Copper-tin alloy electroplating solution for barrel plating

Abstract

The invention relates to a copper-tin alloy electroplating solution for barrel plating. The copper-tin alloy electroplating solution for barrel plating comprises the following components in parts by mass: 80 g / L to 120 g / L of hydrochloric acid, 15 g / L to 25 g / L of copper chloride, 10 g / L to 30 g / L of stannous chloride, 15 g / L to 25 g / L of stannous pyrophosphate, 15 g / L to 35 g / L of copper pyrophosphate, 5 g / L to 10 g / L of sodium chloride, 20 g / L to 40 g / L of succinimide, 0.01 g / L to 0.02 g / L of sodium citrate, 40 g / L to 60 g / L of a complexing agent, 0.2 g / L to 0.6 g / L of a brightening agent, 4 g / L to 8 g / L of a dispersing agent, 0.1 g / L to 0.2 g / L of a stabilizing agent and 30 g / L to 50 g / L of a buffering The copper-tin alloy electroplating solution for barrel plating is a cyanide-free electroplating solution, and the influence on the environment is greatly reduced in the production process. The copper-tin alloy electroplating solution for barrel plating can form a compact plating layer on a plating piece, and the bonding performance of the plating layer and the plating piece is stable, so that a protective layer with corrosion resistance and friction resistance is formed on the surface of the plating piece.

Description

Technical Field

[0001] The invention relates to the field of copper-tin alloy electroplating, in particular to a copper-tin alloy electroplating solution for roller plating. Background Art

[0002] Copper-tin alloy refers to a copper alloy containing 5% to 15% Sn and a small amount of Zn. Copper-tin alloy is the oldest alloy with excellent mechanical strength and hardness, good casting performance and processing performance. In addition, copper-tin alloy has excellent corrosion resistance and load-bearing performance. Copper-tin alloy has appropriate electrical conductivity and easy welding characteristics. Because of its excellent corrosion resistance and mechanical properties, copper-tin alloy is widely used in the field of electroplating. A copper-tin alloy layer is electroplated on the surface of the product to be electroplated to improve the corrosion resistance and wear resistance of the plated part. Barrel plating is suitable for smaller products in electroplating. However, the scientific classification of barrel plating types should be based on the shape and axial direction of the roller used for barrel plating. The shape of the roller refers to what kind of object the appearance of the roller resembles, and the axial direction of the roller refers to the relationship between the direction of the rotating axis and the horizontal plane when the roller rotates. According to the differences in these two aspects of the roller, the common barrel plating methods in electroplating production are divided into three categories: horizontal barrel plating, inclined barrel plating and vibration plating. In other words, barrel plating is the process of electroplating a large number of small parts in a rolling container.

[0003] However, the structure of the plated parts during the barrel plating process is generally more complicated, and it takes a long time to electroplate a dense coating on the surface of the plated parts. In the traditional electroplating process, the plating solution usually uses cyanide plating, and cyanide plating technology is widely used in the electroplating of various single metals or alloys such as zinc, copper, cadmium, silver, and gold. However, cyanide is a highly toxic substance. Therefore, high requirements are placed on the management of highly toxic cyanide and the treatment of wastewater discharge from cyanide-containing plating solutions. The cost of post-processing has been increased, and cyanide-free plating solutions have appeared on the market. However, the coating formed by the traditional cyanide-free plating solution has poor bonding stability with the plated parts and low structural strength. Summary of the invention

[0004] Based on this, it is necessary to provide a copper-tin alloy electroplating solution for roller plating to address the technical problems of poor bonding stability between the plating layer formed by the traditional cyanide-free electroplating solution and the plated part and low structural strength.

[0005] A copper-tin alloy electroplating solution for barrel plating comprises the following components in parts by mass: 80 g / L to 120 g / L of hydrochloric acid, 15 g / L to 25 g / L of cupric chloride, 10 g / L to 30 g / L of stannous chloride, 15 g / L to 25 g / L of stannous pyrophosphate, 15 g / L to 35 g / L of copper pyrophosphate, 5 g / L to 10 g / L of sodium chloride, 20 g / L to 40 g / L of succinimide, 0.01 g / L to 0.02 g / L of sodium citrate, 40 g / L to 60 g / L of complexing agent, 0.2 g / L to 0.6 g / L of brightener, 4 g / L to 8 g / L of dispersant, 0.1 g / L to 0.2 g / L of stabilizer and 30 g / L to 50 g / L of buffer.

[0006] In one embodiment, the buffer is disodium hydrogen phosphate.

[0007] In one embodiment, the buffer is dipotassium hydrogen phosphate.

[0008] In one embodiment, the stabilizer is hydroquinone.

[0009] In one embodiment, the complexing agent is sodium pyrophosphate.

[0010] In one embodiment, the complexing agent is potassium pyrophosphate.

[0011] In one embodiment, the dispersant is alkylphenol polyoxyethylene ether.

[0012] In one embodiment, the brightener is 2-mercaptobenzimidazole.

[0013] In one embodiment, the stabilizer is catechol.

[0014] In one embodiment, the stabilizer is resorcinol.

[0015] The copper-tin alloy electroplating solution for barrel plating is a cyanide-free electroplating solution, which greatly reduces the impact on the environment during the production process. The copper-tin alloy electroplating solution for barrel plating can form a dense plating layer on the plated workpiece, and the bonding performance between the plating layer and the plated workpiece is stable, so that a protective layer with corrosion resistance and friction resistance is formed on the surface of the plated workpiece. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 FIG. 1 is a composition diagram of a copper-tin alloy electroplating solution for barrel plating in one embodiment. DETAILED DESCRIPTION

[0017] In order to make the purpose, technical solution and advantages of the present invention clearer, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention. In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below. In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or position relationship based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention.

[0018] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0019] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0020] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0021] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0022] A copper-tin alloy electroplating solution for barrel plating comprises the following components in parts by mass: 80 g / L to 120 g / L of hydrochloric acid, 15 g / L to 25 g / L of cupric chloride, 10 g / L to 30 g / L of stannous chloride, 15 g / L to 25 g / L of stannous pyrophosphate, 15 g / L to 35 g / L of copper pyrophosphate, 5 g / L to 10 g / L of sodium chloride, 20 g / L to 40 g / L of succinimide, 0.01 g / L to 0.02 g / L of sodium citrate, 40 g / L to 60 g / L of complexing agent, 0.2 g / L to 0.6 g / L of brightener, 4 g / L to 8 g / L of dispersant, 0.1 g / L to 0.2 g / L of stabilizer and 30 g / L to 50 g / L of buffer.

[0023] Further, the copper-tin alloy electroplating solution for barrel plating includes the following components in parts by mass: 90 g / L to 110 g / L hydrochloric acid, 18 g / L to 22 g / L cupric chloride, 15 g / L to 25 g / L stannous chloride, 18 g / L to 22 g / L stannous pyrophosphate, 20 g / L to 30 g / L copper pyrophosphate, 6 g / L to 8 g / L sodium chloride, 25 g / L to 35 g / L succinimide, 0.012 g / L to 0.016 g / L sodium citrate, 45 g / L to 55 g / L complexing agent, 0.3 g / L to 0.5 g / L brightener, 5 g / L to 7 g / L dispersant, 0.12 g / L to 0.18 g / L stabilizer and 35 g / L to 45 g / L buffer.

[0024] Specifically, in this embodiment, the copper-tin alloy electroplating solution for barrel plating includes the following components in parts by mass: 100 g / L hydrochloric acid, 20 g / L cupric chloride, 20 g / L stannous chloride, 20 g / L stannous pyrophosphate, 25 g / L copper pyrophosphate, 7 g / L sodium chloride, 30 g / L succinimide, 0.015 g / L sodium citrate, 50 g / L complexing agent, 0.4 g / L brightener, 6 g / L dispersant, 0.15 g / L stabilizer and 40 g / L buffer.

[0025] In order to increase the stability of the pH value of the copper-tin alloy electroplating solution used for barrel plating, in one embodiment, the buffer is disodium hydrogen phosphate. In another embodiment, the buffer is dipotassium hydrogen phosphate. In yet another embodiment, the buffer is a mixture of disodium hydrogen phosphate and dipotassium hydrogen phosphate. The above buffer can increase the stability of the pH value of the copper-tin alloy electroplating solution used for barrel plating, thereby ensuring the stability of the barrel plating process.

[0026] In order to increase the anti-oxidation performance of the copper-tin alloy electroplating solution used for barrel plating, in one embodiment, the stabilizer is catechol. In another embodiment, the stabilizer is catechol. In another embodiment, the stabilizer is resorcinol. In other embodiments, the stabilizer is a mixture of catechol, catechol, and resorcinol. The stabilizer can increase the anti-oxidation performance of the copper-tin alloy electroplating solution used for barrel plating, thereby increasing the working stability.

[0027] In order to improve the stability of the copper-tin alloy electroplating solution used for barrel plating, in one embodiment, the complexing agent is sodium pyrophosphate. In another embodiment, the complexing agent is potassium pyrophosphate. In yet another embodiment, the complexing agent is a mixture of sodium pyrophosphate and potassium pyrophosphate. The complexing agent can improve the stability of the copper-tin alloy electroplating solution used for barrel plating, so that the copper ions and tin ions in the copper-tin alloy electroplating solution used for barrel plating will not undergo a substitution reaction with the plated part, and a loose substitution layer will not be generated on the surface of the plated part. A good bonding effect between the plating layer and the plated part is guaranteed.

[0028] In order to improve the mixing uniformity of the components in the copper-tin alloy electroplating solution for barrel plating, in one embodiment, the dispersant is alkylphenol polyoxyethylene ether. Alkylphenol polyoxyethylene ether improves the mixing uniformity of the components in the copper-tin alloy electroplating solution for barrel plating, thereby improving the stability of the copper-tin alloy electroplating solution for barrel plating.

[0029] In order to increase the flatness and glossiness of the coating on the surface of the plated part, in one embodiment, the brightener is 2-mercaptobenzimidazole. 2-mercaptobenzimidazole can refine the crystals of the coating, thereby improving the flatness and glossiness of the coating.

[0030] The copper-tin alloy electroplating solution for barrel plating is a cyanide-free electroplating solution, which greatly reduces the impact on the environment during the production process. The copper-tin alloy electroplating solution for barrel plating can form a dense plating layer on the plated workpiece, and the bonding performance between the plating layer and the plated workpiece is stable, so that a protective layer with corrosion resistance and friction resistance is formed on the surface of the plated workpiece. The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0031] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A copper-tin alloy electroplating solution for barrel plating, characterized in that: The invention comprises the following components in parts by mass: 80 to 120 g / L of hydrochloric acid, 15 to 25 g / L of copper chloride, 10 to 30 g / L of stannous chloride, 15 to 25 g / L of stannous pyrophosphate, 15 to 35 g / L of copper pyrophosphate, 5 to 10 g / L of sodium chloride, 20 to 40 g / L of succinimide, 0.01 to 0.02 g / L of sodium citrate, 40 to 60 g / L of complexing agent, 0.2 to 0.6 g / L of brightener, 4 to 8 g / L of dispersant, 0.1 to 0.2 g / L of stabilizer and 30 to 50 g / L of buffer.

2. The copper-tin alloy electroplating solution for barrel plating according to claim 1, characterized in that: The buffer is disodium hydrogen phosphate.

3. The copper-tin alloy electroplating solution for barrel plating according to claim 1, characterized in that: The buffer is dipotassium hydrogen phosphate.

4. The copper-tin alloy electroplating solution for barrel plating according to claim 1, characterized in that: The stabilizer is hydroquinone.

5. The copper-tin alloy electroplating solution for barrel plating according to claim 1, characterized in that: The complexing agent is sodium pyrophosphate.

6. The copper-tin alloy electroplating solution for barrel plating according to claim 1, characterized in that: The complexing agent is potassium pyrophosphate.

7. The copper-tin alloy electroplating solution for barrel plating according to claim 1, characterized in that: The dispersant is alkylphenol polyoxyethylene ether.

8. The copper-tin alloy electroplating solution for barrel plating according to claim 1, characterized in that: The brightener is 2-mercaptobenzimidazole.

9. The copper-tin alloy electroplating solution for barrel plating according to claim 1, characterized in that: The stabilizer is catechol.

10. The copper-tin alloy electroplating solution for barrel plating according to claim 1, characterized in that: The stabilizer is resorcinol.

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