Electronic device

Abstract

The invention provides electronic equipment, the electronic equipment comprises a first frame body, a second frame body, a split type light guide part and a photosensitive device, the split type light guide part comprises a first light guide part and a second light guide part, when the electronic equipment is assembled, the second light guide part and the second frame body can be assembled firstly, and the photosensitive device is arranged on the second frame body; then the first light guide part and the first frame body are assembled, finally, the first frame body assembled with the first light guide part is buckled to the second frame body assembled with the second light guide part, and the assembled second light guide part and the first light guide part are oppositely arranged; according to the invention, the first frame body can be easily buckled on the second frame body while the photosensitive device can smoothly sense the intensity of external light, so that the assembly difficulty is reduced, and the assembly efficiency is improved.

Description

Technical Field

[0001] The present application relates to the field of electronic technology, and in particular to an electronic device with a light-guiding structure. Background Art

[0002] At present, photosensitive devices such as ambient light sensors are widely used in electronic devices such as mobile phones and tablet computers. For electronic devices with a full-body structure (i.e., a unibody structure) in which the middle frame covers the front shell, the existing structural layout of photosensitive devices and light guides is not conducive to rapid assembly during production and needs further improvement. Summary of the invention

[0003] The present application provides an electronic device, which can solve the technical problem of difficulty in assembling all-inclusive structure electronic devices due to an integrated light guide in the prior art.

[0004] To achieve the above objectives, the embodiments of the present application adopt the following technical solutions:

[0005] In a first aspect, the present application provides an electronic device, which includes a first frame and a second frame, the first frame enclosing a first accommodating cavity, the first frame including a first frame, the first frame being provided with a first through hole; the second frame being arranged in the first accommodating cavity, the second frame including a second frame, the second frame being provided with a second through hole, the second through hole being at least partially opposite to the first through hole; the electronic device also includes a first light guide and a second light guide, the first light guide being at least partially located in the first through hole; the second light guide being at least partially located in the second through hole; the electronic device also includes a photosensitive device arranged inside the electronic device, wherein light can be transmitted to the photosensitive device through the first light guide and the second light guide in sequence.

[0006] According to the electronic device of the embodiment of the present application, the light guide is a split light guide, including a first light guide and a second light guide. When the electronic device is assembled, the second light guide and the second frame can be assembled first, and then the first light guide and the first frame can be assembled. Finally, the first frame equipped with the first light guide is snapped onto the second frame equipped with the second light guide. The relative arrangement of the assembled second light guide and the first light guide allows external light to be smoothly transmitted to the photosensitive device through the second light guide and the first light guide, ensuring that the photosensitive device can smoothly sense the intensity of external light. At the same time, due to the split design of the first light guide and the second light guide, the size design of the first light guide and the second light guide is more flexible, so that the sizes of the two will not interfere with the assembly process, so that the first frame can be easily snapped onto the second frame, reducing the difficulty of assembly and improving assembly efficiency.

[0007] In some embodiments of the first aspect of the present application, adjacent surfaces of the first light guide member and the second light guide member are parallel to each other and spaced apart.

[0008] In some embodiments of the first aspect of the present application, the distance between adjacent surfaces of the first light guide and the second light guide is 0-0.25 mm.

[0009] Since there is a gap between the first light emitting surface and the second light incident surface, the two will not collide with each other, and the maximum upper limit of the gap is controlled to be 0.25 mm, which can ensure the transmission efficiency of ambient light between the first light guide member and the second light guide member.

[0010] In some embodiments of the first aspect of the present application, the transmittance of the second light guide is greater than the transmittance of the first light guide.

[0011] The first light guide is used to sense the external ambient light and transmit it to the inside of the mobile terminal. At the same time, the first light guide is a semi-transparent material with high diffusion particles, which can improve the perception range of external light; and the second light guide uses a high transmittance material. By setting the transmittance of the second light guide to be greater than that of the first light guide, the sensitivity of the luminous flux can be improved. In some embodiments of the first aspect of the present application, the peripheral area of ​​the second through hole is recessed to form a receiving groove, wherein the bottom surface of the receiving groove is inclined so that in the thickness direction of the electronic device, the bottom surface of the receiving groove gradually moves away from the first frame in the direction away from the display module.

[0012] This inclined arrangement can make it easier for the second frame to be buckled onto the first frame, and can also reduce scratches on the first light emitting surface and the first buffer.

[0013] In some embodiments of the first aspect of the present application, the electronic device further includes a first buffer member disposed between the first light guide member and the second light guide member, wherein the first buffer member is fixedly connected to the receiving groove via a first colloid.

[0014] In this embodiment, by providing the first buffer, the first light guide member can be prevented from directly bumping into or squeezing the second light guide member, thereby avoiding affecting the assembled second light guide member, thereby buffering the squeezing force of the first light guide member.

[0015] In some embodiments of the first aspect of the present application, the first light guide member includes a first light guide column and a first mounting plate, the first mounting plate includes a first mounting surface, the first mounting surface is fixedly connected to the surface of the first frame facing the first accommodating cavity, the first light guide column is arranged on the first mounting surface, and the first light guide column is at least partially accommodated in the first through hole.

[0016] In some embodiments of the first aspect of the present application, the second light guide member includes a second light guide column and a second mounting plate, the second mounting plate includes a second mounting surface, the second mounting surface is fixedly connected to the surface of the second frame facing away from the first through hole, the second light guide column is arranged on the second mounting surface, and is at least partially located in the second through hole.

[0017] In some embodiments of the first aspect of the present application, the second light guide member further includes a light guide plate disposed on a surface of the second mounting plate away from the first through hole, and the light guide plate extends in a direction away from the first through hole.

[0018] In some embodiments of the first aspect of the present application, along a direction parallel to the second mounting surface, a surface of the light guide plate is opposite to the photosensitive element.

[0019] In some embodiments of the first aspect of the present application, the second frame surrounds and forms a second accommodating cavity, and the photosensitive device is located in the second accommodating cavity.

[0020] In some embodiments of the first aspect of the present application, the electronic device further includes a circuit board, the circuit board is disposed in the second accommodating cavity, and the photosensitive element is disposed on the circuit board.

[0021] In some embodiments of the first aspect of the present application, the first frame further includes a first middle plate, which is disposed on a side of the first frame facing the first accommodation cavity;

[0022] The second frame body further includes a second middle plate, which is arranged on a side of the second frame facing the second accommodation cavity;

[0023] The second middle plate, the circuit board and the first middle plate are stacked in sequence in the thickness direction of the electronic device, the photosensitive device is fixedly arranged on the surface of the circuit board close to the second middle plate, and the photosensitive surface of the photosensitive device is away from the circuit board.

[0024] Specifically, in order to reduce the thickness of the electronic device, the second middle plate, the circuit board and the first middle plate are stacked in sequence, and the photosensitive surface of the photosensitive device faces away from the circuit board, and the thickness direction of the photosensitive device is the same as the thickness direction of the electronic device. This stacked structure can minimize the impact of the photosensitive device on the thickness of the electronic device. Moreover, the second light-emitting surface and the photosensitive surface are opposite, which can further reduce the thickness of the electronic device. Here, the second light-emitting surface and the photosensitive surface are opposite, which means that the projections of the second light-emitting surface and the photosensitive surface on the plane where the display module of the electronic device is located at least partially overlap.

[0025] In some embodiments of the first aspect of the present application, the electronic device also includes a display module, which is arranged on a side of the second middle plate away from the first middle plate, and the first light guide column is inclined toward the side away from the display module from the first through hole toward the accommodating cavity.

[0026] In this embodiment, the first light guide column is tilted toward the side close to the display module, so that an angle is formed between the axis of the first light guide column and the horizontal plane (i.e., the plane of the display module). This tilted arrangement of the first light guide column allows external light to enter the light guide more easily when the user uses the electronic device normally (with the display module facing upward), thereby achieving more accurate ambient brightness detection.

[0027] In some embodiments of the first aspect of the present application, a surface of the light guide plate close to the second middle plate is a third mounting surface, and the third mounting surface is fixedly connected to the second middle plate.

[0028] In this embodiment, the third mounting surface is fixedly connected to the second middle plate, which can further improve the degree of fixation between the second light guide member and the second frame.

[0029] In some embodiments of the first aspect of the present application, a second colloid is arranged between the first mounting surface and the surface of the first frame facing the first accommodating cavity, the second colloid is circumferentially arranged around the first light guide column, and the first mounting surface is fixedly connected to the surface of the first frame facing the first accommodating cavity through the second colloid.

[0030] By arranging the second colloid around the first light guide column in a circle, it is possible to prevent external liquid from entering the electronic device through the gap between the first light guide column and the first through hole.

[0031] In some embodiments of the first aspect of the present application, a third colloid is provided between the second mounting surface and the surface of the second frame facing away from the first through hole and between the third mounting surface and the second middle plate, the third colloid is arranged circumferentially around the second light guide column, the second mounting surface is fixedly connected to the inner surface of the second frame through the third colloid, and the third mounting surface is fixedly connected to the second middle plate through the third colloid.

[0032] By arranging the third colloid circumferentially around the second light guide column, it is possible to prevent external liquid from entering the interior of the electronic device through the gap between the second light guide column and the second through hole.

[0033] In some embodiments of the first aspect of the present application, the second frame and the first middle plate have a second gap in the thickness direction of the electronic device, and the second gap is filled with a second buffer.

[0034] The second buffer between the first middle plate and the second frame can prevent external liquid from entering the electronic device through the gap between the first middle plate and the second frame.

[0035] In some embodiments of the first aspect of the present application, the first frame and the first middle plate are an integrated structure.

[0036] When the first frame and the first middle plate are split structures, the first middle plate can be used as an appearance surface, and the material of the first middle plate can be more diverse. When the first frame and the first middle plate are integrated structures, the strength of the electronic device can be improved. At this time, the first middle plate can be an appearance surface or a non-appearance surface. When the first middle plate is a non-appearance surface, a layer of shell can be added to the outside of the first middle plate as an appearance surface.

[0037] In some embodiments of the first aspect of the present application, it is characterized in that a limiting step is arranged around the accommodating groove, the limiting step includes a limiting step bottom surface and a limiting step side surface, the limiting step bottom surface is used to limit the movement of the first light guide member along a direction perpendicular to the first light emitting surface, and the limiting side surface is used to limit the rotation of the first light guide member.

[0038] In this embodiment, the movement of the first light guide member is further limited by the limiting step, so that the first light guide member can be more firmly assembled.

[0039] In some embodiments of the first aspect of the present application, the electronic device is further provided with a snap-fit ​​structure for fixing the first frame and the second frame on the side of the limiting step, and the accommodating groove, the limiting step and the snap-fit ​​structure are arranged in sequence along the width direction of the electronic device.

[0040] By providing a snap-fit ​​structure on the side of the limiting step, the buckling between the first frame and the second frame can be made more secure. For example, along the width direction of the electronic device, a snap-fit ​​structure is provided on the left and right sides of the limiting step, thereby preventing the first frame from generating a pressing position or abnormal sound, and at the same time limiting the position of the electronic device in the length direction and thickness direction, thereby ensuring the position accuracy of the first light guide and the second light guide.

[0041] In some embodiments of the first aspect of the present application, the first light guide column and the first mounting plate are an integrated structure, and / or the second light guide column, the second mounting plate and the light guide plate are an integrated structure.

[0042] In this embodiment, the first light guide column and the first mounting plate of the first light guide member are an integrated structure, and the second light guide column, the second mounting plate and the light guide plate of the second light guide member are an integrated structure, that is, the first light guide member and the second light guide member are an integrally molded structure, which can improve the light transmission efficiency and improve production efficiency.

[0043] In some embodiments of the first aspect of the present application, the light emitting surface of the first light guide member and / or the light incident surface of the second light guide member is one of a polished surface, a textured surface, and a coated surface.

[0044] Through the above surface treatment process, the light transmittance, surface hardness, wear resistance, etc. of the first light emitting surface and the second light incident surface can be increased, thereby improving the light transmission efficiency between the first light guide member and the second light guide member. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Figure 1 A schematic diagram of the structure of an electronic device according to some embodiments of the present application;

[0046] Figure 2 Based on Figure 1 an exploded schematic diagram of the electronic device shown;

[0047] Figure 3 Based on Figure 1 A schematic diagram of a partial cross-sectional structure of an electronic device shown at line AA;

[0048] Figure 4 A schematic diagram of the structure of an electronic device provided in some other embodiments of the present application;

[0049] Figure 5 Based on Figure 4 A schematic diagram of a partial cross-sectional structure of an electronic device at line BB in one embodiment shown;

[0050] Figure 6 Based on Figure 4 A partial cross-sectional structural diagram of an electronic device at line BB in an embodiment of the present application is shown;

[0051] Figure 7 Based on Figure 4 A schematic diagram of a cross-sectional structure of an electronic device at line BB in another embodiment of the present application is shown;

[0052] Figure 8 (a) and (b) are schematic structural diagrams of the first light guide member;

[0053] Fig. 9 is a schematic structural diagram of a second light guide;

[0054] Fig.10 It is a schematic diagram of the structure after the first light guide member and the second light guide member are assembled;

[0055] Fig.11 is a schematic diagram of light being conducted in a first light guide member and a second light guide member;

[0056] Fig.12 It is a schematic diagram of the structure of the front shell of the electronic device;

[0057] Fig.13 It is an enlarged schematic diagram of a partial structure of a front shell of an electronic device;

[0058] Fig.14 An exploded view of the assembly of the first light guide, the front housing and the second light guide;

[0059] Fig.15 (a) and (b) are schematic diagrams of the structure of the locking structure. DETAILED DESCRIPTION

[0060] In the embodiments of the present application, the terms "exemplary" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a specific way.

[0061] In the embodiments of the present application, the terms "first", "second", "third" and "fourth" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined as "first", "second", "third" and "fourth" may explicitly or implicitly include one or more of the features.

[0062] In the description of the embodiments of the present application, the term "at least one" refers to one or more, and "plurality" refers to two or more. "At least one of the following" or similar expressions refers to any combination of these items, including any combination of single items or plural items. For example, at least one of a, b, or c can represent: a, b, c, ab, ac, bc, or abc, where a, b, and c can be single or multiple.

[0063] In the description of the embodiments of the present application, the term "and / or" refers to and covers any and all possible combinations of one or more of the associated listed items. The term "and / or" is a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in the present application generally indicates that the associated objects before and after are in an "or" relationship.

[0064] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0065] The directional terms mentioned in the embodiments of the present application, such as "inside", "outside", etc., are only references to the directions of the drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of the present application, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.

[0066] In the description of the embodiments of the present application, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the statement "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element. In the absence of further restrictions, an element defined by the statement "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0067] As used herein, "parallel", "perpendicular", "equal", and "coincidence" include the situations described and situations similar to the situations described, and the range of the similar situations is within the acceptable deviation range, wherein the acceptable deviation range is determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity can also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, the difference between the two being equal is less than or equal to 5% of either one. "Coincidence" includes absolute overlap and approximate overlap, wherein the acceptable deviation range of approximate overlap can be, for example, the distance between the two being less than or equal to 0.5 mm.

[0068] The present application provides an electronic device, which is a type of electronic device with a photosensitive device. Specifically, the electronic device can be a portable electronic device or other suitable electronic device. For example, the electronic device can be a mobile phone, a tablet personal computer, a laptop computer, a personal digital assistant (PDA), a camera, a personal computer, a notebook computer, a vehicle-mounted device, a wearable device (such as a watch or a bracelet), augmented reality (AR) glasses, an AR helmet, virtual reality (VR) glasses or a VR helmet, etc.

[0069] See also Figure 1 , Figure 2 and Figure 3 ,in, Figure 1 A schematic diagram of the structure of an electronic device 100 according to some embodiments of the present application; Figure 2 Based on Figure 1 An exploded schematic diagram of the electronic device 100 is shown; Figure 3 Based on Figure 1 The schematic diagram of the partial cross-sectional structure of the electronic device 100 shown is at the AA line. Wherein, "AA line" refers to the plane where the AA line and the arrows at both ends of the AA line are located. The description of similar figures in the following text should be understood in the same way and will not be repeated in the following text. In this embodiment, the electronic device 100 is a mobile phone. The electronic device 100 may include a display module 10, a front shell 20, a middle frame 30, a photosensitive device 40, a main circuit board 50, a sub-circuit board 60, a battery 70, a speaker 80 and a back shell 90. Wherein, the display module 10, the front shell 20, the middle frame 30, and the back shell 90 are stacked in sequence.

[0070] Understandably, Figure 1-Figure 3 Only some components of the electronic device 100 are schematically shown, and the actual shapes, sizes, positions and structures of these components are not subject to the present invention. Figure 1 , Figure 2 and Figure 3 In some other examples, the electronic device 100 may also not include the secondary circuit board 60.

[0071] The display module 10 is used to display image information, video information, etc. The display module 10 includes a transparent cover plate 11 and a display screen 12. The transparent cover plate 11 is in a flat plate shape. The material of the transparent cover plate 11 includes but is not limited to glass, plastic and ceramic. The transparent cover plate 11 and the display screen 12 are stacked and fixedly connected. The connection method between the transparent cover plate 11 and the display screen 12 includes but is not limited to gluing. The transparent cover plate 11 is mainly used to protect the display screen 12 and prevent dust.

[0072] The display screen 12 can be a flexible display screen or a rigid display screen. For example, the display screen 12 can be an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode or an active-matrix organic light-emitting diode (AMOLED) display screen, a mini organic light-emitting diode (MIL-E) display screen, a micro organic light-emitting diode (MIL-E) display screen, a micro organic light-emitting diode (MIL-E) display screen, a quantum dot light-emitting diode (QLED) display screen, or a liquid crystal display (LCD), etc. The display surface of the display screen 12 faces the transparent cover plate 11, so that the image, video and other information displayed on the display screen 12 can be observed by the user through the transparent cover plate 11.

[0073] In order to facilitate the description of each embodiment below, an XYZ coordinate system is established for the electronic device 100. Specifically, the thickness direction of the electronic device 100 (that is, the stacking direction of the light-transmitting cover plate 11 and the display screen 12) is defined as the Z-axis direction, and the directions perpendicular to the Z-axis direction are the X-axis direction and the Y-axis direction, and the X-axis direction is perpendicular to the Y-axis direction. Specifically, in this embodiment, the electronic device 100 is in the shape of a rectangular flat plate, wherein the length direction of the electronic device 100 is the Y-axis direction, and the width direction of the electronic device 100 is the X-axis direction. It can be understood that the coordinate system setting of the electronic device 100 can be flexibly set according to actual needs, and is not specifically limited here.

[0074] See also Figure 2 and Figure 3, the middle frame 30 includes a first frame 311 and a first middle plate 312, the first middle plate 312 is connected to the inner surface of the first frame 311, specifically, the first middle plate 312 is connected to the end of the inner surface of the first frame 311 away from the display module 10, and the first frame 311 is arranged around the first middle plate 312. The first frame 311 includes a first side 3111, a second side 3112, a third side 3113 and a fourth side 3114 connected in sequence. Among them, the first side 3111 and the third side 3113 are arranged oppositely in the first direction (for example, the Y-axis direction), and the second side 3112 and the fourth side 3114 are arranged oppositely in the X-axis direction. In this embodiment, the first side 3111 is the top side frame of the middle frame 30, the second side 3112 is the left side frame of the middle frame 30, the third side 3113 is the bottom side frame of the middle frame 30, and the fourth side 3114 is the right side frame of the middle frame 30.

[0075] The back shell 90 is stacked with the first middle plate 312 of the middle frame 30, and the back shell 90 is arranged on the side of the first middle plate 312 away from the display module 10, and the side of the back shell 90 away from the display module 10 forms the appearance surface of the electronic device 100. The back shell 90 is in the shape of a flat plate. The material of the back shell 90 includes but is not limited to glass, plastic, metal and ceramic. The first frame 311 is arranged around the back shell 90, and the back shell 90 is fixed to the first frame 311. Exemplarily, the back shell 90 can be fixedly connected to the first frame 311 by means of gluing, welding or clamping, that is, the first frame 311 and the back shell 90 can be assembled together. For example, a first step 3110 is formed on the inner circumference of the first frame 311 near the back shell 90, which is recessed in the direction away from the central axis of the first frame 311. The edge of the back shell 90 is supported on the first step 3110. In this way, the first step 3110 can be used to position and install the back shell 90, which can improve the installation efficiency. Of course, it is understandable that in other examples, the first step 3110 may not be provided on the first frame 311 , and the outer circumference of the back shell 90 is connected to the inner circumference of the first frame 311 .

[0076] As another example, the middle frame 30 and the back shell 90 may be an integral structure (not shown in the figure), in which case it can be understood that the first middle plate 312 and the back shell 90 are the same component, and the side of the first middle plate 312 away from the display module 10 forms the appearance surface of the electronic device 100. In addition, the middle frame 30 and the back shell 90 are an integral structure, which can also reduce the assembly process.

[0077] Please continue reading Figure 2 and Figure 3, the front shell 20 also includes a second middle plate 212 and a second frame 211, and the second middle plate 212 is in the shape of a rectangular flat plate. The back shell 90, the middle frame 30, the front shell 20 and the display module 10 are stacked, for example, stacked along the direction of the Z axis. The shape of the second middle plate 212 is adapted to the shape of the light-transmitting cover plate 11, and the stacking and fixing method of the display module 10 and the front shell 20 can be that the display module 10 is fixed on the second frame 211 of the front shell 20. Specifically, the second middle plate 212 is stacked on the side of the display screen 12 away from the light-transmitting cover plate 11. The second middle plate 212 is used as the structural "skeleton" of the electronic device 100, and the main circuit board 50, the auxiliary circuit board 60, the battery 70, etc. can be fixed on the second middle plate 212. It can be understood that in other examples, the front shell 20 may not include the second middle plate 212, but only include the second frame 211. When the front housing 20 does not include the second middle plate 212, the main circuit board 50, the auxiliary circuit board 60, the battery 70, etc. can be fixed on the surface of the display screen 12 away from the light-transmitting cover plate 11, or fixed on the second frame 211, or fixed on the first middle plate 312 of the middle frame 30. In the following description, the front housing 20 including the second middle plate 212 is taken as an example for explanation.

[0078] The second frame 211 is formed into a ring frame structure. Figure 2 , the second frame 211 includes a fifth side 2115, a sixth side 2116, a seventh side 2117 and an eighth side 2118 connected in sequence. Among them, the fifth side 2115 and the seventh side 2117 are arranged opposite to each other in a first direction (for example, the Y-axis direction). The sixth side 2116 and the eighth side 2118 are arranged opposite to each other in the X-axis direction. In this embodiment, the fifth side 2115 is the top side frame of the front shell 20, the sixth side 2116 is the left side frame of the front shell 20, the seventh side 2117 is the bottom side frame of the front shell 20, and the eighth side 2118 is the right side frame of the front shell 20.

[0079] The second frame 211 is disposed around the second middle plate 212 and the display module 10, and is connected to the second middle plate 212 and the display module 10. For details, please refer to Figure 3 A second step 2110 is formed on the portion of the inner circumference of the second frame 211 close to the transparent cover plate 11, which is recessed in the direction away from the central axis of the second frame 211. The edge of the transparent cover plate 11 is supported and fixed on the second step 2110. In this way, the display module 10 can be positioned and installed using the second step 2110, which can improve the installation efficiency. Of course, it can be understood that in other examples, the second step 2110 may not be provided on the second frame 211. The outer circumference of the transparent cover plate 11 is connected to the inner circumference of the second frame 211. The connection method between the transparent cover plate 11 and the second frame 211 includes but is not limited to gluing, welding or clamping.

[0080] The front shell 20 may be an integrally formed structure, that is, the second middle plate 212 and the second frame 211 are an integral structure. This is conducive to improving the structural strength of the front shell 20, simplifying the processing technology of the front shell 20, and reducing the production cost of the front shell 20. Of course, the present application is not limited to this. In other examples, the front shell 20 may also be formed by assembling the second frame 211 and the second middle plate 212. The connection method between the second frame 211 and the second middle plate 212 includes but is not limited to gluing, clamping, screw connection, welding, etc.

[0081] like Figure 2 As shown, the middle frame 30 and the front shell 20 are stacked in the Z-axis direction, and the dimensions of the first frame 311 in the X and Y directions are greater than the dimensions of the second frame 211 in the X and Y directions, so that the first frame 311 at least partially wraps the second frame 211, that is, a full-enclosed structure (i.e., a unibody structure) is formed, in which the first side edge 3111 of the middle frame 30 is located at the periphery of the fifth side edge 2115 of the front shell 20 and is opposite to the fifth side edge 2115, the second side edge 3112 of the middle frame 30 is located at the periphery of the sixth side edge 2116 of the front shell 20 and is opposite to the sixth side edge 2116, the third side edge 3113 of the middle frame 30 is located at the periphery of the seventh side edge 2117 of the front shell 20 and is opposite to the seventh side edge 2117, and the fourth side edge 3114 of the middle frame 30 is located at the periphery of the eighth side edge 2118 of the front shell 20 and is opposite to the eighth side edge 2118. Thus, the first frame 311 of the middle frame 30 partially wraps the second frame 211 of the front shell 20 on the outside, and the outer surface of the middle frame 30 becomes the appearance surface of the electronic device 100. Exemplarily, the outer surface includes the appearance surface of the top of the electronic device 100.

[0082] It should be noted that when the second frame 211 and the second middle plate 212 are not an integral structure, or the second middle plate 212 is not provided in the front shell 20, the second frame 211 can be an integrally molded structure with the back shell 90, that is, the second frame 211 and the back shell 90 are an integral structure.

[0083] The main circuit board 50 is used to integrate a control chip. The control chip includes a processor (for example, an application processor (AP), a memory (for example, a double data rate synchronous dynamic random access memory (double data rate, DDR, universal flash storage (UFS)) and a controller. In some embodiments, the main circuit board 50 is electrically connected to the display screen 12, and the main circuit board 50 is used to control the display screen 12 to display images or videos.

[0084] The main circuit board 50 can be a hard circuit board, a flexible circuit board, or a hard-soft circuit board. For example, the main circuit board 50 can be a FR-4 dielectric board, a Rogers dielectric board, a mixed dielectric board of FR-4 and Rogers, etc. Here, FR-4 is a code for a flame retardant material grade, and Rogers dielectric board is a high-frequency board.

[0085] The main circuit board 50 is located in the second frame 211 and fixed relative to the second frame 211. Specifically, the main circuit board 50 is fixed to the surface of the second middle plate 212 away from the display module 10, that is, the surface facing the back shell 90. Exemplarily, the main circuit board 50 can be fixed to the surface of the second middle plate 212 away from the display module 10 by means of threaded connection, clamping, gluing or welding.

[0086] In order to increase the layout area of ​​the main circuit board 50, electronic components are arranged on the surface of the main circuit board 50 facing the display module 10. On this basis, in order to prevent the electronic components on the surface of the main circuit board 50 facing the second middle plate 212 from interfering with the second middle plate 212, there is an escape gap between the electronic components on the surface of the main circuit board 50 facing the display module 10 and the second middle plate 212. Exemplarily, in order to facilitate the formation of the escape gap, a convex portion (not shown) is provided on the surface of the second middle plate 212 facing the back shell 90. The main circuit board 50 is fixed to the convex portion. In other examples, the convex portion may also be provided on the main circuit board 50. For example, the convex portion may be a screw column. Of course, it is understood that in other examples, the formation method of the escape gap is not limited to this, and it may also be that holes or grooves for escape are provided at the position corresponding to the electronic components of the second middle plate 212. As long as the electronic components on the surface of the main circuit board 50 facing the display module 10 and the second middle plate 212 are kept at a distance, it is sufficient.

[0087] The secondary circuit board 60 is used to integrate a universal serial bus (USB) device 60b. The USB device 60b can be a USB type-C interface device, a USB type-A interface device, a USB type Micro-B interface device, or a USB type-B interface device. A socket 211a (not shown) is provided at a position corresponding to the USB device 60b on the second frame 211, and accessories such as a charger and a data cable can be electrically connected to the USB device 60b via the socket 211a to achieve transmission of power, signals, and data.

[0088] The auxiliary circuit board 60 can be a hard circuit board, a flexible circuit board, or a hard-soft circuit board. The auxiliary circuit board 60 can be a FR-4 dielectric board, a Rogers dielectric board, a mixed dielectric board of FR-4 and Rogers, and so on.

[0089] The auxiliary circuit board 60 is located in the second frame 211 and is relatively fixed to the second frame 211. Specifically, the auxiliary circuit board 60 is fixed to the surface of the second middle plate 212 away from the display module 10, that is, the surface facing the back shell 90. Specifically, the auxiliary circuit board 60 can be fixed to the surface of the second middle plate 212 away from the display module 10 by means of threaded connection, clamping, gluing or welding. The auxiliary circuit board 60 and the main circuit board 50 are arranged in the Y-axis direction. For example, the auxiliary circuit board 60 can be arranged on the side of the battery 70 facing the seventh side 2117, and the main circuit board 50 can be arranged on the side of the battery 70 facing the fifth side 2115. It can be understood that when the electronic components are arranged on the surface of the auxiliary circuit board 60 facing the display module 10, in order to prevent the electronic components on the surface of the auxiliary circuit board 60 facing the display module 10 from interfering with the second middle plate 212, there can also be an avoidance gap (not shown in the figure) between the electronic components on the surface of the auxiliary circuit board 60 facing the display module 10 and the second middle plate 212.

[0090] The auxiliary circuit board 60 is electrically connected to the main circuit board 50 through a connection structure to achieve data and signal transmission between the auxiliary circuit board 60 and the main circuit board 50. The connection structure may be a flexible printed circuit (FPC). In other embodiments, the connection structure may also be a wire or an enameled wire.

[0091] The battery 70 is fixed on the surface of the second middle plate 212 away from the display module 10, that is, on the surface facing the back shell 90, and is located between the main circuit board 50 and the auxiliary circuit board 60. In some embodiments, a mounting groove is provided on the surface of the second middle plate 212 facing the back shell 90, and the battery 70 is fixed in the mounting groove. It can be understood that in other examples, the second middle plate 212 may not be provided with a mounting groove, but the side of the main circuit board 50, the side of the auxiliary circuit board 60, the surface of the second middle plate 212 facing the back shell 90 and the second frame 211 are used to form a mounting groove for placing the battery 70. The battery 70 is used to provide power to the main circuit board 50, the auxiliary circuit board 60, the display module 10 and the photosensitive device 40.

[0092] The battery 70 may include but is not limited to a nickel-cadmium battery, a nickel-metal hydride battery, a lithium battery or other types of batteries. In addition, the number of the battery 70 in the embodiment of the present application may be multiple or one, and the specific number and arrangement of the battery 70 in the embodiment of the present application may be set according to actual needs.

[0093] The speaker 80 is used to convert the audio electrical signal into a sound signal. The speaker 80 is fixed on the main circuit board 50, and can also be fixed on the auxiliary circuit board 60. Alternatively, in other examples, when the electronic device 100 also includes other circuit boards in addition to the main circuit board 50 and the auxiliary circuit board 60, the speaker 80 can also be fixed on the other circuit boards, as long as the speaker 80 is fixed on the circuit board.

[0094] like Figure 1 As shown, the first side 3111 of the middle frame 30 has a sound hole 311b extending therethrough, and the fifth side 2115 of the front shell 20 also has a sound hole (not shown) extending therethrough at the corresponding position. The sound emitted by the speaker 80 is transmitted to the outside of the electronic device 100 via the sound hole 311b. When the electronic device 100 answers a call or voice message, the voice can be answered by placing the sound hole 311b close to the human ear. In other examples, the sound hole 311b may also be provided between the display module 10 and the fifth side 2115 of the front shell. It is understandable that in other examples, the sound hole 311b may also be formed at one end of the light-transmitting cover plate 11 of the display module 10 adjacent to the fifth side 2115. As long as it is ensured that the end of the electronic device 100 having the fifth side 2115 is provided with a sound hole 311b.

[0095] like Figure 3As shown, the photosensitive device 40 can be used to detect the light intensity of the ambient light in the external environment where the electronic device 100 is located. Specifically, the photosensitive device 40 can be an ambient light sensor. The ambient light sensor generally includes a photosensitive element and a logic circuit. The photosensitive element is used to detect ambient light and generate current. The logic circuit includes a current amplifier and a passive low-pass filter to detect and process the output voltage signal caused by the light input. Using the light intensity of the current ambient light in the environment where the electronic device 100 is located measured by the ambient light sensor, the electronic device 100 can realize the function of automatically adjusting the screen brightness. For example, when the ambient light sensor detects that the light intensity of the current ambient light in the environment where the electronic device 100 is located is dark, the brightness of the screen can be reduced to prevent glare; when the ambient light sensor detects that the light intensity of the current ambient light in the environment where the electronic device 100 is located is bright, the screen brightness is increased to make the screen display clearer. Of course, it can be understood that in other examples, the photosensitive device 40 can also be a proximity / ambient light sensor that integrates the functions of an ambient light sensor and a proximity light sensor. It is sufficient as long as the photosensitive device 40 has the function of detecting the light intensity of the ambient light in the external environment where the electronic device 100 is located.

[0096] The photosensitive device 40 has a first end 40A1 and a second end 40A2 that are opposite to each other along the thickness direction thereof. The photosensitive device 40 is fixed to the surface of the main circuit board 50 facing the display module 10 by means of the first end 40A1, and is electrically connected to the main circuit board 50. In other examples, the photosensitive device 40 may also be arranged on the surface of the auxiliary circuit board 60 facing the display module 10, and be electrically connected to the auxiliary circuit board 60. Alternatively, in other examples, when the electronic device 100 further includes other circuit boards in addition to the main circuit board 50 and the auxiliary circuit board 60, the photosensitive device 40 may also be fixed to the surface of the other circuit boards facing the display module 10, as long as the photosensitive device 40 is fixed to the surface of the circuit board facing the display module 10. In the following description, the photosensitive device 40 is fixed to the main circuit board 50 as an example for explanation.

[0097] For example, the photosensitive device 40 can be disposed on the main circuit board 50 by using a surface mount device (SMD) process. In this way, the height of the photosensitive device 40 protruding from the main circuit board 50 can be reduced, and the overall thickness of the main circuit board 50 and the photosensitive device 40 can be reduced, thereby facilitating the reduction of the overall thickness of the electronic device 100.

[0098] In order to improve the reliable detection of the light intensity of the ambient light by the photosensitive device 40, the second end 40A2 of the photosensitive device 40 faces the display module 10, and the second end 40A2 of the photosensitive device 40 has a photosensitive surface. Figure 3As shown, in this embodiment, a gap 201 is provided between the front shell 20 of the electronic device 100 and the display screen 12 of the display module 10, a through hole 202 is provided on the second middle plate 212, and a light guide 401 is provided around the periphery of the photosensitive device 40, or the light guide 401 can be provided above the photosensitive device 40 (not shown in the figure), and the external light passes through the transparent cover plate 11 of the display module 10 and then passes through the gap 201 and the light guide 401 to enter the photosensitive device 40, so that the photosensitive device 40 receives the ambient light. However, in this solution, since the gap 201 is provided between the front shell 20 and the display screen 12 of the display module 10, the effective display area of ​​the display screen 12 becomes smaller, thereby increasing the black edge of the screen, and there are problems such as overflow of glue and blockage at the position of the gap 201, which cause the risk of functional failure. In addition, since the through hole 202 is provided on the second middle plate 212, the structural strength of the second middle plate 212 will also be affected.

[0099] In order to improve the structural strength of the display module 10 and the full-screen design, the structural strength of the second middle plate 212 is also improved. Figure 4 and Figure 5 , Figure 4 The schematic diagram of the structure of the electronic device 100 provided in some other embodiments is as follows. Figure 5 Based on Figure 4 The schematic diagram of the partial cross-sectional structure of the electronic device 100 at line BB is shown, specifically, a cross-sectional view at line BB toward the negative direction of the X-axis. Figure 1-Figure 3 The difference of the illustrated embodiment is that the ambient light of the present embodiment does not enter the photosensitive device 40 through the gap between the front shell 20 and the display screen 12, but a first through hole 311c is opened on the first frame 311 of the middle frame 30, and a second through hole 211c is opened on the second frame 211 of the front shell 20. After the middle frame 30 and the front shell 20 are assembled, the positions of the first through hole 311c and the second through hole 211c are relatively arranged, so that at least one light guide 030 can pass through the first through hole 311c and the second through hole 211c, and external light enters the light guide 030 through the light incident surface 0211 of the light guide 030 and is emitted from the light emitting surface 0212. The photosensitive device 40 receives the light emitted from the light emitting surface 0212, thereby realizing the detection of the brightness of the external ambient light. In this solution, holes are opened on the first frame 311 of the middle frame 30 and the second frame 211 of the front shell 20. Since the ambient light does not need to pass through the gap between the front shell 20 and the display screen 12 to reach the photosensitive device 40, the size of the gap between the front shell 20 and the display screen 12 can be reduced, thereby reducing the black edge of the screen and improving the display effect. In addition, since there is no need to set a through hole on the second middle plate 212, the strength of the middle plate 212 can be further improved.

[0100] It should be noted that the relative arrangement of the positions of the first through hole 311c and the second through hole 211c means that the projections of the first through hole 311c and the second through hole 211c on the plane formed by the X-axis and the Z-axis at least partially overlap, so that external light can enter the interior of the electronic device 100 through the first through hole 311c and the second through hole 211c.

[0101] However, in the above embodiment, since the electronic device 100 is a fully enclosed unibody structure, which includes both the middle frame 30 and the front shell 20, during the assembly process, the light guide 030 is often assembled with the front shell 20 first, and a part of the light guide 030 protrudes from the outer surface of the second frame 211. When the middle frame 30 and the front shell 20 are assembled, the middle frame 30 needs to be snapped into the front shell 20 from the back of the front shell 20 (i.e., from the Z-axis direction) so that the first frame 311 wraps the second frame 211, and in order to ensure the firmness of the wrapping, a smaller assembly gap is provided between the middle frame 30 and the front shell 20. At this time, the part of the light guide 030 protruding from the outer surface of the second frame 211 will cause assembly interference problems, making it difficult for the middle frame 30 to be snapped onto the front shell 20, thereby causing the problem of assembly difficulty in this solution.

[0102] In order to solve the technical problems existing in the above two solutions, so as to achieve the technical effect that the electronic device 100 has a higher screen-to-body ratio while taking into account the convenience of assembly of the electronic device 100, the present application provides the following Figure 6 An electronic device 100 according to another embodiment is shown. Figure 6 Based on Figure 4 A partial cross-sectional structural schematic diagram of an electronic device 100 at line BB in another scheme is shown, wherein the light guide 030 includes a first light guide 031 and a second light guide 032 of split design, wherein the first light guide 031 is assembled with the middle frame 30, and the second light guide 032 is assembled with the front shell 20. Due to the split design, the size design of the second light guide 032 can be more flexible. After being assembled with the front shell 20, the second light guide 032 may not protrude from the outer surface of the front shell 20, thereby making it easier to snap fit between the middle frame 30 and the front shell 20.

[0103] Figure 8 is a schematic structural diagram of the first light guide 031, Fig. 9 is a schematic structural diagram of the second light guide member 032, Fig.10 The schematic diagram of the structure after the first light guide 031 and the second light guide 032 are assembled is as follows: Figure 8-Figure 10As shown, the first light guide 031 includes a first light guide column 0311 and a first mounting plate 0312, the first mounting plate 0312 includes a first mounting surface 0313 and a first light emitting surface 0314, the first mounting surface 0313 is arranged opposite to the first light emitting surface 0314, the first light guide column 0311 is arranged on the first mounting surface 0313 and extends toward a side away from the first mounting surface 0313, the first light guide column 0311 includes a first light inlet surface 0315 (i.e., the end surface of the first light guide 031) away from the first mounting surface 0313, the first light guide column 0311 and the first mounting plate 0312 can be a split design or an integrated design, for example, the two are an integrated design. Figure 6 As shown, when the first light guide 031 is assembled with the middle frame 30, the first light guide column 0311 is at least partially located in the first through hole 311c of the middle frame 30, and the first mounting surface 0313 is in contact with the inner surface of the first frame 311. In order to ensure the beauty of the electronic device 100, the first light guide column 0311 does not protrude from the outer surface of the middle frame 30, for example, the first light-incoming surface 0315 of the first light guide column 0311 is flush with the outer surface of the middle frame 30.

[0104] The second light guide 032 includes a second light guide column 0321, a second mounting plate 0322 and a light guide plate 0323. The second light guide column 0321 and the light guide plate 0323 are respectively connected to the second mounting plate 0322. The second light guide column 0321, the second mounting plate 0322 and the light guide plate 0323 can be a split structure or an integrated structure, for example, an integrated structure. The second mounting plate 0322 includes a second mounting surface 0324, and the second mounting surface 0324 is used to be arranged opposite to the inner surface of the second frame 211.

[0105] The second light guide column 0321 is arranged on the second mounting surface 0324 and extends in a direction away from the second mounting surface 0324 (in the Y direction or nearly parallel to the Y direction). The second light guide column 0321 includes a second light inlet surface 0325 (i.e., an end surface of the second light guide column 0321) away from the second mounting surface 0324. The light guide plate 0323 is arranged on the other side of the second mounting plate 0322 opposite to the second mounting surface 0324 and extends in a direction opposite to the extension direction of the second light guide column 0321 (in the negative direction of the Y direction or nearly parallel to the Y direction). The light guide plate 0323 includes a third mounting surface 0326 and a second light emitting surface 0327. The third mounting surface 0326 and the second light emitting surface 0327 are located on both sides of the light guide plate 0323. The third mounting surface 0326 and the second middle plate 212 are arranged opposite to each other on a side surface away from the display module 10. The third mounting surface 0326 and the second mounting surface 0324 are respectively matched with the second frame 211 and the second middle plate 212 of the front shell 20, so that the second light guide member 032 is conveniently fixed on the front shell 20.

[0106] Among them, the second light guide member 032 and the front shell 20 are assembled together, and the second light guide column 0321 is assembled on the second through hole 211c, so that at least a part of the second light guide column 0321 is located in the second through hole 211c and the second light-entry surface 0325 of the second light guide column 0321 is flush with the outer surface of the second frame 211 (that is, the outer surface of the front shell 20) or slightly protrudes from the outer surface of the second frame 211, the second mounting surface 0324 is in contact with the inner surface of the second frame 211 of the front shell 20, and the third mounting surface 0326 is in contact with the side of the second middle plate 212 of the front shell 20 away from the display module 10, and an angle α is formed between the second mounting plate 0322 and the light guide plate 0323, and the size of α depends on the angle between the inner surface of the second frame 211 of the front shell 20 and the side of the second middle plate 212 away from the display module 10, and α can be 90°, or slightly greater than 90°.

[0107] As mentioned above, since the positions of the first through hole 311c and the second through hole 211c are relatively arranged, at least a portion of the first light guide column 0311 is located in the first through hole 311c of the middle frame 30, and at least a portion of the second light guide column 0321 is located in the second through hole 211c. Therefore, the first light guide column 0311 and the second light guide column 0321 are relatively arranged. This relative arrangement allows external ambient light to pass through the first light inlet surface 0315 (i.e., the first light guide column 0311). The light emitted from the first light emitting surface 0314 enters the second light guide member 032 through the second light input surface 0325 (i.e., the end surface of the second light guide member 032). After being transmitted in the second light guide member 032, the light is transferred to the second light emitting surface 0327 and emitted. The photosensitive device 40 receives the light emitted from the second light emitting surface 0327, thereby realizing the detection of the brightness of the external environment.

[0108] For example, the opening position of the second through hole 211c is set at the lower part of the second frame 211 of the front shell 20, and the projections of the first light-entering surface 0315 and the second light-entering surface 0325 on the plane where the first side edge 3111 of the middle frame 30 is located partially overlap but do not completely overlap, so that the strength of the front shell 20 can be ensured, and external light can be ensured to reach the interior of the electronic device 100 smoothly.

[0109] In this solution, since the light guide 030 is designed to be split, when assembling the electronic device 100, the second light guide 032 and the front shell 20 can be assembled first, and then the first light guide 031 and the middle frame 30 can be assembled, and finally the middle frame 30 equipped with the first light guide 031 can be snapped onto the front shell 20 equipped with the second light guide 032. The relative arrangement of the assembled second light guide 032 and the first light guide 031 allows external light to be smoothly transmitted to the photosensitive device 40 through the second light guide 032 and the first light guide 031. In addition, since the second light-incoming surface 0325 of the second light guide column 0321 is flush with the outer surface of the second frame 211 (i.e., the outer surface of the front shell 20) or slightly protrudes from the outer surface of the second frame 211, the second light guide column 0321 will not interfere with the subsequent assembly, and the middle frame 30 can be easily snapped onto the front shell 20, thereby reducing the difficulty of assembly. Furthermore, since the light guide 030 includes the first light guide 031 and the second light guide 032, the volume of the light guide 030 is larger, the terminal device can sense the external light intensity with a larger field of view, improve the terminal device's screen brightness automatic adjustment function, and enhance the user experience.

[0110] Continue to see Fig.11 , the propagation path of the light in this embodiment is introduced in detail. The light enters the first light guide 031 from the outside through the first light inlet surface 0315, and is emitted from the first light outlet surface 0314. The light emitted from the first light outlet surface 0314 enters the second light inlet surface 0325, and part of the light is transmitted or reflected in the second light guide 032, and then is emitted from the second light outlet surface 0327. The photosensitive device 40 receives the light emitted from the second light outlet surface 0327, thereby realizing the detection of the brightness of the external environment. It should be noted that after the light enters the first light guide 031 from the outside, the light can be reflected, refracted and scattered inside the first light guide 031. After entering the second light guide 032, the light can also be reflected, refracted and scattered. The light can be emitted from the second light outlet surface 0327 or from the surface opposite to the second mounting surface 0324, but most of the light emitted from the second light outlet surface 0327 can enter the photosensitive device 40.

[0111] In a more preferred embodiment, Figure 8 As shown, the first light guide column 0311 can be tilted on the first mounting surface 0313 toward the side close to the display module, so that an angle θ is formed between the axis of the first light guide column 0311 and the horizontal plane (i.e., the plane of the display module). This tilted arrangement of the first light guide column 0311 allows external light to enter the light guide more easily when the user uses the electronic device 100 normally (the display module 10 faces upward), thereby achieving more accurate ambient brightness detection.

[0112] In a more preferred embodiment, Figure 7 As shown, in this embodiment, the bottom surface 0612 of the receiving groove 0611 is tilted, so that the angle β between the bottom surface 0612 and the horizontal plane (i.e., the surface on which the display module extends) is less than 90°, that is, the distance from the side of the bottom surface 0612 close to the back shell 90 to the inner surface of the first side 3111 of the middle frame 30 is greater than the distance from the side of the bottom surface 0612 away from the back shell 90 to the inner surface of the first side 3111 of the middle frame 30. Since the bottom surface 0612 of the receiving groove 0611 is tilted, after the first buffer 051 is set on the receiving groove 0611, the surface of the first buffer 051 is also tilted, and as shown in the attached Fig.13 As shown, the first light emitting surface 0314 of the first light guide member 031 and the second light incident surface 0325 of the second light guide member 032 are both adaptively tilted.

[0113] This inclined arrangement can make it easier for the middle frame 30 to be buckled onto the front shell 20 , and can also reduce scratches on the first light emitting surface 0314 and the first buffer member 051 .

[0114] It should be noted that, no matter which of the above-mentioned assembly schemes is used, the first buffer member 051 cannot block the light guide path between the two light guide members. It should be noted that in order to improve the surface effect and surface quality of the light-emitting surface and the light-incoming surface, and at the same time reduce the risk of the light surface being scratched by foreign objects, some surface treatments can be performed on the light-emitting surface and the light-incoming surface, such as mirror polishing and surface texture effects.

[0115] Among them, the surface forms of the first light-emitting surface 0314 and the second light-incoming surface 0325 can be not restricted, and can be a flat surface, a curved surface, or a combination of surfaces; and surface treatment can be performed to increase the light transmittance, surface hardness, wear resistance, etc. of the light guide, and the treatment method can be mirror polishing, texture effect, coating treatment, etc.

[0116] Among them, the first light guide 031 and the second light guide 032 can be made of the same material or different materials. The material of the light guide can be one or more of polycarbonate (PC), polymethacrylate (PMMA), polystyrene (PS), polypropylene (PP), polyvinyl chloride (PVC), and polyurethane (PU). When different materials are used, for example, the first light guide 031 can be made of a material that takes into account both the exquisiteness of the appearance and the light transmittance. The first light guide 031 is used to sense the external ambient light and transmit it to the inside of the mobile terminal. At the same time, the material of the first light guide 031 can be a semi-transparent material with high diffusion particles to improve the perception range of external light; the second light guide 032 can be made of a material with better light transmittance to improve the sensitivity of the luminous flux, that is, the light transmittance of the second light guide 032 is greater than that of the first light guide 031, so that the entire ambient light solution can take into account both the exquisiteness of the appearance and the light transmittance.

[0117] Continue to see Figure 6 or Figure 7 A second colloid 041 is disposed between the first mounting surface 0313 of the first light guide 031 and the inner surface of the first frame 311. The first light guide 031 is fixed to the inner surface of the first frame 311 by the second colloid 041. For example, the second colloid 041 is arranged circumferentially around the first light guide column 0311 on the first mounting surface 0313. The circumferential arrangement of the second colloid 041 can block contaminants such as external liquid from entering the interior of the electronic device 100 through the first through hole 311c, thereby playing a sealing and protective role.

[0118] A third colloid 042 is arranged between the second mounting surface 0324 of the second light guide 032 and the inner surface of the second frame 211, and a third colloid 042 is also arranged between the third mounting surface 0326 of the second light guide 032 and the second middle plate 212. The second light guide 032 is adhered to the second frame 211 and the second middle plate 212 through the third colloid 042. Exemplarily, the third colloid 042 is continuously arranged on the second mounting surface 0324 and the third mounting surface 0326, and the third colloid 042 is arranged circumferentially around the second light guide column 0321. Through this arrangement, the third colloid 042 can block pollutants such as external liquid from entering the cavity inside the electronic device 100 through the second through hole 211c, thereby playing a role of sealing and protection.

[0119] Continue to see Figure 6 or Figure 7 A second buffer member 052 can be provided between the first middle plate 312 and the front shell 20. The second buffer member 052 provides a buffering effect, so that when the middle frame 30 is buckled onto the front shell 20, damage to the front shell 20 and other components can be reduced. At the same time, it can protect the liquid inlet path of the gap between the front shell 20 and the middle frame 30.

[0120] See also Figure 12-14 As shown, Fig.12 A three-dimensional view of the front shell 20, Fig.13 is a partial enlarged view of the front shell 20, Fig.14 FIG. 2 is an exploded view of the assembly of the first light guide 041 and the second light guide 032. Figure 12-13As shown, the fifth side 2115 of the front shell 20 has an outer surface 061 (also the outer surface of the front shell), and the outer surface 061 is recessed inward in the peripheral area of ​​the second through hole 211c to form a receiving groove 0611, and the receiving groove 0611 has a bottom surface 0612 and a peripheral side surface 0613, and the peripheral side surface 0613 is arranged around the bottom surface 0612. The second through hole 211c passes through the inner surface of the fifth side 2115 and the bottom surface 0612, and the inner surface of the second through hole 211c is connected to the bottom surface 0612. The shape of the receiving groove 0611 can be an irregular polygon, square, rectangle, trapezoid, circle or any other shape, as long as the receiving groove 0611 covers and surrounds the second through hole 211c.

[0121] Continue to see Figure 6 or Figure 7 , a first buffer 051 matching the shape of the receiving groove 0611 is fixedly arranged on the receiving groove 0611, and the first buffer 051 is provided with a third through hole 0521, and the third through hole is arranged opposite to the second through hole 211c so that the light emitted from the first light emitting surface 0314 can enter the second light entering surface 0325. For example, a first colloid 053 is arranged between the first buffer 051 and the receiving groove 0611, and the first buffer 051 is fixed on the receiving groove 0611 through the first colloid 053. For example, the diameter of the third through hole 0521 is greater than the diameter of the second light guide column 0321, and the diameter of the third through hole 0521 is greater than the diameter of the second through hole 211c.

[0122] Exemplarily, the first buffer component 051 can be set to a sealing material such as foam, and the first buffer component 051 can be compressed in the Y-axis direction. By setting the first buffer component 051 on the accommodating groove 0611, when the middle frame 30 is buckled into the front shell 20 from the Z-axis direction, the first light guide component 031 can first contact the first buffer component 051, and will not cause the first light guide component 031 to directly bump into or squeeze the second light guide component 032, thereby avoiding affecting the assembled second light guide component 032, thereby playing a role in buffering the squeezing force of the first light guide component 031.

[0123] Exemplarily, the end face of the second light guide column 0321 (i.e., the second light incident surface 0325) is flush with the bottom surface 0612 of the accommodating groove 0611, or the end face 030123 of the second light guide column 0321 protrudes slightly from the bottom surface 0612 but does not protrude from the outer surface 061, that is, the protrusion of the second light guide column 0321 is based on not interfering with the first light guide member 031 after assembly.

[0124] For example, after being assembled, there is a certain gap between the first light emitting surface 0314 of the first light guide member 031 and the second light incident surface 0325 of the second light guide member 032 , and the gap range may be 0-0.25 mm.

[0125] For example, the first colloid 053 and the first buffer member 051 are both arranged around the second through hole 211c, thereby further improving the sealing and protection effect.

[0126] In this embodiment, by respectively setting the second colloid 041 between the first mounting surface 0313 of the first light guide 031 and the inner surface of the first frame 311, setting the third colloid 042 between the third mounting surface 0326 of the second light guide 032 and the second middle plate 212, and setting the second buffer member 052 between the first middle plate 312 and the front shell 20, the first buffer member 051 and the first colloid 053 on the accommodating groove 0611 can effectively prevent external liquid from entering the interior of the electronic device 100, thereby forming a multi-level sealing solution.

[0127] Continue to see Fig.13 A limiting step 0614 is also provided near the periphery of the receiving groove 0611, and the limiting step 0614 includes a limiting step bottom surface 0615 and a limiting step side surface 0616, and the limiting step bottom surface 0615 and the limiting step side surface 0616 are connected, and the limiting step 0614 is arranged around the receiving groove 0611, and the limiting platform bottom surface 0615 is parallel to the receiving groove bottom surface 0612 to form a ring-shaped limiting step bottom surface 0615, and the limiting step bottom surface 0615 has a height difference with the outer surface 061 and the bottom surface 0612 in a direction perpendicular to the limiting step bottom surface 0615, and the limiting step bottom surface 0615 and the limiting step side surface 0616 form a limiting space, and the size of the limiting space is the same as the first position of the first light guide 031. The size of the mounting plate 0312 is matched, so that after the first light guide 031 is assembled, the first light emitting surface 0314 of the first mounting plate 0312 and the bottom surface 0615 of the limiting step are fitted or approximately fitted, the side surface of the first mounting plate 0312 and the side surface 0616 of the limiting step are fitted or approximately fitted, the end surface of the second light guide 032 does not protrude from the bottom surface 0615 of the limiting step, the bottom surface 0615 of the limiting step can limit the movement of the first light guide 031 in a direction perpendicular to the bottom surface 0615 of the limiting step, and the side surface 0616 of the limiting step can prevent the first light guide 031 from rotating, avoiding position deviation, thereby avoiding affecting the light transmission effect between the first light guide 031 and the second light guide 032. In addition, the limiting step 0614 can also make the first light guide 031 more quickly aligned with the second light guide 032, thereby improving the installation efficiency. Furthermore, by arranging the end face of the second light guide member 032 not to protrude from the bottom surface 0615 of the limiting step, when the electronic device 100 is dropped or impacted, the first light guide member 031 will first touch the bottom surface 0615 of the limiting step instead of the second light input surface 0325 of the second light guide member 032, thereby avoiding scratching the second light input surface 0325.

[0128] See also Fig.14As shown, the second colloid 041 , the first light guide 031 , the first buffer 051 , the first colloid 053 , the front housing 20 , the third colloid 042 and the second light guide 032 are stacked in the opposite direction of the Y axis.

[0129] Continue to see Fig.13 and Fig.15 The electronic device 100 is further provided with a snap-fit ​​structure 062 in the X-axis direction. The snap-fit ​​structure 062, the limiting step 0614 and the receiving groove 0611 are distributed along the X-axis direction. For example, the snap-fit ​​structure 062 includes a first snap-fit ​​structure 0621 and a second snap-fit ​​structure 0622. The second snap-fit ​​structure 0621 and the second snap-fit ​​structure 0622 are respectively arranged on both sides of the receiving groove 0611.

[0130] like Fig.15 As shown, the first engaging structure 0621 may be a plug-in structure, a slot 0623 is provided on the outer surface of the front shell 20, and an inserting tongue 0624 is provided on the inner surface of the middle frame 30. When the middle frame 30 is buckled onto the front shell 20, the inserting tongue 0624 is inserted into the slot 0623; the second engaging structure 0622 may be a buckling structure, a groove 0625 is provided on the surface of the front shell 20, and a raised barb 0626 is provided on the inner surface of the middle frame 30. When the middle frame 30 is buckled onto the front shell 20, the barb 0626 is buckled into the groove 0625. Through the above-mentioned first engaging structure 0621 and second engaging structure 0622, the middle frame 30 can be buckled onto the front shell 20 more firmly, and the middle frame 30 can be prevented from generating problems such as pressing virtual position or abnormal sound, and the displacement of the first light guide 031 in the Y direction and the Z direction can be limited, thereby ensuring the position accuracy of the first light guide 031 and the second light guide 032.

[0131] It should be noted that the specific implementation of the snap-fit ​​structure 062 in this solution is not limited, as long as it can achieve a firm buckle between the middle frame 30 and the front shell 20, for example, the first snap-fit ​​structure 0621 and the second snap-fit ​​structure 0622 can both be plug-in structures or can both be snap-fit ​​structures, the first snap-fit ​​structure 0621 can also be a snap-fit ​​structure and the second snap-fit ​​structure 0622 can be a plug-in structure. The number of snap-fit ​​units of the snap-fit ​​structure 062 can also be greater than 2.

[0132] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0133] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. An electronic device, characterized in that: include: A first frame body, surrounding and forming a first accommodating cavity, wherein the first frame body comprises a first frame, and the first frame is provided with a first through hole; A second frame body is disposed in the first accommodating cavity, the second frame body comprises a second frame, the second frame is provided with a second through hole, and the second through hole is at least partially opposite to the first through hole; A first light guide member, at least partially located in the first through hole; A second light guide member, at least partially located in the second through hole; and A photosensitive device is arranged inside the electronic device, and light can be transmitted to the photosensitive device through the first light guide member and the second light guide member in sequence.

2. The electronic device according to claim 1, characterized in that: Adjacent surfaces of the first light guide member and the second light guide member are parallel to each other and spaced apart.

3. The electronic device according to claim 2, characterized in that: The distance between adjacent surfaces of the first light guide member and the second light guide member is 0-0.25 mm.

4. The electronic device according to any one of claims 1 to 3, characterized in that: The light transmittance of the second light guide member is greater than the light transmittance of the first light guide member.

5. The electronic device according to any one of claims 1 to 4, characterized in that: The peripheral area of ​​the second through hole is recessed to form a receiving groove, and the bottom surface of the receiving groove is inclined so that in the thickness direction of the electronic device, the bottom surface of the receiving groove gradually moves away from the first frame in the direction away from the display module.

6. The electronic device according to any one of claims 1 to 5, characterized in that: The invention also includes a first buffer member, wherein the first buffer member is arranged between the first light guide member and the second light guide member.

7. The electronic device according to claim 6, characterized in that: The first buffer member is fixedly connected to the containing groove via a first colloid.

8. The electronic device according to any one of claims 1 to 7, characterized in that: The first light guide member includes a first light guide column and a first mounting plate, the first mounting plate includes a first mounting surface, the first mounting surface is fixedly connected to the surface of the first frame facing the first accommodating cavity, the first light guide column is arranged on the first mounting surface, and the first light guide column is at least partially accommodated in the first through hole.

9. The electronic device according to any one of claims 1 to 8, characterized in that: The second light guide member includes a second light guide column and a second mounting plate, the second mounting plate includes a second mounting surface, the second mounting surface is fixedly connected to the surface of the second frame facing away from the first through hole, the second light guide column is arranged on the second mounting surface, and is at least partially located in the second through hole.

10. The electronic device according to claim 9, characterized in that: The second light guide member further includes a light guide plate, which is disposed on a surface of the second mounting plate away from the first through hole and extends in a direction away from the first through hole.

11. The electronic device according to claim 10, characterized in that: Along a direction parallel to the second mounting surface, a surface of the light guide plate is opposite to the photosensitive element.

12. The electronic device according to any one of claims 1 to 11, characterized in that: The second frame body surrounds and forms a second accommodating cavity, and the photosensitive device is located in the second accommodating cavity.

13. The electronic device according to claim 12, characterized in that: The electronic device further includes a circuit board, which is disposed in the second accommodating cavity, and the photosensitive element is disposed on the circuit board.

14. The electronic device according to claim 12 or 13, characterized in that: The first frame body further includes a first middle plate, which is arranged on a side of the first frame facing the first accommodating cavity; The second frame body further includes a second middle plate, which is arranged on a side of the second frame facing the second accommodation cavity.

15. The electronic device according to claim 14, characterized in that: The second middle plate, the circuit board and the first middle plate are stacked in sequence in the thickness direction of the electronic device, the photosensitive device is fixedly arranged on the surface of the circuit board close to the second middle plate, and the photosensitive surface of the photosensitive device is away from the circuit board.

16. The electronic device according to claim 14 or 15, characterized in that: It also includes a display module, which is arranged on a side of the second middle plate away from the first middle plate, and the first light guide column is inclined toward the side away from the display module from the direction of the first through hole toward the accommodating cavity.

17. The electronic device according to any one of claims 5 to 16, characterized in that: A limiting step is arranged around the accommodating groove, and the limiting step includes a limiting step bottom surface and a limiting step side surface, the limiting step bottom surface is used to limit the movement of the first light guide member along a direction perpendicular to the first light emitting surface, and the limiting side surface is used to limit the rotation of the first light guide member.

18. The electronic device according to claim 17, characterized in that: The electronic device is further provided with a snap-fit ​​structure for fixing the first frame body and the second frame body on the side of the limiting step, and the accommodating groove, the limiting step and the snap-fit ​​structure are arranged in sequence along the width direction of the electronic device.

19. The electronic device according to any one of claims 14 to 18, characterized in that: The surface of the light guide plate close to the second middle plate is a third mounting surface, and the third mounting surface is fixedly connected to the second middle plate.

20. The electronic device according to any one of claims 8 to 19, characterized in that: A second colloid is arranged between the first mounting surface and the surface of the first frame facing the first accommodating cavity. The second colloid is circumferentially arranged around the first light guide column. The first mounting surface is fixedly connected to the surface of the first frame facing the first accommodating cavity through the second colloid.

21. The electronic device according to claim 19 or 20, characterized in that: A third colloid is provided between the second mounting surface and the surface of the second frame facing away from the first through hole, and between the third mounting surface and the second middle plate. The third colloid is arranged circumferentially around the second light guide column. The second mounting surface is fixedly connected to the surface of the second frame of the second frame facing away from the first through hole through the third colloid, and the third mounting surface is fixedly connected to the second middle plate through the third colloid.

22. The electronic device according to any one of claims 14 to 21, characterized in that: The second frame and the first middle plate have a second gap in the thickness direction of the electronic device, and the second gap is filled with a second buffer.

23. The electronic device according to any one of claims 14 to 22, characterized in that: The first frame and the first middle plate are an integrated structure.

24. The electronic device according to any one of claims 9 to 23, characterized in that: The first light guide column and the first mounting plate are an integrated structure, and / or the second light guide column, the second mounting plate and the light guide plate are an integrated structure.

25. The electronic device according to any one of claims 9 to 24, characterized in that: The light emitting surface of the first light guide member and / or the light incident surface of the second light guide member is one of a polished surface, a textured surface, and a coated surface.

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