Multilayer electronic component

Abstract

The present disclosure provides a multilayer electronic component. The multilayer electronic component includes: a body including dielectric layers and internal electrodes alternately disposed with the dielectric layers in a first direction; an external electrode disposed outside the main body; and an oxide layer disposed between the body and the external electrode and connecting the internal electrode and the external electrode, in which the oxide layer includes one or more of an oxide of Ni and an oxide of Cu.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2023-0102619 filed on August 7, 2023 in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference. Technical Field

[0002] The present disclosure relates to a multi-layer electronic assembly. Background Art

[0003] A multilayer ceramic capacitor (MLCC, a type of multilayer electronic component) may be a chip capacitor mounted on a printed circuit board of any of various electronic products such as an imaging device including a liquid crystal display (LCD) or a plasma display panel (PDP), a computer, a smartphone, or a mobile phone, for charging or discharging therefrom.

[0004] Multilayer ceramic capacitors have a small size, achieve high capacitance, and are easy to mount, and thus can be used as components of various electronic devices. In particular, as various electronic devices such as computers, mobile devices, etc. become smaller and have higher outputs, the demand for miniaturization and higher capacitance of multilayer ceramic capacitors is increasing.

[0005] However, with the recent miniaturization and higher capacitance of multilayer ceramic capacitors, the dielectric layers and internal electrodes of multilayer ceramic capacitors are becoming thinner, making the performance of multilayer ceramic capacitors more susceptible to degradation with changes in the external environment. Therefore, there may be a problem that the moisture-proof reliability of the multilayer ceramic capacitor deteriorates with the penetration of external moisture, etc.

[0006] In addition, generally, in order to make the inner electrode thinner, it is necessary to use finer metal powder particles than before, but when finer metal powder particles are used, the shrinkage start temperature of the inner electrode may move to a lower temperature, so a difference in shrinkage behavior between the inner electrode and the dielectric layer may occur. In this case, since the shrinkage rate of the inner electrode may be greater than the shrinkage rate of the dielectric layer, a problem of deterioration of connectivity between the inner electrode and the outer electrode may occur.

[0007] Therefore, there is a need to study a structure of a multilayer ceramic capacitor that can improve moisture resistance reliability and improve connectivity between inner and outer electrodes. Summary of the invention

[0008] One aspect of the present disclosure is to improve the moisture resistance reliability of multi-layer electronic components.

[0009] An aspect of the present disclosure is to improve connectivity between inner and outer electrodes.

[0010] However, the purpose of the present disclosure is not limited to the above contents and will be more easily understood in the process of describing specific embodiments of the present disclosure.

[0011] According to one aspect of the present disclosure, a multilayer electronic component includes: a main body, including a dielectric layer and internal electrodes alternately arranged with the dielectric layer in a first direction; an external electrode, arranged outside the main body; and an oxide layer, arranged between the main body and the external electrode and connecting the internal electrode and the external electrode, wherein the oxide layer includes Ni oxide, Cu oxide, or both.

[0012] According to another aspect of the present disclosure, a multilayer electronic component includes: a body, including a dielectric layer and internal electrodes alternately arranged with the dielectric layer; an oxide layer, contacting one surface of the body and including a metal oxide; and an external electrode, arranged on the oxide layer, wherein at least one groove is arranged between the one surface of the body and an end of the internal electrode, and the oxide layer is in contact with the end of the internal electrode. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The above and other aspects, features and advantages of the present disclosure will be more clearly understood through the following detailed description in conjunction with the accompanying drawings, in which: Figure 1 is a perspective view schematically illustrating a multilayer electronic component according to an embodiment of the present disclosure.

[0014] Figure 2 It is schematically shown Figure 1 sectional view of a multilayer electronic component taken along line II'.

[0015] Figure 3 It is schematically shown Figure 1 sectional view of a multilayer electronic component taken along line II-II'.

[0016] Figure 4 is partially shown Figure 2 A cross-sectional view schematically shows a main body and a detailed structure of the main body.

[0017] Figure 5 yes Figure 2 An enlarged view of part K1 in FIG.

[0018] Figure 6 yes Figure 2 Magnified view of section K2.

[0019] Figure 7 yes Figure 5 An enlarged view of section K3 in FIG.

[0020] Figure 8is a graph schematically showing X-ray diffraction patterns of oxide layers in Examples and Comparative Examples.

[0021] Fig. 9 and Fig.10 They are schematically shown Figure 2 A modified example of a multilayer electronic component according to another embodiment of the present disclosure and Figure 2 The corresponding cross-sectional view. DETAILED DESCRIPTION

[0022] Hereinafter, embodiments of the present disclosure will be described with reference to specific example embodiments and the accompanying drawings. However, embodiments of the present disclosure may be illustrated in many different forms and should not be construed as being limited to the specific embodiments set forth herein. The example embodiments disclosed herein are provided to those skilled in the art to better explain the present disclosure. In the accompanying drawings, the shapes and sizes of elements may be exaggerated for clarity, and the same reference numerals will always be used to indicate the same or similar elements.

[0023] In addition, in order to clearly describe the present disclosure in the drawings, the contents irrelevant to the description are omitted, and since the size of each component shown in the drawings is arbitrarily shown for the convenience of description, the present disclosure is not limited thereto. In addition, components with the same functions within the scope of the same concept are described using the same reference numerals. Throughout the specification, unless otherwise specified, when a specific part "includes" or "contains" a specific component, this means that other components are not excluded and other components may also be included.

[0024] In the drawings, a first direction may be defined as a thickness direction, a second direction may be defined as a length direction, and a third direction may be defined as a width direction.

[0025] Multilayer electronic components Figure 1 is a perspective view schematically illustrating a multilayer electronic component according to an embodiment of the present disclosure.

[0026] Figure 2 It is schematically shown Figure 1 sectional view of a multilayer electronic component taken along line II'.

[0027] Figure 3 It is schematically shown Figure 1 sectional view of a multilayer electronic component taken along line II-II'.

[0028] Figure 4 is partially shown Figure 2 A cross-sectional view schematically shows a main body and a detailed structure of the main body.

[0029] Figure 5yes Figure 2 An enlarged view of part K1 in FIG.

[0030] Figure 6 yes Figure 2 Magnified view of section K2.

[0031] Figure 7 yes Figure 5 An enlarged view of section K3 in FIG.

[0032] In the following, reference will be made to Figures 1 to 7 A multilayer electronic component 100 according to an embodiment of the present disclosure is described. In addition, a multilayer ceramic capacitor (hereinafter referred to as "MLCC") will be described as an example of a multilayer electronic component, but the present disclosure is not limited thereto, and the multilayer electronic component may also include an inductor, a piezoelectric element, a varistor, a thermistor, etc.

[0033] The multilayer electronic component 100 according to an embodiment of the present disclosure may include: a body 110 including a dielectric layer 111 and internal electrodes 121 and 122 ; external electrodes 131 and 132 ; and oxide layers 141 and 142 .

[0034] As described above, in the related art, as the dielectric layer 111 and the internal electrodes 121 and 122 become thinner, there may be a problem of reduced moisture-proof reliability due to penetration of external moisture, etc. In addition, when fine metal powder particles are used to thin the internal electrodes 121 and 122, there may be a problem of deteriorated connectivity between the internal electrodes 121 and 122 and the external electrodes 131 and 132 due to the difference in shrinkage behavior between the internal electrodes 121 and 122 and the dielectric layer 111.

[0035] The multilayer electronic component 100 according to an embodiment of the present disclosure may include oxide layers 141 and 142 disposed between the body 110 and the external electrodes 131 and 132 to suppress penetration of external moisture, etc., and improve connectivity between the internal electrodes 121 and 122 and the external electrodes 131 and 132 .

[0036] Hereinafter, each component included in the multilayer electronic component 100 according to an embodiment of the present disclosure will be described in more detail.

[0037] Although the specific shape of the main body 110 is not particularly limited, Figure 1 As shown in , the body 110 may have a hexahedral shape or a shape similar thereto. Due to shrinkage of ceramic powder included in the body 110 during a sintering process and / or polishing of corners, the body 110 may not have a hexahedral shape with perfect straight lines but may generally have a hexahedral shape.

[0038] The main body 110 may have a first surface 1 and a second surface 2 opposite to each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and opposite to each other in a second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1, the second surface 2, the third surface 3, and the fourth surface 4 and opposite to each other in a third direction.

[0039] The main body 110 may include a dielectric layer 111 and inner electrodes 121 and 122 alternately disposed with the dielectric layer 111. For example, the inner electrodes 121 and 122 may be alternately disposed with the dielectric layer 111 in a first direction. The plurality of dielectric layers 111 forming the main body 110 may be in a sintered state, and adjacent dielectric layers 111 may be integrated to such an extent that it may be difficult to identify the boundary between them without using a scanning electron microscope (SEM).

[0040] The dielectric layer 111 may include, for example, a dielectric material, and the dielectric material may include BaTiO3 or (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1- x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O3 (0 < y < 1), etc., but the present disclosure is not limited thereto.

[0041] The average thickness td of the dielectric layer 111 does not have to be particularly limited, but may be, for example, 0.01 μm to 10 μm. In addition, the average thickness td of the dielectric layer 111 may be arbitrarily set according to desired characteristics or uses. For example, in a small information technology (IT) electronic component (for example, an electronic component mounted on a printed circuit board (PCB) of an IT device), the average thickness td of at least one of the plurality of dielectric layers 111 may be 0.4 μm or less to achieve miniaturization and high capacitance.

[0042] Generally, as the thickness of the dielectric layer 111 becomes thinner, the insulation resistance may be liable to deteriorate due to external moisture penetrating into the main body 110, which reduces the reliability of the multilayer electronic component. The multilayer electronic component 100 according to an embodiment of the present disclosure may include oxide layers 141 and 142 disposed between the main body 110 and the outer electrodes 131 and 132, so that the reliability of the multilayer electronic component 100 can be ensured even when the average thickness td of the dielectric layer 111 is 0.4 μm or less.

[0043] The internal electrodes 121 and 122 may be alternately disposed with the dielectric layer 111. For example, the first internal electrode 121 and the second internal electrode 122, which may be a pair of electrodes having different polarities, may be disposed to face each other with the dielectric layer 111 interposed therebetween. The first internal electrode 121 and the second internal electrode 122 may be electrically separated from each other by the dielectric layer 111 disposed therebetween.

[0044] The first inner electrode 121 may be disposed to be spaced apart from the fourth surface 4 and to extend toward the third surface 3. The second inner electrode 122 may be disposed to be spaced apart from the third surface 3 and to extend toward the fourth surface 4. The first inner electrode 121 may be electrically connected to the first outer electrode 131 on the third surface 3, and the second inner electrode 122 may be electrically connected to the second outer electrode 132 on the fourth surface 4.

[0045] The conductive metal included in the internal electrodes 121 and 122 may be one or more of Ni, Cu, Pd, Ag, Au, Pt, Sn, W, Ti, and alloys thereof, and more preferably, may include Ni, but the present disclosure is not limited thereto.

[0046] The average thickness te of the internal electrodes 121 and 122 does not need to be particularly limited, but may be, for example, 0.01 μm to 3 μm. In addition, the average thickness te of the internal electrodes 121 and 122 may be arbitrarily set according to desired characteristics or uses. For example, in a small IT electronic component, the average thickness te of at least one of the plurality of internal electrodes 121 and 122 may be 0.4 μm or less to achieve miniaturization and high capacitance.

[0047] As described above, the multilayer electronic component 100 according to the embodiment of the present disclosure may include the oxide layers 141 and 142 disposed between the body 110 and the external electrodes 131 and 132 , thereby ensuring reliability of the multilayer electronic component 100 even when the average thickness te is 0.4 μm or less.

[0048] The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 represent the average size of the dielectric layer 111 in the first direction and the average size of the internal electrodes 121 and 122 in the first direction, respectively. The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 can be measured by scanning the cross section of the body 110 in the first direction and the second direction at a magnification of 10000 with a scanning electron microscope (SEM). More specifically, the average thickness td of the dielectric layer 111 can be obtained by measuring the thickness of one dielectric layer 111 at multiple points (for example, 30 equidistant points) in the second direction and averaging. In addition, the average thickness te of the internal electrode 121 or 122 can be obtained by measuring the thickness of one internal electrode 121 or 122 at multiple points (for example, 30 equidistant points) in the second direction and averaging. The 30 equidistant points can be specified in the capacitance forming part Ac to be described later. In addition, when the average thickness values ​​are obtained by measuring and averaging ten dielectric layers 111 and ten internal electrodes 121 and 122 , respectively, the average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 may be more generalized.

[0049] The body 110 may include: a capacitor forming part Ac, which is disposed in the body 110 and includes a dielectric layer 111 and a first internal electrode 121 and a second internal electrode 122 alternately disposed to form a capacitor; and a first cover part 112 and a second cover part 113, which are respectively disposed on opposite surfaces of the capacitor forming part Ac in the first direction. The cover parts 112 and 113 may be mainly used to prevent the internal electrodes 121 and 122 from being damaged due to physical stress and / or chemical stress. The cover parts 112 and 113 may have the same material as the dielectric layer 111, except that they do not include the internal electrodes.

[0050] The thickness of the covering portions 112 and 113 may not be specifically limited. In order to miniaturize the multilayer electronic component and increase the capacitance, the average thickness tc of the covering portions 112 and 113 may be 20 μm or less. As described above, the multilayer electronic component 100 according to an embodiment of the present disclosure may include oxide layers 141 and 142 disposed between the body 110 and the external electrodes 131 and 132, thereby ensuring the reliability of the multilayer electronic component 100 even when the average thickness tc of the covering portions 112 and 113 is 20 μm or less. In this case, the average thickness tc of the covering portions 112 and 113 represents the average thickness of the first covering portion 112 and the average thickness of the second covering portion 113.

[0051] The average thickness tc of the covering parts 112 and 113 may represent an average size of the covering parts 112 and 113 in the first direction, and may be an average of the size in the first direction measured at five equidistant points in the second direction in a cross section of the body 110 in the first and second directions.

[0052] The body 110 may include a first edge portion 114 and a second edge portion 115, respectively disposed on both sides of the capacitance forming portion Ac that are opposite to each other in the third direction. For example, the edge portions 114 and 115 may refer to regions between both ends of the internal electrodes 121 and 122 and the outer surface of the body 110 in a cross section of the body 110 cut along the first direction and the third direction.

[0053] The edge portions 114 and 115 may include the same material as the dielectric layer 111, except that they do not include the internal electrodes 121 and 122. The edge portions 114 and 115 may mainly serve to prevent the internal electrodes 121 and 122 from being damaged due to physical stress and / or chemical stress.

[0054] The average thickness of the edge portions 114 and 115 does not have to be particularly limited. In order to miniaturize the multilayer electronic component and increase the capacitance, the average thickness of the edge portions 114 and 115 may be 15 μm or less. As described above, the multilayer electronic component 100 according to an embodiment of the present disclosure may include oxide layers 141 and 142 disposed between the body 110 and the external electrodes 131 and 132, thereby ensuring the reliability of the multilayer electronic component 100 even when the average thickness of the edge portions 114 and 115 is 15 μm or less. In this case, the average thickness of the edge portions 114 and 115 refers to the average thickness of the first edge portion 114 and the average thickness of the second edge portion 115.

[0055] The average thickness of the edge portions 114 and 115 may represent an average size of the edge portions 114 and 115 in the third direction, and may be an average value of the size in the third direction measured at five equidistant points in the first direction in a cross section of the body 110 in the first and third directions.

[0056] When a magnetic material is applied to the body 110 instead of a dielectric material, the multilayer electronic component may be used as an inductor. The magnetic material may be, for example, ferrite particles and / or metal magnetic particles. When the multilayer electronic component is used as an inductor, the inner electrodes 121 and 122 may be coil conductors.

[0057] In addition, when a piezoelectric material is applied to the body 110 instead of the dielectric material, the multilayer electronic component may be used as a piezoelectric element. The piezoelectric material may be, for example, lead zirconate titanate (PZT).

[0058] Furthermore, when a ZnO-based material or a SiC-based material is applied to the body 110 instead of a dielectric material, the multilayer electronic component may function as a varistor, and when a spinel-based material is applied to the body 110 instead of a dielectric material, the multilayer electronic component may function as a thermistor.

[0059] For example, the multilayer electronic component according to an embodiment of the present disclosure may appropriately change the material or structure of the body 110 to function as an inductor, a piezoelectric element, a varistor or a thermistor, and a multilayer ceramic capacitor.

[0060] The external electrodes 131 and 132 may be disposed outside the body 110. Specifically, the external electrodes 131 and 132 may be disposed on the third surface 3 and the fourth surface 4 of the body 110, and may be disposed to extend over a portion of the first surface 1, a portion of the second surface 2, a portion of the fifth surface 5, and a portion of the sixth surface 6. The external electrodes 131 and 132 may include: a first external electrode 131 disposed on the third surface 3 and electrically connected to the first internal electrode 121; and a second external electrode 132 disposed on the fourth surface 4 and electrically connected to the second internal electrode 122.

[0061] The external electrodes 131 and 132 may include electrode layers 131a and 132a disposed on the oxide layers 141 and 142, and plating layers 131b and 132b disposed on the electrode layers 131a and 132a. For example, the first external electrode 131 may include a first electrode layer 131a and a first plating layer 131b disposed on the first electrode layer 131a, and the second external electrode 132 may include a second electrode layer 132a and a second plating layer 132b disposed on the second electrode layer 132a.

[0062] The electrode layers 131a and 132a may be, for example, sintered electrode layers containing metal and glass. Alternatively, the electrode layers 131a and 132a may be conductive resin layers containing metal and resin. Alternatively, the electrode layers 131a and 132a may be thin film layers formed by a thin film forming method such as sputtering, deposition, etc. The electrode layers 131a and 132a may preferably be sintered electrode layers, but the present disclosure is not limited thereto, and the electrode layers 131a and 132a may include one or more of a sintered electrode layer, a conductive resin layer, and a thin film layer.

[0063] The metal included in the electrode layers 131 a and 132 a may include Cu, Ni, Sn, Pd, Pt, Au, Ag, Pb, and / or an alloy including the same, and more preferably, Cu, but the present disclosure is not limited thereto.

[0064] The plating layers 131b and 132b can improve the mounting characteristics. The types of the plating layers 131b and 132b are not particularly limited, and the plating layers 131b and 132b can be plating layers containing Ni, Sn, Pd and / or alloys thereof, and can be formed into multiple layers. The plating layers 131b and 132b can be, for example, Ni plating layers or Sn plating layers, or can be formed by sequentially forming Ni plating layers and Sn plating layers. In addition, the plating layers 131b and 132b can include multiple Ni plating layers and / or multiple Sn plating layers.

[0065] Although the drawings show a structure in which the multilayer electronic component 100 has two external electrodes 131 and 132 , the structure is not limited thereto, and the number, shape, etc. of the external electrodes 131 and 132 may vary according to the form of the internal electrodes 121 and 122 , other purposes, etc.

[0066] For example, the oxide layers 141 and 142 may be disposed between the body 110 and the external electrodes 131 and 132 to connect the internal electrodes 121 and 122 with the external electrodes 131 and 132. The oxide layers 141 and 142 may include: a first oxide layer 141 disposed between the body 110 and the first external electrode 131 to connect the first internal electrode 121 with the first external electrode 131; and a second oxide layer 142 disposed between the body 110 and the second external electrode 132 to connect the second internal electrode 122 with the second external electrode 132.

[0067] For example, the oxide layers 141 and 142 may contact one surface of the body 110, and the external electrodes 131 and 132 may be disposed on the oxide layers 141 and 142. For example, the oxide layers 141 and 142 may include a first oxide layer 141 contacting the third surface 3 of the body 110, and a second oxide layer 142 contacting the fourth surface 4 of the body 110, and the first external electrode 131 may be disposed on the first oxide layer 141, and the second external electrode 132 may be disposed on the second oxide layer 142.

[0068] More specifically, the oxide layers 141 and 142 may include: a first oxide layer 141 covering the third surface 3; and a second oxide layer 142 spaced apart from the first oxide layer 141 and covering the fourth surface 4. For example, the oxide layers 141 and 142 may cover at least a portion of the dielectric layer 111 and at least a portion of the internal electrodes 121 and 122. The first oxide layer 141 and the second oxide layer 142 may be disposed between an extension line E1 of the first surface 1 and an extension line E2 of the second surface 2, but the present disclosure is not limited thereto. For example, the oxide layers 141 and 142 may extend from a first corner of the body 110 to a second corner of the body 110 in the first direction. Therefore, the oxide layers 141 and 142 may not be disposed on the first surface 1.

[0069] When a voltage is applied, the oxide layers 141 and 142 can electrically connect the inner electrodes 121 and 122 with the outer electrodes 131 and 132 through a tunnel effect. The tunnel effect refers to a phenomenon in which electrons can move between metals at a metal-insulator-metal junction. When a voltage higher than a certain level is applied to an insulator, electrons can tunnel through the insulator and can move between metals. For example, when an electric field of a certain magnitude or greater is applied, electrons can tunnel through the oxide layers 141 and 142 and can move between the inner electrodes 121 and 122 and the outer electrodes 131 and 132. This tunnel effect occurs because the oxide layers 141 and 142 are formed into a thin film using a sol-gel method to be described later.

[0070] The oxide layers 141 and 142 may include a metal oxide. The oxide layers 141 and 142 may be formed using a sol-gel method as will be described later. The type of metal oxide contained in the oxide layers 141 and 142 may not be specifically limited. The metal oxide may be appropriately selected in consideration of the reactivity and dispersibility of the metal precursor used in the sol-gel method, the moisture resistance and tunneling characteristics of the metal oxide, and the like. For example, the metal oxide may include one or more of an oxide of Ni and an oxide of Cu. The oxide layers 141 and 142 may mainly include a metal oxide to prevent external moisture, etc. from penetrating into the internal electrodes 121 and 122, thereby improving the moisture resistance reliability of the multilayer electronic component 100.

[0071] In addition, the oxide layers 141 and 142 may improve connectivity between the internal electrodes 121 and 122 and the external electrodes 131 and 132. Figure 2 and Figure 4 , the body 110 may include at least one groove G1 and G2 disposed between one surface of the body 110 contacting the oxide layers 141 and 142 and the end of the internal electrodes 121 and 122. More specifically, at least one first groove G1 may be disposed between the third surface 3 contacting the first oxide layer 141 and the end of the first internal electrode 121, and at least one second groove G2 may be disposed between the fourth surface 4 contacting the second oxide layer 142 and the end of the second internal electrode 122. The grooves G1 and G2 may be formed by a difference in shrinkage behavior between the internal electrodes 121 and 122 and the dielectric layer 111 during a sintering process of the body 110. When the sintering shrinkage rate of the internal electrodes 121 and 122 is greater than that of the dielectric layer 111, a problem may occur in which connectivity between the internal electrodes 121 and 122 and the external electrodes 131 and 132 is reduced due to the grooves G1 and G2.

[0072] According to an embodiment of the present disclosure, the oxide layers 141 and 142 may contact the ends of the internal electrodes 121 and 122 in the grooves G1 and G2 to improve connectivity between the internal electrodes 121 and 122 and the external electrodes 131 and 132. In a process using a sol-gel method to be described later, during a process of coating the outer surface of the body 110 with a solution in which a metal precursor and an organic solvent are mixed to form an oxide layer, the solution may be easily applied to the grooves G1 and G2. Therefore, after the heat treatment process, during the process of forming the oxide layers 141 and 142, connectivity between the internal electrodes 121 and 122 and the external electrodes 131 and 132 may be ensured without requiring a separate polishing process.

[0073] In the following, reference will be made to Figures 5 to 7 The oxide layers 141 and 142 are described in more detail. Figures 5 to 7 The first oxide layer 141 is shown. Although there is a difference that the first oxide layer 141 is disposed on the third surface 3 and the second oxide layer 142 is disposed on the fourth surface 4, the first oxide layer 141 and the second oxide layer 142 may have substantially the same configuration. Therefore, the description of the first oxide layer 141 will be considered to include the description of the second oxide layer 142.

[0074] like Figure 5 and Figure 6 As shown in FIG. 1 , the first oxide layer 141 may include a first region 141 a continuously disposed on the third surface 3 and forming a single layer, and at least one second region 141 b extending from the first region 141 a into the first groove G1 and contacting an end of the first internal electrode 121 .

[0075] In addition, refer to Figure 5 , the size L1 of the second region 141b in the second direction does not need to be particularly limited, but may be, for example, greater than 0 nm and less than or equal to 200 nm. Since the grooves G1 and G2 may be formed by the difference in shrinkage behavior between the dielectric layer 111 and the internal electrodes 121 and 122 during the sintering process of the body 110, the sizes L1 of the grooves G1 and G2 in the second direction may be different from each other, and the sizes L1 of the grooves G1 and G2 in the second direction may be randomly determined regardless of where the grooves G1 and G2 are disposed in the first direction.

[0076] In addition, if Figure 2As shown in , the grooves G1 and G2 may not be provided on the end of at least one of the internal electrodes 121 and 122. For example, in the cross section in the first and second directions cut from the center of the body 110 in the third direction, the ratio of the number of the grooves G1 and G2 to the total number of the internal electrodes 121 and 122 may be, for example, 30% to 70%. For example, in the cross section in the first and second directions cut from the center of the body 110 in the third direction, the ratio of the number of the first grooves G1 to the total number of the first internal electrodes 121 may be 30% to 70%, and the ratio of the number of the second grooves G2 to the total number of the second internal electrodes 122 may be 30% to 70%. In an image of the cross section in the first and second directions cut from the center of the body 110 in the third direction using a scanning electron microscope (SEM), the number ratio of the grooves G1 and G2 may be determined as the ratio of the number of the grooves G1 and G2 existing in a portion of the body 110 to the total number of the internal electrodes 121 and 122, for example, in an enlarged central region in the first direction, the number ratio of the grooves G1 and G2 may be measured in the enlarged region.

[0077] In an embodiment, the oxide layers 141 and 142 may include spherical nanoparticles of metal oxides. For example, the oxide layers 141 and 142 may include one or more of spherical nanoparticles of Ni oxide and spherical nanoparticles of Cu oxide. Figure 7 As shown in , the first oxide layer 141 may have a form in which spherical nanoparticles NP of metal oxide are aggregated. The spherical nanoparticles NP may be a structural feature that appears when the metal oxide is synthesized using a sol-gel method. Since the oxide layers 141 and 142 have an aggregated form of spherical nanoparticles NP of metal oxide, it may be advantageous to thin the oxide layers 141 and 142 and effectively suppress the penetration of external moisture.

[0078] The average diameter of the spherical nanoparticles NP may be, for example, 4 nm to 20 nm, and more preferably 5 nm to 10 nm. When the average diameter of the spherical nanoparticles NP falls within the above range, the effect of thinning the oxide layers 141 and 142 and the effect of suppressing external moisture penetration may become more significant.

[0079] The average diameter of the spherical nanoparticles NP may refer to, for example, an average value of the diameters of the spherical nanoparticles obtained by obtaining an image in the first direction and the second direction of the cross-section of the oxide layers 141 and 142 cut from the center of the body 110 in the third direction using a scanning electron microscope SEM at a magnification of 50,000, and analyzing the image using an image analysis program (e.g., Zootos program from Zootos Inc.). Even if not described in the present disclosure, other methods and / or tools understood by those of ordinary skill in the art may be used.

[0080] In an embodiment, the oxide layers 141 and 142 include an oxide of Ni, and I1>I2 may be satisfied, wherein, in the X-ray diffraction pattern of the oxide layer, I1 is the intensity of the diffraction peak of the (111) crystal plane, and I2 is the intensity of the diffraction peak of the (200) crystal plane. More specifically, the oxide layers 141 and 142 may be preferentially oriented toward the (111) crystal plane. I1 and I2 may be changed according to the heat treatment temperature, the heat treatment time, etc., but when the oxide layers 141 and 142 are formed by a sol-gel method, I1>I2 may be satisfied by heat treatment at a temperature of 200°C to 500°C for about 1 hour.

[0081] Figure 8 is a graph schematically showing X-ray diffraction patterns of oxide layers in examples and comparative examples. More specifically, the example shows an X-ray diffraction pattern of Ni oxide formed by a sol-gel method according to an embodiment of the present disclosure, and the comparative example shows an X-ray diffraction pattern of Ni oxide formed by heat treating metal Ni at a temperature of 100° C. to 300° C. Figure 8 , it can be seen that the embodiment of the present disclosure satisfies I1>I2, but the comparative example satisfies I1 <I2。

[0082] The average thickness to of the oxide layers 141 and 142 does not have to be particularly limited. In an embodiment, the average thickness to of the oxide layers 141 and 142 may be greater than or equal to 20nm and less than or equal to 50nm. When the average thickness to of the oxide layers 141 and 142 is less than 20nm, the effect of improving moisture-proof reliability of the present disclosure may be minimal. In addition, when the average thickness to of the oxide layers 141 and 142 is greater than 50nm, the equivalent series resistance (ESR) of the multilayer electronic component 100 may be excessively increased. If the average thickness to of the oxide layers 141 and 142 is greater than or equal to 20nm, the average thickness to of the oxide layers 141 and 142 may be sufficient. However, when the average thickness to of the oxide layers 141 and 142 is less than 30nm, in the process of forming the oxide layers 141 and 142, since the solution used to form the oxide layer may be unevenly applied to the third surface 3 and the fourth surface 4 of the body 110, the thickness uniformity of the oxide layers 141 and 142 may be reduced. Therefore, more preferably, the average thickness to of the oxide layers 141 and 142 may be greater than or equal to 30 nm and less than or equal to 50 nm.

[0083] The average thickness to of the oxide layers 141 and 142 may represent an average size of the oxide layers 141 and 142 in the second direction, and may be an average value of the size in the second direction measured at 5 equidistant points in the first direction in a cross section of the oxide layers 141 and 142 in the first and second directions cut from the center of the body 110 in the third direction. In this case, the thickness of the oxide layers 141 and 142 refers to a distance in the second direction between an inner surface of the oxide layers 141 and 142 contacting one surface of the body 110 and an outer surface of the oxide layers 141 and 142 contacting the external electrodes 131 and 132.

[0084] Reference Figure 5 and Figure 6 , in an embodiment, t2 / t1 may be greater than or equal to 0.9 and less than or equal to 1.0, wherein t1 is the thickness of the first oxide layer 141 measured at the central region of the body 110 in the first direction, and t2 is the thickness of the first oxide layer 141 measured at the first inner electrode 121 disposed at the outermost portion in the first direction. That is, the oxide layers 141 and 142 may have a uniform thickness in the first direction to ensure moisture-proof reliability without excessively increasing the ESR of the multilayer electronic component 100. t1 and t2 may represent the size of the oxide layers 141 and 142 in the second direction, and may be measured by using a scanning electron microscope (SEM) to cut the cross-section of the oxide layers 141 and 142 in the first direction and the second direction from the center of the body 110 in the third direction. Even if not described in the present disclosure, other methods and / or tools understood by those of ordinary skill in the art may be used.

[0085] Fig. 9 and Fig.10 They are schematically shown Figure 2 A modified example of a multilayer electronic component according to another embodiment of the present disclosure and Figure 2 In the following, reference will be made to Fig. 9 and Fig.10 A modified example and another embodiment of the present disclosure are described. However, descriptions overlapping with the above-described embodiment of the present disclosure will be omitted.

[0086] Reference Fig. 9 , the first oxide layer 141' may cover a portion of the third surface 3, and the second oxide layer 142' may cover a portion of the fourth surface 4. Therefore, the first oxide layer 141' and the second oxide layer 142' may be disposed between the extension line E1 of the first surface 1 and the extension line E2 of the second surface 2. Specifically, the first oxide layer 141' and the second oxide layer 142' may be disposed below the extension line E1 of the first surface 1 and above the extension line E2 of the second surface 2.

[0087] In this case, the process efficiency can be improved by controlling (e.g., reducing) the coating amount of the solution used in the sol-gel method, while ensuring the effect of improving the connectivity between the inner electrodes 121 and 122 and the outer electrodes 131 and 132.

[0088] Referring to Fig.10 , the first oxide layer 141'' can cover the third surface 3, and the second oxide layer 142'' can cover the fourth surface 4. The oxide layers 141'' and 142'' can be arranged to extend over a part of the first surface 1 and a part of the second surface 2. Additionally, at least a part of the first surface 1 (e.g., the part not covered by the oxide layers 141'' and 142'' and the outer electrodes 131 and 132) can be exposed.

[0089] In this case, since the oxide layers 141'' and 142'' can also cover a part of the first surface 1 and a part of the second surface 2, the effect of improving the moisture-proof reliability can be more significant.

[0090] Hereinafter, an example of the manufacturing method of the above-described multilayer electronic component 100 will be described.

[0091] First, ceramic powder for forming the dielectric layer 111 can be prepared. The ceramic powder is not particularly limited as long as sufficient capacitance can be obtained. For example, barium titanate-based materials, lead composite perovskite-based materials, strontium titanate-based materials, etc. can be used. Examples of barium titanate-based ceramic powder can include BaTiO3 or (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O3 (0 < y < 1), etc. In the ceramic powder, BaTiO3 can be synthesized, for example, by reacting a titanium raw material (such as titanium dioxide, etc.) with a barium raw material (such as barium carbonate, etc.). The method for synthesizing the ceramic powder (BaTiO3) can include, for example, solid-phase method, sol-gel method, hydrothermal synthesis method, etc., but the present disclosure is not limited thereto.

[0092] Next, after drying and pulverizing the prepared ceramic powder, ceramic slurry may be prepared by mixing an organic solvent such as ethanol and a binder such as polyvinyl butyral, and the ceramic slurry may be coated on a carrier film and dried to prepare a ceramic green sheet.

[0093] Next, a conductive paste for internal electrodes including metal powder, a binder, etc. may be printed on the ceramic green sheet with a predetermined thickness using a screen printing method, a gravure printing method, etc. to form an internal electrode pattern.

[0094] Thereafter, the ceramic green sheet on which the internal electrode pattern is printed may be peeled off from the carrier film, the ceramic green sheets on which the internal electrode pattern is printed may be stacked in a predetermined number of layers to form a stacked body, and the stacked body may be cut into a predetermined sheet size. In order to form the cover portions 112 and 113 after sintering, the ceramic green sheets on which the internal electrode pattern is not printed may be stacked in a predetermined number of layers on the upper and lower portions of the stacked body in the first direction. In addition, in order to form the edge portions 114 and 115 after sintering, a conductive paste for the internal electrode may be applied to the ceramic green sheet except for the region where the edge portions 114 and 115 are to be formed, or a separate ceramic green sheet may be stacked on the surface of the cut sheet in the third direction.

[0095] The adhesive and the like included in the dicing sheet may preferably be removed by an adhesive removal process. The conditions of the adhesive removal process may be changed according to the type of adhesive used, and the conditions of the adhesive removal process are not particularly limited. For example, the adhesive removal process may be performed at a temperature of 180° C. or higher and 450° C. or lower for a period of 0.5 hours or more and 24 hours or less.

[0096] Thereafter, the sheet on which the binder removal process is performed may be sintered at a temperature of 1100° C. or more and 1300° C. or less to form the body 110 including the dielectric layer 111 and the internal electrodes 121 and 122. In this case, during the sintering process, due to a difference in sintering shrinkage behavior between the internal electrodes 121 and 122 and the dielectric layer 111, the grooves G1 and G2 may be formed.

[0097] Next, the oxide layers 141 and 142 may be formed by a sol-gel method. First, a solution for forming the oxide layer may be prepared by mixing a metal precursor and an organic solvent such as methanol. The type of the metal precursor does not have to be particularly limited and may vary according to the type of the target metal oxide. For example, when the metal oxide included in the oxide layers 141 and 142 includes an oxide of Ni, the metal precursor may include nickel acetate tetrahydrate (Ni(CH3CO2)2·4H2O). For example, when the metal oxide included in the oxide layers 141 and 142 includes an oxide of Cu, the metal precursor may include copper acetate monohydrate (Cu(CH3COO)2·H2O), but the present disclosure is not limited thereto.

[0098] The amount of the metal precursor may be 1 wt % to 30 wt % based on 100 wt % of the solution for forming the oxide layer, but the present disclosure is not limited thereto.

[0099] The solution for forming an oxide layer may be applied to the third surface 3 and the fourth surface 4 of the body 110 using a method such as a spin coating method, a spray coating method, etc. and dried. In this case, the solution for forming an oxide layer may also be applied to the grooves G1 and G2. Next, an oxidation reaction may be induced by heat treatment at a temperature of 200° C. to 500° C. for about 1 hour to form oxide layers 141 and 142 containing metal oxides.

[0100] Next, the external electrodes 131 and 132 may be formed.

[0101] When the external electrodes 131 and 132 include sintered electrode layers, the third surface 3 and the fourth surface 4 of the body 110 may be dipped in a conductive paste containing metal powder and glass, and then sintered to form the electrode layers 131a and 132a. In this case, the sintering temperature may be, for example, 700°C to 900°C.

[0102] When the electrode layers 131a and 132a include a conductive resin layer, a conductive resin composition including metal powder and a thermosetting resin such as epoxy resin may be coated on the body 110 and dried, and then may be cured at a temperature of 250° C. to 550° C. and heat-treated to form the electrode layers 131a and 132a. In addition, when the electrode layers 131a and 132a include a thin film layer, the electrode layers 131a and 132a may be formed using a sputtering method, a deposition method, or the like.

[0103] The method of forming the plating layers 131 b and 132 b does not have to be particularly limited, and for example, electrolytic plating and / or electroless plating, etc. may be used.

[0104] However, the above-described manufacturing method is illustrative, and the manufacturing method of the multilayer electronic component 100 is not limited to the above-described manufacturing method.

[0105] (Experimental example) First, BaTiO 3 powder particles, an organic solvent (such as ethanol, etc.), and a binder (such as polyvinyl butyral, etc.) are mixed to prepare a ceramic slurry, and then the ceramic slurry is coated on a carrier film and dried to prepare a ceramic green sheet.

[0106] Next, a conductive paste for internal electrodes containing Ni powder, a binder, etc. is printed on the ceramic green sheets to a predetermined thickness to form internal electrode patterns, and the ceramic green sheets having the internal electrode patterns are stacked and cut.

[0107] Next, after performing a binder removal process and a sintering process to form the body 110, a solution for forming an oxide layer (a mixture of nickel acetate tetrahydrate (Ni(CH3CO2)2·4H2O) and methanol) is sprayed on the body 110 and then dried. Next, a heat treatment is performed at a temperature of 400°C for about 1 hour to form oxide layers 141 and 142 including Ni oxide.

[0108] Next, the body 110 may be dipped in a conductive paste including Cu powder particles and glass and then sintered to form electrode layers 131a and 132a, and Ni plating layers and Sn plating layers may be sequentially formed on the electrode layers to prepare plating layers 131b and 132b. Thus, an experimental example was prepared.

[0109] In this case, the average thickness of the oxide layers 141 and 142 was adjusted by adjusting the weight of nickel acetate tetrahydrate (Ni(CH3CO2)2·4H2O), a metal precursor, based on 100 wt % of the solution for forming the oxide layer of each sample number in Table 1 below. When the weight of nickel acetate tetrahydrate (Ni(CH3CO2)2·4H2O) increased based on 100 wt % of the solution for forming the oxide layer, the average thickness of the oxide layers 141 and 142 increased.

[0110] Thereafter, the average values ​​of the ESR values ​​measured by applying a voltage of 1V at a frequency of 1 kHz to 30 sample pieces of each sample number are listed in the following Table 1. In addition, in order to evaluate the moisture-proof reliability, after applying a voltage of 1.5Vr to 400 sample pieces of each sample number in an environment of 85°C and a relative humidity of 85% for 12 hours, the case where burnout occurred even in one sample and the insulation resistance was 0Ω was judged as defective (X), and the case where burnout did not occur and the insulation resistance was 0Ω was judged as normal (○), and listed in the following Table 1.

[0111] [Table 1] Referring to Table 1, it can be seen that in sample No. 6, the average thickness of the oxide layer exceeds 50 nm and the ESR increases rapidly. In addition, it can be seen that in sample No. 1, the ESR is good, but the moisture-proof reliability is poor.

[0112] It can be seen that Sample No. 2 to Sample No. 5 have an average thickness of the oxide layer of 20 nm to 50 nm, and both ESR and moisture-proof reliability are good.

[0113] The present disclosure is not limited by the above-described embodiments and the accompanying drawings, but is intended to be limited by the appended claims. Therefore, within the scope of the technical spirit of the present disclosure described in the claims, those skilled in the art will be able to make various forms of substitutions, modifications and changes, and this will also be considered to fall within the scope of the present disclosure.

[0114] In addition, the expression "embodiment" does not mean the same embodiment, and is provided to emphasize and describe different unique characteristics. However, the embodiment presented above does not exclude the combination of features with another embodiment. For example, unless there is a description in another embodiment that contradicts the content, even if the content described in one detailed embodiment is not described in another embodiment, it can also be understood as a description related to another embodiment.

[0115] In addition, expressions such as "first" and "second" are used to distinguish one component from another component, and do not limit the order and / or importance of the components. In some cases, without departing from the scope of the rights, the first element may be referred to as the second element, and similarly, the second element may be referred to as the first element.

[0116] As one of many effects of the present disclosure, the moisture-proof reliability of a multilayer electronic component can be improved.

[0117] As one of many effects of the present disclosure, connectivity between inner and outer electrodes may be improved.

[0118] While example embodiments have been shown and described above, it will be readily apparent to those skilled in the art that modifications and variations may be made without departing from the scope of the present disclosure as defined by the appended claims.

Claims

1. A multilayer electronic component comprising: a body comprising a dielectric layer and inner electrodes arranged alternately with the dielectric layer in a first direction; An external electrode, disposed outside the main body; as well as an oxide layer, disposed between the main body and the external electrode and connecting the internal electrode and the external electrode, The oxide layer includes Ni oxide, Cu oxide or both.

2. The multilayer electronic component according to claim 1, wherein The oxide layer includes spherical nanoparticles of Ni oxide, Cu oxide, or both.

3. The multilayer electronic component according to claim 2, wherein: The average diameter of the spherical nanoparticles is 4 nm to 20 nm.

4. The multilayer electronic component according to claim 1, wherein: The oxide layer comprises Ni oxide, The oxide layer satisfies I1>I2, wherein, in the X-ray diffraction pattern of the oxide layer, I1 is the intensity of the diffraction peak of the (111) crystal plane, and I2 is the intensity of the diffraction peak of the (200) crystal plane.

5. The multilayer electronic component according to claim 1, wherein The body includes at least one groove provided between one surface of the body contacting the oxide layer and an end of the inner electrode, and The oxide layer is in contact with the end portion of the inner electrode.

6. The multilayer electronic component according to claim 1, wherein: The body has a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface opposite to each other in the second direction and connected to the first surface and the second surface, and a fifth surface and a sixth surface opposite to each other in the third direction and connected to the first surface, the second surface, the third surface and the fourth surface, and The oxide layer includes: a first oxide layer covering at least a portion of the third surface; and a second oxide layer spaced apart from the first oxide layer and covering at least a portion of the fourth surface.

7. The multilayer electronic component according to claim 6, wherein: The first oxide layer and the second oxide layer are arranged between an extension line of the first surface and an extension line of the second surface.

8. The multilayer electronic component according to claim 6, wherein: The first oxide layer and the second oxide layer are arranged to extend over a portion of the first surface and a portion of the second surface.

9. The multilayer electronic component according to claim 1, wherein: The average thickness of the oxide layer is greater than or equal to 20 nm and less than or equal to 50 nm.

10. The multilayer electronic component according to claim 9, wherein The average thickness of the oxide layer is greater than or equal to 30 nm and less than or equal to 50 nm.

11. The multilayer electronic component according to claim 1, wherein t2 / t1 is greater than or equal to 0.9 and less than or equal to 1.0, wherein t1 is the thickness of the oxide layer measured at the central region of the body in the first direction, and t2 is the thickness of the oxide layer measured at the inner electrode disposed at the outermost portion in the first direction.

12. The multilayer electronic component according to claim 1, wherein The oxide layer covers at least a portion of the dielectric layer and at least a portion of the internal electrode.

13. The multilayer electronic component according to claim 1, wherein The oxide layer extends from a first corner of the body to a second corner of the body in the first direction.

14. The multilayer electronic component according to claim 6, wherein: The oxide layer is not disposed on the first surface.

15. The multilayer electronic component according to claim 8, wherein At least a portion of the first surface is exposed.

16. The multilayer electronic component according to claim 5, wherein: The oxide layer includes: a first region continuously disposed on the one surface of the body and forming a single layer; and at least one second region extending from the first region into the at least one groove and contacting the end portion of the internal electrode.

17. The multilayer electronic component according to claim 16, wherein: A size of the at least one second region in a second direction perpendicular to the first direction is greater than 0 nm and less than or equal to 200 nm.

18. A multilayer electronic component comprising: A main body, comprising a dielectric layer and inner electrodes arranged alternately with the dielectric layer; an oxide layer contacting one surface of the body and comprising a metal oxide; and an external electrode, disposed on the oxide layer, wherein at least one groove is provided between the one surface of the body and the end of the inner electrode, and The oxide layer contacts the end portion of the inner electrode.

19. The multilayer electronic component according to claim 18, wherein: The oxide layer includes spherical nanoparticles of the metal oxide.

20. The multilayer electronic assembly of claim 18, wherein: The metal oxide includes an oxide of Ni, and The oxide layer satisfies I1>I2, wherein, in the X-ray diffraction pattern of the oxide layer, I1 is the intensity of the diffraction peak of the (111) crystal plane, and I2 is the intensity of the diffraction peak of the (200) crystal plane.

21. The multilayer electronic assembly of claim 18, wherein: A ratio of the number of the at least one groove to the total number of the inner electrodes is 30% to 70%.

Images