Base temperature control system, control method and semiconductor processing equipment

Abstract

The invention discloses a base temperature control system and method and semiconductor processing equipment, and the method comprises the steps: conveying a first cooling liquid with a first process temperature to a cooling channel through a first cooling circulation loop, so as to adjust and control the temperature of a substrate, and adjusting the temperature of a second cooling liquid to a second process temperature, the second cooling liquid flows in the second self-circulation loop which does not pass through the cooling channel; and conveying a second cooling liquid with a second process temperature to the cooling channel through a second cooling circulation loop so as to regulate and control the temperature of the substrate, regulating the temperature of the first cooling liquid to a third process temperature, and enabling the first cooling liquid to flow in the first self-circulation loop which does not pass through the cooling channel. The first cooling liquid with different temperatures and the second cooling liquid with different temperatures are alternately conveyed to the cooling channel, so that the temperature of the substrate is subjected to cascade conversion among at least three different temperatures, and the temperature changing requirement of the substrate is met.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a susceptor temperature control system, a control method and semiconductor processing equipment. Background Art

[0002] In the semiconductor manufacturing process (including etching process, deposition process, etc.), the substrate is generally supported and fixed by a base and an electrostatic chuck placed on the base to prevent the substrate from moving or dislocating during the process. A heater and a cooling channel are usually provided in the base to control the temperature of the substrate (including heating and cooling) to meet the temperature requirements of the substrate in various processes; the principle of cooling the substrate is as follows: an external refrigerator passes the refrigerant into the cooling channel of the electrostatic chuck and controls the temperature of the electrostatic chuck through heat exchange, and the electrostatic chuck conducts heat with the substrate through physical contact and helium, thereby achieving temperature control of the substrate.

[0003] In response to the need for substrate temperature changes, the industry usually sets up two high and low temperature refrigerator channels and uses a switching device to change the temperature of the refrigerant flowing into the base. This method is relatively simple and can directly switch the base temperature of the electrostatic chuck to the preset temperature, but it is limited to only two preset temperature levels.

[0004] However, with the continuous improvement of etching depth and efficiency, the existing substrate temperature control method is gradually unable to meet the needs of process advancement. For example, for different etching depths, it is necessary to change the substrate temperature in time to match the binding and desorption rates of the etchants and reaction by-products with the substrate at different depths, so as to achieve precise control of parameters such as key etching dimensions at different depths; for example, for films to be etched of different materials, since the material itself has different sensitivities to temperature, the optimal process temperature at different etching stages is also different.

[0005] In response to this complex temperature change requirement, the mainstream temperature control method is to set up an additional mixing tank, pre-mix the liquids of the high and low temperature refrigerant channels in the mixing tank to the target temperature, and then flow into the base of the electrostatic chuck. Although this method can theoretically achieve stepless conversion of any temperature within the extreme temperature range of the refrigerator, the device cost is high, and the mixing control method is very complicated. The time for the mixed liquid to reach the target temperature is also relatively long, which leads to a longer invalid process time and affects the preparation efficiency of the substrate. Therefore, it is necessary to adjust the temperature control method of the substrate. Summary of the invention

[0006] The object of the present invention is to provide a base temperature control system, a control method and a semiconductor processing equipment, which can alternately deliver a first coolant with different temperatures and a second coolant with different temperatures to a cooling channel, so that the temperature of the substrate can be cascaded between at least three different temperatures, thereby meeting the temperature change requirements of the substrate in the process.

[0007] In order to achieve the above object, the present invention is implemented by the following technical solutions:

[0008] A control method for a susceptor temperature control system, the susceptor temperature control system comprising a susceptor arranged in a reaction chamber and a cooling channel arranged in the susceptor, the cooling channel being used to control the temperature of a substrate carried on the susceptor; the susceptor temperature control system comprising: a first refrigeration device and a first cooling circulation loop, for conveying a first coolant to the cooling channel and circulating the first coolant; a second refrigeration device and a second cooling circulation loop, for conveying a second coolant to the cooling channel and circulating the second coolant; the susceptor temperature control system further comprising a controller, the controller being used to execute the control method, the control method comprising:

[0009] Step S1, obtaining a process temperature required for processing the substrate, wherein the process temperature includes a first process temperature, a second process temperature and a third process temperature;

[0010] Step S2, delivering the first coolant having the first process temperature to the cooling channel through the first cooling circulation loop, so that the first coolant having the first process temperature regulates the temperature of the substrate; at the same time, adjusting the temperature of the second coolant to the second process temperature, and allowing the second coolant to flow in the corresponding second self-circulating loop;

[0011] Step S3, delivering the second coolant having the second process temperature to the cooling channel through the second cooling circulation loop, so that the second coolant having the second process temperature regulates the temperature of the substrate; at the same time, adjusting the temperature of the first coolant to the third process temperature, and allowing the first coolant to flow in the corresponding first self-circulating loop;

[0012] The first process temperature, the second process temperature and the third process temperature are different from each other; and the first self-circulation loop and the second self-circulation loop are not connected to the cooling channel.

[0013] Optionally, the control method further includes:

[0014] Step S4: delivering the first cooling liquid having the third process temperature to the cooling channel through the first cooling circulation loop to control the temperature of the substrate.

[0015] Optionally, the process temperature further includes a fourth process temperature, a fifth process temperature, ..., and an Nth process temperature which are different from each other, where N is an integer and N≥4; and the control method further includes:

[0016] Step S5, delivering the first coolant having the i-th process temperature to the cooling channel through the first cooling circulation loop to control the temperature of the substrate; and judging whether a preset condition is met, if not, adjusting the temperature of the second coolant to the i+1-th process temperature, and making the second coolant flow in the second self-circulating loop;

[0017] Step S6, delivering the second coolant having the (i+1)th process temperature to the cooling channel through the second cooling circulation loop to control the temperature of the substrate; and judging whether the preset condition is met, if not, adjusting the temperature of the first coolant to the (i+2)th process temperature, and making the first coolant flow in the first self-circulating loop;

[0018] Steps S5 to S6 are executed in a loop until the preset condition is met; and the preset condition is that the temperature of the substrate is adjusted to the Nth process temperature; i is an integer, 3≤i≤N-1.

[0019] Based on the same inventive concept, the present invention also provides a susceptor temperature control system for executing the control method described above; the susceptor temperature control system comprises:

[0020] A cooling channel is provided in the base and is used to control the temperature of the substrate carried on the base;

[0021] A first refrigeration device, used for conveying and circulating a first cooling liquid; and the cooling channel is connected to the first refrigeration device through a first liquid inlet pipe and a first liquid outlet pipe to form a first cooling circulation loop;

[0022] A second refrigeration device is used to transport and circulate a second cooling liquid; and the cooling channel is connected to the second refrigeration device through a second liquid inlet pipe and a second liquid outlet pipe to form a second cooling circulation loop; the second cooling circulation loop is not connected to the first cooling circulation loop at the same time;

[0023] a first self-circulating loop, sharing the first refrigeration device with the first cooling circulation loop; and the first self-circulating loop is not connected to the cooling channel;

[0024] The second self-circulating loop shares the second refrigeration device with the second cooling circulating loop; and the second self-circulating loop is not connected to the cooling channel.

[0025] Optionally, the base temperature control system further includes:

[0026] a first branch pipe, connected to the first liquid inlet pipe and the first liquid outlet pipe respectively; and the first branch pipe, the first refrigeration device, and the first liquid inlet pipe and the first liquid outlet pipe located therebetween form the first self-circulating loop;

[0027] The second branch pipe is connected to the second liquid inlet pipe and the second liquid outlet pipe respectively; and the second branch pipe, the second refrigeration device, and the second liquid inlet pipe and the second liquid outlet pipe located therebetween form the second self-circulating loop.

[0028] Optionally, the first self-circulating loop and the first cooling circulating loop are not turned on at the same time;

[0029] The second self-circulating loop and the second cooling circulating loop are not turned on at the same time.

[0030] Optionally, the base temperature control system further includes: a first control valve, which allows only one of the first cooling circulation loop and the second cooling circulation loop to be conductive.

[0031] Optionally, the base temperature control system further includes: a second control valve, which allows only one of the first cooling circulation loop and the first self-circulation loop to be conductive.

[0032] Optionally, the base temperature control system further includes: a third control valve, used to make only one of the second cooling circulation loop and the second self-circulation loop conductive.

[0033] Optionally, when the first cooling circulation loop is turned on, the first coolant regulates the temperature of the substrate; when the first self-circulating loop is turned on, the first coolant flows in the first self-circulating loop and the temperature of the first coolant is adjustable;

[0034] When the second cooling circulation loop is turned on, the second coolant regulates the temperature of the substrate; when the second self-circulation loop is turned on, the second coolant flows in the second self-circulation loop and the temperature of the second coolant is adjustable.

[0035] Optionally, the temperature adjustment range of the first coolant and the second coolant is both -100°C to 100°C.

[0036] Optionally, the temperature adjustment range of the first coolant is -100°C to 30°C; the temperature adjustment range of the second coolant is 20°C to 100°C.

[0037] Optionally, the first refrigeration device and the second refrigeration device are located in the same refrigerator.

[0038] Based on the same inventive concept, the present invention also provides a semiconductor processing device, comprising: a reaction chamber; and a susceptor temperature control system as described above.

[0039] Based on the same inventive concept, the present invention further provides a computer-readable storage medium storing a computer-readable program, wherein the computer-readable program is used to guide the operation of the susceptor temperature control system as described above, wherein the susceptor temperature control system comprises a controller, wherein the controller is used to read the program stored in the computer-readable storage medium to execute the following control method, wherein the control method comprises:

[0040] Step S1, obtaining a process temperature required for processing the substrate, wherein the process temperature includes a first process temperature, a second process temperature and a third process temperature;

[0041] Step S2, delivering the first coolant having the first process temperature to the cooling channel through the first cooling circulation loop, so that the first coolant having the first process temperature regulates the temperature of the substrate; at the same time, adjusting the temperature of the second coolant to the second process temperature, and allowing the second coolant to flow in the corresponding second self-circulating loop;

[0042] Step S3, delivering the second coolant having the second process temperature to the cooling channel through the second cooling circulation loop, so that the second coolant having the second process temperature regulates the temperature of the substrate; at the same time, adjusting the temperature of the first coolant to the third process temperature, and allowing the first coolant to flow in the corresponding first self-circulating loop;

[0043] The first process temperature, the second process temperature and the third process temperature are different from each other; and the first self-circulation loop and the second self-circulation loop are not connected to the cooling channel.

[0044] Optionally, the control method further includes: step S4, delivering the first coolant having the third process temperature to the cooling channel through the first cooling circulation loop to regulate the temperature of the substrate.

[0045] Optionally, the process temperature further includes a fourth process temperature, a fifth process temperature, ..., and an Nth process temperature which are different from each other, where N is an integer and N≥4, and the control method further includes:

[0046] Step S5, delivering the first coolant having the i-th process temperature to the cooling channel through the first cooling circulation loop to control the temperature of the substrate; and judging whether a preset condition is met, if not, adjusting the temperature of the second coolant to the i+1-th process temperature, and making the second coolant flow in the second self-circulating loop;

[0047] Step S6, delivering the second coolant having the (i+1)th process temperature to the cooling channel through the second cooling circulation loop to control the temperature of the substrate; and judging whether the preset condition is met, if not, adjusting the temperature of the first coolant to the (i+2)th process temperature, and making the first coolant flow in the first self-circulating loop;

[0048] Steps S5 to S6 are executed in a loop until the preset condition is met; and the preset condition is that the temperature of the substrate is adjusted to the Nth process temperature; i is an integer, 3≤i≤N-1.

[0049] Compared with the prior art, the present invention has at least one of the following advantages:

[0050] The present invention provides a pedestal temperature control system, a control method and a semiconductor processing device. The controller in the pedestal temperature control system is used to execute the control method, and the control method includes delivering a first coolant having a first process temperature to a cooling channel through a first cooling circulation loop to control the temperature of a substrate, adjusting the temperature of a second coolant to a second process temperature while circulating the first coolant, and allowing the second coolant to flow in a second self-circulating loop that does not pass through the cooling channel; delivering a second coolant having a second process temperature to a cooling channel through a second cooling circulation loop to control the temperature of the substrate, adjusting the temperature of the first coolant to a third process temperature while circulating the second coolant, and allowing the first coolant to flow in the first self-circulating loop that does not pass through the cooling channel. The present invention can make the first cooling circulation loop and the second cooling circulation loop alternately conductive, so as to alternately deliver the first coolant having different temperatures and the second coolant having different temperatures to the cooling channel, so that the temperature of the substrate can be cascaded between at least three different temperatures, thereby meeting the temperature change requirements of the substrate in the process.

[0051] In the present invention, when the first cooling circulation loop is turned on and the first coolant is transported to the cooling channel, the second coolant can flow in the second self-circulation loop, that is, the second refrigeration device is in a standby state; when the second cooling circulation loop is turned on and the second coolant is transported to the cooling channel, the first coolant can flow in the first self-circulation loop, that is, the first refrigeration device is in a standby state; the present invention can use the time when the first refrigeration device is in a standby state to pre-adjust the temperature of the first coolant and use the time when the second refrigeration device is in a standby state to pre-adjust the temperature of the second coolant. Based on this cascade temperature change method, the standby state time of one of the refrigeration devices is used to make a change to the next preset target temperature. Compared with the method of controlling the substrate temperature based on the premixed liquid in the prior art, the present invention greatly shortens the time for processing the substrate.

[0052] In the present invention, the first self-circulation loop is composed of a first refrigeration device and a pipeline connected to the first refrigeration device and not connected to the cooling channel, so that when the temperature of the first coolant flowing in the first self-circulation loop is adjusted, it will not affect the temperature regulation of the substrate by the second coolant.

[0053] In the present invention, the second self-circulation loop is composed of a second refrigeration device and a pipeline connected to the second refrigeration device and not connected to the cooling channel, so that when the temperature of the second coolant flowing in the second self-circulation loop is adjusted, it will not affect the temperature regulation of the substrate by the first coolant.

[0054] The present invention utilizes a low-cost and simply configured hardware device to achieve any preset temperature requirements under different process steps. The software sends instructions to the refrigeration device one process step in advance to raise or lower the standby channel temperature to the target temperature. Then, by switching the first cooling cycle loop and the second cooling cycle loop, the temperature of the substrate can be cascaded between at least three different temperatures. Compared with the method of controlling the substrate temperature based on premixed liquid in the prior art, complex piping design and refrigeration device design are not required. BRIEF DESCRIPTION OF THE DRAWINGS

[0055] Figure 1 It is a structural schematic diagram of a base temperature control system provided by one embodiment of the present invention;

[0056] Figure 2 is a flow chart of a control method of a base temperature control system provided by one embodiment of the present invention;

[0057] Figure 3 It is a structural schematic diagram of a semiconductor processing device provided by one embodiment of the present invention. DETAILED DESCRIPTION

[0058] The following is a further detailed description of a susceptor temperature control system, control method and semiconductor processing equipment proposed by the present invention in combination with the accompanying drawings and specific embodiments. According to the following description, the advantages and features of the present invention will be clearer. It should be noted that the drawings are in a very simplified form and use non-precise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention. In order to make the purposes, features and advantages of the present invention more obvious and easy to understand, please refer to the accompanying drawings. It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present invention, so they have no technical substantive significance. Any structural modification, change in proportional relationship or adjustment of size, without affecting the effects that the present invention can produce and the purposes that can be achieved, should still fall within the scope of the technical content disclosed by the present invention.

[0059] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0060] Combined with Figure 1 As shown, this embodiment provides a base temperature control system, including: a base 101, used to carry a substrate 100; a cooling channel 110, arranged in the base 101, used to control the temperature of the substrate 100; a first refrigeration device 120, used to transport and circulate a first coolant; and the cooling channel 110 is connected to the first refrigeration device 120 through a first liquid inlet pipe 121 and a first liquid outlet pipe 122 to form a first cooling circulation loop; a second refrigeration device 130, used to transport and circulate a second coolant; and the cooling channel 110 is connected to the second refrigeration device 130 through a second liquid inlet pipe 131 and a second liquid outlet pipe 132 to form a second cooling circulation loop; a first self-circulation loop, sharing the first refrigeration device 120 with the first cooling circulation loop; and the first self-circulation loop does not pass through the cooling channel 110; and a second self-circulation loop, sharing the second refrigeration device 130 with the second cooling circulation loop; and the second self-circulation loop does not pass through the cooling channel 110.

[0061] It can be understood that the base temperature control system also includes: a first branch pipe 140, which is connected to the first liquid inlet pipe 121 and the first liquid outlet pipe 122 respectively; and the first branch pipe 140, the first refrigeration device 120, and the first liquid inlet pipe 121 and the first liquid outlet pipe 122 located between the first branch pipe 140 and the first refrigeration device 120 form the first self-circulation loop; and a second branch pipe 150, which is connected to the second liquid inlet pipe 131 and the second liquid outlet pipe 132 respectively; and the second branch pipe 150, the second refrigeration device 130, and the second liquid inlet pipe 131 and the second liquid outlet pipe 132 located between the second branch pipe 150 and the second refrigeration device 130 form the second self-circulation loop.

[0062] Specifically, in the present embodiment, the first cooling circulation loop is composed of the first refrigeration device 120, the first liquid inlet pipe 121, the cooling channel 110 and the first liquid outlet pipe 122; wherein, the first end of the first liquid inlet pipe 121 is connected to the cooling liquid outlet of the first refrigeration device 120, the second end of the first liquid inlet pipe 121 is connected to the first end of the cooling channel 110, the second end of the cooling channel 110 is connected to the first end of the first liquid outlet pipe 122, and the second end of the first liquid outlet pipe 122 is connected to the cooling liquid inlet of the first refrigeration device 120; and when the first cooling liquid flows in the first cooling circulation loop, the first cooling liquid flows through the cooling channel 110, so that the first cooling liquid can control the temperature of the substrate 100. More specifically, the first self-circulating loop may be composed of the first refrigeration device 120, and a pipeline connected to the coolant outlet and the coolant inlet of the first refrigeration device 120 and not connected to the cooling channel 110 (for example, the first branch pipe 140 and the first liquid inlet pipe 121 and the first liquid outlet pipe 122 located between the first branch pipe 140 and the first refrigeration device 120), so that the first coolant can also flow in the first self-circulating loop, and the first coolant will not flow through the cooling channel 110 when flowing in the first self-circulating loop. Further, when the first coolant flows in the first self-circulating loop, it indicates that the first refrigeration device 120 is in a standby state, but the present invention is not limited thereto.

[0063] Similarly, the second cooling circulation loop is composed of the second refrigeration device 130, the second liquid inlet pipe 131, the cooling channel 110 and the second liquid outlet pipe 132; wherein, the first end of the second liquid inlet pipe 131 is connected to the cooling liquid outlet of the second refrigeration device 130, the second end of the second liquid inlet pipe 131 is connected to the first end of the cooling channel 110, the second end of the cooling channel 110 is connected to the first end of the second liquid outlet pipe 132, and the second end of the second liquid outlet pipe 132 is connected to the cooling liquid inlet of the second refrigeration device 130; and when the second cooling liquid flows in the second cooling circulation loop, the second cooling liquid flows through the cooling channel 110, so that the second cooling liquid can control the temperature of the substrate 100. More specifically, the second self-circulating loop may be composed of the second refrigeration device 130, and a pipeline connected to the coolant outlet and the coolant inlet of the second refrigeration device 130 and not connected to the cooling channel 110 (for example, the second branch pipe 150 and the second liquid inlet pipe 131 and the second liquid outlet pipe 132 located between the second branch pipe 150 and the second refrigeration device 130), so that the second coolant can also flow in the second self-circulating loop, and the second coolant will not flow through the cooling channel 110 when flowing in the second self-circulating loop. Further, when the second coolant flows in the second self-circulating loop, it indicates that the second refrigeration device 130 is in a standby state, but the present invention is not limited thereto.

[0064] In some other embodiments, the cooling channel 110 includes a first cooling channel and a second cooling channel, the first cooling channel and the second cooling channel are not connected to each other, the first cooling channel and the first refrigeration device 120, the first liquid inlet pipe 121 and the first liquid outlet pipe 122 constitute the first cooling circulation loop; the second cooling channel and the second refrigeration device 130, the second liquid inlet pipe 131 and the first liquid outlet pipe 132 constitute the second cooling circulation loop.

[0065] Please continue to refer to Figure 1 , the second cooling circulation loop and the first cooling circulation loop are not turned on at the same time; the first self-circulation loop and the first cooling circulation loop are not turned on at the same time; the second self-circulation loop and the second cooling circulation loop are not turned on at the same time.

[0066] It can be understood that when the first cooling circulation loop is turned on, the first coolant flows in the first cooling circulation loop and regulates the temperature of the substrate; when the first self-circulation loop is turned on, the first coolant flows in the first self-circulation loop and the temperature of the first coolant is adjustable; when the second cooling circulation loop is turned on, the second coolant flows in the second cooling circulation loop and regulates the temperature of the substrate; when the second self-circulation loop is turned on, the second coolant flows in the second self-circulation loop and the temperature of the second coolant is adjustable.

[0067] Specifically, in this embodiment, when the first cooling circulation loop is turned on, the first self-circulation loop is not turned on, the second cooling circulation loop is not turned on, and the second self-circulation loop is turned on. At this time, the first coolant flows through the cooling channel 110 to control the temperature of the substrate 100, and the second coolant flows in the second self-circulation loop to adjust the temperature of the second coolant, and the adjustment of the temperature of the second coolant will not affect the regulation of the temperature of the substrate 100 by the first coolant. Similarly, when the second cooling circulation loop is turned on, the second self-circulation loop is not turned on, the first cooling circulation loop is not turned on, and the first self-circulation loop is turned on. At this time, the second coolant flows through the cooling channel 110 to control the temperature of the substrate 100, and the first coolant flows in the first self-circulation loop to adjust the temperature of the first coolant, and the adjustment of the temperature of the first coolant will not affect the regulation of the temperature of the substrate 100 by the second coolant. Optionally, the temperature adjustment range of the first coolant is -100°C to 30°C; the temperature adjustment range of the second coolant is 20°C to 100°C, so as to meet the temperature adjustment requirements of the substrate 100 in the process. In some embodiments, the temperature adjustment ranges of the first coolant and the second coolant are both -100°C to 100°C, but the present invention is not limited thereto.

[0068] Specifically, the base temperature control system also includes: a first control valve (not shown in the figure), which makes only one of the first cooling circulation loop and the second cooling circulation loop conductive; a second control valve (not shown in the figure), which makes only one of the first cooling circulation loop and the first self-circulation loop conductive; a third control valve (not shown in the figure), which makes only one of the second cooling circulation loop and the second self-circulation loop conductive.

[0069] More specifically, the first control valve, the second control valve and the third control valve may be the same valve, in which case the valve is a six-way valve, and the six interfaces on the six-way valve may be respectively connected to the first end and the second end of the cooling channel 110, the second end of the first liquid inlet pipe 121, the first end of the first liquid outlet pipe 122, the second end of the second liquid inlet pipe 131, and the first end of the third liquid outlet pipe 132. Further, based on the internal piping layout and working principle of the six-way valve, if the cooling channel 110, the first liquid inlet pipe 121, the first liquid outlet pipe 122, the second liquid inlet pipe 131 and the third liquid outlet pipe 132 are connected by the six-way valve, the first self-circulation loop and the second self-circulation loop may be formed without providing the first branch pipe 140 and the second branch pipe 150, but the present invention is not limited thereto.

[0070] In addition, in this embodiment, the base temperature control system further includes a controller, which is electrically connected to the first refrigeration device 120 and the second refrigeration device 130, and is used to control the opening and closing of the first refrigeration device and the second refrigeration device and the adjustment of the temperature of the first coolant and the second coolant, and is also used to control the on-off of the first cooling circulation loop, the second cooling circulation loop, the first self-circulation loop, and the second self-circulation loop. More specifically, the controller is also electrically connected to the first control valve, the second control valve, and the third control valve, respectively, to control the opening and closing of the first control valve, the second control valve, and the third control valve, and control the connection direction of the first control valve, the second control valve, and the third control valve, so as to control the on-off of the first cooling circulation loop, the second cooling circulation loop, the first self-circulation loop, and the second self-circulation loop, but the present invention is not limited thereto.

[0071] Specifically, in this embodiment, the first refrigeration device 120 and the second refrigeration device 130 are located in the same refrigerator to reduce the economic cost and space occupied by the base temperature control system. In some embodiments, the first refrigeration device and the second refrigeration device can also be located in two different refrigerators, but the present invention is not limited thereto.

[0072] Based on the same inventive concept, combined with the attached Figure 2As shown, this embodiment also provides a control method for a base temperature control system, and the controller in the base temperature control system is also used to execute the control method, and the control method includes: step S1, obtaining a process temperature required for processing the substrate 100, and the process temperature includes a first process temperature, a second process temperature and a third process temperature; step S2, conveying a first coolant having the first process temperature to the cooling channel 110 through the first cooling circulation loop, so that the first coolant having the first process temperature regulates the temperature of the substrate 100; and at the same time adjusting the temperature of the second coolant to the second process temperature. temperature, and make the second coolant flow in the corresponding second self-circulation loop; step S3, transport the second coolant with the second process temperature to the cooling channel 110 through the second cooling circulation loop, so that the second coolant with the second process temperature regulates the temperature of the substrate 100; at the same time, adjust the temperature of the first coolant to the third process temperature, and make the first coolant flow in the corresponding first self-circulation loop; wherein, the first process temperature, the second process temperature and the third process temperature are different from each other; the first self-circulation loop and the second self-circulation loop are not connected to the cooling channel 110.

[0073] Specifically, in this embodiment, when the process temperature required for processing the substrate 100 includes at least three different temperatures, the controller can be used to alternately connect the first cooling circulation loop and the second cooling circulation loop to alternately deliver the first coolant with different temperatures and the second coolant with different temperatures to the cooling channel 110, so that the temperature of the substrate 100 can be cascaded between at least three different temperatures, thereby meeting the temperature change requirements of the substrate 100 in the process. More specifically, when the first cooling circulation loop is turned on and the first coolant is transported to the cooling channel 110, the second coolant can flow in the second self-circulation loop, that is, the second refrigeration device 130 is in a standby state. At this time, the time when the second refrigeration device 130 is in the standby state can be utilized and the temperature of the second coolant can be pre-adjusted to the temperature of the substrate 100 to be transformed next time through the second refrigeration device 130; similarly, when the second cooling circulation loop is turned on and the second coolant is transported to the cooling channel 110, the first coolant can flow in the first self-circulation loop, that is, the first refrigeration device 120 is in a standby state. At this time, the time when the first refrigeration device 120 is in the standby state can be utilized and the temperature of the first coolant can be pre-adjusted to the temperature of the substrate 100 to be transformed next time through the first refrigeration device 120. It can be seen that in the control method provided in this embodiment, the temperature of the first coolant is pre-adjusted by utilizing the time when the first refrigeration device 120 is in the standby state, and the temperature of the second coolant is pre-adjusted by utilizing the time when the second refrigeration device 130 is in the standby state, thereby shortening the time for the temperature of the substrate to reach a preset condition when the substrate is processed at a specific temperature. At the same time, the temperature of the substrate can be converted to any temperature within the temperature adjustment range of the first coolant and the second coolant to meet the cascade temperature control requirements of the substrate in the process.

[0074] Please continue to refer to Figure 2 The control method further includes: step S4, delivering the first coolant having the third process temperature to the cooling channel 110 through the first cooling circulation loop, so that the first coolant having the third process temperature can regulate the temperature of the substrate 100.

[0075] Specifically, in this embodiment, before executing the step S2, the controller can be used to make the first self-circulation loop conductive, and make the first cooling circulation loop and the second cooling circulation loop disconnected, so as to pre-adjust the temperature of the first coolant to the first process temperature; at this time, the second self-circulation loop can be conductive or disconnected, but the present invention is not limited to this.

[0076] Specifically, in the present embodiment, in the step S2, the controller can be used to connect the first cooling circulation loop and the second self-circulation loop, and disconnect the first self-circulation loop and the second cooling circulation loop, so that the first coolant having the first process temperature can flow in the first cooling circulation loop to flow through the cooling channel 110 and adjust the temperature of the substrate 100 to the first process temperature; at the same time, the second coolant flows in the second self-circulation loop to adjust the temperature of the second coolant to the second process temperature by utilizing the time when the second refrigeration device 130 is in the standby state, and the adjustment of the temperature of the second coolant will not affect the regulation of the temperature of the substrate 100 by the first coolant.

[0077] In step S3, the controller can be used to connect the second cooling circulation loop and the first self-circulation loop, and disconnect the second self-circulation loop and the first cooling circulation loop, so that the second coolant with the second process temperature can flow in the second cooling circulation loop to flow through the cooling channel 110 and adjust the temperature of the substrate 100 to the second process temperature; at the same time, the first coolant flows in the first self-circulation loop to adjust the temperature of the first coolant to the third process temperature by utilizing the time when the first refrigeration device 120 is in the standby state, and the adjustment of the temperature of the first coolant will not affect the regulation of the temperature of the substrate 100 by the second coolant.

[0078] In step S4, the controller can be used to connect the first cooling circulation loop and the second self-circulation loop, and disconnect the first self-circulation loop and the second cooling circulation loop, so that the first coolant having the third process temperature can flow in the first cooling circulation loop to flow through the cooling channel 110 and adjust the temperature of the substrate 100 to the third process temperature. More specifically, if the process temperature only includes the first process temperature, the second process temperature and the third process temperature, after the temperature of the substrate 100 is adjusted to the third process temperature, the controller can be used to turn off the first refrigeration device 120 (i.e., the first refrigeration device is not working) or in a standby state, and turn off the second refrigeration device 130 (i.e., the second refrigeration device is not working) or in a standby state.

[0079] Please continue to refer to Figure 2, the process temperature also includes a fourth process temperature, a fifth process temperature, ..., and an Nth process temperature that are different from each other, N is an integer and N≥4; the fourth process temperature, the fifth process temperature, ..., and the Nth process temperature are all different from the first process temperature, the second process temperature, and the third process temperature. The control method also includes: step S5, conveying the first coolant with the i-th process temperature to the cooling channel through the first cooling circulation loop to regulate the temperature of the substrate; at the same time, judging whether the preset condition is met, if not, adjusting the temperature of the second coolant to the i+1th process temperature, and allowing the second coolant to flow in the second self-circulation loop; step S6, conveying the second coolant with the i+1th process temperature to the cooling channel through the second cooling circulation loop to regulate the temperature of the substrate; at the same time, judging whether the preset condition is met, if not, adjusting the temperature of the first coolant to the i+2th process temperature, and allowing the first coolant to flow in the first self-circulation loop; looping through steps S5 to S6 until the preset condition is met; and the preset condition is that the temperature of the substrate is adjusted to the Nth process temperature; i is an integer, 3≤i≤N-1.

[0080] Specifically, in the present embodiment, in step S5, the controller can be used to connect the first cooling circulation loop and the second self-circulation loop, and disconnect the first self-circulation loop and the second cooling circulation loop, so that the first coolant having the i-th process temperature can flow in the first cooling circulation loop, so as to flow through the cooling channel 110 and adjust the temperature of the substrate 100 to the i-th process temperature. At the same time, it is also necessary to determine whether the preset condition is met. If the preset condition is not met, it means that the temperature of the substrate has not been adjusted to the N-th process temperature. Then, the time when the second refrigeration device 130 is in the standby state can be used to adjust the temperature of the second coolant flowing in the second self-circulation loop to the i+1-th process temperature. If the preset condition is met, it means that the temperature of the substrate has been adjusted to the N-th process temperature. Then, the controller can be used to turn off the first refrigeration device 120 or put it in the standby state, and turn off the second refrigeration device 130 or put it in the standby state.

[0081] In step S6, the controller can be used to connect the second cooling circulation loop and the first self-circulation loop, and disconnect the second self-circulation loop and the first cooling circulation loop, so that the second coolant having the i+1 process temperature can flow in the second cooling circulation loop to flow through the cooling channel 110 and adjust the temperature of the substrate 100 to the i+1 process temperature. At the same time, it is necessary to determine again whether the preset condition is met. If the preset condition is not met, it means that the temperature of the substrate has not been adjusted to the Nth process temperature. Then, the temperature of the first coolant flowing in the first self-circulation loop can be adjusted to the i+2th process temperature by using the time when the first refrigeration device 120 is in the standby state; if the preset condition is met, it means that the temperature of the substrate has been adjusted to the Nth process temperature, then the controller can be used to turn off the first refrigeration device 120 or put it in the standby state, and turn off the second refrigeration device 130 or put it in the standby state. More specifically, when N≥4, step S5 and step S6 can be performed at least once until the preset condition is met. In some embodiments, the preset condition may also be that the temperature of the substrate is no longer regulated, but the present invention is not limited thereto.

[0082] Based on the same inventive concept, combined with the attached Figure 3 As shown, this embodiment also provides a semiconductor processing device, including: a reaction chamber 200; a susceptor temperature control system as described above; and the controller in the susceptor temperature control system is also used to execute the control method as described above.

[0083] Specifically, in this embodiment, the susceptor 101 in the susceptor temperature control system is disposed at the bottom of the reaction chamber 200; a shower head 210 is disposed at the top of the reaction chamber 200, which is opposite to the susceptor 101; the shower head 210 is connected to a gas supply device 220 located outside the reaction chamber 200, and is used to pass the process gas in the gas supply device 220 into the reaction region between the shower head 210 and the susceptor 101. At the same time, the shower head 210 can also serve as the upper electrode of the reaction chamber 200, and the susceptor 101 can also serve as the lower electrode of the reaction chamber 200, and at least one radio frequency power source is applied to the upper electrode or the lower electrode through a matching network to generate a radio frequency electric field between the upper electrode and the lower electrode, so as to ionize the process gas in the reaction region into plasma, and perform process treatment on the substrate 100. An electrostatic chuck for supporting the substrate 100 is disposed above the base 101 , and an electrostatic electrode 230 is disposed inside the electrostatic chuck for generating electrostatic suction force to support and fix the substrate 100 during the process, but the present invention is not limited thereto.

[0084] Specifically, in this embodiment, based on the base temperature control system, the first coolant with different temperatures and the second coolant with different temperatures can be alternately delivered to the cooling channel 110 located in the base 101, so that the temperature of the substrate 100 can be cascaded between at least three different temperatures, thereby meeting the temperature change requirements of the substrate 100 in the process, and for different etching depths, the temperature of the substrate 100 can be changed in time to match the bonding and desorption rates of the etchants and reaction byproducts with the substrate 100 at different etching depths, thereby achieving precise control of parameters such as etching key dimensions at different depths, so that the substrate 100 after the process treatment meets the preparation requirements. More specifically, an ONON structure is formed on the substrate 100 after the process treatment, and the ONON structure includes an oxide layer and a silicon nitride layer stacked in sequence, but the present invention is not limited thereto.

[0085] Based on the same inventive concept, this embodiment also provides a computer-readable storage medium storing a computer-readable program, wherein the computer-readable program is used to guide the operation of the base temperature control system as described above, and the base temperature control system includes a controller, which is used to read the program stored in the computer-readable storage medium to execute the control method as described above.

[0086] In summary, the present embodiment provides a susceptor temperature control system, a control method and a semiconductor processing device, wherein the controller in the susceptor temperature control system is used to execute the control method, and the control method includes delivering a first coolant having a first process temperature to a cooling channel through a first cooling circulation loop to control the temperature of the substrate, while adjusting the temperature of the second coolant to the second process temperature, and allowing the second coolant to flow in a second self-circulating loop that does not pass through the cooling channel; delivering a second coolant having a second process temperature to a cooling channel through a second cooling circulation loop to control the temperature of the substrate, while adjusting the temperature of the first coolant to a third process temperature, and allowing the first coolant to flow in a first self-circulating loop that does not pass through the cooling channel. In the present embodiment, the first cooling circulation loop and the second cooling circulation loop can be alternately turned on to alternately deliver the first coolant having different temperatures and the second coolant having different temperatures to the cooling channel, so that the temperature of the substrate can be cascaded between at least three different temperatures, thereby meeting the temperature change requirements of the substrate in the process. In this embodiment, the temperature of the first coolant can be pre-adjusted by utilizing the time when the first refrigeration device is in the standby state, and the temperature of the second coolant can be pre-adjusted by utilizing the time when the second refrigeration device is in the standby state. Based on this cascade temperature change method, the standby state time of one of the refrigeration devices is utilized to perform the next preset target temperature change. Compared with the method of controlling the substrate temperature based on the premixed liquid in the prior art, this embodiment greatly shortens the time for processing the substrate.

[0087] Although the content of the present invention has been described in detail through the above preferred embodiments, it should be appreciated that the above description should not be considered as a limitation of the present invention. After reading the above content, it will be apparent to those skilled in the art that various modifications and substitutions of the present invention will occur. Therefore, the protection scope of the present invention should be limited by the appended claims.

Claims

1. A control method for a susceptor temperature control system, the susceptor temperature control system comprising a susceptor disposed in a reaction chamber and a cooling channel disposed in the susceptor, the cooling channel being used to control the temperature of a substrate carried on the susceptor; the susceptor temperature control system comprising: a first refrigeration device and a first cooling circulation loop, for conveying a first coolant to the cooling channel and circulating the first coolant; The second refrigeration device and the second cooling circulation loop are used to transport the second coolant to the cooling channel and circulate the second coolant; the base temperature control system also includes a controller, characterized in that the controller is used to execute the control method, and the control method includes: Step S1, obtaining a process temperature required for processing the substrate, wherein the process temperature includes a first process temperature, a second process temperature and a third process temperature; Step S2, delivering the first coolant having the first process temperature to the cooling channel through the first cooling circulation loop, so that the first coolant having the first process temperature regulates the temperature of the substrate; at the same time, adjusting the temperature of the second coolant to the second process temperature, and allowing the second coolant to flow in the corresponding second self-circulating loop; Step S3, delivering the second coolant having the second process temperature to the cooling channel through the second cooling circulation loop, so that the second coolant having the second process temperature regulates the temperature of the substrate; at the same time, adjusting the temperature of the first coolant to the third process temperature, and allowing the first coolant to flow in the corresponding first self-circulating loop; The first process temperature, the second process temperature and the third process temperature are different from each other; and the first self-circulation loop and the second self-circulation loop are not connected to the cooling channel.

2. The control method of the susceptor temperature control system according to claim 1, characterized in that: The control method further comprises: Step S4: delivering the first cooling liquid having the third process temperature to the cooling channel through the first cooling circulation loop to control the temperature of the substrate.

3. The control method of the susceptor temperature control system according to claim 1, characterized in that: The process temperature further includes a fourth process temperature, a fifth process temperature, ..., and an Nth process temperature which are different from each other, where N is an integer and N≥4; the control method further includes: Step S5, delivering the first coolant having the i-th process temperature to the cooling channel through the first cooling circulation loop to control the temperature of the substrate; and judging whether a preset condition is met, if not, adjusting the temperature of the second coolant to the i+1-th process temperature, and making the second coolant flow in the second self-circulating loop; Step S6, delivering the second coolant having the (i+1)th process temperature to the cooling channel through the second cooling circulation loop to control the temperature of the substrate; and judging whether the preset condition is met, if not, adjusting the temperature of the first coolant to the (i+2)th process temperature, and making the first coolant flow in the first self-circulating loop; Steps S5 to S6 are executed in a loop until the preset condition is met; and the preset condition is that the temperature of the substrate is adjusted to the Nth process temperature; i is an integer, 3≤i≤N-1.

4. A susceptor temperature control system, used to execute the control method according to any one of claims 1 to 3; characterized in that: The base temperature control system comprises: A cooling channel is provided in the base and is used to control the temperature of the substrate carried on the base; A first refrigeration device, used for conveying and circulating a first cooling liquid; and the cooling channel is connected to the first refrigeration device through a first liquid inlet pipe and a first liquid outlet pipe to form a first cooling circulation loop; A second refrigeration device is used to transport and circulate a second coolant; and the cooling channel is connected to the second refrigeration device through a second liquid inlet pipe and a second liquid outlet pipe to form a second cooling circulation loop; the second cooling circulation loop is not connected to the first cooling circulation loop at the same time; a first self-circulating loop, sharing the first refrigeration device with the first cooling circulation loop; and the first self-circulating loop is not connected to the cooling channel; The second self-circulating loop shares the second refrigeration device with the second cooling circulating loop; and the second self-circulating loop is not connected to the cooling channel.

5. The susceptor temperature control system according to claim 4, characterized in that: Also includes: a first branch pipe, connected to the first liquid inlet pipe and the first liquid outlet pipe respectively; and the first branch pipe, the first refrigeration device, and the first liquid inlet pipe and the first liquid outlet pipe located therebetween form the first self-circulating loop; The second branch pipe is connected to the second liquid inlet pipe and the second liquid outlet pipe respectively; and the second branch pipe, the second refrigeration device, and the second liquid inlet pipe and the second liquid outlet pipe located therebetween form the second self-circulating loop.

6. The susceptor temperature control system according to claim 5, characterized in that: The first self-circulating loop and the first cooling circulating loop are not turned on at the same time; The second self-circulating loop and the second cooling circulating loop are not turned on at the same time.

7. The susceptor temperature control system according to claim 5, characterized in that: Also includes: The first control valve allows only one of the first cooling circulation circuit and the second cooling circulation circuit to be in conduction.

8. The susceptor temperature control system according to claim 5, characterized in that: Also includes: The second control valve allows only one of the first cooling circulation loop and the first self-circulation loop to be in conduction.

9. The susceptor temperature control system according to claim 5, characterized in that: Also includes: The third control valve is used to open only one of the second cooling circulation loop and the second self-circulation loop.

10. The susceptor temperature control system according to claim 5, characterized in that: When the first cooling circulation loop is turned on, the first coolant regulates the temperature of the substrate; when the first self-circulating loop is turned on, the first coolant flows in the first self-circulating loop and the temperature of the first coolant is adjustable; When the second cooling circulation loop is turned on, the second coolant regulates the temperature of the substrate; when the second self-circulation loop is turned on, the second coolant flows in the second self-circulation loop and the temperature of the second coolant is adjustable.

11. The susceptor temperature control system according to claim 10, characterized in that: The temperature adjustment range of the first coolant and the second coolant is both -100°C to 100°C.

12. The susceptor temperature control system according to claim 10, characterized in that: The temperature adjustment range of the first coolant is -100°C to 30°C; the temperature adjustment range of the second coolant is 20°C to 100°C.

13. The susceptor temperature control system according to claim 4, characterized in that: The first refrigeration device and the second refrigeration device are located in the same refrigerator.

14. A semiconductor processing device, characterized in that: include: Reaction chamber; a susceptor temperature control system as described in any one of claims 4 to 13.

15. A computer-readable storage medium storing a computer-readable program, wherein the computer-readable program is used to guide the operation of the susceptor temperature control system according to any one of claims 4 to 13, wherein the susceptor temperature control system comprises a controller, wherein the controller is used to read the program stored in the computer-readable storage medium to execute the following control method, wherein the control method comprises: Step S1, obtaining a process temperature required for processing the substrate, wherein the process temperature includes a first process temperature, a second process temperature and a third process temperature; Step S2, delivering the first coolant having the first process temperature to the cooling channel through the first cooling circulation loop, so that the first coolant having the first process temperature regulates the temperature of the substrate; at the same time, adjusting the temperature of the second coolant to the second process temperature, and allowing the second coolant to flow in the corresponding second self-circulating loop; Step S3, delivering the second coolant having the second process temperature to the cooling channel through the second cooling circulation loop, so that the second coolant having the second process temperature regulates the temperature of the substrate; at the same time, adjusting the temperature of the first coolant to the third process temperature, and allowing the first coolant to flow in the corresponding first self-circulating loop; The first process temperature, the second process temperature and the third process temperature are different from each other; and the first self-circulation loop and the second self-circulation loop are not connected to the cooling channel.

16. The computer-readable storage medium storing a computer-readable program according to claim 15, wherein: The control method further includes: step S4, delivering the first cooling liquid having the third process temperature to the cooling channel through the first cooling circulation loop to control the temperature of the substrate.

17. The computer-readable storage medium storing a computer-readable program according to claim 15, wherein: The process temperature further includes a fourth process temperature, a fifth process temperature, ..., and an Nth process temperature which are different from each other, where N is an integer and N≥4, and the control method further includes: Step S5, delivering the first coolant having the i-th process temperature to the cooling channel through the first cooling circulation loop to control the temperature of the substrate; and judging whether a preset condition is met, if not, adjusting the temperature of the second coolant to the i+1-th process temperature, and making the second coolant flow in the second self-circulating loop; Step S6, delivering the second coolant having the (i+1)th process temperature to the cooling channel through the second cooling circulation loop to control the temperature of the substrate; and judging whether the preset condition is met, if not, adjusting the temperature of the first coolant to the (i+2)th process temperature, and making the first coolant flow in the first self-circulating loop; Steps S5 to S6 are executed in a loop until the preset condition is met; and the preset condition is that the temperature of the substrate is adjusted to the Nth process temperature; i is an integer, 3≤i≤N-1.

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