Component packaging tube, chip mounter and chip mounter

Abstract

According to the element packaging pipe, the upper end of the element packaging pipe is a storage area, and the lower end of the element packaging pipe is an insertion area; a detachable bolt is inserted between the storage area and the insertion area; an opening is arranged below the plugging area. The chip mounter comprises a platform, a supporting device and a chip mounter, the chip mounter is provided with a feed port and a discharge port; the supporting device is connected with the platform; the supporting device is connected with the chip mounter; the supporter is used for supporting the chip mounter, so that the chip mounter is suspended at a preset position above the platform; the discharge port is vertically aligned with the chip mounting position; and the chip mounter is used for releasing an electronic element when chip mounting operation is executed, so that the electronic element falls down from the discharge port and falls on the chip mounting position of the PCB, and chip mounting is completed. The chip mounter is low in cost, simple in structure, simple to operate, easy to operate, easy to repair and low in use cost.

Description

Technical Field

[0001] The invention belongs to the technical field of SMT surface mounting, and in particular relates to a component packaging tube, a chip mounter and a chip mounter. Background Art

[0002] SMT (surface mount technology) is an important means of electronic manufacturing, so people have developed automatic placement machines; but automatic placement machines are expensive, accessories are expensive, and maintenance costs are high; and automatic placement machines require professional technicians to operate and use, and the cost of use is high; in addition, automatic placement machines have complex structures, many wearing parts, and poor durability.

[0003] In common high-speed placement machines, the placement head needs to move at high speed, constantly accelerating and decelerating, consuming a large amount of electricity, which is not conducive to energy conservation and emission reduction.

[0004] Although the manual placement machine or manual placement table with simple operation is simple and easy to use, it has low output, slow speed and high labor cost.

[0005] At present, most fully automatic placement machines need to be used with electronic components packaged in tape. However, tape packaging requires each component to be packaged separately, which makes the packaging process very troublesome and the packaging cost high. In addition, the packaging materials of tape packaging have low recycling value (especially tapes made of composite materials), and many of them are thrown away as garbage, which is not conducive to environmental protection.

[0006] Technical personnel in this field have technical prejudices and believe that the placement machine should first suck up the material, then move to the placement position, and finally release the material.

[0007] The present invention aims to provide a new chip mounter, which has a simple structure, is easy to operate, low cost, easy to use, easy to repair, long life and durability, and can meet the needs of mass production. Summary of the invention

[0008] In order to solve the above problems, the first aspect of the present invention provides a component packaging tube that can be installed on a placement machine, characterized in that it includes: The upper end of the component packaging tube (50) is a storage area (54), and the lower end is a plug-in area (52); A detachable latch (51) is inserted between the storage area (54) and the insertion area (52); An opening (53) is provided below the plug-in area (52), so that when the opening (53) faces downward, the latch (51) is pulled out and the electronic components stored in the storage area (54) fall out of the opening (53).

[0009] A second aspect of the present invention provides a chip mounter, which is applied to a chip mounter and is characterized by comprising: The chip mounter (30) is provided with a feed port (31); a discharge port (32) is provided below the chip mounter (30); the feed port (31) is used to obtain electronic components, and the discharge port (32) is used to release electronic components; The patch mounter (30) is provided with a storage chamber (34) and a release chamber (35) inside; The storage chamber (34) is in communication with the feed port (31), so that the electronic components can enter the storage chamber (34) from the feed port (31); The discharge port (32) is arranged below the release chamber (35), and the release chamber (35) is in communication with the discharge port (32), so that the electronic components in the release chamber (35) can fall out of the discharge port (32); The storage chamber (34) and the release chamber (35) are in communication, so that the electronic component in the storage chamber (34) can be pushed into the release chamber (35); The storage chamber (34) is provided with an insertion plate gap (36), so that when an insertion plate (37) is inserted into the insertion plate gap (36), the insertion plate (37) pushes an electronic component in the storage chamber (34) into the release chamber (35).

[0010] Furthermore, the above-mentioned chip mounter is applied to a chip mounter, and is characterized in that it also includes: The feed inlet (31) is arranged above the chip mounter (30), and the storage chamber (34) is arranged below the feed inlet (31), so that electronic components can enter the storage chamber (34) from the feed inlet (31) under the action of gravity.

[0011] Furthermore, the above-mentioned chip mounter is applied to a chip mounter, and is characterized in that it also includes: An insertion chamber (33) is provided in the feed port (31) of the patch mounter (30).

[0012] Furthermore, the above-mentioned chip mounter is applied to a chip mounter, and is characterized in that it also includes: The storage chamber (34) and the release chamber (35) are connected via a channel (38), and a height H of the channel (38) is no greater than the height of the two electronic components.

[0013] The third aspect of the present invention provides a chip mounter, characterized in that it comprises: A platform (10), a support (20), and one or more patch mounters (30); The chip mounter (30) is provided with a feed port (31); a discharge port (32) is provided below the chip mounter (30); the feed port (31) is used to obtain electronic components, and the discharge port (32) is used to release electronic components; The support (20) is connected to the platform (10); the support (20) is connected to the patch mounter (30); The support (20) is used to support the chip mounter (30) so that the chip mounter (30) is suspended at a predetermined position above the platform (10), and the discharge port (32) is vertically aligned with a chip mounting position, wherein the chip mounting position refers to a chip mounting position of a PCB board placed on the platform (10) during chip mounting; The chip mounter (30) is used to release an electronic component when performing a chip mounting operation, so that the electronic component falls from the discharge port (32) and lands on the chip mounting position.

[0014] Furthermore, the chip mounter is characterized by further comprising: The patch mounter (30) is the patch mounter described in the second aspect of the present invention.

[0015] Furthermore, the chip mounter is characterized by further comprising: The plug board (37); when the chip mounter is provided with a plurality of chip mounters, the plurality of chip mounters share one plug board (37).

[0016] Furthermore, the chip mounter is characterized by further comprising: The platform (10) is provided with a positioning device (11) so as to limit the PCB board to a predetermined position.

[0017] A fourth aspect of the present invention provides a chip mounter, characterized in that it comprises: The component packaging tube as described in the first aspect of the present invention and the chip mounter as described in the third aspect of the present invention; the chip mounter is installed with the chip mounter as described in the second aspect of the present invention; the component packaging tube is inserted into the feed port or insertion chamber of the chip mounter.

[0018] It can be seen from the above technical solution that the present application has at least one of the following beneficial effects: 1. The SMT machine provided by the present application has a simple structure, no expensive components, low cost and low maintenance cost; it is easy to operate, easy to use and has low cost of use; it has almost no wearing parts and is long-lasting and durable; 2. When the chip mounter provided by the present application is equipped with multiple chip mounters, multiple chip mounters can mount chips at the same time, so the chip mounting speed is fast and the efficiency is high. The production speed can even exceed that of traditional high-speed chip mounters, so it can meet the requirements of large-scale production; 3. The chip mounter provided by the present application supplies materials vertically, the chip mount head is fixed, and multiple components can be mounted simultaneously; it is completely different from the traditional chip mounter structure, and its design concept overcomes the technical prejudice of those skilled in the art and creates a new chip mounter technical solution; 4. Compared with the traditional chip mounter, the chip mounter provided by the present application does not require a high-speed mobile chip mounter head, so it is more power-saving and conducive to energy conservation and emission reduction; 5. The component packaging tube provided in the present application does not need to place the electronic components one by one on the braid, but only needs to put the electronic components into the tube in order, so the packaging is convenient and fast, and the packaging cost is low; and the component packaging tube can be reused, which is beneficial to environmental protection and cost saving. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Obviously, the drawings described below are only some embodiments of the present invention, and those skilled in the art can obtain other drawings based on these drawings without creative work. Figure 1 A schematic structural diagram of a component packaging tube provided in the first aspect of the present invention; Figure 2 A schematic diagram of the front structure of a patch mounter proposed in the second aspect of the present invention; Figure 3 A schematic diagram of the side structure of a patch mounter proposed in the second aspect of the present invention; Figure 4 A cross-sectional view of a patch mounter according to the second aspect of the present invention; Figure 5 A cross-sectional view of a patch mounter according to the second aspect of the present invention; Figure 6 A cross-sectional view of the working process of a patch mounter proposed in the second aspect of the present invention; Figure 7 A cross-sectional view of the working process of a patch mounter proposed in the second aspect of the present invention; Figure 8 A cross-sectional view of the working process of a patch mounter proposed in the second aspect of the present invention; Fig. 9 A schematic front view of the structure of a chip mounter according to the third aspect of the present invention; Fig.10 A schematic side view of the structure of a chip mounter according to the third aspect of the present invention; Fig.11 A schematic diagram of a top view of a chip mounter according to a third aspect of the present invention; Fig.12 A schematic structural diagram of a chip mounter provided by the third aspect of the present invention when a plug-in board is installed; Fig.13 A schematic structural diagram of a chip mounter provided in the third aspect of the present invention when multiple chip mounters are installed; Fig.14 A schematic structural diagram of a chip mounter proposed in the fourth aspect of the present invention; Among them, the figure marks in the figure are: 50-component packaging tube; 51-pin; 52-plug-in area; 53-opening; 54-storage area; 10-platform; 11-positioning device; 20-support; 30-mounter; 31-feeding port; 32-discharging port; 33-plug-in chamber; 34-storage chamber; 35-release chamber; 36-plug-in board gap; 37-plug-in board; 38-channel; 80-first electronic component 81-second electronic component. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0021] The first aspect of the present invention provides a component packaging tube that can be installed on a chip mounter, characterized in that it includes: The upper end of the component packaging tube (50) is a storage area (54), and the lower end is a plug-in area (52); A detachable latch (51) is inserted between the storage area (54) and the insertion area (52); An opening (53) is provided below the plug-in area (52), so that when the opening (53) faces downward, the latch (51) is pulled out and the electronic components stored in the storage area (54) fall out of the opening (53).

[0022] The component packaging tube is used to store electronic components and is a packaging material for electronic components; the latch (51) is used to block the electronic components stored in the storage area (54) so ​​that they do not fall out of the opening (53); Method of use: insert the plug-in area (52) of the component packaging tube (50) into the feed port of the placement machine, then pull out the plug (51), at which time, due to the effect of gravity, the electronic components flow out from the opening (53) and then flow into the placement machine, thereby supplying the placement machine with electronic components for placement.

[0023] A second aspect of the present invention provides a chip mounter, which is applied to a chip mounter and is characterized by comprising: The chip mounter (30) is provided with a feed port (31); a discharge port (32) is provided below the chip mounter (30); the feed port (31) is used to obtain electronic components, and the discharge port (32) is used to release electronic components; The patch mounter (30) is provided with a storage chamber (34) and a release chamber (35) inside; The storage chamber (34) is in communication with the feed port (31), so that the electronic components can enter the storage chamber (34) from the feed port (31); The discharge port (32) is arranged below the release chamber (35), and the release chamber (35) is in communication with the discharge port (32), so that the electronic components in the release chamber (35) can fall out of the discharge port (32); The storage chamber (34) and the release chamber (35) are in communication, so that the electronic component in the storage chamber (34) can be pushed into the release chamber (35); The storage chamber (34) is provided with an insertion plate gap (36), so that when an insertion plate (37) is inserted into the insertion plate gap (36), the insertion plate (37) pushes an electronic component in the storage chamber (34) into the release chamber (35).

[0024] Furthermore, the above-mentioned chip mounter is applied to a chip mounter, and is characterized in that it also includes: The feed inlet (31) is arranged above the chip mounter (30), and the storage chamber (34) is arranged below the feed inlet (31), so that electronic components can enter the storage chamber (34) from the feed inlet (31) under the action of gravity.

[0025] Furthermore, the above-mentioned chip mounter is applied to a chip mounter, and is characterized in that it also includes: An insertion chamber (33) is provided in the feed port (31) of the patch mounter (30).

[0026] The plug-in chamber (33) is used to plug in the component packaging tube as described in the first aspect of the present invention, and is connected in a plug-in manner, which facilitates rapid installation and removal, thereby facilitating rapid replacement of the component packaging tube.

[0027] Furthermore, the above-mentioned chip mounter is applied to a chip mounter, and is characterized in that it also includes: The storage chamber (34) and the release chamber (35) are connected via a channel (38), and a height H of the channel (38) is not greater than the height of two electronic components, so that when the plug board (37) is inserted into the plug board gap (36), the plug board (37) can only push one electronic component into the release chamber (35).

[0028] The following is a detailed example to introduce the working principle and working process of the patch device (30) according to the second aspect of the present invention. Please refer to Figure 6-Figure 8 : First, a first electronic component (80) and a second electronic component (81) are placed from the feed port. Due to gravity, the first electronic component (80) falls into the storage chamber, and the second electronic component (81) is stacked on top of the first electronic component (80). Figure 6 As shown; Then, the patch operation is performed: the plug board (37) is inserted into the plug board gap. At this time, the first electronic component (80) originally in the storage chamber is pushed into the release chamber by the plug board (37). Figure 7 As shown; Then, due to the effect of gravity, the first electronic component (80) in the release chamber falls downward, falls out of the discharge port (32), and falls on the patch position of the PCB board placed on the platform, and the patch operation is now completed; Next, the plug board (37) is removed, and then due to the effect of gravity, the second electronic component (81) falls into the storage chamber and waits to be pushed into the release chamber when the next patch operation is performed. Figure 8 As shown; As an example, the first electronic component (80) and the second electronic component (81) are an integrally formed square chip inductor.

[0029] The chip mounter (30) can be applied to the chip mounter described in the third aspect of the present invention. Therefore, the structure, function, working principle, working process, etc. of the chip mounter (30) can be further understood by referring to the chip mounter described in the third aspect of the present invention.

[0030] The third aspect of the present invention provides a chip mounter, characterized in that it comprises: A platform (10), a support (20), and one or more patch mounters (30); The chip mounter (30) is provided with a feed port (31); a discharge port (32) is provided below the chip mounter (30); the feed port (31) is used to obtain electronic components, and the discharge port (32) is used to release electronic components; The support (20) is connected to the platform (10); the support (20) is connected to the patch mounter (30); The support (20) is used to support the chip mounter (30) so that the chip mounter (30) is suspended at a predetermined position above the platform (10), and the discharge port (32) is vertically aligned with a chip mounting position, wherein the chip mounting position refers to a chip mounting position of a PCB board placed on the platform (10) during chip mounting; The chip mounter (30) is used to release an electronic component when performing a chip mounting operation, so that the electronic component falls from the discharge port (32) and lands on the chip mounting position.

[0031] The electronic component enters the chip mounter (30) through the feed port (31), and when the chip mounting operation is performed, the electronic component is released from the discharge port (32) of the chip mounter (30) and falls on the chip mounting position of the PCB board. When there are multiple chip mounting components on the PCB board that need to be mounted, multiple chip mounters (30) can be installed on the same chip mounter, so that the mounting of multiple electronic components can be completed at one time, thereby improving the mounting speed.

[0032] Furthermore, the chip mounter is characterized by further comprising: The patch mounter (30) is the patch mounter described in the second aspect of the present invention.

[0033] Furthermore, the chip mounter is characterized by further comprising: The plug board (37); when the chip mounter is provided with a plurality of chip mounters, the plurality of chip mounters share one plug board (37) such as Fig.13 shown.

[0034] Since each patch device has a plug-in board, when there are multiple patch devices, the workload of plugging and unplugging the plug-in boards is very large; therefore, when multiple patch devices share one plug-in board, the plug-ins of multiple patch devices can be inserted and removed at one time, thereby improving efficiency and facilitating large-scale production. The plug-in board (37) can be an ordinary plastic plate, iron plate or stainless steel plate. Users can completely make the plug-in board (37) by themselves, so it is not necessary to provide it to customers.

[0035] Furthermore, the chip mounter is characterized by further comprising: The platform (10) is provided with a positioning device (11) so as to limit the PCB board at a predetermined position, thereby facilitating rapid alignment of the discharge port (32) with the patch position of the PCB board placed on the platform (10) during patch placement.

[0036] A fourth aspect of the present invention provides a chip mounter, characterized in that it comprises: The component packaging tube as described in the first aspect of the present invention and the placement machine as described in the third aspect of the present invention; the placement machine is equipped with the placement device as described in the second aspect of the present invention; the component packaging tube is inserted into the feed port or insertion chamber of the placement device, at this time, the component packaging tube becomes a part of the equipment and can be replaced.

[0037] The following is a detailed description of the method for using the chip mounter proposed by the present invention, the steps are as follows: 1. Using the component packaging tube described in the first aspect of the present invention to package electronic components, then inserting the insertion area (52) of the component packaging tube storing the electronic components into the insertion chamber (33) of the chip mounter (30) of the chip mounter, then pulling out the latch (51) of the component packaging tube, so that the electronic components in the component packaging tube flow into the chip mounter (30) under the action of gravity, and thus completing the loading (loading electronic component materials) operation; 2. Placing the PCB printed with solder paste on the platform and limiting it to a predetermined position by a positioning device (11), so that the discharge port of the mounter is vertically aligned with the placement position on the PCB; 3. Insert the plug board into the plug board gap of the mounter. At this time, an electronic component falls from the discharge port of the mounter and lands on the patch position on the PCB board, and then is adhered to the patch position by solder paste. At this point, the patch is completed; for the detailed working process of the mounter, please refer to the above introduction; 4. Remove the board from the board gap, take away the PCB board that has been patched, and then return to step 2; when the electronic components in the component packaging tube are used up, pull out the component packaging tube, replace it with a new component packaging tube (the new component packaging contains electronic components), and then continue the patch work; Empty component packaging tubes can be refilled with electronic components and reused.

[0038] The above-mentioned embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the present invention. It should be pointed out that for ordinary technicians in this field, improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention.

Claims

1. A component packaging tube that can be installed on a chip mounter, characterized in that: include: The upper end of the component packaging tube (50) is a storage area (54), and the lower end is a plug-in area (52); A detachable latch (51) is inserted between the storage area (54) and the insertion area (52); An opening (53) is provided below the plug-in area (52), so that when the opening (53) faces downward, the latch (51) is pulled out and the electronic components stored in the storage area (54) fall out of the opening (53).

2. A chip mounter, used in a chip mounter, characterized in that: include: The chip mounter (30) is provided with a feed port (31); a discharge port (32) is provided below the chip mounter (30); the feed port (31) is used to obtain electronic components, and the discharge port (32) is used to release electronic components; The patch mounter (30) is provided with a storage chamber (34) and a release chamber (35) inside; The storage chamber (34) is in communication with the feed port (31), so that the electronic components can enter the storage chamber (34) from the feed port (31); The discharge port (32) is arranged below the release chamber (35), and the release chamber (35) is in communication with the discharge port (32), so that the electronic components in the release chamber (35) can fall out of the discharge port (32); The storage chamber (34) and the release chamber (35) are in communication, so that the electronic component in the storage chamber (34) can be pushed into the release chamber (35); The storage chamber (34) is provided with an insertion plate gap (36), so that when an insertion plate (37) is inserted into the insertion plate gap (36), the insertion plate (37) pushes an electronic component in the storage chamber (34) into the release chamber (35).

3. A chip mounter as claimed in claim 2, applied to a chip mounter, characterized in that: Also includes: The feed inlet (31) is arranged above the chip mounter (30), and the storage chamber (34) is arranged below the feed inlet (31), so that electronic components can enter the storage chamber (34) from the feed inlet (31) under the action of gravity.

4. A chip mounter as claimed in claim 2 or 3, applied to a chip mounter, characterized in that: Also includes: An insertion chamber (33) is provided in the feed port (31) of the patch mounter (30).

5. A chip mounter as claimed in claim 2 or 3, applied to a chip mounter, characterized in that: Also includes: The storage chamber (34) and the release chamber (35) are connected via a channel (38), and a height H of the channel (38) is no greater than the height of the two electronic components.

6. A chip mounter, characterized in that: include: A platform (10), a support (20), and one or more patch mounters (30); The chip mounter (30) is provided with a feed port (31); a discharge port (32) is provided below the chip mounter (30); the feed port (31) is used to obtain electronic components, and the discharge port (32) is used to release electronic components; The support (20) is connected to the platform (10); the support (20) is connected to the patch mounter (30); The support (20) is used to support the chip mounter (30) so that the chip mounter (30) is suspended at a predetermined position above the platform (10), and the discharge port (32) is vertically aligned with a chip mounting position, wherein the chip mounting position refers to a chip mounting position of a PCB board placed on the platform (10) during chip mounting; The chip mounter (30) is used to release an electronic component when performing a chip mounting operation, so that the electronic component falls from the discharge port (32) and lands on the chip mounting position.

7. A chip mounter as claimed in claim 6, characterized in that: Also includes: The patch mounter (30) is the patch mounter according to any one of claims 2 to 5.

8. A chip mounter as claimed in claim 6, characterized in that: Also includes: The plug board (37); when the chip mounter is provided with a plurality of chip mounters, the plurality of chip mounters share one plug board (37).

9. A chip mounter according to any one of claims 6 to 8, characterized in that: Also includes: The platform (10) is provided with a positioning device (11) so as to limit the PCB board to a predetermined position.

10. A chip mounter, characterized in that: include: The component packaging tube according to claim 1, and the placement machine according to any one of claims 6 to 9; The chip mounter is installed with the chip mounter as described in any one of claims 2 to 5; the component packaging tube is inserted into the feed port or the insertion chamber of the chip mounter.

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