Electroplating solution and plating layer

Abstract

The invention discloses electroplating liquid and a plating layer, and relates to the technical field of electroplating. The electroplating liquid comprises a soluble nickel compound, a soluble phosphorus compound, silicon carbide, graphene, a first additive and a second additive, the first additive comprises alkyl sulfonate, and the second additive comprises a naphthalene sulfonic acid formaldehyde condensate and ester sulfonate. Alkyl sulfonate in the first additive can effectively eliminate stress and reduce the brittleness of a plating layer, a naphthalene sulfonic acid-formaldehyde condensate in the second additive can effectively disperse silicon carbide and graphene, and ester sulfonate in the second additive can effectively wet silicon carbide and graphene. The silicon carbide and the graphene can be uniformly dispersed in the plating solution, so that the problems of aggregation and sedimentation of the silicon carbide and the graphene are avoided, the uniform distribution of the silicon carbide and the graphene in an electroplated coating is conveniently improved, and the hardness, the wear resistance and the flame retardant property of the coating are effectively improved.

Description

Technical Field

[0001] The present application relates to the technical field of electroplating, and in particular to an electroplating solution and a plating layer. Background Art

[0002] Nickel has high corrosion resistance, wear resistance and conductivity, and is often used in plating to improve the performance of plated parts. In the nickel electroplating process, phosphorus sources and silicon carbide are usually incorporated. The resulting nickel-phosphorus-silicon carbide composite coating not only exhibits excellent hardness characteristics, but also has excellent flame retardant properties, providing solid support for the protection and functionalization of the material. However, although the addition of phosphorus sources and silicon carbide enhances the hardness of the coating to a certain extent, its improvement effect still faces inherent limitations.

[0003] In related technologies, graphene has good electrical conductivity, thermal stability and mechanical strength. In order to further improve the performance of the coating, graphene is usually added to the nickel-phosphorus source-silicon carbide plating solution system, which can not only significantly enhance the hardness of the coating, but also further optimize its conductive properties.

[0004] However, in the nickel-phosphorus source-silicon carbide-graphene plating solution system, graphene and silicon carbide particles are prone to agglomeration and sedimentation, which seriously restricts their effective distribution in the coating and affects the final performance of the coating. Summary of the invention

[0005] In view of this, the present application provides an electroplating solution and a plating layer.

[0006] The embodiments of the present application are implemented as follows: in the first aspect, the embodiments of the present application provide an electroplating solution, comprising: a soluble nickel compound, a soluble phosphorus compound, silicon carbide, graphene, a first additive and a second additive, wherein the first additive comprises a hydrocarbon sulfonate, and the second additive comprises a naphthalenesulfonic acid formaldehyde condensate and an ester sulfonate.

[0007] Optionally, in some embodiments of the present application, the hydrocarbon sulfonate includes one or more of hydroxymethyl sulfonate, allyl sulfonate, and propargyl sulfonate; and / or

[0008] The naphthalenesulfonic acid formaldehyde condensate includes one or more of sodium naphthalenesulfonate formaldehyde condensate, sodium dibutylnaphthalenesulfonate formaldehyde condensate, sodium methylnaphthalenesulfonate formaldehyde condensate, and benzylnaphthalenesulfonic acid formaldehyde condensate; and / or

[0009] The ester sulfonate includes one or more of dihexyl sodium sulfosuccinate and dioctyl sodium sulfosuccinate.

[0010] Optionally, in some embodiments of the present application, the hydroxymethane sulfonate includes sodium hydroxymethane sulfonate, potassium hydroxymethane sulfonate; and / or

[0011] The allyl sulfonate includes sodium allyl sulfonate and potassium allyl sulfonate; and / or

[0012] The propargyl sulfonate includes sodium propargyl sulfonate and potassium propargyl sulfonate.

[0013] Optionally, in some embodiments of the present application, the soluble nickel compound includes one or more of nickel sulfamate, nickel chloride, nickel sulfate, and nickel acetate; and / or

[0014] The soluble phosphorus compound comprises phosphoric acid; and / or

[0015] The average particle size of the silicon carbide is 1 nm to 1000 nm; and / or

[0016] The average particle size of the graphene is 0.15 μm to 0.35 μm.

[0017] Optionally, in some embodiments of the present application, in the electroplating solution:

[0018] The mass concentration of the soluble nickel compound is 13 g / L to 500 g / L;

[0019] The mass concentration of the soluble phosphorus compound is 15 g / L to 30 g / L;

[0020] The mass concentration of the silicon carbide is 20 g / L to 100 g / L;

[0021] The mass concentration of the graphene is 0.1 g / L to 5 g / L;

[0022] The mass concentration of the first additive is 0.001 g / L to 0.003 g / L;

[0023] The mass concentration of the second additive is 1 g / L to 3 g / L;

[0024] The balance is water.

[0025] Optionally, in some embodiments of the present application, the soluble nickel compound includes nickel sulfamate and nickel chloride; wherein the mass concentration of the nickel sulfamate is 440g / L to 480g / L, and the mass concentration of the nickel chloride is 13g / L to 20g / L.

[0026] Optionally, in some embodiments of the present application, in the second additive, the mass concentration of the naphthalenesulfonic acid formaldehyde condensate is 1 g / L to 3 g / L; the mass concentration of the ester sulfonate is 1.2 g / L to 2.4 g / L.

[0027] Optionally, in some embodiments of the present application, the electroplating solution includes: 460 g / L nickel sulfamate, 15 g / L nickel chloride, 25 g / L phosphoric acid, 60 g / L silicon carbide, 1 g / L graphene, 0.002 g / L sodium propargyl sulfonate, 1.8 g / L sodium naphthalenesulfonate formaldehyde condensate, 1.8 g / L sodium dihexyl sulfonate succinate, and the balance is water.

[0028] In a second aspect, an embodiment of the present application further provides a coating, which is obtained by electroplating with the above-mentioned electroplating solution.

[0029] Optionally, in some embodiments of the present application, the thickness of the coating is 1 μm to 5 μm; and / or

[0030] The electroplating conditions include: the pH of the electroplating solution is 2-5; the temperature of the electroplating solution is 50°C-55°C; the current density of the electroplating is 0.3A / dm 2 ~1.0A / dm 2 ; The electroplating time is 15min~45min.

[0031] The electroplating solution provided in the present application includes a soluble nickel compound, a soluble phosphorus compound, silicon carbide and graphene. The soluble nickel compound, as the source of the main component nickel, improves the strength and corrosion resistance of the coating substrate, makes it have good adhesion and conductivity, and can effectively protect the substrate from environmental factors. The addition of phosphorus in the soluble phosphorus compound can improve the hardness and wear resistance of the coating. Silicon carbide, as a reinforcing material, can significantly improve the hardness and wear resistance of the coating, as well as the bonding strength with the substrate, and also increases the thermal stability and anti-oxidation of the coating. The addition of graphene can further enhance the hardness and corrosion resistance of the coating, and improve the electrical conductivity and thermal conductivity of the coating. This is mainly based on the fact that graphene itself has high hardness and strength, and can form hard points in the coating, thereby improving the overall hardness of the coating. The two-dimensional structure of graphene enables it to disperse and withstand stress during friction, thereby reducing the wear of the coating. The synergistic effect of soluble nickel compounds, soluble phosphorus compounds, silicon carbide and graphene can effectively improve the performance of the coating.

[0032] The electroplating solution provided in the present application also includes a first additive and a second additive. The hydrocarbon sulfonate in the first additive can effectively eliminate stress and reduce the brittleness of the coating. The naphthalenesulfonic acid formaldehyde condensate in the second additive can effectively disperse silicon carbide and graphene. The ester sulfonate in the second additive can effectively wetting silicon carbide and graphene, so that silicon carbide and graphene can be evenly dispersed in the plating solution, avoiding the problem of aggregation and sedimentation of silicon carbide and graphene, facilitating the improvement of the uniform distribution of silicon carbide and graphene in the electroplated coating, filling the holes or defects in the coating, and enhancing the density of the coating, thereby effectively improving the hardness, wear resistance and flame retardancy of the coating. DETAILED DESCRIPTION

[0033] The technical solutions in the embodiments of the present application will be described clearly and completely below. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present application. In addition, it should be understood that the specific embodiments described herein are only used to illustrate and explain the present application, and are not used to limit the present application.

[0034] In the description of this application, the term "including" means "including but not limited to." The terms first, second, third, etc. are used merely as labels and do not impose numerical requirements or establish a sequence.

[0035] In this application, "and / or" describes the association relationship of associated objects, indicating that there may be three relationships. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. A and B can be singular or plural.

[0036] In the present application, "at least one" means one or more, and "plurality" means two or more. "One or several", "one or more", "at least one of the following" or similar expressions refer to any combination of these items, including any combination of single items or plural items. For example, "at least one of a, b, or c", or "at least one of a, b, and c" can all mean: a, b, c, ab (i.e., a and b), ac, bc, or abc, where a, b, c can be single or multiple, respectively.

[0037] Various embodiments of the present application may be presented in the form of a range; it should be understood that the description in the form of a range is only for convenience and brevity, and should not be understood as a rigid limitation on the scope of the present application; therefore, the range description should be considered to have specifically disclosed all possible sub-ranges and single numerical values ​​within the range. For example, the range description from 1 to 6 should be considered to have specifically disclosed sub-ranges, such as from 1 to 3, from 1 to 4, from 1 to 5, from 2 to 4, from 2 to 6, from 3 to 6, etc., as well as single numbers within the range, such as 1, 2, 3, 4, 5 and 6, which apply regardless of the range. In addition, whenever a numerical range is indicated herein, it is meant to include any cited number (fractional or integer) within the indicated range.

[0038] The technical solution of this application is as follows:

[0039] An embodiment of the present application provides an electroplating solution, comprising: a soluble nickel compound, a soluble phosphorus compound, silicon carbide, graphene, a first additive and a second additive, wherein the first additive comprises an hydrocarbon sulfonate, and the second additive comprises a naphthalenesulfonic acid formaldehyde condensate and an ester sulfonate.

[0040] It should be noted that the hydrocarbyl sulfonate refers to a sulfonate containing a hydrocarbyl group, and the ester sulfonate refers to a sulfonate containing an ester group.

[0041] The electroplating solution provided in the present application includes a soluble nickel compound, a soluble phosphorus compound, silicon carbide and graphene. The soluble nickel compound, as the source of the main component nickel, improves the strength and corrosion resistance of the coating substrate, makes it have good adhesion and conductivity, and can effectively protect the substrate from environmental factors. The addition of phosphorus in the soluble phosphorus compound can improve the hardness and wear resistance of the coating. Silicon carbide, as a reinforcing material, can significantly improve the hardness and wear resistance of the coating, as well as the bonding strength with the substrate, and also increases the thermal stability and anti-oxidation of the coating. The addition of graphene can further enhance the hardness and corrosion resistance of the coating, and improve the electrical conductivity and thermal conductivity of the coating. This is mainly based on the fact that graphene itself has high hardness and strength, and can form hard points in the coating, thereby improving the overall hardness of the coating. The two-dimensional structure of graphene enables it to disperse and withstand stress during friction, thereby reducing the wear of the coating. The synergistic effect of soluble nickel compounds, soluble phosphorus compounds, silicon carbide and graphene can effectively improve the performance of the coating.

[0042] The electroplating solution provided in the present application also includes a first additive and a second additive. The hydrocarbon sulfonate in the first additive can effectively eliminate stress and reduce the brittleness of the coating. The naphthalenesulfonic acid formaldehyde condensate in the second additive can effectively disperse silicon carbide and graphene. The ester sulfonate in the second additive can effectively wetting silicon carbide and graphene, so that silicon carbide and graphene can be evenly dispersed in the plating solution, avoiding the problem of aggregation and sedimentation of silicon carbide and graphene, facilitating the improvement of the uniform distribution of silicon carbide and graphene in the electroplated coating, filling the holes or defects in the coating, and enhancing the density of the coating, thereby effectively improving the hardness, wear resistance and flame retardancy of the coating.

[0043] In some embodiments, the hydrocarbon sulfonate includes one or more of hydroxymethyl sulfonate, allyl sulfonate, and propargyl sulfonate.

[0044] Furthermore, the hydroxymethane sulfonate includes sodium hydroxymethane sulfonate and potassium hydroxymethane sulfonate.

[0045] The allyl sulfonate includes sodium allyl sulfonate and potassium allyl sulfonate.

[0046] The propargyl sulfonate includes sodium propargyl sulfonate and potassium propargyl sulfonate.

[0047] In some embodiments, the naphthalenesulfonic acid formaldehyde condensate includes one or more of sodium naphthalenesulfonate formaldehyde condensate, sodium dibutylnaphthalenesulfonate formaldehyde condensate, sodium methylnaphthalenesulfonate formaldehyde condensate, and benzylnaphthalenesulfonic acid formaldehyde condensate. The naphthalenesulfonic acid formaldehyde condensate provided in the present application has excellent wetting and dispersing properties and can effectively disperse and wet graphene and silicon carbide.

[0048] In some embodiments, the ester sulfonate includes one or more of dihexyl sodium sulfosuccinate and dioctyl sodium sulfosuccinate. The ester group in the ester sulfonate provided in the present application can reduce the surface tension, which is conducive to the penetration of the solvent water in the electroplating solution into the graphene to promote the dispersion of the graphene. The ester group is also conducive to the surface interaction with the graphene to form a firm adsorption layer, making the graphene easier to be wetted by water. In addition, the ester group part can further stabilize the dispersion system through the steric hindrance effect to prevent the interaction and aggregation between the graphenes. The sodium sulfonate of the ester sodium sulfonate carries a negative charge and can form a double electric layer structure in water, thereby generating electrostatic repulsion, preventing the agglomeration and precipitation between the graphene and the silicon carbide, and improving the dispersion stability of the graphene and the silicon carbide.

[0049] In some embodiments, the soluble nickel compound includes one or more of nickel sulfamate, nickel chloride, nickel sulfate, and nickel acetate.

[0050] Preferably, the soluble nickel compound comprises nickel sulfamate and nickel chloride.

[0051] In some embodiments, the soluble phosphorus compound comprises phosphoric acid.

[0052] In some embodiments, the average particle size of the silicon carbide is 1 nm to 1000 nm, for example, 10 nm, 50 nm, 100 nm, 200 nm, 300 nm, 400 nm, 500 nm, 600 nm, 700 nm, 800 nm, 900 nm or a range between any two values.

[0053] In some embodiments, the average particle size of the graphene is 0.15 μm to 0.35 μm, for example, 0.18 μm, 0.2 μm, 0.22 μm, 0.25 μm, 0.28 μm, 0.3 μm, 0.32 μm or a range between any two values.

[0054] In some embodiments, the plating solution comprises:

[0055] The mass concentration of the soluble nickel compound is 13 g / L to 500 g / L, for example, 20 g / L, 100 g / L, 200 g / L, 300 g / L, 400 g / L, 420 g / L, 440 g / L, 480 g / L or a range between any two values;

[0056] The mass concentration of the soluble phosphorus compound is 15 g / L to 30 g / L, for example, 18 g / L, 20 g / L, 22 g / L, 25 g / L, 28 g / L or a range between any two values;

[0057] The mass concentration of the silicon carbide is 20 g / L to 100 g / L, for example, 30 g / L, 40 g / L, 50 g / L, 60 g / L, 70 g / L, 80 g / L, 90 g / L or a range between any two values;

[0058] The mass concentration of the graphene is 0.1 g / L to 5 g / L, for example, 0.5 g / L, 1 g / L, 2 g / L, 3 g / L, 4 g / L or a range between any two values;

[0059] The mass concentration of the first additive is 0.001 g / L to 0.003 g / L, for example, 0.0015 g / L, 0.002 g / L, 0.0025 g / L or a range between any two values;

[0060] The mass concentration of the second additive is 1 g / L to 3 g / L, for example, 1.2 g / L, 1.5 g / L, 1.8 g / L, 2 g / L, 2.2 g / L, 2.5 g / L, 2.8 g / L or a range between any two values;

[0061] The balance is water.

[0062] In this way, within the mass concentration range of each component in the above-mentioned electroplating solution, it is conducive to the dispersion and wetting of graphene and silicon carbide, and a coating with high hardness, uniform density, good wear resistance and flame retardant properties is prepared.

[0063] In some embodiments, in the soluble nickel compound, the mass concentration of the nickel sulfamate is 440 g / L to 480 g / L, and the mass concentration of the nickel chloride is 13 g / L to 20 g / L.

[0064] In some embodiments, in the second additive, the mass concentration of the naphthalenesulfonic acid formaldehyde condensate is 1g / L to 3g / L, for example, 1.1g / L, 1.2g / L, 1.3g / L, 1.4g / L, 1.5g / L, 1.6g / L, 1.7g / L, 1.8g / L, 1.9g / L, 2.0g / L, 2.1g / L, 2.2g / L, 2.3g / L, 2.4g / L, 2.5g / L, 2.6g / L, 2.7g / L The mass concentration of the ester sulfonate is 1.2 g / L to 2.4 g / L, for example, 1.2 g / L, 1.3 g / L, 1.4 g / L, 1.5 g / L, 1.6 g / L, 1.7 g / L, 1.8 g / L, 1.9 g / L, 2.0 g / L, 2.1 g / L, 2.2 g / L, 2.3 g / L, 2.4 g / L or a range between any two values. In this way, the naphthalenesulfonic acid formaldehyde condensate and the ester sulfonate can synergistically improve the dispersibility and wettability of the graphene.

[0065] In some embodiments, the electroplating solution includes: 460 g / L nickel sulfamate, 15 g / L nickel chloride, 25 g / L phosphoric acid, 60 g / L silicon carbide, 1 g / L graphene, 0.002 g / L sodium propargyl sulfonate, 1.8 g / L sodium naphthalenesulfonate formaldehyde condensate, 1.8 g / L sodium dihexyl sulfosuccinate, and the balance is water.

[0066] It can be understood that the electroplating solution provided in the present application can be prepared by mixing a soluble nickel compound, a soluble phosphorus compound, silicon carbide, graphene, a first additive and a second additive using conventional methods in the art.

[0067] In a second aspect, an embodiment of the present application further provides a coating, which is obtained by electroplating with the above-mentioned electroplating solution.

[0068] It can be understood that the workpiece to be plated is placed in the plating solution, and a layer of coating is plated on the workpiece to be plated by electroplating. Since the plating solution provided in the present application contains soluble nickel compounds, soluble phosphorus compounds, silicon carbide, and graphene, a nickel-phosphorus-silicon carbide-graphene coating with relatively high hardness can be obtained, and the plating solution also contains a first additive and a second additive, which fully promotes the dispersion and wetting of silicon carbide and graphene in the plating solution, improves the efficiency of electroplating, and makes silicon carbide and graphene in the coating evenly distributed, filling the holes or defects in the coating, enhancing the density of the coating, thereby effectively improving the hardness, wear resistance and flame retardancy of the coating, and the hydrocarbon sulfonate in the first additive can eliminate stress, reduce the brittleness of the coating, and improve the performance of the coating.

[0069] In some embodiments, the thickness of the coating is 1 μm to 5 μm, for example, 1.5 μm, 2 μm, 2.5 μm, 3 μm, 3.5 μm, 4 μm, 4.5 μm or a range between any two values.

[0070] In some embodiments, the electroplating conditions include: the pH of the electroplating solution is 2-5; the temperature of the electroplating solution is 50°C-55°C; the current density of the electroplating is 0.3A / dm 2 ~1.0A / dm 2 The electroplating time is 15 minutes to 45 minutes. It should be noted that the electroplating conditions can be adjusted according to the thickness of the coating or other requirements.

[0071] The present application is described in detail below through specific embodiments. The following embodiments are only partial embodiments of the present application and are not limitations of the present application.

[0072] Example 1

[0073] This embodiment provides an electroplating solution and a plating layer, including:

[0074] Electroplating solution preparation: Mix the components in the following proportions: 460 g / L nickel sulfamate, 15 g / L nickel chloride, 25 g / L phosphoric acid, 60 g / L silicon carbide, 1 g / L graphene, 0.002 g / L sodium propargyl sulfonate, 1.8 g / L sodium naphthalenesulfonate formaldehyde condensate, 1.8 g / L sodium dihexyl sulfosuccinate, and the balance is water to obtain an electroplating solution;

[0075] Plating preparation: Place the substrate to be plated and the plating solution into the plating tank, turn on the power, the pH of the plating solution is 3, the temperature is 50°C, and the current density is 0.5A / dm 2 , electroplating for 30 minutes to form a coating with a thickness of 3μm.

[0076] Example 2

[0077] This embodiment provides an electroplating solution and a plating layer, including:

[0078] Electroplating solution preparation: Mix the following components in the following proportions: 460 g / L nickel sulfamate, 15 g / L nickel chloride, 25 g / L phosphoric acid, 60 g / L silicon carbide, 1 g / L graphene, 0.002 g / L sodium propargyl sulfonate, 1.8 g / L sodium methylnaphthalene sulfonate formaldehyde condensate, 1.8 g / L sodium dihexyl sulfosuccinate, and the balance is water to obtain an electroplating solution;

[0079] Plating preparation: Place the substrate to be plated and the plating solution into the plating tank, turn on the power, the pH of the plating solution is 3, the temperature is 50°C, and the current density is 0.5A / dm 2 , electroplating for 30 minutes to form a coating with a thickness of 3μm.

[0080] Example 3

[0081] This embodiment provides an electroplating solution and a plating layer, including:

[0082] Electroplating solution preparation: Mix the following components in the following proportions: 460 g / L nickel sulfamate, 15 g / L nickel chloride, 25 g / L phosphoric acid, 60 g / L silicon carbide, 1 g / L graphene, 0.002 g / L sodium propargyl sulfonate, 1.8 g / L sodium dibutylnaphthalene sulfonate formaldehyde condensate, 1.8 g / L sodium dihexyl sulfosuccinate, and the balance is water to obtain an electroplating solution;

[0083] Plating preparation: Place the substrate to be plated and the plating solution into the plating tank, turn on the power, the pH of the plating solution is 3, the temperature is 50°C, and the current density is 0.5A / dm 2 , electroplating for 30 minutes to form a coating with a thickness of 3μm.

[0084] Example 4

[0085] This embodiment provides an electroplating solution and a plating layer, including:

[0086] Electroplating solution preparation: Mix the components in the following proportions: 460 g / L nickel sulfamate, 15 g / L nickel chloride, 25 g / L phosphoric acid, 60 g / L silicon carbide, 1 g / L graphene, 0.002 g / L sodium propargyl sulfonate, 3.6 g / L sodium naphthalenesulfonate formaldehyde condensate, 1.8 g / L sodium dihexyl sulfosuccinate, and the balance is water to obtain an electroplating solution;

[0087] Plating preparation: Place the substrate to be plated and the plating solution into the plating tank, turn on the power, the pH of the plating solution is 3, the temperature is 50°C, and the current density is 0.5A / dm 2 , electroplating for 30 minutes to form a coating with a thickness of 3μm.

[0088] Example 5

[0089] This embodiment provides an electroplating solution and a plating layer, including:

[0090] Electroplating solution preparation: Mix the components in the following proportions: 460 g / L nickel sulfamate, 15 g / L nickel chloride, 25 g / L phosphoric acid, 60 g / L silicon carbide, 1 g / L graphene, 0.002 g / L potassium allyl sulfonate, 1.2 g / L sodium naphthalenesulfonate formaldehyde condensate, 1.8 g / L sodium dihexyl sulfosuccinate, and the balance water to obtain an electroplating solution;

[0091] Plating preparation: Place the substrate to be plated and the plating solution into the plating tank, turn on the power, the pH of the plating solution is 3, the temperature is 50°C, and the current density is 0.5A / dm 2 , electroplating for 30 minutes to form a coating with a thickness of 3μm.

[0092] Example 6

[0093] This embodiment provides an electroplating solution and a plating layer, including:

[0094] Electroplating solution preparation: Mix the components in the following proportions: 460 g / L nickel sulfamate, 15 g / L nickel chloride, 25 g / L phosphoric acid, 60 g / L silicon carbide, 1 g / L graphene, 0.002 g / L sodium propargyl sulfonate, 1.8 g / L sodium naphthalenesulfonate formaldehyde condensate, 1.8 g / L dioctyl sodium sulfosuccinate, and the balance is water to obtain an electroplating solution;

[0095] Plating preparation: Place the substrate to be plated and the plating solution into the plating tank, turn on the power, the pH of the plating solution is 3, the temperature is 50°C, and the current density is 0.5A / dm 2 , electroplating for 30 minutes to form a coating with a thickness of 3μm.

[0096] Example 7

[0097] This embodiment provides an electroplating solution and a plating layer, including:

[0098] Electroplating solution preparation: Mix the components in the following proportions: 460 g / L nickel sulfamate, 15 g / L nickel chloride, 25 g / L phosphoric acid, 60 g / L silicon carbide, 1 g / L graphene, 0.002 g / L sodium propargyl sulfonate, 1.8 g / L sodium naphthalenesulfonate formaldehyde condensate, 2.4 g / L sodium dihexyl sulfosuccinate, and the balance is water to obtain an electroplating solution;

[0099] Plating preparation: Place the substrate to be plated and the plating solution into the plating tank, turn on the power, the pH of the plating solution is 3, the temperature is 50°C, and the current density is 0.5A / dm 2 , electroplating for 30 minutes to form a coating with a thickness of 3μm.

[0100] Example 8

[0101] This embodiment provides an electroplating solution and a plating layer, including:

[0102] Electroplating solution preparation: Mix the components in the following proportions: 460 g / L nickel sulfamate, 15 g / L nickel chloride, 25 g / L phosphoric acid, 60 g / L silicon carbide, 1 g / L graphene, 0.002 g / L sodium propargyl sulfonate, 1.8 g / L sodium naphthalenesulfonate formaldehyde condensate, 1.2 g / L sodium dihexyl sulfosuccinate, and the balance is water to obtain an electroplating solution;

[0103] Plating preparation: Place the substrate to be plated and the plating solution into the plating tank, turn on the power, the pH of the plating solution is 3, the temperature is 50°C, and the current density is 0.5A / dm 2 , electroplating for 30 minutes to form a coating with a thickness of 3μm.

[0104] Example 9

[0105] This embodiment provides an electroplating solution and a plating layer, including:

[0106] Electroplating solution preparation: Mix the components in the following proportions: 460 g / L nickel sulfamate, 15 g / L nickel chloride, 25 g / L phosphoric acid, 60 g / L silicon carbide, 1 g / L graphene, 0.002 g / L potassium allyl sulfonate, 1.8 g / L sodium naphthalenesulfonate formaldehyde condensate, 1.8 g / L sodium dihexyl sulfosuccinate, and the balance is water to obtain an electroplating solution;

[0107] Plating preparation: Place the substrate to be plated and the plating solution into the plating tank, turn on the power, the pH of the plating solution is 3, the temperature is 50°C, and the current density is 0.5A / dm 2 , electroplating for 30 minutes to form a coating with a thickness of 3μm.

[0108] Example 10

[0109] This embodiment provides an electroplating solution and a plating layer, including:

[0110] Electroplating solution preparation: Mix the components in the following proportions: 460 g / L nickel sulfamate, 15 g / L nickel chloride, 25 g / L phosphoric acid, 60 g / L silicon carbide, 1 g / L graphene, 0.003 g / L sodium propargyl sulfonate, 1.8 g / L sodium naphthalenesulfonate formaldehyde condensate, 1.8 g / L sodium dihexyl sulfosuccinate, and the balance is water to obtain an electroplating solution;

[0111] Plating preparation: Place the substrate to be plated and the plating solution into the plating tank, turn on the power, the pH of the plating solution is 3, the temperature is 50°C, and the current density is 0.5A / dm 2 , electroplating for 30 minutes to form a coating with a thickness of 3μm.

[0112] Embodiment 11

[0113] This embodiment provides an electroplating solution and a plating layer, including:

[0114] Electroplating solution preparation: Mix the following components in the following proportions: 460 g / L nickel sulfamate, 15 g / L nickel chloride, 25 g / L phosphoric acid, 60 g / L silicon carbide, 1 g / L graphene, 0.001 g / L sodium propargyl sulfonate, 1.8 g / L sodium naphthalenesulfonate formaldehyde condensate, 1.8 g / L sodium dihexyl sulfosuccinate, and the balance is water to obtain an electroplating solution;

[0115] Plating preparation: Place the substrate to be plated and the plating solution into the plating tank, turn on the power, the pH of the plating solution is 3, the temperature is 50°C, and the current density is 0.5A / dm 2 , electroplating for 30 minutes to form a coating with a thickness of 3μm.

[0116] Comparative Example 1

[0117] This comparative example provides an electroplating solution and a plating layer, comprising:

[0118] Electroplating solution preparation: Mix the components in the following proportions: 460 g / L nickel sulfamate, 15 g / L nickel chloride, 25 g / L phosphoric acid, 60 g / L silicon carbide, 1 g / L graphene, and the balance water to obtain an electroplating solution;

[0119] Plating preparation: Place the substrate to be plated and the plating solution into the plating tank, turn on the power, the pH of the plating solution is 3, the temperature is 50°C, and the current density is 0.5A / dm 2 , electroplating for 30 minutes to form a coating with a thickness of 3μm.

[0120] The Zeta potential of the plating solutions of Examples 1 to 11 and Comparative Example 1, and the hardness of the coatings of Examples 1 to 11 and Comparative Example 1 were tested, and the results are shown in Table 1.

[0121] Among them, the test method of Zeta potential is electrophoresis. Specifically, the plating solution is injected into an electrophoresis tank with voltage applied at both ends, and then the migration speed of the colloidal particles is measured by laser Doppler velocimetry. Then, based on the relationship between Zeta potential and migration rate, the Zeta potential of the solution to be tested is calculated. Zeta potential can reflect the dispersibility of the plating solution. The higher the absolute value of Zeta potential, the more stable the system, that is, the dissolution or dispersion can resist aggregation. Conversely, the lower the absolute value of Zeta potential, the more inclined to coagulation or aggregation, that is, the attraction exceeds the repulsion, the dispersion is destroyed and coagulation or aggregation occurs.

[0122] The hardness test method includes: testing the hardness of the coating using the indentation method under a microscope.

[0123] Table 1

[0124]

[0125]

[0126] It can be seen from Table 1 that the absolute value of the Zeta potential of the electroplating solution provided in the embodiment of the present application is much greater than that of the electroplating solution of Comparative Example 1. This is because the addition of the first additive and the second additive significantly reduces the stress, improves the dispersibility and wettability of silicon carbide and graphene, and makes the dispersion system of the electroplating solution more stable, which is conducive to giving full play to the beneficial effects of silicon carbide and graphene on the nickel plating layer; the coating prepared by the electroplating solution provided by the present application is significantly improved compared with Comparative Example 1, indicating that the soluble nickel compound, soluble phosphorus compound, silicon carbide and graphene in the electroplating solution cooperate well with each other under the action of the first additive and the second additive, and a coating with higher hardness is obtained, which can meet the environmental requirements of high hardness.

[0127] The technical solutions provided by the embodiments of the present application are introduced in detail above. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for technical personnel in this field, according to the idea of ​​the present application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. An electroplating solution, characterized in that: include: A soluble nickel compound, a soluble phosphorus compound, silicon carbide, graphene, a first additive and a second additive, wherein the first additive comprises a hydrocarbon sulfonate, and the second additive comprises a naphthalenesulfonic acid formaldehyde condensate and an ester sulfonate.

2. The electroplating solution according to claim 1, characterized in that The hydrocarbon sulfonate includes one or more of hydroxymethyl sulfonate, allyl sulfonate, and propargyl sulfonate; and / or The naphthalenesulfonic acid formaldehyde condensate includes one or more of sodium naphthalenesulfonate formaldehyde condensate, sodium dibutylnaphthalenesulfonate formaldehyde condensate, sodium methylnaphthalenesulfonate formaldehyde condensate, and benzylnaphthalenesulfonic acid formaldehyde condensate; and / or The ester sulfonate includes one or more of dihexyl sodium sulfosuccinate and dioctyl sodium sulfosuccinate.

3. The electroplating solution according to claim 2, characterized in that The hydroxymethane sulfonate includes sodium hydroxymethane sulfonate and potassium hydroxymethane sulfonate; and / or The allyl sulfonate includes sodium allyl sulfonate and potassium allyl sulfonate; and / or The propargyl sulfonate includes sodium propargyl sulfonate and potassium propargyl sulfonate.

4. The electroplating solution according to claim 1, characterized in that The soluble nickel compound includes one or more of nickel sulfamate, nickel chloride, nickel sulfate, and nickel acetate; and / or The soluble phosphorus compound comprises phosphoric acid; and / or The average particle size of the silicon carbide is 1 nm to 1000 nm; and / or The average particle size of the graphene is 0.15 μm to 0.35 μm.

5. The electroplating solution according to claim 1, characterized in that In the electroplating solution: The mass concentration of the soluble nickel compound is 13 g / L to 500 g / L; The mass concentration of the soluble phosphorus compound is 15 g / L to 30 g / L; The mass concentration of the silicon carbide is 20 g / L to 100 g / L; The mass concentration of the graphene is 0.1 g / L to 5 g / L; The mass concentration of the first additive is 0.001 g / L to 0.003 g / L; The mass concentration of the second additive is 1 g / L to 3 g / L; The balance is water.

6. The electroplating solution according to any one of claims 1 or 5, characterized in that: The soluble nickel compound includes nickel sulfamate and nickel chloride; wherein the mass concentration of the nickel sulfamate is 440 g / L to 480 g / L, and the mass concentration of the nickel chloride is 13 g / L to 20 g / L.

7. The electroplating solution according to any one of claims 1 or 5, characterized in that: In the second additive, the mass concentration of the naphthalenesulfonic acid formaldehyde condensate is 1 g / L to 3 g / L; the mass concentration of the ester sulfonate is 1.2 g / L to 2.4 g / L.

8. The electroplating solution according to claim 1, characterized in that The electroplating solution includes: 460 g / L nickel sulfamate, 15 g / L nickel chloride, 25 g / L phosphoric acid, 60 g / L silicon carbide, 1 g / L graphene, 0.002 g / L sodium propargyl sulfonate, 1.8 g / L sodium naphthalenesulfonate formaldehyde condensate, 1.8 g / L sodium dihexyl sulfosuccinate, and the balance is water.

9. A coating, characterized in that: The coating is obtained by electroplating with the electroplating solution according to any one of claims 1 to 8.

10. The coating according to claim 9, characterized in that: The thickness of the coating is 1 μm to 5 μm; and / or The electroplating conditions include: the pH of the electroplating solution is 2-5; the temperature of the electroplating solution is 50°C-55°C; the current density of the electroplating is 0.3A / dm 2 ~1.0A / dm 2 ; The electroplating time is 15min~45min.

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