Electronic device with high space utilization rate of electronic module

Abstract

The invention discloses electronic equipment with high space utilization rate of electronic modules, which comprises an equipment supporting structure body, a backboard electronic component and a plurality of electronic modules, and is characterized in that the equipment supporting structure body is cylindrical, and the backboard electronic component is arranged in the equipment supporting structure body; the electronic modules are installed in the equipment supporting structure body in the radial direction and are in vertical insertion fit with the backboard electronic assembly, the multiple electronic modules are arranged in a stacked mode in the axial direction, and the circumferential contours of the electronic modules are matched with the radial section shape of the equipment supporting structure body. The equipment supporting structure body is cylindrical, the circumferential contours of the electronic modules are matched with the radial section of the equipment supporting structure body, and the multiple electronic modules are arranged in a stacked mode in the axial direction, so that the high-integration electronic module stacked layout is achieved, and the high space utilization rate of conformal design is achieved; the electronic device can be shaped, miniaturized and lightened at the same time.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic equipment hardware architecture, and in particular to an electronic equipment with high space utilization of electronic modules. Background Art

[0002] According to the existing module standards (ARINC, ASAAC, SEM, VITA, CPCI), the electronic modules are mostly rectangular in shape. Placing the rectangular electronic modules in a square electronic equipment support will increase the space utilization and facilitate assembly and fixation. Figure 1 As shown, a rectangular chassis body is used as an electronic device support body 100, and a rectangular electronic module composed of a board 200, an inter-board connector 300 and a backplane 400 is placed in the rectangular chassis body.

[0003] However, electronic equipment supports have many shapes, including a conventional square and a cylindrical shape. Once a rectangular electronic module is placed in a cylindrical electronic equipment support, a large amount of space will be wasted at the four corners. Not only is the space utilization rate low, but there is no suitable way to fix the electronic module to the electronic equipment support, which brings hardware architecture constraints to the special-shaped, miniaturized, and lightweight electronic equipment, and increases the volume and weight. Figure 2 As shown, if the electronic module of a rectangular structure composed of a board card 200, an inter-board connector 300 and a backplane 400 is placed in a cylindrical electronic device support 500, four arched spaces will be wasted and it will be difficult to achieve relative fixation.

[0004] It should be particularly noted that the above technical information is only intended to deepen the understanding of the overall background technology of the present invention, and should not be regarded as admitting or implying in any form that the above technical information constitutes the prior art already known to those skilled in the art. Summary of the invention

[0005] In view of the deficiencies in the above-mentioned background technology, the present invention proposes an electronic device with high space utilization of electronic modules, which solves the technical problem that the existing electronic devices are mutually restricted by the special-shaped, miniaturized and lightweight.

[0006] The technical solution of this application is: An electronic device with high space utilization of electronic modules, comprising a device support structure, a backplane electronic assembly and a plurality of electronic modules, wherein the device support structure is cylindrical, the backplane electronic assembly is arranged in the device support structure, the electronic module is radially installed into the device support structure and vertically plugged and matched with the backplane electronic assembly, and the plurality of electronic modules are stacked in the axial direction, and the circumferential profile of the electronic module is adapted to the radial cross-sectional shape of the device support structure. In the present technical solution, the backplane electronic assembly is arranged in the axial direction of the inner wall of the device support structure, which not only does not occupy too much radial space of the device structure support body, but also facilitates the plugging and unplugging of the electronic module vertically connected to the backplane electronic assembly from the radial direction of the device support structure, and the circumferential profile of the electronic module is adapted to the radial cross-sectional shape of the device support structure, so the present technical solution has both a highly integrated electronic module stacking layout and a high space utilization of a conformal design, and can simultaneously realize the special-shaped, miniaturized and lightweight electronic equipment. Among them, since the backplane electronic component has a backplane rigid-flexible component, the backplane electronic component does not necessarily have to be axially sent to the inside of the equipment support structure and then fixed. It can also be radially installed from top to bottom like the electronic module, and then the output end of the backplane electronic component can be extended out of the equipment support structure by utilizing the easy deformation characteristics of the backplane rigid-flexible component.

[0007] On the basis of the above technical solution, as a preferred technical solution, the circumferential portion of the equipment support structure is provided with an axial hollow area. Under the premise of ensuring the supporting strength of the equipment support structure, this technical solution hollows out part of the circumferential portion of the equipment support structure, which can not only reduce the weight of the product, but also provide visualization conditions for the installation and fixation of the electronic module. More importantly, the electronic module can extend a certain distance along the radial direction of the equipment support structure in the axial hollow area. As an expandable and usable space, more devices and circuits can be arranged, thereby increasing the PCB board volume ratio within the unit cross-section of the electronic module. It should be noted that under the technical guidance of this technical solution, technical personnel in this field can adopt various forms of axial hollow areas under the premise of ensuring weight reduction, visualization, and PCB board volume ratio.

[0008] On the basis of the above technical solution, as a preferred technical solution, the axial hollow area includes the radial insertion port of the electronic module and the side port close to the back panel electronic component, and the edge of the electronic module is flush with the edge of the radial insertion port and the edge of the side port in the axial direction. This technical solution provides a preferred arrangement position of the axial hollow area on the equipment support structure, that is, the bottom and the upper part of both sides along the axial direction are hollowed out to form radial insertion ports and side ports, while reducing the weight of the product, providing visual conditions for the installation and fixation of the electronic module, and increasing the volume ratio of the PCB board within the unit cross section of the electronic module, it also provides an installation channel for the electronic module and the back panel electronic component, that is, the radial insertion port and the side port have multiple functions at the same time.

[0009] On the basis of the above technical solution, as a preferred technical solution, the shaft end of the equipment support structure is provided with a radial hollow area. This technical solution not only further reduces the weight of the product, provides better visualization conditions for the installation and fixation of the electronic module, but also provides more feasibility for the installation of the backplane electronic components. It should be noted that under the technical guidance of this technical solution, while ensuring weight reduction, visualization, and PCB board volume ratio, technical personnel in this field can adopt various forms of radial hollow areas.

[0010] On the basis of the above technical scheme, as a preferred technical scheme, the skeleton outer contour of the radial hollow area has a straight structure and an arc transition structure located on both sides of the straight structure, and the edge of the electronic module is flush with the edge of the straight structure and the edge of the arc transition structure in the axial direction. This technical scheme provides a preferred arrangement of the radial hollow area on the equipment support structure, and the circumferential coordination of the electronic module and the equipment support structure adopts a conformal matching spatial structure design, wherein the arc transition structure is preferably arranged at four places and located at the four corners of the skeleton outer contour of the radial hollow area, then the four corner circumferential transitions of the electronic module are flush with the four arc transition structures of the equipment support structure, and the upper edge of the electronic module is aligned with the straight structure of the equipment support structure, which can maximize the use of the hollow space without affecting the insertion and removal of the electronic module from the radial insertion port, and further improve the volume ratio of the PCB board within the unit cross section of the electronic module.

[0011] On the basis of the above technical solution, as a preferred technical solution, a primary guide structure is provided between the electronic module and the device support structure, and a secondary guide structure is provided between the electronic module and the backplane electronic assembly. When installing the electronic module, the electronic module is first radially inserted into the device support structure through the guidance of the primary guide structure; when the electronic module is inserted into the device support structure to a certain depth, the electronic module is vertically inserted into the backplane electronic assembly through the guidance of the secondary guide structure.

[0012] On the basis of the above technical solution, as a preferred technical solution, the primary guiding structure includes guiding ribs and guide rail grooves for guiding the insertion between the electronic module and the device support structure. That is, the primary guiding of the electronic module and the device support structure during assembly is achieved through the insertion between the guiding ribs and the guide rail grooves. As for the number, specific arrangement position and cross-sectional shape of the guiding ribs and the guide rail grooves, there are multiple options. Under the guidance of this technical solution, those skilled in the art can select multiple implementation methods suitable for practical use.

[0013] On the basis of the above technical scheme, as a preferred technical scheme, the electronic module includes an electronic module PCB board and a heat-conducting cold plate connected to each other, the guide ribs are arranged on both sides of the heat-conducting cold plate, and the guide rail grooves are arranged on both sides of the inner wall of the equipment support structure. This technical scheme provides a preferred primary guide structure, which realizes the guiding and plugging of the electronic module and the equipment support structure through the guide ribs arranged on both sides of the heat-conducting cold plate and the guide rail grooves arranged in the equipment support structure; under the concept of the primary guide structure in the above technical scheme, the guide rail grooves and guide ribs can also be arranged in reverse, that is, the guide rail grooves are arranged on the heat-conducting cold plate, and the guide ribs are arranged on the equipment support structure, and the number of heat-conducting cold plates and guide ribs arranged in pairs can also be adjusted, for example, a pair of heat-conducting cold plates and guide ribs for guiding and plugging are arranged only on one side of the heat-conducting cold plate.

[0014] On the basis of the above technical solution, as a preferred technical solution, the secondary guiding structure includes guide pins and guide holes for guiding the insertion between the electronic module and the backplane electronic assembly. The present technical solution provides a preferred secondary guiding structure, which realizes the guiding insertion between the electronic module and the backplane electronic assembly through the guide pins and guide holes. Under the concept of the secondary guiding structure in the above technical solution, the number of guide pins and guide holes arranged in pairs can have multiple options, preferably two pairs are used for each electronic module, and the two pairs of guide pins and guide holes are preferably arranged on both sides of the electronic module. At the same time, the positions of the guide pins and guide holes also have multiple options, for example, the guide pins are arranged on the electronic module, and the guide holes are arranged on the backplane electronic assembly, or the guide pins are arranged on the backplane electronic assembly, and the guide holes are arranged on the electronic module; in addition, the shapes of the guide pins and guide holes also have multiple options, for example, the cross-sections of the guide pins and guide holes can be circular, elliptical, arched, etc., and a structure with a circular cross-section is preferably adopted.

[0015] On the basis of the above technical solution, as a preferred technical solution, each of the electronic modules and the backplane electronic assembly is plugged in through a pair of backplane connector plugs and backplane connector sockets, and the guide pins and the guide holes are arranged on the backplane connector plugs and the backplane connector sockets respectively. This technical solution uses the adaptation of the backplane connector plugs and the backplane connector sockets to realize the electrical interconnection between the electronic module and the backplane electronic assembly, and at the same time, the backplane connector plugs and the backplane connector sockets provide arrangement space for the guide pins and the guide holes. The specific arrangement positions of the backplane connector plugs and the backplane connector sockets can be selected according to the guidance of this technical solution, for example, the backplane connector plugs are arranged on the electronic module, and the backplane connector sockets are arranged on the backplane electronic assembly, or conversely, the backplane connector plugs are arranged on the backplane electronic assembly, and the backplane connector sockets are arranged on the electronic module. Similarly, the specific arrangement positions of the guide pins and guide holes can also be selected according to the guidance of the present technical solution, for example, the guide pins are arranged on the backplane connector plug, and the guide holes are arranged on the backplane connector socket, or vice versa, the guide pins are arranged on the backplane connector socket, and the guide holes are arranged on the backplane connector plug.

[0016] On the basis of the above technical solution, as a preferred technical solution, the backplane connector plug is connected to the bottom edge of the electronic module, the backplane connector socket is connected to the upper end of the backplane electronic assembly, the guide pins are arranged on both sides of the plug shell of the backplane connector plug, and the guide holes are arranged on both sides of the socket shell of the backplane connector socket. This technical solution provides a preferred arrangement of the backplane connector plug and the backplane connector socket, where the guide pins and guide holes of the secondary guide structure are arranged on the backplane connector plug and the backplane connector socket, respectively, and are located on both sides of the electrical connection part, respectively. Not only is the spatial arrangement and component layout reasonable, which facilitates the arrangement of the electrical connection part, but the secondary guide is also more convenient and reliable.

[0017] On the basis of the above technical solution, as a preferred technical solution, different anti-misplacement key positions are provided between each pair of the backplane connector plug and the backplane connector socket. This technical solution can meet a variety of key positions by coordinating the directions of the anti-misplacement key positions, and can avoid misuse when different electronic modules are installed and used. As for the specific structure of the anti-misplacement key position structure, under the guidance of the invention concept of anti-misplacement, there can be a variety of options, such as anti-misplacement pins arranged in pairs, or anti-misplacement pins and anti-misplacement grooves arranged in pairs, and so on.

[0018] The anti-mistake insertion key position structure includes a plug anti-mistake pin arranged on the plug housing and a socket anti-mistake pin arranged on the socket housing. The plug anti-mistake pin is plugged into and matched with the socket anti-mistake pin. The plug anti-mistake pins on different electronic modules correspond to socket anti-mistake pins in different directions.

[0019] On the basis of the above technical solution, as a preferred technical solution, the electronic module is threadedly connected to the device support structure through a non-loosening screw; or the electronic module is clamped to the device support structure through a locking device and separated from the device support structure through a puller. This technical solution provides two ways to fix the electronic module to the device support structure. One is directly connected by thread. When the electronic module and the backplane electronic component are plugged into place, the limit surface of the electronic module is attached to the limit surface of the device support structure and is locked and fastened by non-loosening screws. The use of non-loosening screws can also play a role in assisting extraction. The other is that the electronic module is connected to the device support structure through a locking device and separated from the device support structure through a puller, that is, the locking structure and the pulling structure between the electronic module and the device support structure are changed from a single non-loosening screw to a locking device and a puller.

[0020] On the basis of the above technical scheme, as a preferred technical scheme, the non-loosening screw is connected to the equipment support structure through the heat-conducting cold plate of the electronic module; the locking device includes a tightening nut and a three-petal sleeve arranged on the heat-conducting cold plate of the electronic module; the puller includes an auxiliary pull-out operating rod hinged to the heat-conducting cold plate; and the equipment support structure is provided with a support surface that cooperates with the auxiliary pull-out support point stop at the end of the auxiliary pull-out operating rod. This technical scheme provides a preferred implementation of the non-loosening screw, locking device and puller, and the similarities are that the non-loosening screw, locking device and puller are all connected to the electronic module by means of the heat-conducting cold plate. The advantage of this feature is not only reflected in the connection reliability, but also has an excellent heat conduction effect. The heat-conducting cold plate can directly transfer the heat generated by the electronic module PCB board to the equipment support structure for heat dissipation through the non-loosening screw or locking device and puller, thereby reducing the limitation of the heat dissipation by the thermal bridge effect. Among them, the structure of locking by not loosening the screws is relatively simple, and when the locking device is used, the tightening nut of the locking device is rotated clockwise with a hexagonal screwdriver, so that the three-petal sleeve of the locking device is staggered and gradually close to the side of the equipment support structure to achieve radial locking. When the electronic module is pulled out from the equipment support structure, there is no hand-held structure to apply force. At this time, the operating lever of the puller is operated with one hand, and the relative movement between the auxiliary pulling support point of the puller and the supporting surface of the equipment support structure is used to achieve the effect of pulling the electronic module out of the equipment support structure.

[0021] Compared with the prior art, the beneficial effects of the present invention include: 1. It realizes the miniaturized design and installation from equipment to modules. The highly integrated and axially stacked layout saves the space occupied by traditional distributed equipment installation and liberates the dependence of distributed equipment layout on the use of connectors and cables; 2. It realizes the convenience of manual installation and fixation of equipment to automatic blind plug-in installation and fixation, and the quick plug-in and quick pull-out improves the operability and maintainability of the equipment; 3. It improves the high utilization rate of the unit cross-sectional space of the electronic module single board, facilitates the layout of more devices and circuits, meets the single-board function realization of the future integrated signal processing board, and facilitates the development of the system towards the microsystem. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying any creative work.

[0023] Figure 1 It is a schematic diagram of assembling a rectangular electronic module and a square electronic equipment support body; Figure 2 A cross-sectional view of an electronic module having a rectangular structure and an electronic device support having a cylindrical shape is assembled; Figure 3 The general assembly drawing of the electronic device with high space utilization of the electronic module provided by the present invention; Figure 4 for Figure 3 Schematic diagram of the installation process of the electronic module; Figure 5 for Figure 3 Internal assembly diagram in; Figure 6 for Figure 3 Schematic diagram of the equipment support structure in FIG. Figure 7 for Figure 3 The stacking diagram of the electronic modules in the Figure 8 for Figure 3 Schematic diagram of the mid-backplane electronic components; Fig. 9 for Figure 4 Internal state diagram in ; Fig.10 for Fig. 9 Schematic diagram of the connection structure between the central electronic module and the backplane electronic components; Fig.11 for Fig.10 The enlarged view of point A in the middle; Fig.12 for Fig.10 The enlarged view of point B in the middle; Fig.13 for Figure 7 A magnified view of the midplane connector plug; Fig.14 for Fig.13 Enlarged view of point C in the middle; Fig.15 for Figure 8 A magnified view of the midplane connector socket; Fig.16 for Fig.15 The enlarged view of point D in the middle; Fig.17 A radial cross-sectional view of the electronic module, the equipment support structure, and the backplane electronic components after installation; Fig.18 It is an axial cross-sectional view after the electronic module and the equipment support structure are assembled; Fig.19 for Figure 3 A hollow schematic diagram of the equipment support structure; Fig. 20 for Fig.19 Left view of; Fig.21 for Fig.19 A cross-sectional view of Fig. 22 It is the assembly drawing of the electronic module, the locker and the extractor; Fig.23 for Fig. 22 Graph of the change of viewing angle; Fig.24 for Fig.23 Enlarged view of point E in the middle; Fig.25 This is the general assembly drawing using the locking device and the extractor; Fig.26 for Fig.25 Enlarged view of point F in the middle.

[0024] Description of Figure Numbers: Equipment supporting structure 1; Axial hollow area 1-1, radial insertion opening 1-11, side opening 1-12; Radial hollow area 1-2, straight structure 1-21, arc transition structure 1-22; Guide rail groove 1-3, support surface 1-4; Back panel electronic assembly 2; Backplane connector plug 2-1, plug housing 2-10, guide pin 2-11, plug anti-misalignment pin 2-12, plug insulator part 2-13; Backplane connector socket 2-2, socket housing 2-20, guide hole 2-21, socket anti-misalignment pin 2-22, socket insulator part 2-23; Backplane rigid-flexible components 2-3; Board-line transfer electrical connector 2-4; Electronic module 3; Electronic module PCB board 3-1; Heat-conducting cold plate 3-2, guide ribs 3-21, and non-loosening screws 3-22; Locking device 3-23, tightening nut 3-231, three-piece sleeve 3-232; Puller 3-24, auxiliary pulling operating rod 3-241, auxiliary pulling supporting point 3-242. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the core concept of the present invention and the following embodiments, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0026] The present application provides these embodiments to make the present application thorough and complete, and to fully express the scope of the present application to those skilled in the art. It should be noted that unless otherwise specifically stated, the relative arrangement of the parts and steps, the composition of the materials, the numerical expressions and the numerical values ​​set forth in these embodiments should be interpreted as being merely exemplary, rather than as limiting.

[0027] It should be noted that, in the description of this application, unless otherwise specified, the meaning of "several" is greater than or equal to two; the terms "upper", "lower", "left", "right", "inner", "outer", "axial", "radial" and the like indicate positions or positional relationships only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on this application. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0028] In addition, the words "first", "second" and similar words used in this application do not indicate any order, quantity or importance, but are only used to distinguish different parts. "Vertical" does not mean vertical in the strict sense, but is within the tolerance range. "Parallel" does not mean parallel in the strict sense, but is within the tolerance range. "Include" or "comprising" and similar words mean that the elements before the word include the elements listed after the word, and do not exclude the possibility of including other elements.

[0029] It should also be noted that in the description of this application, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be internal communication between two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances. When a specific device is described as being located between a first device and a second device, there may or may not be an intermediate device between the specific device and the first device or the second device.

[0030] All terms used in this application have the same meaning as those understood by those of ordinary skill in the art to which this application belongs, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries, such as general dictionaries, should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and should not be interpreted in an idealized or extremely formal sense, unless explicitly defined herein.

[0031] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the corresponding technologies, methods, and equipment should be considered part of the specification.

[0032] The specific embodiments are as follows: An electronic device with high space utilization of electronic modules, such as Figures 3 to 8 As shown, it includes a device support structure 1, a backplane electronic assembly 2 and a plurality of electronic modules 3. The device support structure 1 is cylindrical, the backplane electronic assembly 2 is arranged in the device support structure 1, the electronic module 3 is radially installed in the device support structure 1 and vertically plugged with the backplane electronic assembly 2, and a plurality of electronic modules 3 are stacked in the axial direction, and the circumferential profile of the electronic module 3 is adapted to the radial cross-sectional shape of the device support structure 1.

[0033] That is, the device support structure 1 is axially connected to the backplane electronic component 2 and radially connected to a plurality of parallel electronic modules 3, and the electronic modules 3 are vertically plugged into the backplane electronic component 2. The radial cross section of the device support structure 1 is approximately annular and has an opening, and the circumferential profile of the electronic module 3 is adapted to the radial cross section of the device support structure 1, that is, the projections of the electronic module 3 and the device support structure 1 in the axial direction are flush with each other and are conformal designs.

[0034] In this embodiment, if Figure 8 and Fig. 9As shown, since the backplane electronic component 2 has a backplane rigid-flexible component 2-3 and a board-line adapter electrical connector 2-4 flexibly connected to the backplane rigid-flexible component 2-3, the backplane electronic component 2 does not necessarily have to be axially delivered to the inside of the device support structure 1 and then fixed, but can also be radially installed from top to bottom like the electronic module 3, and then the output end of the backplane electronic component 2 can be extended to the outside of the device support structure 1 by utilizing the easy deformation characteristics of the backplane rigid-flexible component.

[0035] In this embodiment, the backplane electronic assembly 2 is arranged along the axial direction of the inner wall of the device support structure 1, which not only does not occupy too much radial space of the device structure support 1, but also facilitates the plugging and unplugging of the electronic module 3 vertically connected to the backplane electronic assembly 2 from the radial direction of the device support structure 1. The circumferential profile of the electronic module 3 is adapted to the radial section of the device support structure 1, so this technical solution has both a highly integrated stacked layout structure of the electronic module 3 and a high space utilization rate of the conformal design, and can simultaneously realize the specialization, miniaturization and lightweight of the electronic equipment.

[0036] Based on the above embodiments, as a preferred embodiment, Figures 19 to 21 As shown, the circumferential portion of the device support structure 1 is provided with an axial hollow area 1-1. In this embodiment, under the premise of ensuring the supporting strength of the device support structure 1, part of the circumferential portion of the device support structure 1 is hollowed out, which can not only reduce the weight of the product, but also provide visual conditions for the installation and fixation of the electronic module 3, and at the same time, the backplane electronic component 2 and the electronic module 3 can be installed through the axial hollow area 1-1.

[0037] More importantly, the electronic module 3 can extend a certain distance in the radial direction of the equipment support structure 1 in the axial hollow area 1-1, and as an expandable space, more devices and circuits can be arranged, thereby increasing the PCB board volume ratio within the unit cross section of the electronic module 3. It should be noted that under the technical guidance of this technical solution, while ensuring weight reduction, visualization, and PCB board volume ratio, those skilled in the art can adopt various forms of axial hollow areas.

[0038] On the basis of the above embodiments, as a preferred embodiment, the axial hollow area 1-1 includes a radial insertion port 1-11 of the electronic module 3 and a radial insertion port 1-11 close to the backplane electronic component 2, and the edge of the electronic module 3 is flush with the edge of the radial insertion port 1-11 and the edge of the side port 1-12 in the axial direction.

[0039] The present embodiment provides a preferred arrangement position of the axial hollow area 1-1 on the equipment support structure 1, that is, the bottom and the upper part on both sides along the axial direction are hollowed out to form a radial insertion port 1-11 and a side port 1-12, which reduces the weight of the product, provides visual conditions for the installation and fixation of the electronic module 3, and increases the PCB board volume ratio within the unit cross-section of the electronic module 3. At the same time, it also provides a preferred installation channel for the electronic module 3 and the backplane electronic component 2, that is, the radial insertion port 1-11 and the side port 1-12 have multiple functions at the same time.

[0040] It should be noted that this embodiment is only a preferred arrangement of the axial hollow area 1-1. The axial hollow area 1-1 can also adopt other arrangements. The position, shape and number of the radial insertion port 1-11, as well as the shape, position and number of the side port 1-12 can have multiple options. That is, in addition to arranging the radial insertion port 1-11 on the side of the device support structure 1 away from the back panel electronic component 2 and arranging the side port 1-12 on both sides of the device support structure 1 close to the back panel electronic component 2 as shown in the figure, the radial insertion port 1-11 can also be arranged on the side of the device support structure 1 close to the back panel electronic component 2, and the side port 1-12 can be arranged on the side of the device support structure 1 away from the back panel electronic component 2. In addition, the radial insertion port 1-11 and the side port 1-12 can be set as continuous openings in the axial direction as shown in the figure, or can be set as a plurality of openings arranged at intervals in the axial direction.

[0041] Based on the above embodiments, as a preferred embodiment, Fig.17 and Fig.18 As shown, the shaft end of the device support structure 1 is provided with a radial hollow area 1-2. This embodiment not only further reduces the weight of the product, provides better visualization conditions for the installation and fixation of the electronic module 3, but also provides more feasibility for the installation of the backplane electronic component 2. It should be noted that under the technical guidance of this technical solution, while ensuring weight reduction, visualization, and PCB board volume ratio, technicians in this field can adopt various structural forms of radial hollow areas 1-2.

[0042] On the basis of the above embodiments, as a preferred embodiment, the skeleton outer contour of the radial hollow area 1-2 has a straight structure 1-21 and an arc transition structure 1-22 located on both sides of the straight structure 1-21, and the edge of the electronic module 3 is flush with the edge of the straight structure 1-21 and the edge of the arc transition structure 1-22 in the axial direction.

[0043] The present embodiment provides a preferred arrangement of radial hollow areas 1-2 on the device support structure 1, and the circumferential coordination of the electronic module 3 and the device support structure 1 adopts a conformal matching spatial structure design, wherein the arc transition structures 1-22 are preferably arranged at four locations and are respectively located at the four corners of the skeleton outer contour of the radial hollow area 1-2. The four corner circumferential transitions of the electronic module 3 are flush with the four arc transition structures 1-22 of the device support structure 1, and the upper edge of the electronic module 3 is aligned with the straight structure 1-21 of the device support structure 1, which can maximize the use of the hollow space without affecting the plugging and unplugging of the electronic module 3 from the radial insertion port 1-11, thereby further improving the PCB board volume ratio within the unit cross-section of the electronic module 3.

[0044] In addition, it is preferred to set the straight structure 1-21 and the arc transition structure 1-22 to correspond to the outer contour of the radial insertion port 1-11, that is, the outer contour of the radial insertion port 1-11 includes the straight structure 1-21 and the arc transition structure 1-22, so that the circumferential extension range of the radial insertion port 1-11 covers the straight structure 1-21 and the arc transition structure 1-22.

[0045] It should be specially noted that the above contents are only illustrations of the inventive concept and preferred method of this embodiment. Within the technical scope claimed for protection by the present invention, there are multiple options for the number and relative position relationship of the straight structures 1-21 and the arc transition structures 1-22. Those skilled in the art can implement them by themselves according to the technical guidance of the present invention, and this embodiment will not be described in detail.

[0046] Based on the above embodiments, as a preferred embodiment, Figure 5 , Figure 6 , Fig. 9 , Fig.10 As shown, a primary guide structure is provided between the electronic module 3 and the device support structure 1, and a secondary guide structure is provided between the electronic module 3 and the backplane electronic assembly 2. When installing the electronic module 3, the electronic module 3 is first radially inserted into the device support structure 1 under the guidance of the primary guide structure; when the electronic module 3 is inserted into the device support structure 1 to a certain depth, the electronic module 3 is vertically inserted into the backplane electronic assembly 2 under the guidance of the secondary guide structure.

[0047] On the basis of the above embodiment, as a preferred embodiment, the primary guide structure includes guide ribs 3-21 and guide grooves 1-3 for guiding the insertion between the electronic module 3 and the device support structure 1. That is, this embodiment realizes the primary guidance of the electronic module 3 and the device support structure 1 during assembly through the insertion between the guide ribs 3-21 and the guide grooves 1-3. As for the number, specific arrangement position and cross-sectional shape of the guide ribs 3-21 and the guide grooves 1-3, there are multiple options. Under the guidance of this technical solution, those skilled in the art can choose a variety of implementation methods suitable for practical use.

[0048] Based on the above embodiments, as a preferred embodiment, the electronic module 3 includes an electronic module PCB board 3-1 and a heat-conducting cold plate 3-2 that are connected to each other, the guide ribs 3-21 are arranged on both sides of the heat-conducting cold plate 3-2, and the guide rail grooves 1-3 are arranged on both sides of the inner wall of the equipment support structure 1.

[0049] This embodiment provides a preferred primary guide structure, which realizes the guiding and plugging of the electronic module 3 and the device support structure 1 through the guide ribs 3-21 arranged on both sides of the heat-conducting cold plate 3-2 and the guide grooves 1-3 arranged in the device support structure 1. Under the concept of the primary guide structure in the above embodiment, and without departing from the protection scope of the present invention, the guide grooves 1-3 and the guide ribs 3-21 can also be arranged in reverse, that is, the guide grooves 1-3 are arranged on the heat-conducting cold plate 3-2, and the guide ribs 3-21 are arranged on the device support structure 1, and the number of heat-conducting cold plates 3-2 and guide ribs 3-21 arranged in pairs can also be adjusted, for example, a pair of heat-conducting cold plates 3-2 and guide ribs 3-21 for guiding and plugging are only arranged on one side of the heat-conducting cold plate 3-2.

[0050] Based on the above embodiments, as a preferred embodiment, Fig.11 and Fig.12As shown, the secondary guiding structure includes a guide pin 2-11 and a guide hole 2-21 for guiding the insertion between the electronic module 3 and the backplane electronic component 2. This embodiment provides a preferred secondary guiding structure, which realizes the guiding insertion of the electronic module 3 and the backplane electronic component 2 through the guide pin 2-11 and the guide hole 2-21. Under the concept of the secondary guiding structure in the above embodiment, the number of guide pins 2-11 and guide holes 2-21 arranged in pairs can have multiple options, preferably each electronic module 3 adopts two pairs, and preferably the two pairs of guide pins 2-11 and guide holes 2-21 are respectively arranged on both sides of the electronic module 3. At the same time, the positions of the guide pins 2-11 and the guide holes 2-21 also have multiple options, for example, the guide pins 2-11 are arranged on the electronic module 3, and the guide holes 2-21 are arranged on the backplane electronic component 2, or the guide pins 2-11 are arranged on the backplane electronic component 2, and the guide holes 2-21 are arranged on the electronic module 3.

[0051] Based on the above embodiments, as a preferred embodiment, Figures 13 to 16 As shown, each of the electronic modules 3 is connected to the backplane electronic component 2 through a pair of backplane connector plugs 2-1 and backplane connector sockets 2-2, and the guide pins 2-11 and the guide holes 2-21 are respectively arranged on the backplane connector plugs 2-1 and the backplane connector sockets 2-2.

[0052] This embodiment uses the adaptation of the backplane connector plug 2-1 and the backplane connector socket 2-2 to achieve the electrical interconnection between the electronic module 3 and the backplane electronic component 2. At the same time, the backplane connector plug 2-1 and the backplane connector socket 2-2 provide layout space for the guide pins 2-11 and the guide holes 2-21.

[0053] As for the specific arrangement positions of the backplane connector plug 2-1 and the backplane connector socket 2-2, they can be selected according to the guidance of the present technical solution, for example, the backplane connector plug 2-1 is arranged on the electronic module, and the backplane connector socket 2-2 is arranged on the backplane electronic component 2. Or conversely, the backplane connector plug 2-1 is arranged on the backplane electronic component 2, and the backplane connector socket 2-2 is arranged on the electronic module.

[0054] Similarly, the specific arrangement positions of the guide pins 2-11 and guide holes 2-21 can also be selected in a variety of ways according to the guidance of the technical solution, for example, the guide pins 2-11 are arranged on the backplane connector plug 2-1, and the guide holes 2-21 are arranged on the backplane connector socket 2-2. Or conversely, the guide pins 2-11 are arranged on the backplane connector socket 2-2, and the guide holes 2-21 are arranged on the backplane connector plug 2-1.

[0055] Based on the above embodiments, as a preferred embodiment, Fig.10 As shown, the backplane connector plug 2-1 is connected to the bottom edge of the electronic module 3, the backplane connector socket 2-2 is connected to the backplane electronic component 2, the guide pins 2-11 are arranged on both sides of the plug shell 2-10 of the backplane connector plug 2-1, and the guide holes 2-21 are arranged on both sides of the socket shell 2-20 of the backplane connector socket 2-2.

[0056] The present embodiment provides a preferred structural form of the backplane connector plug 2-1 and the backplane connector socket 2-2, and the guide pins 2-11 and guide holes 2-21 of the secondary guiding structure are respectively arranged on the backplane connector plug 2-1 and the backplane connector socket 2-2, and are respectively located on both sides of the electrical connection part. Not only is the spatial arrangement and component layout reasonable, which facilitates the arrangement of the electrical connection part, but the secondary guiding is also more convenient and reliable.

[0057] On the basis of the above-mentioned embodiment, as a preferred embodiment, different anti-misplacement key positions are provided between each pair of the backplane connector plug 2-1 and the backplane connector socket 2-2. This embodiment can meet a variety of key positions by coordinating the directions of the anti-misplacement key positions, and can avoid misuse when different electronic modules are installed and used. As for the specific structure of the anti-misplacement key position structure, under the guidance of the invention concept of anti-misplacement, there can be a variety of options, such as anti-misplacement pins arranged in pairs, or anti-misplacement pins and anti-misplacement grooves arranged in pairs, and so on.

[0058] On the basis of the above embodiments, as a preferred embodiment, the anti-mistake insertion key position structure includes a plug anti-mistake pin 2-12 set on the plug housing 2-10 and a socket anti-mistake pin 2-22 set on the socket housing 2-20, and the plug anti-mistake pin 2-12 is plugged into and matched with the socket anti-mistake pin 2-22, and the plug anti-mistake pins 2-12 on different electronic modules 3 correspond to the socket anti-mistake pins 2-22 in different directions.

[0059] Based on the above embodiments, as a preferred embodiment, Figures 3 to 6 As shown, the electronic module 3 is threadedly connected to the device support structure 1 through a non-loosening screw 3-22; or the electronic module 3 is clamped to the device support structure 1 through a locker 3-23 and separated from the device support structure 1 through a puller 3-24.

[0060] This embodiment provides two ways of fixing the electronic module 3 and the device support structure 1. One is directly connected by thread. When the electronic module 3 and the backplane electronic assembly 2 are plugged into place, the limit surface of the electronic module 3 is attached to the limit surface of the device support structure 1 and is locked and fixed by the non-loose screw 3-22. The use of the non-loose screw 3-22 for fastening is not only simple in structure, but also has the function of assisting extraction and facilitating disassembly and assembly. When assembling, only the non-loose screw 3-22 needs to be tightened, and when disassembling, only the non-loose screw 3-22 needs to be loosened, and then the electronic module 3 can be pulled out by dragging the non-loose screw 3-22.

[0061] The other is that the electronic module 3 is connected to the device support structure 1 through a locker 3-23 and is separated from the device support structure 1 through a puller 3-24, that is, the locking structure and the pulling structure between the electronic module 3 and the device support structure 1 are respectively changed from a single non-loosening screw 3-22 to a locker 3-23 and a puller 3-24.

[0062] As a preferred embodiment, Figure 22 to Figure 26 As shown, the captive screw 3 - 22 is connected to the equipment supporting structure 1 through the heat-conducting cold plate 3 - 2 of the electronic module 3 .

[0063] The locker 3-23 includes a tightening nut 3-231 and a three-petal sleeve 3-232 arranged on the heat-conducting cold plate 3-2 of the electronic module 3. By rotating the tightening nut 3-231, the three-petal sleeve 3-232 can be radially tightened against the inner wall of the equipment support structure 1 or detached from the inner wall of the equipment support structure 1.

[0064] The puller 3-24 includes an auxiliary pulling operating rod 3-241 hinged to the heat-conducting cold plate 3-2, and the equipment support structure 1 is provided with a support surface 1-4 that stops and cooperates with the auxiliary pulling supporting point 3-242 at the end of the auxiliary pulling operating rod 3-241.

[0065] That is, in this embodiment, the locking device 3-23 adopts a three-petal structure with variable diameter, and the extractor 3-24 is a lever structure. Of course, in addition to this, within the scope of the inventive concept of the present invention, the locking device 3-23 and the extractor 3-24 have a variety of structural forms to choose from, for example, the locking device 3-23 adopts other multi-petal structures, a tongue structure, and the extractor 3-24 adopts a pull-out structure, a push-up structure, and so on.

[0066] It should be noted that this embodiment provides preferred implementations of the screws 3-22, the lockers 3-23 and the pullers 3-24, the same point of which is that the screws 3-22, the lockers 3-23 and the pullers 3-24 are all connected to the electronic module 3 by means of a heat-conducting cold plate. The advantage of this feature is not only reflected in the connection reliability, but also has an excellent heat conduction effect. The heat-conducting cold plate 3-2 can directly transfer the heat generated by the electronic module PCB board 3-1 to the equipment support structure 1 for heat dissipation through the screws 3-22 or the lockers 3-23 and the pullers 3-24, thereby reducing the limitation of the heat dissipation by the thermal bridge effect.

[0067] Although the structure for locking the electronic module 3 by the non-loosening screw 3-22 in this embodiment is relatively simple, the threaded hole structure on the equipment support structure 1 that matches the non-loosening screw 3-22 has a preferred implementation method, that is, it is preferably coupled with the guide groove 1-3 or the guide rib 3-21. When the guide groove 1-3 is arranged on the inner wall of the equipment support structure 1, the threaded hole structure is arranged between adjacent guide grooves 1-3, and the outer wall of the threaded hole structure is aligned with the inner wall of one of the guide grooves 1-3; and when the guide rib 3-21 is arranged on the inner wall of the equipment support structure 1, the threaded hole structure is arranged between adjacent guide ribs 3-21, or the threaded hole is arranged on the guide rib 3-21. The structural mode of coupling the above-mentioned threaded hole structure with the guide groove 1-3 or the guide rib 3-21 can further improve the space utilization rate.

[0068] When the implementation method of the locker 3-23 is adopted, in addition to having the same implementation method as the above-mentioned coupling arrangement form, its operation method is: by using a hexagonal screwdriver to rotate the tightening nut 3-231 of the locker 3-23 clockwise, the three-petal sleeve of the locker 3-23 is staggered and gradually close to the side of the equipment support structure 1 to achieve radial locking. When the electronic module 3 is pulled out from the equipment support structure 1, there is no hand-held structure to apply force. At this time, the auxiliary extraction operating rod 3-241 of the puller 3-24 is operated with one hand, and the relative movement between the auxiliary extraction support point 3-242 of the puller 3-24 and the support surface 1-4 of the equipment support structure 1 is used to achieve the effect of pulling the electronic module 3 out of the equipment support structure 1.

[0069] As a preferred embodiment of the present invention, the electronic device with high space utilization of electronic modules includes three parts: a device support structure 1, a backplane electronic component 2, and an electronic module 3. Figure 3 The backplane electronic assembly 2 passes through the side of the equipment support structure 1 and is fixed on the equipment support structure 1 by screws 3-22 that do not loosen. The six electronic modules 3 are inserted into the backplane electronic assembly 2 from top to bottom in sequence through the guide grooves 1-3 of the equipment support structure 1. Figure 4 , Figure 5 , Figure 6 As shown, the integrity of the electronic compartment assembly in terms of structural reliability is achieved by fastening the screws 3-22 without loosening.

[0070] The 6 electronic modules 3 with different functions have a uniform appearance and are stacked in sequence according to the same axial spacing, such as Figure 7 As shown, the bottom edge of each electronic module 3 is press-fitted with a backplane connector plug 2-1 with different anti-mismatching key positions without soldering, and is plugged into the backplane connector socket 2-2 with press-fitting without soldering on the backplane electronic component 2 to achieve electrical connection. According to the matching relationship of different anti-mismatching key positions on the connector, the six electronic modules can be used in an anti-mismatching manner, such as Figures 10 to 16 shown.

[0071] The six electronic modules 3 and the backplane electronic components 2 are electrically interconnected by means of blind-plugged backplane connector plugs 2-1 and backplane connector sockets 2-2. The two ends of the connectors are guided and plugged in by means of guide pins 2-11 and guide holes 2-21, respectively. Two plug anti-mistake pins 2-12 are designed next to the guide pins 2-11, and two socket anti-mistake pins 2-22 are arranged next to the guide holes 2-21. The guide holes 2-21 are preferably crown-band holes, and the plug anti-mistake pins 2-12 and socket anti-mistake pins 2-22 are preferably anti-mistake key-position square pins, which meet 16 key-position directions through directional matching.

[0072] The guide ribs 3-21 on the electronic module 3 and the guide grooves 1-3 on the equipment support structure 1 realize primary guidance. When the electronic module 3 is inserted into the equipment support structure 1 to a certain depth, the guide pins 2-11 on the backplane connector plug 2-1 at the lower end of the electronic module 3 and the guide holes 2-21 on the backplane connector socket 2-2 on the backplane electronic component 2 guide the insertion to realize secondary guidance. After further insertion to a certain depth, the metal plug shell 2-10 and plug insulator component 2-13 of the backplane connector plug 2-1 and the metal socket shell 2-20 and socket insulator component 2-23 of the backplane connector socket 2-2 are successively contacted and guided until they are inserted into place. At this time, the limit surface of the electronic module 3 is in contact with the limit surface of the equipment support structure 1, and is locked and fastened by the non-loosening screws 3-22.

[0073] Fig.17 and Fig.18 It is a cross-sectional view after the electronic module 3 is installed and fixed to the equipment support structure 1 and plugged into the backplane electronic component 2. From the figure, it can be clearly seen that the cross-section of the electronic module PCB board 3-1 has achieved the maximum area utilization rate relative to the cylindrical equipment support structure 1, so that more electronic devices can be arranged here, achieving high space utilization of the single board. Fig.18The stacking arrangement of 6 kinds of electronic modules 3 in the axial space is demonstrated. The guide ribs 3-21 on both sides of the heat-conducting cold plate 3-2 of the electronic module 3 are guided and inserted into the guide grooves 1-3 in the equipment support structure 1. The heat-conducting cold plate 3-2 has self-contained non-loosening screws 3-22 on both sides that are screwed into the threaded holes on the equipment support structure 1 and coated with thread glue for fastening. It is simple, convenient and highly reliable.

[0074] In order to achieve the volume ratio of the single board in the cylindrical space, the equipment support structure 1 is hollowed out at the bottom and the top of both sides along the axial direction while ensuring the strength support. Figures 19 to 21 As shown, the electronic module 3 will extend a certain distance radially along the device support structure in the hollow area, which can be used as an expandable space to layout more devices and circuits, thereby increasing the PCB board volume ratio within the unit cross section of the electronic module 3, such as Fig.17 , Fig.21 shown.

[0075] The details not described in detail in the present invention are all conventional technical means known to those skilled in the art.

[0076] The above content shows and describes the basic principles, main features and beneficial effects of the present invention. The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An electronic device with high space utilization of electronic modules, comprising a device support structure (1), a backplane electronic component (2) and a plurality of electronic modules (3), characterized in that: The device support structure (1) is cylindrical, the backplane electronic component (2) is arranged in the device support structure (1), the electronic module (3) is radially installed in the device support structure (1) and is vertically plugged into the backplane electronic component (2), and a plurality of electronic modules (3) are stacked in an axial direction, and the circumferential profile of the electronic module (3) is compatible with the radial cross-sectional shape of the device support structure (1).

2. The electronic device with high space utilization of electronic modules according to claim 1, characterized in that: The circumferential portion of the equipment support structure (1) is provided with an axial hollow area (1-1).

3. The electronic device with high space utilization of electronic modules according to claim 2, characterized in that: The axial hollow area (1-1) comprises a radial insertion opening (1-11) of the electronic module (3) and a side opening (1-12) close to the backplane electronic component (2); an edge of the electronic module (3) is flush with an edge of the radial insertion opening (1-11) and an edge of the side opening (1-12) in the axial direction.

4. The electronic device with high space utilization of electronic modules according to any one of claims 1 to 3, characterized in that: The shaft end of the equipment support structure (1) is provided with a radial hollow area (1-2).

5. The electronic device with high space utilization of electronic modules according to claim 4, characterized in that: The skeleton outer contour of the radial hollow area (1-2) comprises a straight structure (1-21) and arc transition structures (1-22) located on both sides of the straight structure (1-21), and the edge of the electronic module (3) is flush with the edge of the straight structure (1-21) and the edge of the arc transition structure (1-22) in the axial direction.

6. The electronic device with high space utilization of electronic modules according to any one of claims 1 to 3 and 5, characterized in that: A primary guiding structure is provided between the electronic module (3) and the equipment supporting structure (1), and a secondary guiding structure is provided between the electronic module (3) and the backplane electronic component (2).

7. The electronic device with high space utilization of electronic modules according to claim 6, characterized in that: The primary guide structure comprises guide ribs (3-21) and guide rail grooves (1-3) for guiding the insertion between the electronic module (3) and the equipment support structure (1).

8. The electronic device with high space utilization of electronic modules according to claim 7, characterized in that: The electronic module (3) comprises an electronic module PCB board (3-1) and a heat-conducting cold plate (3-2) which are connected to each other, the guide ribs (3-21) are arranged on both sides of the heat-conducting cold plate (3-2), and the guide rail grooves (1-3) are arranged on both sides of the inner wall of the equipment support structure (1).

9. The electronic device with high space utilization of electronic modules according to claim 7 or 8, characterized in that: The secondary guiding structure comprises a guiding pin (2-11) and a guiding hole (2-21) for guiding the insertion between the electronic module (3) and the backplane electronic component (2).

10. The electronic device with high space utilization of electronic modules according to claim 9, characterized in that: Each of the electronic modules (3) is plugged into the backplane electronic assembly (2) via a pair of backplane connector plugs (2-1) and backplane connector sockets (2-2), and the guide pins (2-11) and the guide holes (2-21) are arranged on the backplane connector plugs (2-1) and the backplane connector sockets (2-2), respectively.

11. The electronic device with high space utilization of electronic modules according to claim 10, characterized in that: The backplane connector plug (2-1) is connected to the bottom edge of the electronic module (3), the backplane connector socket (2-2) is connected to the upper end of the backplane electronic component (2), the guide pins (2-11) are arranged on both sides of the plug housing (2-10) of the backplane connector plug (2-1), and the guide holes (2-21) are arranged on both sides of the socket housing (2-20) of the backplane connector socket (2-2).

12. The electronic device with high space utilization of electronic modules according to claim 10 or 11, characterized in that: Different anti-wrong-insertion key position structures are provided between each pair of the backplane connector plugs (2-1) and the backplane connector sockets (2-2).

13. The electronic device with high space utilization of electronic modules according to claim 12, characterized in that: The anti-mis-insertion key structure comprises a plug anti-mis-insertion pin (2-12) provided on a plug housing (2-10) of the backplane connector plug (2-1) and a socket anti-mis-insertion pin (2-22) provided on a socket housing (2-20) of the backplane connector socket (2-2); the plug anti-mis-insertion pin (2-12) is plugged and matched with the socket anti-mis-insertion pin (2-22).

14. The electronic device with high space utilization of electronic modules according to any one of claims 1-3, 5, 7-8, 10-11, and 13, characterized in that: The electronic module (3) is threadedly connected to the device support structure (1) via a non-loosening screw (3-22); or the electronic module (3) is clamped to the device support structure (1) via a locker (3-23) and separated from the device support structure (1) via a puller (3-24).

15. The electronic device with high space utilization of electronic modules according to claim 14, characterized in that: The non-loosening screw (3-22) is connected to the equipment support structure (1) via the heat-conducting cold plate (3-2) of the electronic module (3); the locking device (3-23) comprises a tightening nut (3-231) and a three-petal sleeve (3-232) arranged on the heat-conducting cold plate (3-2) of the electronic module (3); the extractor (3-24) comprises an auxiliary extraction operating rod (3-241) hinged to the heat-conducting cold plate (3-2); and the equipment support structure (1) is provided with a support surface (1-4) that is stop-matched with an auxiliary extraction supporting point (3-242) at the end of the auxiliary extraction operating rod (3-241).

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