Nanoscale high-speed sample slicing device and method

Abstract

The invention discloses a nanoscale high-speed sample slicing device and a nanoscale high-speed sample slicing method, and relates to the technical field of pathological research. The nanoscale high-speed sample slicing device is provided with a high-speed air static pressure main shaft and a mechanical feeding table which are respectively fixed on two layers of step surfaces of a base from left to right; the upper surface and the lower surface of the piezoelectric ceramic are fixedly connected with the bottom face of the tool rest and the mechanical feeding table respectively. A sample is fixed at the front end of the high-speed air static pressure spindle through a sample clamp; the slice collecting groove sleeves the knife rest, the slice transmission belt is fixedly mounted on the inner side face of the slice collecting groove, and the front end of the slice transmission belt is embedded in the knife rest. According to the slicing method, an equipment basis is provided for breaking through the thickness limit of the current biological slice, a guarantee is provided for the stability of the ultrathin slice of the biological sample, the biological slice sample can be efficiently and automatically collected, and the development of the pathological analysis field is assisted.

Description

Technical Field

[0001] The present invention relates to the technical field of pathological research, and in particular to a nanometer-level high-speed sample slicing device and method. Background Art

[0002] In pathology research, bioslicers are indispensable tools used to cut biological samples into thin layers for examination under a microscope. The continuous development of the field of pathology has put forward higher and higher standards for the thickness of slices. Specifically, many current experiments and diagnostic processes require the use of slices with a thickness of no more than 1μm. However, the existing slice technology still has some technical obstacles in the process of stably preparing thin slices with a thickness of less than 1μm.

[0003] These technical obstacles are mainly reflected in two aspects: on the one hand, the accuracy of existing equipment is insufficient, for example, the motion error of the slicing axis and the feed error of the feed axis usually exceed 1μm, which directly limits the minimum thickness of the slice. On the other hand, the slicing speed is insufficient, which is mainly limited by the acceleration and movement range of the slicing axis, resulting in curling and wrinkling of the slice. These factors lead to uneven slicing process and uneven slicing quality, which in turn affects the accuracy of pathological analysis results.

[0004] To address these issues, researchers in this field are committed to developing a novel nanoscale high-speed sample slicing technology that aims to achieve more precise slicing: improving the consistency and speed of the slicing process, which will help provide more refined analysis samples to improve the accuracy of pathological research. Summary of the invention

[0005] In view of the above-mentioned defects of the prior art, the technical problem to be solved by the present invention is that the working speed and working accuracy of the biological sample slicing device cannot meet the requirements of high-speed slicing.

[0006] To achieve the above-mentioned purpose, the present invention provides a nano-scale high-speed sample slicing device, which comprises a base 1, a high-speed air static pressure spindle 2, a tool holder 3, a mechanical feed table 4, a piezoelectric ceramic 5, a sample fixture 6, a sample 7, a slice collecting groove 8, a slice transmission belt 9, and a dynamic balance block 10, wherein the high-speed air static pressure spindle 2 and the mechanical feed table 4 are respectively fixed on two step surfaces of the base 1 from left to right, and the upper and lower surfaces of the piezoelectric ceramic 5 are respectively fixedly connected to the bottom surface of the tool holder 3 and the top surface of the mechanical feed table 4; the sample 7 is fixed to the front end of the high-speed air static pressure spindle 2 through the sample fixture 6; the slice collecting groove 8 is sleeved on the outer side of the tool holder 3, the slice transmission belt 9 is fixedly installed on the inner side of the slice collecting groove 8, and the front end of the slice transmission belt 9 is embedded in the tool holder 3.

[0007] In a preferred embodiment of the present invention, Figure 4As shown, the two grooves 6-1 and 6-2 on the end surface of the sample fixture 6 are used to fix and install the sample 7 and the dynamic balancing block 10 respectively, and the outer circle of the sample fixture is evenly distributed with 12 dynamic balancing holes 6-3.

[0008] In another preferred embodiment of the present invention, when the high-speed air static pressure spindle 2 drives the sample fixture 6 to rotate at a high speed, the radial rotation error of the outer circle of the sample fixture 6 is less than 20 nm.

[0009] In another preferred embodiment of the present invention, the present invention further provides a nanoscale high-speed sample slicing method, the nanoscale high-speed sample slicing method comprising the following operating steps:

[0010] S1. Press Figure 1 The sample 7 and the dynamic balancing weight 10 are fixedly mounted in the grooves 6 - 1 and 6 - 2 of the sample fixture 6 ;

[0011] S2. Start the high-speed air static pressure spindle 2, set the speed to 500-1500rpm, use the spindle dynamic balancer to measure its dynamic unbalance and adjust it until the dynamic unbalance of the spindle is <50mg;

[0012] S3. Rotate the sample 7 to a position on the same horizontal line as the top of the tool holder 3, adjust the mechanical feed stage 4, so that the sample 7 approaches the tool holder 3 until the tool contacts the sample surface;

[0013] S4. Control the mechanical feed table 4 to drive the tool holder 3 to feed, with a single-step feed amount of 5-20 μm, and a total of 5-10 times of feeding. At the same time, the slicing belt 9 is turned on to collect the chips in the slicing collection slot 8, and the trimming of the sample 7 is completed;

[0014] S5. Control the piezoelectric ceramic 5 to drive the tool holder 3 to feed, with a single-step feeding amount of 0.1-0.5 μm, and a total feeding of 1-10 times. At the same time, the slicing drive belt 9 is turned on to collect the sample slices in the slicing collection slot 8 to complete the high-speed ultra-thin slicing of the sample 7. The speed of the slicing drive belt 9 needs to match the slicing frequency to ensure that adjacent sample slices are 1-5 mm apart and do not overlap each other;

[0015] S6. Control the mechanical feed stage 4 to drive the tool holder 3 away from the sample, and the high-speed air static pressure spindle 2 stops rotating.

[0016] The present invention provides a high-speed, high-precision slicing and automatic collection device and method for biological samples, wherein the high-speed spindle can achieve a higher linear speed by continuous acceleration, thereby driving the sample to achieve high-speed slicing. At the same time, the high-precision air static pressure spindle can achieve a rotation error of less than 20nm after adjusting the dynamic balance, that is, the motion error during sample slicing is less than 20nm, which provides a guarantee for the stability of ultra-thin slicing of biological samples. At the same time, the cut biological sample slices can be conveyed and collected using a conveyor belt.

[0017] The concept, specific structure and technical effects of the present invention will be further described below in conjunction with the accompanying drawings to fully understand the purpose, characteristics and effects of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a front view of a nanometer-level high-speed sample slicing device according to a preferred embodiment of the present invention;

[0019] Figure 2 is a side view of a nanometer-level high-speed sample slicing device according to a preferred embodiment of the present invention;

[0020] Figure 3 is an axonometric diagram of a nanometer-level high-speed sample slicing device according to a preferred embodiment of the present invention;

[0021] Figure 4 The present invention is a sample holder according to a preferred embodiment of the present invention. DETAILED DESCRIPTION

[0022] The following describes several preferred embodiments of the present invention with reference to the drawings in the specification, so that the technical content is clearer and easier to understand. The present invention can be embodied in many different forms of embodiments, and the protection scope of the present invention is not limited to the embodiments mentioned in the text.

[0023] In the drawings, components with the same structure are indicated by the same numerical reference numerals, and components with similar structures or functions are indicated by similar numerical reference numerals. The size and thickness of each component shown in the drawings are arbitrarily shown, and the present invention does not limit the size and thickness of each component. In order to make the illustration clearer, the thickness of the components is appropriately exaggerated in some places in the drawings.

[0024] like Figure 1 As shown, a nanometer-level high-speed sample slicing device comprises a base 1, a high-speed air static pressure spindle 2, a tool holder 3, a mechanical feed table 4, a piezoelectric ceramic 5, a sample fixture 6, a sample 7, a slice collecting groove 8, a slice transmission belt 9, and a dynamic balance block 10, wherein the high-speed air static pressure spindle 2 and the mechanical feed table 4 are fixed on two step surfaces of the base 1 from left to right, respectively, and the upper and lower surfaces of the piezoelectric ceramic 5 are fixedly connected to the bottom surface of the tool holder 3 and the top surface of the mechanical feed table 4 respectively; the sample 7 is fixed to the front end of the high-speed air static pressure spindle 2 through the sample fixture 6; the slice collecting groove 8 is sleeved on the outer side of the tool holder 3, the slice transmission belt 9 is fixedly installed on the inner side of the slice collecting groove 8, and the front end of the slice transmission belt 9 is embedded in the tool holder 3.

[0025] In a preferred embodiment of the present invention, Figure 4As shown, the two grooves 6-1 and 6-2 on the end surface of the sample fixture 6 are used to fix and install the sample 7 and the dynamic balancing block 10 respectively, and the outer circle of the sample fixture is evenly distributed with 12 dynamic balancing holes 6-3.

[0026] In another preferred embodiment of the present invention, when the high-speed air static pressure spindle 2 drives the sample fixture 6 to rotate at a high speed, the radial rotation error of the outer circle of the sample fixture 6 is less than 20 nm.

[0027] In another preferred embodiment of the present invention, the present invention further provides a nanoscale high-speed sample slicing method, the nanoscale high-speed sample slicing method comprising the following operating steps:

[0028] S1. Press Figure 1 The sample 7 and the dynamic balancing weight 10 are fixedly mounted in the grooves 6 - 1 and 6 - 2 of the sample fixture 6 ;

[0029] S2. Start the high-speed air static pressure spindle 2, set the speed to 500-1500rpm, use the spindle dynamic balancer to measure its dynamic unbalance and adjust it until the dynamic unbalance of the spindle is <20mg;

[0030] S3. Rotate the sample 7 to a position on the same horizontal line as the top of the tool holder 3, adjust the mechanical feed stage 4, so that the sample 7 approaches the tool holder 3 until the tool contacts the sample surface;

[0031] S4. Control the mechanical feed table 4 to drive the tool holder 3 to feed, with a single-step feed amount of 5-20 μm, and a total of 5-10 times of feeding. At the same time, the slicing belt 9 is turned on to collect the chips in the slicing collection slot 8, and the trimming of the sample 7 is completed;

[0032] S5. Control the piezoelectric ceramic 5 to drive the tool holder 3 to feed, with a single-step feeding amount of 0.1-0.5 μm, and a total feeding of 1-10 times. At the same time, the slicing drive belt 9 is turned on to collect the sample slices in the slicing collection slot 8 to complete the high-speed ultra-thin slicing of the sample 7. The speed of the slicing drive belt 9 needs to match the slicing frequency to ensure that adjacent sample slices are 1-5 mm apart and do not overlap each other;

[0033] S6. Control the mechanical feed stage 4 to drive the tool holder 3 away from the sample, and the high-speed air static pressure spindle 2 stops rotating.

[0034] The preferred specific embodiments of the present invention are described in detail above. It should be understood that ordinary technicians in the field can make many modifications and changes based on the concept of the present invention without creative work. Therefore, all technical solutions that can be obtained by technicians in the technical field based on the concept of the present invention through logical analysis, reasoning or limited experiments on the basis of the prior art should be within the scope of protection determined by the claims.

Claims

1. A nanometer-scale high-speed sample slicing device, characterized in that: The invention comprises a base (1), a high-speed air static pressure spindle (2), a tool holder (3), a mechanical feed table (4), a piezoelectric ceramic (5), a sample fixture (6), a sample (7), a slice collecting groove (8), a slice transmission belt (9), and a dynamic balance block (10); wherein the high-speed air static pressure spindle (2) and the mechanical feed table (4) are respectively fixed on two step surfaces of the base (1) from left to right, and the upper and lower surfaces of the piezoelectric ceramic (5) are respectively fixedly connected to the bottom surface of the tool holder (3) and the top surface of the mechanical feed table (4); the sample (7) is fixed to the front end of the high-speed air static pressure spindle (2) through the sample fixture (6); the slice collecting groove (8) is sleeved on the outer side of the tool holder (3), the slice transmission belt (9) is fixedly installed on the inner side of the slice collecting groove (8), and the front end of the slice transmission belt (9) is embedded in the tool holder (3).

2. The device according to claim 1, characterized in that The two grooves (6-1) and (6-2) on the end surface of the sample fixture (6) are used to fix and install the sample (7) and the dynamic balancing block (10) respectively.

3. The device according to claim 2, characterized in that The outer circle of the sample fixture is evenly distributed with 12 dynamic balancing holes (6-3).

4. The device according to claim 1, characterized in that When the high-speed air static pressure main shaft (2) drives the sample fixture (6) to rotate at a high speed, the radial rotation error of the outer circle of the sample fixture (6) is less than 20nm.

5. A method for using the nanoscale high-speed sample slicing device according to any one of claims 1 to 4, characterized in that: The method comprises the following steps: Step 1. Fix the sample (7) and the dynamic balancing weight (10) in the grooves (6-1) and (6-2) of the sample fixture (6); Step 2. Start the high-speed air static pressure spindle (2), set the speed, and use a spindle dynamic balancer to measure its dynamic unbalance and make adjustments; Step 3. Rotate the sample (7) to a position on the same horizontal line as the top of the tool holder (3), and adjust the mechanical feed stage (4) to make the sample (7) approach the tool holder (3) until the tool contacts the sample surface; Step 4. Control the mechanical feeding table (4) to drive the tool holder (3) to feed, with a single-step feeding amount of 5-20 μm, and at the same time start the slicing transmission belt (9), collect the chips in the slicing collection groove (8), and complete the trimming of the sample (7); Step 5. Control the piezoelectric ceramic (5) to drive the tool holder (3) to feed, with a single-step feeding amount of 0.1-0.5 μm, and at the same time start the slice transmission belt (9), collect the sample slices in the slice collection tank (8), and complete the high-speed ultra-thin sectioning of the sample (7); Step 6: Control the mechanical feed stage (4) to drive the tool holder (3) away from the sample, and the high-speed air static pressure spindle (2) stops rotating.

6. The method according to claim 5, characterized in that In step 2, the high-speed air static pressure spindle speed is set to 500-1500 rpm.

7. The method according to claim 5, characterized in that In step 2, a spindle dynamic balancing instrument is used to measure the dynamic unbalance of the spindle and make adjustments until the dynamic unbalance of the spindle is less than 50 mg.

8. The method according to claim 5, characterized in that In step 4, the mechanical feeding table (4) is controlled to drive the tool holder (3) to feed 5-10 times in total.

9. The method according to claim 5, characterized in that In step 5, the piezoelectric ceramic (5) is controlled to drive the tool holder (3) to feed 1 to 10 times in total.

10. The method according to claim 5, characterized in that In step 5, the speed of the slice drive belt (9) needs to match the slice frequency to ensure that adjacent sample slices are 1-5 mm apart and do not overlap each other.

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