Method for controlling placement direction of silicon wafer basket during spin-drying

Abstract

The invention provides a method for controlling the placement direction of a silicon wafer basket during spin-drying, which is an improvement aiming at a spin-drying loading basket (spin-drying basket) of an existing spin-drying machine, that is, a stop block is fixed at a certain height on the inner wall of the spin-drying basket; when in use, wafers are arranged in the wafer basket, the wafer basket is placed in the spin-drying basket of the spin dryer, the wafer basket can be placed in the spin-drying basket only when the H surface of the wafer basket faces the inner wall of the spin-drying basket due to the obstruction of the baffle block, then the spin dryer is closed and started, and the wafers without liquid residues on the surfaces are obtained after spin-drying is finished. By additionally arranging the stop blocks, the wafer basket must be kept in one direction when being put into the spin dryer, namely, the H surface of the wafer basket faces the inner wall of the spin dryer, so that the H surface of the wafer basket faces downwards during spin drying, no liquid is left on the U surface of the wafer basket, no liquid drops on the surface of the wafer during spin drying and taking, and the silicon wafer with a cleaner surface is obtained. And residual liquid on the wafer basket is easier to remove.

Description

Technical Field

[0001] The invention relates to the field of semiconductor production technology, and specifically to a method for controlling the placement direction of a silicon wafer basket during spin drying. Background Art

[0002] Silicon chips, also known as wafers, are processed from silicon ingots. They need to be cleaned frequently during the many processes of processing silicon ingots into silicon chips. The next process after cleaning generally requires the surface of the silicon wafer to remain dry, so a spin dryer is required to perform spin drying after cleaning.

[0003] After the semiconductor silicon wafer processing process, there will be a lot of impurities on the surface of the silicon wafer. In order to remove the residue on the surface of the silicon wafer, a series of cleaning is required. After cleaning, the silicon wafer needs to be spin-dried to obtain a silicon wafer with a clean surface. However, the wafer basket used with the spin dryer has different structures on both sides, and can be placed in any direction when used. This means that when the wafer basket is placed with the U side facing down and spun dry, the liquid on the wafer basket may not be completely removed, causing it to drip onto the surface of the wafer when it is taken out, thus bringing risks to the subsequent processes. Summary of the invention

[0004] In order to improve the above situation, the purpose of the present invention is to provide a method for controlling the placement direction of the silicon wafer basket during spin drying, which is an improvement on the spin drying loading basket (spin drying basket) of the existing spin drying machine, that is, a block is fixed at a certain height on the inner wall of the spin drying basket. By adding the block, the wafer basket must be placed in the spin drying machine in one direction, that is, the H of the wafer basket faces the inner wall of the spin drying basket.

[0005] The purpose of the present invention can be achieved by the following technical solutions:

[0006] A method for controlling the placement direction of a silicon wafer basket during spin drying comprises a spin dryer, a spin drying basket and a stopper (including a buffer layer); the method is an improvement on the spin drying loading basket (spin drying basket) of the existing spin dryer, that is, a stopper is fixed at a certain height on the inner wall of the spin drying basket, and by adding the stopper, the wafer basket must be placed in the spin dryer in one direction, that is, the H side of the wafer basket faces the inner wall of the spin drying basket; when in use, the wafers are arranged in the wafer basket, and the wafer basket is placed in the spin drying basket of the spin dryer. Due to the obstruction of the stopper, the H side of the wafer basket must face the inner wall of the spin drying basket, and the wafer basket can be placed in the spin drying basket, and then the spin dryer is closed and started, and after the spin drying is completed, the wafers with no liquid residue on the surface are obtained.

[0007] In one embodiment of the present invention, the added stopper described in the method is suitable for such a wafer basket with two sides having height differences, such as one side being an H side and the other side being a U side.

[0008] In one embodiment of the present invention, the stopper described in the method can be fixed on the inner wall of the spin drying basket in different ways, such as hanging, welding, gluing, etc.

[0009] In one embodiment of the present invention, the height of the stopper after being fixed is lower than the height of the crossbar of the wafer basket H surface and higher than the lowest height of the wafer basket U surface.

[0010] In one embodiment of the present invention, the length of the stopper after being fixed is smaller than the size of the wafer basket.

[0011] In one embodiment of the present invention, the width of the stopper after being fixed in the method is larger than the width of the wafer basket and smaller than the width of the wafer basket.

[0012] In one embodiment of the present invention, a buffer layer made of soft material is attached to the non-fixed end surface of the stopper in the method, so as to avoid losses caused by collision.

[0013] The outstanding effect of the present invention is that compared with the spin drying loading basket of the existing silicon wafer spin drying machine, by adding a stopper, the wafer basket must be placed in the spin drying machine in one direction, that is, the H of the wafer basket faces the inner wall of the spin drying basket, so that the H side of the wafer basket faces downward during spin drying, and no liquid will remain on the U side of the wafer basket. When the wafer is taken out during spin drying, no liquid will drip onto the surface of the wafer, so that a silicon wafer with a cleaner surface is obtained, and the residual liquid on the wafer basket is easier to remove. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 Schematic diagram of a spin dryer.

[0015] Figure 2 A top view of the spin dry loading basket.

[0016] Figure 3 Schematic diagram of the H surface of the wafer basket.

[0017] Description of Figure Numbers:

[0018] 1 Wafer basket H side

[0019] 2 Spin drying basket (spin drying basket)

[0020] 3 Stopper

[0021] 4. Inner wall of spin drying basket DETAILED DESCRIPTION

[0022] To make the purpose, technical solution and advantages of the embodiments of the present invention more clear, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0023] A method for controlling the placement direction of a wafer basket when a silicon wafer is spin-dried comprises a spin-drying machine, a spin-drying basket and a stopper (including a buffer layer); the method is an improvement on a spin-drying device (spin-drying basket) 2 of an existing spin-drying machine, namely, a stopper 3 is fixed at a certain height on an inner wall 4 of the spin-drying basket; when in use, wafers are placed in the wafer basket, and the wafer basket is placed in the spin-drying basket 2 of the spin-drying machine. Due to the obstruction of the stopper 3, the H1 surface of the wafer basket must face the inner wall 4 of the spin-drying basket, so that the wafer basket can be placed in the spin-drying basket 2, and then the spin-drying machine is closed and started, and wafers with no liquid residue on the surface are obtained after the spin-drying is completed; by adding the stopper 3, the wafer basket must be placed in a direction when placed in the spin-drying machine, namely, the H surface 1 of the wafer basket faces the inner wall 4 of the spin-drying basket, so that the H surface 1 of the wafer basket faces downward during spin-drying, no liquid will remain on the U surface 8 of the wafer basket, and no liquid will drip on the wafer surface when the wafer is taken out after spin-drying, so that a silicon wafer with a cleaner surface is obtained, and the residual liquid on the wafer basket is easier to remove.

[0024] Working principle: a block is fixed at a certain height on the inner wall of the spin drying basket; when in use, the wafers are placed in the wafer basket, and the wafer basket is placed in the spin drying basket of the spin drying machine. Due to the obstruction of the block, the H side of the wafer basket must face the inner wall of the spin drying basket, and the wafer basket can be placed in the spin drying basket, and then the spin drying machine is closed and started, and wafers with no liquid residue on the surface are obtained after the spin drying is completed; by adding the block, the wafer basket must be placed in the spin drying machine in one direction, that is, the H side of the wafer basket faces the inner wall of the spin drying basket, so that the H side of the wafer basket faces downward during spin drying, and there will be no residue on the U side of the wafer basket. When the wafer is taken out by spin drying, no liquid will drip on the surface of the wafer, so that a silicon wafer with a cleaner surface is obtained, and the residual liquid on the wafer basket is easier to remove.

[0025] Finally, the above implementation modes are only used to illustrate the present invention, and are not intended to limit the present invention. Ordinary technicians in the relevant technical field may make various changes and modifications, and apply them to other silicon wafer cleaning fields without departing from the spirit and scope of the present invention. Therefore, all equivalent technical solutions also belong to the scope of the present invention, and the scope of patent protection of the present invention shall be defined by the claims.

Claims

1. A method for controlling the placement direction of a silicon wafer basket during spin drying, which is an improvement on the spin drying loading basket (spin drying basket) of an existing spin drying machine, that is, a block is fixed at a certain height on the inner wall of the spin drying basket; when in use, wafers are placed in the wafer basket, and the wafer basket is placed in the spin drying basket of the spin drying machine. Due to the obstruction of the block, the H surface of the wafer basket must face the inner wall of the spin drying basket, so that the wafer basket can be placed in the spin drying basket, and then the spin drying machine is closed and started, and wafers with no liquid residue on the surface are obtained after the spin drying is completed; by adding the block, the wafer basket must be placed in a direction when placed in the spin drying machine, that is, the H surface of the wafer basket faces the inner wall of the spin drying basket, so that the H surface of the wafer basket faces downward during spin drying, and no liquid will remain on the U surface of the wafer basket. When the wafer basket is taken out by spin drying, no liquid will drip on the wafer surface, so that a silicon wafer with a cleaner surface is obtained, and the residual liquid on the wafer basket is easier to remove.

2. A method for controlling the placement direction of a silicon wafer basket during spin drying as claimed in claim 1, characterized in that: The method for adding a stopper is suitable for such a wafer basket with two sides having height differences, such as one side having an H-side structure and the other side having a U-side structure.

3. A method for controlling the placement direction of a silicon wafer basket during spin drying as claimed in claim 1, characterized in that: The stopper of the method can be fixed on the inner wall of the spin drying basket in different ways, such as hanging, welding, gluing, etc.

4. A method for controlling the placement direction of a silicon wafer basket during spin drying as claimed in claim 1, characterized in that: After the method is carried out, the height of the stopper is lower than the height of the crossbar on the H surface of the wafer basket and higher than the lowest height of the U surface of the wafer basket.

5. A method for controlling the placement direction of a silicon wafer basket during spin drying as claimed in claim 1, characterized in that: The method has a stopper whose length after being fixed is smaller than the size of the wafer basket.

6. A method for controlling the placement direction of a silicon wafer basket during spin drying as claimed in claim 1, characterized in that: After the stopper is fixed, its width should be greater than the width of the wafer basket and less than the width of the wafer basket.

7. A method for controlling the placement direction of a silicon wafer basket during spin drying as claimed in claim 1, characterized in that: In the method, a buffer layer of soft material is attached to the non-fixed end surface of the stopper.

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