Bonding device, bonding method and storage medium

Abstract

The invention provides a bonding device, a bonding method and a computer readable storage medium. The bonding equipment comprises a rack, a wafer chuck and a bonding head. The wafer chuck is arranged on the rack and is used for adsorbing a first surface of a wafer from top to bottom, so that a to-be-bonded second surface of the wafer faces downwards. And the bonding head is mounted on the rack and is used for adsorbing the first surface of the chip from bottom to top and bonding the to-be-bonded second surface of the chip to the target position of the second surface of the wafer from bottom to top. According to the invention, the wafer to be bonded can be inversely placed so as to avoid the defect of the surface to be bonded caused by external pollution or damage, and the chip is bonded to the wafer from bottom to top so as to avoid the bonding error caused by the conversion of tension and pressure of the bonding head in the bonding process.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor device processing, and in particular to a bonding device, a bonding method, and a computer-readable storage medium. Background Art

[0002] In the prior art, C2W (Chip to Wafer) bonding equipment usually places the wafer upright on the wafer table, then picks up the chip through the bonding head and moves it to the optical system to take a picture and correct its posture. After that, the chip can be placed downward on the wafer through the bonding head with a relatively small force. However, in the existing C2W bonding equipment, the surface of the wafer to be bonded faces upward, which is prone to defects due to collisions with external devices and external contamination, and also places extremely high requirements on the cleanliness of the bonding environment. In addition, when bonding the chip from top to bottom, the transmission mechanism and adsorption surface of the bonding head are subjected to downward pulling force due to the influence of gravity before contacting the wafer. However, during the bonding process after the bonding head contacts the wafer, the transmission mechanism and adsorption surface are subjected to upward pressure provided by the wafer. The change in the direction of this force will form a significant deformation error on the transmission mechanism and adsorption surface, thereby affecting the bonding accuracy.

[0003] In order to overcome the above-mentioned defects of the prior art, an improved bonding device is urgently needed in the art to avoid defects on the bonding surface of the wafer due to external contamination or damage, and to avoid bonding errors caused by the conversion of tension and pressure of the bonding head during the bonding process. Summary of the invention

[0004] A brief summary of one or more aspects is given below to provide a basic understanding of these aspects. This summary is not an exhaustive overview of all conceived aspects, and is neither intended to identify the key or decisive elements of all aspects nor to define the scope of any or all aspects. Its only purpose is to give some concepts of one or more aspects in a simplified form as a prelude to a more detailed description that will be given later.

[0005] In order to overcome the above-mentioned defects in the prior art, the present invention provides a bonding device, a bonding method and a computer-readable storage medium, which can be used to avoid defects on the bonding surface due to external contamination or damage by placing the wafer to be bonded upside down, and to avoid bonding errors caused by the conversion of tension and pressure of the bonding head during the bonding process by bonding the chip to the wafer from bottom to top.

[0006] Specifically, the bonding device provided according to the first aspect of the present invention comprises a frame, a wafer chuck and a bonding head. The wafer chuck is arranged on the frame, and is used to absorb the first surface of the wafer from top to bottom, so that the second surface of the wafer to be bonded faces downward. The bonding head is installed on the frame, and is used to absorb the first surface of the chip from bottom to top, and bond the second surface of the chip to be bonded to the target position of the second surface of the wafer from bottom to top.

[0007] Furthermore, in some embodiments of the present invention, the bonding device further includes a gantry motion assembly, which includes at least one gantry base and at least one gantry beam. The at least one gantry base extends along a preset Y direction and is fixedly connected to the frame. The at least one gantry beam extends along a preset X direction, and its first slider is arranged in a first slide groove of the at least one gantry base, so that the gantry beam can be translated along the Y direction. The second slider of the bonding head is arranged in a second slide groove of the at least one gantry beam, so that the bonding head can be translated along the X direction.

[0008] Further, in some embodiments of the present invention, the bonding device further includes a first visual component, a second visual component and a controller. The first visual component is mounted on the wafer chuck, and is used to capture a first image of at least one first mark of the chip downward. The second visual component is mounted on the bonding head, and is used to capture a second image of at least one second mark of the wafer upward. The controller is configured to: parse the first image to determine the first coordinates of each first mark in the first image; parse the second image to determine the second coordinates of each second mark in the second image; align the chip to its target position according to the first coordinates and the second coordinates; and lift the bonding head to bond the second surface of the chip to the target position of the wafer from bottom to top.

[0009] Further, in some embodiments of the present invention, the translation range of the gantry motion assembly covers the chip picking station and the chip bonding station of the bonding head. The first visual component is installed between the chip picking station and the chip bonding station. The controller is also configured to: in response to the bonding head completing the picking of the chip, control the gantry motion assembly to translate the bonding head to the field of view area of ​​the first visual component to capture the first image via the first visual component; and in response to completing the acquisition of the first image, control the gantry motion assembly to translate the bonding head a second time to below the wafer chuck to capture the second image via the second visual component.

[0010] Furthermore, in some embodiments of the present invention, the step of aligning the chip to its target position according to the first coordinate and the second coordinate includes: determining the position deviation of the chip compared to the target position according to the coordinate difference between the first coordinate and the second coordinate, and the coordinate change of the secondary translation; and compensating for the position deviation via the gantry motion assembly to fine-tune the bonding head to the chip bonding station aligned with the target position.

[0011] Furthermore, in some embodiments of the present invention, the bonding device further includes a rotation mechanism. The step of aligning the chip to its target position according to the first coordinate and the second coordinate includes: determining the plane posture deviation of the chip compared to the target position according to the coordinate difference between the first coordinate and the second coordinate, and the coordinate change of the secondary translation; and compensating the plane posture deviation via the rotation mechanism to rotate the bonding head to the chip bonding station aligned with the target position.

[0012] Furthermore, in some embodiments of the present invention, the bonding device further includes a tilting mechanism. The controller is further configured to: before lifting the bonding head, first analyze the second image to determine the tilt angle of the bonding head relative to the second surface of the wafer; and compensate the tilt angle via the tilting mechanism to perform posture correction and leveling of the bonding head and the wafer.

[0013] Furthermore, in some embodiments of the present invention, the first visual component and the second visual component respectively include a plurality of visual units and a triangular prism. Each of the visual units includes a reflector, a lens and a camera to focus and image at least one mark of the corresponding imaging object through the triangular prism.

[0014] Furthermore, in some embodiments of the present invention, at least one of the visual units of the first visual component and / or the second visual component also includes a slide for adjusting the relative position of the field of view of the visual unit and the remaining visual units of the same visual component to adapt to the image acquisition requirements of at least one mark of imaging objects of various sizes.

[0015] In addition, the above-mentioned bonding method provided according to the second aspect of the present invention includes the following steps: via a wafer chuck of a bonding device as provided in the first aspect of the present invention, the first surface of the wafer is adsorbed from top to bottom so that the second surface of the wafer to be bonded faces downward; and via a bonding head of the bonding device, the first surface of the chip is adsorbed from bottom to top, and the second surface of the chip to be bonded is bonded from bottom to top to the target position of the second surface of the wafer.

[0016] In addition, the computer-readable storage medium provided in the third aspect of the present invention stores computer instructions, which, when executed by a processor, implement the bonding method provided in the second aspect of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The above features and advantages of the present invention can be better understood after reading the detailed description of the embodiments of the present disclosure in conjunction with the following drawings. In the drawings, the components are not necessarily drawn to scale, and components with similar related properties or features may have the same or similar reference numerals.

[0018] Figure 1 A schematic structural diagram of a bonding device provided according to some embodiments of the present invention is shown.

[0019] Figure 2 A schematic structural diagram of a gantry motion assembly provided according to some embodiments of the present invention is shown.

[0020] Figure 3 A schematic structural diagram of a first visual component provided according to some embodiments of the present invention is shown.

[0021] Figure 4 A schematic structural diagram of a second visual component provided according to some embodiments of the present invention is shown.

[0022] Figure 5 A schematic flow chart of a bonding method provided according to some embodiments of the present invention is shown. DETAILED DESCRIPTION

[0023] The following specific embodiments illustrate the implementation of the present invention, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. Although the description of the present invention will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this invention are limited to this implementation. On the contrary, the purpose of introducing the invention in conjunction with the implementation is to cover other options or modifications that may be extended based on the claims of the present invention. In order to provide a deep understanding of the present invention, the following description will include many specific details. The present invention can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present invention, some specific details will be omitted in the description.

[0024] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0025] In addition, the terms "upper", "lower", "left", "right", "top", "bottom", "horizontal" and "vertical" used in the following description should be understood as the directions shown in the paragraph and the related drawings. Such relative terms are only used for the convenience of description and do not mean that the device described therein must be manufactured or operated in a specific direction, and therefore should not be understood as limiting the present invention.

[0026] It is understood that although the terms "first", "second", "third", etc. may be used herein to describe various components, regions, layers and / or parts, these components, regions, layers and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers and / or parts. Therefore, the first component, region, layer and / or part discussed below may be referred to as a second component, region, layer and / or part without departing from some embodiments of the present invention.

[0027] As mentioned above, in the existing C2W bonding equipment, the surface of the wafer to be bonded faces upward, which is prone to defects due to collisions with external devices and external contamination, and also places extremely high requirements on the cleanliness of the bonding environment. In addition, when bonding chips from top to bottom, the transmission mechanism and adsorption surface of the bonding head are subjected to downward pulling force due to the influence of gravity before they contact the wafer. However, during the bonding process after the bonding head contacts the wafer, the transmission mechanism and adsorption surface are subjected to upward pressure provided by the wafer. The change in the direction of this force will cause significant deformation errors on the transmission mechanism and adsorption surface, thereby affecting the bonding accuracy.

[0028] In order to overcome the above-mentioned defects in the prior art, the present invention provides a bonding device, a bonding method and a computer-readable storage medium, which can be used to avoid defects on the bonding surface due to external contamination or damage by placing the wafer to be bonded upside down, and to avoid bonding errors caused by the conversion of tension and pressure of the bonding head during the bonding process by bonding the chip to the wafer from bottom to top.

[0029] Please refer to the reference for details Figure 1 to Figure 4 . Figure 1 A schematic structural diagram of a bonding device provided according to some embodiments of the present invention is shown. Figure 2A schematic structural diagram of a gantry motion assembly provided according to some embodiments of the present invention is shown. Figure 3 A schematic structural diagram of a first visual component provided according to some embodiments of the present invention is shown. Figure 4 A schematic structural diagram of a second visual component provided according to some embodiments of the present invention is shown.

[0030] exist Figure 1 In the illustrated embodiment, the bonding device provided by the first aspect of the present invention comprises a frame 11, a wafer chuck 12 and a bonding head 13. Here, the wafer chuck 12 is arranged on the frame 11, and is used to absorb the first surface of the wafer 17 from top to bottom, so that the second surface of the wafer 17 to be bonded faces downward. The bonding head 13 is installed on the frame 11, and is used to absorb the first surface of the chip 18 from bottom to top, and bond the second surface of the chip 18 to be bonded to the target position of the second surface of the wafer 17 from bottom to top.

[0031] In addition, Figure 1 and Figure 2 In the illustrated embodiment, the bonding device provided by the first aspect of the present invention further includes a gantry motion assembly 14. Here, the gantry motion assembly 14 includes at least one gantry base 141 and at least one gantry beam 142. The gantry base 141 extends along a preset Y direction and is fixedly connected to the frame 11. The gantry beam 142 extends along a preset X direction, and its first slider is arranged in the first slide groove of at least one gantry base 141, so that the gantry beam 142 can be translated along the Y direction. The second slider of the bonding head 13 is arranged in the second slide groove of at least one gantry beam 142, so that the bonding head 13 can be translated along the X direction.

[0032] In addition, Figure 1 In the illustrated embodiment, the bonding device provided by the first aspect of the present invention further includes a first visual component 15 and a second visual component 16. Here, the first visual component 15 is mounted on the wafer chuck 12, and is used to capture a first image of at least one first mark of the chip 18 downward. The second visual component 16 is mounted on the bonding head 13, and is used to capture a second image of at least one second mark of the wafer 17 upward.

[0033] Further, in Figure 3 and Figure 4 In the illustrated embodiment, the first visual component 15 and the second visual component 16 respectively include a plurality of visual units and a triangular prism. Each visual unit includes a reflector, a lens, and a camera to focus and image at least one mark of the corresponding imaging object through the triangular prism. Here, the imaging object is a wafer or a chip.

[0034] In addition, Figure 3 and Figure 4In the illustrated embodiment, at least one visual unit of the first visual component 15 and / or the second visual component 16 further includes a slide for adjusting the relative position of the visual unit and the field of view of the remaining visual units of the same visual component to meet the image acquisition requirements of at least one mark of imaging objects of various sizes. Here, the imaging object is a wafer or a chip.

[0035] Specifically, in Figure 3 In the illustrated embodiment, the first visual component 15 includes a first reflector 151, a second reflector 152, a first lens 153, a second lens 154, a first camera 155, a second camera 156, a first triangular prism 157, a first slide 158, and a second slide 159. Here, the first slide 158 and the second slide 159 are used to make the left and right marks on the imaging object be located at the center of the field of view of the first camera 155 and the second camera 156, respectively.

[0036] Similarly, in Figure 4 In the illustrated embodiment, the second visual assembly includes a third reflector 161, a fourth reflector 162, a third lens 163, a fourth lens 164, a third camera 165, a fourth camera 166, a second triangular prism 167, a third slide 168, and a fourth slide 169. Here, the third slide 168 and the fourth slide 169 are used to make the left and right marks on the imaging object be located at the center of the field of view of the third camera 165 and the fourth camera 166, respectively.

[0037] In some non-limiting embodiments, the bonding device provided in the first aspect of the present invention includes a memory and a controller. Here, the memory includes but is not limited to the computer-readable storage medium provided in the third aspect, on which computer instructions are stored. The controller is connected to the memory and is configured to execute the computer instructions stored in the memory to implement the bonding method provided in the second aspect of the present invention.

[0038] The working principle of the above-mentioned bonding device will be described below in conjunction with some embodiments of the bonding method. Those skilled in the art will understand that these embodiments of the bonding method are only some non-limiting implementation methods provided by the present invention, which are intended to clearly demonstrate the main concept of the present invention and provide some specific solutions that are convenient for the public to implement, rather than limiting all functions or all working modes of the bonding device. Similarly, the bonding device is also only a non-limiting implementation method provided by the present invention, and does not constitute a limitation on the execution subject and execution order of each step in these bonding methods.

[0039] Please refer to Figure 5 . Figure 5 A schematic flow chart of a bonding method provided according to some embodiments of the present invention is shown.

[0040] like Figure 5 As shown, the controller can suck the first surface of the wafer 17 from top to bottom via the wafer chuck 12 of the bonding device provided in the first aspect of the present invention, so that the second surface of the wafer 17 to be bonded faces downward.

[0041] Specifically, in some preferred embodiments, the translation range of the gantry motion assembly 14 covers the chip pickup station of the bonding head 13 and the chip bonding station directly below the wafer chuck 12. The first vision assembly 15 is installed between the chip pickup station and the chip bonding station. Here, in response to the bonding head 13 completing the pickup of the chip 18, the controller can also control the gantry motion assembly 14 to translate the bonding head 13 to the field of view area of ​​the first vision assembly 15, so as to capture the first image via the first vision assembly 15.

[0042] Afterwards, in response to completing the acquisition of the first image, the controller may control the gantry motion assembly 14 to translate the bonding head 13 a second time to below the wafer chuck 12 to acquire the second image via the second vision assembly 16 .

[0043] Afterwards, the controller can adsorb the first surface of the chip 18 from bottom to top via the bonding head 13 of the bonding device, and bond the second surface to be bonded of the chip 18 to the target position of the second surface of the wafer 17 from bottom to top.

[0044] Specifically, the controller may first analyze the first image captured by the first visual component 15 to determine the first coordinates of each first mark in the first image.

[0045] Thereafter, the controller may analyze the second image acquired via the second visual component 16 to determine the second coordinates of each second mark in the second image.

[0046] Thereafter, the controller may align the chip 18 to its target position according to the first coordinate and the second coordinate.

[0047] Specifically, the controller can determine the position deviation (Δx, Δy) of the chip 18 compared to the target position based on the coordinate difference between the first coordinate and the second coordinate, and the coordinate change of the secondary translation, and compensate for the position deviation through the gantry motion assembly 14 to fine-tune the bonding head 13 to the chip bonding station aligned with the target position.

[0048] In addition, in some optional embodiments, the above-mentioned bonding device provided by the first aspect of the present invention further includes a rotation mechanism. Here, the controller can also determine the plane posture deviation Δθ of the chip 18 compared to the target position according to the coordinate difference between the first coordinate and the second coordinate, and the coordinate change of the secondary translation, and compensate the plane posture deviation via the rotation mechanism to rotate the bonding head 13 to the chip bonding station aligned with the target position.

[0049] Afterwards, the controller may lift the bonding head 13 to bond the second surface of the chip 18 to the target position of the wafer 17 from bottom to top.

[0050] In addition, in some preferred embodiments, the bonding device provided in the first aspect of the present invention further includes a tilting mechanism. Here, the controller may also analyze the second image before lifting the bonding head 13 to determine the tilt angle of the bonding head 13 relative to the second surface of the wafer 17, and compensate the tilt angle via the tilting mechanism to perform posture correction and leveling of the bonding head 13 and the wafer 17.

[0051] In summary, the above-mentioned bonding equipment, bonding method and computer-readable storage medium provided by the present invention can be used to avoid defects on the bonding surface due to external contamination or damage by placing the wafer to be bonded inverted, and to avoid bonding errors caused by the conversion of tension and pressure of the bonding head during the bonding process by bonding the chip to the wafer from bottom to top.

[0052] Although the above methods are illustrated and described as a series of actions for simplicity of explanation, it should be understood and appreciated that these methods are not limited by the order of the actions, because according to one or more embodiments, some actions may occur in a different order and / or concurrently with other actions from those illustrated and described herein or not illustrated and described herein but understandable to those skilled in the art.

[0053] Although the controller described in the above embodiments can be implemented by a combination of software and hardware. However, it is understood that the controller can also be implemented in software and hardware. For hardware implementation, the controller can be implemented in one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), processors, controllers, microcontrollers, microprocessors, other electronic devices for performing the above functions, or a selection combination of the above devices. For software implementation, the controller can be implemented by independent software modules such as procedures and functions running on a general-purpose chip, each of which performs one or more functions and operations described herein.

[0054] The steps of the method or algorithm described in conjunction with the embodiments disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. The software module may reside in a RAM memory, a flash memory, a ROM memory, an EPROM memory, an EEPROM memory, a register, a hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art. An exemplary storage medium is coupled to a processor so that the processor can read and write information from / to the storage medium. In an alternative, a storage medium may be integrated into a processor. The processor and the storage medium may reside in an ASIC. The ASIC may reside in a user terminal. In an alternative, the processor and the storage medium may reside in a user terminal as discrete components.

[0055] In one or more exemplary embodiments, the functions described may be implemented in hardware, software, firmware, or any combination thereof. If implemented as a computer program product in software, each function may be stored on or transmitted by a computer-readable medium as one or more instructions or codes. Computer-readable media include both computer storage media and communication media, including any medium that facilitates the transfer of a computer program from one place to another. Storage media may be any available medium that can be accessed by a computer. As an example and not limitation, such a computer-readable medium may include RAM, ROM, EEPROM, CD-ROM or other optical disk storage, disk storage or other magnetic storage device, or any other medium that can be used to carry or store the desired program code in the form of an instruction or data structure and can be accessed by a computer. Any connection is also properly referred to as a computer-readable medium. For example, if the software is transmitted from a website, a server, or other remote source using a coaxial cable, a fiber optic cable, a twisted pair, a digital subscriber line (DSL), or wireless technologies such as infrared, radio, and microwaves, the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwaves are included in the definition of the medium. Disk and disc as used herein include compact disc (CD), laser disc, optical disc, digital versatile disc (DVD), floppy disk and Blu-ray disc, wherein disk often reproduces data magnetically, while disc reproduces data optically with lasers. Combinations of the above should also be included within the scope of computer-readable media.

[0056] The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein, but should be granted the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A bonding device, characterized in that: include: frame; A wafer chuck is arranged on the frame and is used to absorb the first surface of the wafer from top to bottom so that the second surface of the wafer to be bonded faces downward; as well as The bonding head is installed on the frame and is used to absorb the first surface of the chip from bottom to top, and bond the second surface to be bonded of the chip to the target position of the second surface of the wafer from bottom to top.

2. The bonding device according to claim 1, characterized in that The bonding device also includes a gantry motion assembly, which includes: At least one gantry base extending along a preset Y direction and fixedly connected to the frame; and At least one gantry beam extends along a preset X direction, and its first slider is arranged in a first slide groove of the at least one gantry base so that the gantry beam can be translated along the Y direction, wherein the second slider of the bonding head is arranged in a second slide groove of the at least one gantry beam so that the bonding head can be translated along the X direction.

3. The bonding device according to claim 2, characterized in that Also includes: A first visual component, mounted on the wafer chuck, for downwardly capturing a first image of at least one first mark of the chip; A second visual component, mounted on the bonding head, for upwardly capturing a second image of at least one second mark of the wafer; as well as A controller configured to: parse the first image to determine first coordinates of each first mark in the first image; parsing the second image to determine the second coordinates of each second mark in the second image; aligning the chip to its target position according to the first coordinates and the second coordinates; And the bonding head is lifted to bond the second surface of the chip to the target position of the wafer from bottom to top.

4. The bonding device according to claim 3, characterized in that The translation range of the gantry motion assembly covers the chip picking station and the chip bonding station of the bonding head, the first visual assembly is installed between the chip picking station and the chip bonding station, and the controller is further configured as follows: In response to the bonding head completing the picking up of the chip, controlling the gantry motion component to translate the bonding head to the field of view area of ​​the first vision component, so as to acquire the first image via the first vision component; as well as In response to completing the acquisition of the first image, the gantry motion assembly is controlled to translate the bonding head a second time to below the wafer chuck to acquire the second image via the second vision assembly.

5. The bonding device according to claim 4, characterized in that The step of aligning the chip to its target position according to the first coordinate and the second coordinate comprises: Determining a position deviation of the chip relative to the target position according to a coordinate difference between the first coordinate and the second coordinate and a coordinate change of the secondary translation; and The position deviation is compensated via the gantry motion assembly to fine-tune the bonding head to a chip bonding station aligned with the target position.

6. The bonding device according to claim 4, characterized in that The bonding device further includes a rotating mechanism, and the step of aligning the chip to its target position according to the first coordinate and the second coordinate includes: Determining a plane posture deviation of the chip relative to the target position according to a coordinate difference between the first coordinate and the second coordinate and a coordinate change of the secondary translation; and The plane posture deviation is compensated by the rotation mechanism to rotate the bonding head to a chip bonding station aligned with the target position.

7. The bonding device according to claim 3, characterized in that The bonding device further includes a tilting mechanism, and the controller is further configured to: Before lifting the bonding head, analyzing the second image to determine a tilt angle of the bonding head relative to the second surface of the wafer; and The tilt angle is compensated by the tilt mechanism to perform posture correction and leveling of the bonding head and the wafer.

8. The bonding device according to claim 3, characterized in that The first visual component and the second visual component respectively include a plurality of visual units and a triangular prism, wherein each of the visual units respectively includes a reflector, a lens and a camera to focus and image at least one mark of the corresponding imaging object through the triangular prism.

9. The bonding device according to claim 8, characterized in that At least one of the visual units of the first visual component and / or the second visual component also includes a slide for adjusting the relative position of the field of view of the visual unit and the remaining visual units of the same visual component to adapt to the image acquisition requirements of at least one mark of imaging objects of various sizes.

10. A bonding method, characterized in that: The following steps are involved: Using a wafer chuck of the bonding device according to any one of claims 1 to 9, sucking the first surface of the wafer from top to bottom so that the second surface of the wafer to be bonded faces downward; as well as The bonding head of the bonding device adsorbs the first surface of the chip from bottom to top, and bonds the second surface of the chip to be bonded to the target position of the second surface of the wafer from bottom to top.

11. A computer-readable storage medium having computer instructions stored thereon, characterized in that: When the computer instructions are executed by a processor, the bonding method according to claim 10 is implemented.

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