Electronic device and interface device including the same

Abstract

An electronic device and an interface device are disclosed. The interface device includes the electronic device and an input device. The electronic device includes a display layer including a display area including a foldable area and a non-foldable area; the sensor layer comprises a plurality of detection electrodes; and a sensor driving unit that drives the sensor layer. The plurality of detection electrodes comprise a first pen sensing electrode and a second pen sensing electrode; and the sensor driving unit transmits one of a first sensing signal having a first driving frequency and a second sensing signal having a second driving frequency different from the first driving frequency to the first pen sensing electrode according to a position of the input device with respect to the display area.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the priority of Korean Patent Application No. 10-2023-0098350 filed in the Korean Intellectual Property Office on July 27, 2023, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0003] Embodiments of the present disclosure described herein relate to an electronic device having improved sensing accuracy and an interface device including the electronic device. Background Art

[0004] Electronic devices that provide images to users, such as smart phones, digital cameras, laptop computers, navigation devices, and smart TVs, include electronic devices that display images. The electronic devices generate images and provide the images to users through a display area.

[0005] The electronic device includes a display layer that displays an image, a sensor layer that is disposed on the display layer and detects a user's touch, and a digitizer that is disposed under the display layer and detects a pen's touch. The digitizer may be implemented in an electromagnetic manner or an electromagnetic resonance manner.

[0006] The digitizer includes a plurality of coils. When the user moves the pen over the display device, the pen is driven by an alternating current (AC) signal that generates an oscillating magnetic field, and the oscillating magnetic field induces a signal in the coil. The position of the pen is detected by the signal induced in the coil. The digitizer determines the position of the pen by detecting the electromagnetic changes that occur as the pen approaches.

[0007] Two input devices such as a sensor layer and a digitizer are used separately and increase the thickness of the display device. A technology for reducing the thickness of the display device is desired. Summary of the invention

[0008] Embodiments of the present disclosure provide an electronic device with improved sensing accuracy and an interface device including the electronic device.

[0009] According to an embodiment, an interface device includes an electronic device and an input device that communicates with the electronic device. The electronic device includes: a display layer including a display area, the display area including a foldable area and a plurality of non-foldable areas spaced apart from each other, and the foldable area is interposed between the plurality of non-foldable areas; a sensor layer disposed on the display layer and including a plurality of detection electrodes; and a sensor driving unit driving the sensor layer. The plurality of detection electrodes include: a first sensing electrode; a second sensing electrode insulated from and crossing the first sensing electrode; a first sensing electrode adjacent to the first sensing electrode, insulated from and crossing the second sensing electrode; and a second sensing electrode adjacent to the second sensing electrode, insulated from and crossing the first sensing electrode and the first sensing electrode. The sensor driving unit transmits one of a first sensing signal having a first driving frequency and a second sensing signal having a second driving frequency different from the first driving frequency to the first sensing electrode according to the position of the input device relative to the display area.

[0010] The sensor driving unit may transmit a first sensing signal to the first pen sensing electrode, and transmit a second sensing signal to the first pen sensing electrode when the input device overlaps the foldable area.

[0011] The electronic device may further include a plurality of lower members disposed under the display layer and overlapping the plurality of non-foldable regions.

[0012] When viewed on a plane, the plurality of lower members may not overlap at least a portion of the foldable region.

[0013] The plurality of lower members may include a conductive shielding layer having electrical conductivity.

[0014] The electronic device may further include a first bracket disposed below the plurality of lower members, and the first bracket may overlap the foldable region and the plurality of non-foldable regions when viewed in a plan view.

[0015] The electronic device may further include a plurality of second brackets disposed below the plurality of lower members, and a first separation distance between the plurality of lower members may be smaller than a second separation distance between the plurality of second brackets.

[0016] The first driving frequency may be higher than the second driving frequency.

[0017] The first pen sensing electrode may include a plurality of first pen sensing electrodes, and two first pen sensing electrodes spaced apart from each other among the plurality of first pen sensing electrodes may be electrically connected to each other.

[0018] The sensor driving unit may transmit the first sensing signal and the second sensing signal to one of the two first pen sensing electrodes.

[0019] The first pen sensing electrode and the second pen sensing electrode may communicate with an input device.

[0020] The input device may include an electromagnetic resonance pen.

[0021] The input device may include an inductor and a capacitor.

[0022] The foldable region may be spaced apart from the plurality of non-foldable regions in a first direction, and the first pen sensing electrode may extend in a second direction crossing the first direction.

[0023] According to an embodiment, an electronic device includes: a display layer including a first area and a second area adjacent to the first area; a sensor layer disposed on the display layer and including a plurality of detection electrodes; and a sensor driving unit driving the sensor layer. The plurality of detection electrodes include: a plurality of first sensing electrodes; a plurality of second sensing electrodes insulated from and crossing the plurality of first sensing electrodes; a plurality of first sensing electrodes adjacent to the plurality of first sensing electrodes, insulated from and crossing the plurality of second sensing electrodes; and a plurality of second sensing electrodes adjacent to the plurality of second sensing electrodes, insulated from and crossing the plurality of first sensing electrodes and the plurality of first sensing electrodes. The sensor driving unit transmits a first sensing signal having a first driving frequency to a first sensing electrode among the plurality of first sensing electrodes to form a magnetic flux in the first area, and transmits a second sensing signal having a second driving frequency different from the first driving frequency to a first sensing electrode among the plurality of first sensing electrodes to form a magnetic flux in the second area. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 is a perspective view of an interface device according to an embodiment of the present disclosure.

[0025] Figure 2 and Figure 3 is a perspective view of a folded electronic device according to an embodiment of the present disclosure.

[0026] Figure 4 is a perspective view of an electronic device according to an embodiment of the present disclosure.

[0027] Figure 5 is a schematic diagram of an electronic device and an input device according to an embodiment of the present disclosure.

[0028] Figure 6 According to the embodiment of the present disclosure, Figure 1 A cross-sectional view of the electronic device taken along line II'.

[0029] Fig. 7Ais a schematic cross-sectional view of an electronic device according to an embodiment of the present disclosure.

[0030] Figure 7B is a schematic cross-sectional view of an electronic device according to an embodiment of the present disclosure.

[0031] Figure 8 is a cross-sectional view of a display module according to an embodiment of the present disclosure.

[0032] Fig. 9 is a cross-sectional view of a portion of an electronic device according to an embodiment of the present disclosure.

[0033] Fig.10 is a plan view of a sensor layer according to an embodiment of the present disclosure.

[0034] Fig.11 According to the embodiments of the present disclosure Fig.10 An enlarged plan view of area AA1.

[0035] Fig.12 is a plan view of a first sensing electrode and a (1-2)th sensing electrode according to an embodiment of the present disclosure.

[0036] Fig.13 According to the embodiment of the present disclosure, Fig.11 and Fig.12 A cross-sectional view taken along line II-II'.

[0037] Fig.14 According to the embodiment of the present disclosure, Fig.11 and Fig.12 A cross-sectional view taken along line III-III'.

[0038] Fig.15 is a flowchart of a method of driving a sensor driving unit according to an embodiment of the present disclosure.

[0039] Figures 16 to 18 Driving of the pen sensing electrode according to an embodiment of the present disclosure is shown.

[0040] Fig.19 A touch sensing operation for an input device is shown. DETAILED DESCRIPTION

[0041] In the present specification, the expression that a first component or a first region, a first layer, a first portion, a first part, etc. is “on”, “connected with” or “coupled to” a second component means that the first component is directly on the second component, directly connected with or directly coupled to the second component, or means that a third component is interposed between the first component and the second component.

[0042] Like reference numerals may refer to like components.

[0043] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0044] Figure 1 is a perspective view of an interface device according to an embodiment of the present disclosure, and Figure 2 and Figure 3 is a perspective view of a folded electronic device according to an embodiment of the present disclosure.

[0045] refer to Figures 1 to 3 In an embodiment, the interface device includes an electronic device 1000 and an input device PN.

[0046] The electronic device 1000 is activated by an electrical signal. The electronic device 1000 includes various implementations. For example, the electronic device 1000 may be a tablet personal computer (PC), a laptop computer, a computer, or a smart TV, etc. In an implementation, the electronic device 1000 is shown as a smart phone.

[0047] The electronic device 1000 includes a display layer 100 (see Figure 5 ). The electronic device 1000 includes a display surface FS. The display surface FS is parallel to a plane defined by the first direction DR1 and the second direction DR2. A normal direction of the display surface FS (such as a thickness direction of the electronic device 1000) is a third direction DR3. The electronic device 1000 displays an image IM in the third direction DR3 in the display surface FS. The front surface (or upper surface) and the rear surface (or lower surface) of the member can be distinguished by the third direction DR3. The wording "in a plan view" refers to observation from the third direction DR3.

[0048] The image IM may include still images as well as moving images. Figures 1 to 3 , an Internet search window and a viewing window are shown as examples of image IM.

[0049] The electronic device 1000 may detect an external input. The external input may be a user's input. The user's input may include various types of inputs such as a part of the user's body, a pen that generates a magnetic field (e.g., an electromagnetic resonance pen), a light beam, heat, or pressure.

[0050] For example, the external input may be contact by a part of the user's body (such as a hand), or an external input (such as hovering) close to or adjacent to the electronic device 1000 at a predetermined distance. In addition, the external input may have various forms such as force, pressure, temperature and / or light beam. In addition, the electronic device 1000 according to the present disclosure may detect an external input by a pen. The pen may be referred to as an input device PN. In addition, the electronic device 1000 may detect multiple inputs having different forms. For example, the electronic device 1000 may detect an external input through the input device PN and an external input through the user's hand.

[0051] Figure 1 An external input from the input device PN is shown. In addition, the input device PN may be mounted on or detached from the inside or outside of the electronic device 1000, and the electronic device 1000 may transmit or receive a signal corresponding to the mounting and detachment of the input device PN.

[0052] The display surface FS includes a display area DA and a peripheral area NA. The peripheral area NA is adjacent to the display area DA. The peripheral area NA has a lower light transmittance than the display area DA and has a predetermined color.

[0053] In an embodiment, the peripheral area NA surrounds the display area DA. Therefore, the shape of the display area DA is substantially defined by the peripheral area NA. However, the embodiment is not necessarily limited thereto, and in some embodiments, the peripheral area NA is adjacent to only one side of the display area DA or is omitted.

[0054] The electronic device 1000 according to the embodiment of the present disclosure can be folded around a predetermined folding axis. Figure 2 As shown in FIG. 1 , a virtual first folding axis AX1 extending in the second direction DR2 is defined in the electronic device 1000. The first folding axis AX1 extends in the second direction DR2 on the display surface FS.

[0055] The display area DA includes a foldable area FA that can be folded around a first folding axis AX1, and a first non-foldable area NFA1 and a second non-foldable area NFA2 that are spaced apart from each other in a first direction DR1, and the foldable area FA is interposed between the first non-foldable area NFA1 and the second non-foldable area NFA2. The foldable area FA may be referred to as a first area, and the non-foldable areas NFA1 and NFA2 may be referred to as a second area. The electronic device 1000 may be folded relative to the first folding axis AX1, and may be folded in an inner folding manner in which the first non-foldable area NFA1 and the second non-foldable area NFA2 are folded to face each other. However, embodiments are not necessarily limited thereto.

[0056] In some embodiments, Figure 3 As shown in , the electronic device 1000 may be folded in an outward-folding manner in which the first non-foldable area NFA1 and the second non-foldable area NFA2 are folded around the second folding axis AX2 in directions opposite to each other.

[0057] At least one sensing area 100SA may be defined in the electronic device 1000 . Figure 1 One sensing area 100SA is shown disposed in the first non-foldable area NFA1, but the area in which the sensing area 100SA is disposed is not necessarily limited thereto. In some embodiments, a plurality of sensing areas 100SA are disposed and arranged in the second non-foldable area NFA2.

[0058] The sensing area 100SA overlaps with the electronic module. The electronic module is one or more of a camera module, a proximity illumination sensor, etc. Some of the electronic modules receive external input through the sensing area 100SA or transmit output through the sensing area 100SA.

[0059] The sensing area 100SA is surrounded by the display area DA. However, the embodiment is not necessarily limited thereto, and in some embodiments, the sensing area 100SA is included in the display area DA. For example, the sensing area 100SA in the display area DA also displays the image IM. The transmittance of the sensing area 100SA is higher than the transmittance of the display area DA.

[0060] According to an embodiment of the present disclosure, the electronic module is surrounded by the display area DA or overlaps with the display area DA. Therefore, it is not necessary to set an area where the electronic module is to be set in the peripheral area NA around the display area DA. As a result, the ratio of the area of ​​the display area DA to the entire surface of the electronic device 1000 increases.

[0061] The display area DA includes a first area AR1 and a second area AR2. The second area AR2 is spaced apart from the first area AR1 in the first direction DR1.

[0062] The image IM is displayed on the first area AR1 and the second area AR2. The second area AR2 is an area where an external input through the input device PN is recognized. The first area AR1 is an area where an external input through the input device PN is not recognized.

[0063] When viewed in a plan view, the first area AR1 overlaps with the first non-foldable area NFA1. When viewed in a plan view, the second area AR2 overlaps with the second non-foldable area NFA2. However, embodiments are not necessarily limited thereto. For example, in some embodiments, when viewed in a plan view, the first area AR1 also overlaps with the second non-foldable area NFA2, and the second area AR2 also overlaps with the first non-foldable area NFA1.

[0064] Figure 1 The area of ​​the first area AR1 is shown to be the same as the area of ​​the second area AR2, but the area of ​​the first area AR1 and the area of ​​the second area AR2 according to the embodiment of the present disclosure are not necessarily limited thereto. For example, in some embodiments, the area of ​​the first area AR1 and the area of ​​the second area AR2 are different from each other.

[0065] Figure 4 is a perspective view of an electronic device according to an embodiment of the present disclosure.

[0066] refer to Figure 4 In an embodiment, a plurality of folding axes AX1-1, AX2-1 are defined in the electronic device 1001. The first folding axis AX1-1 and the second folding axis AX2-1 extend in the second direction DR2 and are spaced apart from each other in the first direction DR1. The display surface FS1 of the electronic device 1001 displays an image IM. The electronic device 1001 includes a first foldable area FA1-1 and a second foldable area FA2-1 folded around the first folding axis AX1-1 and the second folding axis AX2-1, respectively, and a first non-foldable area NFA1-1, a second non-foldable area NFA2-1, and a third non-foldable area NFA3-1 spaced apart from each other in the first direction DR1, and the first foldable area FA1-1 and the second foldable area FA2-1 are interposed between the first non-foldable area NFA1-1, the second non-foldable area NFA2-1, and the third non-foldable area NFA3-1.

[0067] The electronic device 1001 can be folded around the first folding axis AX1-1 in an external folding manner. Therefore, the electronic device 1001 can be folded so that the first non-foldable area NFA1-1 and the second non-foldable area NFA2-1 face each other relative to the first folding axis AX1-1. In addition, the electronic device 1001 can be folded inwardly around the second folding axis AX2-1. Therefore, the electronic device 1001 can be folded so that the second non-foldable area NFA2-1 and the third non-foldable area NFA3-1 face each other.

[0068] In addition, the electronic device 1001 can also be folded around the first folding axis AX1-1 and the second folding axis AX2-1 in the same manner. In addition, the electronic device 1001 according to the embodiment of the present disclosure can be folded around three or more folding axes, and the extension direction of the folding axis can be a direction other than the second direction DR2. As long as the electronic device 1001 can detect external input and be folded, the electronic device 1001 is not limited to the embodiment.

[0069] The active area of ​​the display surface FS1 includes a first area AR1-1 and a second area AR2-1. The second area AR2-1 is spaced apart from the first area AR1-1 in the first direction DR1.

[0070] The image IM is displayed on the first area AR1-1 and the second area AR2-1. The second area AR2-1 is an area where an external input through the input device PN is recognized. The first area AR1-1 is an area where an external input through the input device PN is not recognized.

[0071] When viewed in a plan view, the second area AR2-1 overlaps the third non-foldable area NFA3-1. When viewed in a plan view, the first area AR1-1 overlaps the first non-foldable area NFA1-1 and the second non-foldable area NFA2-1.

[0072] Figure 4 An embodiment in which the area of ​​the first region AR1-1 is larger than the area of ​​the second region AR2-1 is shown, but the areas of the first region AR1-1 and the second region AR2-1 according to an embodiment of the present disclosure are not necessarily limited thereto. For example, according to an embodiment of the present disclosure, the area of ​​the second region AR2-1 is larger than the area of ​​the first region AR1-1.

[0073] Figure 5 is a schematic diagram of an electronic device and an input device according to an embodiment of the present disclosure.

[0074] refer to Figure 5 In an implementation, the electronic device 1000 includes a display module DM, a display driving unit 100C, a sensor driving unit 200C, and a main driving unit 1000C.

[0075] The display module DM includes a display layer 100 and a sensor layer 200 .

[0076] The display layer 100 displays an image. The display layer 100 according to an embodiment of the present disclosure is a light-emitting display layer, but the embodiment of the present disclosure is not necessarily limited thereto. For example, the display layer 100 is one of an organic light-emitting display layer, a quantum dot display layer, a micron light-emitting diode (LED) display layer, and a nano-LED display layer. The light-emitting layer of the organic light-emitting display layer includes an organic light-emitting material. The light-emitting layer of the quantum dot display layer includes quantum dots and quantum rods. The light-emitting layer of the micron LED display layer includes micron LEDs. The light-emitting layer of the nano-LED display layer includes nano-LEDs.

[0077] The sensor layer 200 is disposed on the display layer 100. The sensor layer 200 may detect an external input received from an external unit. The sensor layer 200 may detect a first input from a user's body FN and a second input by an input device PN.

[0078] The sensor layer 200 is directly disposed on the display layer 100. According to an embodiment of the present disclosure, the sensor layer 200 is formed on the display layer 100 by a continuous process. For example, the sensor layer 200 is directly formed on the display layer 100 without a separate coupling member such as an adhesive film. However, the embodiments of the present disclosure are not necessarily limited thereto, and in some embodiments, the sensor layer 200 is coupled to the display layer 100, and a coupling member such as an adhesive film is interposed between the sensor layer 200 and the display layer 100. For example, after the sensor layer 200 is manufactured by a process separate from the display layer 100, the sensor layer 200 is coupled to the upper surface of the display layer 100 through the adhesive film.

[0079] The sensor layer 200 according to the embodiment of the present disclosure further includes a plurality of detection electrodes. The sensor layer 200 detects the position or intensity information of the external input by the change of the capacitance or resistance between the detection electrodes caused by the received external input. The sensor layer 200 detects the position or intensity information of the external input applied to the window 500 (see Figure 6 ) of the input device PN. The sensor layer 200 may be driven using electromagnetic resonance (EMR). However, the embodiment is not necessarily limited thereto, and in other embodiments, the sensor layer 200 may be combined with various other driving methods as long as the sensor layer 200 can detect input from the input device PN.

[0080] The main driving unit 1000C controls the overall operation of the electronic device 1000. For example, the main driving unit 1000C controls the operation of the display driving unit 100C and the sensor driving unit 200C. The main driving unit 1000C includes at least one microprocessor, and the main driving unit 1000C may be referred to as a "host".

[0081] The display driving unit 100C controls the display layer 100. The main driving unit 1000C also includes a graphics controller. The display driving unit 100C receives image data RGB and a control signal D-CS from the main driving unit 1000C. The control signal D-CS includes various signals. For example, the control signal D-CS includes an input vertical synchronization signal, an input horizontal synchronization signal, a main clock, a data enable signal, etc. The display driving unit 100C generates a vertical synchronization signal and a horizontal synchronization signal that control the timing of the signal transmitted to the display layer 100 based on the control signal D-CS.

[0082] The sensor driving unit 200C controls the sensor layer 200. The sensor driving unit 200C receives a control signal I-CS from the main driving unit 1000C. The control signal I-CS includes a clock signal and a mode determination signal that determines a driving mode of the sensor driving unit 200C. Based on the control signal I-CS, the sensor driving unit 200C may operate in a first mode in which a first input TC1 from a user's body FN is detected or in a second mode in which a second input TC2 from an input device PN is detected. Based on the mode determination signal, the sensor driving unit 200C controls the sensor layer 200 to operate in a first mode or a second mode, which will be described below.

[0083] The sensor driving unit 200C calculates the coordinate information of the first input TC1 or the second input TC2 based on the signal received from the sensor layer 200, and provides the coordinate signal I-SS including the coordinate information to the main driving unit 1000C. The main driving unit 1000C performs an operation corresponding to the user's input based on the coordinate signal I-SS. For example, the main driving unit 1000C operates the display driving unit 100C based on the coordinate signal I-SS to display a new application image on the display layer 100.

[0084] The input device PN includes an electromagnetic resonance pen, a housing PNH, a pen tip PNT, a resonance circuit unit PN100, a controller PN200 and a power supply unit PN300.

[0085] The housing PNH has a pen shape. An accommodation space is formed inside the housing PNH. The resonance circuit unit PN100, the controller PN200, and the power supply unit PN300 are accommodated in the accommodation space defined inside the housing PNH.

[0086] The pen tip PNT is provided at the end of the housing PNH. For example, a part of the pen tip PNT is exposed to the outside of the housing PNH, and another part of the pen tip PNT is inserted into the housing PNH.

[0087] The resonance circuit unit PN100 generates a signal. The resonance circuit unit PN100 includes an application specific integrated circuit or an oscillator. The resonance circuit unit PN100 outputs an alternating current (AC) signal having a frequency of a predetermined value.

[0088] The resonance circuit unit PN100 includes an inductor L and a capacitor C connected to the inductor L. An LC resonance circuit is formed by the inductor L and the capacitor C. The capacitor C is a variable capacitor having a variable capacity. The input device PN may be provided on the display module DM, and the capacitor C may be charged during a charging period.

[0089] The power supply unit PN300 provides power to the controller PN200. The power supply unit PN300 includes at least one of a battery and a high-capacity capacitor, etc. However, the embodiment is not necessarily limited thereto, and in some embodiments, the power supply unit PN300 is omitted.

[0090] An electromagnetic field EMF is formed between the input device PN and the sensor layer 200. The sensor driving unit 200C determines a signal by detecting resonance due to electromagnetic induction occurring between the input device PN and the sensor layer 200.

[0091] Figure 6 According to the embodiment of the present disclosure, Figure 1 A cross-sectional view of the electronic device taken along line II'.

[0092] refer to Figures 1 to 6 In an embodiment, the electronic device 1000 includes a display module DM, a first support plate 300, a second support plate 400, and a window 500. In addition to the display module DM, the first support plate 300, the second support plate 400, and the window 500, the electronic device 1000 also includes various other functional layers. For example, the electronic device 1000 also includes a plurality of adhesive layers AD1 and AD2, an optical layer OPL, a panel protection film PFL, a lower protection film CPL, a shielding layer CU (also referred to as a "conductive shielding layer"), a cushion layer CS, an insulating layer TP, and a step compensation member AS.

[0093] The display module DM is a flexible panel. Therefore, the display module DM can be rolled as a whole, or can be folded or unfolded around a folding axis. The display module DM includes a display layer 100 and a sensor layer 200.

[0094] The first support plate 300 is disposed under the display module DM and supports the display module DM. The first support plate 300 includes a first support portion 310, a second support portion 320, and a foldable portion 330. The first support portion 310 and the second support portion 320 are spaced apart from each other in the first direction DR1, and the foldable portion 330 is interposed between the first support portion 310 and the second support portion 320.

[0095] The first support portion 310 overlaps with the second non-foldable area NFA2. The second support portion 320 overlaps with the first non-foldable area NFA1. Each of the first support portion 310 and the second support portion 320 according to an embodiment of the present disclosure is an insulator. For example, each of the first support portion 310 and the second support portion 320 is formed of plastic or glass.

[0096] The foldable portion 330 overlaps the foldable area FA. A plurality of holes are formed through the foldable portion 330. Therefore, the foldable portion 330 has a lattice shape in a plan view.

[0097] The shape of the foldable portion 330 is easily changed by the plurality of holes when the foldable portion 330 is folded. The foldable portion 330 according to the embodiment of the present disclosure includes a material different from the first support portion 310 and the second support portion 320. For example, the foldable portion 330 includes a single metal or alloy. Therefore, even in the folded state, the foldable portion 330 can stably protect the foldable area FA of the display module DM. However, the embodiment is not necessarily limited thereto, and in some embodiments, the first support portion 310, the second support portion 320 and the foldable portion 330 are formed of the same material. In addition, the plurality of holes are filled with a high ductility material.

[0098] The second support plate 400 is disposed below the first support plate 300. The second support plate 400 includes a first plate 410 and a second plate 420 spaced apart from each other in the first direction DR1.

[0099] The first plate 410 overlaps the second non-foldable area NFA2. The second plate 420 overlaps the first non-foldable area NFA1.

[0100] The second support plate 400 has a higher modulus than the first support plate 300. For example, the first plate 410 and the second plate 420 include a material having a higher modulus than the first support 310 and the second support 320. For example, each of the first plate 410 and the second plate 420 includes a metal such as a copper alloy or steel-use stainless steel (SUS).

[0101] The window 500 is provided on the display module DM. The window 500 provides an optically transparent area. The window 500 provides a front surface of the electronic device 1000. External input from the input device PN and the like is basically applied to the window 500. The image IM displayed on the display layer 100 is perceived by the user through the window 500.

[0102] The window 500 includes thin glass or a synthetic resin film. When the window 500 includes thin glass, the thickness of the window 500 is 100 μm or less, such as 30 μm, but the thickness of the window 500 is not necessarily limited thereto. When the window 500 includes a synthetic resin film, the window 500 includes a polyimide (PI) film or a polyethylene terephthalate (PET) film.

[0103] The window 500 may have a multi-layer structure or a single-layer structure. For example, the window 500 includes a plurality of synthetic resin films coupled with an adhesive, or includes a glass substrate and a synthetic resin film coupled with an adhesive. The window 500 is made of a flexible material. Therefore, the window 500 can be folded around the first folding axis AX1 (see Figure 2 and Figure 3 For example, when the shape of the display layer 100 changes, the shape of the window 500 also changes to correspond to the shape of the display layer 100.

[0104] The window 500 transmits an image from the display layer 100 and simultaneously mitigates external impact, thereby preventing the display module DM from being damaged or malfunctioning due to external impact. The external impact refers to an externally applied force that may be expressed as pressure, stress, etc., and causes defects in the display module DM.

[0105] In addition, the electronic device 1000 further includes a protective layer disposed on the window 500. The protective layer increases the impact resistance of the window 500 and prevents the window 500 from being scattered when broken. The protective layer includes at least one of a urethane-based resin, an epoxy-based resin, a polyester-based resin, a polyether-based resin, an acrylate-based resin, an acrylonitrile-butadiene-styrene (ABS) resin, and a rubber. For example, the protective layer includes at least one of phenylene, polyethylene terephthalate (PET), polyimide (PI), polyamide (PAI), polyethylene naphthalate (PEN), and polycarbonate (PC).

[0106] In other embodiments, the electronic device 1000 further includes one or more functional layers arranged between the display module DM and the window 500. For example, the functional layer is an anti-reflection layer that blocks reflection of an external light beam. The anti-reflection layer prevents a user from visually recognizing an element of the electronic device 1000 from the outside due to external light incident on the front surface of the electronic device 1000. The anti-reflection layer includes one or more of a retarder, a polarizer, and a color filter.

[0107] The optical layer OPL and the adhesive layer AD1 are interposed between the window 500 and the display module DM. The window 500 includes a first layer 510, a second layer 520, and a bezel pattern BZ. The first layer 510 includes glass. The first layer 510 has a thickness of about 10 μm or less. Therefore, the first layer 510 can be easily folded.

[0108] The second layer 520 is disposed on the first layer 510. The second layer 520 includes a material having a relatively low modulus compared to the first layer 510. For example, the second layer 520 is a film including an organic material. The second layer 520 has a greater thickness than the first layer 510. The second layer 520 protects the upper surface of the first layer 510.

[0109] The frame pattern BZ is inserted into the second layer 520. However, the embodiment is not necessarily limited thereto, and in some embodiments, the frame pattern BZ is disposed on the lower surface or the upper surface of the second layer 520. The frame pattern BZ has a predetermined color or a reflective pattern. However, the embodiment is not necessarily limited thereto, and in some embodiments, the frame pattern BZ is omitted from the window 500. In addition, the window 500 according to an embodiment of the present disclosure may be formed as a single layer or may further include other functional layers, but the embodiment of the present disclosure is not necessarily limited thereto.

[0110] The optical layer OPL is disposed on the display layer 100. The optical layer OPL reduces the reflectivity of external light. The optical layer OPL includes a stretched synthetic resin film. For example, the optical layer OPL is formed by dyeing a polyvinyl alcohol (PVA) film with an iodine compound. In some embodiments, the optical layer OPL includes a color filter. The optical layer OPL may include various other layers as long as the layers reduce the reflectivity of external light, and is not limited to the embodiments.

[0111] The optical layer OPL and the window 500 are coupled by a predetermined adhesive layer AD1. The adhesive layer AD1 includes at least one of an optically clear adhesive (OCA), an optically clear resin (OCR), and a pressure-sensitive adhesive (PSA). The adhesive layer described below includes the same material as the adhesive layer AD1 and includes a general adhesive or a pressure-sensitive adhesive.

[0112] The panel protection film PFL and the lower protection film CPL are interposed between the display layer 100 and the first support plate 300 .

[0113] The panel protection film PFL is disposed under the display layer 100. The panel protection film PFL protects the lower portion of the display layer 100. The panel protection film PFL includes a flexible plastic material. For example, the panel protection film PFL includes polyethylene terephthalate.

[0114] The lower protective film CPL is disposed under the panel protective film PFL. The lower protective film CPL has a predetermined color. The lower protective film CPL prevents the rear surface of the display layer 100 from being irradiated with light while protecting the rear surface of the display layer 100. The lower protective film CPL is formed of a material having high light absorption.

[0115] In addition, a predetermined concave portion CPL_G overlapping the foldable area FA is formed in the lower protective film CPL. The concave portion CPL_G reduces the folding stress by reducing the thickness of the foldable area FA of the lower protective film CPL. In addition, by adding an adhesive layer to the concave portion CPL_G, the coupling force with the first support plate 300 is increased.

[0116] The first support plate 300 and the second support plate 400 are coupled by a predetermined adhesive layer AD2. A predetermined recessed portion AD2_G overlapping the foldable area FA is formed in the adhesive layer AD2. The folding stress in the foldable area FA is reduced by the recessed portion AD2_G. However, the embodiment is not necessarily limited thereto, and in some embodiments, the recessed portion AD2_G is omitted from the adhesive layer AD2, or a portion of the adhesive layer AD2 overlapping the foldable area FA is removed.

[0117] The shielding layer CU, the cushion layer CS, the insulating layer TP, and the step compensation member AS are disposed under the second support plate 400 .

[0118] The shielding layer CU is disposed below the second support plate 400. The shielding layer CU is conductive. The shielding layer CU includes copper. For example, the shielding layer CU is a copper tape.

[0119] The shielding layer CU includes a first shielding layer CU1 and a second shielding layer CU2 spaced apart from each other in the first direction DR1. The first shielding layer CU1 is disposed under the first board 410. The second shielding layer CU2 is disposed under the second board 420.

[0120] The cushion layer CS is disposed under the shielding layer CU. The cushion layer CS protects the display module DM by absorbing external impact. The cushion layer CS includes a foam sheet having a predetermined elastic force. For example, the cushion layer CS includes sponge or polyurethane. The cushion layer CS includes a plurality of layers CS1 and CS2 respectively coupled to the first shielding layer CU1 and the second shielding layer CU2.

[0121] The insulating layer TP is disposed under the cushion layer CS. The insulating layer TP is an insulating film. The insulating layer TP prevents static electricity from flowing in. The insulating layer TP includes a plurality of layers TP1 and TP2, and the plurality of layers TP1 and TP2 are respectively coupled to the plurality of layers CS1 and CS2 of the cushion layer CS.

[0122] The step compensating member AS is coupled to a lower portion of the second supporting plate 400. The step compensating member AS may be a double-sided tape or an insulating film.

[0123] The through hole MH extends through the adhesive layer AD1 to the insulating layer TP. The area where the through hole MH is formed is adjacent to the sensing area 100SA (see Figure 1 ) corresponds. The electronic module may be disposed below the through hole MH. The electronic module includes one or more of a camera module, a proximity lighting sensor, and the like.

[0124] Fig. 7A is a schematic cross-sectional view of an electronic device according to an embodiment of the present disclosure.

[0125] refer to Figure 5 , Figure 6 and Fig. 7A In an embodiment, the electronic device 1000 includes a display module DM, a second support plate 400, a shielding layer CU, and a first bracket BRK.

[0126] The second support plate 400 and the shielding layer CU may be referred to as a plurality of lower members. When viewed in a plan view, the second support plate 400 and the shielding layer CU do not overlap at least a portion of the foldable area FA.

[0127] The plurality of layers CU1 and CU2 of the shielding layer CU are spaced apart from each other by a first distance DS1 in the first direction DR1. The first distance DS1 is in the range of 0.5 mm to 2.0 mm. For example, the first distance DS1 is 1.5 mm.

[0128] In the foldable area FA, a first opening HA1 is formed, and the width of the first opening HA1 is a first distance DS1.

[0129] The first bracket BRK is disposed below the shielding layer CU. When viewed in a plan view, the first bracket BRK overlaps the foldable area FA and the plurality of non-foldable areas NFA1 and NFA2. The first bracket BRK has an overall shape. The first bracket BRK covers the shielding layer CU. For example, the first bracket BRK covers the first opening HA1.

[0130] The first opening HA1 is an area of ​​the foldable area FA of the electronic device 1000 that does not overlap with the shielding layer CU. For example, at least a portion of the shielding layer CU is not disposed in the foldable area FA.

[0131] The input device PN and the sensor layer 200 resonate with each other through electromagnetic induction. For example, the inductance depends on the stacking structure of the lower member and the bracket, and therefore, the resonant frequency may change. For example, the resonant frequency of the foldable area FA in which the first opening HA1 is formed is different from the resonant frequency of the non-foldable areas NFA1 and NFA2.

[0132] When viewed in a plan view, when the plurality of non-foldable areas NFA1 and NFA2 overlap the input device PN, a gap between the input device PN and the sensor layer 200 has a first resonant frequency. For example, the first resonant frequency is about 304.4 kHz.

[0133] When viewed in a plan view, when the foldable area FA overlaps the input device PN, the gap between the input device PN and the sensor layer 200 has a second resonant frequency. The second resonant frequency is lower than the first resonant frequency. For example, the second resonant frequency is about 304.2 kHz.

[0134] According to an embodiment of the present disclosure, the sensor driving unit 200C generates a signal according to the input device PN relative to the display area DA (see Figure 1 ) position transmits one of a first sensing signal having a first driving frequency (which may be a first resonant frequency) and a second sensing signal having a second driving frequency (which may be a second resonant frequency) to the sensor layer 200. Due to the difference between the stacked structures of the lower members, the difference between the signals received from the input device PN can be removed or reduced. The phenomenon that the picture drawn by the input device PN is bent in the foldable area FA can be prevented. Therefore, the electronic device 1000 has increased detection reliability, and an interface device including the electronic device 1000 can be provided.

[0135] Figure 7B is a schematic cross-sectional view of an electronic device according to an embodiment of the present disclosure. Figure 7B In the description of Fig. 7A The described components are denoted by the same reference numerals, and duplicate descriptions thereof will be omitted.

[0136] refer to Figure 5 and Figure 7B In an embodiment, the electronic device 1000 - 1 includes a display module DM, a second support plate 400 , a shielding layer CU, and a second bracket BRK- 1 .

[0137] The second bracket BRK-1 is disposed below the shielding layer CU. The second bracket BRK-1 includes a plurality of layers. The plurality of layers correspond to the plurality of non-foldable areas NFA1 and NFA2, respectively. The plurality of layers are spaced apart from each other by a second distance DS2 in the first direction DR1. The second distance DS2 is in the range of 15 mm to 25 mm. For example, the second distance DS2 is about 20 mm.

[0138] The second distance DS2 is greater than the first distance DS1.

[0139] In the foldable area FA, a second opening HA2 is formed, and the width of the second opening HA2 is a second distance DS2.

[0140] The input device PN and the sensor layer 200 resonate with each other through electromagnetic induction. For example, the inductance may be changed according to the stacking structure of the lower member and the bracket, and the resonant frequency may be changed. For example, the resonant frequency of the foldable area FA in which the first opening HA1 and the second opening HA2 are formed is different from the resonant frequency of the non-foldable areas NFA1 and NFA2.

[0141] When viewed in a plan view, when the plurality of non-foldable areas NFA1 and NFA2 overlap the input device PN, a gap between the input device PN and the sensor layer 200 has a first resonant frequency. For example, the first resonant frequency is about 304.4 kHz.

[0142] When viewed in a plan view, when the foldable area FA overlaps the input device PN, the gap between the input device PN and the sensor layer 200 has a third resonant frequency. The third resonant frequency is lower than the first resonant frequency. For example, the third resonant frequency is about 302.4 kHz.

[0143] According to an embodiment of the present disclosure, the sensor driving unit 200C generates a signal according to the input device PN relative to the display area DA (see Figure 1 ) is transmitted to the sensor layer 200 from the position of the first sensing signal having a first driving frequency (which may be a first resonant frequency) and a second sensing signal having a third driving frequency (which may be a third resonant frequency). Due to the difference between the stacked structures of the lower members, the difference between the signals received from the input device PN can be removed or reduced. The phenomenon that the picture drawn by the input device PN is bent in the foldable area FA can be prevented. Therefore, the electronic device 1000 has increased detection reliability, and an interface device including the electronic device 1000 can be provided.

[0144] Figure 8 is a cross-sectional view of a display module according to an embodiment of the present disclosure.

[0145] refer to Figure 8 In an embodiment, the display module DM includes a display layer 100 and a sensor layer 200. The thickness of the display module DM is in the range of 25 micrometers to 35 micrometers, such as 30 micrometers, but the thickness of the display module DM is not necessarily limited thereto. The display module DM includes at least one foldable area. The foldable area of ​​the display module DM corresponds to the foldable area FA (see Figure 1 ).

[0146] The display layer 100 includes a base layer 110 , a circuit layer 120 , a light emitting element layer 130 , and an encapsulation layer 140 .

[0147] The base layer 110 includes a synthetic resin layer. The synthetic resin layer includes a thermosetting resin. The base layer 110 may have a multi-layer structure. For example, the base layer 110 includes a first synthetic resin layer, a silicon oxide (SiO x ) layer, an amorphous silicon (a-Si) layer disposed on the silicon oxide layer, and a second synthetic resin layer disposed on the amorphous silicon layer. The silicon oxide layer and the amorphous silicon layer may be referred to as a base barrier layer. Each of the first synthetic resin layer and the second synthetic resin layer includes a polyimide-based resin. In addition, each of the first synthetic resin layer and the second synthetic resin layer includes at least one of an acrylate-based resin, a methacrylate-based resin, a polyisoprene-based resin, a vinyl-based resin, an epoxy-based resin, a urethane-based resin, a cellulose-based resin, a siloxane-based resin, a polyamide-based resin, and a perylene-based resin. In this specification, a "resin based on" refers to a resin containing a "" functional group". In addition, the base layer 110 may include a glass substrate, an organic / inorganic composite material substrate, and the like.

[0148] The circuit layer 120 is disposed on the base layer 110. The circuit layer 120 includes an insulating layer, a semiconductor pattern, a conductive pattern, a signal line, etc. The insulating layer, the semiconductor layer, and the conductive layer are formed on the base layer 110 in a manner such as coating and deposition, and thereafter, the insulating layer, the semiconductor layer, and the conductive layer are selectively patterned by a plurality of photolithography processes. Thereafter, the semiconductor pattern, the conductive pattern, and the signal line of the circuit layer 120 are formed.

[0149] The light emitting element layer 130 is disposed on the circuit layer 120. The light emitting element layer 130 includes a light emitting element. For example, the light emitting element layer 130 includes one or more of an organic light emitting material, a quantum dot, a quantum rod, a micro-LED, a nano-LED, and the like.

[0150] The encapsulation layer 140 is disposed on the light emitting element layer 130. The encapsulation layer 140 includes an inorganic layer, an organic layer, and an inorganic layer stacked in sequence, but the layers of the encapsulation layer 140 are not necessarily limited thereto.

[0151] The inorganic layer protects the light emitting element layer 130 from moisture and oxygen, and the organic layer protects the light emitting element layer 130 from foreign matter such as dust particles. The inorganic layer includes at least one of a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, and an aluminum oxide layer. The organic layer includes an acrylic-based organic layer, but the embodiments of the present disclosure are not necessarily limited thereto.

[0152] The sensor layer 200 is disposed on the display layer 100. The sensor layer 200 is disposed on the encapsulation layer 140. The sensor layer 200 detects an external input received from an external unit. The external input may be an external input of a user. The user's input may include various types of external inputs, such as a part of the user's body, a beam, heat, a pen, or pressure.

[0153] The sensor layer 200 is formed on the display layer 100 through a continuous process. In an embodiment, the sensor layer 200 is directly disposed on the display layer 100. By “directly disposed on the display layer 100” it is meant that no third component is disposed between the sensor layer 200 and the display layer 100. For example, no separate adhesive member is disposed between the sensor layer 200 and the display layer 100.

[0154] In some embodiments, the sensor layer 200 is coupled to the display layer 100 by an adhesive member. The adhesive member may include a general adhesive or a pressure-sensitive adhesive.

[0155] Fig. 9 is a cross-sectional view of a portion of an electronic device according to an embodiment of the present disclosure.

[0156] refer to Fig. 9 In an embodiment, the pixel PX includes a transistor TR and a light emitting element OLED. The light emitting element OLED includes a first electrode AE ​​(or anode), a second electrode CE (or cathode), a hole control layer HCL, an electron control layer ECL and a light emitting layer EML.

[0157] The transistor TR and the light emitting element OLED are disposed on the base layer 110. Figure 8 One transistor TR is shown, but the pixel PX may basically include a plurality of transistors driving the light emitting element OLED and at least one capacitor.

[0158] The display area DA includes a light emitting area LA corresponding to each of the pixels PX and a non-light emitting area NLA adjacent to the light emitting area LA. The light emitting element OLED is disposed in the light emitting area LA.

[0159] The buffer layer BFL is disposed on the base layer 110, and the buffer layer BFL is an inorganic layer. The semiconductor pattern is disposed on the buffer layer BFL. The semiconductor pattern includes at least one of polycrystalline silicon, amorphous silicon, and metal oxide.

[0160] The semiconductor pattern may be doped with an N-type dopant or a P-type dopant. The semiconductor pattern includes a high-doping region and a low-doping region. The conductivity of the high-doping region is higher than that of the low-doping region, and the high-doping region serves as a source electrode and a drain electrode of the transistor TR. The low-doping region corresponds to an active region (or channel) of the transistor TR.

[0161] The source region S, active region A and drain region D of the transistor TR are formed by a semiconductor pattern. A first insulating layer INS1 is disposed on the semiconductor pattern and the buffer layer BFL. A gate G of the transistor TR is disposed on the first insulating layer INS1. A second insulating layer INS2 is disposed on the gate G and the first insulating layer INS1. A third insulating layer INS3 is disposed on the second insulating layer INS2.

[0162] The connection electrode CNE includes a first connection electrode CNE1 and a second connection electrode CNE2 connecting the transistor TR and the light emitting element OLED. The first connection electrode CNE1 is disposed on the third insulating layer INS3 and connected to the drain region D through a first contact hole CH1 penetrating the first insulating layer INS1 to the third insulating layer INS3.

[0163] The fourth insulating layer INS4 is disposed on the first connection electrode CNE1 and the third insulating layer INS3. The fifth insulating layer INS5 is disposed on the fourth insulating layer INS4. The second connection electrode CNE2 is disposed on the fifth insulating layer INS5. The second connection electrode CNE2 is connected to the first connection electrode CNE1 through a second contact hole CH2 penetrating the fourth insulating layer INS4 and the fifth insulating layer INS5.

[0164] The sixth insulating layer INS6 is disposed on the second connection electrode CNE2 and the fifth insulating layer INS5. Layers from the buffer layer BFL to the sixth insulating layer INS6 may be defined as a circuit layer 120. The first to sixth insulating layers INS1 to INS6 may be inorganic layers or organic layers.

[0165] The first electrode AE ​​is disposed on the sixth insulating layer INS6. The first electrode AE ​​is connected to the second connection electrode CNE2 through the third contact hole CH3 penetrating the sixth insulating layer INS6. A pixel defining layer PDL including an opening PX_OP exposing a predetermined portion of the first electrode AE ​​is disposed on the first electrode AE ​​and the sixth insulating layer INS6.

[0166] The hole control layer HCL is disposed on the first electrode AE ​​and the pixel definition layer PDL. The hole control layer HCL includes a hole transport layer and a hole injection layer.

[0167] The light emitting layer EML is disposed on the hole control layer HCL. The light emitting layer EML is disposed in a region corresponding to the opening PX_OP. The light emitting layer EML may include an organic material and / or an inorganic material. The light emitting layer EML generates light of one of red, green, and blue.

[0168] The electron control layer ECL is disposed on the light emitting layer EML and the hole control layer HCL. The electron control layer ECL includes an electron transport layer and an electron injection layer. The hole control layer HCL and the electron control layer ECL are commonly arranged in the light emitting area LA and the non-light emitting area NLA.

[0169] The second electrode CE is disposed on the electronic control layer ECL. The second electrode CE is commonly disposed in the pixel PX. The layer of the light emitting element OLED and the pixel defining film PDL may be defined as a light emitting element layer 130 .

[0170] The encapsulation layer 140 is disposed on the second electrode CE and covers the pixel PX. The encapsulation layer 140 includes a first encapsulation layer EN1 disposed on the second electrode CE, a second encapsulation layer EN2 disposed on the first encapsulation layer EN1, and a third encapsulation layer EN3 disposed on the second encapsulation layer EN2.

[0171] The first encapsulation layer EN1 and the third encapsulation layer EN3 include inorganic insulating layers and protect the pixels PX from moisture / oxygen. The second encapsulation layer EN2 includes an organic insulating layer and protects the pixels PX from foreign substances such as dust particles.

[0172] A first voltage is applied to the first electrode AE ​​through the transistor TR, and a second voltage lower than the first voltage is applied to the second electrode CE. Holes and electrons injected into the emission layer EML couple with each other to form excitons, and as the excitons transition to a ground state, the light emitting element OLED emits light.

[0173] The sensor layer 200 is disposed on the encapsulation layer 140. The sensor layer 200 is disposed directly on the upper surface of the encapsulation layer 140.

[0174] The base layer BSL is disposed on the encapsulation layer 140. The base layer BSL includes at least one inorganic insulating layer.

[0175] The sensor layer 200 includes a first conductive pattern CTL1 and a second conductive pattern CTL2 disposed on the first conductive pattern CTL1. The first conductive pattern CTL1 is disposed on the base layer BSL. The insulating layer TINS ​​is disposed on the base layer BSL and covers the first conductive pattern CTL1. The insulating layer TINS ​​may include an inorganic insulating layer or an organic insulating layer. The second conductive pattern CTL2 is disposed on the insulating layer TINS.

[0176] The first and second conductive patterns CTL1 and CTL2 overlap the non-light emitting area NLA. In addition, the first and second conductive patterns CTL1 and CTL2 are arranged in the non-light emitting area NLA between the light emitting areas LA and have a mesh shape.

[0177] The first conductive pattern CTL1 and the second conductive pattern CTL2 form the sensing electrode and the pen sensing electrode of the sensor layer 200. For example, the first conductive pattern CTL1 and the second conductive pattern CTL2 have a mesh shape and are separated from each other in a predetermined area to form the sensing electrode and the pen sensing electrode. A portion of the second conductive pattern CTL2 is connected to the first conductive pattern CTL1.

[0178] The optical layer OPL is disposed on the second conductive pattern CTL2 and the insulating layer TINS. The optical layer OPL includes a black matrix BM and a plurality of color filters CF. The black matrix BM overlaps the non-light emitting area NLA, and the color filter CF overlaps the light emitting area LA.

[0179] The black matrix BM is disposed on the insulating layer TINS ​​and covers the second conductive pattern CTL2. An opening B_OP overlapping the light emitting area LA and the opening PX_OP is formed in the black matrix BM. The black matrix BM absorbs and blocks light. The width of the opening B_OP is greater than the width of the opening PX_OP.

[0180] The color filter CF is disposed on the insulating layer TINS ​​and the black matrix BM. The color filter CF is arranged in the opening B_OP. The planarization insulating layer PINS is disposed on the color filter CF. The planarization insulating layer PINS provides a flat upper surface. The planarization insulating layer PINS includes an organic insulating layer.

[0181] When external light propagating toward the display layer 100 is reflected back to an external user by the display layer 100, the user may perceive the external light beam. In order to prevent this phenomenon, the optical layer OPL includes a plurality of color filters CF that display the same color as the color of the pixel PX of the display layer 100. The color filter CF filters the external light into the same color as the color of the pixel PX. For example, the external light is not perceived by the user.

[0182] Fig.10 is a plan view of a sensor layer according to an embodiment of the present disclosure.

[0183] refer to Fig.10 In an embodiment, the sensor layer 200 includes a plurality of sensing electrodes SE1 and SE2, a plurality of sensing wirings TL and RL, a plurality of pen sensing electrodes P-SE1 and P-SE2, a plurality of pen sensing wirings PSL1, PSL2, and PSL3-1 to PSL3-3, and a plurality of first pads PD1 and second pads PD2. The sensing electrodes SE1 and SE2, the sensing wirings TL and RL, the pen sensing electrodes P-SE1 and P-SE2, and the pen sensing wirings PSL1, PSL2, and PSL3-1 to PSL3-3 are arranged on the encapsulation layer 140.

[0184] The sensor layer 200 includes an active area AA and an inactive area NAA around the active area AA. When viewed in a plan view, the active area AA is spaced apart from the display area DA (see FIG. Figure 1 ) overlaps, and the passive area NAA overlaps with the peripheral area NA (see Figure 1 )overlapping.

[0185] The active area AA includes a foldable area IFA and first and second non-foldable areas INFA1 and INFA2 spaced apart from each other in a first direction DR1, and the foldable area IFA is interposed between the first and second non-foldable areas INFA1 and INFA2. Figure 5 ) of the foldable area FA (see Figure 1 ) overlaps, the first non-foldable area INFA1 overlaps with the display layer 100 (see Figure 5 ) of the first non-foldable area NFA1 (see Figure 1 ) overlaps, and the second non-foldable area INFA2 overlaps with the display layer 100 (see Figure 5 ) of the second non-foldable area NFA2 (see Figure 1 )overlapping.

[0186] The sensing electrodes SE1 and SE2 are arranged in the active area AA, and the first pad PD1 and the second pad PD2 are arranged in the inactive area NAA. When viewed in a plan view, the first pad PD1 and the second pad PD2 are adjacent to the lower end of the sensor layer 200. However, the embodiment is not necessarily limited thereto, and in some embodiments, the positions of the first pad PD1 and the second pad PD2 are different, or the first pad PD1 and the second pad PD2 are omitted.

[0187] The sensing electrodes SE1 and SE2 include a plurality of first sensing electrodes SE1 extending in the second direction DR2 and spaced apart in the first direction DR1, and a plurality of second sensing electrodes SE2 extending in the first direction DR1 and spaced apart in the second direction DR2. The second sensing electrodes SE2 are insulated from the first sensing electrodes SE1 and cross the first sensing electrodes SE1. The first sensing electrodes SE1 and the second sensing electrodes SE2 sense a first input (e.g., Figure 5 TC1 in).

[0188] The sensing wirings TL and RL are connected to ends of the first sensing electrode SE1 and the second sensing electrode SE2, extend to the inactive area NAA, and are connected to the first pad PD1 and the second pad PD2. The sensing wirings TL and RL include a plurality of first sensing wirings TL connected to the first sensing electrode SE1 and a plurality of second sensing wirings RL connected to the second sensing electrode SE2.

[0189] The first sensing wiring TL is connected to the lower end portion of the first sensing electrode SE1 The first sensing wiring TL extends to the active area NAA and is connected to the corresponding first and second pads PD1 and PD2.

[0190] The second sensing wiring RL is connected to the left end portion or the right end portion of the second sensing electrode SE2 The second sensing wiring RL extends to the active area NAA and is connected to the corresponding first and second pads PD1 and PD2.

[0191] Each of the first sensing electrodes SE1 includes a (1-1)th sensing electrode SE1-1 and a (1-2)th sensing electrode SE1-2 extending in the second direction DR2 and spaced apart from each other in the first direction DR1. The (1-1)th sensing electrode SE1-1 and the (1-2)th sensing electrode SE1-2 are symmetrical to each other in the first direction DR1 with respect to an axis parallel to the second direction DR2.

[0192] In each of the first sensing electrodes SE1, a lower end portion of the (1-1)th sensing electrode SE1-1 and a lower end portion of the (1-2)th sensing electrode SE1-2 are connected to the corresponding first sensing wiring TL. In each of the first sensing electrodes SE1, an upper end portion of the (1-1)th sensing electrode SE1-1 and an upper end portion of the (1-2)th sensing electrode SE1-2 are not connected to each other.

[0193] Each of the second sensing electrodes SE2 includes a (2-1)th sensing electrode SE2-1 and a (2-2)th sensing electrode SE2-2 extending in the first direction DR1 and spaced apart from each other in the second direction DR2. The (2-1)th sensing electrode SE2-1 and the (2-2)th sensing electrode SE2-2 are symmetrical to each other with respect to an axis parallel to the first direction DR1.

[0194] When viewed in a plan view, some of the second sensing electrodes SE2 are arranged in the lower region of the sensor layer 200, and the remaining second sensing electrodes SE2 are arranged in the upper region of the sensor layer 200. In each of the second sensing electrodes SE2 arranged in the lower region of the sensor layer 200, a left end portion of the (2-1)th sensing electrode SE2-1 and a left end portion of the (2-2)th sensing electrode SE2-2 are connected to the corresponding second sensing wiring RL. In each of the second sensing electrodes SE2 arranged in the lower region of the sensor layer 200, a right end portion of the (2-1)th sensing electrode SE2-1 and a right end portion of the (2-2)th sensing electrode SE2-2 are not connected to each other.

[0195] In each of the second sensing electrodes SE2 arranged in the upper region of the sensor layer 200, the right end portion of the (2-1)th sensing electrode SE2-1 and the right end portion of the (2-2)th sensing electrode SE2-2 are connected to the corresponding second sensing wiring RL. In each of the second sensing electrodes SE2 arranged in the upper region of the sensor layer 200, the left end portion of the (2-1)th sensing electrode SE2-1 and the left end portion of the (2-2)th sensing electrode SE2-2 are not connected to each other.

[0196] The first sensing wiring TL is arranged in the inactive area NAA adjacent to the lower side of the active area AA when viewed in a plan view. In addition, the second sensing wiring RL is arranged in the inactive area NAA adjacent to the left and right sides of the active area AA when viewed in a plan view.

[0197] The pen sensing electrodes P-SE1 and P-SE2 are arranged in the active area AA. The pen sensing wirings PSL1, PSL2 and PSL3-1 to PSL3-3 are connected to the pen sensing electrodes P-SE1 and P-SE2, extend to the inactive area NAA, and are connected to the corresponding first and second pads PD1 and PD2.

[0198] Sensor drive unit 200C (see Figure 5 ) is connected to the first pad PD1 and the second pad PD2 through a printed circuit board.

[0199] The pen sensing electrodes P-SE1 and P-SE2 include a plurality of first pen sensing electrodes P-SE1 extending in the second direction DR2 and spaced apart in the first direction DR1, and a plurality of second pen sensing electrodes P-SE2 extending in the first direction DR1 and spaced apart in the second direction DR2. The first pen sensing electrodes P-SE1 and the second pen sensing electrodes P-SE2 sense a second input (e.g., Figure 5 TC2 in ).

[0200] The second sensing electrode P-SE2 is insulated from the first sensing electrode P-SE1 and crosses the first sensing electrode P-SE1. The first sensing electrode P-SE1 is insulated from the second sensing electrode SE2 and crosses the second sensing electrode SE2. The second sensing electrode P-SE2 is insulated from the first sensing electrode SE1 and crosses the first sensing electrode SE1.

[0201] Each of the first sensing electrodes P-SE1 is disposed between the (1-1)th sensing electrode SE1-1 and the (1-2)th sensing electrode SE1-2 of the corresponding first sensing electrode SE1. Each of the second sensing electrodes P-SE2 is disposed between the (2-1)th sensing electrode SE2-1 and the (2-2)th sensing electrode SE2-2 of the corresponding second sensing electrode SE2.

[0202] The upper ends of the first pen sensing electrodes P-SE1 are connected to each other. The lower ends of the first pen sensing electrodes P-SE1 are connected to each other in pairs. The left ends of the second pen sensing electrodes P-SE2 arranged in the upper area of ​​the sensor layer 200 are connected to each other. The right ends of the second pen sensing electrodes P-SE2 arranged in the lower area of ​​the sensor layer 200 are connected to each other.

[0203] Right ends of the second pen sensing electrodes P-SE2 arranged in the upper region of the sensor layer 200 are not connected to each other. Left ends of the second pen sensing electrodes P-SE2 arranged in the lower region of the sensor layer 200 are not connected to each other.

[0204] The pen sensing wirings PSL1, PSL2 and PSL3-1 to PSL3-3 include a plurality of first pen sensing wirings PSL1, a plurality of second pen sensing wirings PSL2 and a plurality of (3-1)th pen sensing wirings PSL3-1, (3-2)th pen sensing wirings PSL3-2 and (3-3)th pen sensing wirings PSL3-3. The first pen sensing wiring PSL1 and the (3-1)th pen sensing wirings PSL3-1, (3-2)th pen sensing wirings PSL3-2 and (3-3)th pen sensing wirings PSL3-3 are connected to the first pen sensing electrode P-SE1. The second pen sensing wiring PSL2 is connected to the second pen sensing electrode P-SE2.

[0205] A pair of first sensing electrodes P-SE1 connected to each other at their lower ends are connected to corresponding first sensing wirings PSL1. Upper ends of the first sensing electrodes P-SE1 are connected to a (3-1)th sensing wiring PSL3-1 extending in the first direction DR1.

[0206] The (3-2)th sensing wiring PSL3-2 and the (3-3)th sensing wiring PSL3-3 extend from both ends of the (3-1)th sensing wiring PSL3-1 in the second direction DR2. The (3-2)th sensing wiring PSL3-2 and the (3-3)th sensing wiring PSL3-3 are connected to the corresponding first pad PD1 and the corresponding second pad PD2, respectively.

[0207] The left end of the second sensing electrode P-SE2 arranged in the upper area of ​​the sensor layer 200 is connected to the corresponding second sensing wiring PSL2. The second sensing wiring PSL2 connected to the second sensing electrode P-SE2 arranged in the upper area of ​​the sensor layer 200 is connected to the corresponding first pad PD1.

[0208] The right end of the second sensing electrode P-SE2 arranged in the lower area of ​​the sensor layer 200 is connected to the corresponding second sensing wiring PSL2. The second sensing wiring PSL2 connected to the second sensing electrode P-SE2 arranged in the lower area of ​​the sensor layer 200 is connected to the corresponding second pad PD2.

[0209] The sensor layer 200 is driven in a time-division manner and includes a first sensing period and a second sensing period. The first sensing period and the second sensing period occur repeatedly. During the first sensing period, the first sensing electrode SE1 and the second sensing electrode SE2 are driven to sense the body FN of the user (see Figure 5 During the second sensing period, the first pen sensing electrode P-SE1 and the second pen sensing electrode P-SE2 are driven to sense the first input by the input device PN (see Figure 5 ) is performed. The following will describe in detail the sensing of the second input by the input device PN (see Figure 5 ) to perform the second input operation.

[0210] According to an embodiment of the present disclosure, because the user's body FN (see Figure 5 ) and the first input by the input device PN (see Figure 5 ) is performed by the same sensor layer 200, so two input devices such as a touch panel and a digitizer are not used, and thus the size of the electronic device 1000 (see Figure 1 ) thickness.

[0211] Although Fig.10 Six first pen sensing electrodes P-SE1 and eight second pen sensing electrodes P-SE2 are shown, but the embodiment is not necessarily limited thereto, and the sensor layer 200 may basically include more first pen sensing electrodes P-SE1 and more second pen sensing electrodes P-SE2.

[0212] Fig.11 According to the embodiments of the present disclosure Fig.10 An enlarged plan view of area AA1.

[0213] refer to Fig.10 and Fig.11 In an embodiment, each of the (1-1)th sensing electrode SE1-1 and the (1-2)th sensing electrode SE1-2 includes a plurality of first sensing cells SP1 extending in the second direction DR2 and a plurality of first connection patterns CP1 connecting the first sensing cells SP1.

[0214] The first sensing cells SP1 have a bent shape. For example, the first sensing cells SP1 of the (1-1)th sensing electrode SE1-1 and the first sensing cells SP1 of the (1-2)th sensing electrode SE1-2 are bent outward.

[0215] The first connection patterns CP1 extend in the second direction DR2, are arranged between the first sensing cells SP1, and are connected to the first sensing cells SP1. The first sensing cells SP1 are connected to each other through the first connection patterns CP1.

[0216] Each of the first connection patterns CP1 is disposed between two adjacent first sensing cells SP1 and connects the two first sensing cells SP1. Fig.13 ) is disposed between the first connection pattern CP1 and the first sensing unit SP1, and the first connection pattern CP1 is formed on the insulating layer TINS ​​(see Fig.13 ) is connected to the first sensing unit SP1.

[0217] Each of the (2-1)th sensing electrode SE2-1 and the (2-2)th sensing electrode SE2-2 includes a plurality of second sensing cells SP2 extending in the first direction DR1 and a plurality of first extension patterns EP1 extending from and connecting the second sensing cells SP2 in the first direction DR1. When viewed in a plan view, the first extension patterns EP1 cross the first connection patterns CP1.

[0218] The second sensing cells SP2 have a bent shape. For example, the second sensing cells SP2 of the (2-1)th sensing electrode SE2-1 and the second sensing cells SP2 of the (2-2)th sensing electrode SE2-2 are bent outward.

[0219] In each of the (2-1)th sensing electrode SE2-1 and the (2-2)th sensing electrode SE2-2, the first extension pattern EP1 is formed integrally with the second sensing unit SP2. Each of the first extension patterns EP1 is disposed between two adjacent second sensing units SP2, and may extend from and connect the two second sensing units SP2.

[0220] The first sensing cells SP1 and the second sensing cells SP2 are spaced apart from each other and alternately arranged while not overlapping each other. Capacitance is formed by the first sensing cells SP1 and the second sensing cells SP2.

[0221] The first sensing cells SP1 and the second sensing cells SP2 and the first extension pattern EP1 are disposed on the same layer. The first connection pattern CP1 is disposed on a different layer from the first sensing cells SP1 and the second sensing cells SP2 and the first extension pattern EP1. The first connection pattern CP1 is disposed under the first sensing cells SP1 and the second sensing cells SP2 and the first extension pattern EP1.

[0222] Each of the first pen sensing electrodes P-SE1 includes a plurality of first pen sensing units P-SP1 extending in the second direction DR2 and a plurality of second connection patterns CP2 connecting the first pen sensing units P-SP1.

[0223] The first pen sensing unit P-SP1 has a rhombus shape, but the shape of the first pen sensing unit P-SP1 is not necessarily limited thereto. The second connection pattern CP2 extends in the second direction DR2, is arranged between adjacent first pen sensing units P-SP1, and is connected to the first pen sensing units P-SP1. The first pen sensing units P-SP1 are connected to each other through the second connection pattern CP2.

[0224] Each of the second connection patterns CP2 is disposed between two adjacent first pen sensing units P-SP1 and connects the two adjacent first pen sensing units P-SP1. Fig.14 ) is disposed between the second connection pattern CP2 and the first pen sensing unit P-SP1, and the second connection pattern CP2 penetrates the insulating layer TINS ​​(see Fig.14 ) is connected to the first pen sensing unit P-SP1.

[0225] Each of the second pen sensing electrodes P-SE2 includes a plurality of second pen sensing cells P-SP2 extending in the first direction DR1 and a plurality of second extension patterns EP2 extending from and connecting the second pen sensing cells P-SP2 in the first direction DR1. When viewed in a plan view, the first extension patterns EP1 and the second extension patterns EP2 cross the first connection patterns CP1 and the second connection patterns CP2.

[0226] The second pen sensing unit P-SP2 has a rhombus shape, but the shape of the second pen sensing unit P-SP2 is not necessarily limited thereto. The second extension pattern EP2 is formed integrally with the second pen sensing unit P-SP2. Each of the second extension patterns EP2 is disposed between two adjacent second pen sensing units P-SP2, and extends from and connects the two adjacent second pen sensing units P-SP2.

[0227] The first pen sensing unit P-SP1, the second pen sensing unit P-SP2 and the second extension pattern EP2 are disposed on the same layer as the first sensing unit SP1, the second sensing unit SP2 and the first extension pattern EP1. The second connection pattern CP2 is disposed on the same layer as the first connection pattern CP1.

[0228] The first sensing wiring TL and the first sensing wiring PSL1 are insulated from each other and cross each other. For example, the first sensing wiring TL is integrally formed with the first sensing cell SP1 adjacent to the lower side of the active area AA and extends from the first sensing cell SP1. The first sensing wiring PSL1 is integrally formed with the second connection pattern CP2 adjacent to the lower side of the active area AA and extends from the second connection pattern CP2.

[0229] The first sensing wiring PSL1 is disposed under the first sensing wiring TL. An insulating layer is provided between the first sensing wiring PSL1 and the first sensing wiring TL.

[0230] Fig.12 is a plan view of a detailed configuration of a first sensing electrode and a (1-2)th sensing electrode according to an embodiment of the present disclosure.

[0231] refer to Fig.12 In an embodiment, the first sensing electrode P-SE1 and the (1-2) sensing electrode SE1-2 have a grid shape. For example, each of the first sensing electrode P-SE1 and the (1-2) sensing electrode SE1-2 includes a plurality of first branches BP1 extending in a first diagonal direction DDR1 and a plurality of second branches BP2 extending in a second diagonal direction DDR2.

[0232] The first diagonal direction DDR1 may be defined as a direction crossing the first and second directions DR1 and DR2 in a plane defined by the first and second directions DR1 and DR2. The second diagonal direction DDR2 may be defined as a direction crossing the first diagonal direction DDR1 in a plane defined by the first and second directions DR1 and DR2.

[0233] The first branch portions BP1 and the second branch portions BP2 intersect each other and are integrally formed. A mesh shape of the first pen sensing electrode P-SE1 and the (1-2)th sensing electrode SE1-2 is formed by the first branch portions BP1 and the second branch portions BP2.

[0234] The diamond opening T-OP is formed by the first branch BP1 and the second branch BP2. The light emitting area LA of the pixel PX is arranged in the diamond opening T-OP. Therefore, the first branch BP1 and the second branch BP2 overlap with the non-light emitting area NLA. For example, the (1-2)th sensing electrode SE1-2 and the first sensing electrode P-SE1 overlap with the non-light emitting area NLA.

[0235] Since the first and second branches BP1 and BP2 are disposed in the non-emission area NLA, light generated by the light emitting element OLED of the pixel PX may be emitted without being affected by the (1-2)th sensing electrode SE1-2 and the first pen sensing electrode P-SE1.

[0236] Fig.13 According to the embodiment of the present disclosure, Fig.11 and Fig.12 A cross-sectional view taken along line II-II' of Fig.14 According to the embodiment of the present disclosure, Fig.11 and Fig.12 Cross-sectional view along line III-III'.

[0237] refer to Fig.13 and Fig.14 In an embodiment, the base layer BSL is disposed on the encapsulation layer 140, and the first and second connection patterns CP1 and CP2 are disposed on the base layer BSL. The first and second connection patterns CP1 and CP2 are formed of the first conductive patterns CTL1 described above.

[0238] The insulating layer TINS ​​is disposed on the base layer BSL and covers the first connection pattern CP1 and the second connection pattern CP2. The first sensing unit SP1, the first pen sensing unit P-SP1, and the first extension pattern EP1 and the second extension pattern EP2 are disposed on the insulating layer TINS. In addition, the second sensing unit SP2 integrally formed with the first extension pattern EP1 and the second pen sensing unit P-SP2 integrally formed with the second extension pattern EP2 are also disposed on the insulating layer TINS.

[0239] The first sensing unit SP1 is connected to the first connection pattern CP1 through a first contact hole T-CH1 formed in the insulating layer TINS. The first pen sensing unit P-SP1 is connected to the second connection pattern CP2 through a second contact hole T-CH2 formed in the insulating layer TINS.

[0240] The black matrix BM is disposed on the insulating layer TINS ​​and covers the first sensing cells SP1, the first pen sensing cells P-SP1, and the first and second extension patterns EP1 and EP2. The color filter CF is disposed on the black matrix BM, and the planarization insulating layer PINS is disposed on the color filter CF.

[0241] Fig.15 is a flowchart of a method of driving a sensor driving unit according to an embodiment of the present disclosure.

[0242] refer to Figure 5 and Fig.15 In an embodiment, the sensor driving unit 200C transmits a first sensing signal SS1 to the first sensing electrode P-SE1 (see Fig.16 )(Step S100).

[0243] The sensor layer 200 receives a first sensing current IC1 from the input device PN (see Fig.19 )(Step S200).

[0244] The sensor driving unit 200C is based on the first inductive current IC1 (see Fig.19 ) calculates the x coordinate of the input device PN (step S300).

[0245] The sensor driving unit 200C determines whether the x coordinate is within the foldable area IFA (see Fig.10 ) (step S400).

[0246] When the x coordinate is within the foldable area IFA (see Fig.10 ), the sensor driving unit 200C transmits a signal having the same value as the first sensing signal SS1 (see Fig.16 ) of the driving frequency of the second sensing signal SS2 (see Fig.17 ) (step S510). Based on the second sensing signal SS2 (see Fig.17 ) charges the input device PN. The charged input device PN generates magnetic flux when discharging, and the magnetic flux can form a first induction current IC1 (see Fig.19 ) and the second inductive current IC2 (see Fig.19 ). Thereafter, the sensor driving unit 200C generates a current based on the first sensing current IC1 (see Fig.19 ) and the second inductive current IC2 (see Fig.19 ) calculates the coordinates of the input device PN (step S520).

[0247] The first sensing signal SS1 (see Fig.16 ) and the second sensing signal SS2 (see Fig.17 ) can be called the drive current.

[0248] When the x coordinate is not in the foldable area IFA (see Fig.10 ), for example, when the x coordinate is between the non-foldable areas INFA1 and INFA2 (see Fig.10 ) can be based on the first sensing signal SS1 (see Fig.16 ) charges the input device PN. The charged input device PN generates magnetic flux when discharging, and the magnetic flux can form a first induction current IC1 (see Fig.19 ) and the second inductive current IC2 (see Fig.19 ). The sensor driving unit 200C is based on the first induction current IC1 (see Fig.19 ) and the second inductive current IC2 (see Fig.19 ) calculates the coordinates of the input device PN (step S520).

[0249] According to an embodiment of the present disclosure, the sensor driving unit 200C transmits a first sensing signal SS1 having a first driving frequency to the sensor layer 200 according to the position of the input device PN relative to the display area DA (see Fig.16 ) and a second sensing signal SS2 having a second driving frequency (see Fig.17 ) during the charging period, the capacitor C of the input device PN is charged by the sensing signals SS1 and SS2. Due to the difference between the stacked structures of the lower members, the difference between the signals received from the input device PN can be removed or reduced. A phenomenon in which a picture drawn by the input device PN is bent in the foldable area FA can be prevented. Therefore, the electronic device 1000 has increased detection reliability, and an interface device including the electronic device 1000 can be provided.

[0250] Figures 16 to 18 1 shows the driving of the pen sensing electrode according to an embodiment of the present disclosure. Figures 16 to 18 In the description of Fig.10 The described components are denoted by the same reference numerals, and duplicate descriptions thereof will be omitted.

[0251] exist Figures 16 to 18 In FIG. 2 , for clarity of illustration, edges of the active area AA and the inactive area NAA of the sensor layer 200 are omitted. Figures 16 to 18 It is shown that the first sensing wiring PSL1 is divided into a (1-1)th sensing wiring PSL1-1, a (1-2)th sensing wiring PSL1-2, and a (1-3)th sensing wiring PSL1-3 from the left to the right.

[0252] refer to Figure 5 and Fig.16In an embodiment, the second sensing period includes a charging period and a pen sensing period after the charging period. During the charging period, the (1-1)th pen sensing wiring PSL1-1, the (1-2)th pen sensing wiring PSL1-2, the (1-3)th pen sensing wiring PSL1-3, the first pen sensing electrode P-SE1, and the (3-1)th pen sensing wiring PSL3-1, the (3-2)th pen sensing wiring PSL3-2, and the (3-3)th pen sensing wiring PSL3-3 are sequentially driven to form a coil.

[0253] For example, the first pad PD1 and the second pad PD2 are connected to the sensor driving unit 200C. The sensor driving unit 200C generates a first sensing signal SS1 having a first driving frequency and a second sensing signal SS2 having a second driving frequency different from the first driving frequency (see Fig.17 ) are transmitted in a predetermined order to the (1-1)th sensing wiring PSL1-1, the (1-2)th sensing wiring PSL1-2 and the (1-3)th sensing wiring PSL1-3, the first sensing electrode P-SE1 and the (3-1)th sensing wiring PSL3-1, the (3-2)th sensing wiring PSL3-2 and the (3-3)th sensing wiring PSL3-3.

[0254] During the first period of the charging period, the sensor driving unit 200C is connected to the first pad PD1 connected to the (3-2)th sensing wiring PSL3-2 and the (1-2)th sensing wiring PSL1-2. The sensor driving unit 200C transmits the first sensing signal SS1 to the (3-2)th sensing wiring PSL3-2. The first sensing signal SS1 flows through the (3-2)th sensing wiring PSL3-2, the first sensing electrode P-SE1 connected to the (1-2)th sensing wiring PSL1-2, and the (1-2)th sensing wiring PSL1-2.

[0255] Therefore, the (3-2)th sensing wiring PSL3-2, the first sensing electrode P-SE1 connected to the (1-2)th sensing wiring PSL1-2, and the (1-2)th sensing wiring PSL1-2 form a coil, and the first sensing signal SS1 flows through the (3-2)th sensing wiring PSL3-2, the first sensing electrode P-SE1 connected to the (1-2)th sensing wiring PSL1-2, and the (1-2)th sensing wiring PSL1-2.

[0256] For example, the input device PN is provided on the sensor layer 200. In the input device PN, the capacitor C is charged during the charging period.

[0257] When the input device PN overlaps the second non-foldable area INFA2, the resonance circuit unit PN100 resonates by the first sensing signal SS1 to charge the capacitor C. For example, the input device PN is disposed between the (3-2)th sensing wiring PSL3-2 and the first sensing electrode P-SE1 connected to the (1-2)th sensing wiring PSL1-2.

[0258] A magnetic flux is generated by the first sensing electrode P-SE1 connected to the (1-2) sensing wiring PSL1-2 and the first sensing signal SS1 flowing through the (3-2) sensing wiring PSL3-2, and the (1-2) sensing wiring PSL1-2. The magnetic flux flows into the ferrite core surrounded by the coil of the inductor L, and an induced current is generated in the coil of the inductor L. The capacitor C is charged by the induced current.

[0259] refer to Figure 5 , Fig.15 and Fig.17 In an embodiment, two or more first pen sensing electrodes P-SE1 spaced apart from each other are electrically connected to each other. The sensor driving unit 200C transmits the first sensing signal SS1 or the second sensing signal SS2 to at least one of the two or more first pen sensing electrodes P-SE1.

[0260] During a second period after the first period of the charging period, the sensor driving unit 200C is connected to the first pad PD1 connected to the (1-1)th sensing wiring PSL1-1 and the second pad PD2 connected to the (1-3)th sensing wiring PSL1-3. The sensor driving unit 200C transmits a first sensing signal SS1 to the (1-1)th sensing wiring PSL1-1 (step S100). The first sensing signal SS1 flows through the (1-1)th sensing wiring PSL1-1, the first sensing electrode P-SE1 connected to the (1-1)th sensing wiring PSL1-1, the first sensing electrode P-SE1 connected to the (1-3)th sensing wiring PSL1-3, and the (1-3)th sensing wiring PSL1-3.

[0261] The sensor layer 200 receives a first sensing current IC1 from the input device PN (see Fig.19 ) (Step S200). The sensor driving unit 200C generates a first inductive current IC1 (see Fig.19 ) calculates the x coordinate of the input device PN (step S300).

[0262] The sensor driving unit 200C determines whether the x coordinate is in the foldable area IFA (step S400 ).

[0263] When the input device PN does not overlap the foldable area IFA, for example, when the input device PN overlaps the non-foldable areas INFA1 and INFA2, the x coordinate is in the non-foldable areas INFA1 and INFA2. For example, during a first period or a third period to be described below, a magnetic flux generated by the first sensing signal SS1 flows into the ferrite core surrounded by the coil of the inductor L, and in this case, an induced current is generated in the coil of the inductor L. The capacitor C is charged by the induced current.

[0264] When the input device PN overlaps the foldable area IFA, the x coordinate is in the foldable area IFA. For example, the sensor driving unit 200C transmits a second sensing signal SS2 having a driving frequency different from that of the first sensing signal SS1 to the first pen sensing electrode P-SE1 (step S510).

[0265] During the second period, the sensor driving unit 200C is connected to the first pad PD1 connected to the (1-1)th sensing wiring PSL1-1 and the second pad PD2 connected to the (1-3)th sensing wiring PSL1-3. The sensor driving unit 200C transmits the second sensing signal SS2 to the (1-1)th sensing wiring PSL1-1. The second sensing signal SS2 flows through the (1-1)th sensing wiring PSL1-1, the first sensing electrode P-SE1 connected to the (1-1)th sensing wiring PSL1-1, the first sensing electrode P-SE1 connected to the (1-3)th sensing wiring PSL1-3, and the (1-3)th sensing wiring PSL1-3.

[0266] Therefore, the (1-1)th sensing wiring PSL1-1, the first sensing electrode P-SE1 connected to the (1-1)th sensing wiring PSL1-1, the first sensing electrode P-SE1 connected to the (1-3)th sensing wiring PSL1-3, and the (1-3)th sensing wiring PSL1-3 form a coil. In addition, the second sensing signal SS2 flows through the (1-1)th sensing wiring PSL1-1, the first sensing electrode P-SE1 connected to the (1-1)th sensing wiring PSL1-1, the first sensing electrode P-SE1 connected to the (1-3)th sensing wiring PSL1-3, and the (1-3)th sensing wiring PSL1-3.

[0267] A magnetic flux is generated by flowing through the (1-1)th sensing wiring PSL1-1, the first sensing electrode P-SE1 connected to the (1-1)th sensing wiring PSL1-1, the first sensing electrode P-SE1 connected to the (1-3)th sensing wiring PSL1-3, and the second sensing signal SS2 of the (1-3)th sensing wiring PSL1-3. The magnetic flux flows into the ferrite core surrounded by the coil of the inductor L, and an induced current is generated in the coil of the inductor L. The capacitor C is charged by the induced current.

[0268] Unlike the embodiment of the present disclosure, the inductance may be changed due to the difference between the stacking structures of the lower members of the electronic device 1000. The resonant frequency may be changed due to the change in inductance. Figure 1 ) moves to the foldable area FA (see Figure 1 ), the first inductive current IC1 (see Fig.19 ) and the second inductive current IC2 (see Fig.19 ) changes due to the changed resonance frequency, and therefore, the coordinates of the input device PN may not be accurately measured. However, according to an embodiment of the present disclosure, when the input device PN is disposed in the foldable area FA (see Figure 1 ), the sensor driving unit 200C transmits a second sensing signal SS2 having a second driving frequency corresponding to the resonant frequency changed by the stacked structure. Due to the difference between the stacked structures of the lower members, the difference between the signals received from the input device PN can be removed or reduced. Figure 1 ) The accuracy of the coordinates measured by the input device PN in ). Therefore, the electronic device 1000 has increased detection reliability, and an interface device including the electronic device 1000 can be provided.

[0269] However, in the electronic device 1000 according to an embodiment of the present disclosure, the sensor driving unit 200C may transmit the second sensing signal SS2 only to the first pen sensing electrode P-SE1 to form a magnetic flux in the foldable area IFA, and transmit the first sensing signal SS1 only to the first pen sensing electrode P-SE1 to form a magnetic flux in the non-foldable areas INFA1 and INFA2.

[0270] refer to Figure 5 and Fig.18During the third period after the second period of the charging period, the sensor driving unit 200C is connected to the first pad PD1 connected to the (1-2)th sensing wiring PSL1-2 and the second pad PD2 connected to the (3-3)th sensing wiring PSL3-3. The sensor driving unit 200C transmits the first sensing signal SS1 to the (1-2)th sensing wiring PSL1-2. The first sensing signal SS1 flows through the (1-2)th sensing wiring PSL1-2, the first sensing electrode P-SE1 connected to the (1-2)th sensing wiring PSL1-2, and the (3-3)th sensing wiring PSL3-3.

[0271] Therefore, the (1-2)th sensing wiring PSL1-2, the first sensing electrode P-SE1 connected to the (1-2)th sensing wiring PSL1-2, and the (3-3)th sensing wiring PSL3-3 form a coil, and the first sensing signal SS1 flows through the (1-2)th sensing wiring PSL1-2, the first sensing electrode P-SE1 connected to the (1-2)th sensing wiring PSL1-2, and the (3-3)th sensing wiring PSL3-3.

[0272] When the input device PN overlaps the first non-foldable area INFA1, the resonance circuit unit PN100 resonates by the first sensing signal SS1 to charge the capacitor C. For example, the input device PN is disposed between the (3-3)th sensing wiring PSL3-3 and the first sensing electrode P-SE1 connected to the (1-2)th sensing wiring PSL1-2.

[0273] A magnetic flux is generated by the first sensing signal SS1 flowing through the (1-2)th sensing wiring PSL1-2, the first sensing electrode P-SE1 connected to the (1-2)th sensing wiring PSL1-2, and the (3-3)th sensing wiring PSL3-3. The magnetic flux flows into the ferrite core surrounded by the coil of the inductor L, and an induced current is generated in the coil of the inductor L. The capacitor C is charged by the induced current.

[0274] Fig.19 A touch sensing operation of the input device is shown.

[0275] For ease of description, Fig.19 A first sensing electrode P-SE1 and a second sensing electrode P-SE2 through which the induced current generated by the input device PN flows are shown. In addition, the first sensing electrode SE1 adjacent to the first sensing electrode P-SE1 and the second sensing electrode SE2 adjacent to the second sensing electrode P-SE2 are shown together with the first sensing electrode P-SE1 and the second sensing electrode P-SE2.

[0276] refer to Figure 5 , Fig.15 and Fig.19 In an embodiment, during the pen sensing period after the charging period, the sensor driving unit 200C is electrically connected to the first sensing electrode SE1 and the second sensing electrode SE2. During the pen sensing period, the first sensing signal SS1 and the second sensing signal SS2 are not transmitted to the (1-1)th pen sensing wiring PSL1-1, the (1-2)th pen sensing wiring PSL1-2, and the (1-3)th pen sensing wiring PSL1-3, the first pen sensing electrode P-SE1, and the (3-1)th pen sensing wiring PSL3-1, the (3-2)th pen sensing wiring PSL3-2, and the (3-3)th pen sensing wiring PSL3-3.

[0277] The first sensing electrode P-SE1 and the second sensing electrode P-SE2 communicate with the input device PN. The resonant circuit unit PN100 of the input device PN generates magnetic flux while consuming electric charge. Due to the magnetic flux, an induced current is generated in the first sensing electrode P-SE1 and the second sensing electrode P-SE2.

[0278] The first sensing current IC1 generated in the first sensing electrode P-SE1 is transmitted to the first sensing electrode SE1 through the first capacitor CAP1 formed by the first sensing electrode SE1 and the first sensing electrode P-SE1, and is transmitted to the sensor driving unit 200C. The sensor driving unit 200C can calculate the x coordinate based on the first sensing current IC1. The second sensing current IC2 generated in the second sensing electrode P-SE2 is transmitted to the second sensing electrode SE2 through the second capacitor CAP2 formed by the second sensing electrode SE2 and the second sensing electrode P-SE2, and is transmitted to the sensor driving unit 200C. The sensor driving unit 200C can calculate the y coordinate based on the second sensing current IC2.

[0279] The sensor driving unit 200C calculates the coordinates of the input device PN by sensing the first sensing current IC1 and the second sensing current IC2 received through the first sensing electrode SE1 and the second sensing electrode SE2 (step S520). For example, the touch of the input device PN is sensed through the first pen sensing electrode P-SE1 and the second pen sensing electrode P-SE2 and the first sensing electrode SE1 and the second sensing electrode SE2.

[0280] According to the above description, the sensor driving unit transmits one of a first sensing signal having a first driving frequency and a second sensing signal having a second driving frequency different from the first driving frequency to the sensor layer according to the position of the input device relative to the display area. Due to the difference between the stacking structures of the lower member, the difference between the signals received from the input device can be removed or reduced. The phenomenon that the picture drawn by the input device is bent in the foldable area can be prevented. Therefore, an electronic device with improved detection reliability and an interface device including the electronic device can be provided.

[0281] Although the description has been provided above with reference to the embodiments of the present disclosure, it is to be understood that those skilled in the art or those with ordinary knowledge in the art may make various modifications and changes to the embodiments of the present disclosure without departing from the spirit and technical scope of the embodiments of the present disclosure as claimed in the attached claims. Therefore, the technical scope of the embodiments of the present disclosure is not limited to the detailed description, but should be defined by the attached claims.

Claims

1. An interface device, comprising: Electronic devices; as well as an input device in communication with the electronic device, Wherein, the electronic device comprises: A display layer, comprising a display area, the display area comprising a foldable area and a plurality of non-foldable areas spaced apart from each other, and the foldable area is interposed between the plurality of non-foldable areas; a sensor layer disposed on the display layer and comprising a plurality of detection electrodes; and A sensor driving unit drives the sensor layer. Wherein, the plurality of detection electrodes include: a first sensing electrode; a second sensing electrode insulated from the first sensing electrode and crossing the first sensing electrode; a first sensing electrode adjacent to the first sensing electrode, insulated from the second sensing electrode and crossing the second sensing electrode; and a second pen sensing electrode adjacent to the second sensing electrode, insulated from the first sensing electrode and the first pen sensing electrode, and crossing the first sensing electrode and the first pen sensing electrode, and The sensor driving unit transmits one of a first sensing signal having a first driving frequency and a second sensing signal having a second driving frequency different from the first driving frequency to the first pen sensing electrode according to the position of the input device relative to the display area.

2. The interface device according to claim 1, wherein: The sensor driving unit: transmitting the first sensing signal to the first sensing electrode; as well as When the input device overlaps the foldable area, the second sensing signal is transmitted to the first pen sensing electrode.

3. The interface device according to claim 1, wherein: The electronic device also includes a plurality of lower members disposed below the display layer and overlapping the plurality of non-foldable areas.

4. The interface device according to claim 3, wherein: When viewed in plan, the plurality of lower members do not overlap at least a portion of the foldable region.

5. The interface device according to claim 3, wherein: The plurality of lower members include a conductive shielding layer.

6. The interface device according to claim 3, wherein: The electronic device further includes a first bracket disposed below the plurality of lower members, and When viewed in a plan view, the first bracket overlaps the foldable region and the plurality of non-foldable regions.

7. The interface device according to claim 3, wherein: The electronic device further includes a plurality of second brackets disposed below the plurality of lower members, and A first separation distance between the plurality of lower members is smaller than a second separation distance between the plurality of second brackets.

8. The interface device according to claim 1, wherein: The first driving frequency is higher than the second driving frequency.

9. The interface device according to claim 1, wherein: The first sensing electrode includes a plurality of first sensing electrodes, and Two first pen sensing electrodes spaced apart from each other among the plurality of first pen sensing electrodes are electrically connected to each other.

10. The interface device according to claim 9, wherein: The sensor driving unit transmits one of the first sensing signal and the second sensing signal to one of the two first pen sensing electrodes.

11. The interface device according to claim 1, wherein: The first pen sensing electrode and the second pen sensing electrode communicate with the input device.

12. The interface device according to claim 1, wherein: The input device includes an electromagnetic resonance pen.

13. The interface device according to claim 12, wherein: The input device includes an inductor and a capacitor.

14. The interface device according to claim 1, wherein: The foldable region is spaced apart from the plurality of non-foldable regions in a first direction, and The first sensing electrode extends in a second direction crossing the first direction.

15. An electronic device comprising: A display layer, comprising a first area and a second area adjacent to the first area; a sensor layer, disposed on the display layer and comprising a plurality of detection electrodes; as well as A sensor driving unit drives the sensor layer. Wherein, the plurality of detection electrodes include: a plurality of first sensing electrodes; a plurality of second sensing electrodes insulated from the plurality of first sensing electrodes and crossing the plurality of first sensing electrodes; a plurality of first sensing electrodes adjacent to the plurality of first sensing electrodes, insulated from the plurality of second sensing electrodes and crossing the plurality of second sensing electrodes; and a plurality of second sensing electrodes adjacent to the plurality of second sensing electrodes and insulated from the plurality of first sensing electrodes and the plurality of first sensing electrodes and crossing the plurality of first sensing electrodes and the plurality of first sensing electrodes, and The sensor driving unit transmits a first sensing signal having a first driving frequency to a first sensing electrode among the plurality of first sensing electrodes to form a magnetic flux in the first area, and transmits a second sensing signal having a second driving frequency different from the first driving frequency to a first sensing electrode among the plurality of first sensing electrodes to form a magnetic flux in the second area.

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