation exceeds the threshold), it also indicates that the mixture is uneven.

[0161] The logical "OR" here comprehensively considers both the absolute value and the discreteness of the indicator. If even one of these factors is abnormal, adjustments are triggered to ensure the quality of the blend. A pairwise difference less than the threshold is based on a single comparison, focusing on the difference between each pair of data points. If the overall deviation range of the data points is large but the distribution is relatively even, all pairwise differences may be less than the threshold. The standard deviation is calculated based on the deviation of all data points from the mean and focuses on the overall distribution. Even if the pairwise differences are small, the standard deviation may still be large if the data points are distributed far from the mean.

[0162] If the difference set does not satisfy the first preset mixing condition (i.e., some of the difference values ​​are greater than the corresponding threshold), it indicates that there is an obvious problem with the mixing. Alternatively, even if the difference set satisfies the first preset mixing condition, but the calculated standard deviation does not satisfy the second preset mixing condition, it indicates that there is a hidden problem with the mixing. The second preset mixing condition includes the standard deviation of the color coordinates being less than or equal to the preset color coordinate standard deviation, the standard deviation of the color temperature values ​​being less than or equal to the preset color temperature standard deviation, and the standard deviation of the luminous flux being less than or equal to the preset luminous flux standard. In both of the above cases, it is necessary to adjust the second preset speed and / or the second preset time and re-stir the colloid.

[0163] For example, but not limitation, if the initial stirring time is long enough, but the test results show uneven mixing (such as a large difference in luminous flux, which may be related to insufficient local dispersion), the mixing efficiency can be improved by increasing the stirring speed. If the test results show that the overall uniformity is acceptable, but the standard deviation still exceeds the threshold, it means that the mixing requires more time, and the speed is close to the equipment limit or is not suitable for further increase. If the test results show serious unevenness (such as significant deviations in both color coordinates and luminous flux), it may be necessary to adjust the speed and time in combination to significantly improve the mixing effect. After adjusting the stirring conditions, it is necessary to return to stir a second time and ensure that the new stirring conditions can better meet the requirements.

[0164] S28. If the standard deviations of the color coordinate values, the luminous flux, and the color temperature values ​​meet the second preset mixing condition, a mixed colloid meeting the first preset condition is obtained by initially mixing the colloid.

[0165] When all test results meet the standard deviation requirements—that is, the fluctuations in color coordinate values, luminous flux, and color temperature are all within control ranges—the initial colloid mixture can be confirmed to have met the first pre-determined condition. At this point, the colloid mixture can be used in subsequent spin coating and curing steps to produce high-efficiency LED light-emitting semiconductors.

[0166] Preferably, in response to the first spectroscopic test result of the mixed colloid satisfying a first preset condition, the mixed colloid is uniformly coated on the surface of the LED excitation chip according to preset spin coating parameters to form a fluorescent coating, comprising:

[0167] S31, obtaining the viscosity of the mixed colloid and the target thickness of the fluorescent coating;

[0168] At this stage, the viscosity of the mixed colloid needs to be measured. The viscosity of the mixed colloid is crucial to the spin coating process, as colloids with higher viscosities are difficult to apply evenly, while colloids with lower viscosities may result in a thin coating and poor optical quality. Viscosity testing can predict the fluidity of the mixed colloid during spin coating and the coating effect.

[0169] The target phosphor coating thickness is also a key parameter to determine in this step. This target thickness is typically determined based on the LED application requirements, the phosphor's luminous efficiency, and the required optical performance. The appropriate phosphor coating thickness not only affects luminous flux but also parameters such as spectrum and color temperature, requiring precise control.

[0170] S32. Acquire corresponding preset spin coating parameters according to the viscosity and the target thickness, wherein the preset spin coating parameters include a spin coating speed control curve, the spin coating speed control curve includes a plurality of stages, and different stages have different durations and / or spin coating speeds;

[0171] Select appropriate spin coating parameters based on viscosity and target thickness. Spin coating speed is a key factor influencing coating uniformity and thickness. Higher speeds distribute the colloid quickly and evenly, but may result in a thinner coating. Lower speeds promote a uniform coating without overly thin layers. By adjusting the speed curve, you can achieve different speed and time settings at different stages of the spin coating process, precisely controlling the thickness and uniformity of the phosphor coating.

[0172] The speed control profile in the pre-set spin coating parameters typically consists of multiple stages. For example, the first stage might be a lower speed to evenly distribute the colloid across the chip surface, followed by a higher speed in the second stage to further homogenize the coating and accelerate the coating process. The speed control and duration settings for these different stages are optimized based on experience and experimental results.

[0173] S33, dropping a preset amount of the mixed colloid to the center of the LED excitation chip;

[0174] During this stage, a predetermined amount of mixed colloid is precisely dripped onto the center of the LED excitation chip. The amount of colloid added is typically optimized to ensure the correct amount without spillage or uneven coverage. The accuracy of this dripping process is crucial for uniform coating. Uneven colloid application can result in inconsistent coating thickness, impacting optical performance.

[0175] S34, controlling the LED excitation chip to rotate according to the spin coating speed control curve so that the mixed colloid diffuses on the surface of the LED excitation chip to form an initial fluorescent coating;

[0176] After the colloid is added, the spin coating process is initiated, and the speed is adjusted according to the preset spin coating speed control curve. During the spin process, the colloid diffuses outward under the influence of centrifugal force and spreads evenly across the surface of the LED chip. The key to this process is to control the speed and time to ensure that the coating is both uniform and achieves the desired thickness. The spin rate and time are adjusted according to the target thickness and the viscosity of the colloid to ensure the desired coating quality.

[0177] S35, performing spectroscopic detection on different positions on the initial fluorescent coating to obtain a second preset number of second spectroscopic test results;

[0178] After spin coating, the initially formed phosphor coating requires spectrophotometry testing. Testing is performed at various locations on the coating to ensure uniformity. A second predetermined number of tests are typically performed to cover different areas of the coating and obtain representative optical data. This data includes parameters such as luminous flux, color temperature, and color coordinates, which are used to evaluate the coating's optical properties.

[0179] S36, judging whether the fluorescent coating is uniform according to the degree of difference between the second spectroscopic test results;

[0180] At this stage, the uniformity of the phosphor coating can be determined by comparing the spectrophotometric test results. If the test results vary significantly at different locations, the coating may be uneven. Conversely, if the test results are similar across locations, the coating is relatively uniform. This discrepancy can be determined by measuring differences in parameters such as luminous flux, color temperature, and color coordinates, or by calculating their standard deviation or difference.

[0181] S37, if it is not uniform, adjusting the duration of the specified stage of the spin coating speed control curve and / or the spin coating speed according to the degree of the difference;

[0182] If unevenness in the phosphor coating is detected, it's necessary to adjust the spin-coating parameters. Depending on the location and extent of the unevenness, adjustments can be made to specific stages of the spin-coating process. For example, thicker coatings in certain areas may be due to an initial spin-coating speed that was too high, while thinner coatings in certain areas may be due to a spin-coating speed that was too low. Therefore, fine-tuning the duration or speed of specific stages in the spin-coating speed control curve can improve coating uniformity.

[0183] S38: If uniform, a fluorescent coating that meets a second preset condition is obtained through the initial fluorescent coating.

[0184] Once the phosphor coating meets uniformity requirements and meets pre-set optical properties (e.g., luminous flux, color temperature, color coordinates, etc.), the coating has met the second pre-set condition. At this point, the coating is considered qualified, completing the phosphor coating preparation process, and subsequent steps (e.g., curing) can proceed.

[0185] Preferably, the spin coating speed control curve includes an initial stage, a main spin coating stage and an accelerated spin coating stage in sequence, and obtaining the preset spin coating parameters according to the viscosity and the target thickness includes:

[0186] S321, measuring the mixed colloid to obtain colloid parameters, wherein the colloid parameters include density and particle concentration of the mixed colloid;

[0187] First, it's necessary to measure some basic parameters of the colloid mixture to facilitate effective adjustments during the subsequent spin-coating process. The density of the colloid mixture refers to the mass of the colloid per unit volume, while the particle concentration refers to the phosphor particle content within the colloid mixture. These parameters directly influence the fluidity of the colloid and the diffusion rate during spin coating, thus determining the thickness and uniformity of the final coating.

[0188] A colloid with a higher density will be more difficult to spread and may result in a thicker coating, whereas a colloid with a lower density will spread more easily and may result in a thinner coating.

[0189] A high particle concentration means a higher phosphor content in the colloid, a higher viscosity, and poor colloid fluidity. A low particle concentration means a lower viscosity, better fluidity, and an easier formation of a more uniform coating.

[0190] S322, obtaining a first rotational speed and a first duration in the initial stage based on the viscosity of the mixed colloid, the preset drop amount, and the surface area of ​​the LED excitation chip, wherein the first rotational speed is positively correlated with the viscosity of the coating colloid and negatively correlated with the surface area; the first duration is positively correlated with the surface area and positively correlated with the preset drop amount;

[0191] In the initial stage, the goal is to evenly coat the colloid on the surface of the LED excitation chip. In this stage, the settings of the rotation speed and duration are crucial.

[0192] First, the rotational speed is positively correlated with the viscosity of the colloid. This is because colloids with higher viscosities require higher rotational speeds to ensure even spreading. For lower viscosities, the rotational speed can be reduced. The rotational speed is negatively correlated with the surface area. The larger the chip surface area, the lower the required rotational speed. A larger surface area requires longer time and a lower rotational speed to ensure even spreading of the colloid.

[0193] The duration of the first stage is positively correlated with the surface area of ​​the LED excitation chip. The larger the surface area, the longer the coating time. It is also positively correlated with the preset drop volume. The larger the drop volume, the longer the coating time. By adjusting the duration, you can ensure a uniform coating.

[0194] S323, obtaining a second rotation speed and a second duration of the main spin coating phase according to the viscosity and density of the mixed colloid and the particle concentration, wherein the second rotation speed is positively correlated with the viscosity and density and negatively correlated with the particle concentration; the second duration is positively correlated with the target thickness and negatively correlated with the density;

[0195] During the main spin coating stage, the goal is to further optimize the uniformity and thickness of the coating by spin coating.

[0196] The second speed is positively correlated with the viscosity and density of the colloid, as colloids with higher viscosity and density require higher speeds to evenly distribute the colloid on the surface in a shorter time. It is negatively correlated with particle concentration, as colloids with high particle concentrations increase the resistance of the coating. Higher particle concentrations require lower speeds to avoid uneven or overly thick coatings.

[0197] The second duration is positively correlated with the target thickness, as thicker coatings require longer times to ensure the colloid can fully spread and cure. It is negatively correlated with density, as denser colloids require longer times to expand to the desired thickness.

[0198] S324. Obtain a third rotation speed and a third duration of the accelerated spin coating stage according to the viscosity, density and particle concentration of the mixed colloid, wherein the third rotation speed is positively correlated with the viscosity and density, and negatively correlated with the particle concentration; and the third duration is positively correlated with the target thickness, and negatively correlated with the density.

[0199] The purpose of the accelerated spin coating stage is to speed up the coating process to minimize the solvent evaporation time while maintaining coating uniformity and target thickness.

[0200] The third speed is positively correlated with the viscosity and density of the mixed colloid. Higher viscosity and density result in a denser colloid, requiring a higher speed to accelerate coating formation. It is negatively correlated with particle concentration. When particle concentration is high, the colloid becomes more viscous, requiring a lower speed to avoid uneven coating distribution.

[0201] The third duration is positively correlated with the target thickness; thicker coatings require more time to complete the accelerated spin coating process to ensure uniformity. It is negatively correlated with density, as denser colloid coatings form faster, allowing accelerated coating to be completed in a shorter time.

[0202] Preferably, in response to the second spectroscopic test result of the fluorescent coating meeting the second preset condition, curing the LED excitation chip with the fluorescent coating according to the preset curing condition to obtain the initial light-emitting semiconductor includes:

[0203] S41, obtaining preset curing conditions corresponding to the type of the LED encapsulation adhesive, wherein the preset curing conditions include curing temperature and curing time;

[0204] During the curing process, curing conditions are crucial because different types of LED encapsulants have different chemical compositions and physical properties, and therefore require different curing temperatures and times. The purpose of this step is to select initial curing conditions that match the type of encapsulant used. Preset curing conditions typically include two main components:

[0205] Curing temperature is the temperature at which heat is applied to the colloid and phosphor coating. Too high a temperature may cause the colloid to be too fluid, resulting in an uneven coating; too low a temperature may not fully cure the colloid, affecting its performance.

[0206] The curing time is the time the colloid needs to be maintained at a set temperature. A longer curing time helps the colloid fully cure, but too long a time may lead to excessive heat treatment, which may affect the luminescence performance. This time is usually preset based on the characteristics of the material.

[0207] S42, adjusting the preset curing conditions according to the colloid parameters of the mixed colloid to obtain target curing conditions

[0208] Adjustment of curing conditions is based on the actual conditions of the mixed colloid. The physical parameters of the colloid (such as density, viscosity, particle concentration, etc.) will affect its behavior during the curing process, so fine-tuning of curing conditions is necessary.

[0209] Adjusting the curing temperature: Depending on the viscosity and density of the colloid, the curing temperature may need to be slightly increased or decreased. For example, a higher viscosity colloid may require a higher curing temperature to ensure efficient curing, while a lower viscosity colloid may fully cure at a lower temperature.

[0210] Adjustment of curing time: If the particle concentration of the colloid is high, the curing time may need to be extended to ensure that all the material is completely cured; conversely, a lower particle concentration may complete the curing in a shorter time.

[0211] S43, curing the LED excitation chip with the fluorescent coating according to the target curing conditions to obtain an initial light-emitting semiconductor;

[0212] This step applies the adjusted target curing conditions to the LED excitation chip. The LED excitation chip is placed in the curing equipment and treated according to the target curing conditions (including temperature and time). The goal is to thoroughly cure the fluorescent coating and ensure the stability of the coating and colloid as well as their optical properties.

[0213] During this process, the temperature and time of the curing equipment need to be strictly controlled to ensure that the uniformity and performance of the coating meet the expected requirements.

[0214] S44, performing a spectroscopic test on the initial light-emitting semiconductor to obtain a third spectroscopic test result, wherein the third spectroscopic test result includes luminous flux, color coordinate values, and color temperature;

[0215] After the curing process is completed, the fluorescent coating of the LED excitation chip needs to undergo a final spectrophotometric test to ensure that its luminous performance meets expectations. The third spectrophotometric test mainly measures the following key parameters:

[0216] Luminous flux: The light output capacity of an LED light-emitting semiconductor, that is, the total amount of light emitted per unit time. Low luminous flux may mean that the efficiency of the phosphor coating or chip is low.

[0217] Color coordinates: These reflect the color of the LED's light-emitting semiconductor. These coordinates are typically expressed as coordinates on a chromaticity diagram. They determine whether the color of the light emitted meets predetermined requirements.

[0218] Color temperature: Color temperature is a parameter that describes the hue of a light source. Lower color temperatures generally indicate warmer light, while higher color temperatures indicate cooler light. Deviations in color temperature can affect the final application of the light source.

[0219] S45. Performing a weighted calculation on the luminous flux, the color coordinate value, and the color temperature based on the difference between each parameter in the third spectral test result and the corresponding target spectral parameter threshold value to obtain a spectral deviation degree of the initial light-emitting semiconductor, wherein the target spectral parameter threshold value includes a luminous flux threshold value, a color coordinate threshold value, and a color temperature threshold value; the weight value of the luminous flux is greater than or equal to the weight value of the color coordinate value, and the weight value of the color coordinate value is greater than the weight value of the color temperature;

[0220] This step will perform a weighted calculation of the differences in luminous flux, color coordinate values, and color temperature. The difference in each parameter will be weighted according to its impact on product quality to obtain the final degree of spectroscopic deviation.

[0221] Among them, luminous flux has the greatest weight, because luminous flux directly determines the brightness of the LED and is the factor that most directly affects the performance. A large deviation in luminous flux may mean that the LED cannot achieve the expected brightness.

[0222] Chromaticity coordinates are second most important, determining the color of the light source. Large deviations can affect color accuracy, and thus the user experience, especially in applications with high color requirements. Color temperature carries the least weight. While color temperature is also an important factor affecting color, in many applications, deviations in color temperature generally have less impact on the final product than luminous flux and chromaticity coordinates.

[0223] S46: If the spectral deviation is less than or equal to a preset deviation threshold, the third spectral test result satisfies a preset finished product spectral condition;

[0224] If the calculated spectral deviation is less than or equal to a preset deviation threshold, the initial light-emitting semiconductor's optical performance has met the expected requirements and satisfies the optical conditions of the finished product. If these conditions are met, the initial light-emitting semiconductor can be put into use as a final product.

[0225] S47: Otherwise, the third spectroscopic test result does not meet the preset finished product spectroscopic condition.

[0226] If the degree of spectroscopic deviation exceeds the preset deviation threshold, it indicates that the initial light-emitting semiconductor performance is not up to standard and further adjustment and optimization may be required. In this case, you can return to the previous steps to adjust parameters, such as adjusting the curing conditions, phosphor coating, or other process steps.

[0227] Preferably, if the third spectral test result of the initial light-emitting semiconductor does not meet the preset finished product spectral condition, adjusting one or more of the first preset ratio, the second preset ratio, the preset spin coating parameters, and the preset curing conditions according to the first spectral test result, the second spectral test result, and the third spectral test result, includes:

[0228] S51, respectively obtaining the deviation degree between the first spectroscopic test result, the second spectroscopic test result, and the third spectroscopic test result and the target spectroscopic parameter threshold, recorded as a first deviation degree, a second deviation degree, and a third deviation degree;

[0229] In this step, the test results for each stage (mixing, coating, and curing) are compared against the preset target spectroscopic parameter thresholds. The deviations from the test results for each stage (such as luminous flux, color coordinates, and color temperature) are calculated based on the difference between the target parameters and the actual results. These deviations are recorded as:

[0230] First deviation degree: The difference between the first spectroscopic test result and the target spectroscopic parameter threshold, reflecting the performance of the mixing stage.

[0231] Second deviation degree: The difference between the second spectroscopic test result and the target spectroscopic parameter threshold, reflecting the performance of the spin coating stage.

[0232] Third Deviation Degree: The difference between the third spectrophotometric test result and the target spectrophotometric parameter threshold, reflecting the performance of the curing stage.

[0233] Calculation of these deviations helps identify optical performance issues at each stage and provides data support for subsequent adjustments.

[0234] S52: Obtaining allowable deviation thresholds for the first spectrophotometric test result, the second spectrophotometric test result, and the third spectrophotometric test result according to the preset deviation threshold, wherein the allowable deviation thresholds for the first spectrophotometric test result, the second spectrophotometric test result, and the third spectrophotometric test result are increased in sequence;

[0235] In order to handle deviations at different stages, you can set gradually increasing deviation thresholds. The allowed deviation thresholds for each stage increase in sequence, meaning:

[0236] Mixing stage: Larger deviations are allowed because the test at this stage is mainly for the preliminary evaluation of the phosphor ratio and the uniformity of the colloid mixing.

[0237] Spin coating stage: The permissible deviation is smaller because the uniformity and optical properties of the coating are more important at this time.

[0238] Curing stage: The allowed deviation is minimal because the curing process determines the performance of the final light-emitting semiconductor and the error must be minimized.

[0239] By setting gradually tighter deviation thresholds, possible problems at each stage can be effectively screened out.

[0240] S53, determining a main deviation stage according to the first deviation degree, the second deviation degree, the third deviation degree and the corresponding allowable deviation thresholds, wherein the main deviation stage includes one of a mixing stage, a spin coating stage and a curing stage;

[0241] In this step, the deviation level of each stage is compared with the allowable deviation threshold. If the deviation of a stage exceeds the allowable deviation threshold, it is considered to be the main deviation stage. This helps to determine which process the problem occurs and provides direction for subsequent adjustments:

[0242] If the first deviation exceeds the standard, the problem may be in the mixing stage, and the main deviation stage is in the mixing stage. If the second deviation exceeds the standard, the problem may be in the spin coating stage, and the main deviation stage is in the spin coating stage. If the third deviation exceeds the standard, the problem may be in the curing stage, and the main deviation stage is in the curing stage.

[0243] S55. Determine parameters to be adjusted according to the main deviation stage, wherein the parameters to be adjusted in the mixing stage include a first preset ratio and a second preset ratio, the parameters to be adjusted in the spin coating stage include preset spin coating parameters, and the parameters to be adjusted in the curing stage include preset curing conditions;

[0244] Once the main deviation stage is identified, the next step is to find out the parameters that need to be adjusted at that stage:

[0245] If the problem occurs during the mixing phase, the parameters that need to be adjusted are usually the first preset ratio (the ratio of phosphors) and the second preset ratio (the ratio of phosphors to encapsulant), which directly affect the optical properties of the mixed colloid.

[0246] If the problem occurs during the spin coating stage, it is necessary to adjust the spin coating parameters, such as spin coating speed, coating time, etc. These parameters will directly affect the uniformity and thickness of the coating.

[0247] If the problem occurs during the curing stage, it may be necessary to adjust the curing conditions, including the curing temperature and curing time. These parameters have a decisive influence on the optical properties of the final product.

[0248] S56: Determine an adjustment amount of the parameter to be adjusted according to the first spectroscopic test result, the second spectroscopic test result, the third spectroscopic test result, and the target spectroscopic parameter threshold;

[0249] In this step, the difference between each test parameter and the target parameter can be calculated based on the previous spectrophotometric test results. Based on these differences, the specific amount of adjustment required for each parameter can be further calculated:

[0250] If the luminous flux deviation is large, it is necessary to adjust the first preset ratio (affecting the luminous flux) or the second preset ratio (affecting the optical properties of the colloid).

[0251] Differences in color coordinates may mean that the phosphor ratio or the parameters of the spin coating process need to be adjusted.

[0252] Changes in color temperature may indicate that the temperature or time of the curing stage is not set correctly and needs to be adjusted.

[0253] By calculating the specific adjustment amount for each parameter, the settings for each process stage can be precisely optimized.

[0254] S57: Adjust the parameter to be adjusted according to the adjustment amount.

[0255] The final step is to adjust the corresponding parameters based on the determined adjustment amount. After each adjustment, spectrophotometry should be re-tested to ensure that the deviation is gradually reduced and ultimately the preset spectrophotometric parameter requirements are achieved. Through the above steps, relevant parameters can be adjusted at each stage (mixing, spin coating, and curing) based on spectrophotometric test results and deviation thresholds. This gradual adjustment and feedback mechanism ensures that the optical performance of the final product remains stable within the target range, while also improving process controllability and consistency through precise parameter adjustment.

[0256] It should be understood that the present invention is not limited to the specific configurations and processes described above and illustrated in the figures. For the sake of brevity, a detailed description of known methods is omitted. In the above embodiments, several specific steps are described and illustrated as examples. However, the method of the present invention is not limited to the specific steps described and illustrated. Those skilled in the art may make various changes, modifications, and additions, or change the order of the steps after understanding the spirit of the present invention.

[0257] It should also be noted that the exemplary embodiments described herein describe methods or systems based on a series of steps or devices. However, the present invention is not limited to the order of the steps described above. In other words, the steps may be performed in the order described in the embodiments, or in a different order, or several steps may be performed simultaneously.

[0258] The above description is only a specific embodiment of the present invention. Those skilled in the art will clearly understand that for the convenience and brevity of description, the specific working processes of the systems, modules and units described above can refer to the corresponding processes in the aforementioned method embodiments, and will not be repeated here. It should be understood that the protection scope of the present invention is not limited to this. Any person skilled in the art can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present invention, and these modifications or replacements should be covered within the protection scope of the present invention.

Claims

1. A method for preparing a high-light-efficiency LED light-emitting semiconductor, characterized in that: The high-efficiency LED light-emitting semiconductor comprises: LED excitation chip; phosphors; The phosphors include a first phosphor, a second phosphor, and a third phosphor. The peak wavelength of the first phosphor is within a first wavelength range, the peak wavelength of the second phosphor is within a second wavelength range, and the peak wavelength of the third phosphor is within a third wavelength range. The first wavelength range is 545-556 nm, the second wavelength range is 630-634 nm, and the third wavelength range is 615-617 nm. The main wavelength of the LED excitation chip is in the fourth wavelength range, and the fourth wavelength range is 440-470nm; The preparation method comprises: placing a first phosphor, a second phosphor, and a third phosphor weighed in a first preset ratio in a stirring container and uniformly mixing them to obtain a phosphor mixture; Adding the phosphor mixture to the LED packaging adhesive according to a second preset ratio and continuing to stir to obtain a mixed colloid; In response to a first spectroscopic test result of the mixed colloid satisfying a first preset condition, the mixed colloid is uniformly coated on a surface of the LED excitation chip according to preset spin coating parameters to form a fluorescent coating; In response to the second spectroscopic test result of the fluorescent coating meeting the second preset condition, curing the LED excitation chip with the fluorescent coating according to the preset curing condition to obtain an initial light-emitting semiconductor; If the third spectroscopic test result of the initial light-emitting semiconductor does not meet the preset finished product spectroscopic conditions, adjusting one or more of the first preset ratio, the second preset ratio, the preset spin coating parameters, and the preset curing conditions according to the first spectroscopic test result, the second spectroscopic test result, and the third spectroscopic test result; If the third light emitting semiconductor test result meets the preset finished product light emitting condition, the initial light emitting semiconductor is used as the target light emitting semiconductor.

2. The method for preparing a high-light-efficiency LED light-emitting semiconductor according to claim 1, wherein: The particle size of the first phosphor is between 23.0 and 26.0 μm, the particle size of the second phosphor is between 22.0 and 28.0 μm, and the particle size of the third phosphor is between 18.0 and 20.0 μm.

3. The method for preparing a high-light-efficiency LED light-emitting semiconductor according to claim 2, wherein: The chemical formula of the first phosphor is Y3(Al,Ga)5O 12 :Ce, the chemical formula of the second phosphor is K2SiF6:Mn 4+ , the third phosphor is a nitride; compared with room temperature conditions, the temperature quenching rate of the third phosphor at 100°C is 93%; the internal quantum efficiency of the third phosphor is 0.97±0.02, and the external quantum efficiency of the third phosphor is 0.85±0.

02.

4. The method for preparing a high-light-efficiency LED light-emitting semiconductor according to any one of claims 1 to 3, characterized in that: It also includes LED packaging glue, the mass percentage of the first phosphor is 17.42%, the mass percentage of the second phosphor is 0.62%, the mass percentage of the third phosphor is 21.42%, and the mass percentage of the LED packaging glue is 60.54%.

5. The method for preparing a high-light-efficiency LED light-emitting semiconductor according to claim 1, wherein: The method of adding the phosphor mixture to the LED packaging adhesive according to the second preset ratio and continuously stirring to obtain a mixed colloid comprises: Preliminarily stirring the phosphor mixture and LED encapsulation adhesive at a first preset stirring speed according to a second preset ratio and for a first preset time; Continuously stirring at a second preset stirring speed and maintaining the stirring for a second preset time to obtain an initial mixed colloid, wherein the second preset stirring speed is greater than the first preset stirring speed; Sampling samples at different positions of the initial mixed colloid to obtain a first preset number of mixed colloid samples; Performing a spectrophotometric test on each of the mixed colloid samples to obtain a corresponding first spectrophotometric test result, wherein the first spectrophotometric test result includes: luminous flux, color coordinate value, and color temperature; According to each of the first spectrophotometric test results, obtaining the differences in color coordinate values, luminous flux, and color temperature values ​​between the two mixed colloid samples to obtain a difference value set, wherein the difference value set includes a color coordinate difference value set, a luminous flux difference value set, and a color temperature difference value set; If the difference value set satisfies a first preset mixing condition, obtaining the standard deviation of the color coordinate value, the luminous flux value, and the color temperature value, respectively, based on each of the first spectroscopic test results, wherein the first preset mixing condition includes that each color coordinate difference value in the color coordinate difference value set is less than or equal to a preset color coordinate threshold value, each color luminous flux difference value in the luminous flux difference value is less than or equal to a preset luminous flux threshold value, and each color temperature difference value in the color temperature difference value set is less than or equal to a preset color temperature threshold value; If none of the difference value sets satisfy the first preset mixing condition, or the standard deviation of the color coordinate value, the luminous flux, or the color temperature value does not satisfy the second preset mixing condition, adjusting the second preset stirring speed and / or the second preset time, and returning to the step of continuously stirring according to the second preset stirring speed and maintaining the stirring for the second preset time to obtain an initial mixed colloid, wherein the second preset mixing condition includes that the standard deviation of the color coordinates is less than or equal to the preset color coordinate standard deviation, the standard deviation of the color temperature value is less than or equal to the preset color temperature standard deviation, and the standard deviation of the luminous flux is less than or equal to the preset luminous flux standard deviation; If the standard deviations of the color coordinate values, the luminous flux, and the color temperature values ​​meet the second preset mixing condition, a mixed colloid meeting the first preset condition is obtained by initially mixing the colloid.

6. The method for preparing a high-light-efficiency LED light-emitting semiconductor according to claim 1, wherein: In response to the first spectroscopic test result of the mixed colloid satisfying the first preset condition, the mixed colloid is uniformly coated on the surface of the LED excitation chip according to preset spin coating parameters to form a fluorescent coating, including: obtaining the viscosity of the mixed colloid and the target thickness of the fluorescent coating; Obtaining corresponding preset spin coating parameters according to the viscosity and the target thickness, wherein the preset spin coating parameters include a spin coating speed control curve, the spin coating speed control curve includes a plurality of stages, and different stages have different durations and / or spin coating speeds; Add a preset amount of mixed colloid to the center of the LED excitation chip; According to the spin coating speed control curve, the LED excitation chip is controlled to rotate so that the mixed colloid diffuses on the surface of the LED excitation chip to form an initial fluorescent coating; Performing spectroscopic detection on different positions on the initial fluorescent coating to obtain a second preset number of second spectroscopic test results; determining whether the fluorescent coating is uniform according to the degree of difference between the second spectroscopic test results; If it is not uniform, adjusting the duration of the specified phase of the spin coating speed control curve and / or the spin coating speed according to the degree of the difference; If it is uniform, a fluorescent coating that meets the second preset condition is obtained through the initial fluorescent coating.

7. The method for preparing a high-light-efficiency LED light-emitting semiconductor according to claim 6, wherein: The spin coating speed control curve includes an initial stage, a main spin coating stage, and an accelerated spin coating stage. The preset spin coating parameters are obtained according to the viscosity and the target thickness, including: Measuring the mixed colloid to obtain colloid parameters, wherein the colloid parameters include density and particle concentration of the mixed colloid; Obtaining a first rotation speed and a first duration in the initial stage according to the viscosity of the mixed colloid, the preset drop amount, and the surface area of ​​the LED excitation chip, wherein the first rotation speed is positively correlated with the viscosity of the coating colloid and negatively correlated with the surface area; the first duration is positively correlated with the surface area and positively correlated with the preset drop amount; Obtaining a second rotation speed and a second duration of the main spin coating stage according to the viscosity and density of the mixed colloid and the particle concentration, wherein the second rotation speed is positively correlated with the viscosity and density and negatively correlated with the particle concentration; the second duration is positively correlated with the target thickness and negatively correlated with the density; According to the viscosity, density and particle concentration of the mixed colloid, a third rotation speed and a third duration of the accelerated spin coating stage are obtained, wherein the third rotation speed is positively correlated with the viscosity and density, and negatively correlated with the particle concentration; the third duration is positively correlated with the target thickness, and negatively correlated with the density.

8. The method for preparing a high-light-efficiency LED light-emitting semiconductor according to claim 7, wherein: In response to the second spectroscopic test result of the fluorescent coating meeting the second preset condition, curing the LED excitation chip with the fluorescent coating according to the preset curing condition to obtain an initial light-emitting semiconductor, including: Obtaining preset curing conditions corresponding to the type of LED encapsulation adhesive, wherein the preset curing conditions include curing temperature and curing time; According to the colloid parameters of the mixed colloid, the preset curing conditions are adjusted to obtain the target curing conditions. Curing the LED excitation chip with the fluorescent coating according to the target curing conditions to obtain an initial light-emitting semiconductor; Performing a spectroscopic test on the initial light-emitting semiconductor to obtain a third spectroscopic test result, wherein the third spectroscopic test result includes luminous flux, color coordinate values, and color temperature; performing a weighted calculation on the difference between each parameter in the third spectral test result and the corresponding target spectral parameter threshold to obtain a spectral deviation degree of the initial light-emitting semiconductor, wherein the target spectral parameter threshold includes a luminous flux threshold, a color coordinate threshold, and a color temperature threshold; the weight value of the luminous flux is greater than or equal to the weight value of the color coordinate value, and the weight value of the color coordinate value is greater than the weight value of the color temperature; If the degree of spectroscopic deviation is less than or equal to a preset deviation threshold, the third spectroscopic test result meets the preset finished product spectroscopic condition; Otherwise, the third spectrophotometric test result does not meet the preset finished product spectrophotometric condition.

9. The method for preparing a high-light-efficiency LED light-emitting semiconductor according to claim 8, wherein: If the third spectral test result of the initial light-emitting semiconductor does not meet the preset finished product spectral condition, adjusting one or more of the first preset ratio, the second preset ratio, the preset spin coating parameters, and the preset curing conditions according to the first spectral test result, the second spectral test result, and the third spectral test result, includes: Obtaining deviations of the first spectroscopic test result, the second spectroscopic test result, and the third spectroscopic test result from a target spectroscopic parameter threshold value, respectively, and recording them as a first deviation degree, a second deviation degree, and a third deviation degree; According to the preset deviation threshold, obtaining the allowable deviation thresholds of the first spectrophotometric test result, the second spectrophotometric test result, and the third spectrophotometric test result, wherein the allowable deviation thresholds of the first spectrophotometric test result, the second spectrophotometric test result, and the third spectrophotometric test result are increased in sequence; Determining a main deviation stage according to the first deviation degree, the second deviation degree, the third deviation degree and corresponding allowable deviation thresholds, wherein the main deviation stage includes one of a mixing stage, a spin coating stage and a curing stage; Determining parameters to be adjusted according to the main deviation stage, wherein the parameters to be adjusted in the mixing stage include a first preset ratio and a second preset ratio, the parameters to be adjusted in the spin coating stage include preset spin coating parameters, and the parameters to be adjusted in the curing stage include preset curing conditions; determining an adjustment amount of the parameter to be adjusted according to the first spectroscopic test result, the second spectroscopic test result, the third spectroscopic test result, and the target spectroscopic parameter threshold; The parameter to be adjusted is adjusted according to the adjustment amount.

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