Tool mold for one-step blind assembly brazing of surface-mounted packaging shell and use method of tool mold for one-step blind assembly brazing of surface-mounted packaging shell

Abstract

The invention discloses a tool mold for one-step blind assembly brazing of a surface-mounted packaging shell and a using method.The mold comprises a base body, a plurality of mold units are arranged on the base body, each mold unit comprises a porcelain piece limiting groove, and a porcelain piece limiting boss is arranged in each porcelain piece limiting groove; the inner edges of the mold units and the outer edges of the porcelain piece limiting bosses form porcelain piece limiting grooves; a welding ring limiting boss is arranged on the outer edge of the porcelain part limiting boss, a welding ring limiting groove is formed between the welding ring limiting boss and the porcelain part limiting groove, and the top of the welding ring limiting groove is lower than that of the porcelain part limiting groove; leading wire limiting bosses are arranged on the two sides of the leading wire receding groove and the two sides, not provided with the leading wire receding groove, of the porcelain piece limiting groove, and leading wire receding grooves are formed in the inner edges of the leading wire limiting bosses located on the two sides of the leading wire receding groove. On the basis that the brazing appearance and reliability are met, the efficiency can be remarkably improved, the labor cost and the material cost are reduced, and the beneficial effects that the brazing size precision is high, the brazing appearance consistency is high, the requirement for the manual operation proficiency degree is low, and batch production is easy are achieved.

Description

Technical Field

[0001] The invention relates to a tooling die and a use method, and in particular to a tooling die for one-step blind soldering of a surface-mounted packaging shell and a use method. Background Art

[0002] The common surface mount package shell includes a base and a cover. The base is composed of a lead frame, a ceramic part and a welding ring, which can provide mechanical support, heat dissipation and internal and external circuit connections for the chip. The welding ring and the cover are welded or sealed to achieve airtight packaging of the chip to meet the use requirements of different environments. The surface mount package shell has a relatively uniform structure, a large market demand, and a demand for high-efficiency, low-cost, and mass production.

[0003] At present, the mounting and brazing of surface mount package shells mostly adopts two methods: two-step regular mounting and graded blind mounting. 1. The two-step regular mounting requires first mounting and brazing the solder ring to form a brazing semi-finished product, and then mounting and brazing the lead frame to form a brazing finished product. After each mounting, the position of the parts needs to be manually adjusted to make the metal parts centered relative to the porcelain parts, and then put them into the chain-belt brazing furnace for brazing connection. This mounting and brazing method is inefficient, has poor appearance consistency, and requires high manual operation proficiency. 2. Graded blind mounting requires first grading the size of the porcelain parts and solder rings, generally divided into two grades according to negative tolerance and positive tolerance, and respectively prepare mounting molds for the two grades of porcelain parts and solder rings. After the grading is completed, the corresponding graded molds are used to realize the one-step blind mounting of the solder ring, porcelain parts, and lead frame. However, this mounting and brazing method requires size screening of the porcelain parts and solder rings, and the preparation of double mounting molds. The labor and material costs are high, and it is difficult to implement in actual production. Summary of the invention

[0004] Purpose of the invention: The purpose of the present invention is to provide a tooling die for blind soldering of a surface-mount package shell in one step, which has high soldering dimension alignment accuracy and high use efficiency;

[0005] The second object of the present invention is to provide a method for using the above-mentioned tooling die for blind soldering of the surface mount package housing in one step.

[0006] Technical solution: The tooling mold for one-step blind soldering of the surface-mount packaging shell described in the present invention includes a base body, a plurality of mold units are arranged on the base body, the mold unit includes a porcelain limiting groove, a porcelain limiting boss is arranged in the porcelain limiting groove, the inner edge of the mold unit and the outer edge of the porcelain limiting boss constitute the porcelain limiting groove; the outer edge of the porcelain limiting boss is provided with a welding ring limiting boss, a welding ring limiting groove is provided between the welding ring limiting boss and the porcelain limiting groove, the top of the welding ring limiting groove is lower than the top of the porcelain limiting groove, and the difference between the two is the ratio of the welding ring height to the solder thickness. The sum of; the two opposite sides of the porcelain limit groove are respectively provided with lead avoidance grooves for avoiding the bent parts of the lead; the two sides of the lead avoidance groove and the two sides of the porcelain limit groove where no lead avoidance groove is provided are provided with lead limiting bosses for limiting the centering position of the lead frame in the horizontal direction, and the inner edges of the lead limiting bosses located on both sides of the lead avoidance groove form the lead avoidance groove; the solder ring limit groove is used to limit the outer edge of the solder ring, and the solder ring limit boss is used to limit the inner edge of the solder ring; the porcelain limit groove is used to limit the outer edge of the porcelain, and the porcelain limit boss is used to limit the inner edge of the porcelain cavity.

[0007] Wherein, the center of the ceramic limiting boss coincides with the center of the welding ring limiting boss.

[0008] Wherein, the mold units are arranged in a rectangular array on the base.

[0009] The length dimension of the inner frame of the welding ring is recorded as X1±x1, and the width dimension is recorded as Y1±y1. Then, the length dimension of the welding ring limiting boss is X'1=X1-x1, and the width dimension is Y'1=Y1-y1.

[0010] The length dimension of the welding ring outer frame is recorded as X2±x2, and the width dimension is recorded as Y2±y2. Then, the length dimension of the welding ring limiting groove is X'2=X2+x2, and the width dimension is Y'2=Y2+y2.

[0011] The length dimension of the porcelain cavity is recorded as X3±x3, and the width dimension is recorded as Y3±y3. Then, the length dimension of the porcelain limiting boss is X'3=X3-x3, and the width dimension is Y'3=Y3-y3.

[0012] The length dimension of the outer shape of the porcelain piece is recorded as X4±x4, and the width dimension is recorded as Y4±y4. Then, the length dimension of the porcelain piece limiting groove is X'4=X4+x4, and the width dimension is Y'4=Y4+y4.

[0013] The length dimension of the inner frame of the lead frame is recorded as X5±x5, and the width dimension is recorded as Y5±y5. Then, the distance X'5 in the length direction of the lead limiting boss is equal to X5-x5, and the distance Y'5 in the width direction is equal to Y5-y5.

[0014] Wherein, the material of the mold is graphite.

[0015] The method for using the above-mentioned tooling die for blind soldering of the surface mount package shell comprises the following steps:

[0016] (A) Place the welding ring in the mold so that it falls between the welding ring limiting boss and the welding ring limiting groove, and place the welding ring solder on the welding ring;

[0017] (B) placing the ceramic component in the mold so that it falls between the component limiting boss and the ceramic component limiting groove, and placing the lead frame solder on top of the ceramic component;

[0018] (C) Place the lead frame in the mold so that its inner frame falls outside the lead limiting boss and the lead bend falls within the lead avoidance groove;

[0019] (D) Brazing the mold to achieve the brazing connection of the welding ring, porcelain parts and lead frame.

[0020] Beneficial effects: Compared with the prior art, the present invention achieves the following significant effects: (1) Compared with the two-step regular assembly, the one-step blind assembly of the present invention can solve the shortcomings of low efficiency, poor consistency and high requirements for manual operation proficiency; compared with the step-by-step blind assembly, by adding a limit boss, the mold can be used for both positive and negative tolerance porcelain parts and welding rings, solving the shortcomings of high labor and material costs. (2) Using the tooling mold of the present invention to perform frame brazing of surface-mounted package shells can significantly improve efficiency, reduce labor and material costs, and have the characteristics of high brazing dimensional accuracy, high brazing appearance consistency, low requirements for manual operation proficiency, and easy mass production. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a partial enlarged structural schematic diagram of the tooling mold of the present invention;

[0022] Figure 2 yes Figure 1 Schematic diagram of partial disassembly structure in;

[0023] Figure 3 It is a schematic diagram of the top view of the mold unit of the tooling mold of the present invention;

[0024] Figure 4 It is a schematic diagram of the overall structure of the tooling mold of the present invention;

[0025] Figure 5 It is a schematic diagram of the three-dimensional structure of the surface-mount packaging shell of the present invention;

[0026] Figure 6 1. The surface-mount package housing of the present invention is viewed from four directions;

[0027] Figure 7It is a schematic diagram of the welding ring structure of the surface mount package shell of the present invention;

[0028] Figure 8 It is a schematic diagram of the ceramic structure of the surface-mount packaging shell of the present invention;

[0029] Fig. 9 It is a schematic diagram of the lead frame structure of the surface mount package shell of the present invention. DETAILED DESCRIPTION

[0030] The present invention is described in further detail below.

[0031] Example 1

[0032] like Figure 1-4 As shown, a tooling mold for one-step blind soldering of a surface-mount packaging shell includes a base, on which are arranged a plurality of mold units, each mold unit including a solder ring limiting boss 4, a solder ring limiting groove 3, a ceramic component limiting boss 2, a ceramic component limiting groove 1, a lead avoidance groove 5 and a lead limiting boss 6.

[0033] A ceramic limiting groove 1 is provided with a ceramic limiting boss 2, and the inner edge of the mold unit and the outer edge of the ceramic limiting boss 2 constitute the ceramic limiting groove 1; a welding ring limiting boss 4 is provided on the outer edge of the ceramic limiting boss 2, and a welding ring limiting groove 3 is provided between the welding ring limiting boss 4 and the ceramic limiting groove 1, and the top of the welding ring limiting groove 3 is lower than the top of the ceramic limiting groove 1, and the distance between the two is the sum of the welding ring height and the solder thickness; lead avoidance grooves 5 for avoiding the bent part of the lead are respectively provided on the opposite sides of the ceramic limiting groove 1; lead limiting bosses 6 for limiting the centering position of the lead frame 9 in the horizontal direction are provided on both sides of the lead avoiding groove 5 and on both sides of the ceramic limiting groove 1 where the lead avoiding groove 5 is not provided, and the inner edges of the lead limiting bosses 6 located on both sides of the lead avoiding groove 5 form the lead avoiding groove 5.

[0034] The welding ring limiting groove 3 of the present invention is used to limit the outer edge of the welding ring 7, and the welding ring limiting boss 4 is used to limit the inner edge of the welding ring 7; the ceramic part limiting groove 1 is used to limit the outer edge of the ceramic part 8, and the ceramic part limiting boss 2 is used to limit the inner edge of the cavity of the ceramic part 8. The center of the ceramic part limiting boss 2 and the center of the welding ring limiting boss 4 of this embodiment coincide with each other; the mold units are arranged in a rectangular array on the substrate. The material of the mold can be graphite or a similar substance.

[0035] The structural design of each mold unit is as follows:

[0036] (1) The length dimension of the inner frame of the welding ring 7 is recorded as X1±x1, and the width dimension is recorded as Y1±y1, then the length dimension of the welding ring limiting boss 4 is X'1=X1-x1, and the width dimension is Y'1=Y1-y1. The length dimension of the outer frame of the welding ring 7 is recorded as X2±x2, and the width dimension is recorded as Y2±y2, then the length dimension of the welding ring limiting groove 3 is X'2=X2+x2, and the width dimension is Y'2=Y2+y2.

[0037] (2) The length dimension of the cavity of the porcelain 8 is recorded as X3±x3, and the width dimension is recorded as Y3±y3, then the length dimension X'3 of the porcelain limiting boss 2 is X3-x3, and the width dimension Y'3 is Y3-y3. The length dimension of the outer shape of the porcelain 8 is recorded as X4±x4, and the width dimension is recorded as Y4±y4, then the length dimension X'4 of the porcelain limiting groove 1 is X4+x4, and the width dimension Y'4 is Y4+y4.

[0038] (3) The inner frame length of the lead frame 9 is recorded as X5±x5, and the width is recorded as Y5±y5. Then, the length direction distance of the lead limiting boss 6 is X'5=X5-x5, and the width direction distance is Y'5=Y5-y5.

[0039] The mold material of this embodiment is graphite; the specific dimensions of the mold are as follows: the outer dimensions of the base are: length 298.00mm, width 58.00mm, thickness 3.80mm; the size of the welding ring limiting boss 4 is 8.55mm*5.75mm, the size of the welding ring limiting groove 3 is 9.88mm*7.08mm, the size of the porcelain limiting boss 2 is 8.00mm*5.30mm, and the size of the porcelain limiting groove 1 is 10.45mm*7.65mm. Each mold unit is arranged in a rectangular array of 3 rows and 16 columns.

[0040] The structure of the package shell obtained by using the tooling mold of the present invention is as follows Figure 5-6 As shown, Figure 6 yes Figure 5 Several views after being inverted, where (a) is the front view, (b) is the top view, (c) is the left view, and (d) is the bottom view.

[0041] The specific method of using the tooling mold includes the following steps:

[0042] (1) Place the welding ring 7 in the mold so that it falls between the welding ring limiting boss 4 and the welding ring limiting groove 3, and place the welding ring solder above the welding ring 7; wherein the structure of the welding ring 7 is as follows: Figure 7 As shown, Figure 7 yes Figure 5 The view of the welding ring after being turned upside down, (a) is the top view, (b) is the left view;

[0043] (2) Place the single-cavity ceramic piece 8 in the mold so that its cavity matches the single ceramic piece limiting boss 2 and its shape matches the ceramic piece limiting groove 1, and place lead frame solder on top of the ceramic piece 8; wherein the structure of the ceramic piece 8 is as follows: Figure 8 As shown, Figure 8 yes Figure 5 The porcelain piece is inverted upside down, (a) is a top view, (b) is a left view, (c) is a bottom view, (d) is a right sectional view, and (e) is a rear sectional view;

[0044] (3) Place the lead frame 9 in the mold so that the inner frame of the lead frame 9 falls outside the lead limiting boss 6 and the lead bending portion falls within the lead avoiding groove 5; wherein the structure of the lead frame 9 is as follows: Fig. 9 As shown, Fig. 9 yes Figure 5 The lead frame in FIG. is inverted upside down, (a) is a top view, and (b) is a left view;

[0045] (4) There is no need to manually adjust the position of the parts. The mold can be directly placed into the chain-belt brazing furnace to achieve the brazing connection of the welding ring 7, the ceramic part 8 and the lead frame 9.

[0046] Example 2

[0047] On the basis of Example 1, different from Example 1, the specific dimensions of the mold are: the outer dimensions of the base body are 296.00 mm in length, 60.00 mm in width, and 3.00 mm in thickness, the dimensions of the welding ring limiting boss 4 are 18.22 mm*5.65 mm, the dimensions of the welding ring limiting groove 3 are 19.92 mm*7.28 mm, the dimensions of the single ceramic limiting boss 2 are 3.50 mm*5.30 mm, the pitch of the ceramic limiting boss 2 is 14.4 mm, and the dimensions of the ceramic limiting groove 1 are 20.20 mm*7.50 mm. The rectangular array is designed to be 4 rows and 11 columns.

[0048] Here’s how to use it:

[0049] (1) Place the welding ring in the mold so that it falls between the welding ring limiting boss 4 and the welding ring limiting groove 3, and place the welding ring solder above the welding ring;

[0050] (2) placing the multi-cavity ceramic component in the mold so that each cavity matches the corresponding ceramic component limiting boss 2 and the shape matches the ceramic component limiting groove 1, and placing the lead frame solder above the ceramic component;

[0051] (3) Place the lead frame in the mold so that its inner frame falls outside the lead limiting boss 6 and the lead bend falls inside the lead avoidance groove 5;

[0052] (4) There is no need to manually adjust the position of the parts. The mold can be directly placed into the chain-belt brazing furnace to achieve the brazing connection of the welding ring 7, the ceramic part 8 and the lead frame 9.

[0053] The tooling mold structure for one-step blind soldering of the surface-mount packaging shell of the present invention can significantly improve efficiency and reduce labor and material costs on the basis of meeting the requirements of soldering appearance and reliability. It has the characteristics of high soldering dimensional accuracy, high soldering appearance consistency, low requirements for manual operation proficiency, and easy mass production.

Claims

1. A tooling die for blind soldering of a surface mount package shell, characterized in that: The invention comprises a base body, on which a plurality of mold units are arranged, wherein the mold unit comprises a ceramic limiting groove (1), wherein a ceramic limiting boss (2) is arranged in the ceramic limiting groove (1), and the inner edge of the mold unit and the outer edge of the ceramic limiting boss (2) constitute the ceramic limiting groove (1); the outer edge of the ceramic limiting boss (2) is provided with a welding ring limiting boss (4), and a welding ring limiting groove (3) is provided between the welding ring limiting boss (4) and the ceramic limiting groove (1), wherein the top of the welding ring limiting groove (3) is lower than the top of the ceramic limiting groove (1), and the difference between the two is the sum of the height of the welding ring and the thickness of the solder; the ceramic limiting groove is provided with two opposite sides for A lead avoidance groove (5) is provided to avoid the bent portion of the lead; both sides of the lead avoidance groove (5) and both sides of the ceramic component limiting groove where the lead avoidance groove (5) is not provided are provided with lead limiting bosses (6) for limiting the position of the lead frame (9) in the horizontal direction, and the inner edges of the lead limiting bosses (6) located on both sides of the lead avoidance groove (5) form the lead avoidance groove (5); the solder ring limiting groove (3) is used to limit the outer edge of the solder ring (7), and the solder ring limiting boss (4) is used to limit the inner edge of the solder ring (7); the ceramic component limiting groove (1) is used to limit the outer edge of the ceramic component (8), and the ceramic component limiting boss (2) is used to limit the inner edge of the ceramic component (8) cavity.

2. The tooling die for blind soldering of a surface mount package shell according to claim 1, characterized in that: The center of the ceramic limiting boss (2) coincides with the center of the welding ring limiting boss (4).

3. The tooling die for blind soldering of a surface mount package shell according to claim 1, characterized in that: The mold units are arranged in a rectangular array on the base.

4. The tooling die for blind soldering of a surface mount package shell according to claim 1, characterized in that: The length dimension of the inner frame of the welding ring (7) is recorded as X1±x1, and the width dimension is recorded as Y1±y1. Then the length dimension of the welding ring limiting boss (4) is X'1=X1-x1, and the width dimension is Y'1=Y1-y1.

5. The tooling die for blind soldering of a surface mount package shell according to claim 1, characterized in that: The length dimension of the welding ring outer frame is recorded as X2±x2, and the width dimension is recorded as Y2±y2. Then the length dimension of the welding ring limiting groove (3) is X'2=X2+x2, and the width dimension is Y'2=Y2+y2.

6. The tooling die for blind soldering of a surface mount package shell according to claim 1, characterized in that: The length dimension of the cavity of the porcelain piece (8) is recorded as X3±x3, and the width dimension is recorded as Y3±y3. Then the length dimension of the porcelain piece limiting boss (2) is X'3=X3-x3, and the width dimension Y'3=Y3-y3.

7. The tooling die for blind soldering of a surface mount package shell according to claim 1, characterized in that: The length dimension of the outer shape of the porcelain piece (8) is recorded as X4±x4, and the width dimension is recorded as Y4±y4. Then the length dimension of the porcelain piece limiting groove (1) is X'4=X4+x4, and the width dimension is Y'4=Y4+y4.

8. The tooling die for blind soldering of a surface mount package shell according to claim 1, characterized in that: The inner frame length dimension of the lead frame (9) is recorded as X5±x5, and the width dimension is recorded as Y5±y5. Then, the distance X'5 of the lead limiting boss (6) in the length direction is X5-x5, and the distance Y'5 in the width direction is Y5-y5.

9. The tooling die for blind soldering of a surface mount package shell according to claim 1, characterized in that: The material of the mold is graphite.

10. A method for using the tooling die for blind soldering of a surface mount package shell according to claim 1, characterized in that: The following steps are involved: (A) placing the welding ring (7) into the mold so that it falls between the welding ring limiting boss (4) and the welding ring limiting groove (3), and placing welding ring solder above the welding ring (7); (B) placing the ceramic component (8) into the mold so that it falls between the ceramic component limiting boss (2) and the ceramic component limiting groove (1), and placing lead frame solder above the ceramic component (8); (C) placing the lead frame (9) in the mold so that its inner frame falls outside the lead limiting boss (6) and the lead bending portion falls within the lead avoiding groove (5); (D) The mold is brazed to achieve the brazing connection of the welding ring (7), the ceramic part (8) and the lead frame (9).

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