Wafer test positioning device

Abstract

The invention relates to the technical field of positioning devices, and particularly discloses a wafer test positioning device which comprises a bottom plate, first sliding grooves are symmetrically formed in the upper surface of the bottom plate, a bearing ring is arranged on the upper surface of the bottom plate, sliding blocks are slidably connected into the first sliding grooves, and the sliding blocks are fixedly connected to the bottom of the bottom plate through bolts. A second sliding groove is formed in the upper surface of the middle of the bottom plate in a penetrating mode, and the second sliding groove is formed between the two first sliding grooves. By arranging the lifting mechanism, even if the wafer can automatically and horizontally ascend to the detection equipment, manual intervention is not needed, the production efficiency is greatly improved, human errors are reduced, meanwhile, the device can be additionally arranged on a production line through the bottom plate, production and detection are synchronously carried out, and the production efficiency is improved. And the wafer can be directly detected in the horizontal rising process, so that the carrying frequency of the wafer between different detection devices can be reduced, and the damage risk caused by carrying is reduced.

Description

Technical Field

[0001] The invention relates to the technical field of positioning devices, in particular to a wafer testing positioning device. Background Art

[0002] Wafer refers to the silicon chip used to make silicon semiconductor integrated circuits. Because of its round shape, it is called a wafer. In the semiconductor industry, wafers are the basic materials for chip manufacturing. Various integrated circuit chips can be manufactured by performing a series of processing processes on wafers, such as photolithography, etching, deposition, etc. The quality and performance of wafers have a crucial impact on the quality and performance of chips.

[0003] In the semiconductor manufacturing process, wafers, as key materials for manufacturing integrated circuits, need to undergo a series of precision tests and positioning operations to ensure product quality. In this process, wafer test positioning devices play a vital role. Traditional wafer test positioning devices usually use manual operation or simple mechanical positioning methods, which have the following shortcomings: 1. Inefficiency: Manual operation is not only time-consuming, but also has poor repeatability, and it is difficult to meet the needs of large-scale production. 2. Insufficient accuracy: Traditional positioning devices may not be able to ensure the precise positioning of wafers during the test process, which may lead to errors in test results. 3. Complex operation: In some devices, the loading and unloading process of wafers is complicated and requires professional technicians, which increases the difficulty of operation and training costs. 4. Risk of damage: During the handling and positioning process, the wafer may be damaged due to improper operation or defects in equipment design, affecting its performance and reliability. 5. Poor compatibility: Traditional equipment is often designed for wafers of specific sizes or types, and has poor adaptability to wafers of different specifications, which limits its application in diversified production.

[0004] In response to these technical challenges, the industry urgently needs a new type of wafer testing and positioning device to improve production efficiency, ensure positioning accuracy, simplify operating procedures, reduce the risk of wafer damage, and have good compatibility. Summary of the invention

[0005] The present invention provides a wafer testing and positioning device, which solves the problems mentioned in the above background technology.

[0006] To achieve the above objectives, the present invention is implemented through the following technical solutions: a wafer test positioning device, comprising a base plate, a first slide groove is symmetrically opened on the upper surface of the base plate, a bearing ring is arranged on the upper surface of the base plate, a slider is slidably connected in the first slide groove, the slider is fixedly connected to the bottom of the base plate by bolts, a second slide groove is opened through the middle upper surface of the base plate, the second slide groove is opened between the two first slide grooves, and further comprises:

[0007] A lifting mechanism, which is fixedly mounted inside the carrying ring and is used to control the rise and fall of the wafer;

[0008] A clamping mechanism, wherein the clamping mechanism is fixedly mounted on the outside of the lifting mechanism, the clamping mechanism is used to cooperate with the lifting mechanism to work, and the clamping mechanism is also used to horizontally clamp the wafer;

[0009] The lifting mechanism includes an electric telescopic rod, which is slidably connected to the bottom surface of the base plate through a second sliding groove, and the electric telescopic rod is arranged directly below the middle of the carrying ring. The output end of the electric telescopic rod is fixedly connected to a pushing rod, and the pushing rod penetrates and is slidably connected to the middle upper surface of the carrying ring. The pushing rod is vertically arranged, and a positioning ring is slidably sleeved on the outer surface of the pushing rod, and the bottom surface of the positioning ring is fixedly connected to the middle upper surface of the carrying ring.

[0010] A driving ring is fixedly sleeved on the top outer surface of the pushing rod, and the bottom edge of the driving ring is elastically connected to the upper surface of the positioning ring through a spring. A loading plate is fixedly connected to the top outer surface of the driving ring. The loading plate is horizontally arranged and arranged on the same central axis as the driving ring. The diameter of the loading plate is smaller than the diameter of the carrying ring. When the wafer needs to be tested, the carrying ring can be pushed to slide in the first sliding groove on the upper surface of the bottom plate through the slider to move the carrying ring to the designated test location. Then the wafer can be placed on the upper surface of the loading plate and the electric telescopic rod can be started. After the electric telescopic rod is started, the pushing rod will be pushed upward. When the pushing rod moves upward, the driving ring on its top will be driven to move upward, thereby causing the loading plate to move upward, that is, the wafer is driven upward by the loading plate to test the wafer.

[0011] Preferably, the clamping mechanism includes an articulated seat, which is fixedly connected to the side of the driving ring, and three articulated seats are arranged at fixed intervals around the central axis of the driving ring. A movable groove is provided on the upper surface of the outer edge of the carrying ring, and three movable grooves are arranged at fixed intervals around the central axis of the carrying ring, and the articulated seat and the movable groove are arranged on the same straight line.

[0012] Preferably, a limit rod is fixedly connected to the inner surface of the movable groove, the limit rod is horizontally arranged, a connecting rod is rotatably connected to the hinge seat, and a side of the connecting rod away from the hinge seat is arranged in the movable groove.

[0013] Preferably, a limiting groove is horizontally penetrated through the outer surface of one side of the connecting rod away from the hinge seat, and the limiting rod is slidably arranged in the limiting groove. The two side surfaces of the end of the limiting rod away from the hinge seat are symmetrically connected to a rotating plate, and the end of the rotating plate away from the connecting rod is rotatably connected to a moving rod.

[0014] Preferably, the moving rod is vertically arranged, and positioning blocks are fixedly connected to the outer surfaces of both sides of the moving rod, and guide plates are symmetrically arranged on both sides of the moving rod, and one end of the guide plate away from the moving rod is fixedly connected to the outer surface of the carrying ring, and a guide groove is penetrated through the outer surface of the guide plate, and the positioning block is horizontally slidably connected in the guide groove. When the driving ring moves up to push the wafer up, it will also pull the connecting rod to one side of the driving ring through the hinge seat to retract, thereby causing the connecting rod to make relative displacement between the limiting groove opened on its surface and the limiting rod on the carrying ring, and pull the moving rod to approach the carrying ring through the rotating plate. Since the driving ring will be misaligned with the connecting rod when moving up, the driving ring will also drive the connecting rod to rotate along the limiting rod when rising, thereby causing the end of the connecting rod away from the driving ring to rotate downward, so that when the moving rod is pulled close to the carrying ring, the rotating plate will also be prompted to rotate, so as to ensure that the connecting rod can move normally.

[0015] Preferably, the top end of the movable rod is slidably connected to a mating rod up and down, the mating rod is vertically arranged, the outer surface of the mating rod close to the carrying ring is fixedly connected to a clamping plate, the clamping plate is arranged in an arc shape, the inner surface of the clamping plate is fixedly connected to a positioning plate, a plurality of positioning plates are arranged at fixed intervals along the inner surface of the clamping plate, the positioning plates are horizontally arranged, and the positioning plates are arranged parallel to each other.

[0016] Preferably, a transmission rod is fixedly connected to the bottom inner surface of the matching rod, and the transmission rod is arranged as a telescopic rod. One end of the transmission rod away from the matching rod is fixedly connected to the top outer surface of the driving ring, and three transmission rods are arranged at fixed intervals around the central axis of the driving ring.

[0017] Preferably, installation grooves are formed through the outer surfaces of both sides of the matching rod, and three installation grooves are arranged at fixed intervals along the outer surface of the matching rod. A synchronization tube is fixedly sleeved in the installation groove, and the three synchronization tubes are arranged as a group. The synchronization tubes are arranged in three groups, and synchronization rods are slidably inserted inside the adjacent synchronization tubes. When the driving ring moves upward, it will also drive the transmission rod on its outer surface to move upward. When the transmission rod moves upward horizontally, it will push the matching rod to move vertically upward at the top of the moving rod, so that the horizontal position relationship between the loading disk and the clamping plate remains unchanged.

[0018] The present invention provides a wafer testing and positioning device, which has the following beneficial effects:

[0019] 1. The wafer test positioning device, by setting up a lifting mechanism, can automatically and horizontally rise the wafer to the testing equipment without human intervention, thereby greatly improving production efficiency and reducing the occurrence of human errors. At the same time, the device can also be installed on the production line through the base plate, thereby realizing simultaneous production and testing, and the wafer can be directly tested during the horizontal rising process, which can reduce the number of times the wafer is transported between different testing equipment and reduce the risk of damage caused by transportation. At the same time, the automated wafer rising system can accurately control the position and height of the wafer, ensuring that the testing equipment can accurately align with the testing area of ​​the wafer, thereby improving the accuracy of the test, and the wafer horizontal rising mechanism can adapt to testing equipment at different heights, so that the same wafer can be tested on different testing equipment, thereby increasing the flexibility of the production line.

[0020] 2. In the wafer test positioning device, since the moving rod is horizontally slidably connected to the guide groove of the guide plate through the positioning blocks at both ends, the moving rod always maintains horizontal movement when it is close to the carrying ring, thereby achieving the position of the wafer to be adjusted by the moving rod when the wafer is lifted, so that the center of the wafer is consistent with the central axis of the loading plate, which greatly improves the test effect of the wafer.

[0021] 3. The wafer test positioning device, when the wafer is lifted by the loading plate, the clamping plate shrinks inward until the outer edge of the wafer is clamped between the positioning plates, thereby ensuring that the wafer is always in a plane when the wafer is lifted, greatly improving the test accuracy, and at the same time, by setting up multiple positioning plates, wafers of different sizes can be tested and fixed, and the wafer always remains horizontal during the test, greatly increasing the applicability of the device, and when the moving rod is close to the carrying ring, the synchronous tube and the synchronous rod in the mounting groove will shrink synchronously, and by setting the synchronous tube and the synchronous rod as a circular combination, it can be ensured that the shrinkage amplitude of the three clamping plates remains the same, thereby greatly improving the horizontal effect of the wafer when the wafer is fixed, further improving the test accuracy, and when the movement amplitudes between the clamping plates are the same, it means that the movement amplitudes of the three moving rods are the same, thereby prompting the drive ring to always keep moving vertically up and down, avoiding the problem of inaccurate test results caused by the tilt of the loading plate when moving. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a front view of the present invention;

[0023] Figure 2 It is a structural schematic diagram of the bottom plate of the present invention;

[0024] Figure 3 It is a structural schematic diagram of the lifting mechanism of the present invention;

[0025] Figure 4 It is a structural schematic diagram of the carrier ring of the present invention;

[0026] Figure 5 It is a structural schematic diagram of the clamping mechanism of the present invention;

[0027] Figure 6 It is a structural schematic diagram of the mobile rod of the present invention;

[0028] Figure 7 It is a structural schematic diagram of the matching rod of the present invention;

[0029] Figure 8 It is a structural schematic diagram of the linkage rod of the present invention.

[0030] In the figure: 1, bottom plate; 2, first slide groove; 3, load-bearing ring; 4, slider; 5, second slide groove; 6, lifting mechanism; 61, electric telescopic rod; 62, push rod; 63, positioning ring; 64, drive ring; 65, loading plate; 7, clamping mechanism; 71, hinge seat; 72, moving groove; 73, limit rod; 74, connecting rod; 75, limit groove; 76, rotating plate; 77, moving rod; 78, positioning block; 79, guide plate; 710, guide groove; 711, matching rod; 712, clamping plate; 713, positioning plate; 714, transmission rod; 715, installation groove; 716, synchronization pipe; 717, synchronization rod. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] First embodiment: Figures 1 to 8 As shown, the present invention provides a technical solution: a wafer test positioning device, comprising a base plate 1, a first slide groove 2 is symmetrically opened on the upper surface of the base plate 1, a bearing ring 3 is arranged on the upper surface of the base plate 1, a slider 4 is slidably connected in the first slide groove 2, and the slider 4 is fixedly connected to the bottom of the base plate 1 by bolts, and a second slide groove 5 is opened through the middle upper surface of the base plate 1, and the second slide groove 5 is opened between the two first slide grooves 2, and also includes:

[0033] A lifting mechanism 6, which is fixedly mounted inside the carrying ring 3 and is used to control the rise and fall of the wafer;

[0034] The clamping mechanism 7 is fixedly mounted on the outside of the lifting mechanism 6. The clamping mechanism 7 is used to cooperate with the lifting mechanism 6 to work. The clamping mechanism 7 is also used to horizontally clamp the wafer.

[0035] The lifting mechanism 6 includes an electric telescopic rod 61, which is slidably connected to the bottom surface of the base plate 1 through the second slide groove 5. The electric telescopic rod 61 is arranged just below the middle of the carrying ring 3. The output end of the electric telescopic rod 61 is fixedly connected to a push rod 62, which penetrates and slides through the middle upper surface of the carrying ring 3. The push rod 62 is vertically arranged, and a positioning ring 63 is slidably sleeved on the outer surface of the push rod 62. The bottom surface of the positioning ring 63 is fixedly connected to the middle upper surface of the carrying ring 3.

[0036] A driving ring 64 is fixedly sleeved on the top outer surface of the push rod 62, and the bottom edge of the driving ring 64 is elastically connected to the upper surface of the positioning ring 63 through a spring. A loading plate 65 is fixedly connected to the top outer surface of the driving ring 64. The loading plate 65 is horizontally arranged and arranged on the same central axis as the driving ring 64. The diameter of the loading plate 65 is smaller than the diameter of the carrying ring 3.

[0037] During operation, when the wafer needs to be tested, the carrying ring 3 can be pushed on the upper surface of the bottom plate 1 to slide in the first slide groove 2 through the slider 4, and the carrying ring 3 can be moved to the designated test location. Then the wafer can be placed on the upper surface of the loading plate 65, and the electric telescopic rod 61 can be started. After the electric telescopic rod 61 is started, it will push the pushing rod 62 upward. When the pushing rod 62 moves upward, it will drive the driving ring 64 on its top to move upward, thereby causing the loading plate 65 to move upward, that is, the wafer is driven to move upward through the loading plate 65, and the wafer is tested. By setting the lifting mechanism 6, the wafer can be automatically raised horizontally to the testing equipment without manual intervention, which is greatly Improve production efficiency and reduce the occurrence of human errors. At the same time, the device can also be installed on the production line through the base plate 1, so as to realize the simultaneous production and detection. The wafer can be directly detected during the horizontal rising process, which can reduce the number of times the wafer is transported between different detection equipment and reduce the risk of damage caused by transportation. At the same time, the automated wafer rising system can accurately control the position and height of the wafer, ensuring that the detection equipment can accurately align with the detection area of ​​the wafer, thereby improving the accuracy of the detection. The horizontal rising mechanism of the wafer can adapt to detection equipment at different heights, so that the same wafer can be detected on different detection equipment, thereby increasing the flexibility of the production line.

[0038] Second embodiment: Figures 1 to 8 As shown, the clamping mechanism 7 includes an articulated seat 71, which is fixedly connected to the side of the driving ring 64, and three articulated seats 71 are arranged at fixed intervals around the central axis of the driving ring 64. A movable groove 72 is provided on the upper surface of the outer edge of the carrying ring 3, and three movable grooves 72 are provided at fixed intervals around the central axis of the carrying ring 3. The articulated seat 71 and the movable groove 72 are arranged on the same straight line.

[0039] A limit rod 73 is fixedly connected to the inner surface of the movable groove 72 . The limit rod 73 is arranged horizontally. A connecting rod 74 is rotatably connected to the hinge seat 71 . The side of the connecting rod 74 away from the hinge seat 71 is arranged in the movable groove 72 .

[0040] A limiting groove 75 is horizontally penetrated through the outer surface of one side of the connecting rod 74 away from the hinge seat 71, and the limiting rod 73 is slidably set in the limiting groove 75. The two side surfaces of the end of the limiting rod 73 away from the hinge seat 71 are symmetrically connected to the rotating plate 76 for rotation, and the end of the rotating plate 76 away from the connecting rod 74 is connected to the moving rod 77 for rotation.

[0041] The moving rod 77 is arranged vertically, and positioning blocks 78 are fixedly connected to the outer surfaces of both sides of the moving rod 77. Guide plates 79 are symmetrically arranged on both sides of the moving rod 77. One end of the guide plate 79 away from the moving rod 77 is fixedly connected to the outer surface of the supporting ring 3. A guide groove 710 is opened through the outer surface of the guide plate 79, and the positioning block 78 is horizontally slidably connected in the guide groove 710.

[0042] When the drive ring 64 moves upward to push the wafer up, the connecting rod 74 will be pulled to shrink toward one side of the drive ring 64 through the hinge seat 71, so that the connecting rod 74 will move relative to the limiting rod 73 on the carrying ring 3 through the limiting groove 75 on its surface, and the moving rod 77 will be pulled closer to the carrying ring 3 through the rotating plate 76. Since the drive ring 64 will be misaligned with the connecting rod 74 when it moves upward, the connecting rod 74 will also be driven to rotate along the limiting rod 73 when the drive ring 64 rises, so that the connecting rod 74 will be away from the drive ring 64. One end of the ring 64 rotates downward, so that when the moving rod 77 is pulled close to the carrying ring 3, the rotating plate 76 will also be prompted to rotate to ensure that the connecting rod 74 can move normally. Since the moving rod 77 is horizontally slidably connected to the guide groove 710 of the guide plate 79 through the positioning blocks 78 at both ends, the moving rod 77 always maintains horizontal movement when approaching the carrying ring 3, thereby realizing the adjustment of the position of the wafer through the moving rod 77 when lifting the wafer, so that the center of the wafer is consistent with the central axis of the loading plate 65, which greatly improves the test effect of the wafer.

[0043] The third embodiment: Figures 1 to 8 As shown, the top end of the moving rod 77 is slidably connected to a matching rod 711, which is vertically arranged. The outer surface of the matching rod 711 close to the supporting ring 3 is fixedly connected to a clamping plate 712, which is arranged in an arc shape. The inner surface of the clamping plate 712 is fixedly connected to a positioning plate 713. A plurality of positioning plates 713 are arranged at fixed intervals along the inner surface of the clamping plate 712. The positioning plates 713 are horizontally arranged, and the positioning plates 713 are arranged parallel to each other.

[0044] A transmission rod 714 is fixedly connected to the bottom inner surface of the matching rod 711. The transmission rod 714 is set as a telescopic rod. One end of the transmission rod 714 away from the matching rod 711 is fixedly connected to the top outer surface of the driving ring 64. Three transmission rods 714 are set at fixed intervals around the central axis of the driving ring 64.

[0045] The outer surfaces of both sides of the matching rod 711 are penetrated with installation grooves 715. Three installation grooves 715 are arranged at fixed intervals along the outer surface of the matching rod 711. A synchronization tube 716 is fixedly sleeved in the installation groove 715. Three synchronization tubes 716 are arranged as a group. There are three groups of synchronization tubes 716. Synchronization rods 717 are slidably inserted into the inner parts of two adjacent synchronization tubes 716.

[0046] During operation, when the driving ring 64 moves upward, it will also drive the transmission rod 714 on its outer surface to move upward. When the transmission rod 714 moves upward horizontally, it will push the matching rod 711 to move vertically upward on the top of the moving rod 77, so that the horizontal position relationship between the loading plate 65 and the clamping plate 712 remains unchanged. When the wafer is lifted by the loading plate 65, the clamping plate 712 shrinks inward until the outer edge of the wafer is clamped between the positioning plates 713, thereby ensuring that the wafer is always in a plane when it is lifted, greatly improving the test accuracy. At the same time, by setting up multiple positioning plates 713, wafers of different sizes can be tested and fixed, and the wafer always remains horizontal during the test. , which greatly increases the applicability of the device. When the moving rod 77 is close to the carrying ring 3, the synchronization tube 716 and the synchronization rod 717 in the installation groove 715 will be synchronously contracted. By setting the synchronization tube 716 and the synchronization rod 717 as a circular combination, it can be ensured that the contraction amplitude of the three clamping plates 712 remains the same, thereby greatly improving the horizontal effect of the wafer when fixing the wafer, further improving the test accuracy, and when the movement amplitudes between the clamping plates 712 are the same, it means that the movement amplitudes of the three moving rods 77 are the same, thereby prompting the drive ring 64 to always maintain vertical up and down movement, avoiding the problem of inaccurate test results caused by the tilt of the loading plate 65 during movement.

[0047] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions. The sentence "includes an element defined by... does not exclude the existence of other identical elements in the process, method, article or device including the element".

Claims

1. A wafer testing and positioning device, comprising a base plate (1), characterized in that: The upper surface of the bottom plate (1) is symmetrically provided with a first slide groove (2), the upper surface of the bottom plate (1) is provided with a bearing ring (3), a slider (4) is slidably connected in the first slide groove (2), the slider (4) is fixedly connected to the bottom of the bottom plate (1) by bolts, a second slide groove (5) is penetrated through the middle upper surface of the bottom plate (1), the second slide groove (5) is provided between the two first slide grooves (2), and further comprises: A lifting mechanism (6), the lifting mechanism (6) is fixedly installed inside the carrying ring (3), and the lifting mechanism (6) is used to control the rise and fall of the wafer; A clamping mechanism (7), wherein the clamping mechanism (7) is fixedly mounted on the outside of the lifting mechanism (6), the clamping mechanism (7) is used to cooperate with the lifting mechanism (6) to work, and the clamping mechanism (7) is also used to horizontally clamp the wafer; The lifting mechanism (6) comprises an electric telescopic rod (61), which is slidably connected to the bottom surface of the base plate (1) through a second sliding groove (5), and the electric telescopic rod (61) is arranged directly below the middle of the carrying ring (3). The output end of the electric telescopic rod (61) is fixedly connected to a push rod (62), and the push rod (62) penetrates and is slidably connected to the middle upper surface of the carrying ring (3). The push rod (62) is vertically arranged, and the outer surface of the push rod (62) is slidably sleeved with a positioning ring (63), and the bottom surface of the positioning ring (63) is fixedly connected to the middle upper surface of the carrying ring (3).

2. A wafer testing and positioning device according to claim 1, characterized in that: A driving ring (64) is fixedly sleeved on the top outer surface of the push rod (62); the bottom edge of the driving ring (64) is elastically connected to the upper surface of the positioning ring (63) via a spring; a loading plate (65) is fixedly connected to the top outer surface of the driving ring (64); the loading plate (65) is horizontally arranged; the loading plate (65) and the driving ring (64) are arranged on the same central axis; the diameter of the loading plate (65) is smaller than the diameter of the carrying ring (3).

3. A wafer testing and positioning device according to claim 2, characterized in that: The clamping mechanism (7) comprises an articulated seat (71), the articulated seat (71) is fixedly connected to the side of the driving ring (64), three articulated seats (71) are arranged at fixed intervals around the central axis of the driving ring (64), a movable groove (72) is provided on the upper surface of the outer edge of the carrying ring (3), three movable grooves (72) are arranged at fixed intervals around the central axis of the carrying ring (3), and the articulated seat (71) and the movable groove (72) are arranged on the same straight line.

4. A wafer testing and positioning device according to claim 3, characterized in that: The inner surface of the movable groove (72) is fixedly connected to a limit rod (73), the limit rod (73) is arranged horizontally, and the hinge seat (71) is rotatably connected to a connecting rod (74), and the side of the connecting rod (74) away from the hinge seat (71) is arranged in the movable groove (72).

5. The wafer testing and positioning device according to claim 4, characterized in that: A limiting groove (75) is horizontally penetrated through the outer surface of one side of the linkage rod (74) away from the hinge seat (71), and the limiting rod (73) is slidably arranged in the limiting groove (75). The two side surfaces of one end of the limiting rod (73) away from the hinge seat (71) are symmetrically rotatably connected to a rotating plate (76), and one end of the rotating plate (76) away from the linkage rod (74) is rotatably connected to a moving rod (77).

6. The wafer testing and positioning device according to claim 5, characterized in that: The moving rod (77) is arranged vertically, and positioning blocks (78) are fixedly connected to the outer surfaces of both sides of the moving rod (77). Guide plates (79) are symmetrically arranged on both sides of the moving rod (77). One end of the guide plate (79) away from the moving rod (77) is fixedly connected to the outer surface of the supporting ring (3). A guide groove (710) is formed through the outer surface of the guide plate (79), and the positioning block (78) is horizontally slidably connected in the guide groove (710).

7. The wafer testing and positioning device according to claim 6, characterized in that: The top end of the movable rod (77) is slidably connected to a matching rod (711) up and down, and the matching rod (711) is vertically arranged. The outer surface of the matching rod (711) close to the supporting ring (3) is fixedly connected to a clamping plate (712), and the clamping plate (712) is arranged in an arc shape. The inner surface of the clamping plate (712) is fixedly connected to a positioning plate (713), and a plurality of positioning plates (713) are arranged at fixed intervals along the inner surface of the clamping plate (712). The positioning plates (713) are horizontally arranged, and the positioning plates (713) are arranged parallel to each other.

8. The wafer testing and positioning device according to claim 7, characterized in that: A transmission rod (714) is fixedly connected to the inner surface of the bottom of the matching rod (711); the transmission rod (714) is configured as a telescopic rod; one end of the transmission rod (714) away from the matching rod (711) is fixedly connected to the outer surface of the top of the driving ring (64); and three transmission rods (714) are arranged at fixed intervals around the central axis of the driving ring (64).

9. The wafer testing and positioning device according to claim 8, characterized in that: The outer surfaces of both sides of the matching rod (711) are penetrated with mounting grooves (715), and three mounting grooves (715) are arranged at fixed intervals along the outer surface of the matching rod (711). A synchronization tube (716) is fixedly sleeved in the mounting groove (715), and three synchronization tubes (716) are arranged as a group. The synchronization tubes (716) are arranged in three groups, and synchronization rods (717) are slidably inserted into the interiors of two adjacent synchronization tubes (716).

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