Accurate temperature control and comprehensive energy management device for injection molding machine

Abstract

The invention discloses a precise temperature control and energy comprehensive management device for an injection molding machine, the device is arranged on a machine barrel of the injection molding machine, the device comprises a temperature difference power generation system, a semiconductor refrigeration system and a cooling system, the temperature difference power generation system comprises a plurality of temperature difference power generation sheets and is used for controlling the temperature of a high-temperature heating section of the machine barrel and absorbing waste heat for power generation; the plurality of thermoelectric power generation sheets are connected in series to the voltage stabilizing circuit to supply power to a PLC of the injection molding machine; the semiconductor refrigeration system comprises a plurality of semiconductor refrigeration sheets and is used for controlling the temperature of the low-temperature heating section of the machine barrel; the cooling system is used for maintaining the constant temperature difference between the cold and hot ends of the thermoelectric power generation sheet and improving the refrigeration efficiency of the semiconductor refrigeration sheet. The device has the advantages of being simple in structure, safe, reliable, long in service life, free of moving parts, free of noise, environmentally friendly and the like, continuous and precise control over the temperature of the high-temperature section of the machine barrel can be achieved by controlling the heat dissipating capacity of the cold end of the thermoelectric power generation piece, and the temperature of the low-temperature section of the machine barrel can be precisely controlled by changing the magnitude of current supplied to the semiconductor chilling plate.

Description

Technical Field

[0001] The present invention relates to the technical field of injection molding machines, and in particular to a precise temperature control and comprehensive energy management device for injection molding machines. Background Art

[0002] High efficiency, high quality and high consistency are the main characteristics of injection molding. Injection molding is a highly automated and precisely controlled manufacturing process that can produce plastic parts with extremely high precision and complex geometries. The main characteristics of this process are reflected in its fine control of materials, molds and process parameters to ensure the dimensional accuracy and surface quality of parts. Through precise temperature control, pressure re-regulation and optimization of injection speed, injection molding can achieve uniform flow and filling of materials, reduce internal stress and deformation, and thus improve the consistency and reliability of parts.

[0003] However, the current temperature control strategy is relatively simple and direct, that is, when the temperature is detected to be lower than the set value, heating is started, and vice versa, cooling is started. This method has significant limitations in temperature control effect. Specifically, it faces problems such as obvious control response lag, significant system nonlinear characteristics, and over-adjustment that often occurs during temperature regulation.

[0004] In terms of physical structure, traditional cooling methods such as water cooling and air cooling cause a large amount of heat to be directly dissipated into the air during the melting process, resulting in huge heat losses.

[0005] The above problems not only lead to low energy efficiency, but also seriously affect the temperature control accuracy of the polymer molding process, resulting in uneven product quality. Therefore, seeking more efficient and precise temperature control methods and more reasonable energy distribution structures have become urgent problems to be solved in this field. Summary of the invention

[0006] The purpose of the present invention is to provide a precise temperature control and comprehensive energy management device for an injection molding machine to solve the problems existing in the above-mentioned prior art.

[0007] To achieve the above object, the present invention provides a precise temperature control and comprehensive energy management device for an injection molding machine, which is arranged on the barrel of the injection molding machine and comprises:

[0008] Semiconductor chips, including thermoelectric power generation chips and semiconductor refrigeration chips;

[0009] A temperature difference power generation system, the temperature difference power generation system is used to control the temperature of the high temperature heating section of the barrel and absorb waste heat to generate electricity; the temperature difference power generation system includes a plurality of temperature difference power generation sheets, the temperature difference power generation sheets are arranged on the side of the barrel, and the hot end of the temperature difference power generation sheet is fixed to the barrel; the plurality of temperature difference power generation sheets are connected in series to a voltage stabilizing circuit and supply power to the PLC of the injection molding machine;

[0010] A semiconductor refrigeration system, the semiconductor refrigeration system is used to control the temperature of the low-temperature heating section of the barrel; the semiconductor refrigeration system comprises a plurality of semiconductor refrigeration sheets, the semiconductor refrigeration sheets are arranged on the side of the barrel, and the cold end of the semiconductor refrigeration sheet is fixed to the barrel;

[0011] A cooling system, wherein the cold end of the thermoelectric power generation sheet and the hot end of the semiconductor refrigeration sheet are both arranged corresponding to the cooling system. The cooling system is used to maintain a constant temperature difference between the cold end and the hot end of the thermoelectric power generation sheet, and to keep the hot end of the semiconductor refrigeration sheet at a relatively stable temperature, thereby improving the cooling efficiency and facilitating precise temperature control.

[0012] Preferably, the thermoelectric power generation chip is a semiconductor thermoelectric power generation chip.

[0013] Preferably, the barrel is a regular polygonal prism structure.

[0014] Preferably, the cooling system comprises a cooling water tower, the bottom of which is connected to two water pipes, a plasticizing coil is wound around the outside of the semiconductor sheet, both ends of the plasticizing coil are respectively connected to the two water pipes, and a water pump and a regulating valve are installed on the water pipe.

[0015] Preferably, the cooling system uses heat dissipation fins and a heat dissipation fan with adjustable power.

[0016] Compared with the prior art, the present invention has the following advantages and technical effects:

[0017] 1. The precise temperature control and comprehensive energy management device for an injection molding machine provided by the present invention has the advantages of simple structure, safety and reliability, long service life, no moving parts, no noise, and green environmental protection; a thermoelectric generator is used in the high-temperature section of the barrel to simultaneously control the barrel temperature and generate electricity; a semiconductor refrigeration sheet is used in the low-temperature section of the barrel as a more efficient cooling means; the temperature of the high-temperature heating section of the barrel can be continuously and precisely controlled by controlling the heat dissipation of the cold end of the thermoelectric generator; the temperature of the low-temperature heating section of the barrel can be accurately controlled by changing the current supplied to the semiconductor refrigeration sheet; the thermoelectric generator can supply power to the PLC after absorbing the waste heat, thereby optimizing the energy distribution structure.

[0018] 2. From the Seebeck effect, it can be seen that semiconductor materials can generate potential differences when there is a temperature difference. The temperature difference between the hot and cold ends of the thermoelectric generator and the output DC voltage are in a one-to-one correspondence. Therefore, when a stable output voltage is detected, it means that there is a constant temperature difference between the two ends of the thermoelectric generator. By controlling the heat dissipation of the cold end of the thermoelectric generator, continuous and precise control of the heat at the hot end of the thermoelectric generator can be achieved, thereby accurately controlling the barrel temperature.

[0019] 3. The semiconductor refrigeration sheet is composed of multiple P-type and N-type semiconductor material couples, which are connected together by electrodes and sandwiched between two ceramic electrodes. Based on the Peltier effect, when current passes through these couples, one end absorbs heat and becomes cold, and the other end releases heat and becomes hot. This effect is reversible. If the direction of the current is changed, the hot and cold ends will also be exchanged accordingly. The cooling or heating capacity of the semiconductor refrigeration sheet is proportional to the current passing through its couple. Therefore, changing the current powering the semiconductor refrigeration sheet can achieve precise control of the barrel temperature.

[0020] 4. Semiconductor temperature difference power generation technology has great potential in the utilization of low-grade energy such as industrial and domestic waste heat, automobile exhaust, geothermal energy, etc. It not only saves energy and protects the environment and improves energy utilization rate, but also reduces energy consumption for enterprises and creates economic benefits. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 It is a structural schematic diagram of the precise temperature control and comprehensive energy management device for an injection molding machine of the present invention;

[0023] Figure 2 This is a PLC power supply control circuit diagram of the injection molding machine of the present invention;

[0024] Figure 3 It is a coupling relationship diagram of the barrel, semiconductor temperature difference power generation sheet and cooling system of the present invention;

[0025] In the figure: 1. barrel; 2. semiconductor wafer; 3. plasticizing coil; 4. cooling water tower; 5. water pipe; 6. water pump; 7. regulating valve; 8. voltage stabilizing circuit; 10. cooling channel. DETAILED DESCRIPTION

[0026] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other. The described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. The present invention will be described in detail below with reference to the drawings and in combination with the embodiments.

[0027] like Figure 1 As shown, Figure 1The present invention is a structural schematic diagram of a precise temperature control and comprehensive energy management device for an injection molding machine; the present invention provides a precise temperature control and comprehensive energy management device for an injection molding machine, the device being arranged on a barrel 1 of the injection molding machine, comprising:

[0028] Semiconductor chip 2, semiconductor chip 2 includes a thermoelectric power generation chip and a semiconductor refrigeration chip;

[0029] Thermoelectric power generation system, the thermoelectric power generation system is used to control the temperature of the high temperature heating section of the barrel 1 and absorb waste heat to generate electricity; the thermoelectric power generation system includes a plurality of thermoelectric power generation sheets, the thermoelectric power generation sheets are arranged on the side of the barrel 1, and the hot end of the thermoelectric power generation sheet is fixed to the barrel 1; the plurality of thermoelectric power generation sheets are connected in series to the voltage stabilizing circuit 8, and power the PLC of the injection molding machine;

[0030] A semiconductor refrigeration system, which is used to control the temperature of the low-temperature heating section of the barrel 1; the semiconductor refrigeration system includes a plurality of semiconductor refrigeration sheets, which are arranged on the side of the barrel 1, and the cold end of the semiconductor refrigeration sheet is fixed to the barrel 1;

[0031] The cooling system, the cold end of the thermoelectric power generation sheet and the hot end of the semiconductor refrigeration sheet are both set corresponding to the cooling system. The cooling system is used to maintain a constant temperature difference between the cold end and the hot end of the thermoelectric power generation sheet, and to keep the hot end of the semiconductor refrigeration sheet at a relatively stable temperature, thereby improving the cooling efficiency and facilitating precise temperature control.

[0032] According to a further optimization scheme, the thermoelectric power generation chip is a semiconductor thermoelectric power generation chip.

[0033] According to a further optimized solution, the barrel 1 is a regular hexagonal prism structure.

[0034] To further optimize the solution, the cooling system can be water-cooled or air-cooled and set corresponding to the cold end of the temperature difference power generation sheet and the hot end of the semiconductor refrigeration sheet. The cooling system includes a cooling water tower 4, and two water pipes 5 are connected to the bottom of the cooling water tower 4. A plasticizing coil 3 is wound around the outside of the semiconductor sheet 2, and the two ends of the plasticizing coil 3 are respectively connected to the two water pipes 5. A water pump 6 and a regulating valve 7 are installed on the water pipe 5.

[0035] When the cooling system adopts air cooling, the cooling system adopts heat dissipation fins and a heat dissipation fan with adjustable power.

[0036] In this embodiment, the cooling system adopts water cooling.

[0037] like Figure 2 As shown, Figure 2The diagram is a PLC power supply control circuit diagram of the injection molding machine of the present invention; at the initial stage of heating of the high-temperature heating section of the barrel 1, the temperature difference between the hot and cold ends of the thermoelectric generator is small, the generated DC voltage is less than 24V, the undervoltage relay KV works, the normally closed contact KV is disconnected, and the normally open contact KV is closed, and the single-phase AC voltage 220V passes through the transformer and the rectifier bridge to power the PLC; after the temperature of the high-temperature heating section of the barrel 1 rises to a certain level, the temperature difference between the hot and cold ends of the thermoelectric generator is large, and the generated voltage is higher than 24V, and a DC voltage of 24V is outputted constantly through the voltage stabilizing circuit 8, the undervoltage relay KV stops working, the normally closed contact KV is closed, and the normally open contact KV is disconnected, and the thermoelectric generator powers the PLC; the air switch QF and the fuses FU1 / FU2 / FU3 in the PLC power supply control circuit provide overload protection and short-circuit protection, the undervoltage relay KV provides undervoltage protection, and the power supply source of the PLC is switched in time when the thermoelectric generator is undervoltage.

[0038] like Figure 3 As shown, Figure 3 It is a coupling relationship diagram of the barrel 1, semiconductor chip 2 and cooling system of the present invention; the hot end of the temperature difference power generation chip and the cold end of the semiconductor refrigeration chip are in contact with the heating area of ​​the barrel 1, the cold end of the temperature difference power generation chip and the hot end of the semiconductor refrigeration chip are in contact with the cooling flow channel 10 of the cooling system, and the semiconductor chips 2 are arranged at equal intervals along the circumferential direction of the barrel 1 and can cover the entire outer wall of the barrel 1.

[0039] The precise temperature control and comprehensive energy management device for an injection molding machine provided by the present invention has the following specific operation process:

[0040] Thermoelectric power generation system, semiconductor chip 2 is a semiconductor thermoelectric power generation chip. The waste heat generated by the high-temperature heating section of barrel 1 is transferred to the hot end of semiconductor chip 2 through the metal wall of barrel 1. At this time, the temperature difference between the hot and cold ends of semiconductor chip 2 converts the waste heat into electrical energy. In the initial stage of heating, the temperature difference between the hot and cold ends of semiconductor chip 2 is small, and the DC voltage generated is less than 24V. The undervoltage relay KV works, the normally closed contact KV is disconnected, and the normally open contact KV is closed. The single-phase AC voltage 220V passes through the transformer and the rectifier bridge to power the PLC; after the temperature of the high-temperature heating section of barrel 1 rises to a certain level, the temperature difference between the hot and cold ends of semiconductor chip 2 is large, and the voltage generated is higher than 24V. The voltage stabilizing circuit 8 outputs a constant DC voltage of 24V, the undervoltage relay KV stops working, the normally closed contact KV is closed, and the normally open contact KV is disconnected, and the TEG powers the PLC.

[0041] In the temperature difference power generation system, the cold end of the semiconductor chip 2 gradually heats up under the heating environment, and the cold water in the cooling tower 4 flows into the plasticizing coil 3. Through the coupling effect of convection heat transfer and heat conduction, the heat of the cold end of the semiconductor chip 2 is transferred to the cold water in the cooling channel 10, and the hot water flows back into the cooling tower 4 through the water pump 6. In this process, the water flow rate flowing into the plasticizing coil 3 can be controlled by the regulating valve 7, and then the temperature of the cold end of the semiconductor chip 2 is controlled, so as to ensure a constant temperature difference and power output between the cold and hot ends of the semiconductor chip 2, and realize the precise temperature control of the surface of the high-temperature heating section of the injection molding machine barrel 1.

[0042] Semiconductor refrigeration system, semiconductor chip 2 is a semiconductor refrigeration chip. After the semiconductor chip 2 on the low-temperature heating section of the barrel 1 is powered on, the cold end of the semiconductor chip 2 will absorb heat and become cold, and the hot end of the semiconductor chip 2 will release heat and become hot. Through the coupling of convection heat transfer and heat conduction, the heat released by the hot end of the semiconductor chip 2 is absorbed by the cold water in the cooling channel 10 of the water cooling system, and the hot water flows back into the cooling tower 4 through the water pump 6. The water cooling system is conducive to maintaining better heat dissipation at the hot end of the semiconductor chip 2, so that the hot end of the semiconductor chip 2 is maintained at a relatively stable temperature, improves the refrigeration efficiency, and facilitates precise temperature control. By adjusting the current size of the semiconductor chip 2, the temperature of the low-temperature heating section of the barrel 1 of the injection molding machine can be accurately controlled.

[0043] The temperature difference power generation system of the present invention is based on the Seebeck principle of the thermoelectric effect, and uses semiconductor temperature difference power generation technology to control the temperature of the high temperature heating section of the barrel 1, absorbs waste heat to power the PLC, and optimizes the energy distribution structure. The temperature difference power generation system uses water cooling or air cooling as a cooling system to construct a constant temperature difference between the cold and hot ends of the semiconductor temperature difference power generation sheet, and accurately controls the temperature of the high temperature heating section of the barrel 1 while recovering waste heat to generate electricity.

[0044] The semiconductor refrigeration system of the present invention is based on the Peltier principle of the thermoelectric effect. The semiconductor refrigeration system uses water cooling or air cooling as a cooling system to keep the hot end of the semiconductor refrigeration plate at a relatively stable temperature, improve the refrigeration efficiency, and facilitate precise temperature control. By adjusting the current supplied to the semiconductor refrigeration plate, the temperature of the low-temperature heating section of the barrel 1 can be accurately controlled.

[0045] The above are only preferred specific implementations of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by any technician familiar with the technical field within the technical scope disclosed by the present invention should be covered within the protection scope of the present invention.

Claims

1. A precise temperature control and comprehensive energy management device for an injection molding machine, the device being arranged on a barrel (1) of the injection molding machine, characterized in that: include: A semiconductor chip (2), wherein the semiconductor chip (2) comprises a temperature difference power generation chip and a semiconductor refrigeration chip; A temperature difference power generation system, the temperature difference power generation system is used to control the temperature of the high temperature heating section of the barrel (1) and absorb waste heat to generate electricity; the temperature difference power generation system comprises a plurality of temperature difference power generation sheets, the temperature difference power generation sheets are arranged on the side of the barrel (1), and the hot end of the temperature difference power generation sheet is fixed to the barrel (1); the plurality of temperature difference power generation sheets are connected in series to a voltage stabilizing circuit (8) and supply power to a PLC of the injection molding machine; A semiconductor refrigeration system, the semiconductor refrigeration system is used to control the temperature of the low-temperature heating section of the barrel (1); the semiconductor refrigeration system comprises a plurality of semiconductor refrigeration sheets, the semiconductor refrigeration sheets are arranged on the side of the barrel (1), and the cold ends of the semiconductor refrigeration sheets are fixed to the barrel (1); A cooling system, wherein the cold end of the thermoelectric power generation sheet and the hot end of the semiconductor refrigeration sheet are both arranged corresponding to the cooling system, and the cooling system is used to maintain a constant temperature difference between the cold end and the hot end of the thermoelectric power generation sheet.

2. The precise temperature control and comprehensive energy management device for an injection molding machine according to claim 1, characterized in that: The temperature difference power generation sheet is a semiconductor temperature difference power generation sheet.

3. The precise temperature control and comprehensive energy management device for an injection molding machine according to claim 1, characterized in that: The barrel (1) is a regular polygonal prism structure.

4. The precise temperature control and comprehensive energy management device for an injection molding machine according to claim 1, characterized in that: The cooling system comprises a cooling water tower (4), the bottom of which is connected to two water pipes (5), a plasticizing coil (3) is wound around the outer side of the semiconductor chip (2), the two ends of the plasticizing coil (3) are respectively connected to the two water pipes (5), and a water pump (6) and a regulating valve (7) are installed on the water pipe (5).

5. The precise temperature control and comprehensive energy management device for an injection molding machine according to claim 1, characterized in that: The cooling system adopts heat dissipation fins and a heat dissipation fan.

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