Manufacturing method of light-emitting device, jig and light-emitting device

Abstract

The invention relates to the technical field of semiconductor light emitting, and discloses a manufacturing method of a light-emitting device, a jig and the light-emitting device. The manufacturing method comprises the following steps: S1, fixing the light-emitting chip in the bracket; and S2, in the bracket, covering the outer side of the light-emitting chip with a jig, wherein the outer side surface of the jig is provided with an inclined surface which forms a certain angle with the front surface of the light-emitting chip. And S3, filling high-reflection glue between the bracket and the jig, and after curing and forming, surrounding the periphery of the light-emitting chip by a high-reflection glue layer at intervals. And S4, filling the front surface of the light-emitting chip and a gap between the side surface of the light-emitting chip and the high-reflection glue layer with light-transmitting glue, and after the light-transmitting glue is cured, forming a reflection surface on an interface between the first light-transmitting glue layer and the high-reflection glue layer. The light-emitting device manufactured by the manufacturing method realizes front-side light emission and can reflect side light to the front side, light energy is fully utilized, and the front-side light emission brightness is improved. The light spot quality of the light-emitting device is ensured by batch forming, and the production cost is low.

Description

Technical Field

[0001] The present invention belongs to the field of semiconductor light emitting technology, and in particular, relates to a method for manufacturing a light emitting device, a fixture and a light emitting device thereof. Background Art

[0002] In order to realize the special optical function of the light-emitting device, a transparent adhesive layer or a fluorescent adhesive layer needs to be coated on the surface of the light-emitting chip. At present, the coating process mainly uses electrophoresis, spraying, sputtering and other methods to achieve good results. However, due to the complex process, expensive equipment and serious material waste, the process cost is too high and it is not suitable for low-cost mass production.

[0003] The existing technology realizes this by using a bowl-cup structure bracket to carry the fluorescent glue, which can achieve low-cost mass production under the limitation of the bowl-cup structure. Fig.12 The light-emitting device of the prior art includes a bracket 1, a light-emitting chip 2 arranged in the bracket 1, the front and side of the light-emitting chip 2 are covered with a first light-transmitting adhesive layer 5, and the outer periphery of the side of the first light-transmitting adhesive layer 5 is surrounded by a high-reflective adhesive layer 4. The first light-transmitting adhesive layer 5 can be set as a fluorescent adhesive layer. Due to the existence of the high-reflective adhesive layer 4, the side light of the light-emitting chip 2 will be reflected back into the first light-transmitting adhesive layer 5, so that the front light of the light-emitting chip 2 is realized. However, there is a problem that the interface between the first light-transmitting adhesive layer 5 and the high-reflective adhesive layer 4 is a vertical plane. When the light emitted from the side of the light-emitting chip 2 is incident on the high-reflective adhesive layer 4, it returns to the side of the light-emitting chip 2. The emitted light from the side of the light-emitting chip 2 propagates back and forth between the first light-transmitting adhesive layer 5 and the high-reflective adhesive layer 4. After several round trips, the light is absorbed by the material itself. The light from the side of the light-emitting chip 2 can reach very little of the front light, and the light energy utilization rate is low.

[0004] Based on the above, the problem to be solved at present is: to provide a light-emitting device with front light emission, high light energy utilization rate, high and stable light spot quality, and low mass production cost, as well as a method and a fixture for manufacturing the light-emitting device. Summary of the invention

[0005] The purpose of the present invention is to provide a method for manufacturing a light-emitting device, a fixture and a light-emitting device thereof, aiming to solve the problems in the prior art that the light-emitting device has low light energy utilization, unstable light spot quality, complex manufacturing method, high batch manufacturing cost and complex fixture structure.

[0006] The present invention is implemented in this way: a method for manufacturing a light emitting device comprises the following steps:

[0007] Step S1, fixing the light emitting chip in the bracket;

[0008] Step S2, a jig is provided inside the bracket and on the outer side of the light-emitting chip, a cavity structure for covering the front and side surfaces of the light-emitting chip is provided inside the jig, an inclined surface is provided on the outer side surface of the jig at a certain angle to the front surface of the light-emitting chip, and a cross section of the inclined surface decreases along the front surface of the light-emitting chip toward the bottom surface of the light-emitting chip;

[0009] Step S3, filling a high-reflective adhesive between the bracket and the fixture, and removing the fixture after curing. The light-emitting chip is surrounded by a high-reflective adhesive layer;

[0010] Step S4, filling the front of the light-emitting chip and the gap between the side of the light-emitting chip and the high-reflective adhesive layer with light-transmitting adhesive. After the light-transmitting adhesive is cured, a first light-transmitting adhesive layer is formed on the front and side of the light-emitting chip, and a reflective surface is formed at the interface between the first light-transmitting adhesive layer and the high-reflective adhesive layer.

[0011] Furthermore, the following steps are included between step S1 and step S2: a second light-transmitting adhesive layer is provided on the periphery of the light-emitting chip and on the bracket; in step S2, a fixture is provided inside the bracket, on the outside of the light-emitting chip, and on the second light-transmitting adhesive layer.

[0012] Furthermore, in the step S4, the light-transmitting glue is filled by natural leveling through direct dispensing, or is filled by injection molding.

[0013] Furthermore, in step S4, the light-transmitting glue is filled by injection molding; the light-transmitting glue is first arranged on the front side of the light-emitting chip or on the front side and side of the light-emitting chip, and then pressed into shape by a pressing mold. After the light-transmitting glue is cured, the pressing mold is removed.

[0014] Furthermore, in the step S4, the light-transmitting glue is filled by injection molding; the light-transmitting glue is first distributed correspondingly on the pressing surfaces of the pressing mold, and then pressed into shape by the pressing mold. After the light-transmitting glue is cured, the pressing mold is removed.

[0015] Furthermore, the first light-transmitting adhesive layer (5) in step S4 is a light-transmitting medium at least comprising fluorescent powder.

[0016] A light emitting device, comprising:

[0017] The bracket is in the shape of a bowl;

[0018] A light-emitting chip is disposed in the bracket;

[0019] A first light-transmitting adhesive layer, which covers the front and side surfaces of the light-emitting chip;

[0020] A high-reflective adhesive layer, which is arranged on the outer periphery of the first light-transmitting adhesive layer and inside the bracket;

[0021] The interface between the first light-transmitting adhesive layer and the high-reflective adhesive layer is configured as a reflective surface that is at a certain angle to the front surface of the light-emitting chip, and the reflective surface is used to reflect the emitted light from the side of the light-emitting chip to the front surface.

[0022] Furthermore, a second light-transmitting adhesive layer for protecting the bracket is provided on the side surface of the light-emitting chip, the bottom surface of the first light-transmitting adhesive layer, and the bracket.

[0023] Furthermore, a cross section of the reflective surface decreases along the front surface of the light emitting chip toward the bottom surface of the light emitting chip.

[0024] Furthermore, the first light-transmitting adhesive layer is configured as a light-transmitting medium including at least fluorescent powder.

[0025] Furthermore, the front side of the first light-transmitting adhesive layer is a flat surface or a slightly curved surface.

[0026] Furthermore, the reflecting surface is set to be a flat surface or a curved surface.

[0027] A fixture for a light emitting device comprises a cavity structure with an opening on one side, an inclined surface arranged on the periphery of the cavity structure and a bonding surface connected to the inclined surface; the cross section of the inclined surface gradually increases along the side away from the opening of the cavity structure.

[0028] Furthermore, the cavity structure is configured as a cube or a rectangular solid.

[0029] Furthermore, the inclined surface is set to be a plane or a curved surface.

[0030] Furthermore, the joint surface is set to be a plane.

[0031] Compared with the prior art, the optical device manufacturing method, fixture and light-emitting device provided by the present invention have the following beneficial effects:

[0032] Reference Figure 10-11 The manufacturing method of the present invention can form a reflective surface 41 at a certain angle to the front surface of the light-emitting chip 2 on the outer side of the light-emitting chip 2 in batches. Compared with the prior art, the reflective surface 41 is Fig.12 The reflective surface 41 can reflect the emitted light from the side of the light-emitting chip 2 to the front light of the light-emitting chip 2, making full use of the side light, further improving the brightness of the front light, and improving the utilization rate of light energy. When the first light-transmitting adhesive layer 5 is molded, the shape of the front of the first light-transmitting adhesive layer 5 can be set as needed, and the problem of yellowing of the edge after blue light excitation can be solved by optimizing the surface shape. At the same time, batch molding is performed, and the shape of the first light-transmitting adhesive layer 5 is stable and consistent.

[0033] The fixture 3 of the present invention can easily form a stable reflection surface 41 between the light-transmitting adhesive layer 5 and the high-reflection adhesive layer 4. The angle between the inclined surface 32 of the fixture 3 and the front surface of the light-emitting chip 2 can be set as needed to ensure that the side light of the light-emitting chip 2 is fully reflected to the front surface. The fixture 3 has a simple and reasonable structure and is easy to operate and manufacture.

[0034] The light-emitting device of the present invention can emit light from the front side, and can make full use of the light from the side of the light-emitting chip 2, further improve the brightness of the light emitted from the front side, and greatly improve the utilization rate of light energy. At the same time, the light spot quality of the light-emitting device of the present invention is high and the production cost is low. The first light-transmitting adhesive layer 5 can be set to a light-transmitting medium containing at least phosphor, which can improve the excitation efficiency of blue light on the side of the light-emitting chip 2. The front side of the first light-transmitting adhesive layer 5 is set to a flat surface or a micro-arc surface. By optimizing the surface shape of the first light-transmitting adhesive layer 5, the problem of yellowing of the edge after blue light excitation can be solved. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 It is a schematic diagram of a state after the step S1 of the method for manufacturing a light-emitting device provided by the present invention is implemented;

[0036] Figure 2 is another schematic diagram of a state after the step S1 of the method for manufacturing a light-emitting device provided by the present invention is implemented;

[0037] Figure 3 is a schematic diagram of the state after the step S2 of the method for manufacturing the light emitting device provided by the present invention is implemented;

[0038] Figure 4 is another schematic diagram of a state after step S2 of the method for manufacturing a light-emitting device provided by the present invention is implemented;

[0039] Figure 5 It is a schematic diagram of the state of filling high-reflective glue between the bracket and the fixture in step S3 of the method for manufacturing the light-emitting device provided by the present invention;

[0040] Figure 6 is a schematic diagram of the state after the step S3 of the method for manufacturing the light emitting device provided by the present invention is implemented;

[0041] Figure 7 It is a schematic diagram of the state in which the light-transmitting glue is arranged on the front and side surfaces of the light-emitting chip in step S4 of the method for manufacturing the light-emitting device provided by the present invention;

[0042] Figure 8 It is a schematic diagram of the state of the light-transmitting glue corresponding to the pressing surface of the pressing mold in step S4 of the method for manufacturing the light-emitting device provided by the present invention;

[0043] Fig. 9It is a schematic diagram of the state of the pressing and molding of the pressing mold in step S4 of the method for manufacturing the light-emitting device provided by the present invention;

[0044] Fig.10 is a schematic diagram of the cross-sectional structure of the light-emitting device provided by the present invention;

[0045] Fig.11 is a schematic cross-sectional structure diagram of another light emitting device provided by the present invention;

[0046] Fig.12 It is a schematic diagram of the cross-sectional structure of a light emitting device in the prior art;

[0047] Fig.13 It is a schematic diagram of the cross-sectional structure of a manufacturing jig for a light-emitting device provided by the present invention;

[0048] In the figure: 1- bracket; 2- light-emitting chip; 3- fixture; 31- cavity structure; 32- inclined plane; 33- joint surface; 4- high reflective adhesive layer; 41- reflective surface; 5- first light-transmitting adhesive layer; 6- pressing mold; 7- second light-transmitting adhesive layer. DETAILED DESCRIPTION

[0049] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0050] The implementation of the present invention is described in detail below in conjunction with specific embodiments.

[0051] The same or similar numbers in the drawings of this embodiment correspond to the same or similar parts; in the description of the present invention, it should be understood that if the terms "upper", "lower", "left", "right" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the drawings, it is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and cannot be understood as limitations on this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0052] Reference Figure 1-13 The figure shows a preferred embodiment of the present invention.

[0053] The method for manufacturing a light emitting device of the present invention comprises the following steps:

[0054] Step S1: Fix the light emitting chip 2 in the bowl-shaped bracket 1, referring to Figure 1 .

[0055] Step S2: A fixture 3 is provided on the bracket 1 and on the outer side of the light emitting chip 2. Figure 3 A cavity structure 31 is provided inside the fixture 3 for covering the front and side surfaces of the light-emitting chip 2. An inclined surface 32 is provided on the outer surface of the fixture 3 at a position corresponding to the cavity structure 31, which is at a certain angle to the front surface of the light-emitting chip 2. The cross section of the inclined surface 32 of the fixture 3 gradually decreases from the front surface of the light-emitting chip 2 to the bottom surface of the light-emitting chip 2.

[0056] Step S3: Fill the space between the bracket 1 and the fixture 3 with highly reflective glue, refer to Figure 5 After curing, the fixture 3 is removed, and the light-emitting chip 2 is surrounded by the high-reflective adhesive layer 4. Figure 6 .

[0057] Step S4: Fill the front of the light emitting chip 2 and the gap between the side of the light emitting chip 2 and the high reflective adhesive layer 4 with a light-transmitting adhesive. After the light-transmitting adhesive is cured, a first light-transmitting adhesive layer 5 is formed on the front and side of the light emitting chip 2, and a reflective surface 41 is formed at the interface between the first light-transmitting adhesive layer 5 and the high reflective adhesive layer 4. Figure 10-11 .

[0058] The front and side surfaces of the light-emitting chip 2 of the light-emitting device of the present invention are covered by the first light-transmitting adhesive layer 5, and the interface between the high-reflective adhesive layer 4 and the first light-transmitting adhesive layer 5 is set as a reflecting surface 41 that is at a certain angle to the front surface of the light-emitting chip 2, so that the light emitted from the side surface of the light-emitting chip 2 is incident on the reflecting surface 41 and then reflected and emitted from the front surface of the light-emitting chip 2, thereby changing the emission angle of the side light and greatly improving the utilization rate of light energy.

[0059] By adopting the manufacturing method of the present invention, a reflective surface 41 at a certain angle to the front of the light-emitting chip 2 can be formed in batches on the side of the light-emitting chip 2, which can reflect the side light to the front light, thereby improving the brightness of the front light of the light-emitting chip 2 and improving the utilization rate of light energy. The first light-transmitting adhesive layer 5 can be set to a light-transmitting medium containing at least phosphor, which can improve the excitation efficiency of blue light on the side of the light-emitting chip 2. When the first light-transmitting adhesive layer 5 is molded, the shape of the front of the first light-transmitting adhesive layer 5 can be set as needed, and the problem of yellowing of the edge after blue light excitation can be solved by optimizing the surface shape. At the same time, by batch molding, the first light-transmitting adhesive layer 5 has a stable shape and good consistency.

[0060] In order to prevent the fixture 3 from being placed directly on the bracket 1 to form an indentation on the substrate, which may affect the performance of the light-emitting device, the optimization steps are as follows:

[0061] Step S1: First, fix the light emitting chip 2 in the bowl-shaped bracket 1. Figure 2 Then, a second light-transmitting adhesive layer 7 is provided on the periphery of the light-emitting chip 2 and the bracket 1 .

[0062] Step S2: A fixture 3 is provided inside the bracket 1, outside the light emitting chip 2, and on the second light-transmitting adhesive layer 7, referring to Figure 4 The outer surface of the fixture 3 is provided with an inclined surface 32 at a certain angle to the front surface of the light emitting chip 2 at a position corresponding to the cavity structure 31. The cross section of the inclined surface 32 of the fixture 3 gradually decreases from the front surface of the light emitting chip 2 to the bottom surface of the light emitting chip 2.

[0063] Step 3 and step 4 are consistent with the above description.

[0064] The second light-transmitting adhesive layer 7 is disposed between the substrate of the bracket 1 and the fixture 3 , and the fixture 3 is directly placed on the second light-transmitting adhesive layer 7 . The second light-transmitting adhesive layer 7 plays a role in buffering and protecting the bracket 1 .

[0065] The light-transmitting glue filling method in step S4 is optimized, and the light-transmitting glue is filled by direct dispensing and natural leveling, or by injection molding. There are two specific implementation methods for light-transmitting glue injection molding:

[0066] 1. First, place the light-transmitting glue on the front of the light-emitting chip 2 or on the front and side of the light-emitting chip 2, and then press and mold it with a pressing mold 6, referring to Figure 7 and Fig. 9 After the light-transmitting adhesive is cured, the pressing mold 6 is removed. A first light-transmitting adhesive layer 5 is formed on the front and side surfaces of the light-emitting chip 2 , and a reflective surface 41 is formed at the interface between the first light-transmitting adhesive layer 5 and the high-reflective adhesive layer 4 .

[0067] 2. First, distribute the light-transmitting glue on the pressing surface of the pressing mold 6, and then press the pressing mold 6 into shape, referring to Figure 8 and Fig. 9 After the light-transmitting adhesive is cured, the pressing mold 6 is removed. A first light-transmitting adhesive layer 5 is formed on the front and side surfaces of the light-emitting chip 2, and a reflective surface 41 is formed at the interface between the first light-transmitting adhesive layer 5 and the high-reflective adhesive layer 4. The light-transmitting adhesive is preferably distributed on the pressing surface of the pressing mold 6 by printing, dotting or spraying.

[0068] A fixture for making a light emitting device 3, referring to Figure 3 Figure 4 Figure 5 and Fig.13, including a cavity structure 31 with an opening on one side, a bevel 32 arranged on the periphery of the cavity structure 31, and a joint surface 33 connected to the bevel 32. The cavity structure 31 is used to accommodate the light-emitting chip 2. The shape of the cavity structure 31 is set according to the shape of the light-emitting chip 2, preferably a cube or a rectangular cube. The bevel 32 is used to form a reflective surface 41 on the side of the light-emitting chip 2. The bevels 32 around the fixture 3 are in an inverted cone shape, and the cross-section of the bevel 32 gradually increases along the opening side away from the cavity structure 31. The joint surface 33 is arranged above the bevel 32, away from the opening side of the cavity structure 31, and is used to work with the bevel 32 to form a reflective surface 41. The joint surface 33 is preferably a plane. The bevel 32 can be set as a plane or a curved surface. The fixture 3 of the present invention can form a reflective surface 41 on the side of the light-emitting chip 2 in batches, which can improve the brightness of the light emitted from the front of the light-emitting chip 2 and improve the utilization rate of light energy. The fixture 3 has a simple and reasonable structure and is easy to manufacture.

[0069] The light emitting device formed by the above-mentioned manufacturing method comprises: a bowl-shaped bracket 1 and a light emitting chip 2 arranged in the bracket 1. Fig.10 , the light-emitting chip 2 is arranged on the bottom surface of the bracket 1, and the electrode of the light-emitting chip 2 is arranged on the bottom surface of the light-emitting chip 2. The front and surrounding sides of the light-emitting chip 2 are covered with a first light-transmitting adhesive layer 5. The outer periphery of the first light-transmitting adhesive layer 5 and the interior of the bracket 1 are provided with a high-reflection adhesive layer 4 with a reflective effect. The high-reflection adhesive layer 4 is preferably a high-reflection white adhesive layer. The interface between the first light-transmitting adhesive layer 5 and the high-reflection adhesive layer 4 is set to a reflective surface 41 at a certain angle to the front of the light-emitting chip 2, and the reflective surface 41 is used to reflect the emitted light from the side of the light-emitting chip 2 to the front light. The cross-section of the reflective surface 41 decreases along the front of the light-emitting chip 2 toward the bottom of the light-emitting chip 2. The reflective surface 41 is preferably a plane or a curved surface. The light-emitting device of the present invention realizes front light emission, and can make full use of the light from the side of the light-emitting chip 2, further improve the brightness of the front light emission, and greatly improve the light energy utilization rate. Further, the first light-transmitting adhesive layer 5 preferably includes at least a light-transmitting medium of phosphor. The front of the first light-transmitting adhesive layer 5 is preferably a plane or a micro-arc surface. The yellowing problem of the edge of the blue light chip after activation can be solved by optimizing the surface shape of the first light-transmitting adhesive layer 5.

[0070] Further optimize the structure of the light emitting device, refer to Fig.11 A second light-transmitting adhesive layer 7 is provided on the side of the light-emitting chip 2, the bottom of the first light-transmitting adhesive layer 5, and the bracket 1. The second light-transmitting adhesive layer 7 is used to protect the substrate of the bracket 1.

[0071] The present invention is not limited thereto; any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims

1. A method for manufacturing a light emitting device, characterized in that: The steps include: Step S1, fixing the light-emitting chip (2) in the bracket (1); Step S2, a jig (3) is provided inside the bracket (1) and on the outer side of the light-emitting chip (2), a cavity structure (31) for covering the front and side surfaces of the light-emitting chip (2) is provided inside the jig (3), an inclined surface (32) which is at a certain angle to the front surface of the light-emitting chip (2) is provided on the outer side surface of the jig (3), and the cross section of the inclined surface (32) decreases along the front surface of the light-emitting chip (2) towards the bottom surface of the light-emitting chip (2); Step S3, filling a high-reflective adhesive between the support (1) and the jig (3), and after curing and forming, removing the jig (3), so that the four sides of the light-emitting chip (2) are surrounded by the high-reflective adhesive layer (4); Step S4, filling the front surface of the light-emitting chip (2) and the gap between the side surface of the light-emitting chip (2) and the high-reflective adhesive layer (4) with a light-transmitting adhesive. After the light-transmitting adhesive is cured, a first light-transmitting adhesive layer (5) is formed on the front surface and side surface of the light-emitting chip (2), and a reflective surface (41) is formed at the interface between the first light-transmitting adhesive layer (5) and the high-reflective adhesive layer (4).

2. The method according to claim 1, characterized in that: The following steps are also included between step S1 and step S2: a second light-transmitting adhesive layer (7) is provided on the outer periphery of the light-emitting chip (2) and on the bracket (1); in step S2, a fixture (3) is provided inside the bracket (1), on the outer side of the light-emitting chip (2) and on the second light-transmitting adhesive layer (7).

3. The method according to claim 1, characterized in that: In the step S4, the light-transmitting glue is filled by direct dispensing to allow natural leveling, or is filled by injection molding.

4. The method according to claim 3, characterized in that: In the step S4, the light-transmitting adhesive is filled by injection molding; the light-transmitting adhesive is first arranged on the front surface of the light-emitting chip (2) or on the front surface and side surface of the light-emitting chip (2), and then pressed into shape by a pressing mold (6); after the light-transmitting adhesive is cured, the pressing mold (6) is removed.

5. The manufacturing method according to claim 3, characterized in that: In the step S4, the light-transmitting adhesive is filled by injection molding; the light-transmitting adhesive is first distributed correspondingly on the pressing surface of the pressing mold (6), and then pressed into shape by the pressing mold (6); after the light-transmitting adhesive is cured, the pressing mold (6) is removed.

6. The method according to claim 1, characterized in that: The first light-transmitting adhesive layer (5) in the step S4 is a light-transmitting medium at least comprising fluorescent powder.

7. A light emitting device, characterized in that: include: A support (1) having a bowl-cup shape; A light-emitting chip (2), which is arranged in the bracket (1); A first light-transmitting adhesive layer (5), which covers the front and side surfaces of the light-emitting chip (2); A high-reflective adhesive layer (4), which is arranged on the outer periphery of the first light-transmitting adhesive layer (5) and inside the bracket (1); The interface between the first light-transmitting adhesive layer (5) and the highly reflective adhesive layer (4) is arranged as a reflective surface (41) which forms a certain angle with the front surface of the light-emitting chip (2), and the reflective surface (41) is used to reflect the light emitted from the side surface of the light-emitting chip (2) to the front surface.

8. The light emitting device according to claim 7, characterized in that: The cross section of the reflective surface (41) tapers along the front surface of the light-emitting chip (2) towards the bottom surface of the light-emitting chip (2).

9. The light emitting device according to claim 7, characterized in that: The front surface of the first light-transmitting adhesive layer (5) is a flat surface or a slightly curved surface.

10. A fixture for a light emitting device, characterized in that: It comprises a cavity structure (31) with an opening on one side, an inclined surface (32) arranged on the periphery of the cavity structure (31), and a joint surface (33) connected to the inclined surface (32); the cross section of the inclined surface (32) gradually increases along the opening side away from the cavity structure (31).

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