Simulation method, device and equipment for air holes in 3D printing mold and medium

Abstract

The invention discloses a simulation method, device and equipment for air holes in a 3D printing mold and a medium. The method comprises the steps that a three-dimensional digital model of a target mold is determined, and printing path information of the target mold is generated based on the three-dimensional digital model and printing process parameters; material parameters of the target mold and equipment process parameters of the 3D printing equipment are determined, and a simulation printing result of the target mold is determined based on the printing path information, the material parameters and the equipment process parameters; the simulated printing result is used for describing the temperature distribution condition of the simulated target mold at different positions in the actual printing process of the target mold; based on the printing path information and the simulation printing result, a pore distribution cloud picture of the target mold is generated; the pore distribution cloud picture is used for describing and simulating the distribution state of the air holes in different positions of the target mold in the actual printing process. According to the technical scheme, the problem of high printing cost is solved, and the air permeability of the air holes in the mold is accurately determined.

Description

Technical Field

[0001] The present invention relates to the technical field of additive manufacturing, and in particular to a simulation method, device, equipment and medium for simulating air holes in a 3D printing mold. Background Art

[0002] 3D printing, also known as additive manufacturing, is a technology that manufactures physical parts by adding materials layer by layer based on three-dimensional CAD model data.

[0003] In the mold manufacturing industry, 3D printing is used to print molds to solve the problem of mold air entrapment. 3D printing molds require the selection of suitable breathable steel to ensure the mold, that is, the selection of appropriate materials and printing process parameters to ensure the quality of the mold. However, the selected materials and printing process parameters require multiple rounds of printing verification for optimization, which takes a lot of time, printing and experimental costs. The internal pore distribution of the printed breathable steel mold cannot be viewed, and the air permeability cannot be judged. Summary of the invention

[0004] The present invention provides a simulation method, device, equipment and medium for air vents in a 3D printing mold, so as to solve the problem of high printing cost and realize accurate determination of the air permeability of the air vents inside the mold.

[0005] According to one aspect of the present invention, a method for simulating vent holes in a 3D printing mold is provided, the method comprising:

[0006] Determine a three-dimensional digital model of a target mold, and generate printing path information of the target mold based on the three-dimensional digital model and printing process parameters; the printing process parameters are used to describe scanning parameters of a 3D printing device in a simulated 3D printing process;

[0007] Determine the material parameters of the target mold and the equipment process parameters of the 3D printing device, and determine the simulated printing result of the target mold based on the printing path information, the material parameters and the equipment process parameters; the simulated printing result is a description of the temperature distribution at different positions of the target mold during the actual printing process of the simulated target mold;

[0008] Based on the printing path information and the simulated printing result, a pore distribution cloud map of the target mold is generated; the pore distribution cloud map is used to describe the distribution state of the vent holes at different positions of the target mold in the simulated actual printing process.

[0009] According to another aspect of the present invention, a simulation device for air holes in a 3D printing mold is provided, the device comprising:

[0010] An information determination module, used to determine a three-dimensional digital model of a target mold, and generate printing path information of the target mold based on the three-dimensional digital model and printing process parameters; the printing process parameters are used to describe scanning parameters of a 3D printing device in a simulated 3D printing process;

[0011] A simulation printing result determination module is used to determine the material parameters of the target mold and the equipment process parameters of the 3D printing device, and determine the simulation printing result of the target mold based on the printing path information, the material parameters and the equipment process parameters; the simulation printing result is a description of the temperature distribution at different positions of the target mold during the actual printing process of the simulated target mold;

[0012] The distribution map determination module is used to generate a pore distribution cloud map of the target mold based on the printing path information and the simulated printing result; the pore distribution cloud map is used to describe the distribution state of the vent holes at different positions of the target mold in the simulation of the actual printing process.

[0013] According to another aspect of the present invention, an electronic device is provided, the electronic device comprising:

[0014] at least one processor; and

[0015] a memory communicatively connected to the at least one processor; wherein,

[0016] The memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor can execute the method for simulating air pores in a 3D printing mold described in any embodiment of the present invention.

[0017] According to another aspect of the present invention, a computer-readable storage medium is provided, wherein the computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a processor to implement the method for simulating air vents in a 3D printing mold as described in any embodiment of the present invention when executed.

[0018] The technical solution of the embodiment of the present invention determines the three-dimensional digital model of the target mold, and generates the printing path information of the target mold based on the three-dimensional digital model and the printing process parameters; the printing process parameters are used to describe the scanning parameters of the 3D printing device in the simulated 3D printing process, that is, by simulating the actual printing process printing path, it is convenient to determine the gaps generated by the printing path according to the printing path information. Further, the material parameters of the target mold and the equipment process parameters of the 3D printing device are determined, and the simulated printing result of the target mold is determined based on the printing path information, material parameters and equipment process parameters; the simulated printing result is to describe the temperature distribution at different positions of the target mold during the actual printing process of the simulated target mold, that is, to accurately obtain the temperature distribution of the printed mold due to the differences in materials and temperatures during the printing process during the simulation of the actual printing process, so as to facilitate the determination of defects caused by temperature according to the temperature distribution. Then, based on the printing path information and the simulated printing results, a pore distribution cloud map of the target mold is generated; the pore distribution cloud map is used to describe the distribution state of the pores at different positions of the target mold in the simulated actual printing process, that is, the gaps generated by the printing path are coupled with the defects caused by temperature, and the pore distribution of the target mold is accurately obtained, so as to facilitate determining whether the parameters of the current printing mold meet the requirements according to the gap distribution, so as to accurately adjust the parameters of the printing mold, avoid repeated actual printing, waste printing materials, solve the problem of high printing costs, and realize the accurate determination of the air permeability of the pores inside the mold.

[0019] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0021] Figure 1 is a flow chart of a method for simulating air holes in a 3D printing mold provided according to an embodiment of the present invention;

[0022] Figure 2 is a flow chart of another method for simulating vent holes in a 3D printing mold provided according to an embodiment of the present invention;

[0023] Figure 3 is a schematic structural diagram of a simulation device for air holes in a 3D printing mold provided according to an embodiment of the present invention;

[0024] Figure 4 It is a structural schematic diagram of an electronic device for implementing a method for simulating air holes in a 3D printing mold according to an embodiment of the present invention. DETAILED DESCRIPTION

[0025] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0026] It should be noted that the term "target" and the like in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0027] Embodiment 1

[0028] Figure 1 A flow chart of a method for simulating air holes in a 3D printed mold provided in an embodiment of the present invention. This embodiment can be applied to the process of simulating a 3D printed mold, as well as the situation of simulating air holes in a 3D printed mold. The method can be performed by a simulation device for air holes in a 3D printed mold. The simulation device for air holes in a 3D printed mold can be implemented in the form of hardware and / or software. The simulation device for air holes in a 3D printed mold can be configured in any electronic device with network communication function.

[0029] like Figure 1 As shown, the method for simulating vent holes in a 3D printing mold of the present invention may include the following process:

[0030] S110, determining a three-dimensional digital model of a target mold, and generating printing path information of the target mold based on the three-dimensional digital model and printing process parameters; the printing process parameters are used to describe scanning parameters of a 3D printing device in a simulated 3D printing process.

[0031] Specifically, the three-dimensional digital model may be a three-dimensional stereoscopic model of a simulated target mold, which is used to represent the actual shape and size of the target mold. The process of printing the target mold based on the printing process parameters is simulated, thereby forming printing path information for generating the target mold. For example, the printing process parameters may include scanning speed, scanning power, scanning spacing, and scanning layer thickness; the printing path information may be a printing path formed according to the scanning speed, scanning power, scanning spacing, and scanning layer thickness.

[0032] Optionally, printing path information of the target mold is generated based on the three-dimensional digital model and printing process parameters, including: slicing the three-dimensional digital model along the height direction to generate a preset number of target printing layers; simulating the printing scanning process of the target printing layer based on the printing process parameters to generate printing path information for each target printing layer.

[0033] Specifically, the three-dimensional digital model is sliced ​​along the height direction according to the set scanning layer thickness to generate a preset number of target printing layers. The scanning operation of the target printing layer is further simulated based on the scanning speed, scanning power and scanning spacing, and the G code in the scanning process is generated based on the G code generator, and the printing path information of each target printing layer is generated based on the G code.

[0034] The technical solution of this embodiment uses slicing operations to simulate the generation of printing path information for the three-dimensional digital model, thereby achieving accurate determination of the parameters of the scanning path during the printing process, and facilitating the subsequent determination of the generation of macroscopic gaps based on the printing path information.

[0035] S120, determining material parameters of the target mold and equipment process parameters of the 3D printing device, and determining a simulated printing result of the target mold based on the printing path information, material parameters and equipment process parameters; the simulated printing result is a description of the temperature distribution at different positions of the target mold during the actual printing process of the simulated target mold.

[0036] Among them, material parameters are used to describe the parameter information of the material selected for the mold, and equipment process parameters are used to describe the equipment information of the 3D printing equipment.

[0037] Specifically, based on the printing path information and with material parameters and equipment process parameters as restrictions, the generation of the target mold is simulated to generate a simulated printing result of the target mold. Because different material parameters and printing path information will cause different melting degrees at different positions of the target mold, different temperature distributions will be presented.

[0038] Optionally, the simulated printing result of the target mold is determined based on the printing path information, material parameters and the equipment process parameters, including: generating a finite element mesh model of the target mold based on the three-dimensional digital model; using the printing path information, material parameters and equipment process parameters as constraints of the finite element mesh, performing thermal physical analysis, and generating the simulated printing result of the target mold. That is, the thermal physical analysis can effectively reflect the thermal physical effects of different positions of the target mold, and different thermal physical effects reflect the melting degree of the corresponding position, so as to determine whether there is a gap or phase change at the position.

[0039] S130, generating a pore distribution cloud map of the target mold based on the printing path information and the simulated printing result; the pore distribution cloud map is used to describe the distribution state of the vent holes at different positions of the target mold in the simulated actual printing process.

[0040] Specifically, the printing path information and the simulated printing results are fused and analyzed, so as to fuse the macroscopic voids and the microscopic voids, thereby obtaining the void distribution that reflects the actual printing of the target mold, that is, the distribution of the air pores.

[0041] Optionally, based on the printing path information and the simulated printing results, a pore distribution cloud map of the target mold is generated, including steps A1-A4:

[0042] Step A1: Generate printing gap distribution information of the target mold based on the printing path information.

[0043] Specifically, the printing path information corresponding to each target printing layer is superimposed according to the position of the target mold to generate the printing path information of the target mold, and the printing path information of the target mold is analyzed to determine the defects formed on the target mold due to the macro printing process, that is, the printing gap distribution information.

[0044] Step A2: determining the thermal change states corresponding to different positions of the target mold according to the temperature distribution at different positions in the simulated printing result.

[0045] Among them, the thermal change state can be understood as the high and low temperature conditions and the preset qualified temperatures at different positions, that is, the preset qualified temperature is a range. If it is lower than a certain temperature value, insufficient melting may occur, and if it is higher than a certain temperature value, transition melting may occur.

[0046] Specifically, the temperature distribution at different positions in the simulated printing result is compared with the preset qualified temperature to determine the thermal change state corresponding to different positions of the target mold.

[0047] Step A3: Generate temperature gap analysis information of the target mold based on the thermal change state; the temperature gap analysis information is gap information caused by temperature determined after thermal physical analysis.

[0048] Specifically, the thermal change states at different positions are superimposed and analyzed to determine the temperature gap analysis information within different regions corresponding to the target mold. Defects may occur if the temperature is too high or too low. If the temperature changes too much in a continuous area, cracks may occur.

[0049] Optionally, generating temperature gap analysis information of the target mold based on the thermal change state includes: determining the melting state and phase change state of the material generating the target mold through the thermal change state; and determining the temperature gap analysis information according to the melting state and / or phase change state.

[0050] Step A4: Generate a pore distribution cloud map based on the printed void distribution information and the temperature void analysis information.

[0051] Specifically, the printing void distribution information is coupled with the temperature void analysis information to generate the void coupling result; the void coupling result is mapped to the finite element mesh model to generate the void distribution cloud map of the target mold. The void coupling result is used to describe the result after coupling the voids generated by the printing process and the voids generated by temperature.

[0052] The technical solution of this embodiment generates the printing gap distribution information of the target mold based on the printing path information, ensuring the accuracy of the prediction of the gaps on the target mold at the macro level. Further, the thermal change state corresponding to different positions of the target mold is determined according to the temperature distribution of different positions in the simulated printing results, and the temperature gap analysis information of the target mold is generated based on the thermal change state. The temperature gap analysis information is the gap information caused by temperature determined after thermal physical analysis, thereby ensuring the accuracy of the prediction of the gaps caused by temperature changes on the target mold at the micro level. Finally, based on the printing gap distribution information and the temperature gap analysis information, a pore distribution cloud map is generated, and the analysis of the two gaps is coupled to achieve accurate prediction of the gaps generated in the process of printing the target mold.

[0053] The technical solution of the embodiment of the present invention determines the three-dimensional digital model of the target mold, and generates the printing path information of the target mold based on the three-dimensional digital model and the printing process parameters; the printing process parameters are used to describe the scanning parameters of the 3D printing device in the simulated 3D printing process, that is, by simulating the actual printing process printing path, it is convenient to determine the gaps generated by the printing path according to the printing path information. Further, the material parameters of the target mold and the equipment process parameters of the 3D printing device are determined, and the simulated printing result of the target mold is determined based on the printing path information, material parameters and equipment process parameters; the simulated printing result is to describe the temperature distribution at different positions of the target mold during the actual printing process of the simulated target mold, that is, to accurately obtain the temperature distribution of the printed mold due to the differences in materials and temperatures during the printing process during the simulation of the actual printing process, so as to facilitate the determination of defects caused by temperature according to the temperature distribution. Then, based on the printing path information and the simulated printing results, a pore distribution cloud map of the target mold is generated; the pore distribution cloud map is used to describe the distribution state of the pores at different positions of the target mold in the simulated actual printing process, that is, the gaps generated by the printing path are coupled with the defects caused by temperature, and the pore distribution of the target mold is accurately obtained, so as to facilitate determining whether the parameters of the current printing mold meet the requirements according to the gap distribution, so as to accurately adjust the parameters of the printing mold, avoid repeated actual printing, waste printing materials, solve the problem of high printing costs, and realize the accurate determination of the air permeability of the pores inside the mold.

[0054] Embodiment 2

[0055] Figure 2 A flow chart of another method for simulating air vents in a 3D printed mold provided in an embodiment of the present invention. The technical solution of this embodiment is based on the above embodiment and takes the three-dimensional digital model as a CAD model as an example to further describe in detail the method for simulating air vents in a 3D printed mold.

[0056] Material parameters can be the density, melting temperature, energy absorption rate, specific heat at different temperatures, conductivity at different temperatures, thermal expansion coefficient at different temperatures, elasticity and Poisson's ratio at different temperatures, room temperature and high temperature tensile mechanical properties data (RT and HT), etc.

[0057] The printing process parameters may be 3D printing process parameters corresponding to the material grade, such as spot diameter, scanning speed, scanning power, scanning spacing, scanning layer thickness, etc.

[0058] Equipment process parameters may be, for example, substrate size, preheat temperature, and substrate material properties of the printing equipment used.

[0059] In the simulation method of the vent holes in the 3D printing mold provided by the present invention, the final result obtained after simulation analysis is a distribution cloud map of the pores in the target mold. The specific process is as follows:

[0060] S1. Mesh the CAD model to generate a finite element mesh model.

[0061] S2. Based on the CAD model and the set printing process parameters, such as scanning speed, scanning spacing, scanning power and layer thickness, slicing is performed to generate printing path information G-Code, which is used to detect the analysis data of the pores generated by the printing path, that is, the printing gap distribution information.

[0062] S3. Printing process parameters, material parameters and equipment process parameters (substrate size, scraper direction, preheating temperature) are used as all simulation input data for additive manufacturing simulation.

[0063] S4. Based on the simulation input data, thermal physical analysis is performed according to the finite element mesh model to simulate the temperature change process during the printing process, and the temperature distribution cloud map of each layer and the whole is obtained, that is, the simulated printing result of the target mold.

[0064] Whether the powder is completely melted is determined by the change and distribution of temperature. If the temperature is lower than the first preset temperature, the powder is not completely melted, which will lead to poor fusion and unfused defects. If the temperature is higher than the second preset temperature, the thermal expansion of the molten pool formed by scanning is different from that of the surrounding area. The change in temperature will produce phase change, which will produce residual stress. When the residual stress exceeds the strength limit of the material, cracks will form, and even cause macroscopic cracking and delamination. If the overall temperature distribution is uneven, cracks may occur;

[0065] S5. According to the generated printing path information G-Code, detect the pores generated by the printing path, generate printing gap distribution information, and visualize the pores.

[0066] S6. Couple the temperature distribution cloud map results of the thermal physical analysis and the pores generated by the printing path and map them to the finite element mesh model to obtain the pore distribution cloud map of the entire target mold.

[0067] By coupling the temperature distribution and the void distribution generated by the printing path and mapping them to the finite element mesh model, the temperature and printing status of each mesh unit can be viewed. The voids generated by the printing path are not related to the temperature. After coupling with the temperature distribution, smaller voids may disappear or become larger due to the improved temperature radiation during the printing process, thereby obtaining a more accurate overall void distribution of the target mold.

[0068] S7. Finally, by analyzing the pore distribution cloud map, it can be determined whether the current printing process parameters are appropriate and whether the simulated printing effect is appropriate, so that the printing process parameters can be quickly adjusted and the simulation experiment can be carried out again, so as to ensure that the parameters are appropriate and put into the actual part printing process, reduce the printing process, and save material and time costs.

[0069] The technical solution of this embodiment can quickly develop air permeability printing processes for different materials, accelerate production iterations, and achieve cost reduction and efficiency improvement.

[0070] Embodiment 3

[0071] Figure 3 A schematic structural diagram of a device for simulating air holes in a 3D printed mold provided in an embodiment of the present invention. This embodiment can be applied to the process of simulating a 3D printed mold, as well as the situation of simulating air holes in a 3D printed mold. The device for simulating air holes in a 3D printed mold can be implemented in the form of hardware and / or software. The device for simulating air holes in a 3D printed mold can be configured in any electronic device with network communication function.

[0072] like Figure 3 As shown, the simulation device of the air holes in the 3D printing mold of the present invention includes:

[0073] The information determination module 210 is used to determine the three-dimensional digital model of the target mold, and generate the printing path information of the target mold based on the three-dimensional digital model and the printing process parameters; the printing process parameters are used to describe the scanning parameters of the 3D printing device in the simulation 3D printing process;

[0074] The simulation printing result determination module 220 is used to determine the material parameters of the target mold and the equipment process parameters of the 3D printing device, and determine the simulation printing result of the target mold based on the printing path information, the material parameters and the equipment process parameters; the simulation printing result is a description of the temperature distribution at different positions of the target mold during the actual printing process of the simulated target mold;

[0075] The distribution map determination module 230 is used to generate a pore distribution cloud map of the target mold based on the printing path information and the simulated printing result; the pore distribution cloud map is used to describe the distribution state of the vent holes at different positions of the target mold in the simulation of the actual printing process.

[0076] Based on the above embodiment, optionally, the information determination module is used to slice the three-dimensional digital model along the height direction to generate a preset number of target printing layers; simulate the printing scanning process of the target printing layer based on the printing process parameters to generate the printing path information of each target printing layer.

[0077] Based on the above embodiment, optionally, the simulation printing result determination module is used to generate a finite element mesh model of the target mold based on the three-dimensional digital model; using the printing path information, the material parameters and the equipment process parameters as constraints of the finite element mesh, a thermal physical analysis is performed to generate a simulation printing result of the target mold.

[0078] On the basis of the above embodiment, optionally, the distribution map determination module includes an information determination unit, a thermal change state determination unit, a void information determination unit and a pore distribution cloud map determination unit; the information determination unit is used to generate the printing void distribution information of the target mold based on the printing path information. The thermal change state determination unit is used to determine the thermal change state corresponding to different positions of the target mold according to the temperature distribution of different positions in the simulated printing result. The void information determination unit is used to generate the temperature void analysis information of the target mold based on the thermal change state; the temperature void analysis information is the void information caused by temperature determined after thermal physical analysis. The pore distribution cloud map determination unit is used to generate a pore distribution cloud map based on the printing void distribution information and the temperature void analysis information.

[0079] Based on the above embodiment, optionally, a pore distribution cloud map determination unit is used to couple the printing void distribution information with the temperature void analysis information to generate a void coupling result; the void coupling result is used to describe the result after coupling the voids generated by the printing process and the voids generated by temperature; the void coupling result is mapped to the finite element mesh model to generate a pore distribution cloud map of the target mold.

[0080] Based on the above embodiment, optionally, the gap information determination unit is used to: determine the melting state and phase change state of the material generating the target mold through the thermal change state; and determine the temperature gap analysis information according to the melting state and / or phase change state.

[0081] Based on the above embodiment, optionally, the printing process parameters include scanning speed, scanning power, scanning interval and scanning layer thickness.

[0082] The device for simulating air holes in a 3D printing mold provided in an embodiment of the present invention can execute the method for simulating air holes in a 3D printing mold provided in any embodiment of the present invention, and has functional modules and beneficial effects corresponding to the execution method.

[0083] Embodiment 4

[0084] According to an embodiment of the present disclosure, the present disclosure also provides an electronic device, a readable storage medium and a computer program product.

[0085] Figure 4 A schematic diagram of the structure of an electronic device 10 that can be used to implement an embodiment of the present invention is shown. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processing, cellular phones, smart phones, wearable devices (such as helmets, glasses, watches, etc.) and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present invention described and / or required herein.

[0086] like Figure 4 As shown, the electronic device 10 includes at least one processor 11, and a memory connected to the at least one processor 11, such as a read-only memory (ROM) 12, a random access memory (RAM) 13, etc., wherein the memory stores a computer program that can be executed by at least one processor, and the processor 11 can perform various appropriate actions and processes according to the computer program stored in the read-only memory (ROM) 12 or the computer program loaded from the storage unit 18 to the random access memory (RAM) 13. In the RAM 13, various programs and data required for the operation of the electronic device 10 can also be stored. The processor 11, the ROM 12, and the RAM 13 are connected to each other through a bus 14. An input / output (I / O) interface 15 is also connected to the bus 14.

[0087] A number of components in the electronic device 10 are connected to the I / O interface 15, including: an input unit 16, such as a keyboard, a mouse, etc.; an output unit 17, such as various types of displays, speakers, etc.; a storage unit 18, such as a disk, an optical disk, etc.; and a communication unit 19, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 19 allows the electronic device 10 to exchange information / data with other devices through a computer network such as the Internet and / or various telecommunication networks.

[0088] The processor 11 may be a variety of general and / or special processing components with processing and computing capabilities. Some examples of the processor 11 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various special artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any appropriate processor, controller, microcontroller, etc. The processor 11 executes the various methods and processes described above, such as a simulation method for vent holes in a 3D printing mold.

[0089] In some embodiments, the simulation method of the vent holes in the 3D printing mold can be implemented as a computer program, which is tangibly contained in a computer-readable storage medium, such as a storage unit 18. In some embodiments, part or all of the computer program can be loaded and / or installed on the electronic device 10 via the ROM 12 and / or the communication unit 19. When the computer program is loaded into the RAM 13 and executed by the processor 11, one or more steps of the simulation method of the vent holes in the 3D printing mold described above can be performed. Alternatively, in other embodiments, the processor 11 can be configured to perform the simulation method of the vent holes in the 3D printing mold by any other appropriate means (for example, by means of firmware).

[0090] Various implementations of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), systems on chips (SOCs), complex programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various implementations can include: being implemented in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which can be a special purpose or general purpose programmable processor that can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.

[0091] Computer programs for implementing the methods of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, so that when the computer program is executed by the processor, the functions / operations specified in the flow chart and / or block diagram are implemented. The computer program may be executed entirely on the machine, partially on the machine, partially on the machine and partially on a remote machine as a stand-alone software package, or entirely on a remote machine or server.

[0092] In the context of the present invention, a computer-readable storage medium may be a tangible medium that may contain or store a computer program for use by or in combination with an instruction execution system, device or equipment. A computer-readable storage medium may include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, devices or equipment, or any suitable combination of the foregoing. Alternatively, a computer-readable storage medium may be a machine-readable signal medium. A more specific example of a machine-readable storage medium may include an electrical connection based on one or more lines, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0093] To provide interaction with a user, the systems and techniques described herein may be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and a pointing device (e.g., a mouse or trackball) through which the user can provide input to the electronic device. Other types of devices may also be used to provide interaction with the user; for example, the feedback provided to the user may be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user may be received in any form (including acoustic input, voice input, or tactile input).

[0094] The systems and techniques described herein may be implemented in a computing system that includes backend components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes frontend components (e.g., a user computer with a graphical user interface or a web browser through which a user can interact with implementations of the systems and techniques described herein), or a computing system that includes any combination of such backend components, middleware components, or frontend components. The components of the system may be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: a local area network (LAN), a wide area network (WAN), a blockchain network, and the Internet.

[0095] A computing system may include a client and a server. The client and the server are generally remote from each other and usually interact through a communication network. The client and server relationship is generated by computer programs running on the corresponding computers and having a client-server relationship with each other. The server may be a cloud server, also known as a cloud computing server or cloud host, which is a host product in the cloud computing service system to solve the defects of difficult management and weak business scalability in traditional physical hosts and VPS services.

[0096] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps described in the present invention can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solution of the present invention can be achieved, and this document does not limit this.

[0097] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A method for simulating vent holes in a 3D printing mold, characterized in that: The method comprises: Determine a three-dimensional digital model of a target mold, and generate printing path information of the target mold based on the three-dimensional digital model and printing process parameters; the printing process parameters are used to describe scanning parameters of a 3D printing device in a simulated 3D printing process; Determine the material parameters of the target mold and the equipment process parameters of the 3D printing device, and determine the simulated printing result of the target mold based on the printing path information, the material parameters and the equipment process parameters; the simulated printing result is a description of the temperature distribution at different positions of the target mold during the actual printing process of the simulated target mold; Based on the printing path information and the simulated printing result, a pore distribution cloud map of the target mold is generated; the pore distribution cloud map is used to describe the distribution state of the vent holes at different positions of the target mold in the simulated actual printing process.

2. The method according to claim 1, characterized in that Generating printing path information of the target mold based on the three-dimensional digital model and printing process parameters includes: Slicing the three-dimensional digital model along the height direction to generate a preset number of target printing layers; The printing scanning process is simulated for the target printing layer based on the printing process parameters to generate the printing path information of each target printing layer.

3. The method according to claim 1, characterized in that Determining a simulated printing result of the target mold based on the printing path information, the material parameters, and the equipment process parameters includes: Generate a finite element mesh model of the target mold based on the three-dimensional digital model; The printing path information, the material parameters and the equipment process parameters are used as constraints of the finite element mesh to perform a thermal physical analysis and generate a simulated printing result of the target mold.

4. The method according to claim 3, characterized in that: Based on the printing path information and the simulated printing result, a pore distribution cloud map of the target mold is generated, including: Generate printing gap distribution information of the target mold based on the printing path information; Determining the thermal change states corresponding to different positions of the target mold according to the temperature distribution conditions at different positions in the simulated printing result; Generating temperature gap analysis information of the target mold based on the thermal change state; the temperature gap analysis information is gap information caused by temperature determined after thermal physical analysis; A pore distribution cloud map is generated based on the printing void distribution information and the temperature void analysis information.

5. The method according to claim 4, characterized in that Based on the printed void distribution information and the temperature void analysis information, a void distribution cloud map is generated, including: The printing gap distribution information is coupled with the temperature gap analysis information to generate a gap coupling result; the gap coupling result is used to describe the result after coupling the gap generated by the printing process and the gap generated by the temperature; The void coupling result is mapped into the finite element mesh model to generate a pore distribution cloud map of the target mold.

6. The method according to claim 4, characterized in that Generating temperature gap analysis information of the target mold based on the thermal change state includes: Determining the melting state and phase change state of the material for generating the target mold through the thermal change state; The temperature void analysis information is determined according to the melting state and / or phase change state.

7. The method according to claim 1, characterized in that The printing process parameters include scanning speed, scanning power, scanning spacing and scanning layer thickness.

8. A simulation device for air holes in a 3D printing mold, characterized in that: The device comprises: An information determination module, used to determine a three-dimensional digital model of a target mold, and generate printing path information of the target mold based on the three-dimensional digital model and printing process parameters; the printing process parameters are used to describe scanning parameters of a 3D printing device in a simulated 3D printing process; A simulation printing result determination module is used to determine the material parameters of the target mold and the equipment process parameters of the 3D printing device, and determine the simulation printing result of the target mold based on the printing path information, the material parameters and the equipment process parameters; the simulation printing result is a description of the temperature distribution at different positions of the target mold during the actual printing process of the simulated target mold; The distribution map determination module is used to generate a pore distribution cloud map of the target mold based on the printing path information and the simulated printing result; the pore distribution cloud map is used to describe the distribution state of the vent holes at different positions of the target mold in the simulation of the actual printing process.

9. An electronic device, characterized in that: The electronic device comprises: at least one processor; and a memory communicatively connected to the at least one processor; wherein, The memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor can execute the method for simulating air pores in a 3D printed mold according to any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a processor to implement the method for simulating air vents in a 3D printing mold according to any one of claims 1 to 7 when executed.

Images