Display module, display device and preparation method of display module

Abstract

The invention relates to a display module, a display device and a preparation method of the display module. The display module comprises a display panel; the attaching layer is arranged on the light emitting side of the display panel; the cover plate is arranged on the side, away from the display panel, of the attaching layer, the cover plate comprises a plane part and a bent part, and the bent part is bent towards the display panel; wherein the thickness of the fitting layer corresponding to the bending part is greater than that of the fitting layer corresponding to the plane part. Based on the scheme, bubbles generated due to existence of the bent part can be effectively improved.

Description

Technical Field

[0001] The present application relates to the technical field of display panels, and in particular to a display module, a display device, and a method for preparing the display module. Background Art

[0002] In order to achieve a better display effect or tactile effect, etc., an existing display device sets the edge of the display module to a curved structure, which is generally called a curved screen.

[0003] Taking a conventional rectangular display device as an example, in the prior art, the curved screen is generally divided into a double-curved screen and a quad-curved screen. The double-curved screen is a display device with curved structures on the left and right sides of the display module, and the quad-curved screen is a display device with curved structures on all four sides. The left and right sides are the two sides adjacent to the side where the binding area is located.

[0004] Although the above-mentioned curved screen has certain advantages during use, it was later discovered that in the process of preparing this type of curved screen display module, since the edge of the display module is curved, the cover plate of the display module squeezes the bonding layer at the curved position, which easily generates bubbles, affects the display effect of the display module, and the display module may have quality problems. Summary of the invention

[0005] In order to solve the above technical problems, the present application provides a display module, a display device and a method for preparing the display module.

[0006] In a first aspect, the present application provides a display module, comprising:

[0007] Display panel;

[0008] A bonding layer, arranged on the light-emitting side of the display panel;

[0009] A cover plate, disposed on a side of the laminating layer away from the display panel, the cover plate comprising a planar portion and a curved portion, the curved portion being curved toward the display panel;

[0010] Wherein, the thickness of the bonding layer corresponding to the curved portion is greater than the thickness of the bonding layer corresponding to the planar portion.

[0011] In a second aspect, based on the same inventive concept, the present application also provides a display device, comprising the display module described in the first aspect.

[0012] In a third aspect, based on the same inventive concept, the present application further provides a method for preparing a display module, the method being used to prepare the display module as described in the first aspect; the method comprising:

[0013] Providing the display panel and the cover plate;

[0014] Adhere the light emitting side of the display panel to the cover plate by using a bonding layer;

[0015] Wherein, the cover plate includes a planar portion and a curved portion, the curved portion is curved toward the display panel; and the thickness of the bonding layer corresponding to the curved portion is greater than the thickness of the bonding layer corresponding to the planar portion.

[0016] Compared with the prior art, the technical solution provided by this application has the following advantages:

[0017] The present application provides a display module, a display device and a method for preparing a display module, wherein the display module comprises: a display panel; a bonding layer, which is arranged on the light-emitting side of the display panel; a cover plate, which is arranged on the side of the bonding layer away from the display panel, wherein the cover plate comprises a plane portion and a curved portion, and the curved portion is curved toward the display panel; wherein the thickness of the bonding layer corresponding to the curved portion is greater than the thickness of the bonding layer corresponding to the plane portion. In the above scheme, relative to the corresponding position of the plane portion, the present application actually increases the thickness of the bonding layer at the corresponding position of the curved portion; on the one hand, since the bonding layer at the corresponding position of the curved portion is thicker, even after the cover plate squeezes the bonding layer, the bonding layer will not be unable to fill the corresponding position of the curved portion due to the small thickness of the bonding layer, and the probability of generating bubbles is smaller; on the other hand, since the bonding layer at the corresponding position of the curved portion is thicker, the ability to absorb bubbles is stronger, and even after a certain number of bubbles are generated, the bubbles can be effectively sucked into the interior of the bonding layer through the bonding layer and diffused into the molecular gap of the bonding layer, and the bubbles cannot be in the form of bubbles. In summary, the present application can effectively improve the problem of bubbles existing in the curved portion of a display module or display device with a curved structure based on the above-mentioned solution, thereby improving the quality of the display module or display device. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0019] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0020] Figure 1 A schematic diagram of a display module structure of a related solution;

[0021] Figure 2 A schematic diagram of a display module structure provided in an embodiment of the present application;

[0022] Figure 3A schematic diagram of another display module structure provided in an embodiment of the present application;

[0023] FIG4( a) is a schematic diagram of another display module structure provided in an embodiment of the present application;

[0024] FIG4( b ) is a schematic diagram of another display module structure provided in an embodiment of the present application;

[0025] Figure 5 A schematic diagram of another display module structure provided in an embodiment of the present application;

[0026] Figure 6 A schematic diagram of another display module structure provided in an embodiment of the present application;

[0027] Figure 7 A schematic diagram of another display module structure provided in an embodiment of the present application;

[0028] Figure 8 A schematic diagram of another display module structure provided in an embodiment of the present application;

[0029] Fig. 9 A schematic diagram of another display module structure provided in an embodiment of the present application;

[0030] Fig.10 A schematic diagram of the structure of a display device provided in an embodiment of the present application;

[0031] Fig.11 A schematic diagram of structural changes in a display module packaging process provided in an embodiment of the present application.

[0032] Reference numerals:

[0033] 100, display panel; 200, bonding layer; 300, cover plate; 301, curved portion; 302, flat portion; 000, bubble; 303, corner; 3011, first transition zone; 3012, second transition zone; 204, first bonding adhesive layer; 205, second bonding adhesive layer; S1, first zone; S2, second zone. DETAILED DESCRIPTION

[0034] In order to more clearly understand the above-mentioned purposes, features and advantages of the present application, the scheme of the present application will be further described below. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0035] In the following description, many specific details are set forth to facilitate a full understanding of the present application, but the present application may also be implemented in other ways different from those described herein; obviously, the embodiments in the specification are only part of the embodiments of the present application, rather than all of the embodiments.

[0036] It is obvious to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention. Therefore, the present invention is intended to cover modifications and variations of the present invention that fall within the scope of the corresponding claims (technical solutions claimed for protection) and their equivalents. It should be noted that the implementation methods provided in the embodiments of the present invention can be combined with each other without contradiction.

[0037] Figure 1 This is a schematic diagram of a display module structure of a related solution, from a cross-sectional perspective.

[0038] like Figure 1 As shown, the display module may include a display panel 100, a bonding layer 200 and a cover plate 300. The cover plate 300 is arranged on the side of the bonding layer 200 away from the display panel 100, and includes a flat portion 302 and a curved portion 301. The display panel 100 represents a basic structure that can achieve a display effect, and the display module is formed after further packaging. The cover plate 300 is a light-transmitting structure arranged on the light-emitting side of the display panel 100, generally glass, which can play a role in protecting the display panel 100. The bonding layer 200 is arranged between the cover plate 300 and the display panel 100, and can play a role in fixing the cover plate 300 and the display panel 100 to each other. The above description of the display panel 100, the cover plate 300 and the bonding layer 200 is only a brief description of the above structure, and the purpose is only to clarify which structure of the above structures belongs to in the existing display module. The other functions of each structure have no direct relationship with the improvement points of the present application, and are not exhaustively listed here.

[0039] Before encapsulating the display panel 100, the display panel 100 is generally a planar structure, and the cover plate 300 includes a planar portion 302 and a curved portion 301. In the process of encapsulating the display panel 100, the cover plate 300 is fixed to the display panel 100 by a specific encapsulation device and pressure is applied to the cover plate 300. The curved portion 301 of the cover plate 300 further applies pressure to the display panel 100, so that the display panel 100 is forced to bend at the position corresponding to the curved portion 301, and finally the encapsulation of the display panel 100 is completed. Among them, the bonding layer 200 has been prepared on the light-emitting side of the display panel 100 before the cover plate 300 is fixed to the display panel 100. Of course, it may also be prepared on the side of the cover plate 300 facing the display panel 100. During the packaging process, the plane portion 302 is relatively flat in structure and therefore is evenly stressed, making the generation of bubbles 000 less likely. However, in the curved portion 301, due to uneven stress and the need to compress the display panel 100 into a curved shape, the squeezing of the bonding layer 200 may result in the bonding layer 200 being unable to fill the curved portion 301 well, generating bubbles 000 and affecting the quality of the display panel 100.

[0040] In order to solve the above technical problems, the embodiments of the present application provide a display module, a display device and a method for manufacturing the display module.

[0041] Figure 2 A schematic diagram of a display module structure provided in an embodiment of the present application includes:

[0042] Display panel 100 .

[0043] The bonding layer 200 is disposed on the light emitting side of the display panel 100 .

[0044] The cover plate 300 is disposed on a side of the bonding layer 200 away from the display panel 100 . The cover plate 300 includes a planar portion 302 and a curved portion 301 . The curved portion 301 is curved toward the display panel 100 .

[0045] The thickness of the bonding layer 200 corresponding to the curved portion 301 is greater than the thickness of the bonding layer 200 corresponding to the planar portion 302 .

[0046] like Figure 2 As shown, Figure 2 Schematic diagram of the display module structure before packaging (before the cover plate 300 is fixed to the display panel 100), which is a cross-sectional view. The meaning of the bonding layer 200 corresponding to the curved portion 301 is that after packaging, the corresponding position of the bonding layer 200 contacts the curved portion 301 of the cover plate 300; the meaning of the bonding layer 200 corresponding to the flat portion 302 is that after packaging, the corresponding position of the bonding layer 200 contacts the flat portion 302 of the cover plate 300. In the figure, the thickness of the bonding layer 200 corresponding to the curved portion 301 is indicated as H1, and the thickness of the bonding layer 200 corresponding to the flat portion 302 is indicated as H2. In the embodiment of the present application, the thickness of the bonding layer 200 at the position corresponding to the bending portion 301 is thickened. Even if pressure is applied to the bonding layer 200 during the packaging process, the bonding layer 200 is thicker at this position and can better fill the position, thereby reducing the probability of generating bubbles. On the other hand, because the bonding layer 200 is thicker at this position, even if a certain amount of bubbles are generated, the bubbles can be absorbed by the bonding layer 200, so that the bubbles diffuse into the inside of the bonding layer 200 and the shape of the bubbles cannot be maintained. Figure 3 Another display module structure schematic diagram provided in the embodiment of the present application is a cross-sectional view. Figure 3 As shown, Figure 3 is a schematic diagram of the display module structure after packaging (after the cover plate 300 is fixed to the display panel 100), compared with Figure 1 The display module provided by the embodiment of the present application will not generate bubbles after packaging. Therefore, the embodiment of the present application can improve the problem of bubbles in the display module with a curved surface structure based on the above solution and improve the quality of the display module.

[0047] FIG4(a) is a schematic diagram of another display module structure provided in an embodiment of the present application, and FIG4(b) is a schematic diagram of another display module structure provided in an embodiment of the present application. In some embodiments, the planar portion 302 is rectangular, and the curved portion 301 is located at the corners 303 of two adjacent sides and at least one pair of opposite sides of the planar portion 302.

[0048] In a display module with a rectangular structure, the curved portion 301 may be arranged on two opposite sides of the flat portion 302 of the cover plate 300 which is also rectangular, or the curved portion 301 may be arranged on all four sides, and there may be a problem of bubbles at the position where the curved portion 301 is arranged. Therefore, the embodiment of the present application can be improved for different situations. After research, it was found that not only on the side where the curved portion 301 is located, but also at the corners 303 on both sides adjacent to the side where the curved portion 301 is located, there may be a problem of bubbles due to the same reason, so the embodiment of the present application is also improved.

[0049] Figures 4(a) and 4(b) are both top views. As shown in Figure 4(a), Figure 4(a) is a structure in which a curved portion 301 is provided on two opposite sides of the cover plate 300. Correspondingly, a thicker bonding layer can also be provided at the curved portion 301 on two opposite sides of the cover plate 300 and at the corner 303. As shown in Figure 4(b), Figure 4(b) is a structure in which a curved portion 301 is provided on four sides of the cover plate 300. Correspondingly, a thicker bonding layer can also be provided at the curved portion 301 on four sides of the cover plate 300 and at the corner 303. In Figures 4(a) and 4(b), the thickness of the thicker bonding layer can be H1, and the thickness of the thinner bonding layer can be H2. Based on the above scheme, the embodiment of the present application can effectively eliminate bubbles generated by the existence of the curved portion 301.

[0050] In some embodiments, the difference between the thickness of the lamination layer corresponding to the planar portion and the thickness of the lamination layer corresponding to the curved portion ranges from 25 micrometers to 100 micrometers.

[0051] Specifically, after research, it was found that the difference between the thickness of the bonding layer corresponding to the plane part and the thickness of the bonding layer corresponding to the curved part should not be too high or too low. The size of the difference actually reflects the volume difference of the bonding layer at this position. If the difference is too large, it actually means that the volume of the bonding layer at the corresponding position of the curved part is too large. On the one hand, it may easily cause the problem of glue overflow. On the other hand, there may also be a strong step difference between the curved part and the plane part due to the large difference, which will cause marks after the display panel is packaged. If the difference is too small, the bonding layer may not be able to fill the gap well, nor absorb all the bubbles well, and the display module still has the problem of bubbles after packaging. After actual testing, the difference range is between 25 microns and 100 microns, which can not only achieve the beneficial effect of eliminating bubbles better, but also avoid adverse consequences such as glue overflow and marks.

[0052] In some embodiments, the difference between the thickness of the laminating layer corresponding to the planar portion and the thickness of the laminating layer corresponding to the curved portion is positively correlated with the curvature of the curved portion.

[0053] Figure 5 Another schematic diagram of the display module structure provided for the embodiment of the present application is a cross-sectional view. It has been explained in the previous embodiment that in the process of encapsulating the display module, the flat display panel 100 is forced to bend. After research, it was found that in this case, the curvature of the display panel 100 after encapsulation is smaller than the curvature of the cover plate 300 at the corresponding position of the bending portion, and the greater the curvature of the bending portion, the greater the difference between the curvature of the bending portion and the curvature of the display panel 100 after encapsulation at the corresponding position of the bending portion 301, and therefore the greater the maximum spacing H3 of the internal area formed between the two.

[0054] To this end, the embodiment of the present application can make the difference between the thickness of the bonding layer 200 corresponding to the planar portion 302 and the thickness of the bonding layer 200 corresponding to the curved portion 301 positively correlated with the curvature of the curved portion 301, that is, the greater the curvature of the curved portion 301, the greater the difference, and the internal area is filled with a larger bonding layer 200 to absorb the bubbles generated at this position, thereby avoiding the generation of bubbles, thereby achieving the purpose of improving the quality of the display module.

[0055] Figure 6 Another schematic diagram of a display module structure provided in an embodiment of the present application is a cross-sectional view. In some embodiments, the curved portion 301 includes a first transition region 3011 and / or a second transition region 3012 .

[0056] The first transition zone 3011 is connected to the plane portion 302 , and the second transition zone 3012 is away from the plane portion 302 .

[0057] The thickness of the laminating layer 200 corresponding to the first transition region 3011 gradually increases in the direction away from the plane portion 302, and the thickness of the laminating layer 200 corresponding to the second transition region 3012 gradually decreases in the direction away from the plane portion 302.

[0058] After research, it was found that when there is a certain thickness difference between the bonding layer 200 corresponding to the curved portion 301 and the bonding layer 200 corresponding to the flat portion 302, and there is no transition zone between the two, a "step" effect will be produced, and the "step" will not disappear due to the end of the packaging process. After the packaging is completed, the "step" still exists. Under the action of light, the bonding layers 200 of different thicknesses produce different reflection effects, which in turn causes marks on the display module, affecting the quality of the display module.

[0059] To this end, the embodiment of the present application may set a first transition zone 3011 and / or a second transition zone 3012 in the curved portion 301, such as Figure 6 To reduce the length of the article, Figure 6 2 shows an embodiment in which both the first transition zone 3011 and the second transition zone 3012 are provided, and no single scenario is further illustrated. Figure 6 In the structure, the thickness of the bonding layer 200 is actually gradually increased or decreased instead of forming an obvious step difference. In this way, the "step" effect will no longer be produced. After the packaging is completed, the bonding layer 200 can transition more smoothly as a whole to eliminate the imprint.

[0060] In some embodiments, the laminating layer includes OCR liquid optically clear adhesive.

[0061] Specifically, OCR (Optical Clear Resin) liquid optical transparent adhesive is a transparent material with strong viscosity, which can better adhere to the cover, eliminate bubbles, and repair step differences.

[0062] Moreover, compared with the traditional OCA (Optical Clear Adhesive) tape, the bonding layer can be prepared by printing and spraying instead of only by front coating, which makes it easier to prepare the required shape and reduces the complexity of the process.

[0063] Figure 7 Another schematic diagram of a display module structure provided by an embodiment of the present application is a cross-sectional view. In some embodiments, the bonding layer 200 corresponding to the curved portion 301 includes at least two stacked bonding adhesive layers.

[0064] like Figure 7 As shown, Figure 7When there are more bonding adhesive layers, it is also easier to make the bonding layer 200 corresponding to the curved portion 301 form a pyramid-shaped bonding layer 200 with a gradually decreasing width. Figure 7 The diagram schematically shows that the bonding layer 200 corresponding to the curved portion 301 is composed of three layers of bonding adhesive layers, which are indicated as 201, 202 and 203. The layer 201 closest to the display panel 100 is a full-surface structure, so the width is not indicated. The widths of the other two layers 202 and 203 can be W1 and W2, respectively, and W2<W1. Compared with the relatively flat bonding layer 200 without a gradual width change, it naturally has a shape that better fits the shape of the curved portion 301, which can achieve a better filling effect, thereby improving the effect of eliminating bubbles.

[0065] In addition, since the number of layers of the bonding layer 200 can be multiple, it is also easier to stack the thickness of the bonding layer 200 corresponding to the bent portion 301 to be larger.

[0066] Furthermore, since the laminating layer 200 with a gradient structure is formed, it can actually form an effect similar to the gradual change of the film thickness in the above specific embodiment, which is helpful to reduce the occurrence of imprints.

[0067] Figure 8 Another display module structure schematic diagram provided for an embodiment of the present application is a cross-sectional view. In some embodiments, of two adjacent laminating layers, the laminating layer away from the display panel 100 has a vertical projection on the display panel 100 that is located within the vertical projection of the laminating layer adjacent to the display panel 100.

[0068] Specifically, after research, it was found that after the thickness of the bonding layer 200 at the position corresponding to the curved portion 301 is increased, the bonding layer 200 may overflow to the outside of the display module during the process of encapsulating the display module, that is, there is a glue overflow. Moreover, the closer the position of the thicker bonding layer 200 is to the edge of the cover plate 300 or the display panel 100, the greater the possibility of glue overflow.

[0069] To this end, the embodiment of the present application can shrink the location of the thicker bonding layer 200. Figure 8 As shown, Figure 8 Only two layers of bonding adhesive layers are shown, namely 201 and 202. The vertical projection of 202 falls within the vertical projection range of 201, that is, the vertical projection of the bonding layer 200 far away from the display panel 100 on the display panel 100 is located within the vertical projection of the bonding adhesive layer adjacent to the display panel 100 on the display panel 100. Since the bonding layer 200 for absorbing bubbles is at a large distance from the edge of the display panel 100, the possibility of glue overflow is lower during the packaging process, that is, the purpose of reducing the possibility of glue overflow is achieved.

[0070] Fig. 9 Another display module structure schematic diagram provided in the embodiment of the present application is a cross-sectional view. In some embodiments, the bonding layer 200 includes a first bonding adhesive layer 204, and the curved portion 301 also includes a second bonding adhesive layer 205 located on a side of the first bonding adhesive layer 204 away from the display panel 100.

[0071] like Fig. 9 As shown, the bonding layer 200 is not only arranged on the curved portion 301, but also on the flat portion 302. If a complete bonding layer 200 is prepared by only one adhesive layer, the thickness difference of the bonding layer 200 at different positions will increase the difficulty of the preparation process or increase the complexity of the preparation process.

[0072] In the case where the bonding layer 200 corresponding to the curved portion 301 uses at least two laminated bonding adhesive layers, the layer on the side facing the display panel 100 can be prepared in the same process as the adhesive layer of the flat portion 302, and in the second process, only the adhesive layer on the side away from the display panel 100 needs to be prepared, which can not only reduce the difficulty of the process, but also reduce the complexity of the preparation process. That is, in the first process, the adhesive layer of the entire surface structure is prepared, and in the second process, the second adhesive layer is only prepared at the position corresponding to the curved portion 301, so that the bonding layer 200 with a thicker thickness at the position corresponding to the curved portion 301 can be formed.

[0073] In some embodiments, the first bonding adhesive layer includes OCA optical adhesive, and the second bonding adhesive layer includes OCR liquid optical transparent adhesive.

[0074] Specifically, OCA can be prepared in a whole-surface manner, and its preparation difficulty, process complexity, tediousness and preparation cost are all relatively low, so the first bonding adhesive layer can be made of OCA optical adhesive.

[0075] As for the second bonding adhesive layer, since it is only provided at the position corresponding to the bending part, and not provided at the area corresponding to the flat part, if OCA is used, it may be necessary to prepare the entire surface and then remove the second bonding adhesive layer of the flat part, which is a cumbersome process. However, due to its strong fluidity, OCR can be prepared by spray printing to prepare the second bonding adhesive layer, which can prepare the shape of the second bonding adhesive layer more accurately.

[0076] It should be noted that the above Fig. 9In the embodiment, the bonding layer 200 corresponding to the bending portion 301 is illustrated as being prepared by two adhesive layers. When the bonding layer 200 corresponding to the bending portion 301 has more adhesive layers, for example, a third bonding layer, a fourth bonding layer... and so on are also provided on the side of the second bonding layer 205 away from the display panel 100, the third bonding layer, the fourth bonding layer... may also adopt OCR.

[0077] By using the two different types of bonding layers in combination, the cost can be effectively reduced, the complexity of the process can be reduced, and the shape of the bonding layer of the curved part can be accurately prepared, achieving multiple goals at one stroke.

[0078] Fig.10 A schematic diagram of the structure of a display device provided in an embodiment of the present application, wherein the display device includes a display module according to any one of the above display module embodiments.

[0079] The display device provided in the embodiment of the present application includes the display module in the above embodiment, and thus can also achieve the same or at least similar technical effects as the above display module embodiment, which will not be repeated here.

[0080] The present application also provides a method for preparing a display module, which is used to prepare the display module of any one of the above display module embodiments. The method comprises:

[0081] Display panels and cover panels are provided.

[0082] A bonding layer is used to bond the light emitting side of the display panel to the cover plate.

[0083] The cover plate includes a plane portion and a curved portion, the curved portion is curved toward the display panel, and the thickness of the bonding layer corresponding to the curved portion is greater than the thickness of the bonding layer corresponding to the plane portion.

[0084] Specifically, although the present application exemplarily takes the preparation of the bonding layer on the display panel as an example in the above-mentioned display module embodiment, it can be understood that the role of the bonding layer in the embodiment of the present application is to fix the display panel and the cover plate, and as long as the thickness of the bonding layer corresponding to the bent portion is greater than the thickness of the bonding layer corresponding to the flat portion, it can eliminate bubbles. Therefore, the bonding layer in the embodiment of the present application can actually be set on the display panel or on the cover plate. As long as the thickness of the bonding layer corresponding to the bent portion is greater than the thickness of the bonding layer corresponding to the flat portion, the volume of the bonding layer corresponding to the bent portion is actually increased, which can achieve a better filling effect and the effect of absorbing bubbles, and finally achieve the purpose of eliminating bubbles.

[0085] In some embodiments, a bonding layer is used to bond the light emitting side of the display panel to the cover plate, including:

[0086] A bonding layer is formed on the light-emitting side of the display panel, wherein the edge of the bonding layer is located within the edge surrounding range of the display panel, the bonding layer includes a first area and a second area, and the thickness of the first area is greater than the thickness of the second area.

[0087] The cover plate is laminated to the laminating layer. The cover plate includes a planar portion and a curved portion, and the curved portion is curved toward the display panel. The planar portion corresponds to the second area, and the curved portion corresponds to the first area.

[0088] Fig.11 The schematic diagram of the structural change of a display module packaging process provided by the embodiment of the present application is a cross-sectional view. Fig.11 As shown in (a), a bonding layer 200 can be formed on a display panel 100 with a planar structure, and the bonding layer 200 includes a first area S1 and a second area S2. The first area S1 corresponds to the curved portion 301. After the encapsulation is completed, in the direction perpendicular to the plane where the planar portion 302 of the cover plate 300 is located, the vertical projection of the first area S1 falls within the vertical projection range of the curved portion 301 (including overlap). The second area S2 corresponds to the planar portion 302. After the encapsulation is completed, in the direction perpendicular to the plane where the planar portion 302 of the cover plate 300 is located, the vertical projection of the second area S2 falls within the vertical projection range of the planar portion 302 (including overlap). Thus, the thickness of the bonding layer 200 corresponding to the curved portion 301 is greater than the thickness of the bonding layer 200 corresponding to the planar portion 302. The solution for forming different thicknesses of the first area S1 and the second area S2 can refer to the corresponding part in the above display module embodiment and will not be repeated here. The thickness of the first area S1 can be H1, the thickness of the second area S2 can be H2, and H1>H2.

[0089] like Fig.11 As shown in (b), after forming a cover plate 300 including a first area S1 and a second area S2 on the display panel 100, the cover plate 300 can be attached to the side of the adhesive layer 200 away from the display panel 100 by a specific packaging device, and pressure is applied to the cover plate 300, and the cover plate 300 squeezes the adhesive layer 200 under the action of the packaging device, and then squeezes the display panel 100. Among them, the adhesive layer 200 of the first area S1 fills the internal area between the cover plate 300 and the display panel 100 (i.e., the position corresponding to the curved portion 301) under the action of pressure. Although the internal force is uneven due to the different curvatures of the cover plate 300 and the display panel 100, the thickness of the adhesive layer 200 here is larger, that is, it is actually larger in volume, so it can effectively fill the internal area between the cover plate 300 and the display panel 100. In addition, even if bubbles are generated, the adhesive layer 200 with a larger thickness can also absorb the bubbles (i.e., air) into the interior of the adhesive layer 200, so that it cannot form bubbles, thereby achieving the purpose of eliminating bubbles.

[0090] It should be noted that, in this article, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0091] The above description is only a specific implementation of the present application, so that those skilled in the art can understand or implement the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments described herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A display module, characterized in that: include: Display panel; A bonding layer, arranged on the light-emitting side of the display panel; A cover plate, disposed on a side of the laminating layer away from the display panel, the cover plate comprising a planar portion and a curved portion, the curved portion being curved toward the display panel; Wherein, the thickness of the bonding layer corresponding to the curved portion is greater than the thickness of the bonding layer corresponding to the planar portion.

2. The display module according to claim 1, characterized in that: The plane portion is rectangular, and the curved portion is located at the corners of two adjacent sides and at least one pair of opposite sides of the plane portion.

3. The display module according to claim 1, characterized in that: The difference between the thickness of the laminating layer corresponding to the planar portion and the thickness of the laminating layer corresponding to the curved portion ranges from 25 micrometers to 100 micrometers.

4. The display module according to claim 1, characterized in that: The difference between the thickness of the bonding layer corresponding to the planar portion and the thickness of the bonding layer corresponding to the curved portion is positively correlated with the curvature of the curved portion.

5. The display module according to claim 1, characterized in that: The curved portion comprises a first transition zone and / or a second transition zone; The first transition zone is connected to the plane portion, and the second transition zone is away from the plane portion; The thickness of the bonding layer corresponding to the first transition zone gradually increases along the direction away from the planar portion; and the thickness of the bonding layer corresponding to the second transition zone gradually decreases along the direction away from the planar portion.

6. The display module according to claim 5, characterized in that: The bonding layer includes OCR liquid optical transparent glue.

7. The display module according to claim 1, characterized in that: The bonding layer corresponding to the bent portion includes at least two stacked bonding adhesive layers.

8. The display module according to claim 7, characterized in that: Of the two adjacent laminating adhesive layers, the vertical projection of the laminating adhesive layer farther from the display panel on the display panel is located within the vertical projection of the laminating adhesive layer adjacent to the display panel on the display panel.

9. The display module according to claim 8, characterized in that: The bonding layer includes a first bonding adhesive layer, and the bent portion further includes a second bonding adhesive layer located on a side of the first bonding adhesive layer away from the display panel.

10. The display module according to claim 9, characterized in that: The first bonding adhesive layer includes OCA optical adhesive, and the second bonding adhesive layer includes OCR liquid optical transparent adhesive.

11. A display device, characterized in that: The invention comprises a display panel as claimed in any one of claims 1 to 10.

12. A method for preparing a display module, characterized in that: The method is used to prepare the display module according to any one of claims 1 to 10; the method comprises: Providing the display panel and the cover plate; Adhere the light emitting side of the display panel to the cover plate by using a bonding layer; Wherein, the cover plate includes a planar portion and a curved portion, the curved portion is curved toward the display panel; and the thickness of the bonding layer corresponding to the curved portion is greater than the thickness of the bonding layer corresponding to the planar portion.

13. The method according to claim 12, characterized in that The step of laminating the light emitting side of the display panel to the cover plate using a laminating layer comprises: A bonding layer is formed on the light-emitting side of the display panel; wherein the edge of the bonding layer is located within the surrounding range of the edge of the display panel, the bonding layer includes a first area and a second area, and the thickness of the first area is greater than the thickness of the second area; The cover plate is laminated to the laminating layer; wherein the cover plate comprises a planar portion and a curved portion, and the curved portion is curved toward the display panel; the planar portion corresponds to the second area, and the curved portion corresponds to the first area.

Images