Dynamic measurement method and system for thermal printing head

Abstract

The invention discloses a dynamic measurement method and system for a thermal printing head, and the method comprises the steps: building a dynamic measurement model based on voltage signals collected by all voltage collection points, corresponding collection channels and the working state of the thermal printing head in a voltage collection system, and triggering the dynamic measurement of the thermal printing head based on the dynamic measurement. Therefore, the dynamic measurement accuracy of the thermal printing head is improved. Further, in dynamic measurement of the thermal printing head, based on the plurality of voltage signals, the corresponding acquisition channels and voltage features defined by the combined identification model, matching corresponding working areas according to the plurality of voltage features and each working module in the thermal printing head; a voltage abnormal path is defined according to the reverse tracing of the voltage abnormal signal, and the configuration of each working area is optimized based on the voltage abnormal path, the cooperative relationship of each working area and the anomaly optimization model, so that the autonomous optimization of the configuration of each working area is realized.

Description

Technical Field

[0001] The present invention relates to the technical field of thermal print heads, and in particular to a dynamic measurement method and system for a thermal print head. Background Art

[0002] With the development of science and technology, thermal print heads are widely used in printers, and print paper under the instruction of the control center of the printer. In the prior art, based on the thermal print head printing paper, the voltage signal of the thermal print head during the printing process is collected, and the printing status of the thermal print head is presented according to multiple voltage signals. However, there will be abnormal voltage signals in the multiple voltage signals. The prior art does not filter out the corresponding abnormal voltage signals, nor can it autonomously optimize the configuration of each working area, which affects the autonomous regulation of the thermal print head in dynamic measurement. Summary of the invention

[0003] The purpose of the present invention is to overcome the shortcomings of the prior art. The present invention provides a dynamic measurement method and system for a thermal print head, which collects the position of the thermal print head; defines multiple voltage collection points according to the position of the thermal print head and the three-dimensional model of the thermal print head; constructs a voltage collection system based on multiple voltage collection points, corresponding circuit paths and corresponding orientations; in the voltage collection system, a dynamic measurement model is constructed based on the voltage signals collected by each voltage collection point, the corresponding collection channel and the working state of the thermal print head, and the dynamic measurement of the thermal print head is triggered based on the dynamic measurement, which is compatible with the overall consideration of the voltage signals collected by each voltage collection point, the corresponding collection channel and the working state of the thermal print head, and realizes multi-dimensional control of the voltage signals collected by each voltage collection point, the corresponding collection channel and the working state of the thermal print head, thereby ensuring the accuracy of the dynamic measurement model and improving the accuracy of the dynamic measurement of the thermal print head.

[0004] Furthermore, in the dynamic measurement of the thermal print head, the voltage characteristics defined based on multiple voltage signals, corresponding acquisition channels and a combined recognition model are defined, and the corresponding working areas are matched according to the multiple voltage characteristics and the various working modules in the thermal print head; the voltage abnormality path is defined according to the reverse tracing of the voltage abnormality signal, and the configuration of each working area is optimized based on the voltage abnormality path, the synergistic relationship of each working area and the abnormal optimization model, which is compatible with the voltage abnormality path, the synergistic relationship of each working area and the overall consideration of the abnormal optimization model, and realizes the autonomous optimization of the configuration of each working area, so that the working area with the voltage abnormality path is targetedly optimized, and the working area without the voltage abnormality path maintains the current state of the thermal print head, thereby realizing autonomous regulation of the thermal print head in dynamic measurement.

[0005] An embodiment of the present invention provides a dynamic measurement method of a thermal print head, which is applied to a dynamic measurement scenario of a thermal print head; the dynamic measurement method of a thermal print head includes:

[0006] Collect the location of the thermal print head;

[0007] Define multiple voltage collection points according to the location of the thermal print head and the three-dimensional model of the thermal print head;

[0008] Construct a voltage collection system based on multiple voltage collection points, corresponding circuit paths and corresponding locations;

[0009] In the voltage acquisition system, a dynamic measurement model is constructed based on the voltage signals collected at each voltage acquisition point, the corresponding acquisition channel and the working state of the thermal print head, and the dynamic measurement of the thermal print head is triggered based on the dynamic measurement;

[0010] In the dynamic measurement of the thermal print head, based on the voltage features defined by the multiple voltage signals, the corresponding acquisition channels and the combined recognition model, the corresponding working area is matched according to the multiple voltage features and each working module in the thermal print head;

[0011] A voltage abnormality path is defined according to the reverse tracing of the voltage abnormality signal, and the configuration of each working area is optimized based on the voltage abnormality path, the cooperative relationship of each working area and the abnormality optimization model.

[0012] Optionally, collecting the location of the thermal print head includes:

[0013] Collect the working signal of thermal print head;

[0014] Analyze the working signal of thermal print head;

[0015] Acquiring the working space of the thermal print head based on the analysis of the working signal of the thermal print head;

[0016] A plurality of position information according to the traversal of the working space of the thermal print head;

[0017] The position of the thermal print head is defined according to a plurality of position information, a current time of the thermal print head and a position review logic.

[0018] Optionally, the step of defining a plurality of voltage collection points according to the location of the thermal print head and the three-dimensional model of the thermal print head includes:

[0019] Freeze the location of the thermal print head;

[0020] matching a corresponding circuit path based on the location of the thermal print head and the circuit portion of the thermal print head;

[0021] constructing a three-dimensional model of the thermal print head based on the location of the thermal print head and the circumferential image of the thermal print head;

[0022] A three-dimensional model of the associated thermal print head and circuit paths;

[0023] defining a plurality of voltage collection areas according to a three-dimensional model of the thermal print head, a circuit path, and a state of the thermal print head;

[0024] A plurality of voltage collection points are defined according to the traversal of a plurality of voltage collection areas.

[0025] Optionally, constructing a voltage collection system based on multiple voltage collection points, corresponding circuit paths, and corresponding locations includes:

[0026] Freeze multiple voltage collection points;

[0027] Matching corresponding circuit paths based on multiple voltage collection points and corresponding voltage collection areas;

[0028] Associating voltage collection points, corresponding circuit paths, and corresponding orientations;

[0029] Defining first system parameters according to voltage collection points and corresponding circuit paths;

[0030] Defining the second system parameters according to the voltage collection points and the corresponding positions;

[0031] A corresponding voltage acquisition system is matched based on the second system parameter, the first system parameter and the dynamic measurement state of the thermal print head.

[0032] Optionally, in the voltage acquisition system, a dynamic measurement model is constructed based on the voltage signals acquired at each voltage acquisition point, the corresponding acquisition channel, and the working state of the thermal print head, and dynamic measurement of the thermal print head is triggered based on the dynamic measurement, including:

[0033] In the voltage collection system, each voltage collection point is monitored in real time, and the voltage signal collected by each voltage collection point is defined;

[0034] Collect the working status of the thermal print head, and associate the voltage signals collected by each voltage collection point, the corresponding collection channel and the working status of the thermal print head;

[0035] A dynamic measurement model is constructed according to the voltage signals collected at each voltage collection point, the corresponding collection channel and the working state of the thermal print head;

[0036] A dynamic measurement of the thermal print head is triggered based on the dynamic measurement.

[0037] Optionally, in the dynamic measurement of the thermal print head, based on multiple voltage signals, corresponding acquisition channels and voltage features defined by the combined recognition model, matching corresponding working areas according to the multiple voltage features and each working module in the thermal print head includes:

[0038] In the dynamic measurement of thermal print heads, multiple voltage signals are frozen;

[0039] Correlate multiple voltage signals and corresponding acquisition channels;

[0040] A corresponding voltage signal combination is constructed according to the multiple voltage signals and the corresponding acquisition channels.

[0041] Optionally, in the dynamic measurement of the thermal print head, based on multiple voltage signals, corresponding acquisition channels and voltage features defined by the combined recognition model, matching corresponding working areas according to the multiple voltage features and each working module in the thermal print head, further includes:

[0042] Associating multiple voltage signal combinations and a combination recognition model, the combination recognition model is trained based on previous combination data;

[0043] A voltage feature defined according to a combination of multiple voltage signals and a combination identification model;

[0044] The corresponding working area is matched according to the multiple voltage characteristics and each working module in the thermal print head.

[0045] Optionally, the step of defining a voltage abnormality path according to the reverse tracing of the voltage abnormality signal, and optimizing the configuration of each working area based on the voltage abnormality path, the synergistic relationship of each working area, and the abnormality optimization model includes:

[0046] Monitor each working area in real time and collect abnormal voltage signals in each working area;

[0047] Matching corresponding reverse tracing models according to nodes where multiple voltage abnormality signals are located and abnormality types of the multiple voltage abnormality signals, and triggering reverse tracing of the voltage abnormality signals based on the reverse tracing model;

[0048] The voltage abnormality path is defined based on the reverse tracing of the voltage abnormality signal.

[0049] Optionally, the step of defining a voltage abnormality path according to the reverse tracing of the voltage abnormality signal, and optimizing the configuration of each working area based on the voltage abnormality path, the synergistic relationship of each working area and the abnormality optimization model, further includes:

[0050] Associating the voltage abnormality path, the synergistic relationship of each working area and the abnormality optimization model;

[0051] Optimize the configuration of each working area based on the voltage abnormality path, the coordinated relationship of each working area and the abnormality optimization model;

[0052] The working area with the abnormal voltage path is optimized specifically, while the working area without the abnormal voltage path maintains the current state of the thermal print head.

[0053] In addition, an embodiment of the present invention further provides a dynamic measurement system for a thermal print head, the dynamic measurement system for a thermal print head comprising:

[0054] A collection module, used for collecting the location of the thermal print head;

[0055] A voltage collection point module is used to define multiple voltage collection points according to the location of the thermal print head and the three-dimensional model of the thermal print head;

[0056] A voltage collection system module is used to construct a voltage collection system based on multiple voltage collection points, corresponding circuit paths and corresponding locations;

[0057] A dynamic measurement module is used to build a dynamic measurement model based on the voltage signals collected by each voltage collection point, the corresponding collection channel and the working state of the thermal print head in the voltage collection system, and trigger the dynamic measurement of the thermal print head based on the dynamic measurement;

[0058] A working area module is used to match the corresponding working area according to the multiple voltage characteristics and each working module in the thermal print head in the dynamic measurement of the thermal print head based on the voltage characteristics defined by the multiple voltage signals, the corresponding acquisition channels and the combined recognition model;

[0059] The state module is used to define a voltage abnormality path according to the reverse tracing of the voltage abnormality signal, and optimize the configuration of each working area based on the voltage abnormality path, the cooperative relationship of each working area and the abnormality optimization model.

[0060] In an embodiment of the present invention, the method in the embodiment of the present invention is used to collect the position of the thermal print head; multiple voltage collection points are defined according to the position of the thermal print head and the three-dimensional model of the thermal print head; a voltage collection system is constructed based on multiple voltage collection points, corresponding circuit paths and corresponding orientations; in the voltage collection system, a dynamic measurement model is constructed based on the voltage signals collected by each voltage collection point, the corresponding collection channel and the working state of the thermal print head, and the dynamic measurement of the thermal print head is triggered based on the dynamic measurement, which is compatible with the overall consideration of the voltage signals collected by each voltage collection point, the corresponding collection channel and the working state of the thermal print head, and realizes multi-dimensional control of the voltage signals collected by each voltage collection point, the corresponding collection channel and the working state of the thermal print head, thereby ensuring the accuracy of the dynamic measurement model and thereby improving the accuracy of the dynamic measurement of the thermal print head.

[0061] Furthermore, in the dynamic measurement of the thermal print head, the voltage characteristics defined based on multiple voltage signals, corresponding acquisition channels and a combined recognition model are defined, and the corresponding working areas are matched according to the multiple voltage characteristics and the various working modules in the thermal print head; the voltage abnormality path is defined according to the reverse tracing of the voltage abnormality signal, and the configuration of each working area is optimized based on the voltage abnormality path, the synergistic relationship of each working area and the abnormal optimization model, which is compatible with the voltage abnormality path, the synergistic relationship of each working area and the overall consideration of the abnormal optimization model, and realizes the autonomous optimization of the configuration of each working area, so that the working area with the voltage abnormality path is targetedly optimized, and the working area without the voltage abnormality path maintains the current state of the thermal print head, thereby realizing autonomous regulation of the thermal print head in dynamic measurement. BRIEF DESCRIPTION OF THE DRAWINGS

[0062] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0063] Figure 1 is a schematic flow chart of a dynamic measurement method of a thermal print head in an embodiment of the present invention;

[0064] Figure 2 is a schematic flow chart of S11 in the dynamic measurement method of a thermal print head in an embodiment of the present invention;

[0065] Figure 3 is a schematic flow chart of S12 in the dynamic measurement method of a thermal print head in an embodiment of the present invention;

[0066] Figure 4 is a schematic flow chart of S13 in the dynamic measurement method of a thermal print head in an embodiment of the present invention;

[0067] Figure 5 is a schematic flow chart of S14 in the dynamic measurement method of a thermal print head in an embodiment of the present invention;

[0068] Figure 6 is a schematic flow chart of S15 in the dynamic measurement method of a thermal print head in an embodiment of the present invention;

[0069] Figure 7 is a schematic flow chart of S16 in the dynamic measurement method of a thermal print head in an embodiment of the present invention;

[0070] Figure 8 Schematic diagram of the structure of a dynamic measurement system of a thermal print head in an embodiment of the present invention;

[0071] Fig. 9 is a hardware diagram of an electronic device according to an exemplary embodiment;

[0072] Fig.10 is a schematic diagram of a high-voltage multi-channel dynamic measurement circuit according to an exemplary embodiment. DETAILED DESCRIPTION

[0073] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0074] See also Figures 1 to 9 , a dynamic measurement method of a thermal print head, applied to a dynamic measurement scenario of a thermal print head; the dynamic measurement method of a thermal print head includes:

[0075] Step S11: collecting the location of the thermal print head;

[0076] Step S12: defining a plurality of voltage collection points according to the location of the thermal print head and the three-dimensional model of the thermal print head;

[0077] Step S13: defining a plurality of voltage collection points according to the location of the thermal print head and the three-dimensional model of the thermal print head;

[0078] Step S14: in the voltage acquisition system, a dynamic measurement model is constructed based on the voltage signals acquired at each voltage acquisition point, the corresponding acquisition channel and the working state of the thermal print head, and dynamic measurement of the thermal print head is triggered based on the dynamic measurement;

[0079] Step S15: in the dynamic measurement of the thermal print head, based on the voltage features defined by the multiple voltage signals, the corresponding acquisition channels and the combined recognition model, the corresponding working areas are matched according to the multiple voltage features and the various working modules in the thermal print head;

[0080] Step S16: defining a voltage abnormality path according to the reverse tracing of the voltage abnormality signal, and optimizing the configuration of each working area based on the voltage abnormality path, the cooperative relationship of each working area and the abnormality optimization model.

[0081] In an embodiment of the present invention, the method in the embodiment of the present invention is used to collect the position of the thermal print head; multiple voltage collection points are defined according to the position of the thermal print head and the three-dimensional model of the thermal print head; a voltage collection system is constructed based on multiple voltage collection points, corresponding circuit paths and corresponding orientations; in the voltage collection system, a dynamic measurement model is constructed based on the voltage signals collected by each voltage collection point, the corresponding collection channel and the working state of the thermal print head, and the dynamic measurement of the thermal print head is triggered based on the dynamic measurement, which is compatible with the overall consideration of the voltage signals collected by each voltage collection point, the corresponding collection channel and the working state of the thermal print head, and realizes multi-dimensional control of the voltage signals collected by each voltage collection point, the corresponding collection channel and the working state of the thermal print head, thereby ensuring the accuracy of the dynamic measurement model and thereby improving the accuracy of the dynamic measurement of the thermal print head.

[0082] Furthermore, in the dynamic measurement of the thermal print head, the voltage characteristics defined based on multiple voltage signals, corresponding acquisition channels and a combined recognition model are defined, and the corresponding working areas are matched according to the multiple voltage characteristics and the various working modules in the thermal print head; the voltage abnormality path is defined according to the reverse tracing of the voltage abnormality signal, and the configuration of each working area is optimized based on the voltage abnormality path, the synergistic relationship of each working area and the abnormal optimization model, which is compatible with the voltage abnormality path, the synergistic relationship of each working area and the overall consideration of the abnormal optimization model, and realizes the autonomous optimization of the configuration of each working area, so that the working area with the voltage abnormality path is targetedly optimized, and the working area without the voltage abnormality path maintains the current state of the thermal print head, thereby realizing autonomous regulation of the thermal print head in dynamic measurement.

[0083] refer to Figure 2 , in step S11, the location of the thermal print head is collected;

[0084] In the specific implementation process of the present invention, the specific steps may be:

[0085] S111: Collecting the working signal of the thermal print head;

[0086] S112: analyzing the working signal of the thermal print head;

[0087] S113: collecting the working space of the thermal print head based on the analysis of the working signal of the thermal print head;

[0088] S114: obtaining a plurality of position information according to the traversal of the working space of the thermal print head;

[0089] S115: defining the location of the thermal print head according to the plurality of location information, the current time of the thermal print head and the location review logic.

[0090] In an embodiment of the present application, the working signal of the thermal print head is collected, the working signal of the thermal print head is introduced, the working signal of the thermal print head is controlled, thereby analyzing the working signal of the thermal print head, and then based on the analysis of the working signal of the thermal print head, the working space of the thermal print head is collected, the working space of the thermal print head is introduced, and further control of the working space of the thermal print head is achieved.

[0091] Therefore, based on the traversal of the working space of the thermal print head, multiple position information are introduced, and the multiple position information are controlled, so as to define the position of the thermal print head according to the multiple position information, the current time of the thermal print head and the position review logic, and is compatible with the overall consideration of multiple position information, the current time of the thermal print head and the position review logic, realizing multi-dimensional control of multiple position information, the current time of the thermal print head and the position review logic, and further reviewing the position review logic to ensure the accuracy of the position of the thermal print head.

[0092] refer to Figure 3 , in step S12, a plurality of voltage collection points are defined according to the location of the thermal print head and the three-dimensional model of the thermal print head;

[0093] In the specific implementation process of the present invention, the specific steps may be:

[0094] S121: freeze the position of the thermal print head;

[0095] S122: matching a corresponding circuit path based on the location of the thermal print head and the circuit portion of the thermal print head;

[0096] S123: constructing a three-dimensional model of the thermal print head based on the position of the thermal print head and the circumferential image of the thermal print head;

[0097] S124: associating a three-dimensional model of a thermal print head and a circuit path;

[0098] S125: defining a plurality of voltage collection areas according to the three-dimensional model of the thermal print head, the circuit path, and the state of the thermal print head;

[0099] S126: defining a plurality of voltage collection points according to the traversal of the plurality of voltage collection areas.

[0100] In an embodiment of the present application, the position of the thermal print head is frozen, and further processing is performed on the position of the thermal print head, so as to match the corresponding circuit path based on the position of the thermal print head and the circuit part of the thermal print head, thereby achieving multi-dimensional control of the position of the thermal print head and the circuit part of the thermal print head, and ensuring the accuracy of the circuit path.

[0101] At this time, a three-dimensional model of the thermal print head is constructed based on the position of the thermal print head and the circumferential image of the thermal print head. The position of the thermal print head and the circumferential image of the thermal print head are introduced, and the position of the thermal print head and the circumferential image of the thermal print head are combined in multiple dimensions to realize the construction of the three-dimensional model of the thermal print head.

[0102] Furthermore, the three-dimensional model and circuit path of the thermal print head are associated, and multi-dimensional interaction is performed on the three-dimensional model and circuit path of the thermal print head, so as to define multiple voltage collection areas according to the three-dimensional model of the thermal print head, the circuit path and the state of the thermal print head. The three-dimensional model of the thermal print head, the circuit path and the state of the thermal print head are introduced, and multi-dimensional control of the three-dimensional model of the thermal print head, the circuit path and the state of the thermal print head is achieved, thereby ensuring the accuracy of multiple voltage collection areas. At the same time, multiple voltage collection points are defined according to the traversal of multiple voltage collection areas, thereby achieving the marking of multiple voltage collection points.

[0103] refer to Figure 4 In step S13, a voltage collection system is constructed based on a plurality of voltage collection points, corresponding circuit paths and corresponding positions;

[0104] In the specific implementation process of the present invention, the specific steps may be:

[0105] S131: freeze multiple voltage collection points;

[0106] S132: Matching corresponding circuit paths based on multiple voltage collection points and corresponding voltage collection areas;

[0107] S133: Associating voltage collection points, corresponding circuit paths, and corresponding directions;

[0108] S134: defining a first system parameter according to the voltage collection point and the corresponding circuit path;

[0109] S135: defining a second system parameter according to the voltage collection point and the corresponding position;

[0110] S136: Matching a corresponding voltage acquisition system based on the second system parameter, the first system parameter and the dynamic measurement state of the thermal print head.

[0111] In an embodiment of the present application, multiple voltage collection points are frozen and controlled, so that corresponding circuit paths are matched based on the multiple voltage collection points and the corresponding voltage collection areas, and the circuit paths are introduced to ensure the accuracy of the circuit paths.

[0112] At this time, the voltage collection points, the corresponding circuit paths and the corresponding positions are associated to realize multi-dimensional control of the voltage collection points, the corresponding circuit paths and the corresponding positions. At the same time, the first system parameters are defined according to the voltage collection points and the corresponding circuit paths; the second system parameters are defined according to the voltage collection points and the corresponding positions, and the second system parameters and the first system parameters are introduced.

[0113] Therefore, based on matching the corresponding voltage acquisition system with the second system parameters, the first system parameters and the dynamic measurement state of the thermal print head, the overall consideration of the second system parameters, the first system parameters and the dynamic measurement state of the thermal print head is compatible, and multi-dimensional control of the second system parameters, the first system parameters and the dynamic measurement state of the thermal print head is achieved, ensuring the rationality and accuracy of the voltage acquisition system.

[0114] refer to Figure 5 , S14: in the voltage acquisition system, a dynamic measurement model is constructed based on the voltage signals collected by each voltage acquisition point, the corresponding acquisition channel and the working state of the thermal print head, and a dynamic measurement of the thermal print head is triggered based on the dynamic measurement;

[0115] In the specific implementation process of the present invention, the specific steps may be:

[0116] S141: In the voltage collection system, each voltage collection point is monitored in real time, and a voltage signal collected by each voltage collection point is defined;

[0117] S142: collecting the working state of the thermal print head, and associating the voltage signals collected by each voltage collection point, the corresponding collection channel and the working state of the thermal print head;

[0118] S143: constructing a dynamic measurement model according to the voltage signals collected at each voltage collection point, the corresponding collection channel, and the working state of the thermal print head;

[0119] S144: triggering dynamic measurement of the thermal print head based on the dynamic measurement.

[0120] In an embodiment of the present application, the position of the thermal print head is collected; a plurality of voltage collection points are defined according to the position of the thermal print head and the three-dimensional model of the thermal print head; a voltage collection system is constructed based on the plurality of voltage collection points, the corresponding circuit paths and the corresponding orientations; in the voltage collection system, a dynamic measurement model is constructed based on the voltage signals collected by each voltage collection point, the corresponding collection channels and the working state of the thermal print head, and the dynamic measurement of the thermal print head is triggered based on the dynamic measurement, which is compatible with the overall consideration of the voltage signals collected by each voltage collection point, the corresponding collection channels and the working state of the thermal print head, and realizes multi-dimensional control of the voltage signals collected by each voltage collection point, the corresponding collection channels and the working state of the thermal print head, thereby ensuring the accuracy of the dynamic measurement model and thereby improving the accuracy of the dynamic measurement of the thermal print head.

[0121] At this time, in the voltage acquisition system, each voltage acquisition point is monitored in real time, and the voltage signal collected by each voltage acquisition point is defined, and multiple voltage signals are introduced. At the same time, the working status of the thermal print head is collected, and the voltage signal collected by each voltage acquisition point, the corresponding acquisition channel and the working status of the thermal print head are associated, which is compatible with the overall consideration of the voltage signal collected by each voltage acquisition point, the corresponding acquisition channel and the working status of the thermal print head.

[0122] Therefore, a dynamic measurement model is constructed according to the voltage signals collected by each voltage collection point, the corresponding collection channels and the working status of the thermal print head. The voltage signals collected by each voltage collection point, the corresponding collection channels and the working status of the thermal print head are introduced, and multi-dimensional control of the voltage signals collected by each voltage collection point, the corresponding collection channels and the working status of the thermal print head is achieved, thereby ensuring the accuracy of the dynamic measurement model. At the same time, the dynamic measurement of the thermal print head is triggered based on the dynamic measurement, thereby improving the accuracy of the dynamic measurement of the thermal print head.

[0123] refer to Figure 6 , S15: In the dynamic measurement of the thermal print head, based on the voltage features defined by the multiple voltage signals, the corresponding acquisition channels and the combined recognition model, the corresponding working area is matched according to the multiple voltage features and each working module in the thermal print head;

[0124] In the specific implementation process of the present invention, the specific steps may be:

[0125] S151: freezing multiple voltage signals in dynamic measurement of a thermal print head;

[0126] S152: Associating multiple voltage signals and corresponding acquisition channels;

[0127] S153: constructing a corresponding voltage signal combination according to the multiple voltage signals and the corresponding acquisition channels;

[0128] S154: Associating a plurality of voltage signal combinations with a combination recognition model, where the combination recognition model is trained based on previous combination data;

[0129] S155: defining a voltage feature according to a combination of multiple voltage signals and a combination recognition model;

[0130] S156: Matching corresponding working areas according to the multiple voltage characteristics and each working module in the thermal print head.

[0131] In an embodiment of the present application, in the dynamic measurement of the thermal print head, a plurality of voltage signals are frozen; at the same time, the plurality of voltage signals and the corresponding acquisition channels are associated, and the plurality of voltage signals and the corresponding acquisition channels are controlled as a whole.

[0132] At this time, a corresponding voltage signal combination is constructed according to multiple voltage signals and corresponding acquisition channels, and multiple voltage signals and corresponding acquisition channels are introduced, thereby realizing multi-dimensional control of multiple voltage signals and corresponding acquisition channels and ensuring the accuracy of the voltage signal combination.

[0133] Therefore, multiple voltage signal combinations and a combination recognition model are associated, and the combination recognition model is trained based on previous combination data; voltage features are defined according to multiple voltage signal combinations and the combination recognition model; corresponding working areas are matched according to multiple voltage features and each working module in the thermal print head, and multiple working areas are introduced, and the accuracy of multiple working areas is ensured through multiple voltage features and each working module in the thermal print head.

[0134] refer to Figure 7 , S16: defining a voltage abnormality path according to the reverse tracing of the voltage abnormality signal, and optimizing the configuration of each working area based on the voltage abnormality path, the synergistic relationship of each working area and the abnormality optimization model;

[0135] In the specific implementation process of the present invention, the specific steps may be:

[0136] S161: monitor each working area in real time and collect voltage abnormality signals in each working area;

[0137] S162: matching corresponding reverse tracing models according to the nodes where the multiple voltage abnormality signals are located and the abnormality types of the multiple voltage abnormality signals, and triggering reverse tracing of the voltage abnormality signals based on the reverse tracing model;

[0138] S163: defining a voltage abnormality path according to reverse tracing of the voltage abnormality signal;

[0139] S164: Associating the voltage abnormality path, the coordination relationship of each working area, and the abnormality optimization model;

[0140] S165: Optimizing the configuration of each working area based on the voltage abnormality path, the coordinated relationship of each working area, and the abnormality optimization model;

[0141] S166: Targetedly optimize the working area with the voltage abnormality path, while maintaining the current state of the thermal print head in the working area without the voltage abnormality path.

[0142] In the specific implementation process of the present invention, in the dynamic measurement of the thermal print head, the voltage characteristics defined based on multiple voltage signals, corresponding acquisition channels and combined recognition models are defined, and the corresponding working areas are matched according to the multiple voltage characteristics and the various working modules in the thermal print head; the voltage abnormality path is defined according to the reverse tracing of the voltage abnormality signal, and the configuration of each working area is optimized based on the voltage abnormality path, the synergistic relationship of each working area and the abnormal optimization model, which is compatible with the voltage abnormality path, the synergistic relationship of each working area and the overall consideration of the abnormal optimization model, and realizes the autonomous optimization of the configuration of each working area, so that the working area with the voltage abnormality path is targetedly optimized, and the working area without the voltage abnormality path maintains the current state of the thermal print head, thereby realizing the autonomous regulation of the thermal print head in dynamic measurement.

[0143] At this time, each working area is monitored in real time, and the voltage abnormality signal in each working area is collected and introduced, so as to match the corresponding reverse tracing model according to the nodes where the multiple voltage abnormality signals are located and the abnormal types of the multiple voltage abnormality signals, and trigger the reverse tracing of the voltage abnormality signal based on the reverse tracing model, thereby ensuring the timeliness of the reverse tracing of the voltage abnormality signal.

[0144] Therefore, the voltage abnormality path is defined according to the reverse tracing of the voltage abnormality signal; the voltage abnormality path, the coordinated relationship of each working area and the abnormality optimization model are associated; the configuration of each working area is optimized based on the voltage abnormality path, the coordinated relationship of each working area and the abnormality optimization model, which is compatible with the overall consideration of the voltage abnormality path, the coordinated relationship of each working area and the abnormality optimization model, and realizes the multi-dimensional control of the voltage abnormality path, the coordinated relationship of each working area and the abnormality optimization model, ensures the optimization effect of the configuration of each working area, and realizes the dynamic configuration of each working area. At the same time, the working area with the voltage abnormality path is optimized in a targeted manner, while the working area without the voltage abnormality path maintains the current state of the thermal print head.

[0145] Furthermore, based on the voltage abnormality path, the coordinated relationship of each working area and the abnormal optimization model, the configuration of each working area is optimized, which is compatible with the overall consideration of the voltage abnormality path, the coordinated relationship of each working area and the abnormal optimization model, and the autonomous optimization of the configuration of each working area is achieved, so that the working area with the voltage abnormality path is optimized in a targeted manner, while the working area without the voltage abnormality path maintains the current state of the thermal print head, thereby realizing autonomous regulation of the thermal print head in dynamic measurement.

[0146] In the dynamic measurement of the thermal print head, a high-voltage multi-channel dynamic measurement circuit is introduced. For the high-voltage multi-channel dynamic measurement circuit, the high-voltage multi-channel dynamic measurement circuit is mainly composed of several optocouplers, MOS tubes, triodes, isolation transformers and several resistors, capacitors and diodes.

[0147] For the circuits of KZ1, KT1, LT2, K1-Kn, refer to Fig.10 The working process of KZ1, KT1, LT2, and K1-Kn is that when the power supply needs to be turned on, a high level of 3.3V is output through the program to control the transistor Q1 to be turned on, and then the optocoupler U1 is controlled, and then the isolated power supply +12V1 is controlled to be turned on through the optocoupler output; when the high-voltage power supply needs to be turned off, a low level of 0V is output through the program to control the transistor Q1 to be turned off, and then the optocoupler U1 is controlled to disconnect the isolated power supply +12V1, and then Q2 and Q3 are disconnected.

[0148] The working process of KZ2 is to control U2 by outputting a pulse signal of a specific width through the program. U2 outputs a driving signal through R10 to the primary coil of the isolation transformer. The secondary coil induces the same pulse signal through R13 and C4 to control Q6 to turn on.

[0149] Therefore, the high-voltage multi-channel dynamic measurement circuit is composed of multiple channels with the same structure, and the circuit normally works between 30V and 600V. If the equivalent resistance value of each channel needs to be dynamically measured, it is necessary to close KT1 and KT2 while disconnecting KZ1 and KZ2, and then open K1, K2, K3...Kn in sequence, so as to measure the equivalent resistance of RL1, RL2, RL3...RLn respectively.

[0150] In an embodiment of the present invention, the method in the embodiment of the present invention is used to collect the position of the thermal print head; multiple voltage collection points are defined according to the position of the thermal print head and the three-dimensional model of the thermal print head; a voltage collection system is constructed based on multiple voltage collection points, corresponding circuit paths and corresponding orientations; in the voltage collection system, a dynamic measurement model is constructed based on the voltage signals collected by each voltage collection point, the corresponding collection channel and the working state of the thermal print head, and the dynamic measurement of the thermal print head is triggered based on the dynamic measurement, which is compatible with the overall consideration of the voltage signals collected by each voltage collection point, the corresponding collection channel and the working state of the thermal print head, and realizes multi-dimensional control of the voltage signals collected by each voltage collection point, the corresponding collection channel and the working state of the thermal print head, thereby ensuring the accuracy of the dynamic measurement model and thereby improving the accuracy of the dynamic measurement of the thermal print head.

[0151] Furthermore, in the dynamic measurement of the thermal print head, the voltage characteristics defined based on multiple voltage signals, corresponding acquisition channels and a combined recognition model are defined, and the corresponding working areas are matched according to the multiple voltage characteristics and the various working modules in the thermal print head; the voltage abnormality path is defined according to the reverse tracing of the voltage abnormality signal, and the configuration of each working area is optimized based on the voltage abnormality path, the synergistic relationship of each working area and the abnormal optimization model, which is compatible with the voltage abnormality path, the synergistic relationship of each working area and the overall consideration of the abnormal optimization model, and realizes the autonomous optimization of the configuration of each working area, so that the working area with the voltage abnormality path is targetedly optimized, and the working area without the voltage abnormality path maintains the current state of the thermal print head, thereby realizing autonomous regulation of the thermal print head in dynamic measurement.

[0152] See also Figure 8 , Figure 8 Schematic diagram of the structure of the dynamic measurement system of the thermal print head in the embodiment of the present invention.

[0153] like Figure 8 As shown, a dynamic measurement system for a thermal print head, the dynamic measurement system for a thermal print head comprises:

[0154] The acquisition module 21 is used to acquire the position of the thermal print head;

[0155] A voltage collection point module 22, used to define a plurality of voltage collection points according to the location of the thermal print head and a three-dimensional model of the thermal print head;

[0156] A voltage collection system module 23, used to construct a voltage collection system based on multiple voltage collection points, corresponding circuit paths and corresponding locations;

[0157] The dynamic measurement module 24 is used to build a dynamic measurement model based on the voltage signals collected by each voltage collection point, the corresponding collection channel and the working state of the thermal print head in the voltage collection system, and trigger the dynamic measurement of the thermal print head based on the dynamic measurement;

[0158] A working area module 25 is used to match the corresponding working area according to the multiple voltage features and each working module in the thermal print head in the dynamic measurement of the thermal print head based on the voltage features defined by the multiple voltage signals, the corresponding acquisition channels and the combined recognition model;

[0159] The state module 26 is used to define a voltage abnormality path according to the reverse tracing of the voltage abnormality signal, and optimize the configuration of each working area based on the voltage abnormality path, the cooperative relationship of each working area and the abnormality optimization model.

[0160] See also Fig. 9 , refer to the following Fig. 9 The electronic device 40 according to this embodiment of the present invention will be described. Fig. 9 The electronic device 40 shown is only an example and should not bring any limitation to the functions and scope of use of the embodiments of the present invention.

[0161] like Fig. 9 As shown, the electronic device 40 is in the form of a general computing device. The components of the electronic device 40 may include but are not limited to: at least one processing unit 41, at least one storage unit 42, and a bus 43 connecting different system components (including the storage unit 42 and the processing unit 41).

[0162] The storage unit stores program codes, which can be executed by the processing unit 41, so that the processing unit 41 executes the steps according to various exemplary embodiments of the present invention described in the above “Embodiment Method” section of this specification.

[0163] The storage unit 42 may include a readable medium in the form of a volatile storage unit, such as a random access memory unit (RAM) 421 and / or a cache memory unit 422 , and may further include a read-only memory unit (ROM) 423 .

[0164] The storage unit 42 may also include a program / utility 424 having a set (at least one) of program modules 425, such program modules 425 including but not limited to: an operating system, one or more application programs, other program modules, and program data, each of which or some combination may include an implementation of a network environment.

[0165] Bus 43 may represent one or more of several types of bus structures, including a memory unit bus or memory unit controller, a peripheral bus, an accelerated graphics port, a processing unit, or a local bus using any of a variety of bus architectures.

[0166] The electronic device 40 may also communicate with one or more external devices (e.g., keyboards, pointing devices, Bluetooth devices, etc.), one or more devices that enable a user to interact with the electronic device 40, and / or any device that enables the electronic device 40 to communicate with one or more other computing devices (e.g., routers, modems, etc.). Such communication may be performed via an input / output (I / O) interface 44. Furthermore, the electronic device 40 may also communicate with one or more networks (e.g., a local area network (LAN), a wide area network (WAN), and / or a public network, such as the Internet) via a network adapter 45. Fig. 9 As shown, the network adapter 45 communicates with other modules of the electronic device 40 via the bus 43. It should be understood that although Fig. 9 Not shown, other hardware and / or software modules may be used in conjunction with the electronic device 40, including but not limited to: microcode, device drivers, redundant processing units, external disk drive arrays, RAID systems, tape drives, and data backup planning systems.

[0167] Through the description of the above implementation, it is easy for those skilled in the art to understand that the example implementation described here can be implemented by software, or by software combined with necessary hardware. Therefore, the technical solution according to the implementation of the present disclosure can be embodied in the form of a software product, which can be stored in a non-volatile storage medium (which can be a CD-ROM, a USB flash drive, a mobile hard disk, etc.) or on a network, including several instructions to enable a computing device (which can be a personal computer, a server, a multi-parameter sensor device, or a network device, etc.) to execute the method according to the implementation of the present disclosure.

[0168] Those skilled in the art can understand that all or some of the steps in the various methods of the above embodiments can be completed by instructing related hardware through a program, and the program can be stored in a computer-readable storage medium, and the storage medium can include: a read-only memory (ROM), a random access memory (RAM), a disk or an optical disk, etc. In addition, it stores computer program instructions, and when the computer program instructions are executed by a computer, the computer executes the above method.

[0169] In addition, the dynamic measurement method and system of the thermal print head provided in the embodiment of the present invention are introduced in detail above. Specific examples are used herein to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. For general technicians in this field, according to the idea of ​​the present invention, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A dynamic measurement method for a thermal print head, characterized in that: Applicable to the dynamic measurement scenario of a thermal print head; the dynamic measurement method of the thermal print head includes: Collect the location of the thermal print head; Define multiple voltage collection points according to the location of the thermal print head and the three-dimensional model of the thermal print head; Construct a voltage collection system based on multiple voltage collection points, corresponding circuit paths and corresponding locations; In the voltage acquisition system, a dynamic measurement model is constructed based on the voltage signals collected at each voltage acquisition point, the corresponding acquisition channel and the working state of the thermal print head, and the dynamic measurement of the thermal print head is triggered based on the dynamic measurement; In the dynamic measurement of the thermal print head, based on the voltage features defined by the multiple voltage signals, the corresponding acquisition channels and the combined recognition model, the corresponding working area is matched according to the multiple voltage features and each working module in the thermal print head; A voltage abnormality path is defined according to the reverse tracing of the voltage abnormality signal, and the configuration of each working area is optimized based on the voltage abnormality path, the cooperative relationship of each working area and the abnormality optimization model.

2. The dynamic measurement method of a thermal print head according to claim 1, characterized in that: The collecting of the location of the thermal print head includes: Collect the working signal of thermal print head; Analyze the working signal of thermal print head; Acquiring the working space of the thermal print head based on the analysis of the working signal of the thermal print head; A plurality of position information according to the traversal of the working space of the thermal print head; The position of the thermal print head is defined according to a plurality of position information, a current time of the thermal print head and a position review logic.

3. The dynamic measurement method of a thermal print head according to claim 2, characterized in that: Defining a plurality of voltage collection points according to the location of the thermal print head and the three-dimensional model of the thermal print head includes: Freeze the location of the thermal print head; matching a corresponding circuit path based on the location of the thermal print head and the circuit portion of the thermal print head; constructing a three-dimensional model of the thermal print head based on the location of the thermal print head and the circumferential image of the thermal print head; A three-dimensional model of the associated thermal print head and circuit paths; defining a plurality of voltage collection areas according to a three-dimensional model of the thermal print head, a circuit path, and a state of the thermal print head; A plurality of voltage collection points are defined according to the traversal of a plurality of voltage collection areas.

4. The dynamic measurement method of a thermal print head according to claim 3, characterized in that: The voltage collection system is constructed based on multiple voltage collection points, corresponding circuit paths and corresponding positions, including: Freeze multiple voltage collection points; Matching corresponding circuit paths based on multiple voltage collection points and corresponding voltage collection areas; Associating voltage collection points, corresponding circuit paths, and corresponding orientations; Defining first system parameters according to voltage collection points and corresponding circuit paths; Defining the second system parameters according to the voltage collection points and the corresponding positions; A corresponding voltage acquisition system is matched based on the second system parameter, the first system parameter and the dynamic measurement state of the thermal print head.

5. The dynamic measurement method of a thermal print head according to claim 4, characterized in that: In the voltage acquisition system, a dynamic measurement model is constructed based on the voltage signals collected by each voltage acquisition point, the corresponding acquisition channel and the working state of the thermal print head, and the dynamic measurement of the thermal print head is triggered based on the dynamic measurement, including: In the voltage collection system, each voltage collection point is monitored in real time, and the voltage signal collected by each voltage collection point is defined; Collect the working status of the thermal print head, and associate the voltage signals collected by each voltage collection point, the corresponding collection channel and the working status of the thermal print head; A dynamic measurement model is constructed according to the voltage signals collected at each voltage collection point, the corresponding collection channel and the working state of the thermal print head; A dynamic measurement of the thermal print head is triggered based on the dynamic measurement.

6. The dynamic measurement method of a thermal print head according to claim 5, characterized in that: In the dynamic measurement of the thermal print head, based on multiple voltage signals, corresponding acquisition channels and voltage features defined by the combined recognition model, the corresponding working areas are matched according to the multiple voltage features and each working module in the thermal print head, including: In the dynamic measurement of thermal print heads, multiple voltage signals are frozen; Correlate multiple voltage signals and corresponding acquisition channels; A corresponding voltage signal combination is constructed according to the multiple voltage signals and the corresponding acquisition channels.

7. The dynamic measurement method of a thermal print head according to claim 6, characterized in that: In the dynamic measurement of the thermal print head, based on multiple voltage signals, corresponding acquisition channels and voltage features defined by the combined recognition model, the corresponding working areas are matched according to the multiple voltage features and each working module in the thermal print head, and further includes: Associating multiple voltage signal combinations and a combination recognition model, the combination recognition model is trained based on previous combination data; A voltage feature defined according to a combination of multiple voltage signals and a combination identification model; The corresponding working area is matched according to the multiple voltage characteristics and each working module in the thermal print head.

8. The dynamic measurement method of a thermal print head according to claim 7, characterized in that: The voltage abnormality path is defined according to the reverse tracing of the voltage abnormality signal, and the configuration of each working area is optimized based on the voltage abnormality path, the cooperative relationship of each working area and the abnormality optimization model, including: Monitor each working area in real time and collect abnormal voltage signals in each working area; Matching corresponding reverse tracing models according to nodes where multiple voltage abnormality signals are located and abnormality types of the multiple voltage abnormality signals, and triggering reverse tracing of the voltage abnormality signals based on the reverse tracing model; The voltage abnormality path is defined based on the reverse tracing of the voltage abnormality signal.

9. The dynamic measurement method of a thermal print head according to claim 8, characterized in that: The method further includes defining a voltage abnormality path according to the reverse tracing of the voltage abnormality signal, and optimizing the configuration of each working area based on the voltage abnormality path, the cooperative relationship of each working area and the abnormality optimization model. Associating the voltage abnormality path, the synergistic relationship of each working area and the abnormality optimization model; Optimize the configuration of each working area based on the voltage abnormality path, the coordinated relationship of each working area and the abnormality optimization model; The working area with the abnormal voltage path is optimized specifically, while the working area without the abnormal voltage path maintains the current state of the thermal print head.

10. A dynamic measurement system for a thermal print head, characterized in that: The dynamic measurement system of the thermal print head is applied to the dynamic measurement method of the thermal print head as claimed in any one of claims 1 to 9, and the dynamic measurement system of the thermal print head comprises: A collection module, used for collecting the location of the thermal print head; A voltage collection point module is used to define multiple voltage collection points according to the location of the thermal print head and the three-dimensional model of the thermal print head; A voltage collection system module is used to construct a voltage collection system based on multiple voltage collection points, corresponding circuit paths and corresponding locations; A dynamic measurement module is used to build a dynamic measurement model based on the voltage signals collected by each voltage collection point, the corresponding collection channel and the working state of the thermal print head in the voltage collection system, and trigger the dynamic measurement of the thermal print head based on the dynamic measurement; A working area module is used to match the corresponding working area according to the multiple voltage characteristics and each working module in the thermal print head in the dynamic measurement of the thermal print head based on the voltage characteristics defined by the multiple voltage signals, the corresponding acquisition channels and the combined recognition model; The state module is used to define a voltage abnormality path according to the reverse tracing of the voltage abnormality signal, and optimize the configuration of each working area based on the voltage abnormality path, the cooperative relationship of each working area and the abnormality optimization model.

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