Electronic component

Abstract

The invention provides an electronic assembly. The electronic assembly comprises a radiator, and a channel is formed in the radiator in a cutting mode. A thermal interface material is disposed between the heat sink and the electronic device. A compressible filler is disposed in the channel to surround and confine the thermal interface material.

Description

Technical Field

[0001] The present invention relates to cooling of electronic devices. Background Art

[0002] Electronic devices such as central processing units (CPUs), graphics processing units (GPUs), and application-specific integrated circuits (ASICs) generate a large amount of heat and therefore require cooling for normal operation. One method of cooling an electronic device is to connect a heat sink to the electronic device. The heat sink acts as a heat exchanger, which is used to dissipate the heat generated by the electronic device to the ambient space in air cooling or to dissipate the heat to the coolant in immersion cooling. A thermal interface material is provided between the electronic device and the heat sink to facilitate heat transfer from the electronic device to the heat sink. Examples of thermal interface materials include thermal pads, thermal adhesives, thermal fillers, graphite sheets, phase change materials, liquid metals, and the like. The thermal interface material is adhered or laid on a flat surface of the heat sink and further attached to the electronic device.

[0003] When thermal interface material is compressed between a heat sink and an electronic device, especially when it is in a liquid phase, it can overflow. Consequently, the thermal interface material can leak and contaminate nearby components, damaging the integrated circuit (IC) socket, causing electrical shorts or other permanent damage.

[0004] In immersion cooling systems, compatibility issues limit the choice of thermal interface materials. For example, thermal paste cannot be used when using hydrocarbon oil as the coolant for immersion cooling. Over time, the hydrocarbon oil will wash out the thermal paste and reduce its heat transfer capacity. Furthermore, the washed-off thermal paste will alter the properties of the hydrocarbon oil.

[0005] Typically, there's no specific containment mechanism designed for thermal interface materials. In cases where the thermal interface material is conductive and liquid at high temperatures, such as liquid metal, a sponge or gasket is bonded directly to the flat surface of the heat sink to surround the thermal interface material. Sponges and glues are not oil-resistant, limiting their use in immersion cooling systems. They also don't provide a rigid structure and can still cause thermal interface material leakage. Tapes and foams can also be used to contain thermal interface materials, but they present similar challenges in preventing thermal interface material leakage as sponges and glues. Summary of the Invention

[0006] In one embodiment, an electronic assembly includes a heat sink, an electronic device, a thermal interface material, and a compressible filler. The heat sink has a first groove cut into its surface. The thermal interface material is disposed between the heat sink and the electronic device, adhered to the heat sink and the electronic device, and disposed within the perimeter of the compressible filler. The compressible filler is disposed within the first groove to completely surround and confine the thermal interface material.

[0007] In another embodiment, an electronic assembly includes a heat sink, an electronic device, a thermal interface material, and a compressible filler. The heat sink has a continuous channel cut into its bottom surface. The thermal interface material is disposed between the heat sink and the electronic device, wherein the thermal interface material directly contacts the bottom surface of the heat sink and directly contacts the top surface of the electronic device. The compressible filler is secured in the continuous channel in an adhesive-free manner and completely surrounds the thermal interface material.

[0008] The embodiments of the present invention can confine the thermal interface material to a specific area to prevent leakage, prevent degradation of the thermal interface material, and provide a wider range of thermal interface material choices.

[0009] In order to further understand the technology, method and effects of the present invention and achieve the intended purpose of the present invention, please refer to the following detailed description and drawings; in addition, the purpose, characteristics and features of the present invention can be understood more deeply and specifically; however, the drawings are provided for reference and description only and are not intended to limit the scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 FIG. 1 is a bottom side view of a heat sink according to an embodiment of the present invention.

[0011] Figure 2 and Figure 3 FIG. 1 is a cross-sectional view of an electronic component according to an embodiment of the present invention.

[0012] Figure 4 and Figure 5 FIG. 1 is a cross-sectional view of an electronic component according to another embodiment of the present invention.

[0013] Figure 6 and Figure 7 FIG. 2 is a cross-sectional view of an electronic component according to yet another embodiment of the present invention.

[0014] Figure 8 and Figure 9 FIG. 1 is a cross-sectional view of an electronic component according to yet another embodiment of the present invention.

[0015] Wherein, the accompanying drawings are marked as follows:

[0016] 100: Radiator

[0017] 101: Groove

[0018] 102: Overflow area

[0019] 103: Thermal interface materials

[0020] 104: Bottom surface

[0021] 120: Electronic components

[0022] 150: Electronic devices

[0023] 151:Substrate

[0024] 152: Compressible filler

[0025] 153: Top

[0026] 154: Bottom

[0027] 155: Surface

[0028] 156: Fins

[0029] 200: Radiator

[0030] 201: Overflow channel

[0031] 220: Electronic components

[0032] 300: Radiator

[0033] 301: Overflow channel

[0034] 320: Electronic components

[0035] 400: Radiator

[0036] 401: Slot

[0037] 402: Compressible filler

[0038] 420: Electronic components DETAILED DESCRIPTION

[0039] The detailed description and technical contents of the present invention are described below with reference to the accompanying drawings. However, the accompanying drawings are only provided for reference and illustration and are not intended to limit the present invention.

[0040] The present invention discloses numerous specific details, such as components, elements, structures, and methods, to facilitate a thorough understanding of the embodiments of the present invention. However, one of ordinary skill in the art will appreciate that the present invention can be practiced without omitting one or more specific details. In other cases, well-known details are not shown or described to avoid obscuring the present invention.

[0041] like Figure 1 The figure shows a front view of a bottom portion of a heat sink 100 according to an embodiment of the present invention. The bottom portion serves as a base of the heat sink 100. The bottom portion has a relatively flat and smooth bottom surface 104, and a continuous groove 101 is cut on the bottom surface 104. A thermal interface material 103 is disposed on the bottom surface 104, and the groove 101 forms a closed perimeter completely surrounding the thermal interface material 103. The groove 101 may be a groove, a slot, or other structure having a depth relative to the plane of the bottom surface 104, which is used to hold and constrain a compressible filler (such as Figure 3A compressible filler 152 is shown. There is an overflow area 102 between the channel 101 and the thermal interface material 103. When the heat sink 100 and an electronic device (such as Figure 3 When one of the electronic devices 150 is compressed, the thermal interface material 103 overflows into the overflow area 102 .

[0042] Figure 2 FIG. 1 is a cross-sectional view of an electronic component 120 according to an embodiment of the present invention. Figure 2 In the example shown, for ease of illustration, the heat sink 100 shown therein has a plurality of fins 156. It is understood that the heat sink 100 may also be a water-cooled plate or other heat dissipation structure.

[0043] like Figure 2 As shown, the heat sink 100 is attached to an electronic device 150 (e.g., a central processing unit (CPU), a graphics processing unit (GPU), an application-specific integrated circuit (ASIC), etc.). The electronic device 150 is mounted on a surface 155 of a substrate 151. In one embodiment, the substrate 151 is a printed circuit board (PCB). The substrate 151 can be, for example, a motherboard of a server computer. Figure 2 In the example shown, the thermal interface material 103 is applied directly to the bottom surface 104 and within the perimeter of the channel 101. A top surface 153 of the electronic device 150 faces the thermal interface material 103, and a bottom surface 154 of the electronic device 150 faces the substrate 151.

[0044] Figure 3 FIG. 1 is a cross-sectional view of an electronic component 120 according to an embodiment of the present invention. Figure 3 The heat sink 100 is shown attached to an electronic device 150. A compressible filler 152 is inserted into the channel 101 and when the heat sink 100 is attached to the electronic device 150, the compressible filler 152 is compressed together with the thermal interface material 103 to the top surface 153 of the electronic device 150 (e.g., Figure 2 When the electronic device 150 is pressed, the compressible filler 152 and the thermal interface material 103 directly contact the top surface 153 of the electronic device 150. When the thermal interface material 103 is pressed against the electronic device 150, it overflows into the overflow area 102 (as shown). Figure 1 shown).

[0045] like Figure 3 In the example shown, the channel 101 does not extend beyond the perimeter of the electronic device 150. More specifically, Figure 3 In the example shown, the channel 101 may be aligned with or slightly within the perimeter of the electronic device 150 . Heat generated by the electronic device 150 is transferred to the heat sink 100 via the thermal interface material 103 .

[0046] The compressible filler 152 completely surrounds the thermal interface material 103. The compressible filler 152 is firmly held and constrained in the channel 101, and it forms a continuous, solid structure that confines the thermal interface material 103 within the perimeter of the compressible filler 152 and prevents external fluid from reaching the thermal interface material 103. This prevents the thermal interface material 103 from leaking outside the perimeter of the compressible filler 152 and, in immersion cooling applications, prevents the thermal interface material 103 from being contaminated by the coolant.

[0047] Compressible filler 152 may comprise rubber or other compressible material suitable for a specific cooling application. For example, compressible filler 152 may be a rubber sponge. Compressible filler 152 follows the shape / contour of channel 101. Compressible filler 152 can be inserted into channel 101 with a sweat fit without the need for glue or other adhesives. Eliminating adhesives allows for a wider selection of thermal interface materials for specific cooling applications.

[0048] Figure 4 FIG. 1 is a cross-sectional view of an electronic component 120 according to an embodiment of the present invention. Figure 4 In the illustrated example, heat sink 200 is identical to heat sink 100 of electronic assembly 120, except that a continuous overflow channel 201 is added within the perimeter of channel 101. Overflow channel 201 has the same shape and structure as channel 101, except that it is shallower than channel 101. Overflow channel 201 is separate from channel 101. Electronic assemblies 220 and 120, which have the same reference numerals, otherwise have the same components.

[0049] Figure 5 FIG. 1 is a cross-sectional view of an electronic component 220 according to an embodiment of the present invention. Figure 5 FIG2 shows the heat sink 200 after being attached to the electronic device 150. As previously described, when the heat sink 200 is attached to the electronic device 150, the compressible filler 152 is inserted into the groove 101 and is compressed together with the thermal interface material 103 to press against the top surface 153 (eg, Figure 4 When the thermal interface material 103 is pressed against the electronic device 150, the thermal interface material 103 overflows into the overflow channel 201. It should be noted that the portion of the thermal interface material 103 located in the overflow channel 201 does not contact the compressible filler 152 in the channel 101.

[0050] When the thermal interface material 103 is compressed, shear stress is applied to it, which may cause the thermal interface material 103 to be thicker at the corners than in the center. The overflow channel 201 receives overflowing thermal interface material 103 and allows the thermal interface material 103 to be evenly distributed on the electronic device 150.

[0051] Figure 6 FIG. 2 is a cross-sectional view of an electronic component 220 according to an embodiment of the present invention. Figure 6 In the illustrated example, a heat sink 300 is substantially identical to the heat sink 200 of the aforementioned electronic assembly 220, with the difference being a continuous overflow channel 301. Overflow channel 301 is substantially identical to overflow channel 201 of the aforementioned heat sink 200, with the difference being that overflow channel 301 is located immediately outside of the channel 101. Like overflow channel 201 of the aforementioned heat sink 200, overflow channel 301 of the heat sink 300 is located within the perimeter of the channel 101 and has a shallower depth than the channel 101. Electronic assemblies 320 and 220 with the same reference numerals otherwise have identical components.

[0052] Figure 7 FIG. 1 is a cross-sectional view of an electronic component 320 according to an embodiment of the present invention. Figure 7 The heat sink 300 is shown after being attached to the electronic device 150. As previously described, when the heat sink 300 is attached to the electronic device 150, the compressible filler 152 is inserted into the channel 101 and is compressed together with the thermal interface material 103 against the top surface 153 of the electronic device 150 (e.g., Figure 6 When the thermal interface material 103 presses against the electronic device 150, the thermal interface material 103 overflows into the overflow channel 301. Compared to the overflow channel 201 of the heat sink 200, the portion of the thermal interface material 103 in the overflow channel 301 directly contacts the compressible filler 152 in the channel 101.

[0053] Figure 8 FIG. 4 is a cross-sectional view of an electronic component 420 according to an embodiment of the present invention. Figure 8 In the example shown, a heat sink 400 is substantially the same as the heat sink 100 of the electronic component 120 described above, except that a continuous groove 401 is provided. The groove 401 is substantially the same as the groove 101 of the heat sink 100 described above, except that when the heat sink 400 is attached to the electronic device 150, the groove 401 is located outside the periphery of the electronic device 150, which results in a compressible filler 402 (e.g., Figure 9 ) is located outside the perimeter of the electronic device 150. Electronic assemblies 120 and 420 having the same reference numerals have otherwise identical elements.

[0054] Figure 9 FIG. 4 is a cross-sectional view of an electronic component 420 according to an embodiment of the present invention. Figure 9The heat sink 400 is shown after being attached to the electronic device 150. When the heat sink 400 is attached to the electronic device 150, the compressible filler 402 is inserted into the groove 401 and is pressed against the substrate 151 along with the thermal interface material 103. The thermal interface material 103 is compressed against the top surface 153 (eg, Figure 8 As shown in FIG, the compressible filler 402 is compressed against the surface 155 of the substrate 151. Like the compressible filler 152 of the aforementioned electronic component 120, the compressible filler 402 may include rubber or other suitable compressible materials. For example, the compressible filler 402 may be a rubber sponge.

[0055] Compressible filler 402 follows the shape / contour of channel 401. Compressible filler 402 completely surrounds electronic device 150 and thermal interface material 103. By positioning channel 401 outside the perimeter of electronic device 150, channel 401 can be made shallower than the channel 101 of heat sink 100 for electronic assembly 120 described above. Furthermore, compressible filler 402 is positioned on the side of electronic device 150 rather than on top. This configuration improves heat transfer and slightly increases the coverage area of ​​thermal interface material 103 on electronic device 150.

[0056] The thermal interface material 103 may include liquid metal, thermal paste, or other thermal interface materials suitable for a particular cooling application. It will be appreciated that embodiments of the present invention allow for a wider range of thermal interface materials. For example, embodiments of the present invention allow for the use of thermal paste as a thermal interface material in an immersion cooling system because the compressible filler (152, 402) in the groove (101, 401) of the embodiment can prevent leakage of the thermal paste and prevent the thermal conductive container from contacting the coolant.

[0057] The electronic components disclosed herein can be immersed in a coolant of an immersion cooling system. It will be appreciated that while embodiments of the present invention are particularly advantageous for immersion cooling systems, these embodiments are also advantageous for air cooling systems or other cooling systems.

[0058] The above description is merely a detailed description and drawings of preferred specific embodiments of the present invention. However, the features of the present invention are not limited thereto and are not intended to limit the present invention. The full scope of the present invention shall be subject to the scope of the patent application. All embodiments that conform to the spirit of the patent application and similar variations of the present invention shall be included in the scope of the present invention. Any changes or improvements that can be easily conceived by ordinary technicians in the field of the present invention that are familiar with the technology are all covered by the patent scope of the following case.

Claims

1. An electronic component, characterized in that: include: A heat sink, a first groove is formed by cutting a surface of the heat sink; an electronic device; A thermal interface material is disposed between the heat sink and the electronic device, and the thermal interface material is attached to the surface of the heat sink and a surface of the electronic device; as well as A compressible filler is disposed in the first channel. The compressible filler completely surrounds the thermal interface material and confines the thermal interface material within the perimeter formed by the compressible filler.

2. The electronic component according to claim 1, wherein: The radiator further comprises: a second groove cut and formed on the surface of the heat sink, The second channel is located within the perimeter of the first channel and accommodates an overflow portion of the thermal interface material.

3. The electronic component according to claim 1, wherein: The compressible filler contacts the surface of the electronic device.

4. The electronic component according to claim 1, wherein: Also includes: a substrate, The electronic device is attached to a surface of the substrate.

5. The electronic component according to claim 4, characterized in that The compressible filler contacts the surface of the substrate.

6. The electronic component according to claim 1, wherein: The compressible filler is arranged outside a peripheral edge of the electronic device.

7. The electronic component according to claim 1, wherein: The electronic device is a central processing unit, a graphics processing unit or a specific application integrated circuit.

8. The electronic component according to claim 1, wherein: The compressible filler is fixed in the first channel in an adhesive-free manner.

9. The electronic component according to claim 1, wherein: The compressible filler is secured in the first channel with an interference fit.

10. The electronic component according to claim 1, wherein: The thermal interface material includes thermally conductive paste or liquid metal.

11. An electronic component, characterized in that: include: A heat sink having a continuous groove cut into a bottom surface thereof; an electronic device; a thermal interface material disposed between the heat sink and the electronic device, wherein the thermal interface material directly contacts the bottom surface of the heat sink and directly contacts a top surface of the electronic device; and A compressible filler is fixed in the continuous channel in an adhesive-free manner and completely surrounds the thermal interface material.

12. The electronic component according to claim 11, wherein: Also includes: An overflow channel is cut and formed on the bottom surface of the heat sink, wherein the overflow channel accommodates an overflow portion of the thermal interface material.

13. The electronic component according to claim 11, wherein: The continuous channel extends beyond a peripheral edge of the electronic device.

14. The electronic component according to claim 11, wherein: The compressible filler directly contacts the top surface of the electronic device.

15. The electronic component according to claim 11, wherein: Also includes: A printed circuit board, wherein the electronic device is attached to a surface of the printed circuit board.

16. The electronic component according to claim 15, wherein: The compressible filler directly contacts the surface of the printed circuit board.

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