Binding method of heterogeneous metals

Abstract

A dissimilar metal bonding method comprises the steps that (a) first and second metal pieces which are made of different materials are arranged in a lower die cavity of a lower die, the lower die cavity is provided with a bottom and a top which is transversely provided with the first and second metal pieces at intervals and is close to the bottom relative to the top surfaces of the first and second metal pieces, and the lower die comprises a runner communicating the bottom of the lower die cavity with the outside of the lower die; (b) the upper mold cavity of the upper mold faces the lower mold cavity to be assembled on the lower mold, the upper mold cavity is defined by an inner ring face, back to the lower mold cavity, of the face, making contact with the lower mold, of the upper mold and an inner base face connected with the inner ring face, and the inner base face, the top faces of the first metal piece and the second metal piece are coplanar after mold assembly; and (c) the bonding glue is injected from the runner to fill the gap between the bottom of the lower mold cavity and the first metal piece and the second metal piece, the viscosity of the bonding glue is not enough to enable the bonding glue to flow out of the lower mold, and the bonding glue can be directly and upwards filled into the gap at the top of the lower mold cavity from the bottom of the lower mold cavity in the single step (c), so that the effect of transversely bonding the first metal piece and the second metal piece is achieved. And the manufacturing process is simplified.

Description

Technical Field

[0001] The invention relates to a bonding method, in particular to a bonding method of heterogeneous metals. Background Art

[0002] With the advancement of the technology industry, the demand for 3C products such as computers and computer peripherals, communications and consumer electronics is increasing day by day. As consumers' requirements for the appearance of 3C products are gradually increasing, the appearance design of 3C products has also been increasingly valued by the industry. Therefore, in the relevant technical industries of 3C products, such as mobile phones, laptops and tablet computers, the beauty of the casing / shell of 3C products is particularly valued. Among the existing types of 3C product casings, the most common ones are casings that combine plastic and metal, and casings that combine heterogeneous metals. Based on the property of metal that can reflect light sources, it can bring consumers a dazzling visual experience in the presentation of appearance, and is highly valued. However, the problem that the industry is troubled by the casing composed of heterogeneous metals is the lack of integration at the junction of different metals.

[0003] For example, see Figure 1 and Figure 2 The invention patent case with Chinese application publication number CN106544674A (hereinafter referred to as case 1) discloses a surface treatment process for combining a magnesium die-casting workpiece and an aluminum part, which includes a step S1, a step S2, a step S3, a step S4, a step S5, and a step S6.

[0004] The step S1 is to grind and sandblast a bonding surface 111 of a magnesium die casting 11 and a bonding surface 121 of an aluminum frame 12 to provide a good bonding surface for subsequent connection and thermal spraying. The step S2 is to apply a glue 13 on the bonding surface 111 of the magnesium die casting 11 after grinding and sandblasting. The step S3 is to connect the bonding surface 121 of the aluminum frame 12 after grinding and sandblasting to the glue 13 to form a workpiece assembly with the magnesium die casting 11. The step S4 is to thermally spray a nickel-aluminum material 14 at a gap after connecting the magnesium die casting 11 and the aluminum frame 12. The step S5 is to partially grind the nickel-aluminum material 14 to make it integrated with the workpiece assembly as a whole and more natural. The step S6 is to spray paint the surface appearance of the workpiece assembly after grinding.

[0005] Although the previous case 1 can solve the problem of insufficient integrity of the heterogeneous metal joint, the previous case 1 cannot completely combine the magnesium die casting 11 and the aluminum frame 12 in a single step (i.e., step S3) during the process of combining the magnesium die casting 11 and the aluminum frame 12. The previous case 1 still needs to perform the thermal spraying of step S4 to form the nickel-aluminum material 14 in the gap between the magnesium die casting 11 and the aluminum frame 12 in order to completely combine the magnesium die casting 11 and the aluminum frame 12. Therefore, the previous case 1 is relatively complicated in the means of combining the magnesium die casting 11 and the aluminum frame 12.

[0006] It can be seen from the above description that improving the method of combining heterogeneous metals to simplify the manufacturing process is a problem to be solved by relevant practitioners in the technical field. Summary of the invention

[0007] The object of the present invention is to provide a method for combining heterogeneous metals which can simplify the manufacturing process.

[0008] The method for combining heterogeneous metals of the present invention comprises the following steps: step (a), step (b), and step (c).

[0009] The step (a) is to arrange a first metal piece and a second metal piece of different materials in a lower mold cavity of a lower mold, wherein the lower mold cavity has a bottom, and the first metal piece and the second metal piece are arranged laterally at intervals and close to the top of the bottom relative to the top surface of the first metal piece and the top surface of the second metal piece. The lower mold includes a flow channel extending from the bottom of the lower mold cavity to one side of the lower mold to communicate with the outside of the lower mold.

[0010] The step (b) is to close the mold on the lower mold with the upper mold cavity of the upper mold facing the lower mold cavity of the lower mold, wherein the upper mold cavity is defined by an inner annular surface that is recessed toward the lower mold on one side of the upper mold that contacts the lower mold and faces away from the lower mold, and an inner base surface connecting the inner annular surface, and the inner base surface, the top surface of the first metal part and the top surface of the second metal part are coplanar after closing the mold.

[0011] The step (c) is to inject bonding glue from the flow channel so that the bonding glue fills the bottom of the lower mold cavity and the gap between the first metal part and the second metal part, wherein the bonding glue has a viscosity sufficient to prevent it from flowing out of the lower mold.

[0012] In the method for bonding heterogeneous metals of the present invention, in the step (c), the viscosity of the bonding glue is between 15000 cps and 50000 cps.

[0013] In the method for bonding heterogeneous metals of the present invention, in the step (c), the bonding adhesive is implemented using a thermosetting epoxy resin.

[0014] In the method for combining heterogeneous metals of the present invention, in step (a), the flow channel of the lower mold has a width, and the width of the flow channel at the bottom of the lower mold cavity of the lower mold is smaller than its width at the side of the lower mold.

[0015] In the method for combining heterogeneous metals of the present invention, in the step (a), the width of the flow channel of the lower mold is no more than 2 mm at the bottom of the lower mold cavity.

[0016] The method for combining heterogeneous metals of the present invention further comprises a step (d) after the step (c), wherein the step (d) is to cure the bonding adhesive after the step (c) to combine the first metal component and the second metal component.

[0017] The method for combining heterogeneous metals of the present invention further comprises a step (e) after the step (d), wherein the step (e) is to remove the upper mold and take out the first metal part and the second metal part that are combined by curing with the bonding adhesive from the lower mold cavity of the lower mold.

[0018] The method for bonding heterogeneous metals of the present invention further comprises a step (f) after the step (e), wherein the step (f) is to grind the bonding glue at the gap from the top surface of the first metal component and the top surface of the second metal component.

[0019] The method for bonding heterogeneous metals of the present invention further comprises a step (g) after the step (f), wherein the step (g) is to spray a paint layer on the top surface of the first metal part, the top surface of the second metal part and the bonding glue at the gap.

[0020] The beneficial effect of the present invention is that during the implementation of a single step (c), the bonding adhesive can be directly filled upward from the bottom of the lower mold cavity to the gap at the top of the lower mold cavity, so as to achieve the effect of horizontally bonding the first metal part and the second metal part, thereby simplifying the production process. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Other features and effects of the present invention will be clearly presented in the embodiments with reference to the accompanying drawings, in which:

[0022] Figure 1 It is a schematic diagram of a manufacturing process, which illustrates a surface treatment process of combining a magnesium die-casting workpiece and an aluminum part disclosed in the invention patent case with Chinese application publication number CN106544674A, a step S1, a step S2 and a step S3;

[0023] Figure 2 Is a continuation Figure 1A schematic diagram of a manufacturing process, illustrating a step S4, a step S5 and a step S6 of the surface treatment process of combining the magnesium die-casting workpiece and the aluminum part;

[0024] Figure 3 is a schematic diagram illustrating a step (a) of an embodiment of a method for bonding dissimilar metals of the present invention;

[0025] Figure 4 is a schematic diagram illustrating a step (b) of the bonding method of the embodiment of the present invention;

[0026] Figure 5 is a schematic diagram illustrating a step (c) of the bonding method of the embodiment of the present invention;

[0027] Figure 6 is a schematic diagram illustrating a step (d) of the bonding method of the embodiment of the present invention;

[0028] Figure 7 is a schematic diagram illustrating a step (e) of the bonding method according to an embodiment of the present invention; and

[0029] Figure 8 is a schematic diagram illustrating a step (g) of the combining method according to the embodiment of the present invention. DETAILED DESCRIPTION

[0030] Before the present invention is described in detail, it should be noted that similar elements are denoted by the same reference numerals in the following description.

[0031] An embodiment of the method for combining heterogeneous metals of the present invention is suitable for making casings of 3C products such as laptop computers, tablet computers, and mobile phones, and includes the following steps: a step (a), a step (b), and a step (c).

[0032] See also Figure 3 , the step (a) is to arrange a first metal member 3 and a second metal member 4 of different materials in a lower mold cavity 20 of a lower mold 2. The lower mold cavity 20 has a bottom 201, and a top 202 on which the first metal member 3 and the second metal member 4 are arranged laterally at intervals, a top surface 31 opposite to the first metal member 3 and a top surface 41 of the second metal member 4 and close to the bottom 201. The lower mold 2 includes a flow channel 203 extending from the bottom 201 of the lower mold cavity 20 to a side 21 of the lower mold 2 to communicate with the outside of the lower mold 2. In the embodiment of the present invention, a gap 204 is formed between the first metal member 3 and the second metal member 4 arranged laterally at intervals at the top 202 of the lower mold cavity 20. The metal material suitable for the first metal member 3 and the second metal member 4 of the present invention can be selected from magnesium (Mg), aluminum (Al), stainless steel, or titanium (Ti).

[0033] See also Figure 4 , the step (b) is to mold an upper mold cavity 50 of an upper mold 5 onto the lower mold 2 facing the lower mold cavity 20 of the lower mold 2. The upper mold cavity 50 is defined by an inner annular surface 52, which is recessed away from the lower mold 2 and has a surface 51 of the upper mold 5 in contact with the lower mold 2, and an inner base surface 53 connected to the inner annular surface 52, and the inner base surface 53, the top surface 31 of the first metal component 3, and the top surface 41 of the second metal component 4 are coplanar after the mold is closed.

[0034] See also Figure 5 The step (c) is to inject a bonding adhesive 6 from the flow channel 203 so that the bonding adhesive 6 fills the bottom 201 of the lower mold cavity 20 and the gap 204 between the first metal member 3 and the second metal member 4. The bonding adhesive 6 has a viscosity that is sufficient to prevent it from flowing outside the lower mold 2.

[0035] Preferably, in the step (c), the viscosity of the bonding adhesive 6 is between 15000 cps and 50000 cps. More preferably, in the step (c), the bonding adhesive 6 is made of a thermosetting epoxy resin.

[0036] Preferably, the embodiment of the present invention further comprises a step (d) after the step (c); further comprises a step (e) after the step (d); further comprises a step (f) after the step (e); and further comprises a step (g) after the step (f).

[0037] See also Figure 6 , the step (d) is to cure the bonding adhesive 6 after the step (c) to bond the first metal member 3 and the second metal member 4. Specifically, the step (d) of the embodiment of the present invention is to place the lower mold 2, the first metal member 3, the second metal member 4, the upper mold 5 and the bonding adhesive 6 in an oven 7, and perform the curing at a curing temperature between 60° C. and 90° C. for a curing time of 60 seconds to 90 seconds.

[0038] See also Figure 7 , the step (e) is to remove Figure 6 The upper mold 5 shown in the figure takes out the first metal component 3 and the second metal component 4 that are cured and bonded by the bonding adhesive 6 from the lower mold cavity 20 of the lower mold 2 .

[0039] It should be noted here that, in order to facilitate the implementation of the step (e), the first metal member 3 and the second metal member 4 disposed in the lower mold cavity 20 are easily demolded, and the bonding glue 6 solidified in the flow channel 203 of the lower mold 2 is prevented from hindering the demolding. Figure 3 As shown, in the step (a), the flow channel 203 of the lower mold 2 has a width. The width of the flow channel 203 at the bottom 201 of the lower mold cavity 20 of the lower mold 2 is smaller than its width at the side 21 of the lower mold 2. More preferably, in the step (a), the width of the flow channel 203 of the lower mold 2 at the bottom 201 of the lower mold cavity 20 is not greater than 2 mm. It can be seen that since the width of the flow channel 203 at the bottom 201 of the lower mold cavity 20 of the lower mold 2 in the embodiment of the present invention is only 2 mm; therefore, Figure 7 As shown, the size of the bonding glue 6 located in the flow channel 203 of the lower mold 2 of the present invention at the bottom 201 of the lower mold cavity 20 is only 2 mm. When the first metal member 3 and the second metal member 4 that are cured and bonded by the bonding glue 6 are taken out from the lower mold cavity 20, the bonding glue 6 located at the bottom 201 of the lower mold cavity 20 can be directly disconnected from the bonding glue 6 in the flow channel 203.

[0040] The step (f) is performed after the step (c) is performed. Specifically, when the bonding glue 6 at the gap 204 is uneven due to overflow after the step (c), the step (f) is performed. The step (f) is to grind the bonding glue 6 at the gap 204 from the top surface 31 of the first metal member 3 and the top surface 41 of the second metal member 4 to make it smooth.

[0041] See also Figure 8 The step (g) is to spray a paint layer 8 on the top surface 31 of the first metal member 3 , the top surface 41 of the second metal member 4 and the bonding glue 6 at the gap 204 .

[0042] As can be seen from the above detailed description, the embodiment of the present invention can make the bonding glue 6 directly fill upward from the bottom 201 of the lower die cavity 20 to the gap 204 located at the top 202 of the lower die cavity 20 during the implementation of a single step (c), so as to achieve the effect of horizontally bonding the first metal member 3 and the second metal member 4. In contrast, in the process of bonding the magnesium die casting 11 and the aluminum frame 12, the previous case 1 needs to first implement the step S3 (that is, use the glue 13 to bond the bonding surface 111 of the magnesium die casting 11 and the bonding surface 121 of the aluminum frame 12), and then implement the step S4 (that is, use thermal spraying to form the nickel-aluminum material 14 in the gap between the magnesium die casting 11 and the aluminum frame 12) to completely bond the magnesium die casting 11 and the aluminum frame 12, and the process is relatively complicated.

[0043] In summary, the method for combining heterogeneous metals of the present invention can fill the gap 204 between the first metal member 3 and the second metal member 4 in a single step (c) to achieve the effect of horizontally combining the first metal member 3 and the second metal member 4, thereby simplifying the manufacturing process and truly achieving the purpose of the present invention.

[0044] However, what is described above is only an embodiment of the present invention and should not be used to limit the scope of implementation of the present invention. All simple equivalent changes and modifications made according to the claims and the contents of the patent specification of the present invention are still within the scope of the patent of the present invention.

Claims

1. A method for bonding heterogeneous metals, characterized in that: The following steps are involved: Step (a), arranging a first metal member and a second metal member of different materials in a lower mold cavity of a lower mold, wherein the lower mold cavity has a bottom, and the first metal member and the second metal member are arranged laterally and spaced apart and close to the top of the bottom relative to the top surface of the first metal member and the top surface of the second metal member, and the lower mold includes a flow channel extending from the bottom of the lower mold cavity to one side of the lower mold to communicate with the outside of the lower mold; Step (b), closing the mold on the lower mold with the upper mold cavity of the upper mold facing the lower mold cavity of the lower mold, wherein the upper mold cavity is defined by an inner annular surface of the upper mold that contacts the lower mold and faces away from the lower mold and is recessed, and an inner base surface connected to the inner annular surface, and the inner base surface, the top surface of the first metal part and the top surface of the second metal part are coplanar after closing the mold; and Step (c), injecting bonding glue from the flow channel to fill the bottom of the lower mold cavity and the gap between the first metal component and the second metal component with the bonding glue, wherein the bonding glue has a viscosity sufficient to prevent it from flowing out of the lower mold.

2. The method for bonding heterogeneous metals according to claim 1, characterized in that: In the step (c), the viscosity of the bonding adhesive is between 15000 cps and 50000 cps.

3. The method for bonding heterogeneous metals according to claim 1, characterized in that: In the step (c), the bonding adhesive is implemented using a thermosetting epoxy resin.

4. The method for bonding dissimilar metals according to claim 1, characterized in that: In the step (a), the flow channel of the lower mold has a width, and the width of the flow channel at the bottom of the lower mold cavity of the lower mold is smaller than the width of the flow channel at the side of the lower mold.

5. The method for bonding dissimilar metals according to claim 4, characterized in that: In the step (a), the width of the flow channel of the lower mold is no greater than 2 mm at the bottom of the lower mold cavity.

6. The method for bonding dissimilar metals according to claim 1, characterized in that: The method further comprises a step (d) after the step (c), wherein the step (d) is to cure the bonding adhesive after the step (c) to bond the first metal component and the second metal component.

7. The method for bonding dissimilar metals according to claim 6, characterized in that: The method further comprises a step (e) after the step (d), wherein the step (e) is to remove the upper mold and take out the first metal component and the second metal component which are bonded by curing of the bonding adhesive from the lower mold cavity of the lower mold.

8. The method for bonding dissimilar metals according to claim 7, characterized in that: The method further comprises a step (f) after the step (e), wherein the step (f) is to grind the bonding glue at the gap from the top surface of the first metal component and the top surface of the second metal component.

9. The method for bonding dissimilar metals according to claim 8, characterized in that: The method further comprises a step (g) after the step (f), wherein the step (g) is to spray a paint layer on the top surface of the first metal component, the top surface of the second metal component and the bonding glue at the gap.

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