Wafer back cleaning device, wafer cleaning equipment and wafer cleaning method

Abstract

The embodiment of the invention provides a wafer back cleaning device, wafer cleaning equipment and a wafer cleaning method, the wafer back cleaning device comprises a main body part, the upper part of the main body part is provided with a clamping piece capable of clamping a wafer and enabling the wafer to be parallel to the horizontal plane, and the main body part is internally provided with a mounting hole penetrating through the axis of the main body part; the output shaft is arranged in the mounting hole, a liquid conveying pipe is arranged in the output shaft, and cleaning liquid used for being sprayed to the lower surface of the wafer is conveyed through the liquid conveying pipe; the liquid discharging assembly is communicated with the liquid conveying pipe, and a negative pressure air pipe penetrating through the liquid discharging assembly and a communicating pipeline communicating with the negative pressure air pipe and the liquid conveying pipe at the same time are arranged in the liquid discharging assembly; when the negative pressure air pipe is ventilated through the air inlet, residual liquid in the infusion tube is pumped out through negative pressure and is discharged through the discharge port of the negative pressure air pipe. The embodiment of the invention provides a wafer back cleaning device, wafer cleaning equipment and a wafer cleaning method. Residual liquid in a liquid conveying pipe can be avoided.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of wafer cleaning technology, and in particular to a wafer back side cleaning device, a wafer cleaning equipment and a wafer cleaning method. Background Art

[0002] In the horizontal wet cleaning process of the wafer, when the back side of the wafer needs to be cleaned, a cleaning liquid is used to clean the back side of the wafer. The cleaning process is usually completed by setting up several groups of pipes at the center point under the wafer.

[0003] Because the wafer being cleaned usually needs to be driven by a driving device (such as a hollow motor) to rotate at high speed, the size and number of the backside pipelines are limited by the driving device (such as a hollow motor) and the number will not be too large. Generally speaking, the backside will contain at least three pipelines, namely, the infusion pipe for wafer cleaning, the gas purge pipe for accelerating the drying of the backside of the wafer, and the drainage pipe for discharging the waste liquid from the backside cleaning.

[0004] To meet the cleaning process requirements of the back of the wafer, the infusion tube can usually be used to transport a variety of cleaning fluids, such as DHF, SC1, DI-O3, DIW, etc. These cleaning fluids will be used in time periods through switching valves according to the requirements of the process menu. Summary of the invention

[0005] In view of this, the embodiments of the present application provide a wafer back side cleaning device, a wafer cleaning equipment and a wafer cleaning method, which can avoid the presence of residual liquid in the infusion tube.

[0006] According to the first aspect of the present application, a wafer back side cleaning device is provided, comprising: a main body, an upper part of which has a clamping member capable of clamping a wafer and making the wafer parallel to a horizontal plane, the main body having a mounting hole passing through its axis; an output shaft, which is arranged in the mounting hole, the output shaft having an infusion tube inside, so as to convey a cleaning liquid for spraying the lower surface of the wafer through the infusion tube; at least one drainage component, which is connected to the infusion tube, the drainage component having a negative pressure air pipe passing through it and a connecting pipeline connected to both the negative pressure air pipe and the infusion tube; when the negative pressure air pipe is ventilated through the air inlet, a negative pressure can be formed at the connection point between the negative pressure air pipe and the connecting pipeline, so that the residual liquid in the infusion tube can be extracted by the negative pressure and discharged from the discharge port of the negative pressure air pipe.

[0007] Optionally, the drainage component includes an air supply pipeline and a discharge pipeline, and the negative pressure air pipe includes: a first pipe section, the first pipe section has the air inlet, and the air inlet is connected to the air supply pipeline; a second pipe section, the second pipe section has the discharge outlet, and the discharge outlet is connected to the discharge pipeline; a negative pressure pipe section, the two ends of the negative pressure pipe section are respectively connected to the first pipe section and the second pipe section, and the radial dimension of the negative pressure pipe section is smaller than the radial dimension of the first pipe section and the radial dimension of the second pipe section, so that when the negative pressure air pipe is ventilated, negative pressure can be formed at the negative pressure pipe section.

[0008] Optionally, the drainage component also includes a drainage body, the connecting pipeline is arranged in the drainage body, and the connecting pipeline is connected to the negative pressure pipe section to discharge the residual liquid through the infusion tube, the connecting pipeline and the discharge port of the second pipe section through negative pressure.

[0009] Optionally, the connecting pipeline includes a liquid inlet pipe section, a transition pipe section and a guide pipe section which are connected in sequence, the transition pipe section has a cavity inside, one end of the guide pipe section is connected to the transition pipe section, the other end of the guide pipe section is connected to the negative pressure pipe section, and the extension direction of the guide pipe section has an acute angle with the first pipe section to guide the residual liquid to the second pipe section.

[0010] Optionally, the drainage body of the drainage component, the negative pressure air pipe and the connecting pipeline are all made of resin materials.

[0011] Optionally, the wafer back side cleaning device also includes a combination valve, which includes a converging flow tube and multiple liquid medicine tubes, one ends of the multiple liquid medicine tubes are respectively connected to multiple different liquid medicines, and the other ends of the multiple liquid medicine tubes are connected to the infusion tube through the converging flow tube to transport different liquid medicines in the infusion tube, the infusion tube and the connecting pipeline are both connected to the converging flow tube, and the connecting pipeline of the drainage assembly is connected to the infusion tube through the converging flow tube.

[0012] Optionally, the drainage assembly further comprises: a gas flow meter, wherein the gas flow meter is arranged between the gas supply pipeline and the gas inlet.

[0013] Optionally, the plurality of drug liquid tubes, the infusion tubes and the connecting pipelines are respectively connected to the converging pipe via a plurality of control valves, and the plurality of drug liquid tubes are respectively connected to the converging pipe via a plurality of liquid flow meters.

[0014] Optionally, the output shaft further includes a drain pipe, and the wafer back side cleaning device includes two drain components, one of which is connected to the combination valve, and the other of which is connected to the drain pipe.

[0015] Optionally, the wafer back side cleaning device further comprises a drainage collection trough, and the drainage collection trough is arranged between another of the drainage components and the drainage pipe.

[0016] According to a second aspect of the present application, a wafer cleaning device is provided, the wafer cleaning device comprising a wafer back side cleaning device, and the wafer back side cleaning device is the wafer back side cleaning device described in the first aspect above.

[0017] According to the third aspect of the present application, a wafer cleaning method is provided, which is applied to wafer cleaning equipment, and the method includes: clamping the wafer by a clamping member of the main body and making the wafer parallel to the horizontal plane; delivering cleaning liquid through an infusion tube inside the output shaft and spraying the cleaning liquid on the lower surface of the wafer to clean the lower surface of the wafer; when the delivery of the cleaning liquid is stopped, the residual liquid of the cleaning liquid in the infusion tube is extracted and discharged through at least one drainage component connected to the infusion tube; wherein the interior of the drainage component has a negative pressure air pipe passing through it and a connecting pipeline connected to the negative pressure air pipe and the infusion tube at the same time, and when the negative pressure air pipe is ventilated through the air inlet, a negative pressure can be formed at the connection point between the negative pressure air pipe and the connecting pipeline, so that the residual liquid in the infusion tube can be extracted by negative pressure and discharged from the discharge port of the negative pressure air pipe.

[0018] According to a fourth aspect of the present application, a computer storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, the method described in the third aspect is implemented.

[0019] According to a fifth aspect of the present application, a computer program product is provided, comprising a computer program, which implements the method described in the third aspect when executed by a processor.

[0020] The wafer backside cleaning device, wafer cleaning equipment and wafer cleaning method provided by the embodiments of the present application have the following beneficial effects:

[0021] 1. By connecting the drainage component with the infusion tube, after gas is introduced into the negative pressure air pipe inside the infusion tube, negative pressure can be formed at the connection between the negative pressure air pipe and the connecting pipeline, so that the residual liquid in the infusion tube can be extracted by negative pressure, thereby cleaning the residual liquid in the infusion tube.

[0022] 2. Avoid residual liquid remaining in the infusion tube, which may cause the residual liquid to flow out during the subsequent wafer processing and affect the wafer processing process. It can also avoid chemical reactions between the cleaning liquid used subsequently and the residual liquid.

[0023] 3. At the same time, by quickly discharging the residual liquid, the residual liquid in the infusion tube can be prevented from affecting the wafer cleaning process. In addition, since the residual liquid in the infusion tube can be quickly discharged, the subsequent cleaning liquid can be prevented from bringing out the residual liquid of the previously used cleaning liquid to the lower surface of the wafer when it is sprayed on the lower surface of the wafer. This effectively prevents the lower surface of the wafer from being contaminated. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the embodiments of the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0025] Figure 1 A cross-sectional view of a wafer backside cleaning device;

[0026] Figure 2 is a cross-sectional view of an embodiment of a wafer backside cleaning device according to the first aspect of the present application;

[0027] Figure 3 is a cross-sectional view of a drain assembly of a wafer backside cleaning device according to the first aspect of the present application;

[0028] Figure 4 is a cross-sectional view of another embodiment of the wafer backside cleaning device according to the first aspect of the present application;

[0029] Figure 5 is a cross-sectional view of a wafer cleaning device according to the second aspect of the present application;

[0030] Figure 6 is a flow chart of a wafer cleaning method according to the third aspect of the present application;

[0031] Figure 7 The wafer back side cleaning device is a comparison diagram of wafer cleaning before and after when the liquid discharge component is set and when the liquid discharge component is not set.

[0032] Description of reference numerals:

[0033] Wafer cleaning equipment 1000;

[0034] Wafer backside cleaning device 100;

[0035] Main body 10; mounting hole 101; clamping member 102;

[0036] Output shaft 20; liquid infusion tube 201; liquid discharge tube 202; gas purge tube 203;

[0037] Drain assembly 30; drain main body 301;

[0038] Negative pressure air pipe 302; first pipe section 3021; ​​second pipe section 3022; negative pressure pipe section 3023;

[0039] Connecting pipeline 303; liquid inlet pipe section 3031; transition pipe section 3032; flow guide pipe section 3033;

[0040] Gas supply pipeline 304; exhaust pipeline 305; gas flow meter 306;

[0041] Combination valve 40; flow pipe 401; liquid medicine pipe 402;

[0042] Control valve 70; liquid flow meter 80; drainage collection tank 90;

[0043] Cleaning device body 200; fan filter group 300; cleaning component 400;

[0044] Wafer W. DETAILED DESCRIPTION

[0045] In order to enable those skilled in the art to better understand the technical solutions in the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the embodiments of the present application should fall within the scope of protection of the embodiments of the present application.

[0046] In the description of the present application, it should be understood that the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0047] In addition, in the description of the present application, unless otherwise specified and limited, it should be noted that the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, it can be a mechanical connection or an electrical connection, or it can be the internal connection between two components. It can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to the specific circumstances.

[0048] As mentioned before, Figure 1As shown, during the horizontal wet cleaning process of wafer W, when the back side of wafer W needs to be cleaned, a cleaning liquid is used to clean the back side of wafer W. The cleaning process is usually completed by setting several groups of pipelines at the center point below wafer W.

[0049] Since the wafer W to be cleaned usually needs to be driven by a driving device (such as a hollow motor) to rotate the wafer W at a high speed, the size and number of the backside pipelines are limited by the driving device (such as a hollow motor) and the number will not be too large. Generally speaking, the backside will include at least three pipelines, namely, a liquid infusion pipe 201 for cleaning the wafer W, a gas purge pipe 203 for accelerating the drying of the backside of the wafer W, and a liquid discharge pipe 202 for discharging the waste liquid from the backside cleaning.

[0050] In order to meet the cleaning process requirements of the back side of the wafer W, the liquid delivery tube 201 can usually be used to deliver a variety of cleaning liquids. The cleaning liquid can use pure water or a variety of chemical liquids. For example, the cleaning liquid can use DHF, SC1, DI-O3, DIW, etc. These cleaning liquids will be used in different time periods through the switching valve according to the requirements of the process menu.

[0051] At present, when the cleaning liquid for cleaning the back of the wafer W is used in different time periods, there is a problem that the previous cleaning liquid remains in the pipeline, that is, there is residual liquid of the previously used cleaning liquid in the liquid infusion tube 201. The residual liquid may flow out from the lower end of the liquid infusion tube 201, or the previous residual liquid in the liquid infusion tube 201 may flow out in the next process step, and the residual liquid may affect the process of the wafer W. There is also a risk that the residual liquid may chemically react with the next cleaning liquid to be used (for example, acidic liquid DHF and alkaline liquid SC1).

[0052] Therefore, the present application proposes a wafer backside cleaning device 100 and a wafer cleaning apparatus 1000 for cleaning a wafer W. The residual liquid in the infusion tube 201 can be cleaned in time to prevent the residual liquid from affecting the process of the wafer W and preventing the residual liquid from chemically reacting with the cleaning liquid used subsequently.

[0053] The following is attached to the instruction manual Figure 2-Figure 4 The wafer backside cleaning device 100 for cleaning the wafer W according to the first aspect of the present application is described in detail. It should be noted that when the wafer W is placed in the horizontal cleaning device, the backside of the wafer W faces downward. Therefore, the lower surface of the wafer W herein refers to the backside of the wafer W.

[0054] According to a first aspect of the present invention, a wafer backside cleaning device 100 for cleaning a wafer W is provided. Figure 2As shown, it includes a main body 10, an output shaft 20 and at least one drainage assembly 30. The main body 10 has a clamping member 102 on its upper part that can clamp the wafer W and make the wafer W parallel to the horizontal plane. The clamping member 102 can be a structure such as an elastic clamping claw, which can conveniently and quickly clamp the wafer W. The main body 10 has a mounting hole 101 that runs through its axis. The axis of the main body 10 is along the up and down direction and is perpendicular to the horizontal plane. The mounting hole 101 formed inside it can be used to install the output shaft 20.

[0055] Specifically, the output shaft 20 is arranged in the mounting hole 101, and the output shaft 20 has a liquid infusion tube 201 inside, so as to deliver the cleaning liquid for spraying to the lower surface of the wafer W through the liquid infusion tube 201. The wafer back cleaning device 100 includes at least one liquid discharge component 30, which is connected to the liquid infusion tube 201. The liquid discharge component 30 is used to quickly discharge the residual liquid remaining in the liquid infusion tube 201. This is to prevent the residual liquid from chemically reacting with the next chemical cleaning liquid used, and also to avoid the residual liquid from flowing out in the next processing process, which may affect the process of the wafer W.

[0056] Among them, at least one drainage component 30 , namely, the wafer back side cleaning device 100 may include one drainage component 30 , or may include two or more drainage components 30 .

[0057] like Figure 3 As shown, the interior of the liquid discharge component 30 has a negative pressure air pipe 302 passing through it and a connecting pipeline 303 connected with the negative pressure air pipe 302 and the infusion tube 201. When the negative pressure air pipe 302 is ventilated through the air inlet, negative pressure can be formed at the connection point between the negative pressure air pipe 302 and the connecting pipeline 303, so that the residual liquid in the infusion tube 201 is drawn out by the negative pressure and discharged from the discharge port of the negative pressure air pipe 302.

[0058] Specifically, after the liquid discharge assembly 30 is connected to the liquid infusion tube 201, the liquid infusion tube 201 is connected to the connecting pipeline 303. Therefore, there is residual liquid in the liquid infusion tube 201. By passing gas into the negative pressure air pipe 302, negative pressure can be formed at the connection between the negative pressure air pipe 302 and the connecting pipeline 303, so that the residual liquid in the liquid infusion tube 201 can be extracted to achieve the cleaning of the residual liquid in the liquid infusion tube 201.

[0059] According to the wafer back cleaning device 100 of the first aspect of the present application, the drain assembly 30 is connected to the infusion tube 201. After the gas is passed into the negative pressure air pipe 302 inside the infusion tube 201, a negative pressure can be formed at the connection between the negative pressure air pipe 302 and the connecting pipeline 303, so that the residual liquid in the infusion tube 201 can be extracted by the negative pressure, and the residual liquid in the infusion tube 201 can be cleaned. Avoid the residual liquid remaining in the infusion tube 201, which will affect the subsequent processing of the wafer W, and the subsequent cleaning liquid can also avoid the chemical reaction between the cleaning liquid and the residual liquid. At the same time, by quickly discharging the residual liquid, the influence of the residual liquid in the infusion tube 201 on the cleaning process of the wafer W can be avoided, and because the residual liquid inside the infusion tube 201 can be quickly discharged, it can be avoided that the cleaning liquid used later will bring out the residual liquid of the previously used cleaning liquid to the back of the wafer when it is sprayed on the back of the wafer W. Effectively avoid the back of the wafer W from being contaminated.

[0060] like Figure 3 As shown, the drain assembly 30 also includes an air supply pipeline 304 and a discharge pipeline 305. The negative pressure air pipe 302 includes a first pipe section 3021, a second pipe section 3022 and a negative pressure pipe section 3023. The first pipe section 3021 has an air inlet, wherein the air inlet is as shown in FIG. Figure 3 The C port in the figure is the air inlet. The air inlet is connected to the air supply pipeline 304. Thus, the gas can be delivered through an external gas source or air supply device, and the gas can pass through the air supply pipeline 304 and then be delivered to the negative pressure pipe section 3023 through the air inlet. The second pipe section 3022 has an exhaust port, wherein the exhaust port is as shown in FIG. Figure 3 The E port in the figure is the discharge port. The discharge port is connected to the discharge pipeline 305. Thus, the residual liquid in the infusion tube 201 can be drawn out through the negative pressure pipe section 3023, discharged from the discharge port, and further discharged through the discharge pipeline 305.

[0061] like Figure 3 As shown, the two ends of the negative pressure pipe segment 3023 are respectively connected to the first pipe segment 3021 and the second pipe segment 3022, and the radial dimension of the negative pressure pipe segment 3023 is smaller than the radial dimension of the first pipe segment 3021 and the radial dimension of the second pipe segment 3022, so that negative pressure can be formed at the negative pressure pipe segment 3023 when the negative pressure air pipe 302 is ventilated.

[0062] Specifically, since the radial dimension of the negative pressure pipe section 3023 is smaller than the radial dimension of the first pipe section 3021 and the radial dimension of the second pipe section 3022, the gas can enter the negative pressure pipe section 3023 through the first pipe section 3021 and then pass through the second pipe section 3022. When the gas enters the negative pressure pipe section 3023 through the first pipe section 3021, the radial dimension becomes smaller, that is, the cross section of the negative pressure pipe section 3023 becomes smaller, that is, the flow cross section becomes smaller. The cross sections of the first pipe section 3021 and the second pipe section 3022 are larger, that is, the flow cross section is large. Therefore, when the gas enters the negative pressure pipe section 3023 through the first pipe section 3021, the flow rate increases, so a negative pressure is formed in the negative pressure pipe section 3023, thereby forming a Venturi effect in the negative pressure pipe section 3023. Therefore, the residual liquid inside the infusion tube 201 can be extracted from the connecting pipeline 303 through the negative pressure.

[0063] The gas delivered to the discharge assembly 30 is compressed air injected at high speed, so that a high-speed jet can be formed in the negative pressure air pipe 302. Due to the viscosity of the gas, the high-speed jet will absorb the gas in the negative pressure air pipe 302, thereby forming a vacuum in the negative pressure air pipe 302. The residual liquid can then be extracted and discharged.

[0064] It should be noted that the Venturi effect is also called the Venturi effect. This effect is manifested in that when a restricted flow passes through a reduced flow section, the flow velocity of the fluid increases, and the flow velocity is inversely proportional to the flow section. According to Bernoulli's principle, the increase in flow velocity is accompanied by a decrease in fluid pressure, which is the common Venturi phenomenon. In layman's terms, this effect refers to the low pressure generated near a high-speed flowing fluid, which produces a suction effect. This effect can be used to make a Venturi tube.

[0065] In other words, the negative pressure pipe section 3023 can be used as a venturi tube because the gas passing through it can form a venturi effect. Therefore, when the gas passes through the first pipe section 3021 and enters the second pipe section 3022, the radial dimension of the pipeline is reduced, so that negative pressure is formed in the negative pressure pipe section 3023, so that the residual liquid in the infusion tube 201 can be extracted from the connecting pipeline 303 by the negative pressure and discharged through the discharge port of the second pipe section 3022.

[0066] like Figure 3 As shown, the drainage component 30 also includes a drainage body 301, a connecting pipeline 303 is arranged in the drainage body 301, and the connecting pipeline 303 is connected to the negative pressure pipe section 3023 to discharge the residual liquid through the infusion tube 201, the connecting pipeline 303 and the discharge port of the second pipe section 3022 by negative pressure.

[0067] Specifically, due to the negative pressure formed in the negative pressure pipe section 3023, the residual liquid in the infusion tube 201 can be extracted from the connecting pipe 303 and discharged through the discharge port of the second pipe section 3022. The discharge body 301 can serve as an external overall protection structure, which can protect the negative pressure air pipe 302 and the connecting pipe 303 disposed inside to prevent the negative pressure air pipe 302 and the connecting pipe 303 from being damaged. At the same time, it also prevents external impurities from entering the negative pressure air pipe 302 and the connecting pipe 303.

[0068] Furthermore, if Figure 3 As shown, the connecting pipeline 303 includes a liquid inlet pipe section 3031, a transition pipe section 3032 and a flow guide pipe section 3033 which are connected in sequence. One end of the liquid inlet pipe section 3031 is connected to the liquid delivery pipe 201, so that the residual liquid can enter the connecting pipe section 303 from the liquid inlet pipe section 3031. The other end of the liquid inlet pipe section 3031 is connected to the transition pipe section 3032.

[0069] Among them, Figure 3 As shown, the transition pipe section 3032 has a cavity inside, and one end of the guide pipe section 3033 is connected to the transition pipe section 3032 , thereby allowing the residual liquid to pass through the cavity and then enter the guide pipe section 3033 .

[0070] In some embodiments of the present invention, Figure 3 As shown, the cross section of the transition pipe section 3032 is a right-angle trapezoid. Figure 3 The transition pipe section 3032 shown is an exemplary simplified diagram, and the shape of its cross section is not limited, as long as there is a cavity inside it. In this embodiment, the cross section of the transition pipe section 3032 is a right-angled trapezoid, and one waist of the trapezoid is a right angle with the angles between the two bottom sides. The other waist has an angle with the two bottom sides. In addition, the extension direction of its right-angled waist is perpendicular to the extension direction of the first pipe section 3021, and the extension direction of its inclined waist has an angle with the extension direction of the first pipe section 3021. Therefore, after the residual liquid enters the interior of the transition pipe section 3032, the residual liquid can be guided by the inclined waist, and the residual liquid is guided into the guide pipe section 3033, and the residual liquid can be further flowed into the negative pressure pipe section 3023.

[0071] Therefore, when the residual liquid enters the transition pipe section 3032, the inclined waist of the right-angled trapezoid can guide the flow direction of the residual liquid and guide it to the lower guide pipe section 3033. One end of the guide pipe section 3033 is connected to the transition pipe section 3032, and the other end of the guide pipe section 3033 is connected to the negative pressure pipe section 3023. The extension direction of the guide pipe section 3033 forms an acute angle with the first pipe section 3021, so as to guide the residual liquid to the second pipe section 3022.

[0072] That is Figure 4As shown in FIG. 3 , the flow guide pipe section 3033 serves as an intermediate pipe connecting the transition pipe section 3032 and the negative pressure pipe section 3023. The extension direction of the first pipe section 3021 is a straight line. Figure 3 The extension direction of the flow guide section 3033 is as shown in the dashed line L1. Figure 3 The extension direction of the flow guide pipe section 3033 and the extension direction of the first pipe section 3021 form an acute angle, that is, Figure 3 As shown in the angle Z between the line L1 and the line L2 shown in FIG. 3033, the residual liquid can flow downward into the negative pressure pipe section 3023 through the guide pipe section 3033. When the gas is blown into the negative pressure pipe section 3023 through the first pipe section 3021, the gas can be prevented from entering the guide pipe section 3033, and the residual liquid to be discharged can be blown by the guide pipe section 3033 by the power of the gas and flow back to the upper transition pipe section 3032 along the guide pipe section 3033, thereby affecting the downward flow of the residual liquid and the discharge of the residual liquid.

[0073] The connecting pipeline 303 includes an opening of the liquid inlet pipe section 3031 such as Figure 3 As shown in the S port in the figure, it can be connected with the external infusion tube 201, that is, the residual liquid in the infusion tube 201 can be extracted from the S port. And the residual liquid enters the inside of the communication pipeline 303 from the S port and is then discharged.

[0074] In some embodiments of the present invention, the drain body 301 , the negative pressure air pipe 302 and the connecting pipe 303 of the drain assembly 30 are all made of resin material. The cleaning liquid used for cleaning the wafer W may be corrosive, so using resin material can increase the service life of the drain assembly 30 .

[0075] Specifically, the discharge body 301, the negative pressure air pipe 302 and the connecting pipe 303 of the discharge assembly 30 can be made of PTFE material. The full name of PTFE material is polytetrafluoroethylene. PTFE material has chemical stability and basically does not react with all chemical substances, including acids, alkalis, solvents and oxidants. Therefore, it can effectively prevent corrosion from corrosive residual liquid, thereby ensuring its stability in use and improving its service life.

[0076] In some embodiments of the present invention, the air supply pipeline 304 and the exhaust pipeline 305 may also be made of PTFE material, which can improve the corrosion resistance of the air supply pipeline 304 and the exhaust pipeline 305, and the PTFE material also has temperature resistance, electrical insulation and aging resistance, etc., thereby increasing the service life and reducing loss.

[0077] In some embodiments of the present invention, Figure 2 and Figure 4As shown, the wafer backside cleaning device 100 also includes a combination valve 40, which includes a converging pipe 401 and multiple liquid medicine pipes 402. One end of the multiple liquid medicine pipes 402 is respectively connected to multiple different cleaning liquids, so that different liquid medicine pipes 402 can respectively transport different cleaning liquids. The other ends of the multiple liquid medicine pipes 402 are all connected to the infusion pipe 201 through the converging pipe 401 to transport different cleaning liquids in the infusion pipe 201. The converging pipe 401 can connect multiple pipelines at the same time, which is convenient for controlling the transportation of cleaning liquids.

[0078] The infusion tube 201 and the connecting pipeline 303 are both connected to the confluence tube 401, and the connecting pipeline 303 of the drainage component 30 is connected to the infusion tube 201 through the confluence tube 401. Specifically, the drainage component 30 can quickly discharge the residual liquid of various cleaning liquids. This can prevent the residual liquid from remaining in the infusion tube 201, causing the subsequent processing of the wafer W to be affected by the residual liquid flowing out, and can also prevent the subsequent cleaning liquid from chemically reacting with the residual liquid.

[0079] In some embodiments of the present invention, Figure 2 and Figure 4 As shown, the liquid discharge component 30 also includes a gas flow meter 306, which is arranged between the gas supply pipeline 304 and the air inlet. A gas flow meter 306 is arranged between the gas supply pipeline 304 and the air inlet of the wafer back side cleaning device 100. The gas flow meter 306 can control the flow rate of the gas passing through the negative pressure air pipe 302. By controlling the flow rate of the gas, the negative pressure intensity in the negative pressure air pipe 302 can be controlled. That is, the larger the gas flow rate, the larger the negative pressure intensity formed in the negative pressure air pipe 302. The smaller the gas flow rate, the smaller the negative pressure intensity formed in the negative pressure air pipe 302. In this way, the discharge speed of the residual liquid is controlled.

[0080] It is understandable that when the negative pressure is large, the extraction force on the residual liquid is large, so the residual liquid discharge speed is also fast. Correspondingly, when the negative pressure is small, the extraction force on the residual liquid is small, so the residual liquid discharge speed is also slow. Therefore, the gas flow meter 306 is used to control the residual liquid discharge speed.

[0081] In some embodiments of the present invention, Figure 2 and Figure 4 As shown, the multiple drug liquid tubes 402 , the infusion tube 201 and the connecting pipeline 303 are respectively connected to the converging tube 401 through multiple control valves 70 , and the multiple drug liquid tubes 402 are respectively connected to the converging tube 401 through multiple liquid flow meters 80 .

[0082] Specifically, multiple liquid medicine tubes 402 are connected to the flow tube 401 one by one through multiple control valves 70, so that multiple cleaning liquids can be delivered to the infusion tube 201 through the flow tube 401. And multiple liquid medicine tubes 402 are connected to the flow tube 401 through the control valve 70, which can ensure the control of the delivery and stop of the cleaning liquid. For example, the control valve 70 on the liquid medicine tube 402 of the first cleaning liquid can be opened first, so that the first cleaning liquid can be delivered first. Then, when the second cleaning liquid needs to be delivered, the control valve 70 of the first cleaning liquid can be closed first, and then the control valve 70 of the second cleaning liquid can be opened to start delivering the second cleaning liquid. In this way, the delivery of different cleaning liquids can be controlled.

[0083] The infusion tube 201 is also connected to the confluence tube 401 through the control valve 70. When there is no need to deliver the cleaning liquid to the infusion tube 201, the infusion tube 201 can be closed by the control valve 70 to prevent the cleaning liquid from entering the infusion tube 201. The connecting line 303 is also connected to the confluence tube 401 through the control valve 70. When the cleaning liquid is normally delivered to the infusion tube 201, closing the control valve 70 between the connecting line 303 and the confluence tube 401 can prevent the cleaning liquid from entering the connecting line 303. When it is necessary to discharge the residual liquid in the infusion tube 201, the control valve 70 between the connecting line 303 and the confluence tube 401 can be opened to discharge the residual liquid in the infusion tube 201 through negative pressure, which is convenient, fast and easy to operate.

[0084] like Figure 2 and Figure 4 As shown, multiple liquid medicine pipes 402 are respectively connected to the converging pipe 401 through multiple liquid flow meters 80. The liquid flow meters 80 can control the delivery amount of the cleaning liquid respectively, which is convenient for accurate control and convenient for observing the amount of the cleaning liquid.

[0085] In some embodiments of the present invention, Figure 4 As shown, the output shaft 20 further includes a drain pipe 202 , and the wafer back side cleaning device 100 includes two drain components 30 , one of which is connected to the combination valve 40 , and the other of which is connected to the drain pipe 202 .

[0086] Specifically, the drain pipe 202 in the output shaft 20 can be used to discharge the chemical waste liquid formed after the cleaning liquid sprayed by the infusion pipe 201 is sprayed onto the back of the wafer W to clean the wafer W, so that the chemical waste liquid can pass through the drain pipe 202 and be quickly discharged from the discharge port below the output shaft 20. By quickly discharging the residual liquid, the influence of the residual liquid in the infusion pipe 201 on the cleaning process of the wafer W can be avoided, and because the residual liquid inside the infusion pipe 201 can be quickly discharged, it can be avoided that the cleaning liquid used subsequently is sprayed onto the back of the wafer W, and the residual liquid of the previously used cleaning liquid is brought out to the back of the wafer. The back of the wafer W is effectively prevented from being contaminated.

[0087] A drain assembly 30 is connected below the drain pipe 202 , and the chemical waste liquid in the drain pipe 202 can be quickly drained through the drain assembly 30 to prevent the chemical waste liquid from accumulating inside the drain pipe 202 .

[0088] In some embodiments of the present invention, Figure 4 As shown, the wafer backside cleaning device 100 also includes a drainage collection tank 90, which is arranged between another drainage component 30 and the drainage pipe 202. Specifically, the chemical waste liquid discharged from the drainage pipe 202 can first enter the drainage collection tank 90, and then be extracted and discharged through the drainage component 30. By providing the drainage collection tank 90, the discharged chemical waste liquid can be stored to avoid the accumulation of chemical waste liquid in the drainage pipe 202 inside the output shaft 20. Avoid liquid accumulation at the outlet of the drainage pipe 202. Then, the chemical waste liquid is quickly discharged through the drainage component 30 to avoid leakage of chemical waste liquid. The drainage component 30 is suitable for a variety of use environments and can quickly discharge liquid. The overall structure is simple, the cost is low, and it is easy to use.

[0089] In some embodiments of the present invention, Figure 1 , Figure 2 , Figure 4 and Figure 5 As shown, the wafer backside cleaning device 100 further includes a gas purge pipe 203, which can deliver gas for rapid drying of the wafer W. The gas purge pipe 203 can be a nitrogen purge pipe.

[0090] According to a second aspect of the present application, a wafer cleaning device 1000 is proposed. The wafer cleaning device 1000 includes a wafer back side cleaning device 100. The wafer back side cleaning device 100 is the wafer back side cleaning device 100 of the first aspect.

[0091] According to the wafer cleaning device 1000 of the second aspect of the present application, Figure 5As shown, since the wafer backside cleaning device 100 of the first aspect is provided, it has the same beneficial effects as the wafer backside cleaning device 100 of the first aspect, that is, the drain assembly 30 is connected with the infusion tube 201, and after the gas is introduced into the negative pressure air pipe 302 inside the infusion tube 201, a negative pressure can be formed at the connection between the negative pressure air pipe 302 and the connecting pipeline 303, so that the residual liquid in the infusion tube 201 is extracted by the negative pressure, and the residual liquid in the infusion tube 201 is cleaned. It is avoided that the residual liquid remains in the infusion tube 201, causing the subsequent processing of the wafer W to be affected by the outflow of the residual liquid, and it is also possible to avoid a chemical reaction between the cleaning liquid used subsequently and the residual liquid. At the same time, by quickly draining the residual liquid, the residual liquid in the liquid infusion tube 201 can be prevented from affecting the cleaning process of the wafer W. Moreover, since the residual liquid in the liquid infusion tube 201 can be quickly drained, the cleaning liquid used subsequently can be prevented from bringing the residual liquid of the previously used cleaning liquid to the back of the wafer W when sprayed on the back of the wafer W. The back of the wafer W is effectively prevented from being contaminated.

[0092] like Figure 5 As shown, the wafer cleaning equipment 1000 according to the second aspect of the present invention further includes a cleaning device body 200 , a fan filter group 300 and a cleaning component 400 .

[0093] The present invention is not limited thereto. In some embodiments of the present invention, Figure 5 As shown, the wafer W horizontal cleaning device 100 further includes a cleaning device body 200 , a fan filter group 300 and a cleaning component 400 .

[0094] Specifically, the cleaning device body 200 has an installation cavity. The cleaning device body 200 can provide a stable installation foundation for the external internal structure, so as to protect the internal structure. The fan filter group 300 is arranged outside the cleaning device body 200 to allow gas exchange between the installation cavity and the outside.

[0095] The fan filter unit 300 is abbreviated as FFU (Fan Filter Unit), which can be used to maintain a clean microenvironment in the installation cavity to avoid the introduction of external pollutants. At the same time, an air outlet can be opened in the cleaning device body 200 so that the gas blown out by the fan filter unit 300 is led out from the air outlet. The cleaning component 400 is arranged in the installation cavity, and the cleaning component 400 has a nozzle to spray cleaning liquid on the front side of the wafer W. Among them, the cleaning component 400 for front cleaning has a rotating and lifting function.

[0096] The following is attached to the instruction manual Figure 6 The wafer cleaning method according to the third aspect of the present application is described, and the wafer cleaning method is applied to a wafer cleaning device 1000 .

[0097] like Figure 6 As shown, the wafer cleaning method includes:

[0098] Step S1: Clamp the wafer W by the clamping member 102 of the main body 10 and make the wafer W parallel to the horizontal plane;

[0099] In this step, the clamping member 102 of the main body 10 can clamp the wafer W so that the wafer W is parallel to the horizontal plane, thereby achieving horizontal cleaning of the wafer W. The lower surface of the wafer W is the back side of the wafer W. Making the wafer W horizontal can facilitate spraying the cleaning liquid on the lower surface of the wafer W.

[0100] Step S2: transporting the cleaning liquid through the liquid delivery tube 201 inside the output shaft 20 and spraying the cleaning liquid on the lower surface of the wafer W to clean the lower surface of the wafer W;

[0101] In this step, the infusion tube 201 is arranged inside the output shaft 20 to protect the infusion tube 201. The infusion tube 201 sprays the cleaning liquid on the lower surface of the wafer W, that is, the back side of the wafer W, so as to clean the back side of the wafer W.

[0102] Step S3: after the delivery of the cleaning liquid is stopped, the residual cleaning liquid in the infusion tube 201 is extracted and discharged through at least one drainage assembly 30 connected to the infusion tube 201;

[0103] Specifically, when the cleaning of the wafer W is completed, or the cleaning liquid currently used has been cleaned and another cleaning liquid needs to be replaced, the residual liquid of the current cleaning liquid remaining in the infusion tube 201 can be quickly discharged through the drainage component 30 to avoid chemical reactions between the cleaning liquid used subsequently and the cleaning liquid currently used. Alternatively, after the residual liquid of the cleaning liquid currently used is discharged, it is prevented from overflowing in the subsequent operation of the wafer W, affecting the processing of the wafer W.

[0104] Among them, the interior of the drainage component 30 has a negative pressure air pipe 302 running through it and a connecting pipeline 303 connected to both the negative pressure air pipe 302 and the infusion tube 201. When the negative pressure air pipe 302 is ventilated through the air inlet, a negative pressure can be formed at the connection point between the negative pressure air pipe 302 and the connecting pipeline 303, so that the residual liquid in the infusion tube 201 can be extracted by the negative pressure and discharged from the discharge port of the negative pressure air pipe 302.

[0105] According to the wafer cleaning method of the third aspect of the present invention, Figure 6As shown, the drain assembly 30 is connected to the infusion tube 201, and after the gas is passed into the negative pressure air pipe 302 inside the infusion tube 201, a negative pressure can be formed at the connection between the negative pressure air pipe 302 and the connecting pipeline 303, so that the residual liquid in the infusion tube 201 can be extracted by the negative pressure, and the residual liquid in the infusion tube 201 can be cleaned. Avoid the residual liquid remaining in the infusion tube 201, which will affect the subsequent processing of the wafer W, and the residual liquid will flow out, causing the processing of the wafer W to be affected. It can also avoid the chemical reaction between the cleaning liquid used subsequently and the residual liquid. At the same time, by quickly discharging the residual liquid, the influence of the residual liquid in the infusion tube 201 on the cleaning process of the wafer W can be avoided, and because the residual liquid inside the infusion tube 201 can be quickly discharged, it can be avoided that the cleaning liquid used subsequently will bring out the residual liquid of the cleaning liquid used previously to the back of the wafer when it is sprayed on the back of the wafer W. Effectively prevent the back of the wafer W from being contaminated.

[0106] like Figure 7 As shown in FIG. 1 , the wafer backside cleaning device 100 is compared with the wafer W cleaning effect before and after the cleaning when the drain assembly 30 is provided and when the drain assembly 30 is not provided. Figure 7 As shown, when the drain assembly 30 is not provided, the surface of the wafer W has contaminants before cleaning, and after cleaning, traces of contamination can still be found on its surface. Relatively speaking, after the drain assembly 30 is provided, the surface of the wafer W has contaminants before cleaning. However, after cleaning, the surface of the wafer W is relatively clean. Therefore, by comparison, it can be understood that after the drain assembly 30 is provided, the residual liquid in the infusion tube 201 can be quickly discharged, and the residual liquid in the infusion tube 201 is prevented from being re-sprayed onto the back of the wafer W when the cleaning liquid is replaced, causing the back of the wafer W to be re-contaminated with contaminants, thereby reducing the cleaning effect.

[0107] The present application provides an electronic device, comprising: a processor, a communication interface, a memory and a communication bus, wherein the processor, the communication interface and the memory communicate with each other through the communication bus; the memory is used to store a computer program; and the processor is used to execute the wafer cleaning method described in the first aspect above by running the computer program stored in the memory.

[0108] The present application does not limit the specific implementation of the electronic device. As an example, the electronic device provided by the present application includes: a processor, a communications interface, a memory, and a communication bus. Among them:

[0109] The processor, the communication interface, and the memory communicate with each other via a communication bus.

[0110] Communication interface, used to communicate with other electronic devices or servers.

[0111] The processor is used to execute a computer program, and specifically can execute the relevant steps in any of the aforementioned wafer cleaning method embodiments.

[0112] Specifically, a computer program may include program code, which includes computer operation instructions.

[0113] The processor may be a central processing unit (CPU), a graphics processing unit (GPU), or an application specific integrated circuit (ASIC), or one or more integrated circuits configured to implement the present application. The one or more processors included in the smart device may be processors of the same type, such as one or more CPUs; or processors of different types, such as one or more CPUs and one or more ASICs.

[0114] The memory is used to store computer programs. The memory may include high-speed RAM memory, and may also include non-volatile memory, such as at least one disk memory.

[0115] The computer program can specifically be used to enable a processor to execute the wafer cleaning method in any of the aforementioned embodiments.

[0116] The specific implementation of each step in the computer program can refer to the corresponding description of the corresponding steps and units in any of the aforementioned wafer cleaning method embodiments, which will not be repeated here. Those skilled in the art can clearly understand that for the convenience and simplicity of description, the specific working process of the above-described equipment and modules can refer to the corresponding process description in the aforementioned method embodiment, which will not be repeated here.

[0117] The electronic device in the present application has been described in detail in the aforementioned wafer cleaning method embodiment, so its related content and beneficial effects can be understood by referring to the above method embodiment and will not be repeated here.

[0118] According to a fourth aspect of the present application, a computer storage medium is provided, on which a computer program is stored, and when the computer program is executed by a processor, the wafer cleaning method as described above is implemented.

[0119] According to a fifth aspect of the present application, a computer program product is provided, comprising a computer program, which implements the wafer cleaning method as described above when executed by a processor.

[0120] The above implementation methods are only used to illustrate the embodiments of the present application, and are not limitations on the embodiments of the present application. Ordinary technicians in the relevant technical field can make various changes and modifications without departing from the spirit and scope of the embodiments of the present application. Therefore, all equivalent technical solutions also belong to the scope of the embodiments of the present application. The scope of patent protection of the embodiments of the present application should be limited by the claims.

Claims

1. A wafer backside cleaning device, characterized in that: include: A main body, the upper part of which has a clamping member capable of clamping a wafer and making the wafer parallel to a horizontal plane, and the main body has a mounting hole passing through its axis; an output shaft, which is arranged in the mounting hole, and the interior of the output shaft is provided with a liquid infusion tube, so as to deliver a cleaning liquid for spraying the lower surface of the wafer through the liquid infusion tube; At least one drainage component, which is connected to the infusion tube, and the interior of the drainage component has a negative pressure air pipe passing through it and a connecting pipeline connected to both the negative pressure air pipe and the infusion tube; When the negative pressure air pipe is ventilated through the air inlet, negative pressure can be formed at the connection point between the negative pressure air pipe and the connecting pipeline, so that the residual liquid in the infusion tube can be extracted by the negative pressure and discharged from the discharge port of the negative pressure air pipe.

2. The wafer backside cleaning device according to claim 1, characterized in that: The liquid discharge assembly also includes an air supply pipeline and a discharge pipeline, and the negative pressure air pipe includes: a first pipe section, wherein the first pipe section has the air inlet, and the air inlet is connected to the air supply pipeline; a second pipe section, the second pipe section having the discharge port, the discharge port being in communication with the discharge pipeline; A negative pressure pipe section, wherein both ends of the negative pressure pipe section are respectively connected to the first pipe section and the second pipe section, and the radial dimension of the negative pressure pipe section is smaller than the radial dimension of the first pipe section and the radial dimension of the second pipe section, so that negative pressure can be formed at the negative pressure pipe section when the negative pressure airway is ventilated.

3. The wafer backside cleaning device according to claim 2, characterized in that: The drainage component also includes a drainage body, the connecting pipeline is arranged in the drainage body, and the connecting pipeline is connected to the negative pressure pipe section to discharge the residual liquid through the infusion tube, the connecting pipeline and the discharge port of the second pipe section through negative pressure.

4. The wafer backside cleaning device according to claim 3, characterized in that: The connecting pipeline includes a liquid inlet pipe section, a transition pipe section and a guide pipe section which are connected in sequence. The transition pipe section has a cavity inside. One end of the guide pipe section is connected to the transition pipe section, and the other end of the guide pipe section is connected to the negative pressure pipe section. The extension direction of the guide pipe section has an acute angle with the first pipe section to guide the residual liquid to the second pipe section.

5. The wafer backside cleaning device according to claim 4, characterized in that: The discharge body of the discharge assembly, the negative pressure air pipe and the connecting pipeline are all made of resin materials.

6. The wafer backside cleaning device according to claim 4, characterized in that: The wafer back side cleaning device also includes a combination valve, which includes a converging flow tube and multiple liquid medicine tubes, one ends of the multiple liquid medicine tubes are respectively connected to multiple different liquid medicines, and the other ends of the multiple liquid medicine tubes are connected to the infusion tube through the converging flow tube to transport different liquid medicines in the infusion tube, the infusion tube and the connecting pipeline are both connected to the converging flow tube, and the connecting pipeline of the drainage component is connected to the infusion tube through the converging flow tube.

7. The wafer backside cleaning device according to claim 6, characterized in that: The drainage assembly also includes: A gas flow meter is arranged between the gas supply pipeline and the gas inlet.

8. The wafer backside cleaning device according to claim 7, characterized in that: The plurality of drug liquid tubes, the infusion tubes and the connecting pipelines are respectively connected to the converging pipe through a plurality of control valves, and the plurality of drug liquid tubes are respectively connected to the converging pipe through a plurality of liquid flow meters.

9. The wafer backside cleaning device according to any one of claims 1 to 8, characterized in that: The output shaft also includes a drain pipe, and the wafer back side cleaning device includes two drain components, one of which is connected to the combination valve, and the other of which is connected to the drain pipe.

10. The wafer backside cleaning device according to claim 9, characterized in that: The wafer back side cleaning device further comprises a drainage collection tank, and the drainage collection tank is arranged between another of the drainage components and the drainage pipe.

11. A wafer cleaning device, characterized in that: The wafer cleaning equipment comprises: a wafer back side cleaning device, and the wafer back side cleaning device is the wafer back side cleaning device according to any one of claims 1-10.

12. A wafer cleaning method, characterized in that: Applied to wafer cleaning equipment, the method comprises: Clamp the wafer by the clamping member of the main body so that the wafer is parallel to the horizontal plane; The cleaning liquid is delivered through the liquid infusion tube inside the output shaft and sprayed onto the lower surface of the wafer to clean the lower surface of the wafer; When the delivery of the cleaning liquid is stopped, the residual cleaning liquid in the infusion tube is extracted and discharged through at least one drainage component connected to the infusion tube; Among them, the interior of the drainage component has a negative pressure air pipe running through it and a connecting pipeline connected to both the negative pressure air pipe and the infusion tube. When the negative pressure air pipe is ventilated through the air inlet, negative pressure can be formed at the connection point between the negative pressure air pipe and the connecting pipeline, so that the residual liquid in the infusion tube can be extracted by negative pressure and discharged from the discharge port of the negative pressure air pipe.

13. A computer storage medium having a computer program stored thereon, wherein the computer program implements the method according to claim 12 when executed by a processor.

14. A computer program product, comprising a computer program, which, when executed by a processor, implements the method according to claim 12.

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