Chip stripping assembly, bonding equipment, chip stripping method and storage medium

Abstract

The invention provides a chip stripping assembly, a bonding device, a chip stripping method and a computer readable storage medium. The chip stripping assembly comprises a plurality of stripping heads and a vertical rotary sliding table. And the plurality of stripping heads are arranged on the vertical rotary sliding table along a vertical plane, are mutually kept at preset angle intervals, and are used for stripping various chips with different sizes. And the vertical rotary sliding table rotates along the vertical plane and is used for rotating a first stripping head with the size of the chip upwards so as to strip the chip from a sample to be stripped through the first stripping head and rotating at least one second stripping head which is not matched with the size of the chip towards the side and / or the lower part. According to the invention, the requirement of dismounting and replacing the stripping head can be canceled, so that the overall efficiency of continuously stripping different chips with various sizes is improved.

Description

Technical Field

[0001] The present invention relates to the field of processing of semiconductor devices, and in particular to a chip peeling component, a bonding device, a chip peeling method, and a computer-readable storage medium. Background Art

[0002] Chip peeling technology (peeling off) is widely used in the testing and packaging of high-performance chip devices such as CPU, DSP, LED and RFID, and is the key to improving the quality and efficiency of chip packaging and testing. There are many specifications of chips used for bonding on the market, and the peeling head in a bonding device can only peel chips of one specification. However, since the peeling heads in existing bonding equipment cannot be replaced automatically, when chips of other specifications need to be peeled off, the peeling heads need to be replaced manually, resulting in a lot of time being wasted, thereby reducing the efficiency of the chip. In addition, the peeling heads in existing bonding equipment occupy a large space, which makes it impossible to perform batch integration and synchronous operation of multiple chip peeling components. In addition, its idle peeling head is still placed upward, which is prone to damage to its accuracy by falling objects and dust from above.

[0003] In order to overcome the above-mentioned defects of the prior art, the art is in urgent need of an improved chip stripping assembly to eliminate the need to disassemble and replace the stripping head, thereby improving the overall efficiency of continuously stripping different chips of multiple sizes, and saving planar space, thereby facilitating batch integration and synchronous operation of multiple chip stripping assemblies, while preventing falling objects and dust from above from damaging the high-precision stripping head. Summary of the invention

[0004] A brief summary of one or more aspects is given below to provide a basic understanding of these aspects. This summary is not an exhaustive overview of all conceived aspects, and is neither intended to identify the key or decisive elements of all aspects nor to define the scope of any or all aspects. Its only purpose is to give some concepts of one or more aspects in a simplified form as a prelude to a more detailed description that will be given later.

[0005] In order to overcome the above-mentioned defects in the prior art, the present invention provides a chip stripping assembly, a bonding device, a chip stripping method and a computer-readable storage medium, which can automatically switch the stripping head to eliminate the need to disassemble and replace the stripping head, thereby improving the overall efficiency of continuously stripping different chips of various sizes. In addition, the stripping head can be rotated vertically to save plane space, thereby facilitating batch integration and synchronous operation of multiple chip stripping assemblies. In addition, the idle stripping head can be turned to the side or downward to prevent falling objects and dust from above from damaging the high-precision stripping head.

[0006] Specifically, the chip stripping assembly provided according to the first aspect of the present invention comprises a plurality of stripping heads and a vertical rotating slide. The plurality of stripping heads are mounted on the vertical rotating slide along a vertical plane and maintain a preset angular interval with each other, and are used to strip chips of various sizes. The vertical rotating slide rotates along the vertical plane, and is used to rotate the first stripping head of the size of the chip upward, so as to strip the chip from the sample to be stripped via the first stripping head, and rotate at least one second stripping head of a size that does not match the chip toward the side and / or downward.

[0007] Furthermore, in some embodiments of the present invention, the chip stripping assembly also includes a controller, which is configured to: obtain size information of the chip to be stripped; select a corresponding first stripping head from the multiple stripping heads based on the size information; and rotate the first stripping head upward via the vertical rotating slide, and rotate the remaining second stripping heads to the side and / or downward.

[0008] Furthermore, in some embodiments of the present invention, the chip stripping assembly further includes a camera module. The controller is further configured to: in response to the first stripping head being rotated upward, collect an image of the first stripping head via the camera module; analyze the image to determine the tilt angle of the first stripping head relative to the chip; and fine-tune the vertical rotating slide according to the tilt angle to level the first stripping head and the chip.

[0009] Furthermore, in some embodiments of the present invention, the chip stripping assembly further includes a lifting mechanism for supporting and lifting the vertical rotary slide. The controller is further configured to: analyze the image to determine the actual height of the first stripping head; and adjust the lifting mechanism according to the difference between the actual height and the height of the workstation for stripping the chip to compensate for the height difference between the stripping heads.

[0010] Further, in some embodiments of the present invention, the lifting mechanism includes a vertical lifting slide and / or a lifting cylinder. The vertical lifting slide includes a base, a first support seat, a first motor, a lead screw, a lead screw nut and a plurality of connecting rods. The vertical rotating slide is arranged on the first support seat. The first support seat is arranged on the base via the plurality of connecting rods. The first motor drives the lead screw to rotate according to the height adjustment instruction provided by the controller. The outer side of the lead screw nut is connected to the plurality of connecting rods, and the inner side thereof is threadedly connected to the lead screw to adjust the angle between the plurality of connecting rods as the lead screw rotates, thereby adjusting the height of the first support seat. The lifting cylinder includes a second support seat, a piston rod, a piston, a cylinder body and an air source. The vertical rotating slide is arranged on the second support seat. Vents are respectively arranged at both ends of the cylinder body. The piston is located inside the cylinder body and isolates each of the vents. The air source is connected to each of the vents, and inflates or exhausts air to each of the vents according to the height adjustment instruction provided by the controller, so as to drive the piston to move between the vents. The second support seat is connected to the piston via the piston rod, and lifts each of the stripping heads on the vertical rotating slide as the piston moves.

[0011] Furthermore, in some embodiments of the present invention, the controller is also configured to: in response to completing the leveling and height difference compensation of the first stripping head, lift the vertical rotating slide via the lifting mechanism so that the first stripping head squeezes the back side of the sample to be stripped, and cooperates with the picking head to strip the chip from the sample to be stripped.

[0012] Further, in some embodiments of the present invention, the vertical rotating slide includes a second motor, a coupling, a worm, a turbine and a slide body. The multiple stripping heads are mounted on the slide body along a vertical plane. The slide body is fixedly connected to the turbine. The edge of the turbine is provided with a toothed structure to engage with the threaded portion of the worm. The worm is connected to the second motor via the coupling. The second motor drives the worm to rotate according to the angle adjustment instruction provided by the controller, so as to drive the turbine and the slide body to rotate along the vertical plane via its threaded portion and the toothed structure, thereby rotating the first stripping head of the size of the chip upward, and / or leveling the first stripping head with the chip.

[0013] Further, in some embodiments of the present invention, the stripping head includes a stripping head body, three groups of ejector pins, and two groups of springs with different elastic coefficients. The first group of ejector pins is aligned with the edge area of ​​the chip and is rigidly connected to the stripping head body. It is first lifted up as the stripping head body rises to strip the edge area of ​​the chip. The second group of ejector pins is aligned with the middle area between the edge area and the center area of ​​the chip and is connected to the stripping head body via a first spring with a smaller elastic coefficient. After the first spring is completely deformed, it is lifted up as the stripping head body continues to rise to strip the middle area of ​​the chip. The third group of ejector pins is aligned with the center area of ​​the chip and is connected to the stripping head body via a second spring with a larger elastic coefficient. After the first spring and the second spring are completely deformed, it is lifted up as the stripping head body continues to rise to strip the center area of ​​the chip.

[0014] In addition, the above-mentioned bonding equipment provided according to the second aspect of the present invention comprises a bonding head, a pick-up head and a chip peeling assembly as provided in the first aspect of the present invention. The bonding head is used to bond the chip to be bonded to its target position. The pick-up head is used to pick up the chip from the sample to be peeled and transfer it to the bonding head. The chip peeling assembly is used to squeeze the sample to be peeled from the back side after the pick-up head absorbs the chip from the front side, so as to peel the chip from the sample to be peeled.

[0015] In addition, the above-mentioned chip stripping method provided according to the third aspect of the present invention includes the following steps: obtaining size information of the chip to be stripped; selecting a corresponding first stripping head from multiple stripping heads of a chip stripping assembly provided in the first aspect of the present invention according to the size information; rotating the first stripping head upward via the vertical rotating slide of the chip stripping assembly, and rotating the remaining second stripping heads to the side and / or downward; and lifting the vertical rotating slide so that it squeezes the sample to be stripped from the back to strip the chip from the sample to be stripped.

[0016] In addition, the computer-readable storage medium provided in the fourth aspect of the present invention stores computer instructions, which, when executed by a processor, implement the chip stripping method provided in the first aspect of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The above features and advantages of the present invention can be better understood after reading the detailed description of the embodiments of the present disclosure in conjunction with the following drawings. In the drawings, the components are not necessarily drawn to scale, and components with similar related properties or features may have the same or similar reference numerals.

[0018] Figure 1A schematic structural diagram of a chip peeling assembly provided according to some embodiments of the present invention is shown.

[0019] Figure 2 A schematic structural diagram of a chip peeling assembly provided according to some embodiments of the present invention is shown.

[0020] Figure 3 A schematic structural diagram of a vertical lifting slide provided according to some embodiments of the present invention is shown.

[0021] Figure 4 A simplified structural schematic diagram of a vertical lifting slide provided according to some embodiments of the present invention is shown.

[0022] Figure 5 A schematic structural diagram of a lifting cylinder provided according to some embodiments of the present invention is shown.

[0023] Figure 6 A simplified structural schematic diagram of a lifting cylinder provided according to some embodiments of the present invention is shown.

[0024] Figure 7 A schematic structural diagram of a vertical rotating slide provided according to some embodiments of the present invention is shown.

[0025] Figure 8 A partial structural schematic diagram of a vertical rotating slide provided according to some embodiments of the present invention is shown.

[0026] Fig. 9 A schematic structural diagram of a stripping head provided according to some embodiments of the present invention is shown.

[0027] Fig.10 A top view of three groups of ejector pins provided according to some embodiments of the present invention is shown.

[0028] Fig.11 A schematic structural diagram of a chip provided according to some embodiments of the present invention is shown.

[0029] Fig.12 A schematic flow chart of a chip peeling method provided according to some embodiments of the present invention is shown. DETAILED DESCRIPTION

[0030] The following specific embodiments illustrate the implementation of the present invention, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. Although the description of the present invention will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this invention are limited to this implementation. On the contrary, the purpose of introducing the invention in conjunction with the implementation is to cover other options or modifications that may be extended based on the claims of the present invention. In order to provide a deep understanding of the present invention, the following description will include many specific details. The present invention can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present invention, some specific details will be omitted in the description.

[0031] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0032] In addition, the terms "upper", "lower", "left", "right", "top", "bottom", "horizontal" and "vertical" used in the following description should be understood as the directions shown in the paragraph and the related drawings. Such relative terms are only used for the convenience of description and do not mean that the device described therein must be manufactured or operated in a specific direction, and therefore should not be understood as limiting the present invention.

[0033] It is understood that although the terms "first", "second", "third", etc. may be used herein to describe various components, regions, layers and / or parts, these components, regions, layers and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers and / or parts. Therefore, the first component, region, layer and / or part discussed below may be referred to as a second component, region, layer and / or part without departing from some embodiments of the present invention.

[0034] As mentioned above, there are many specifications of chips used for bonding on the market, and the stripping head in a bonding device can only strip chips of one specification. However, since the stripping heads in existing bonding devices cannot be replaced automatically, when chips of other specifications need to be stripped, the stripping heads need to be replaced manually, resulting in a large waste of time, thereby reducing the efficiency of the chip. In addition, the stripping heads in existing bonding devices occupy a large space, making it impossible to perform batch integration and synchronous operation of multiple chip stripping components. In addition, the idle stripping heads are still placed upwards, which can easily cause problems such as falling objects and dust from above damaging their accuracy.

[0035] In order to overcome the above-mentioned defects in the prior art, the present invention provides a chip stripping assembly, a bonding device, a chip stripping method and a computer-readable storage medium, which can automatically switch the stripping head to eliminate the need to disassemble and replace the stripping head, thereby improving the overall efficiency of continuously stripping different chips of various sizes. In addition, the stripping head can be rotated vertically to save plane space, thereby facilitating batch integration and synchronous operation of multiple chip stripping assemblies. In addition, the idle stripping head can be turned to the side or downward to prevent falling objects and dust from above from damaging the high-precision stripping head.

[0036] In some non-limiting embodiments, the chip stripping assembly provided in the first aspect of the present invention can be configured in the bonding device provided in the second aspect of the present invention for implementation. Specifically, the bonding device provided in the second aspect of the present invention includes a bonding head, a pick-up head and a chip stripping assembly as provided in the first aspect of the present invention. Here, the bonding head is used to bond the chip to be bonded to its target position. The pick-up head is used to pick up the chip from the sample to be stripped and transfer it to the bonding head. The chip stripping assembly is used to squeeze the sample to be stripped from the back side after the pick-up head adsorbs the chip from the front side, so as to strip the chip from the sample to be stripped.

[0037] Please refer to the reference for details Figure 1 and Figure 2 . Figure 1 A schematic structural diagram of a chip peeling assembly provided according to some embodiments of the present invention is shown. Figure 2 A schematic structural diagram of a chip peeling assembly provided according to some embodiments of the present invention is shown.

[0038] exist Figure 1 and Figure 2 In the illustrated embodiment, the chip stripping assembly provided by the first aspect of the present invention includes a plurality of stripping heads 11-14 and a vertical rotating slide 15. Here, the plurality of stripping heads 11-14 are mounted on the vertical rotating slide 15 along a vertical plane and maintain a preset angle interval with each other, and are used to strip chips of various sizes. The vertical rotating slide 15 rotates along a vertical plane, and is used to rotate the first stripping head 11 of the size of the chip upward, so as to strip the chip from the sample to be stripped via the first stripping head 11, and rotate at least one second stripping head 12-14 of a size that does not match the chip toward the side and / or downward.

[0039] Specifically, each stripping head 11 to 14 corresponds to chips of different sizes. For example, the first stripping head 11 can correspond to stripping chips of 1mm*1mm, 1mm*2mm, 1mm*3mm, 3mm*3mm, 3mm*6mm and 5mm*5mm. The second stripping head 12 can correspond to stripping chips of 3mm*9mm, 5mm*10mm and 5mm*15mm. The third stripping head 13 can correspond to stripping chips of 12.5mm*12.8mm. The fourth stripping head 14 can correspond to stripping chips of 5mm*15mm, 11mm*33mm, 16mm*33mm and 26mm*33mm.

[0040] In addition, Figure 1 and Figure 2 In the illustrated embodiment, the chip stripping assembly provided in the first aspect of the present invention further includes a lifting mechanism for supporting and lifting the vertical rotary slide 15. Specifically, the lifting mechanism includes a vertical lifting slide 16 and / or a lifting cylinder 17.

[0041] Please refer to Figure 3 to Figure 6 . Figure 3 A schematic structural diagram of a vertical lifting slide provided according to some embodiments of the present invention is shown. Figure 4 A simplified structural schematic diagram of a vertical lifting slide provided according to some embodiments of the present invention is shown. Figure 5 A schematic structural diagram of a lifting cylinder 17 provided according to some embodiments of the present invention is shown. Figure 6 A simplified structural schematic diagram of a lifting cylinder 17 provided according to some embodiments of the present invention is shown.

[0042] exist Figure 3 and Figure 4 In the illustrated embodiment, the vertical lifting slide 16 includes a base 161, a first support seat 162, a first motor 163, a lead screw 164, a lead screw nut 165 and a plurality of connecting rods 166. Here, the vertical rotating slide 15 is arranged on the first support seat 162. The first support seat 162 is arranged on the base 161 via a plurality of connecting rods 166. The first motor 163 drives the lead screw 164 to rotate according to the height adjustment instruction provided by the controller. The outer side of the lead screw nut 165 is connected to a plurality of connecting rods 166, and the inner side thereof is threadedly connected to the lead screw 164, so as to adjust the angle between the plurality of connecting rods 166 as the lead screw 164 rotates, thereby adjusting the height of the first support seat 162.

[0043] Here, the lifting height range of the vertical lifting slide 16 is 90 mm to 210 mm.

[0044] exist Figure 5 and Figure 6In the illustrated embodiment, the lifting cylinder 17 includes a second support seat, a piston rod 171, a piston 172, a cylinder body and an air source. Here, the vertical rotary slide 15 is arranged on the second support seat, and vents 173 to 174 are respectively provided at both ends of the cylinder body. The piston 172 is located inside the cylinder body and isolates the vents. The air source is respectively connected to the vents, and it inflates or exhausts air to the vents according to the height adjustment instructions provided by the controller to drive the piston to move between the vents. The second support seat is connected to the piston 172 via the piston rod 171, and lifts the stripping heads 11 to 14 on the vertical rotary slide 15 as the piston 172 moves.

[0045] Furthermore, in some optional embodiments, the vertical rotating slide 15 can be directly set on the vertical lifting slide 16, and can also be indirectly set on the vertical lifting slide 16 via the lifting cylinder 17.

[0046] Please refer to further Figure 7 and Figure 8 . Figure 7 A schematic structural diagram of a vertical rotating slide provided according to some embodiments of the present invention is shown. Figure 8 A partial structural schematic diagram of a vertical rotating slide provided according to some embodiments of the present invention is shown.

[0047] exist Figure 7 and Figure 8 In the illustrated embodiment, the vertical rotating slide 15 includes a second motor 151, a coupling 152, a worm 153, a turbine 154 and a slide body 155. Here, a plurality of stripping heads 11 to 14 are mounted on the slide body 155 along a vertical plane. The slide body 155 is fixedly connected to the turbine 154. The edge of the turbine 154 is provided with a toothed structure to engage with the threaded portion of the worm 153. The worm 153 is connected to the second motor 151 via the coupling 152. The second motor 151 drives the worm 153 to rotate according to the angle adjustment instruction provided by the controller, so as to drive the turbine 154 and the slide body 155 to rotate along a vertical plane via its threaded portion and toothed structure, thereby rotating the first stripping head 11 of the size of the chip upward, and / or performing leveling of the first stripping head 11 and the chip.

[0048] Please refer to Figures 9 to 11 . Fig. 9 A schematic structural diagram of a stripping head provided according to some embodiments of the present invention is shown. Fig.10 A top view of three groups of ejector pins provided according to some embodiments of the present invention is shown. Fig.11 A schematic structural diagram of a chip provided according to some embodiments of the present invention is shown.

[0049] Further, in Fig. 9 and Fig.10 In the illustrated embodiment, the stripping head 11 includes a stripping head body 111, three groups of ejector pins 112 to 114, and two groups of springs with different elastic coefficients. Here, the first group of ejector pins 112 is aligned with the edge area of ​​the chip and is rigidly connected to the stripping head body 111. It is first lifted up as the stripping head body 111 rises to strip the edge area of ​​the chip. The second group of ejector pins 113 is aligned with the middle area between the edge area and the center area of ​​the chip and is connected to the stripping head body 111 via a first spring with a smaller elastic coefficient. After the first spring is fully deformed, it is lifted up as the stripping head body 111 continues to rise to strip the middle area of ​​the chip. The third group of ejector pins 114 is aligned with the center area of ​​the chip and is connected to the stripping head body 111 via a second spring with a larger elastic coefficient. After the first spring and the second spring are fully deformed, it is lifted up as the stripping head body 111 continues to rise to strip the center area of ​​the chip.

[0050] like Fig.11 As shown in the figure, the chip wafer is often adhered to the base film, and the chip-glue layer-base film three-layer structure is a typical film-based bonding structure. As the chip plane size becomes larger and the thickness becomes thinner, the chip will fail during the peeling process, such as fragmentation and fracture, and peeling becomes more and more difficult. When the chip is thinner than 75μm, the production efficiency of picking up the chip on its standard device degrades to an unacceptable level.

[0051] In some non-limiting embodiments, the chip stripping assembly provided in the first aspect of the present invention includes a memory and a controller. Here, the memory includes but is not limited to the computer-readable storage medium provided in the fourth aspect, on which computer instructions are stored. The controller is connected to the memory and is configured to execute the computer instructions stored in the memory to implement the chip stripping method provided in the third aspect of the present invention.

[0052] The working principle of the chip peeling component will be described below in conjunction with some embodiments of the chip peeling method. Those skilled in the art will understand that these embodiments of the chip peeling method are only some non-limiting implementation methods provided by the present invention, which are intended to clearly demonstrate the main concept of the present invention and provide some specific solutions that are convenient for the public to implement, rather than limiting all functions or all working modes of the chip peeling component. Similarly, the chip peeling component is also only a non-limiting implementation method provided by the present invention, and does not constitute a limitation on the execution subject and execution order of each step in these chip peeling methods.

[0053] Please refer to Fig.12 . Fig.12 A schematic flow chart of a chip peeling method provided according to some embodiments of the present invention is shown.

[0054] like Fig.12As shown, the controller may first obtain the size information of the chip to be peeled.

[0055] Afterwards, the controller may select a corresponding first stripping head 11 from a plurality of stripping heads of the chip stripping assembly provided in the first aspect of the present invention according to the size information.

[0056] Afterwards, the controller can rotate the first stripping head 11 upwards and the remaining second stripping heads 12 to 14 toward the side and / or downwards via the vertical rotating slide 15 of the chip stripping assembly.

[0057] In this way, the chip stripping assembly provided by the first aspect of the present invention can save plane space by vertically rotating multiple stripping heads 11~14, thereby facilitating batch integration and synchronous operation of multiple chip stripping assemblies, and by turning the idle stripping heads to the side or downward to avoid falling objects and dust from above to damage the high-precision stripping heads.

[0058] In addition, Figure 1 and Figure 2 In the illustrated embodiment, the chip stripping assembly provided by the first aspect of the present invention also includes a camera module 18. Here, in response to the first stripping head 11 being rotated upward, the controller can capture an image of the first stripping head 11 via the camera module 18. Afterwards, the controller can parse the image to determine the tilt angle of the first stripping head 11 relative to the chip. Here, the chip is fixed on a preset plane (for example, a horizontal plane, or a preset tilt angle in a film expansion pickup process). Thereafter, the controller can fine-tune the vertical rotating slide 15 according to the tilt angle to level the first stripping head 11 with the chip.

[0059] In this way, the chip stripping assembly provided by the first aspect of the present invention can use the camera module 16 to capture the image of the current stripping head, which is used to adapt to the actual angle of the chip in the film expansion picking process to fine-tune the inclination angle of the stripping head online, so as to further improve the parallelism of the stripping head compared to the chip, thereby further avoiding the chip from being broken and fractured.

[0060] In addition, in some preferred embodiments, the controller can also analyze the image to determine the actual height of the first stripping head 11, and adjust the lifting mechanism according to the difference between the actual height and the height of the chip stripping station to compensate for the height difference between the stripping heads 11 to 14. Here, the height difference includes the height difference of each stripping head itself and the installation height difference of each stripping head on the vertical rotating slide.

[0061] In this way, the chip stripping assembly provided by the first aspect of the present invention can be determined by fixing a 3D camera or a depth camera at a preset height and determining the distance from the first stripping head 11 to its detection surface, or it can be estimated by calculating the ratio of the image size of the first stripping head collected to its actual size.

[0062] Afterwards, in response to completing the leveling and height difference compensation of the first stripping head, the controller can also lift the vertical rotating slide 15 via the lifting mechanism to allow the first stripping head to press the back of the sample to be stripped and cooperate with the pickup head to strip the chip from the sample to be stripped.

[0063] In summary, the chip stripping assembly, bonding equipment, chip stripping method and computer-readable storage medium provided by the present invention can be used to eliminate the need to disassemble and replace the stripping head by automatically switching the stripping head, thereby improving the overall efficiency of continuously stripping different chips of various sizes. In addition, the stripping head can be rotated vertically to save plane space, thereby facilitating batch integration and synchronous operation of multiple chip stripping assemblies. In addition, the idle stripping head can be turned to the side or downward to prevent falling objects and dust from above from damaging the high-precision stripping head.

[0064] Although the above methods are illustrated and described as a series of actions for simplicity of explanation, it should be understood and appreciated that these methods are not limited by the order of the actions, because according to one or more embodiments, some actions may occur in a different order and / or concurrently with other actions from those illustrated and described herein or not illustrated and described herein but understandable to those skilled in the art.

[0065] Those skilled in the art will appreciate that information, signals, and data may be represented using any of a variety of different technologies and techniques. For example, data, instructions, commands, information, signals, bits, symbols, and chips cited throughout the above description may be represented by voltage, current, electromagnetic waves, magnetic fields or magnetic particles, optical fields or optical particles, or any combination thereof.

[0066] Although the controller described in the above embodiments can be implemented by a combination of software and hardware. However, it is understood that the controller can also be implemented in software and hardware. For hardware implementation, the controller can be implemented in one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), processors, controllers, microcontrollers, microprocessors, other electronic devices for performing the above functions, or a selection combination of the above devices. For software implementation, the controller can be implemented by independent software modules such as procedures and functions running on a general-purpose chip, each of which performs one or more functions and operations described herein.

[0067] The steps of the method or algorithm described in conjunction with the embodiments disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. The software module may reside in a RAM memory, a flash memory, a ROM memory, an EPROM memory, an EEPROM memory, a register, a hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art. An exemplary storage medium is coupled to a processor so that the processor can read and write information from / to the storage medium. In an alternative, a storage medium may be integrated into a processor. The processor and the storage medium may reside in an ASIC. The ASIC may reside in a user terminal. In an alternative, the processor and the storage medium may reside in a user terminal as discrete components.

[0068] In one or more exemplary embodiments, the functions described may be implemented in hardware, software, firmware, or any combination thereof. If implemented as a computer program product in software, each function may be stored on or transmitted by a computer-readable medium as one or more instructions or codes. Computer-readable media include both computer storage media and communication media, including any medium that facilitates the transfer of a computer program from one place to another. Storage media may be any available medium that can be accessed by a computer. As an example and not limitation, such a computer-readable medium may include RAM, ROM, EEPROM, CD-ROM or other optical disk storage, disk storage or other magnetic storage device, or any other medium that can be used to carry or store the desired program code in the form of an instruction or data structure and can be accessed by a computer. Any connection is also properly referred to as a computer-readable medium. For example, if the software is transmitted from a website, a server, or other remote source using a coaxial cable, a fiber optic cable, a twisted pair, a digital subscriber line (DSL), or wireless technologies such as infrared, radio, and microwaves, the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwaves are included in the definition of the medium. Disk and disc as used herein include compact disc (CD), laser disc, optical disc, digital versatile disc (DVD), floppy disk and Blu-ray disc, wherein disk often reproduces data magnetically, while disc reproduces data optically with lasers. Combinations of the above should also be included within the scope of computer-readable media.

[0069] The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein, but should be granted the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A chip peeling assembly, characterized in that: include: A plurality of stripping heads are mounted on a vertical rotating slide along a vertical plane and are spaced at a preset angle from each other, for stripping chips of various sizes; and The vertical rotating slide rotates along the vertical plane to rotate the first stripping head of the size of the chip upward to strip the chip from the sample to be stripped via the first stripping head, and to rotate at least one second stripping head of a size that does not match the chip toward the side and / or downward.

2. The chip peeling assembly according to claim 1, characterized in that: The chip stripping assembly also includes a controller, which is configured to: Obtaining size information of the chip to be peeled off; selecting a corresponding first stripping head from the plurality of stripping heads according to the size information; as well as The first stripping head is rotated upward via the vertical rotating slide, and the remaining second stripping heads are rotated sideways and / or downwards.

3. The chip peeling assembly according to claim 1, characterized in that: The chip stripping assembly also includes a camera module, and the controller is further configured to: In response to the first stripping head being rotated upward, capturing an image of the first stripping head via the camera module; analyzing the image to determine a tilt angle of the first stripping head relative to the chip; as well as The vertical rotating slide is finely adjusted according to the tilt angle to level the first stripping head and the chip.

4. The chip peeling assembly according to claim 3, characterized in that: The chip peeling assembly also includes a lifting mechanism for supporting and lifting the vertical rotating slide, and the controller is further configured as follows: parsing the image to determine an actual height of the first stripping head; and According to the difference between the actual height and the height of the workstation for stripping the chip, the lifting mechanism is adjusted to compensate for the height difference between the stripping heads.

5. The chip peeling assembly according to claim 4, characterized in that: The lifting mechanism comprises: A vertical lifting slide, comprising a base, a first support base, a first motor, a lead screw, a lead screw nut and a plurality of connecting rods, wherein the vertical rotating slide is arranged on the first support base, the first support base is arranged on the base via the plurality of connecting rods, the first motor drives the lead screw to rotate according to a height adjustment instruction provided by the controller, the outer side of the lead screw nut is connected to the plurality of connecting rods, and the inner side thereof is threadedly connected to the lead screw, so as to adjust the angle between the plurality of connecting rods as the lead screw rotates, thereby adjusting the height of the first support base; and / or The lifting cylinder includes a second support seat, a piston rod, a piston, a cylinder body and an air source, wherein the vertical rotating slide is arranged on the second support seat, and air vents are respectively provided at both ends of the cylinder body. The piston is located inside the cylinder body and isolates the air vents. The air source is respectively connected to the air vents, and inflates or exhausts air to the air vents according to the height adjustment instructions provided by the controller to drive the piston to move between the air vents. The second support seat is connected to the piston via the piston rod, and lifts the stripping heads on the vertical rotating slide as the piston moves.

6. The chip peeling assembly according to claim 4, characterized in that: The controller is also configured to: In response to completing the leveling and height difference compensation of the first stripping head, the vertical rotating slide is lifted via the lifting mechanism to allow the first stripping head to press the back of the sample to be stripped and cooperate with the pickup head to strip the chip from the sample to be stripped.

7. The chip peeling assembly according to claim 1, characterized in that: The vertical rotating slide includes a second motor, a coupling, a worm, a turbine and a slide body, wherein: The plurality of stripping heads are mounted on the slide body along a vertical plane, the slide body is fixedly connected to the turbine, the edge of the turbine is provided with a toothed structure to engage with the threaded portion of the worm, and the worm is connected to the second motor via the coupling. The second motor drives the worm to rotate according to the angle adjustment instruction provided by the controller, so as to drive the turbine and the slide body to rotate along the vertical plane via its threaded portion and the toothed structure, thereby rotating the first stripping head of the chip size upward, and / or leveling the first stripping head and the chip.

8. The chip peeling assembly according to claim 1, characterized in that: The stripping head includes a stripping head body, three sets of ejector pins and two sets of springs with different elastic coefficients, wherein: The first set of top pins is aligned with the edge area of ​​the chip and is rigidly connected to the stripping head body. The first set of top pins is lifted first with the rise of the stripping head body to strip the edge area of ​​the chip. The second set of top pins is aligned with the middle area between the edge area and the center area of ​​the chip, and is connected to the stripping head body via a first spring with a smaller elastic coefficient. After the first spring is fully deformed, it is lifted as the stripping head body continues to rise to strip the middle area of ​​the chip. The third set of top pins is aimed at the central area of ​​the chip and is connected to the stripping head body via a second spring with a larger elastic coefficient. After the first spring and the second spring are fully deformed, the third set of top pins is lifted as the stripping head body continues to rise to strip the central area of ​​the chip.

9. A bonding device, characterized in that: include: A bonding head, used to bond the chip to be bonded to its target position; A pick-up head, used for picking up the chip from the sample to be peeled off and transferring it to the bonding head; as well as The chip peeling assembly according to any one of claims 1 to 8 is used to squeeze the sample to be peeled from the back after the pickup head absorbs the chip from the front side, so as to peel the chip from the sample to be peeled.

10. A chip peeling method, characterized in that: The following steps are involved: Obtaining size information of the chip to be peeled; According to the size information, a corresponding first stripping head is selected from a plurality of stripping heads of the chip stripping assembly according to any one of claims 1 to 8; Rotating the first stripping head upwards and rotating the remaining second stripping heads sideways and / or downwards via the vertical rotating slide of the chip stripping assembly; and The vertical rotating slide is lifted to press the sample to be peeled off from the back side, so as to peel off the chip from the sample to be peeled off.

11. A computer-readable storage medium having computer instructions stored thereon, characterized in that: When the computer instructions are executed by a processor, the chip peeling method as claimed in claim 10 is implemented.

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