Electroplating device with function of monitoring state of ionic membrane in electroplating cavity and monitoring method

Abstract

The invention discloses an electroplating device with a function of monitoring the state of an ionic membrane in an electroplating cavity and a monitoring method. The electroplating device comprises an electroplating cavity, an ion membrane is arranged in the electroplating cavity, and the electroplating cavity is divided into a cathode cavity and an anode cavity by the ion membrane; the anode tank is configured to contain anode electroplating liquid and is connected with the anode cavity through a pipeline, so that the anode electroplating liquid circulates between the anode cavity and the anode tank; the cathode tank is configured to contain cathode electroplating liquid and is connected with the cathode cavity through a pipeline, so that the cathode electroplating liquid circulates between the cathode cavity and the cathode tank; the monitoring mechanism is configured to monitor at least one piece of event information of the electroplating device, and the event information is used for determining the state of the ionic membrane. According to the electroplating device disclosed by the invention, the monitoring mechanism is arranged to monitor various event information of the electroplating device in real time so as to monitor whether the ionic membrane is in a normal working state in real time, so that cross contamination of the cathode electroplating liquid and the anode electroplating liquid is prevented, and the quality of a plating layer is guaranteed.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor manufacturing, and in particular relates to an electroplating device and a monitoring method with the function of monitoring the state of an ion membrane in an electroplating chamber. Background Art

[0002] Electroplating refers to the process in which the cations of the plating metal in the plating solution are reduced to form a plating layer on the surface of the workpiece to be plated. In the interconnection technology of ultra-large-scale integrated circuits, as the circuit integration continues to increase and the circuit size continues to shrink, the requirements for the quality of the plating layer are also increasing.

[0003] Usually, an ion membrane is arranged in the plating chamber of the electroplating device, and the ion membrane separates the plating chamber into an independent cathode chamber and anode chamber. On the one hand, the ion membrane can well isolate the cathode and cathode plating solutions, thereby avoiding cross-contamination of the cathode and cathode plating solutions; on the other hand, it can supplement the metal ions to be plated to the cathode chamber through the concentration difference. However, in the existing electroplating devices, the ion membrane may be damaged. Once the ion membrane is damaged, it cannot effectively isolate the cathode and cathode plating solutions, thereby causing cross-contamination of the cathode and cathode plating solutions and reducing the quality of the coating. In order to ensure the quality of the electroplating layer, it is necessary to ensure that the ion membrane is in a normal state. For this purpose, an electroplating device with the function of monitoring the state of the ion membrane in the plating chamber is proposed. Summary of the invention

[0004] In order to ensure that whether the ion membrane is damaged can be discovered in time, an electroplating device with the function of monitoring the state of the ion membrane in the electroplating chamber is proposed, which can monitor in real time whether the state of the ion membrane is in normal working state and improve the quality of the electroplating layer during the electroplating process.

[0005] In a first aspect, the present invention provides an electroplating device having a function of monitoring the state of an ion membrane in an electroplating chamber, the electroplating device comprising:

[0006] An electroplating chamber, wherein an ion membrane is disposed inside the electroplating chamber, and the ion membrane divides the electroplating chamber into a cathode chamber and an anode chamber;

[0007] an anode tank configured to contain an anode plating solution and connected to the anode chamber via a pipeline so that the anode plating solution circulates between the anode chamber and the anode tank;

[0008] a cathode tank configured to contain a cathode plating solution and connected to the cathode chamber via a pipeline so that the cathode plating solution circulates between the cathode chamber and the cathode tank;

[0009] A monitoring mechanism is configured to monitor at least one event information of the electroplating device, wherein the event information is used to determine the state of the ion membrane.

[0010] According to a specific implementation of the embodiment of the present application: the event information includes a change in the pressure in the anode chamber; the monitoring mechanism includes:

[0011] A pressure sensor, used for sensing the pressure in the anode cavity and generating a pressure value detection signal;

[0012] The controller is used to receive the pressure value detection signal, and when the pressure value detection signal exceeds a preset pressure value variation range, determine that the state of the ion membrane is an abnormal state.

[0013] According to a specific implementation method of the embodiment of the present application: the pressure sensor is arranged on the side wall of the anode chamber.

[0014] According to a specific implementation of the embodiment of the present application: the event information includes changes in the liquid level value in the anode tank and / or the cathode tank; the monitoring mechanism includes:

[0015] A continuous liquid level sensor, used for sensing the liquid level value in the anode tank and / or the cathode tank and generating a first liquid level value detection signal;

[0016] The controller is used to receive the first liquid level detection signal, and when the change rate of the first liquid level detection signal exceeds a preset liquid level change rate range, determine that the state of the ion membrane is an abnormal state.

[0017] According to a specific implementation of the embodiment of the present application: the monitoring mechanism further includes:

[0018] A breakpoint liquid level sensor, connected to the controller for communication, configured to monitor the liquid level value in the anode tank and / or the cathode tank and generate a second liquid level value detection signal;

[0019] The controller is also configured to receive the second liquid level value detection signal, and when the second liquid level value detection signal exceeds a threshold, determine that the state of the ion membrane is abnormal, wherein the threshold includes a preset high liquid level limit value and a low liquid level limit value in the anode tank and / or the cathode tank.

[0020] According to a specific implementation of the embodiment of the present application: the continuous liquid level sensor is arranged in the anode tank and / or the cathode tank;

[0021] The breakpoint type liquid level sensor is arranged in the anode tank and / or the cathode tank.

[0022] According to a specific implementation of the embodiment of the present application: the event information includes a change in the Ph value of the anode plating solution and / or the cathode plating solution, and the monitoring mechanism includes:

[0023] A Ph value sensor, used for sensing the Ph value of the anode plating solution and / or the cathode plating solution and generating a Ph value detection signal;

[0024] The controller is used to receive the Ph value detection signal, and when the Ph value detection signal exceeds a preset Ph value variation range, determine that the state of the ion membrane is an abnormal state.

[0025] According to a specific implementation of the embodiment of the present application: the Ph value sensor is arranged in the anode cavity and / or the cathode cavity.

[0026] According to a specific implementation method of an embodiment of the present application: the Ph value sensor is arranged on the pipeline where the anode plating liquid flows from the anode cavity to the anode tank, and / or, is arranged on the pipeline where the cathode plating liquid flows from the cathode cavity to the cathode tank.

[0027] In a second aspect, the present invention proposes a method for monitoring the state of an ion membrane in an electroplating chamber, monitoring at least one event information of an electroplating device, wherein the event information is used to determine the state of the ion membrane, wherein the event information includes one or any combination of the following: a change in the pressure in the anode chamber, a change in the liquid level value in the anode tank and / or the cathode tank, and a change in the Ph value of the anode plating solution and / or the cathode plating solution.

[0028] According to a specific implementation method of the embodiment of the present application:

[0029] When the event information includes a change in the pressure in the anode chamber, the monitoring method includes:

[0030] Real-time detection of the pressure in the anode chamber of the electroplating device to generate a pressure value detection signal;

[0031] The pressure value detection signal is monitored, and when the pressure value detection signal exceeds a preset pressure value variation range, it is determined that the state of the ion membrane is an abnormal state.

[0032] According to a specific implementation of the embodiment of the present application: when the event information includes a change in the liquid level value in the anode tank and / or the cathode tank, the monitoring method includes:

[0033] Real-time detection of the liquid level value in the anode tank and / or cathode tank connected to the electroplating chamber to generate a first liquid level detection signal;

[0034] The first liquid level detection signal is monitored, and when a change rate of the first liquid level detection signal exceeds a preset liquid level change rate range, it is determined that the state of the ion membrane is an abnormal state.

[0035] According to a specific implementation method of the embodiment of the present application:

[0036] When the event information includes a change in the Ph value of the anode plating solution and / or the cathode plating solution, the monitoring method includes:

[0037] Real-time detection of the Ph value of the anode plating solution and / or cathode plating solution connected to the plating chamber and generating a Ph value detection signal;

[0038] The Ph value detection signal is monitored, and when the Ph value detection signal exceeds a preset Ph value variation range, the state of the ion membrane is determined to be an abnormal state.

[0039] The present invention proposes an electroplating device and a monitoring method with the function of monitoring the state of the ion membrane in the electroplating chamber. By setting a monitoring mechanism to monitor various event information of the electroplating device in real time, the state of the ion membrane is monitored in real time to see if it is in a normal working state, thereby preventing cross contamination of the anode and cathode electroplating solutions and ensuring the quality of the coating. Other features and advantages of the present invention will be described in the subsequent description, and partly become apparent from the description, or can be understood by implementing the present invention. The objects and other advantages of the present invention can be achieved and obtained by the structures indicated in the description and the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0041] Figure 1 A schematic structural diagram of an electroplating device according to Embodiment 1 of the present invention is shown;

[0042] Figure 2 A schematic structural diagram of an electroplating device according to Embodiment 2 of the present invention is shown;

[0043] Figure 3 A schematic structural diagram of an electroplating device according to Embodiment 3 of the present invention is shown; and

[0044] Figure 4 A schematic structural diagram of another electroplating device according to an embodiment of the present invention is shown. DETAILED DESCRIPTION

[0045] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0046] Example 1

[0047] Please refer to Figure 1 , Figure 1 FIG. 2 shows a schematic diagram of the structure of an electroplating device having the function of monitoring the state of an ion membrane in an electroplating chamber according to an embodiment of the present invention. Figure 1 As shown, the present invention proposes an electroplating device with a function of monitoring the state of an ion membrane in an electroplating chamber, comprising: an electroplating chamber 100, an anode tank 200, a cathode tank 300 and a monitoring mechanism. The electroplating chamber comprises an anode chamber 101, a cathode chamber 102 arranged on the top of the anode chamber 101, and an ion membrane 103 separating the anode chamber 101 and the cathode chamber 102. The composition of the electroplating solution in the anode chamber 101 and the cathode chamber 102 is slightly different. Specifically, additives are usually added to the electroplating solution in the cathode chamber 102, and anode particles are usually contained in the electroplating solution in the anode chamber 101. The ion membrane 103 isolates the cathode chamber 102 and the anode chamber 101, which can prevent the electroplating solutions in the two chambers from mixing, thereby preventing the cathode electroplating solution and the anode particles in the anode electroplating solution from reacting to generate pollutants and reduce the electroplating quality. The anode tank 200 is connected to the anode chamber 101 through a pipeline to form an anode circulation system, and the anode tank 200 is configured to accommodate an anode plating solution; the cathode tank 300 is connected to the cathode chamber 102 through a pipeline to form a cathode circulation system, and the cathode tank 300 is configured to accommodate a cathode plating solution; the monitoring mechanism is configured to monitor at least one event information of the electroplating device when the electroplating device is in a process, and the event information is used to determine the state of the ion membrane 103.

[0048] Exemplarily, the monitoring mechanism includes a pressure sensor 401 and a controller. Figure 1 , Figure 1 FIG. 1 is a schematic diagram showing the structure of the electroplating device in Embodiment 1 of the present invention. Figure 1As shown, in an embodiment of the present invention, the monitoring mechanism includes: a pressure sensor 401, which is used to sense the pressure in the anode chamber 101 and generate a pressure value detection signal; and a controller, which is configured to receive the pressure value detection signal, and when the pressure value detection signal exceeds the preset pressure value variation range, the state of the ion membrane is judged to be an abnormal state. In the actual installation process of the pressure sensor 401, the pressure sensor 401 can be installed on the inner wall or the outer wall of the anode chamber 101 according to actual needs, and the pressure sensor 401 is required to be able to monitor the pressure in the anode chamber 101.

[0049] Furthermore, the monitoring mechanism also includes an alarm (not shown) that is communicatively connected to the controller. When the controller determines that the state of the ion membrane is abnormal, it issues an alarm instruction, and the alarm receives and executes the alarm instruction to issue an alarm.

[0050] The ion membrane 103 isolates the anode plating solution from the cathode plating solution, prevents the plating solution from being cross-contaminated, and makes the anode chamber 101 in a state similar to being closed. The anode chamber 101 is connected to the anode tank 200 through a pipeline to form an anode circulation system. During the process, the amount of anode plating solution transported from the anode tank 200 to the anode chamber 101 is the same as the amount of anode plating solution refluxed from the anode chamber 101 to the anode tank 200. Therefore, the anode circulation system is in a dynamic equilibrium process. At this time, the anode chamber 101 can be regarded as a closed chamber, and the pressure at various places inside the anode chamber 101 is in a relatively constant state. When the pressure in the anode chamber 101 is measured by the pressure sensor 401, the measured value of the pressure sensor 401 should be a relatively stable value, or a relatively stable pressure range. Once the ion membrane 103 is damaged, the plating solution in the anode chamber 101 will flow from the anode chamber 101 to the cathode chamber 102 through the damaged part. At this time, the dynamic balance of the anode circulation system will be broken, and the value detected by the pressure sensor 401 will change. Because the plating solution in the anode chamber 101 continues to flow to the cathode chamber 102, the pressure in the anode chamber 101 continues to decrease, and the value detected by the pressure sensor 401 will also continue to decrease. When the controller determines that the pressure value detected by the pressure sensor 401 exceeds the preset pressure value variation range, it determines that the state of the ion membrane is abnormal, issues an alarm instruction, and the alarm receives the alarm instruction and triggers the alarm. Exemplarily, the preset pressure value variation range is 3±0.2psi. When the pressure value detected by the pressure sensor 401 is within the range of 3±0.2psi, the controller determines that the state of the ion membrane is normal and will not issue an alarm instruction; when the pressure value is detected to be less than 2.8psi, the controller determines that the state of the ion membrane is abnormal, issues an alarm instruction, and the alarm receives the alarm instruction and issues an alarm to remind the staff to check and confirm the state of the ion membrane.

[0051] Example 2

[0052] This embodiment provides an electroplating device with the function of monitoring the state of the ion membrane in the electroplating chamber. The structure of the device is basically the same as that of the electroplating device in Example 1. The difference is that the event information monitored by the monitoring mechanism includes changes in the liquid level value in the anode tank and / or cathode tank. For details, please refer to Figure 2 , Figure 2 FIG. 2 shows a schematic diagram of the structure of an electroplating device in an embodiment of the present invention. Figure 2 As shown, the monitoring mechanism includes: a continuous liquid level sensor 4031, used to sense the liquid level value in the anode tank 200 and / or the cathode tank 300 and generate a first liquid level value detection signal; a controller, used to receive the first liquid level value detection signal, and when the change rate of the first liquid level value detection signal exceeds the preset liquid level value change rate range, judge that the state of the ion membrane is an abnormal state.

[0053] Furthermore, the monitoring mechanism also includes an alarm (not shown) that is communicatively connected to the controller. When the controller determines that the state of the ion membrane is abnormal, it issues an alarm instruction, and the alarm receives and executes the alarm instruction, and the alarm issues an alarm.

[0054] Furthermore, the liquid level sensor 4031 can be installed in at least one of the anode tank 200 and the cathode tank 300. Considering that the volume of the anode tank 200 is smaller than that of the cathode tank 300, the change of the liquid level in the anode tank 200 will be more obvious. Therefore, when choosing to install the continuous liquid level sensor 4031 in the anode tank 200 and the cathode tank 300, it is preferred to install the continuous liquid level sensor 4031 in the anode tank 200 to monitor the liquid level of the anode tank 200.

[0055] Specifically, in the normal process, the electroplating solution in the anode tank 200 and the cathode tank 300 is in a state of continuous consumption, but because the consumption rate is slow, the replenishment of the electroplating solution is intermittent. In the process, the electroplating solution in the anode tank 200 and the cathode tank 300 is reduced at a constant rate of change. For example, taking a copper electroplating process as an example, during an interval of replenishing the electroplating solution, the consumption rate of the electroplating solution in the anode tank 200 is 10 ml / h, and the consumption rate of the electroplating solution in the cathode tank 300 is 150 ml / h; since the pressure of the anode chamber 101 is greater than the pressure of the cathode chamber 102, once the ion membrane is damaged, part of the electroplating solution in the anode chamber 101 will flow to the cathode chamber 102 through the damaged part, and then flow to the cathode tank 300 through the cathode chamber 102. Part of the electroplating solution in the anode tank 200 flows back to the anode tank 200 through the anode chamber 101, and the other part flows to the cathode tank 300. Finally, the electroplating solution in the anode tank 200 continues to decrease, and the speed of the electroplating solution decreases faster. For example, at this time, the consumption rate of the electroplating solution in the anode tank 300 is 50 ml / h. It should be understood that the greater the degree of damage to the ion membrane, the faster the reduction of the electroplating solution in the anode tank 300. The faster the rate, under this situation, the consumption rate of the plating liquid in the cathode tank 300 will decrease, and even the plating liquid in the cathode tank 300 will increase instead of decrease. For example, the consumption rate of the plating liquid in the cathode tank 300 becomes 110ml / h. Based on this, when the continuous liquid level sensor 4031 detects the liquid level value in the anode tank 200 and / or the cathode tank 300, the controller determines that the change rate of the detected first liquid level value detection signal exceeds the preset liquid level value change rate, that is, when the liquid level value change rate of the plating liquid in the anode tank 200 changes from the preset liquid level value change rate of 10ml / h to 50ml / h and / or the liquid level value change rate of the plating liquid in the cathode tank 300 changes from the preset liquid level value change rate of 150ml / h to 120ml / h, the state of the ion membrane is judged to be abnormal, an alarm instruction is issued, and the alarm receives the alarm instruction and triggers the alarm. It should be understood that when detecting the liquid level in the anode tank 200, the liquid level value continues to decrease; when detecting the liquid level in the cathode tank 300, the liquid level value may be continuously decreasing at a slower rate, or it may be continuously increasing; therefore, the rate of change of the plating liquid level and the trend of the liquid level change in the anode tank 200 and the cathode tank 300 may be detected simultaneously. When the rate of change of the plating liquid level in the anode tank 200 and the cathode tank 300 both exceed the range of the preset rate of change of the liquid level value, and the liquid level in the anode tank 200 decreases, and the liquid level in the cathode tank 300 decreases slowly or increases, it is possible to more accurately determine that the ion membrane is damaged, the controller issues an alarm command, the alarm receives the alarm command and issues an alarm, and reminds the staff to check and confirm the status of the ion membrane.

[0056] Furthermore, a high liquid level limit value and a low liquid level limit value are preset in the anode tank 200 and / or the cathode tank 300, and the monitoring mechanism also includes: a breakpoint liquid level sensor 4032 communicated with the controller, configured to monitor the liquid level value in the anode tank 200 and / or the cathode tank 300, and generate a second liquid level value detection signal; the controller is also configured to receive the second liquid level value detection signal, and when the second liquid level value detection signal exceeds a threshold value, it is judged that the state of the ion membrane is abnormal, wherein the threshold value includes the high liquid level limit value and the low liquid level limit value preset in the anode tank and / or the cathode tank.

[0057] In this embodiment, a continuous liquid level sensor 4031 and a breakpoint liquid level sensor 4032 are combined for monitoring, and both the continuous liquid level sensor 4031 and the breakpoint liquid level sensor 4032 are arranged in the anode tank 200 and / or the cathode tank 300. When the event information monitored by the monitoring mechanism through the continuous liquid level sensor 4031 is that the liquid level value changes, and the liquid level change rate exceeds the range of the preset liquid level value change rate, the controller issues an alarm instruction, and the alarm receives the alarm instruction and executes the trigger alarm; the breakpoint liquid level sensor 4032 monitors the limit liquid level value in the anode tank 200 and / or the cathode tank 300, and when it is detected that the second liquid level value detection signal reaches the preset high liquid level limit value or low liquid level limit value, the controller issues an alarm instruction, and the alarm receives the alarm instruction and executes the trigger alarm, so as to further ensure the normal operation of the electroplating device.

[0058] Example 3

[0059] This embodiment provides an electroplating device with the function of monitoring the state of the ion membrane in the electroplating chamber. The structure of the device is basically the same as that of the electroplating device in Example 2. The difference is that the event information monitored by the monitoring mechanism includes the change of the Ph value of the anode plating solution and / or the cathode plating solution. For details, please refer to Figure 3 , Figure 3 FIG. 2 shows a schematic diagram of the structure of an electroplating device in an embodiment of the present invention. Figure 3 As shown, the monitoring mechanism includes: a Ph value sensor 402, which is used to sense the Ph value of the anode plating solution and / or the cathode plating solution and generate a Ph value detection signal; and a controller, which is configured to receive the Ph value detection signal and, when the Ph value detection signal exceeds a preset Ph value variation range, determine that the state of the ion membrane is an abnormal state.

[0060] Furthermore, the detection mechanism also includes an alarm (not shown) connected to the controller. When the controller determines that the state of the ion membrane is abnormal, it issues an alarm instruction, and the alarm receives and executes the alarm instruction. The alarm sounds an alarm.

[0061] For details, please continue to refer to Figure 3In the electroplating process, the anode chamber 101 and the cathode chamber 102 are both filled with electroplating solution, and the electroplating solution is weakly acidic. Once the ion membrane 103 is damaged, the electroplating solution in the anode chamber 101 will flow into the cathode chamber 102 through the damaged part, while the cathode chamber 102 is relatively open. The excess electroplating solution will be directly discharged and flow back into the cathode tank 300. Part of the electroplating solution in the anode tank 200 flows back to the anode tank 200 through the anode chamber 101, and the other part flows into the cathode tank 300. Finally, the electroplating solution in the anode tank 200 is continuously reduced, and the speed of the electroplating solution reduction becomes faster. Once the speed of the electroplating solution in the anode tank 200 is reduced too quickly, in order to prevent the electroplating solution in the anode tank 200 from being consumed (the anode tank Once the plating solution is consumed, the electroplating device will stop working), and in order to ensure that the anode tank 200 has enough plating solution, deionized water will be added to the anode tank 200 first to maintain the operation of the electroplating device. In this way, the Ph value of the anode plating solution in the anode tank 200 will increase, so the Ph value of the anode plating solution transported to the anode chamber 101 will also increase, and the Ph value in the anode chamber 101 will also increase. Because the plating solution in the anode chamber 101 is continuously input into the cathode chamber 102, the Ph value in the cathode chamber 102 will also increase, so the Ph value measured by the Ph value sensor 402 set on the pipeline connecting the electroplating chamber 100 with the anode tank 200 and the cathode tank 300 will increase. Once the result value detected by the Ph value sensor 402 increases, it means that the ion membrane 103 is damaged, and the alarm sounds an alarm. Therefore, using the Ph value sensor 402 to monitor the Ph value of the plating solution in the plating chamber in real time can effectively monitor whether the ion membrane 103 is in a normal state.

[0062] It should be understood that the Ph value sensor 402 can be installed inside the anode tank 200 and / or the cathode tank 300, or can be installed on the pipeline where the anode plating solution flows from the anode chamber 101 to the anode tank 200, and / or, installed on the pipeline where the cathode plating solution flows from the cathode chamber 102 to the cathode tank 300. For the convenience of installation, when the Ph value sensor 402 is actually installed, it is preferred to set the Ph value sensor 402 on the pipeline where the anode plating solution flows from the anode chamber 101 to the anode tank 200 in the electroplating device, and / or, installed on the pipeline where the cathode plating solution flows from the cathode chamber 102 to the cathode tank 300. During installation, the Ph value sensor 402 can be installed in at least one of the pipeline where the anode plating solution flows from the anode chamber 101 to the anode tank 200 and the pipeline where the cathode plating solution flows from the cathode chamber 102 to the cathode tank 300.

[0063] It should be noted that the technical features of the first to third embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification. For example, please refer to Figure 4 , the Ph value sensor in the above-mentioned embodiment 3 can also be combined with embodiment 1 and / or embodiment 2. It should be understood that when embodiment 1 is combined with embodiment 3, because the first event that occurs once the ion membrane is damaged is that the pressure in the anode chamber changes instantly, the pressure sensor also detects the change in the pressure in the anode chamber at the first time, so the speed at which the pressure sensor in embodiment 1 detects the change will be faster than the speed at which the Ph value sensor in embodiment 3 detects the change. When making a judgment, the data in embodiment 1 is judged first, and then the data in embodiment 3 is further reviewed and judged; when embodiment 2 is combined with embodiment 3, because in the normal process, the cathode tank and the anode tank are replenished with electroplating solution intermittently, and when it is found that the change rate of the first liquid level value detection signal representing the liquid level value in the anode tank and / or the cathode tank exceeds the preset liquid level value change After the rate range, in order to ensure the continuous operation of the machine, the electroplating solution is continuously replenished, so the speed at which the continuous liquid level sensor in Example 2 detects the change rate of the first liquid level detection signal will be faster than the range of the Ph value change detected by the Ph value sensor in Example 3. Therefore, when Example 2 is combined with Example 3, the first result detected is the change rate result of the first liquid level detection signal, and then the result of the Ph value change detected by the Ph value sensor; when Example 1, Example 2 and Example 3 are combined to detect the state of the ion membrane, the result detected by the pressure sensor in Example 1 is first detected, and then the result of the change rate of the first liquid level detection signal detected by the continuous liquid level sensor in Example 2 is detected, and then the Ph value change result in Example 3 is detected. In the process of the electroplating device, once the monitoring mechanism detects that any of the above event information is abnormal, an alarm is issued to remind the staff to check, and the staff needs to check other monitoring items. For example, if the pressure detection value signal of the pressure sensor is abnormal (exceeding the preset pressure value change range), when the alarm sounds an alarm, when the staff investigates the pressure abnormality, they also need to check whether the detection signals of the Ph sensor and the liquid level sensor are abnormal. Once the ion membrane is damaged, the liquid level of the anode tank, the liquid level of the cathode tank, the Ph value of the anode cavity, the Ph value of the cathode cavity, and the pressure in the anode cavity will change. When an alarm is triggered in one of the liquid level, Ph value, and pressure monitored by the monitoring mechanism, the control device will issue an alarm instruction to prompt the staff to check and confirm the corresponding liquid level, Ph value, and pressure of the electroplating device.

[0064] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein; and these modifications or substitutions do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. An electroplating device having the function of monitoring the state of an ion membrane in an electroplating chamber, characterized in that: The electroplating device comprises: An electroplating chamber, wherein an ion membrane is disposed inside the electroplating chamber, and the ion membrane divides the electroplating chamber into a cathode chamber and an anode chamber; an anode tank configured to contain an anode plating solution and connected to the anode chamber via a pipeline so that the anode plating solution circulates between the anode chamber and the anode tank; a cathode tank configured to contain a cathode plating solution and connected to the cathode chamber via a pipeline so that the cathode plating solution circulates between the cathode chamber and the cathode tank; A monitoring mechanism is configured to monitor at least one event information of the electroplating device, wherein the event information is used to determine the state of the ion membrane.

2. The electroplating device according to claim 1, characterized in that: The event information includes changes in the pressure in the anode chamber; the monitoring mechanism includes: A pressure sensor, used for sensing the pressure in the anode cavity and generating a pressure value detection signal; The controller is used to receive the pressure value detection signal, and when the pressure value detection signal exceeds a preset pressure value variation range, determine that the state of the ion membrane is an abnormal state.

3. The electroplating device according to claim 2, characterized in that: The pressure sensor is arranged on the side wall of the anode chamber.

4. The electroplating device according to claim 1, characterized in that: The event information includes changes in the liquid level value in the anode tank and / or the cathode tank; the monitoring mechanism includes: A continuous liquid level sensor, used for sensing the liquid level value in the anode tank and / or the cathode tank and generating a first liquid level value detection signal; The controller is used to receive the first liquid level detection signal, and when the change rate of the first liquid level detection signal exceeds a preset liquid level change rate range, determine that the state of the ion membrane is an abnormal state.

5. The electroplating device according to claim 4, characterized in that: The monitoring agency also includes: A breakpoint liquid level sensor, connected to the controller for communication, configured to monitor the liquid level value in the anode tank and / or the cathode tank and generate a second liquid level value detection signal; The controller is also configured to receive the second liquid level value detection signal, and when the second liquid level value detection signal exceeds a threshold, determine that the state of the ion membrane is abnormal, wherein the threshold includes a preset high liquid level limit value and a low liquid level limit value in the anode tank and / or the cathode tank.

6. The electroplating device according to claim 5, characterized in that: The continuous liquid level sensor is arranged in the anode tank and / or the cathode tank; The breakpoint type liquid level sensor is arranged in the anode tank and / or the cathode tank.

7. The electroplating device according to claim 1, characterized in that: The event information includes changes in the Ph value of the anode plating solution and / or the cathode plating solution, and the monitoring mechanism includes: A Ph value sensor, used for sensing the Ph value of the anode plating solution and / or the cathode plating solution and generating a Ph value detection signal; The controller is used to receive the Ph value detection signal, and when the Ph value detection signal exceeds a preset Ph value variation range, determine that the state of the ion membrane is an abnormal state.

8. The electroplating device according to claim 7, characterized in that: The Ph value sensor is arranged in the anode cavity and / or the cathode cavity.

9. The electroplating device according to claim 7, characterized in that: The Ph value sensor is arranged on the pipeline of the anode plating solution flowing from the anode cavity to the anode tank, and / or, is arranged on the pipeline of the cathode plating solution flowing from the cathode cavity to the cathode tank.

10. A method for monitoring the state of an ion membrane in an electroplating chamber, characterized in that: Monitor at least one event information of the electroplating device, wherein the event information is used to determine the state of the ion membrane, wherein the event information includes one or any combination of the following: a change in the pressure in the anode chamber, a change in the liquid level value in the anode tank and / or the cathode tank, and a change in the Ph value of the anode plating solution and / or the cathode plating solution.

11. The monitoring method according to claim 10, characterized in that: When the event information includes a change in the pressure in the anode chamber, the monitoring method includes: Real-time detection of the pressure in the anode chamber of the electroplating device to generate a pressure value detection signal; The pressure value detection signal is monitored, and when the pressure value detection signal exceeds a preset pressure value variation range, it is determined that the state of the ion membrane is an abnormal state.

12. The monitoring method according to claim 10, characterized in that: When the event information includes changes in the liquid level values ​​in the anode tank and / or the cathode tank, the monitoring method includes: Real-time detection of the liquid level value in the anode tank and / or cathode tank connected to the electroplating chamber to generate a first liquid level detection signal; The first liquid level detection signal is monitored, and when a change rate of the first liquid level detection signal exceeds a preset liquid level change rate range, it is determined that the state of the ion membrane is an abnormal state.

13. The monitoring method according to claim 10, characterized in that: When the event information includes a change in the Ph value of the anode plating solution and / or the cathode plating solution, the monitoring method includes: Real-time detection of the Ph value of the anode plating solution and / or cathode plating solution connected to the plating chamber and generating a Ph value detection signal; The Ph value detection signal is monitored, and when the Ph value detection signal exceeds a preset Ph value variation range, the state of the ion membrane is determined to be an abnormal state.

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