Method for improving rubdown geometry
By using water-based paint and numbered Yuxinghe in the process of smoothing silicon wafers, anti-stopping measures were established, and the problem of inconsistent wafer geometric parameters was solved, and the concentration of wafer thickness and surface roughness parameters was achieved. High, ensuring the efficiency of the smoothing process and the consistency of the geometric parameters of the product.
Patent Information
- Application Number
- CN202310986881.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-07-29
- Publication Date
- 2025-02-14
AI Technical Summary
In the semiconductor industry, the sliced silicon wafer does not meet the requirements because of the bending, flatness and parallelism, which makes it difficult to ensure the consistency of the geometric parameters of the wafer during the polishing process, affecting the polishing effect.
By applying water-based paint to the X3 side of the silicon wafer and combining the numbered Youxing Wheel, mixed batch operation table, audio recorder and recording camera, a set of anti-dust measures are established to ensure that each wafer is fully produced. , avoid mixing and improve the concentration of wafer geometric parameters.
It effectively ensures the concentration of the thickness (THK) and surface roughness (TTV) parameters of each wafer, ensuring the efficiency of the polishing process and the consistency of the geometric parameters of the product.
Smart Images
Figure CN119427102A_ABST
Abstract
Description
Technical Field
[0001] The invention is mainly applied to wafer processing, and specifically relates to a method for improving grinding geometry. Background Art
[0002] In the semiconductor industry, because the silicon wafer after slicing does not meet the curvature, flatness and parallelism required by the semiconductor process, and because the amount removed during the wafer polishing process is very small and cannot improve the slicing, it is very important to add a grinding step after slicing and before polishing. The goal of grinding is to improve the saw marks and surface damage layer caused by slicing, and at the same time achieve a flatness that can be handled by the polishing process. Usually, the TTV of the ground wafer has reached less than a few microns. In the grinding operation, it is very necessary to have a method that can not only ensure good geometric parameters of the product but also efficiently complete the production task. This method is a best of both worlds method that can meet both requirements at the same time. Summary of the invention
[0003] The present invention provides a method for improving grinding geometry. Each wafer size is fixed and the number of wafers produced in a plate during grinding is also fixed. For example, a plate of 6-inch wafers produces 35 pieces. It is ensured that each plate is full and the geometry of the wafers produced can be effectively controlled. According to data, if the plate is not full, the following conditions will occur: the THK and TTV of the wafers are obviously different in the same plate, and only when there are 35 pieces, the THK and TTV are relatively concentrated.
[0004] The method mainly relates to the field of silicon wafer production and manufacturing process, and comprises a group of planetary wheels with numbered processing holes, silicon wafers, water-based paint pens, mixed batch operation tables, a recorder and a video camera.
[0005] In one embodiment of the present invention, the thickness of the silicon wafer is within ±20 um;
[0006] In one embodiment of the present invention, paint is applied to the X3 surface of the silicon wafer and gently rubbed three times;
[0007] In one embodiment of the present invention, the water-based paint pen targeted by the method needs to be obvious after being smoothed and can be easily removed in an alkaline solution;
[0008] In one embodiment of the present invention, the mixed batch operation table in the method can clearly indicate the location of the specific mixed batch wafers, so that they can be easily distinguished after grinding;
[0009] In one embodiment of the present invention, all planetary wheels must have serial numbers, with the characters being 20±2mm high and 10±2mm wide;
[0010] In one embodiment of the present invention, the recorder in the method can accurately and clearly record the voice, prompting the operator to be alert to the matter.
[0011] Based on the above description, the method of the present invention adds fool-proof methods before, during and after production, which will not cause wafer mixing. It not only ensures that each tray of wafers is fully produced, and the geometric parameters such as THK and TTV of the wafers in the tray are highly concentrated, but also ensures maximum utilization of the machine and maximizes the use of various materials. BRIEF DESCRIPTION OF THE DRAWINGS
[0012] Figure 1 Star Wheel DETAILED DESCRIPTION
[0013] The specific implementation of a method for improving grinding geometry provided by the present invention is described in detail below with reference to the accompanying drawings.
[0014] Figure 1 The planetary wheel provides a schematic diagram of the implementation structure of the present invention. In order to ensure that the wafer is fully polished, each tray is fully produced and the following five protections are implemented:
[0015] The first level of protection is that the planetary wheel has serial numbers, which is suitable for wafer positioning during production;
[0016] The second layer of protection is the application of water-based paint during production, which cannot be removed after grinding;
[0017] The third level of protection is to install a recorder next to the machine to play warning messages;
[0018] The fourth level of protection is to record the mixed batch wafers in the mixed batch record sheet before production to prevent forgetting;
[0019] The fifth level of protection is to use video cameras to record into the system after production.
[0020] The method is characterized in that silicon wafers coated with water-based paint pens are placed on a group of planetary wheels with numbered processing holes, a mixed batch operation sheet is filled out before production, a portable recorder is turned on to play warning voices during production, and a video camera is used after production to record the data into a computer backup for easy traceability.
[0021] It should be understood that the specific embodiments described herein are only used to understand the present invention and are not used to limit the present invention. All other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.
Claims
1. A method for improving grinding geometry, characterized in that: Place silicon wafers coated with water-based paint pens on a group of planetary wheels with numbered processing holes. Fill out the mixed batch operation sheet before production. During production, turn on a portable recorder to play warning voice. After production, use a video camera to record the data into a computer backup for easy traceability.
2. A method for improving grinding geometry according to claim 1, characterized in that The planetary wheel has a serial number, and each working hole has its own unique position number.
3. A method for improving grinding geometry according to claim 1, characterized in that Water-based paint pens have the characteristic that they cannot be removed after being ground and must be removed after cleaning.