Through hole and blind hole matching control method and device of circuit board and medium

Abstract

The invention discloses a through-blind hole matching control method and device of a circuit board and a medium. The circuit board comprises a device setting area and a peripheral area surrounding the device setting area. The peripheral area comprises a plurality of corner areas. The through hole and blind hole matching control method of the circuit board comprises the steps of drilling blind hole detection rings located in corner areas; the blind hole detection ring comprises at least four blind hole detection holes, and the directions of the blind hole detection holes in the corner area are different; a drilling machine is controlled to drill through hole detection holes located in the corner areas; the blind hole detection holes are in central symmetry with respect to the through hole detection hole. Acquiring the actual position relationship between each blind hole detection hole and each through hole detection hole in the corner area; judging whether the actual position relationship accords with a preset position relationship or not; if not, the working parameters of the drilling machine are adjusted according to the actual position relation, and the step of drilling the blind hole detection rings located in the corner areas is executed again till the actual position relation meets the preset position relation; the working parameters at least comprise an offset direction and an offset.

Description

Technical Field

[0001] The invention relates to the technical field of circuit boards, and in particular to a through-and-blind hole matching control method, device and medium for a circuit board. Background Art

[0002] With the development of miniaturization, high performance, multi-function, high frequency and high speed of electronic products, the demand for printed circuit boards is getting smaller and smaller, and the line density is getting higher and higher. The circuit board manufacturing technology characterized by high density and refinement is rapidly improving and is widely used in high-end electronic products such as aerospace technology, medical equipment and consumer products.

[0003] In the production and processing of circuit boards, the alignment consistency of blind holes, through holes and circuit patterns is very important. If the blind holes, through holes and patterns in the produced circuit board products do not match, the board will be scrapped. Through holes and blind holes can provide circuit boards with functions such as conduction, heat dissipation or plug-in. Through holes are usually completed by mechanical drilling equipment, and blind holes are usually completed by laser laser equipment. There are certain differences in the alignment and machine accuracy of the two types of machines, resulting in differences in the alignment of through holes and blind holes.

[0004] The alignment consistency monitoring of blind holes, through holes and patterns in existing circuit boards is usually carried out using an automated optical inspection (A0I) after the circuit pattern is completed. When an abnormality is found, there is no chance to save it. There is no abnormal warning function, and it is impossible to find problems in time during the production process to improve and correct them and stop losses. Summary of the invention

[0005] The present invention provides a through hole and blind hole matching control method, device and medium of a circuit board, so as to improve the matching consistency of through holes and blind holes in the circuit board, thereby improving the preparation yield of the circuit board.

[0006] The technical solution provided by the present invention is to drill out each blind hole detection ring located in each corner area, and use a drill to drill out each through hole detection hole located in each corner area respectively. If the actual position relationship between each blind hole detection hole and the through hole detection hole in the corner area does not conform to the preset position relationship, then the working parameters of the drill are adjusted according to the actual position relationship between each blind hole detection hole and the through hole detection hole in the corner area, and return to execute the steps of drilling out each blind hole detection ring located in each corner area, and using the adjusted drill to drill out each through hole detection hole located in each corner area respectively. If the actual position relationship between the drilled through hole detection hole and the blind hole detection hole still does not conform to the preset position relationship, then the working parameters of the drill can be adjusted again according to the actual position relationship, and return to execute the above process until the actual position relationship conforms to the preset position relationship. In this way, the working parameters of the drill are adjusted once or multiple times according to the actual position relationship, so that when blind holes and through holes are prepared in the device setting area later, the matching consistency of the through holes and the blind holes is improved, thereby improving the preparation yield of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 A schematic diagram of the structure of a circuit board provided by an embodiment of the present invention;

[0008] Figure 2 A flowchart of a through-and-blind hole matching control method for a circuit board provided by an embodiment of the present invention;

[0009] Figure 3 A schematic diagram of the structure of another circuit board provided by an embodiment of the present invention;

[0010] Figure 4 A schematic diagram of the position structure of a blind hole detection ring and a through hole detection hole is provided for an embodiment of the present invention;

[0011] Figure 5 A schematic diagram of the structure of a circuit board provided by an embodiment of the present invention;

[0012] Figure 6 A schematic diagram of the structure of another circuit board provided by an embodiment of the present invention;

[0013] Figure 7 A schematic diagram of the structure of another circuit board provided by an embodiment of the present invention;

[0014] Figure 8 A schematic diagram of the structure of another circuit board provided in an embodiment of the present invention;

[0015] Fig. 9 A schematic diagram of the structure of a circuit board provided by an embodiment of the present invention;

[0016] Fig.10 A schematic diagram of the structure of another circuit board provided by an embodiment of the present invention;

[0017] Fig.11 A schematic diagram of the structure of another circuit board provided by an embodiment of the present invention;

[0018] Fig.12 A schematic diagram of the structure of another circuit board provided in an embodiment of the present invention;

[0019] Fig.13 A schematic diagram of the structure of a circuit board provided by an embodiment of the present invention;

[0020] Fig.14 A schematic diagram of the structure of another circuit board provided by an embodiment of the present invention;

[0021] Fig.15 A schematic diagram of the structure of another circuit board provided by an embodiment of the present invention;

[0022] Fig.16 A schematic diagram of the structure of another circuit board provided in an embodiment of the present invention;

[0023] Fig.17 A schematic diagram of the structure of a circuit board provided by an embodiment of the present invention;

[0024] Fig.18 A schematic diagram of the structure of another circuit board provided by an embodiment of the present invention;

[0025] Fig.19 A schematic diagram of the structure of another circuit board provided by an embodiment of the present invention;

[0026] Fig. 20 A schematic diagram of the structure of another circuit board provided in an embodiment of the present invention;

[0027] Fig.21 A schematic diagram of the structure of a circuit board provided by an embodiment of the present invention;

[0028] Fig. 22 A schematic diagram of the structure of another circuit board provided by an embodiment of the present invention;

[0029] Fig.23 A schematic diagram of the structure of another circuit board provided by an embodiment of the present invention;

[0030] Fig.24 A schematic structural diagram of a through and blind hole matching control device for a circuit board provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0031] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0032] Figure 1 A schematic diagram of the structure of a circuit board provided by an embodiment of the present invention, such as Figure 1 As shown, the circuit board 100 includes a device setting area 10 and a peripheral area 20 surrounding the device setting area 10; the peripheral area 20 includes a plurality of corner areas 210; the corner area 210 is located in the peripheral area 20 near the junction of two adjacent board edges.

[0033] The device setting area 10 of the circuit board 100 includes electrical components, such as transistors, diodes, resistors, wires and pins, etc. Correspondingly, the peripheral area 20 includes some simple circuits and other devices.

[0034] Specifically, the circuit board 100 is composed of multiple layers of metal layers stacked together. After lamination, the area where the edges of the circuit board meet, that is, the corner area of ​​the circuit board, is the place with the largest deformation. Therefore, the through-hole and blind-hole matching control method provided in the embodiment of the present invention drills through holes and blind holes in the corner area 210, and adjusts the equipment for drilling through holes and / or blind holes according to the matching alignment of the through holes and the blind holes, so that the through holes match the blind holes. The above process is performed before the circuit is manufactured, and the matching alignment of the through holes and the blind holes can be pre-tested to avoid problems such as inconsistent matching between the through holes and the blind holes, which may lead to scrapping of the board, thereby improving the production yield of the circuit board and saving costs.

[0035] It should be noted that the circuit board 100 includes a rectangular, circular or polygonal shape, etc., and can be configured according to actual needs. Figure 1 Only the circuit board 100 is shown to be rectangular, and the circuit board 100 includes four board edges, namely, board edge 21, board edge 22, board edge 23 and board edge 24. The area near the junction of board edge 21 and board edge 24 in the peripheral area 20 is a corner area 211, the area near the junction of board edge 21 and board edge 22 in the peripheral area 20 is a corner area 212, the area near the junction of board edge 23 and board edge 24 in the peripheral area 20 is a corner area 213, and the area near the junction of board edge 22 and board edge 23 in the peripheral area 20 is a corner area 214. When the shape of the circuit board 100 is other shapes, the corner area 210 of the circuit board 100 can be determined with reference to the above principle.

[0036] Figure 2The flowchart of a through-and-blind hole matching control method for a circuit board provided in an embodiment of the present invention is applicable to adjusting the equipment for preparing through-holes or blind holes according to the matching conditions of through-holes and blind holes, so that the through-holes and blind holes in the circuit board have a preset matching alignment. The through-and-blind hole matching control method for a circuit board can be executed by the through-and-blind hole matching control device for a circuit board provided in an embodiment of the present invention, and the through-and-blind hole alignment device for the circuit board can be implemented in the form of hardware and / or software. Figure 1 As shown, the through-and-blind hole matching control method includes:

[0037] S101, drilling out each blind hole detection ring located in each corner area.

[0038] The blind hole detection ring includes at least four blind hole detection holes, and the blind hole detection holes have different orientations in the corner area.

[0039] Specifically, refer to Figure 1 , a laser device can be used to laser drill a blind hole detection ring in each corner area 210 at the same time to improve the detection efficiency. By setting the blind hole detection ring to include at least four blind hole detection holes, and each blind hole detection hole has a different orientation in the corner area 210, the working parameters of the drilling rig can be adjusted at the four orientations where the blind hole detection holes are located, thereby improving the control reliability.

[0040] It should be noted that, on the basis that the blind hole detection ring includes at least four blind hole detection holes, the number of blind hole detection holes in the blind hole detection ring can also be other. For example, the blind hole detection ring can also include 6 blind hole detection holes, or 8 blind hole detection holes, and each blind hole detection hole is located at a different position in the corner area 210, so that the working parameters of the drilling rig can be adjusted in 6 positions or 8 positions to improve the control accuracy. For the convenience of explanation, the following description is only based on the example that the blind hole detection ring includes four blind hole detection holes.

[0041] S102, controlling the drilling machine to drill the through-hole detection holes located in the corner areas respectively.

[0042] Among them, each blind hole detection hole is centrally symmetrical with respect to the through hole detection hole. Figure 3 A schematic diagram of the structure of another circuit board provided by an embodiment of the present invention, such as Figure 3As shown, the blind hole detection ring 30 includes four blind hole detection holes 31, namely, a first blind hole detection hole 311, a second blind hole detection hole 312, a third blind hole detection hole 313 and a fourth blind hole detection hole 314, and each blind hole detection hole 31 is centrally symmetrical about the through hole detection hole 32. For ease of description, for the blind hole detection ring 30 located in the same corner area 210, the blind hole detection hole located on the left side of the through hole detection hole 32 is the first blind hole detection hole 311, the blind hole detection hole located on the right side of the through hole detection hole 32 is the second blind hole detection hole 312, the blind hole detection hole located above the through hole detection hole 32 is the third blind hole detection hole 313, and the blind hole detection hole located below the through hole detection hole 32 is the fourth blind hole detection hole 314.

[0043] Specifically, a drilling machine may be used to drill a through hole detection hole 32 in the corner area 211, the corner area 212, and the corner area 213 in sequence, so that the blind hole detection hole 31 in the same corner area 210 surrounds the through hole detection hole 32 and is centrally symmetrical about the through hole detection hole 32. Alternatively, four drilling machines may be used to simultaneously drill a through hole detection hole 32 in each corner area 210 to improve detection efficiency.

[0044] In other optional embodiments, a drill having the same number of drill bits as the number of corner areas 210 may be used to simultaneously drill through-hole detection holes 32 in each corner area 210. The through-hole detection holes 32 may be prepared in other ways, which are not specifically limited here.

[0045] S103, obtaining the actual position relationship between each blind hole detection hole and the through hole detection hole in the corner area.

[0046] The actual positional relationship between the blind hole detection hole and the through hole detection hole includes: the blind hole detection hole intersects or is tangent to the through hole detection hole, or there is a spacing between the blind hole detection hole and the through hole detection hole.

[0047] Specifically, the actual positional relationship between each blind hole detection hole and the through hole detection hole in the corner area can be obtained visually, or visually after magnification with a magnifying glass, thereby reducing the detection cost. It can also be obtained through a display device with a higher resolution such as a microscope, which is not specifically limited here.

[0048] S104, determine whether the actual position relationship conforms to the preset position relationship; if not, execute S105.

[0049] The preset position relationship includes that each blind hole detection hole 31 is symmetrical about the center of the through hole detection hole 32 .

[0050] Specifically, when the actual position relationship is consistent with the preset position relationship, it means that the through holes and blind holes prepared in the circuit board by using the drilling equipment and the laser equipment have good matching consistency. At this time, there is no need to adjust the drilling equipment or the laser equipment, and it can be ensured that when the current drilling equipment and the laser equipment are used to prepare through holes and blind holes in the device setting area of ​​the circuit board, the through holes and blind holes in the device setting area have good matching consistency, thereby improving the product yield. However, due to the expansion or contraction of the circuit board during the preparation process, and the position offset of the drilling machine during the alignment with the circuit board, the actual position relationship between the blind hole detection hole 31 and the through hole detection hole 32 formed in the corner area 210 deviates from the preset position relationship. If the current drilling machine or laser equipment is still used to prepare through holes or blind holes in the device setting area, the blind holes in the device setting area will not match the through holes, thereby causing the circuit board to be scrapped.

[0051] S105: Adjust the working parameters of the drilling rig according to the actual position relationship.

[0052] The working parameters include at least an offset direction and an offset. The offset may be a fixed value or a non-fixed value, and may be determined according to the actual detection process. The offset may range from 0.3mil to 1mil. In an exemplary embodiment, the offset may be 0.4mils.

[0053] Specifically, if the actual position relationship does not match the preset position relationship, the offset direction and offset amount of the drill are adjusted according to the actual position relationship, and the process returns to drill the blind hole detection rings located in each corner area, and the adjusted drill is used to drill the through hole detection holes located in each corner area. If the actual position relationship between the drilled through hole detection hole and the blind hole detection hole still does not match the preset position relationship after the drill is adjusted, the working parameters of the drill can be adjusted again according to the actual position relationship, and the process returns to execute the above process until the actual position relationship matches the preset position relationship. In this way, the working parameters of the drill are adjusted once or multiple times according to the actual position relationship, so that when blind holes and through holes are prepared in the device setting area later, the matching consistency of the through holes and the blind holes is improved, thereby improving the preparation yield of the circuit board.

[0054] The technical solution of the present invention is to drill out each blind hole detection ring located in each corner area, and use a drill to drill out each through hole detection hole located in each corner area respectively. If the actual position relationship between each blind hole detection hole and the through hole detection hole in the corner area does not conform to the preset position relationship, then the working parameters of the drill are adjusted according to the actual position relationship between each blind hole detection hole and the through hole detection hole in the corner area, and return to execute the steps of drilling out each blind hole detection ring located in each corner area, and using the adjusted drill to drill out each through hole detection hole located in each corner area respectively. If the actual position relationship between the drilled through hole detection hole and the blind hole detection hole still does not conform to the preset position relationship, then the working parameters of the drill can be adjusted again according to the actual position relationship, and return to execute the above process until the actual position relationship conforms to the preset position relationship. In this way, the working parameters of the drill are adjusted once or multiple times according to the actual position relationship, so that when blind holes and through holes are prepared in the device setting area later, the matching consistency of the through holes and the blind holes is improved, thereby improving the preparation yield of the circuit board.

[0055] In an alternative embodiment, Figure 4 A schematic diagram of the position structure of a blind hole detection ring and a through hole detection hole is provided for an embodiment of the present invention, such as Figure 4 As shown, there is a preset safety distance d0 between the hole wall of the blind hole detection hole 31 close to the through hole detection hole 32 and the hole wall of the through hole detection hole 32 close to the blind hole detection hole 31; wherein d0>0mil.

[0056] Specifically, by setting the hole wall of the blind hole detection hole 31 close to the through hole detection hole 32, there is a preset safety distance d0 between the hole wall of the through hole detection hole 32 close to the blind hole detection hole 31, so that under the effect of the preset safety distance d0, the blind hole detection hole 31 and the through hole detection hole 32 are well insulated, and the blind hole detection hole 31 is prevented from directly contacting the hole wall of the through hole detection hole 32, thereby affecting the electrical performance. The preset safety distance d0 can be set according to the design requirements of the circuit board. In an exemplary embodiment, the preset safety distance d0 is 3 mil, and can also be other, which is not specifically limited here.

[0057] In an optional embodiment, the working parameters of the drilling rig are determined based on the actual position relationship, including adjusting the drilling rig to move an offset amount along the first offset direction if the blind hole detection holes located on the same side of the through hole detection hole in each corner area intersect with the through hole detection hole.

[0058] The direction in which the blind hole detection hole intersecting with the through hole detection hole points to the through hole detection hole is parallel to the first offset direction.

[0059] Specifically, Figure 5 A schematic diagram of a circuit board structure provided by an embodiment of the present invention, referring to Figure 5After the blind hole detection ring and the through hole detection hole 32 are drilled in each corner area 210, the blind hole detection holes 311 located on the left side of the through hole detection hole 32 in each corner area 210 all intersect with the through hole detection hole 32. In order to avoid this situation, the first offset direction is set to be parallel to the direction X1 of the blind hole detection hole 311 pointing to the through hole detection hole 32, so that the drilling rig can move the offset in the first offset direction (X1), and return to execute drilling of each blind hole detection ring located in each corner area 210, and use the adjusted drilling rig to drill each through hole detection hole 32 located in each corner area 210 respectively. The drilled second group of through hole detection holes 32 and blind hole detection rings can refer to Figure 6 After adjusting the drill, the actual position relationship between the drilled through hole detection hole 32 and the blind hole detection hole 31 conforms to the preset position relationship. At this time, the working parameters of the drill are no longer adjusted. When the current laser equipment and drill are used to prepare through holes and blind holes in the device setting area 10, the blind holes and through holes can have better matching consistency, thereby improving the preparation yield of the circuit board.

[0060] Figure 7 A schematic diagram of the structure of another circuit board provided in an embodiment of the present invention, referring to Figure 7 After the blind hole detection ring and the through hole detection hole 32 are drilled in each corner area 210, the blind hole detection holes 311 located on the left side of the through hole detection hole 32 in each corner area 210 all intersect with the through hole detection hole 32. In order to avoid this situation, the first offset direction is set to be parallel to the direction X1 of the blind hole detection hole 311 pointing to the through hole detection hole 32, so that the drilling rig can move the offset in the first offset direction (X1), and return to execute drilling of each blind hole detection ring located in each corner area 210, and use the adjusted drilling rig to drill each through hole detection hole 32 located in each corner area 210 respectively. The drilled second group of through hole detection holes 32 and blind hole detection rings can refer to Figure 8 After the drilling machine is adjusted, the actual position relationship between the drilled through hole detection hole 32 and the blind hole detection hole 31 still does not conform to the preset position relationship, and the through hole detection hole 311 in the second group still intersects with the through hole detection hole 32. At this time, it is necessary to adjust the working parameters of the drilling machine for the second time, so that the drilling machine moves the offset in the first offset direction (X1) again, and returns to execute drilling of each blind hole detection ring located in each corner area 210. The adjusted drilling machine is used to drill each through hole detection hole 32 located in each corner area 210 respectively. The drilled third group of through hole detection holes 32 and blind hole detection rings can be referred to Fig. 9 After the drilling machine is adjusted, the actual position relationship between the through hole detection holes 32 and the blind hole detection holes 31 in the third group conforms to the preset position relationship, and the working parameters of the drilling machine are no longer adjusted.

[0061] It should be noted that the above-mentioned adjustment of the working parameters of the drilling rig is performed only once or twice according to the actual position relationship, so that the actual position relationship between the through hole detection hole drilled by the drilling rig and the blind hole detection ring meets the preset position relationship. In other optional embodiments, the working parameters of the drilling rig can also be adjusted multiple times so that the actual position relationship between the through hole detection hole drilled and the blind hole detection ring meets the preset position relationship. Exemplarily, the number of times the drilling rig is adjusted is 7 times, and 8 groups of blind hole detection rings and through hole detection holes are formed in the corner area.

[0062] It can be understood that the above description only takes the example of the intersection of the blind hole detection hole located on the left side of the through hole detection hole and the through hole detection hole. It can also be the case that the blind hole detection hole located on the right side, above or below the through hole detection hole intersects with the through hole detection hole. The principle of adjusting the working parameters of the drilling rig is similar to the above principle, and the above description can be referred to, which will not be repeated here.

[0063] In another optional embodiment, the working parameters of the drilling rig are determined according to the actual position relationship, including: if in each corner area, the blind hole detection holes located on the same side of the through hole detection hole are tangent to the through hole detection hole, then the drilling rig is adjusted to move an offset amount along the second offset direction; the direction in which the blind hole detection hole tangent to the through hole detection hole points to the through hole detection hole is parallel to the second offset direction.

[0064] Specifically, Fig.10 A schematic diagram of another circuit board structure provided by an embodiment of the present invention, referring to Fig.10 After the blind hole detection ring and the through hole detection hole 32 are drilled in each corner area 210, the blind hole detection holes 311 located on the left side of the through hole detection hole 32 in each corner area 210 are all tangent to the through hole detection hole 32. In order to avoid this situation, the second offset direction is set to be parallel to the direction X1 of the blind hole detection hole 311 pointing to the through hole detection hole 32, so that the drilling rig can move the offset in the second offset direction (X1), and return to execute drilling of each blind hole detection ring located in each corner area 210, and use the adjusted drilling rig to drill each through hole detection hole 32 located in each corner area 210 respectively. The drilled second group of through hole detection holes 32 and blind hole detection rings can refer to Fig.11 After adjusting the drill, the actual position relationship between the drilled through hole detection hole 32 and the blind hole detection hole 31 conforms to the preset position relationship. At this time, the working parameters of the drill are no longer adjusted. When the current laser equipment and drill are used to prepare through holes and blind holes in the device setting area 10, the blind holes and through holes can have better matching consistency, thereby improving the preparation yield of the circuit board.

[0065] It can be understood that the above description only takes the example of the blind hole detection hole located on the left side of the through hole detection hole being tangent to the through hole detection hole. It can also be the case that the blind hole detection hole located on the right side, above or below the through hole detection hole is tangent to the through hole detection hole. The principle of adjusting the working parameters of the drilling rig is similar to the above principle, and the above description can be referred to, which will not be repeated here.

[0066] In an optional embodiment, the working parameters of the drilling rig are determined according to the actual position relationship, including: if in each corner area, the blind hole detection holes located on the same side of the through hole detection hole are not tangent to or intersecting with the through hole detection hole, and each through hole detection hole is located in the expansion area formed by some blind hole detection holes, then the drilling rig is adjusted to move the offset along the third offset direction.

[0067] The direction in which the through hole detection hole points to the center of the circuit board is parallel to the third offset direction; and the expansion zone is located between two adjacent blind hole detection holes near the junction of the board edge.

[0068] Specifically, when the through-hole detection hole 32 is located in the expansion zone, it indicates that the size of the circuit board 100 has expanded during the preparation process. For example, the initial size is 5cm×5cm. After lamination or other treatment of the circuit board 100, the current size of the circuit board 100 is 6cm×6cm. Fig.12 A schematic diagram of the structure of another circuit board provided in an embodiment of the present invention, referring to Fig.12 After the blind hole detection ring and the through hole detection hole 32 are drilled in each corner area 210, in each corner area 210, the through hole detection hole 32 is located in the corresponding expansion area. Although the through hole detection hole 32 does not intersect or tangent to the blind hole detection hole 31 at this time, the through hole detection hole 32 is located in the expansion area, which reduces the matching consistency between the through hole detection hole 32 and the blind hole detection hole 31. In order to make the through hole detection hole 32 adapt to the expansion of the circuit board, a third offset direction is set to be parallel to the direction (Z1 / Z2 / Z3 / Z4) of the through hole detection hole 32 pointing to the center of the circuit board, so that the drilling direction of the through hole detection hole 32 located in the corner area 211 The drill moves an offset in the third offset direction (Z1), the drill that drills the through hole detection hole 32 in the corner area 212 moves an offset in the third offset direction (Z2), the drill that drills the through hole detection hole 32 in the corner area 213 moves an offset in the third offset direction (Z3), the drill that drills the through hole detection hole 32 in the corner area 214 moves an offset in the third offset direction (Z4), and returns to execute drilling of each blind hole detection ring in each corner area 210, and uses the adjusted drill to drill each through hole detection hole 32 in each corner area 210 respectively. The drilled second group of through hole detection holes 32 and blind hole detection rings can be referred to Fig.13After adjusting the drill, the actual position relationship between the drilled through hole detection hole 32 and the blind hole detection hole 31 conforms to the preset position relationship. At this time, the working parameters of the drill are no longer adjusted. When the current laser equipment and drill are used to prepare through holes and blind holes in the device setting area 10, the blind holes and through holes can have better matching consistency, thereby improving the preparation yield of the circuit board.

[0069] Optionally, the working parameters of the drilling rig are determined based on the actual position relationship, including: if in each corner area, the blind hole detection holes located on the same side of the through hole detection hole are not tangent to or intersecting with the through hole detection hole, and each through hole detection hole is located in a compression zone formed by some blind hole detection holes, then adjust the drilling rig to move an offset amount along the fourth offset direction.

[0070] The direction in which the center of the circuit board points to the through-hole detection hole is parallel to the fourth offset direction; and the contraction area is located between two adjacent blind-hole detection holes close to the device setting area.

[0071] Specifically, when the through-hole detection hole 32 is located in the shrinkage zone, it indicates that the size of the circuit board 100 has been shrunk during the preparation process. For example, the initial size is 5 cm×5 cm. After lamination or other treatment of the circuit board 100, the current size of the circuit board 100 is 4 cm×4 cm. Fig.14 A schematic diagram of another circuit board structure provided by an embodiment of the present invention, referring to Fig.14 After the blind hole detection ring and the through hole detection hole 32 are drilled in each corner area 210, in each corner area 210, the through hole detection hole 32 is located in the corresponding contraction area. Although the through hole detection hole 32 does not intersect or tangent to the blind hole detection hole 31 at this time, the through hole detection hole 32 is located in the contraction area, which reduces the matching consistency between the through hole detection hole 32 and the blind hole detection hole 31. In order to make the through hole detection hole 32 adapt to the contraction of the circuit board, the fourth offset direction is set to be parallel to the direction (O1 / O2 / O3 / O4) of the center of the circuit board pointing to the through hole detection hole 32, so that the drill hole 32 located in the corner area 211 is The drill moves the offset amount in the fourth offset direction (O1), the drill that drills the through hole detection hole 32 in the corner area 212 moves the offset amount in the fourth offset direction (O2), the drill that drills the through hole detection hole 32 in the corner area 213 moves the offset amount in the fourth offset direction (O3), the drill that drills the through hole detection hole 32 in the corner area 214 moves the offset amount in the fourth offset direction (O4), and returns to execute drilling of each blind hole detection ring in each corner area 210, and uses the adjusted drill to drill each through hole detection hole 32 in each corner area 210 respectively. The drilled second group of through hole detection holes 32 and blind hole detection rings can refer to Fig.15After adjusting the drill, the actual position relationship between the drilled through hole detection hole 32 and the blind hole detection hole 31 conforms to the preset position relationship. At this time, the working parameters of the drill are no longer adjusted. When the current laser equipment and drill are used to prepare through holes and blind holes in the device setting area 10, the blind holes and through holes can have better matching consistency, thereby improving the preparation yield of the circuit board.

[0072] Optionally, the working parameters of the drilling rig are adjusted according to the actual position relationship, including: if there is a corner area where the blind hole detection hole located on one side of the through hole detection hole is tangent to the through hole detection hole, then the drilling rig for drilling the through hole detection hole in the corner area is adjusted to move the fifth offset along the fifth offset direction.

[0073] The direction in which the blind hole detection hole tangent to the through hole detection hole points to the through hole detection hole is parallel to the fifth offset direction.

[0074] Specifically, Fig.16 A schematic diagram of the structure of another circuit board provided in an embodiment of the present invention, referring to Fig.16 After the blind hole detection ring and the through hole detection hole 32 are drilled in each corner area 210, the actual position relationship between each blind hole detection hole and the through hole detection hole in the corner area 212, the corner area 213 and the corner area 214 meets the preset position relationship, and only the actual position relationship between each blind hole detection hole and the through hole detection hole in the corner area 211 does not meet the preset position relationship. In the corner area 211, the blind hole detection hole 311 located on the left side of the through hole detection hole 32 is tangent to the through hole detection hole 32. In order to avoid this situation, the direction X1 of the blind hole detection hole 311 tangent to the through hole detection hole 32 pointing to the through hole detection hole 32 is set to be parallel to the fifth offset direction, so that the drill for drilling the through hole detection hole 32 in the corner area 211 can move the offset in the fifth offset direction (X1) and return to execute drilling of each blind hole detection ring located in each corner area 210. The through hole detection holes 32 located in each corner area 210 are drilled respectively using the adjusted drill. The drilled second group of through hole detection holes 32 and blind hole detection rings can refer to Fig.17 After adjusting the drill, the actual position relationship between the drilled through hole detection hole 32 and the blind hole detection hole 31 conforms to the preset position relationship. At this time, the working parameters of the drill are no longer adjusted. When the current laser equipment and drill are used to prepare through holes and blind holes in the device setting area 10, the blind holes and through holes can have better matching consistency, thereby improving the preparation yield of the circuit board.

[0075] It is understandable that the above description is only based on the fact that the actual position relationship between the blind hole detection holes and the through hole detection holes in the corner area 211 does not conform to the preset position relationship. In other optional embodiments, Fig.18 A schematic diagram of another circuit board structure provided by an embodiment of the present invention, referring to Fig.18After the blind hole detection ring and the through hole detection hole 32 are drilled in each corner area 210, the actual positional relationship between each blind hole detection hole and the through hole detection hole in each corner area 210 does not conform to the preset positional relationship. In the corner area 211, the blind hole detection hole 311 located on the left side of the through hole detection hole 32 is tangent to the through hole detection hole 32, in the corner area 212, the blind hole detection hole 312 located on the right side of the through hole detection hole 32 is tangent to the through hole detection hole 32, in the corner area 213, the blind hole detection hole 312 located on the right side of the through hole detection hole 32 is tangent to the through hole detection hole 32, and in the corner area 214, the blind hole detection hole 314 located below the through hole detection hole 32 is tangent to the through hole detection hole 32. In order to avoid this situation, the direction X1 in which the blind hole detection hole 311 in the corner area 211 points to the through hole detection hole 32 is parallel to the first and fifth offset directions, so that the drill for drilling the through hole detection hole 32 in the corner area 211 can move the offset in the first and fifth offset directions (X1); the direction X2 in which the blind hole detection hole 312 in the corner area 212 points to the through hole detection hole 32 is parallel to the second and fifth offset directions, so that the drill for drilling the through hole detection hole 32 in the corner area 212 can move the offset in the second and fifth offset directions (X2); the direction X2 in which the blind hole detection hole 312 in the corner area 213 points to the through hole detection hole 32 is parallel to The third and fifth offset directions are used so that the drill for drilling the through hole detection hole 32 in the corner area 213 can move the offset in the third and fifth offset directions (X2); the direction Y1 of the blind hole detection hole 314 in the corner area 214 pointing to the through hole detection hole 32 is parallel to the fourth and fifth offset directions, so that the drill for drilling the through hole detection hole 32 in the corner area 214 can move the offset in the fourth and fifth offset directions (Y1); and return to execute drilling of each blind hole detection ring located in each corner area 210, and use the adjusted drill to drill each through hole detection hole 32 located in each corner area 210 respectively. The drilled second group of through hole detection holes 32 and blind hole detection rings can be referred to Fig.19 After adjusting the drill, the actual position relationship between the drilled through hole detection hole 32 and the blind hole detection hole 31 conforms to the preset position relationship. At this time, the working parameters of the drill are no longer adjusted. When the current laser equipment and drill are used to prepare through holes and blind holes in the device setting area 10, the blind holes and through holes can have better matching consistency, thereby improving the preparation yield of the circuit board.

[0076] Optionally, if there is a corner area in which a blind hole detection hole located on one side of the through hole detection hole intersects with the through hole detection hole, the drill for drilling the through hole detection hole in the corner area is adjusted to move the offset along the sixth offset direction.

[0077] The direction in which the blind hole detection hole tangent to the through hole detection hole points to the through hole detection hole is parallel to the sixth offset direction.

[0078] Specifically, Fig. 20A schematic diagram of the structure of another circuit board provided in an embodiment of the present invention, referring to Fig. 20 After the blind hole detection ring and the through hole detection hole 32 are drilled in each corner area 210, the actual position relationship between each blind hole detection hole and the through hole detection hole in the corner area 212, the corner area 213 and the corner area 214 meets the preset position relationship, and only the actual position relationship between each blind hole detection hole and the through hole detection hole in the corner area 211 does not meet the preset position relationship. In the corner area 211, the blind hole detection hole 311 located on the left side of the through hole detection hole 32 intersects with the through hole detection hole 32. In order to avoid this situation, by setting the direction X1 of the blind hole detection hole 311 in the corner area 211 pointing to the through hole detection hole 32 to be parallel to the sixth offset direction, the drill rig for drilling the through hole detection hole 32 in the corner area 211 can move the offset in the sixth offset direction (X1) and return to execute drilling of each blind hole detection ring located in each corner area 210. The through hole detection holes 32 located in each corner area 210 are drilled respectively using the adjusted drill rig. The drilled second group of through hole detection holes 32 and blind hole detection rings can be referred to Fig.21 After adjusting the drill, the actual position relationship between the drilled through hole detection hole 32 and the blind hole detection hole 31 conforms to the preset position relationship. At this time, the working parameters of the drill are no longer adjusted. When the current laser equipment and drill are used to prepare through holes and blind holes in the device setting area 10, the blind holes and through holes can have better matching consistency, thereby improving the preparation yield of the circuit board.

[0079] It should be noted that the above only adjusts the working parameters of the drill once according to the actual position relationship, so that the actual position relationship between the through hole detection hole drilled by the drill and the blind hole detection ring meets the preset position relationship. In other optional embodiments, if the actual position relationship in the corner area still does not meet the preset position relationship after the working parameters of the drill are adjusted once, the working parameters of the drill can be adjusted twice or multiple times to make the actual position relationship between the drilled through hole detection hole and the blind hole detection ring meet the preset position relationship. Exemplarily, the drill is adjusted 7 times, and 8 groups of blind hole detection rings and through hole detection holes are formed in the corner area.

[0080] It is understandable that the above description is only based on the fact that the actual position relationship between the blind hole detection holes and the through hole detection holes in the corner area 211 does not conform to the preset position relationship. In other optional embodiments, Fig. 22 A schematic diagram of another circuit board structure provided by an embodiment of the present invention, referring to Fig. 22After the blind hole detection ring and the through hole detection hole 32 are drilled in each corner area 210, the actual positional relationship between each blind hole detection hole and the through hole detection hole in each corner area 210 does not conform to the preset positional relationship. In the corner area 211, the blind hole detection hole 311 located on the left side of the through hole detection hole 32 intersects with the through hole detection hole 32, in the corner area 212, the blind hole detection hole 314 located below the through hole detection hole 32 is tangent to the through hole detection hole 32, in the corner area 213, the blind hole detection hole 312 located on the right side of the through hole detection hole 32 is tangent to the through hole detection hole 32, and in the corner area 214, the blind hole detection hole 313 located above the through hole detection hole 32 is tangent to the through hole detection hole 32. In order to avoid this situation, the direction X1 in which the blind hole detection hole 311 in the corner area 211 points to the through hole detection hole 32 is parallel to the first and sixth offset directions, so that the drill for drilling the through hole detection hole 32 in the corner area 211 can move the offset in the first and sixth offset directions (X1); the direction Y1 in which the blind hole detection hole 314 in the corner area 212 points to the through hole detection hole 32 is parallel to the second and sixth offset directions, so that the drill for drilling the through hole detection hole 32 in the corner area 212 can move the offset in the second and sixth offset directions (Y1); the direction X2 in which the blind hole detection hole 312 in the corner area 213 points to the through hole detection hole 32 is parallel to The third and sixth offset directions are used so that the drill for drilling the through hole detection hole 32 in the corner area 213 can move the offset in the third and sixth offset directions (X2); the direction Y2 of the blind hole detection hole 313 in the corner area 214 pointing to the through hole detection hole 32 is parallel to the fourth and sixth offset directions, so that the drill for drilling the through hole detection hole 32 in the corner area 214 can move the offset in the fourth and sixth offset directions (Y2); and return to execute drilling of each blind hole detection ring located in each corner area 210, and use the adjusted drill to drill each through hole detection hole 32 located in each corner area 210 respectively. The drilled second group of through hole detection holes 32 and blind hole detection rings can refer to Fig.23 After adjusting the drill, the actual position relationship between the drilled through hole detection hole 32 and the blind hole detection hole 31 conforms to the preset position relationship. At this time, the working parameters of the drill are no longer adjusted. When the current laser equipment and drill are used to prepare through holes and blind holes in the device setting area 10, the blind holes and through holes can have better matching consistency, thereby improving the preparation yield of the circuit board.

[0081] Understandably, reference Fig.16 and Fig. 20When there is only one corner area in which the blind hole detection hole located on one side of the through hole detection hole intersects or is tangent to the through hole detection hole, the drill for drilling the through hole detection hole in the corner area is adjusted so that the actual positional relationship between the drilled through hole detection hole and the blind hole detection hole meets the preset positional relationship. The circuit board 100 can be evenly divided, so that after the circuit board 100 is divided along the dividing line AB, the blind holes and through holes in the area within the device setting area 10 located within the dividing line AB can be drilled with the adjusted drill to improve the matching consistency of the blind holes and the through holes and improve the alignment of the blind holes and the through holes.

[0082] Accordingly, reference Fig.18 and Fig. 22 When the positions of the through-hole detection holes intersecting or tangent to the through-hole detection holes in each corner area are different, the drilling machines for drilling the through-hole detection holes in each corner area are adjusted respectively. After the actual position relationship between the through-hole detection holes and the blind hole detection holes drilled in each corner area meets the preset position relationship, the circuit board 100 can be evenly divided, so that after the circuit board 100 is divided along the dividing line A-A' and the dividing line B-B', the drilling machines for drilling the through-hole detection holes in the corner areas surrounded by the dividing lines are respectively used to drill through holes in the corresponding areas formed by the dividing lines in the device setting area, so as to improve the preparation matching consistency of the blind holes and the through holes in the device setting area, and improve the alignment degree of the blind holes and the through holes.

[0083] Fig.24 A schematic diagram of a circuit board through-and-blind hole matching control device provided by an embodiment of the present invention is shown in FIG. Fig.24 As shown, the through-and-blind hole matching control device comprises:

[0084] The blind hole drilling module 41 is used to drill each blind hole detection ring located in each corner area; the blind hole detection ring includes at least four blind hole detection holes, and each blind hole detection hole has a different orientation in the corner area;

[0085] The through hole drilling module 42 is used to control the drilling machine to drill each through hole detection hole located in each corner area; each blind hole detection hole is centrally symmetrical about the through hole detection hole;

[0086] A position relationship acquisition module 43 is used to acquire the actual position relationship between each blind hole detection hole and the through hole detection hole in the corner area;

[0087] The position relationship determination module 44 is used to determine whether the actual position relationship conforms to the preset position relationship;

[0088] The working parameter adjustment module 45 is used to adjust the working parameters of the drilling machine according to the actual position relationship, and return to execute the step of drilling each blind hole detection ring located in each corner area until the actual position relationship meets the preset position relationship; the working parameters at least include the offset direction and the offset amount.

[0089] The through-and-blind hole matching control device provided in the embodiment of the present invention can execute the through-and-blind hole matching control method provided in any embodiment of the present invention, and has the corresponding functional modules and beneficial effects of the execution method. The similarities can be referred to the above description.

[0090] An embodiment of the present invention further provides a computer-readable storage medium, which stores computer instructions. The computer instructions are used to enable a processor to implement the blind hole matching control method provided by the embodiment of the present invention when executed. The method has corresponding functional modules and beneficial effects, which will not be repeated here.

[0091] Computer readable storage medium can be a tangible medium that can contain or store a computer program for use by or in combination with an instruction execution system, device or equipment. Computer readable storage medium can include but is not limited to electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, devices or equipment, or any suitable combination of the above. Alternatively, computer readable storage medium can be a machine readable signal medium. More specific examples of machine readable storage medium can include electrical connections based on one or more lines, portable computer disks, hard disks, random access memories (RAM), read-only memories (ROM), erasable programmable read-only memories (EPROM or flash memory), optical fibers, portable compact disk read-only memories (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination of the above.

[0092] Note that the above are only preferred embodiments of the present invention and the technical principles used. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments, combinations and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in more detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A method for controlling through and blind vias of a circuit board, characterized in that: The circuit board includes a device setting area and a peripheral area surrounding the device setting area; the peripheral area includes a plurality of corner areas; the corner area is located in the peripheral area near the junction of two adjacent board edges; The through-and-blind hole matching control method comprises: Drilling each blind hole detection ring located in each corner area; the blind hole detection ring includes at least four blind hole detection holes, and each blind hole detection hole has a different orientation in the corner area; Controlling the drilling machine to drill the through hole detection holes located in the corner areas respectively; each of the blind hole detection holes is centrally symmetrical about the through hole detection hole; Acquire the actual position relationship between each of the blind hole detection holes and the through hole detection holes in the corner area; Determining whether the actual position relationship conforms to the preset position relationship; If not, the working parameters of the drilling rig are adjusted according to the actual position relationship, and the step of drilling each blind hole detection ring located in each corner area is returned to execute until the actual position relationship meets the preset position relationship; the working parameters include at least the offset direction and the offset amount.

2. The through-and-blind hole matching control method according to claim 1, characterized in that: According to the actual position relationship, adjusting the working parameters of the drilling rig includes: If in each of the corner areas, the blind hole detection holes located on the same side of the through hole detection hole intersect with the through hole detection hole, the drilling rig is adjusted to move the offset amount along the first offset direction; the direction in which the blind hole detection hole intersecting with the through hole detection hole points to the through hole detection hole is parallel to the first offset direction.

3. The through-and-blind hole matching control method according to claim 1, characterized in that: According to the actual position relationship, adjusting the working parameters of the drilling rig includes: If in each of the corner areas, the blind hole detection holes located on the same side of the through hole detection hole are tangent to the through hole detection hole, the drilling rig is adjusted to move the offset amount along the second offset direction; the direction in which the blind hole detection hole tangent to the through hole detection hole points to the through hole detection hole is parallel to the second offset direction.

4. The through-and-blind hole matching control method according to claim 1, characterized in that: According to the actual position relationship, adjusting the working parameters of the drilling rig includes: If in each of the corner areas, the blind hole detection holes located on the same side of the through hole detection hole are not tangent to or intersect with the through hole detection hole, and each of the through hole detection holes is located in the expansion area formed by part of the blind hole detection holes, then the drilling rig is adjusted to move the offset amount along the third offset direction; The direction in which the through hole detection hole points to the center of the circuit board is parallel to the third offset direction; and the expansion zone is located between two adjacent blind hole detection holes near the junction of the board edge.

5. The through-and-blind hole matching control method according to claim 1, characterized in that: According to the actual position relationship, adjusting the working parameters of the drilling rig includes: If in each of the corner areas, the blind hole detection holes located on the same side of the through hole detection hole are not tangent to or intersect with the through hole detection hole, and each of the through hole detection holes is located in a compression zone formed by part of the blind hole detection holes, then adjusting the drilling rig to move the offset amount along a fourth offset direction; The direction in which the center of the circuit board points to the through-hole detection hole is parallel to the fourth offset direction; and the tightening area is located between two adjacent blind-hole detection holes close to the device setting area.

6. The through-and-blind hole matching control method according to claim 1, characterized in that: According to the actual position relationship, the working parameters of the drilling rig are adjusted, including: if there is a corner area in which the blind hole detection hole located on one side of the through hole detection hole is tangent to the through hole detection hole, then the drilling rig for drilling the through hole detection hole in the corner area is adjusted to move the offset along the fifth offset direction; the direction in which the blind hole detection hole tangent to the through hole detection hole points to the through hole detection hole is parallel to the fifth offset direction.

7. The through-and-blind hole matching control method according to claim 1, characterized in that: According to the actual position relationship, the working parameters of the drilling rig are adjusted, including: if there is a corner area in which the blind hole detection hole located on one side of the through hole detection hole intersects with the through hole detection hole, then the drilling rig that drills the through hole detection hole in the corner area is adjusted to move the offset amount along a sixth offset direction; the direction in which the blind hole detection hole tangent to the through hole detection hole points to the through hole detection hole is parallel to the sixth offset direction.

8. The through-and-blind hole matching control method according to claim 1, characterized in that: A preset safety distance d0 is formed between the hole wall of the blind hole detection hole close to the hole wall of the through hole detection hole and the hole wall of the through hole detection hole close to the blind hole detection hole; Among them, d0>0mil.

9. A through-and-blind hole matching control device for a circuit board, characterized in that: The circuit board includes a device setting area and a peripheral area surrounding the device setting area; the peripheral area includes a plurality of corner areas; the corner area is located in the peripheral area near the junction of two adjacent board edges; The through-and-blind hole matching control device comprises: A blind hole drilling module, used for drilling each blind hole detection ring located in each corner area; the blind hole detection ring includes at least four blind hole detection holes, and each blind hole detection hole has a different orientation in the corner area; A through hole drilling module is used to control the drilling machine to drill each through hole detection hole located in each corner area; each blind hole detection hole is centrally symmetrical about the through hole detection hole; A position relationship acquisition module, used to acquire the actual position relationship between each blind hole detection hole and the through hole detection hole in the corner area; A position relationship determination module, used to determine whether the actual position relationship conforms to a preset position relationship; A working parameter adjustment module is used to adjust the working parameters of the drilling rig according to the actual position relationship, and return to execute the step of drilling each blind hole detection ring located in each corner area until the actual position relationship meets the preset position relationship; the working parameters at least include an offset direction and an offset amount.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a processor to implement the through-and-blind via matching control method for a circuit board according to any one of claims 1 to 8 when executed.

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