Spray plate and thin film deposition equipment

Abstract

The invention discloses a spraying plate and thin film deposition equipment, the spraying plate comprises a base plate, a spraying hole array is arranged on the base plate, the spraying hole array is distributed in an inner ring hole array and an outer ring hole array, the inner ring hole array and the outer ring hole array are concentric, spraying holes in the inner ring hole array are inclined holes, and the spraying holes in the outer ring hole array are inclined holes. The spraying holes of the outer ring hole array are straight holes. Compared with an existing spraying plate with a single inclined hole, the spraying holes of the outer ring hole array are arranged to be straight holes, airflow distribution of the edge of the spraying plate is increased, namely process gas of the edge of a film thickness outline is increased, the edge of the film thickness outline is prevented from sinking downwards, and therefore the film thickness uniformity is improved, the requirement for the film thickness range is met, and the spraying plate is suitable for large-scale popularization and application. And the technological performance of the product is optimized.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a shower plate and a thin film deposition device. Background Art

[0002] In thin film deposition technology, especially in the manufacturing process of solar cells, the uniformity of amorphous silicon (a-Si) thin films is crucial to improving device performance. Amorphous silicon has been widely used in the photovoltaic industry due to its relatively low preparation cost, high material utilization rate and large-scale production. However, in the actual production process, due to the influence of various factors, the thickness distribution of amorphous silicon thin films is often difficult to achieve an ideal uniform state. In the actual production process, when an inclined hole spray plate is used as a reaction gas distribution device, a problem is often encountered: the thickness profile of the amorphous silicon process film often appears concave at the edge. The uneven film thickness not only affects the performance of the amorphous silicon film, but also limits the adjustment of the amorphous silicon process film thickness range, and may also affect the stability of the final product. Summary of the invention

[0003] The embodiments of the present invention provide a shower plate and a thin film deposition device, aiming to solve the problem that the existing inclined hole shower plate is concave at the edge of the film thickness profile.

[0004] In a first aspect, the present invention provides a spray plate, comprising:

[0005] A substrate is provided with a spray hole array, wherein the spray hole array is distributed in an inner circle hole array and an outer circle hole array, the inner circle hole array is concentric with the outer circle hole array, the spray holes in the inner circle hole array are inclined holes, and the spray holes in the outer circle hole array are straight holes.

[0006] Furthermore, the width of the outer circle hole array is w1, the radius of the spray hole array is r, and w1 and r satisfy: w1:r=20-30%.

[0007] Furthermore, the width of the inner circle hole array is w2, the radius of the spray hole array is r, and w2 and r satisfy: w2:r=70-80%.

[0008] Furthermore, the lower surface of the substrate is a spray surface, and the diameter of the straight hole on the side facing the spray surface is the same as the diameter of the inclined hole on the side facing the spray surface.

[0009] Furthermore, the upper surface of the substrate is an air inlet surface, the lower surface of the substrate is a spray surface, the straight hole includes a first choke hole and a straight through hole connected in sequence, the first choke hole passes through the air inlet surface, the straight through hole passes through the spray surface, and the diameter of the straight through hole is larger than the diameter of the first choke hole.

[0010] Furthermore, the upper surface of the substrate is an air inlet surface, the lower surface of the substrate is a spray surface, the inclined hole includes a second choke hole, a transition hole and a tapered hole which are connected in sequence, the second choke hole passes through the air inlet surface, the tapered hole passes through the spray surface, the transition hole has a diameter larger than the second choke hole, and the tapered hole has a diameter larger than the transition hole.

[0011] Furthermore, the narrow end of the tapered hole is communicated with the transition hole, and the wide end of the tapered hole passes through the spray surface.

[0012] Furthermore, the outer circle hole array is annular, and the inner circle hole array is circular.

[0013] Furthermore, the density of the inner circle hole array is the same as the density of the outer circle hole array.

[0014] In a second aspect, the present invention further provides a thin film deposition device, comprising the above-mentioned shower plate.

[0015] The present invention provides a spray plate and a thin film deposition device, wherein the spray plate comprises a substrate, on which a spray hole array is arranged, the spray hole array is distributed in an inner circle hole array and an outer circle hole array, the inner circle hole array is concentric with the outer circle hole array, the spray holes in the inner circle hole array are inclined holes, and the spray holes in the outer circle hole array are straight holes. Compared with the existing spray plate with a single inclined hole, the present application sets the spray holes in the outer circle hole array as straight holes, thereby increasing the airflow distribution at the edge of the spray plate, that is, increasing the process gas at the edge of the film thickness profile, avoiding the concave edge of the film thickness profile, thereby improving the uniformity of the film thickness, meeting the requirements of the film thickness range, and optimizing the process performance of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying any creative work.

[0017] Figure 1 A schematic diagram of the three-dimensional structure of a spray plate according to an embodiment of the present invention is shown;

[0018] Figure 2 A schematic top view of a spray plate according to an embodiment of the present invention is shown;

[0019] Figure 3 Shown Figure 2 BB cross-sectional diagram;

[0020] Figure 4 A bottom view schematic diagram of a spray plate according to an embodiment of the present invention is shown;

[0021] Figure 5 Shown Figure 4 A magnified view of part A;

[0022] Figure 6 Shown Figure 3 A magnified view of part B;

[0023] Figure 7 The film thickness curves of a single straight hole spray plate, a single inclined hole spray plate, and a combination of straight and inclined holes are shown;

[0024] Reference numerals:

[0025] 1. Base plate; 11. Air inlet surface; 12. Spray surface; 2. Inner circle hole array; 3. Outer circle hole array; 4. Straight hole; 41. First choke hole; 42. Straight through hole; 5. Oblique hole; 51. Second choke hole; 52. Transition hole; 53. Conical hole. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] The directional terms mentioned in the present invention, such as "upper", "lower", "front", "back", "left", "right", "inner", "outer", "side", etc., are only referenced to the directions of the attached drawings. Therefore, the directional terms used are used to illustrate and understand the present invention, but are not used to limit the present invention. In addition, in the drawings, structures with similar or identical structures are represented by the same reference numerals.

[0028] In the field of thin film deposition, when using an inclined hole shower plate for amorphous silicon process, a significant technical challenge is to control the uniformity of the film thickness profile. Specifically, during the process, it was observed that the film thickness generally showed a concave trend in the edge area, which directly led to the uneven distribution of film thickness. This non-uniformity not only affects the performance parameters of the film, such as conductivity, transmittance and mechanical strength, but may also affect the compatibility of subsequent process steps and the reliability of the final product. Although the overall film thickness profile can be effectively optimized by adjusting the airflow of the shower plate, the concave at the edge of the wafer cannot be solved.

[0029] To this end, the embodiments of the present invention provide a spray plate and a thin film deposition device to solve the problem that the existing inclined hole spray plate is concave at the edge of the film thickness profile. The airflow distribution is optimized by combining straight holes and inclined holes, thereby avoiding the concave edge of the film thickness and improving the uniformity of the film thickness.

[0030] The embodiment of the present invention solves the above-mentioned problem of edge concavity, and the specific solution is:

[0031] The spray plate is set to an inner and outer circle hole array structure, with the inner circle being oblique holes and the outer circle being straight holes. Compared with oblique holes, straight holes have smaller flow resistance, so straight holes can increase the gas flow rate. Then setting the outer circle as straight holes increases the gas flow rate at the edge of the spray plate, so that more reaction gas reaches the edge area to participate in deposition, reducing the film thickness difference between the edge and the center area. This can effectively improve the problem of concave film thickness profile at the edge, improve film thickness uniformity, and meet customer requirements for film thickness range.

[0032] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0033] See also Figure 1-Figure 6 An embodiment of the present invention shows a spray plate, comprising: a substrate 1, on which a spray hole array is provided, wherein the spray hole array is distributed in an inner circle hole array 2 and an outer circle hole array 3, the inner circle hole array 2 is concentric with the outer circle hole array 3, the spray holes in the inner circle hole array 2 are inclined holes 5, and the spray holes in the outer circle hole array 3 are straight holes 4.

[0034] Specifically, the substrate 1 is a circular plate structure as a whole, and a circle of mounting steps is provided on the outer periphery of the substrate 1, and a plurality of fixing holes are provided on the mounting steps, and the substrate 1 is fixed through the fixing holes. The middle of the substrate 1 sinks, so that an air intake area is formed inside the substrate 1, and the air intake area is above the plate body. A plurality of spray holes are provided on the plate body, and penetrate the plate body from top to bottom, so that the process gas can enter the spray holes from the air intake area and spray downward through the spray holes. The spray holes are distributed in an array on the circular substrate 1, and the spray hole array is arranged in a circular array, that is, the holes are distributed along concentric circles. The entire spray hole array includes two parts, one part is the inner circle hole array 2, and the other part is the outer circle hole array 3, the inner circle hole array 2 and the outer circle hole array 3 are concentrically arranged, the inner circle hole array 2 is on the inner side, and the outer circle hole array 3 is on the outer side, that is, the outer circle hole array 3 is wrapped around the outer periphery of the inner circle hole array 2. The hole type of the spray holes of the inner circle hole array 2 is different from that of the outer circle hole array 3. The hole type of the spray holes of the inner circle hole array 2 is an inclined hole 5. Compared with the straight hole 4, the granularity performance of the process will be better. However, the single inclined hole 5 will face the problem of the concave edge of the film thickness profile. The concave edge of the film thickness profile is mainly due to the design of the machine, which leads to a smaller airflow distribution at the edge of the spray plate. Therefore, the concave phenomenon can be improved by increasing the airflow distribution at the edge of the spray plate. In this embodiment, the hole type of the spray holes of the outer circle hole array 3 is set to a straight hole 4. Compared with the inclined hole 5, the straight hole 4 has a smaller flow resistance, so the gas flow rate is larger. This can compensate for the defect of smaller airflow distribution at the edge, making the airflow distribution more uniform as a whole. The film thickness of the wafer finally deposited is more uniform, and the concave edge of the film thickness profile is avoided.

[0035] Through this embodiment, the spray holes of the inner circle hole array 2 are set to the inclined holes 5, and the spray holes of the outer circle hole array 3 are set to the straight holes 4 in a manner of combining the straight holes 4 and the inclined holes 5. The straight holes 4 have a small flow resistance and can pass a large gas flow rate, thereby increasing the gas flow rate at the edge of the spray plate, allowing more reaction gas to reach the edge area to participate in deposition, compensating for the defect of smaller airflow distribution at the edge, making the airflow distribution more uniform as a whole, avoiding the concave edge of the film thickness profile, improving the uniformity of the film thickness, meeting the customer's requirements for the film thickness range, and optimizing the product's process performance.

[0036] Reference Figure 1 and Figure 2In one embodiment, the outer circle hole array 3 is annular, and the inner circle hole array 2 is circular. Specifically, the inner circle hole array 2 is circular, that is, the spray hole distribution of the inner circle hole array is circular as a whole, and the spray holes are symmetrically distributed relative to the center of the circle in the inner circle, for example, they can be distributed equidistantly according to the planned grid, or they can be symmetrically distributed radially according to the center of the circle. Similarly, the outer circle hole array 3 can also be distributed in the same way as the inner circle hole array 2. The spray hole distribution of the outer circle hole array 3 is annular as a whole, and the outer circle hole array 3 is wrapped around the outer periphery of the inner circle hole array 2, that is, the inner circle hole array 2 is an inner circle, and the outer circle hole array 3 is an outer ring, and the spray holes of the two are closely transitioned. The spray holes of the spray plate of this structure can achieve a higher density, and the uniformity of gas distribution is good, which improves the effect of thin film deposition, and has a simple structure and convenient processing.

[0037] Continue to refer to Figure 1 and Figure 2 In one embodiment, the density of the inner circle hole array 2 is the same as the density of the outer circle hole array 3. Specifically, in order to ensure the uniformity of the gas distribution of the shower plate, the distribution density of the shower plate of the inner circle hole array 2 is kept the same as the distribution density of the shower plate of the outer circle hole array 3, ensuring that the gas distribution of the shower surface 12 of the entire substrate 1 is more uniform, which helps to reduce the flow field non-uniformity in the edge area, thereby reducing the probability of problems such as edge concave. Moreover, the same hole density makes the design of the shower plate simpler, and it is easy to calculate and optimize the size and spacing of the holes, reducing the production cost and manufacturing difficulty. In addition, the same hole density means that consistent process parameters (such as gas flow, pressure, etc.) can be used, which facilitates the control and optimization of the process and helps to improve the stability and repeatability of the process.

[0038] Reference Figure 2-Figure 4 In one embodiment, the width of the outer circle hole array 3 is w1, the radius of the spray hole array is r, and w1 and r satisfy: w1:r=20-30%. Specifically, the radius of the entire spray hole array (that is, the outer circle hole array 3 plus the inner circle hole array 2) is r, the width of the outer circle hole array 3 is w1, and the width of the outer circle hole array 3 occupies a range of 20-30% of the radius of the spray hole array. Exemplarily, w1:r=20%. Exemplarily, w1:r=30%. Exemplarily, w1:r=25%. Within this range, the width of the outer circle hole array 3 can effectively balance the flow field distribution of the inner circle and the outer circle, ensure that the gas distribution on the spray surface 12 of the entire substrate 1 is more uniform, and help improve the uniformity and quality of thin film deposition.

[0039] If the width of the outer circle hole array 3 exceeds 30%, the flow field in the outer circle area will be too dense, which may cause local oversaturation and lead to excessive deposition rate in the edge area, thus affecting the uniformity of the film. Too many outer circle holes may reduce the flow field intensity in the inner circle area, causing the deposition rate in the central area to decrease, further exacerbating the problem of uneven film thickness. If the width of the outer circle hole array 3 is less than 20%, the flow field distribution in the outer circle area may be insufficient, and the edge effect cannot be effectively balanced, resulting in uneven flow field in the edge area and increasing the risk of concave edges. An outer circle hole array 3 that is too narrow may not be able to provide sufficient gas supply, resulting in uneven overall flow field distribution, affecting the uniformity and quality of the film. Therefore, the optimal width range of the outer circle hole array 3 is 20-30% of the radius of the spray hole array.

[0040] Continue to refer to Figure 2-Figure 4 In one embodiment, the width of the inner circle hole array 2 is w2, the radius of the spray hole array is r, and w2 and r satisfy: w2:r=70-80%. Specifically, the radius of the entire spray hole array (that is, the outer circle hole array 3 plus the inner circle hole array 2) is r, the width of the inner circle hole array 2 is w2, and the width of the inner circle hole array 2 occupies a range of 70-80% of the radius of the spray hole array. Exemplarily, w2:r=70%. Exemplarily, w2:r=80%. Exemplarily, w2:r=75%. Within this range, the width of the inner circle hole array 2 can effectively ensure uniform flow field distribution in the central area, and at the same time cooperate with the outer circle hole array 3 to ensure that the gas distribution on the spray surface 12 of the entire substrate 1 is more uniform, which helps to improve the uniformity and quality of thin film deposition.

[0041] If the width of the inner circle hole array 2 exceeds 80%, the flow field in the central area may be too dense, which may cause local oversaturation and lead to excessive deposition rate in the central area, thus affecting the uniformity of the film. Too many inner circle holes may reduce the flow field intensity in the outer circle area, resulting in a decrease in the deposition rate in the edge area, further exacerbating the problem of uneven film thickness. If the width of the inner circle hole array 2 is less than 70%, the flow field distribution in the central area may be insufficient, and sufficient gas or liquid supply cannot be provided, thereby affecting the deposition rate and uniformity in the central area. An inner circle hole array 2 that is too narrow may not be able to effectively balance the flow field distribution of the entire spray plate, resulting in uneven overall flow field distribution, affecting the quality and performance of the film. Therefore, the optimal width range of the inner circle hole array 2 is 70-80% of the radius of the spray hole array.

[0042] Reference Figure 3In one embodiment, the lower surface of the substrate 1 is a spray surface 12, and the diameter of the straight hole 4 facing the spray surface 12 is the same as the diameter of the inclined hole 5 facing the spray surface 12. Specifically, the upper surface of the plate body of the sinking part of the substrate 1 is the air inlet surface 11, and the lower surface is the spray surface 12. The diameters of the straight holes 4 and the inclined holes 5 facing the spray surface 12 remain the same, which can ensure that the gases ejected from these holes have similar initial velocities and flow rates, which helps to form a more uniform flow field distribution on the entire spray surface 12, thereby improving the uniformity and quality of thin film deposition. In addition, the same diameter can reduce the unevenness of the local flow field, avoid excessively high or low flow rates in certain areas, and thus reduce edge effects and center effects.

[0043] Reference Figure 5 and Figure 6 In one embodiment, the upper surface of the substrate 1 is the air inlet surface 11, the lower surface of the substrate 1 is the spray surface 12, and the straight hole 4 includes a first choke hole 41 and a straight hole 42 which are connected in sequence, the first choke hole 41 passes through the air inlet surface 11, the straight hole 42 passes through the spray surface 12, and the diameter of the straight hole 42 is larger than the diameter of the first choke hole 41. Specifically, the upper surface of the plate body of the sinking part of the substrate 1 is the air inlet surface 11, and the lower surface is the spray surface 12. The straight hole 4 of this embodiment is a two-stage structure, including a first choke hole 41 and a straight hole 42, both of which are cylindrical through holes, the first choke hole 41 is on the top, and the straight hole 42 is on the bottom, and the two are connected, the first choke hole 41 passes through the upper air inlet surface 11, and the straight hole 42 passes through the lower spray surface 12. The process gas enters the first choke hole 41 from the air inlet surface 11, and then is ejected from the spray surface 12 through the straight hole 42. The diameter of the straight hole 42 is larger than the diameter of the first choke hole 41, that is, the first choke hole 41 is narrower and the straight hole 42 is wider. The narrower first choke hole 41 can play a flow limiting role. By reducing the aperture to control the gas flow entering the straight hole 42, excessive flow fluctuations can be avoided, and it can ensure that the gas has reached a certain pressure and flow rate before entering the straight hole 42, thereby achieving more precise flow control. Moreover, the first choke hole 41 can produce a significant pressure drop, thereby forming a stable pressure difference between the air inlet surface 11 and the spray surface 12. This pressure difference helps to maintain the pressure balance inside the substrate 1 and prevent the gas from generating turbulence or uneven flow inside the substrate 1. In addition, the narrower choke hole can reduce the risk of large particle impurities entering the interior of the substrate 1, thereby reducing the possibility of hole clogging. The wider through hole 42 allows more gas to pass through, thereby forming a uniform flow field distribution on the spray surface 12, which helps to improve the uniformity and quality of thin film deposition. In addition, the wider through hole 42 can ensure that the gas has a uniform speed and flow rate when it is ejected, thereby forming a uniform spray effect on the spray surface 12.

[0044] Continue to refer to Figure 5 and Figure 6 In one embodiment, the upper surface of the substrate 1 is the air inlet surface 11, the lower surface of the substrate 1 is the spray surface 12, the inclined hole 5 includes a second choke hole 51, a transition hole 52 and a tapered hole 53 which are connected in sequence, the second choke hole 51 passes through the air inlet surface 11, the tapered hole 53 passes through the spray surface 12, the diameter of the transition hole 52 is larger than that of the second choke hole 51, and the diameter of the tapered hole 53 is larger than that of the transition hole 52. The narrow end of the tapered hole 53 is connected to the transition hole 52, and the wide end of the tapered hole 53 passes through the spray surface 12. Specifically, the upper surface of the plate body of the sunken part of the substrate 1 is the air inlet surface 11, and the lower surface is the spray surface 12. The inclined hole 5 of this embodiment is a three-stage structure, including a second choke hole 51, a transition hole 52 and a tapered hole 53. The second choke hole 51 and the transition hole 52 are both cylindrical through holes. The second choke hole 51 is on the top, the transition hole 52 is in the middle, and the tapered hole 53 is on the bottom. The three are connected. The second choke hole 51 passes through the upper air inlet surface 11. The second choke hole 51 is connected to the tapered hole 53 through the transition hole 52. The narrow end of the tapered hole 53 is connected to the transition hole 52 upward, and the wide end of the tapered hole 53 passes through the lower spray surface 12 downward. The process gas enters the second choke hole 51 from the air inlet surface 11, then enters the tapered hole 53 through the transition hole 52, and finally sprays out from the spray surface 12 through the tapered hole 53. Among them, the diameter of the second choke hole 51 is the same as that of the first choke hole 41, the diameter of the transition hole 52 is larger than that of the second choke hole 51, and the diameter of the tapered hole 53 is larger than that of the transition hole 52, that is, the second choke hole 51 is the narrowest, the transition hole 52 is wider, and the tapered hole 53 is the widest. The function of the second choke hole 51 is the same as that of the first choke hole 41, which will not be repeated here. The transition hole 52 with a diameter larger than that of the second choke hole 51 can smoothly expand the flow channel and reduce sudden changes in flow velocity, thereby helping the gas to smoothly transition to the tapered hole 53, which helps to reduce turbulence and uneven flow and ensure the stability of the flow field. The design of the tapered hole 53 allows the gas to diffuse rapidly near the spray surface 12 to form a uniform spray effect. The wide end of the tapered hole 53 can cover a larger area to ensure that the gas distribution on the spray surface 12 is more uniform.

[0045] The embodiment of the present invention further provides a thin film deposition device, including the shower plate of the above embodiment. Specifically, the shower plate has been described in detail in the above embodiment, and for the sake of brevity of the description, it will not be repeated here.

[0046] like Figure 7 As shown, Figure 7The film thickness curves are for a single straight hole 4 type spray plate (straight hole SHD), a single inclined hole 5 type spray plate (inclined hole SHD), and a straight hole 4 and inclined hole 5 combined spray plate (straight hole & inclined hole combined SHD). The ordinate in the figure is the normalized film thickness, and the abscissa is the radius (mm). It can be seen from the figure that the film thickness deposited by the spray plate combining straight hole 4 and inclined hole 5 has a better uniformity between 130-150. Therefore, by adopting the spray plate of this embodiment, the uniformity of the film thickness is improved, the customer's requirements for the film thickness range are met, the quality of thin film deposition is improved, and the process performance of the product is optimized.

[0047] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of various equivalent modifications or substitutions within the technical scope disclosed by the present invention, and these modifications or substitutions should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be based on the protection scope of the claims.

Claims

1. A spray plate, characterized in that: include: A substrate is provided with a spray hole array, wherein the spray hole array is distributed in an inner circle hole array and an outer circle hole array, the inner circle hole array is concentric with the outer circle hole array, the spray holes in the inner circle hole array are inclined holes, and the spray holes in the outer circle hole array are straight holes.

2. The shower plate according to claim 1, characterized in that: The width of the outer circle hole array is w1, the radius of the spray hole array is r, and w1 and r satisfy: w1:r=20-30%.

3. The shower plate according to claim 1, characterized in that: The width of the inner circle hole array is w2, the radius of the spray hole array is r, and w2 and r satisfy: w2: r = 70-80%.

4. The shower plate according to claim 1, characterized in that: The lower surface of the substrate is a spray surface, and the diameter of the straight hole on the side facing the spray surface is the same as the diameter of the inclined hole on the side facing the spray surface.

5. The shower plate according to claim 1, characterized in that: The upper surface of the substrate is an air inlet surface, the lower surface of the substrate is a spray surface, the straight hole includes a first choke hole and a straight through hole which are connected in sequence, the first choke hole passes through the air inlet surface, the straight through hole passes through the spray surface, and the diameter of the straight through hole is larger than the diameter of the first choke hole.

6. The shower plate according to claim 1, characterized in that: The upper surface of the substrate is an air inlet surface, the lower surface of the substrate is a spray surface, the inclined hole includes a second choke hole, a transition hole and a tapered hole which are connected in sequence, the second choke hole passes through the air inlet surface, the tapered hole passes through the spray surface, the transition hole has a diameter larger than the second choke hole, and the tapered hole has a diameter larger than the transition hole.

7. The shower plate according to claim 6, characterized in that: The narrow end of the tapered hole is communicated with the transition hole, and the wide end of the tapered hole passes through the spray surface.

8. The shower plate according to claim 1, characterized in that: The outer circle hole array is annular, and the inner circle hole array is circular.

9. The shower plate according to claim 1, characterized in that: The density of the inner circle hole array is the same as the density of the outer circle hole array.

10. A thin film deposition device, characterized in that: It comprises a spray plate as described in any one of claims 1 to 9.

Images