Heat dissipation device, vehicle and heat dissipation control method

Abstract

The invention discloses a heat dissipation device, a vehicle and a heat dissipation control method. The heat dissipation device comprises a shell and an air cooling heat dissipation part, the shell comprises a first plate body, an intelligent module close to the first plate body is arranged in the shell, and the air cooling heat dissipation part and the intelligent module are arranged on the same side of the first plate body. A first cavity is formed in the first plate body, the first plate body is located in the multiple liquid cooling loops, and the air cooling heat dissipation part and / or the first plate body are / is used for dissipating heat of the intelligent module. When the scheme is adopted, the heat dissipation device can dissipate heat of the intelligent module through a liquid cooling or air cooling and liquid cooling combined heat dissipation mode, the heat dissipation capacity is high, the heat dissipation effect on the intelligent module can be enhanced, and the heat dissipation requirement of the intelligent module can be met. And the condensation phenomenon of the intelligent module when a liquid cooling heat dissipation mode is adopted for the intelligent module can be avoided by connecting the first plate body into a proper liquid cooling loop, so that the short circuit caused by the condensation phenomenon of the intelligent module can be avoided, and the heat dissipation safety of the intelligent module can be improved.

Description

Heat dissipation device, vehicle, and heat dissipation control method Technical Field

[0001] The present application relates to the field of vehicle technology, and in particular to a heat dissipation device, a vehicle, and a heat dissipation control method. Background Art

[0002] As autonomous driving levels increase, the computing power and power consumption of the system-on-chip (SoC) in onboard intelligent modules are increasing, and the heat dissipation requirements of intelligent modules are also becoming increasingly stringent. Currently, natural cooling or air cooling is commonly used for onboard intelligent modules. However, these two cooling modes have limited heat dissipation capabilities and are less than ideal, making it difficult to meet the heat dissipation requirements of intelligent modules.

[0003] Summary of the Invention

[0004] The present application provides a heat dissipation device, a vehicle, and a heat dissipation control method to improve heat dissipation capability and meet the heat dissipation requirements of an intelligent module.

[0005] In a first aspect, the present application provides a heat dissipation device that may include a housing and an air-cooled heat sink. The housing may include a first plate, and an intelligent module may be disposed within the housing near the first plate. The air-cooled heat sink may be disposed on the same side of the first plate as the intelligent module. The first plate may have a first cavity therein, and the first plate may be positioned within multiple liquid cooling circuits. The first plate may selectively connect to one of the multiple liquid cooling circuits, and the air-cooled heat sink and / or the first plate may dissipate heat from the intelligent module.

[0006] In the technical solution provided by this application, the heat dissipation device includes both an air-cooled heat dissipation portion and multiple liquid-cooling circuits. When the temperature of one of the multiple liquid-cooling circuits meets certain access conditions, the first plate can be connected to this liquid-cooling circuit. The heat dissipation device can use a liquid-cooling heat dissipation mode, an air-cooling heat dissipation mode, or a combined air-cooling and liquid-cooling heat dissipation mode for the intelligent module. When the temperature of all liquid-cooling circuits does not meet certain access conditions, the first plate is not connected to any liquid-cooling circuit, and the heat dissipation device can use an air-cooling heat dissipation mode for the intelligent module. The heat dissipation device can dissipate heat from the intelligent module through liquid cooling or a combined air-cooling and liquid-cooling heat dissipation mode, has strong heat dissipation capabilities, can enhance the heat dissipation effect of the intelligent module, and can meet the heat dissipation requirements of the intelligent module. Furthermore, this application can avoid condensation in the intelligent module when the heat dissipation device uses a liquid-cooling heat dissipation mode for the intelligent module by configuring appropriate access conditions, thereby preventing short circuits in the intelligent module caused by condensation and improving the safety of heat dissipation in the intelligent module.

[0007] In one specific embodiment, the multiple liquid cooling circuits may include a first liquid cooling circuit and a second liquid cooling circuit. The first plate may be connected to the first liquid cooling circuit via a first piping assembly, and the first plate may be connected to the second liquid cooling circuit via a second piping assembly. Connecting the first plate to different liquid cooling circuits via different piping assemblies can improve connection efficiency.

[0008] When specifically configuring the first pipeline assembly, the first pipeline assembly may include a first pipeline and a first control valve, wherein the first control valve facilitates on-off control of the first pipeline. When specifically configuring the second pipeline assembly, the second pipeline assembly may include a second pipeline and a first control valve, or the second pipeline assembly may include a second pipeline and a second control valve, wherein the first control valve or the second control valve facilitates on-off control of the second pipeline.

[0009] In a specific embodiment, a first temperature sensor may be provided on the first liquid cooling circuit to measure the temperature of the first liquid cooling circuit, and a second temperature sensor may be provided on the second liquid cooling circuit to measure the temperature of the second liquid cooling circuit.

[0010] In one specific embodiment, the heat dissipation device may further include a temperature and humidity sensor capable of measuring the temperature and humidity of the environment in which the intelligent module resides. The temperature and humidity sensor may be electrically connected to the intelligent module. The measurement results of the temperature and humidity sensor may be used to determine the dew point temperature of the environment in which the intelligent module resides. The measurement results of the first temperature sensor, the measurement results of the second temperature sensor, and the dew point temperature may be used to determine the liquid cooling circuit connected to the first plate. This ensures that condensation does not form in the intelligent module when the liquid cooling circuit connected to the first plate dissipates heat for the intelligent module.

[0011] In a specific embodiment, a first heat conducting portion may be provided on a side of the first plate facing the smart module, and the smart module may be connected to the first heat conducting portion. The provision of the first heat conducting portion may improve the heat dissipation efficiency of the heat dissipation device.

[0012] In a specific embodiment, the air-cooling heat dissipation unit may be provided with a heating unit, which can heat the airflow generated by the air-cooling heat dissipation unit. The provision of the heating unit can reduce the relative humidity of the environment in which the smart module is located, thereby reducing the risk of condensation on the smart module.

[0013] In a second aspect, the present application provides a vehicle that may include a central control system, a battery cooling system, a motor cooling system, and a heat dissipation device as described in any of the possible implementation schemes of the first aspect. The battery cooling system can dissipate heat from the vehicle's batteries, and the motor cooling system can dissipate heat from the vehicle's motors. The battery cooling system and the motor cooling system can be controlled by the central control system. The first plate of the heat dissipation device can be located in multiple liquid cooling circuits, and the multiple liquid cooling circuits can be connected to the battery cooling system and the motor cooling system respectively, so that the heat dissipation device can use the battery cooling system or the motor cooling system to implement a liquid cooling mode for the intelligent module.

[0014] In a specific embodiment, the multiple liquid cooling circuits may include a first liquid cooling circuit and a second liquid cooling circuit. The first liquid cooling circuit may be connected to the battery cooling system, and the second liquid cooling circuit may be connected to the motor cooling system.

[0015] In a third aspect, the present application provides a heat dissipation control method, which can be applied to a heat dissipation device in any possible implementation of the first aspect or a vehicle in any possible implementation of the second aspect. The method may include:

[0016] acquiring a temperature of a first liquid cooling circuit and a temperature of a second liquid cooling circuit among the plurality of liquid cooling circuits;

[0017] determining whether the temperature of the first liquid cooling circuit meets the connection condition, and when the temperature of the first liquid cooling circuit meets the connection condition, controlling the first plate of the heat dissipation device to connect to the first liquid cooling circuit to dissipate heat to the intelligent module;

[0018] When the temperature of the first liquid cooling circuit does not meet the connection condition, it is determined whether the temperature of the second liquid cooling circuit meets the connection condition. When the temperature of the second liquid cooling circuit meets the connection condition, the first plate is controlled to connect to the second liquid cooling circuit to dissipate heat for the intelligent module.

[0019] When the temperature of the second liquid cooling circuit does not meet the connection condition, the first plate is not connected to the first liquid cooling circuit or the second liquid cooling circuit, and the air cooling heat dissipation part of the heat dissipation device is controlled to be in a working state to dissipate heat to the smart module.

[0020] In the technical solution provided in this application, when the temperature of the first liquid cooling circuit meets the access condition, the first plate of the heat dissipation device can be controlled to connect to the first liquid cooling circuit, in which case a liquid cooling heat dissipation mode can be adopted for the intelligent module. When the temperature of the first liquid cooling circuit does not meet the access condition, but the temperature of the second liquid cooling circuit does meet the access condition, the first plate can be controlled to connect to the second liquid cooling circuit, in which case a liquid cooling heat dissipation mode can also be adopted for the intelligent module. When the temperature of the second liquid cooling circuit also does not meet the access condition, the first plate is not connected to either liquid cooling circuit. In this case, the air cooling heat dissipation unit can be controlled to be in an operating state, in which case an air cooling heat dissipation mode can be adopted for the intelligent module. By selectively controlling the first plate to connect to a liquid cooling circuit, a liquid cooling heat dissipation mode can be adopted for the intelligent module, achieving an ideal heat dissipation effect for the intelligent module and meeting the heat dissipation requirements of the intelligent module. Furthermore, by configuring appropriate access conditions, condensation can be avoided in the intelligent module when the liquid cooling heat dissipation mode is adopted for the intelligent module, thereby preventing short circuits in the intelligent module caused by condensation and improving the safety of the intelligent module's heat dissipation.

[0021] In one specific embodiment, before the first board is connected to the first liquid cooling circuit or the second liquid cooling circuit, the air-cooling heat dissipation unit can be controlled to start. When the temperature of the first liquid cooling circuit meets the connection condition and the first board is connected to the first liquid cooling circuit, or when the temperature of the first liquid cooling circuit does not meet the connection condition and the temperature of the second liquid cooling circuit meets the connection condition and the first board is connected to the second liquid cooling circuit, the operating state of the air-cooling heat dissipation unit can be kept unchanged or controlled to be shut down. When the first board is not connected to the first liquid cooling circuit or the second liquid cooling circuit, the air-cooling heat dissipation unit can be controlled to start, and an air-cooling heat dissipation mode can be adopted for the intelligent module. When the first board is connected to the first liquid cooling circuit or the second liquid cooling circuit, the operating state of the air-cooling heat dissipation unit can be kept unchanged, and a combined liquid-cooling and air-cooling heat dissipation mode can be adopted for the intelligent module. Alternatively, the air-cooling heat dissipation unit can be controlled to be shut down, and only a liquid-cooling heat dissipation mode can be adopted for the intelligent module. In this way, at least an air-cooling heat dissipation mode can be adopted for the intelligent module, providing more reliable heat dissipation for the intelligent module. Furthermore, the intelligent module can be cooled using a combination of liquid and air cooling, or liquid cooling alone, for optimal heat dissipation. Combining liquid cooling with this enhanced heat dissipation strategy can also prevent condensation, which can lead to short circuits and improve heat dissipation safety. Overall, this allows for reliable and safe heat dissipation of the intelligent module.

[0022] In a specific feasible implementation scheme, controlling the air-cooled heat dissipation part of the heat dissipation device to be in a working state includes: when the air-cooled heat dissipation part is in a working state, not changing the working state of the air-cooled heat dissipation part, so that the air-cooled heat dissipation part can maintain the working state; when the air-cooled heat dissipation part is in a closed state, controlling the air-cooled heat dissipation part to start, so that the air-cooled heat dissipation part can change from a closed state to a working state.

[0023] In one specific implementation, the connection condition can be: the temperature of the liquid cooling circuit is greater than or equal to the sum of the dew point temperature of the environment in which the smart module is located and a preset temperature; wherein the preset temperature is greater than or equal to zero. This can prevent condensation in the smart module when liquid cooling is used, avoid short circuits in the smart module caused by condensation, and improve the safety of the smart module's heat dissipation.

[0024] In a specific possible implementation, the heat dissipation control method may further include: acquiring the temperature and humidity of the environment in which the smart module is located, and determining the dew point temperature based on the temperature and humidity.

[0025] In a fourth aspect, the present application provides a heat dissipation control device, which includes: a memory for storing a computer program; and a processor for executing the computer program stored in the memory, so that the device performs a method as in any possible implementation of the third aspect.

[0026] In a fifth aspect, the present application provides a computer program product, which includes: computer program code, which, when the computer program code is run on a computer, enables the computer to execute the method in any possible implementation of the third aspect.

[0027] The computer program code may be stored in whole or in part in a memory, which may be packaged together with the processor or separately.

[0028] In a sixth aspect, the present application provides a computer-readable medium, which stores instructions. When the instructions are executed by a processor, the processor implements the method in any possible implementation of the third aspect.

[0029] In a seventh aspect, the present application provides a chip, which includes a circuit for executing the method in any possible implementation of the third aspect above. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] FIG1 is a schematic structural diagram of a heat dissipation device provided in an embodiment of the present application;

[0031] FIG2 is a schematic structural diagram of a heat dissipation device provided in another embodiment of the present application;

[0032] FIG3 is a schematic diagram of a circuit connection of a heat dissipation device provided in an embodiment of the present application;

[0033] FIG4 is a schematic diagram of a circuit connection of a heat dissipation device provided by another embodiment of the present application;

[0034] FIG5 is a schematic diagram of a circuit connection of a heat dissipation device provided by another embodiment of the present application;

[0035] FIG6 is a circuit connection diagram of a heat dissipation device provided by another embodiment of the present application;

[0036] FIG7 is a schematic diagram of a circuit connection of a heat dissipation device provided by another embodiment of the present application;

[0037] FIG8 is a schematic diagram of a cooling system for a vehicle provided in an embodiment of the present application;

[0038] FIG9 is a flow chart of a heat dissipation control method according to an embodiment of the present application.

[0039] Reference numerals:

[0040] 100-housing; 200-air cooling unit; 300-intelligent module; 400-liquid cooling circuit; 500-connector;

[0041] 110 - first plate; 120 - first pipeline assembly; 130 - second pipeline assembly; 140 - second plate;

[0042] 150 - third pipeline assembly; 310 - circuit board; 320 - electronic device; 330 - connector; 400a - first liquid cooling circuit;

[0043] 400b - second liquid cooling circuit; 430 - first temperature sensor; 440 - second temperature sensor; 111 - first cavity;

[0044] 112 - first heat dissipation fin; 113 - first heat conducting portion; 121 - first pipeline; 122 - first control valve; 131 - second pipeline;

[0045] 132 - second control valve; 141 - second cavity; 142 - second heat dissipation fin; 151 - third pipeline; 152 - third control valve. DETAILED DESCRIPTION

[0046] The embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0047] For ease of understanding, the application scenarios of the heat dissipation device involved in this application are first described. As a possible application scenario, the heat dissipation device provided in the embodiments of this application can be used in the vehicle field to dissipate heat from on-board intelligent modules (such as intelligent driving modules, on-board entertainment modules, vehicle control modules, etc.).

[0048] For example, in the automotive sector, as autonomous driving levels increase, the computing power and power consumption of the system-on-chip (SoC) in onboard intelligent modules are increasing, and the heat dissipation requirements of these modules are also becoming increasingly stringent. In related technologies, natural cooling or air cooling is typically used for onboard intelligent modules. However, these two cooling methods have limited heat dissipation capabilities and are difficult to meet the heat dissipation requirements of intelligent modules.

[0049] Based on this, an embodiment of the present application provides a heat dissipation device to improve the heat dissipation capability and meet the heat dissipation requirements of the smart module.

[0050] First, reference is made to FIG1 , which shows a schematic structural diagram of a heat dissipation device provided in an embodiment of the present application. As shown in FIG1 , the heat dissipation device provided in an embodiment of the present application may include a housing 100 and an air-cooling heat dissipation portion 200. The housing 100 may include a first plate 110, and an intelligent module 300 may be disposed within the housing 100 near the first plate 110. The first plate 110 may have a first cavity 111 therein, and the first plate 110 may be located in a plurality of liquid cooling circuits 400. The first plate 110 may selectively be connected to one of the plurality of liquid cooling circuits 400. The air-cooling heat dissipation portion 200 may be disposed within or outside the housing 100 of the heat dissipation device. Specifically, the air-cooling heat dissipation portion 200 may be disposed on the same side of the first plate 110 as the intelligent module 300. The air-cooling heat dissipation portion 200 and / or the first plate 110 may dissipate heat from the intelligent module 300.

[0051] In actual application, the heat dissipation device can adopt an air-cooling heat dissipation mode for the smart module 300 through the air-cooling heat dissipation portion 200. When the temperature of a liquid cooling circuit 400 among the multiple liquid cooling circuits 400 meets certain connection conditions, for example, when the temperature of a liquid cooling circuit 400 is higher than or equal to the dew point temperature of the environment in which the smart module 300 is located, specifically, when the temperature of the coolant in a liquid cooling circuit 400 is higher than or equal to the dew point temperature of the environment in which the smart module 300 is located, there is no risk of condensation in the smart module 300 after the first plate 110 is connected to this liquid cooling circuit 400. At this time, the first plate 110 can be connected to this liquid cooling circuit 400, the first cavity 111 is in communication with this liquid cooling circuit 400, and the coolant in this liquid cooling circuit 400 can flow through the first cavity 111. The heat dissipation device can adopt a liquid-cooling heat dissipation mode, an air-cooling heat dissipation mode, or a combination of air-cooling and liquid-cooling heat dissipation mode for the smart module 300. When the temperatures of all liquid cooling circuits 400 do not meet certain connection conditions, for example, when the temperatures of all liquid cooling circuits 400 are lower than the dew point temperature of the environment in which the smart module 300 is located, specifically, when the temperature of the coolant in all liquid cooling circuits 400 is lower than the dew point temperature of the environment in which the smart module 300 is located, there is a risk of condensation on the smart module 300 after the first plate 110 is connected to any liquid cooling circuit 400. In this case, the first plate 110 is not connected to any liquid cooling circuit 400, and the heat dissipation device can still use an air cooling mode to dissipate heat from the smart module 300. The heat dissipation device can dissipate heat from the smart module 300 through liquid cooling or a combination of air cooling and liquid cooling, thereby having strong heat dissipation capabilities, enhancing the heat dissipation effect on the smart module 300, and meeting the heat dissipation requirements of the smart module 300. Furthermore, by configuring appropriate access conditions, the first plate 110 can be connected to a suitable liquid cooling circuit 400 to avoid condensation in the smart module 300 when the heat dissipation device adopts a liquid cooling mode for the smart module 300, thereby avoiding short circuits in the smart module 300 due to condensation and improving the safety of heat dissipation of the smart module 300.

[0052] Thanks to the heat dissipation device provided in the embodiment of the present application, while dissipating heat for the smart module 300 and preventing condensation from forming on the smart module 300, the ingress protection rating (IP) of the smart module 300 can be a non-IP67 protection rating. For example, the ingress protection rating of the smart module 300 can be IP20. In other words, the smart module 300 does not need to have a stronger ingress protection rating, and thus does not require the processes and components required to achieve a stronger ingress protection rating. For example, the smart module 300 does not need to be sealed with waterproof glue, or equipped with a breathable valve or reversible moisture-absorbing material. This reduces the cost of the smart module 300 and enhances maintainability. The first digit in the ingress protection rating represents the dustproof rating, and the second digit represents the waterproof rating. A larger digit represents a higher ingress protection rating.

[0053] Referring to Figure 2, Figure 2 shows a schematic structural diagram of a heat dissipation device provided in another embodiment of the present application. The reference numerals in Figure 2 may refer to the same reference numerals in Figure 1. As shown in Figure 2, the intelligent module 300 may include a circuit board 310, and various electronic devices 320 and various connectors 330 arranged on the circuit board 310. The circuit board 310 may be fixedly connected to the first board 110 via a connector 500, thereby achieving a fixed connection between the intelligent module 300 and the first board 110. The electronic device 320 may be attached to the first board 110. For example, the electronic device 320 with higher power consumption among the various electronic devices 320 may be attached to the first board 110 to achieve relatively efficient heat dissipation. The intelligent module 300 may be electrically connected to other functional modules or electronic devices via a connector 330.

[0054] In a specific implementation, to achieve a relatively ideal heat dissipation effect, the first plate 110 can be made of sheet metal, which has strong thermal conductivity, is lightweight, and has low cost. The first plate 110 can also be made of other materials with strong thermal conductivity. The shape of the first plate 110 can match the shape of the smart module 300 to cover the entire smart module 300 or the main heat-generating areas of the smart module 300. The embodiment of the present application does not limit the shape and material of the first plate 110.

[0055] In one possible implementation, the first plate 110 may be provided with first heat dissipation fins 112. For example, the first heat dissipation fins 112 may be provided on a side of the first plate 110 away from the smart module 300. The first plate 110 may also be provided with first heat dissipation bosses to improve heat dissipation efficiency. For example, the first heat dissipation bosses may be provided on a side of the first plate 110 facing the smart module 300. In a specific implementation, the electronic components 320 of the smart module 300, which consume relatively high power, may be in contact with the first heat dissipation bosses.

[0056] As a possible implementation, a first heat-conducting portion 113 may be provided on the side of the first plate 110 facing the smart module 300, and the smart module 300 may be connected to the first heat-conducting portion 113 to accelerate the heat dissipation of the smart module 300. In actual configuration, the electronic device 320 of the smart module 300 with relatively high power consumption may be attached to the first heat-conducting portion 113. The first heat-conducting portion 113 may be a sheet-like structure, and the shape of the first heat-conducting portion 113 may be a variety of shapes that can cover the electronic device 320 of the smart module 300 with relatively high power consumption, for example, the shape of the first heat-conducting portion 113 may be square, circular, etc. The first heat-conducting portion 113 may be made of a thermal interface material (TIM) or a metal material with relatively ideal thermal conductivity. The embodiment of the present application does not limit the structure and material of the first heat-conducting portion 113.

[0057] When the first heat conducting portion 113 and the heat dissipation boss are simultaneously provided on the side of the first plate 110 facing the smart module 300, in one possible specific implementation, the first heat conducting portion 113 and the heat dissipation boss can be provided in a one-to-one correspondence. Specifically, the first heat conducting portion 113, the heat dissipation boss and the first plate 110 can be provided in sequence, and the electronic components 320 with higher power consumption of the smart module 300 can be attached to the first heat conducting portion 113; in another possible specific implementation, a portion of the first heat conducting portion 113 can be directly provided on the first plate 110, and another portion of the first heat conducting portion 113 can be provided on the heat dissipation boss. A portion of the electronic components 320 with higher power consumption of the smart module 300 can be attached to the first heat conducting portion 113, and another portion of the electronic components 320 with higher power consumption of the smart module 300 can be attached to the heat dissipation boss.

[0058] As a possible embodiment, the air-cooling heat dissipation unit 200 can adopt a device capable of generating airflow, such as a fan. The air-cooling heat dissipation unit 200 can be electrically connected to the intelligent module 300. The air-cooling heat dissipation unit 200 can be provided with a heating unit, which can heat the airflow generated by the air-cooling heat dissipation unit 200, thereby reducing the relative humidity of the environment in which the intelligent module 300 is located, and further reducing the risk of condensation in the intelligent module 300. In specific implementation, the heating unit can be provided on the airflow path of the air-cooling heat dissipation unit 200. The heating unit can be a device with a heating function and with little effect on the airflow of the air-cooling heat dissipation unit 200. The embodiment of the present application does not limit the specific device used for the heating unit.

[0059] Referring to Figure 3, Figure 3 shows a schematic diagram of the circuit connection of the heat dissipation device provided in an embodiment of the present application. The reference numerals in Figure 3 may refer to the same reference numerals in Figure 1. As shown in Figure 3, the multiple liquid cooling circuits 400 may include a first liquid cooling circuit 400a and a second liquid cooling circuit 400b. The first plate 110 may be connected to the first liquid cooling circuit 400a through the first pipe assembly 120, so that the first cavity 111 may be connected to the first liquid cooling circuit 400a through the first pipe assembly 120. In a specific implementation, the first plate 110 is connected to the first liquid cooling circuit 400a through two first pipe assemblies 120. Similarly, the first plate 110 may be connected to the second liquid cooling circuit 400b through the second pipe assembly 130, so that the first cavity 111 may be connected to the second liquid cooling circuit 400b through the second pipe assembly 130. In a specific implementation, the first plate 110 is connected to the second liquid cooling circuit 400b through two second pipe assemblies 130. In specific applications, the heat dissipation device can be freely switched under three working conditions: one is that the first plate body 110 is connected to the first liquid cooling circuit 400a, and at this time the heat dissipation device can adopt a heat dissipation mode combining liquid cooling and air cooling for the smart module 300; the other is that the first plate body 110 is connected to the second liquid cooling circuit 400b, and at this time the heat dissipation device can also adopt a heat dissipation mode combining liquid cooling and air cooling for the smart module 300; the other is that the first plate body 110 is not connected to any liquid cooling circuit, and at this time the heat dissipation device can maintain an air cooling heat dissipation mode for the smart module 300.

[0060] In a specific implementation, the first pipeline assembly 120 may include a first pipeline 121 and a first control valve 122 . The first pipeline 121 may connect the first cavity 111 with the first liquid cooling circuit 400 a . The on / off of the first pipeline 121 may be controlled by the first control valve 122 .

[0061] In a specific implementation, the second pipeline assembly 130 may include a second pipeline 131 and a first control valve 122. The second pipeline 131 may connect the first cavity 111 with the second liquid cooling circuit 400b. The on-off of the second pipeline 131 may also be controlled by the first control valve 122, that is, the on-off of the second pipeline 131 and the first pipeline 121 may both be controlled by the first control valve 122. For example, the first control valve 122 may adopt a three-way valve.

[0062] Referring to Figure 4, Figure 4 shows a schematic diagram of the circuit connection of a heat dissipation device provided by another embodiment of the present application. The numbers in Figure 4 can refer to the same numbers in Figures 1 and 3. As shown in Figure 4, in another specific implementation, the second pipeline assembly 130 may include a second pipeline 131 and a second control valve 132, and the second pipeline 131 can connect the first cavity 111 with the second liquid cooling circuit 400b. The on-off of the second pipeline 131 can be controlled by the second control valve 132, that is, the on-off of the second pipeline 131 and the first pipeline 121 can be controlled by the second control valve 132 and the first control valve 122, respectively. In a specific implementation, the first control valve 122 is in a closed state by default, and the second control valve 132 is also in a closed state by default.

[0063] In a specific implementation, a first temperature sensor 430 may be provided on the first liquid cooling circuit 400a. The first temperature sensor 430 can measure the temperature of the first liquid cooling circuit 400a. Specifically, the first temperature sensor 430 can measure the temperature of the coolant in the first liquid cooling circuit 400a. The first temperature sensor 430 can be electrically connected to the intelligent module 300 and can report the temperature of the first liquid cooling circuit 400a to the intelligent module 300. Similarly, a second temperature sensor 440 can be provided on the second liquid cooling circuit 400b. The second temperature sensor 440 can measure the temperature of the second liquid cooling circuit 400b. Specifically, the second temperature sensor 440 can measure the temperature of the coolant in the second liquid cooling circuit 400b. The second temperature sensor 440 can be electrically connected to the intelligent module 300 and can report the temperature of the second liquid cooling circuit 400b to the intelligent module 300.

[0064] As a possible implementation, the heat dissipation device provided in the embodiment of the present application may further include a temperature and humidity sensor, which can measure the temperature and humidity of the environment in which the smart module 300 is located. The temperature and humidity sensor can be electrically connected to the smart module 300, and the temperature and humidity sensor can report the temperature and humidity of the environment in which the smart module 300 is located to the smart module 300. The temperature and humidity sensor and the smart module 300 can be located on the same side of the first plate body 110. Specifically, the temperature and humidity sensor can be set on the circuit board 310 of the smart module 300. In actual applications, the smart module 300 can determine the dew point temperature of the environment in which the smart module 300 is located based on the measurement results of the temperature and humidity sensor. The smart module 300 can determine the liquid cooling circuit that the first plate body 110 can be connected to through the measurement results of the first temperature sensor 430 (i.e., the temperature of the first liquid cooling circuit 400a), the measurement results of the second temperature sensor 440 (i.e., the temperature of the second liquid cooling circuit 400b) and the dew point temperature of the environment in which the smart module 300 is located, so that after the first plate body 110 is connected to this liquid cooling circuit, the smart module 300 will not produce condensation when the heat dissipation device dissipates heat for the smart module 300.

[0065] Referring to FIG5 , FIG5 shows a schematic diagram of a circuit connection of a heat dissipation device provided in another embodiment of the present application. The reference numerals in FIG5 may refer to the same reference numerals in FIG1 and FIG2 . As shown in FIG5 , the housing 100 may further include a second plate 140 , which is spaced apart from the first plate 110 to form a storage space. The smart module 300 may be disposed in the storage space between the second plate 140 and the first plate 110 . Specifically, the circuit board 310 of the smart module 300 may be fixedly connected to the first plate 110 and the second plate 140 via a connector 500 . In actual implementation, if electronic devices 320 with high power consumption are also arranged on the side of the circuit board 310 of the smart module 300 facing the second plate 140 , these electronic devices 320 may be attached to the second plate 140 to improve heat dissipation efficiency.

[0066] In a specific implementation, the housing 100 formed by the second plate 140 and the first plate 110 can be a non-enclosed structure to facilitate the use of an air-cooling heat dissipation mode to dissipate heat from the smart module 300. The air-cooling heat dissipation unit 200 can be disposed within or outside the accommodating space, that is, the air-cooling heat dissipation unit 200 can be disposed within or outside the housing 100. When the air-cooling heat dissipation unit 200 is disposed outside the housing 100, the air-cooling heat dissipation unit 200 can be disposed as close to the housing 100 as possible, and thus as close to the smart module 300 as possible, thereby ensuring a relatively ideal heat dissipation effect when the air-cooling heat dissipation mode is used to dissipate heat from the smart module 300.

[0067] In a specific implementation, the second plate 140 can be made of sheet metal or other materials with strong thermal conductivity. The shape of the second plate 140 can match the shape of the smart module 300 to cover the entire smart module 300, or cover the main heat-generating parts of the smart module 300. The embodiment of the present application also does not limit the shape and material of the second plate 140. The second plate 140 can be provided with a second heat dissipation fin 142. For example, the second heat dissipation fin 142 can be provided on the side of the second plate 140 away from the smart module 300. The second plate 140 can also be provided with a second heat dissipation boss. For example, the second heat dissipation boss can be provided on the side of the second plate 140 facing the smart module 300, and the electronic device 320 with higher power consumption of the smart module 300 can be attached to the second heat dissipation boss.

[0068] As a possible implementation, a second heat conducting portion can be provided on the side of the second plate 140 facing the smart module 300. The smart module 300 can be connected to the second heat conducting portion to further accelerate heat dissipation from the smart module 300. In actual implementation, the high-power electronic device 320 of the smart module 300 can be attached to the second heat conducting portion. The present embodiment does not impose any restrictions on the structure and material of the second heat conducting portion. When the second heat-conducting portion and the second heat-dissipating boss are simultaneously provided on the side of the second plate body 140 facing the smart module 300, in one possible specific implementation, the second heat-conducting portion and the second heat-dissipating boss can be provided in a one-to-one correspondence. Specifically, the second heat-conducting portion, the second heat-dissipating boss and the second plate body 140 can be provided in sequence, and the electronic device 320 with higher power consumption of the smart module 300 can be attached to the second heat-conducting portion; in another possible specific implementation, a portion of the second heat-conducting portion can be directly provided on the second plate body 140, and another portion of the second heat-conducting portion can be provided on the second heat-dissipating boss. A portion of the electronic device 320 with higher power consumption of the smart module 300 can be attached to the second heat-conducting portion, and another portion of the electronic device 320 with higher power consumption of the smart module 300 can be attached to the second heat-conducting portion.

[0069] As a possible implementation, the second plate body 140 may have a second cavity 141 therein. Similarly, the second plate body 140 may be located in multiple liquid cooling circuits 400 , and the second plate body 140 may be selectively connected to one of the multiple liquid cooling circuits 400 .

[0070] Referring to FIG6 , FIG6 shows a circuit connection schematic diagram of a heat dissipation device provided in another embodiment of the present application. The reference numerals in FIG6 may refer to the same reference numerals in FIG1 and FIG5 . As shown in FIG6 , the second plate 140 and the first plate 110 can be connected in parallel, that is, the second cavity 141 and the first cavity 111 can be connected in parallel. The second plate 140 and the first plate 110 can be connected together to a liquid cooling circuit 400 . Thus, the second plate 140 can also dissipate heat from the smart module 300, thereby improving the heat dissipation efficiency of the smart module 300.

[0071] As a possible implementation, the second plate 140 can be connected to the first plate 110 via the third pipe assembly 150, so that the second cavity 141 can communicate with the first cavity 111 via the third pipe assembly 150, and further communicate with the first liquid cooling circuit 400a or the second liquid cooling circuit 400b, thereby achieving parallel connection of the second plate 140 and the first plate 110 to the first liquid cooling circuit 400a or the second liquid cooling circuit 400b. In a specific implementation, the second plate 140 is connected in parallel with the first plate 110 via two third pipe assemblies 150. The third pipe assembly 150 may include a third pipe 151, and the second cavity 141 and the first cavity 111 can be communicated via the third pipe 151.

[0072] When the first pipeline assembly 120 includes a first pipeline 121 and a first control valve 122, the first control valve 122 can control the on-off of the first pipeline 121. Since the second plate body 140 is connected in parallel with the first plate body 110, the first control valve 122 can also control the on-off of the third pipeline 151. It can be understood that the first control valve 122 can control the on-off of the first pipeline 121 and the third pipeline 151 at the same time. The first control valve 122 can control whether the coolant in the first liquid cooling circuit 400a flows into the first cavity 111 and the second cavity 141.

[0073] When the second pipeline assembly 130 includes the second pipeline 131 and the first control valve 122, the first control valve 122 can control the on-off of the second pipeline 131. Since the second plate body 140 is connected in parallel with the first plate body 110, the first control valve 122 can naturally control the on-off of the third pipeline 151. It can be understood that the first control valve 122 can control the on-off of the second pipeline 131 and the third pipeline 151 at the same time. The first control valve 122 can control whether the coolant in the second liquid cooling circuit 400b flows into the first cavity 111 and the second cavity 141.

[0074] Referring to Figure 7, Figure 7 shows a circuit connection diagram of a heat dissipation device provided by another embodiment of the present application. The numbers in Figure 7 can refer to the same numbers in Figure 6. As shown in Figure 7, when the second pipeline assembly 130 includes a second pipeline 131 and a second control valve 132, the second control valve 132 can control the on-off of the second pipeline 131. Since the second plate body 140 is connected in parallel with the first plate body 110, the second control valve 132 can also control the on-off of the third pipeline 151. It can be understood that the second control valve 132 can control the on-off of the second pipeline 131 and the third pipeline 151 at the same time, and the second control valve 132 can control whether the coolant in the second liquid cooling circuit 400b flows into the first cavity 111 and the second cavity 141.

[0075] In a specific implementation, the third pipeline assembly 150 may further include a third control valve 152, and the on-off of the third pipeline 151 may be further controlled by the third control valve 152. The third control valve 152 is in a closed state by default.

[0076] Referring to Figure 8, Figure 8 shows a schematic diagram of the cooling system of a vehicle provided in an embodiment of the present application. The numbers in Figure 8 can refer to the same numbers in Figure 1. An embodiment of the present application also provides a vehicle, as shown in Figure 8. In one possible implementation, the vehicle provided in an embodiment of the present application may include a central control system, a battery cooling system, a motor cooling system, and a heat dissipation device as described in the above embodiments. The battery cooling system can dissipate heat from the battery of the vehicle. The motor cooling system can dissipate heat from the motor of the vehicle. The battery cooling system and the motor cooling system are controlled by the central control system. The intelligent module 300 can be controlled by the central control system, or the intelligent module 300 can be part of the central control system.

[0077] In a specific implementation, the first plate 110 of the heat sink can be located within multiple liquid cooling loops 400, which can be connected to the battery cooling system and the motor cooling system, respectively. For example, the first liquid cooling loop 400a of the multiple liquid cooling loops 400 can be connected to the battery cooling system, and the second liquid cooling loop 400b can be connected to the motor cooling system. This means that the heat sink can cool the smart module 300 via either the battery cooling system or the motor cooling system. Typically, the temperature of the coolant in the battery cooling system is lower than that of the coolant in the motor cooling system. Consequently, the temperature of the coolant in the first liquid cooling loop 400a is lower than that of the coolant in the second liquid cooling loop 400b.

[0078] In one possible usage scenario, when the vehicle is parked, the smart module 300 can be in sentry mode. In this mode, the smart module 300 can process the vehicle's surrounding conditions reported by the sensing and monitoring modules. In this mode, the smart module 300 consumes relatively low power. When in sentry mode, the smart module 300 can be cooled solely by air cooling. Compared to liquid cooling, this reduces power loss to the vehicle's power battery, allowing the smart module 300 to operate for extended periods, increasing the battery's range, and preventing wide temperature fluctuations in the smart module 300, thereby reducing the failure rate of the smart module 300 chip.

[0079] Based on the above heat dissipation control device or vehicle, an embodiment of the present application further provides a heat dissipation control method. Referring to FIG. 9 , FIG. 9 shows a flow chart of the heat dissipation control method provided by an embodiment of the present application. The reference numerals in FIG. 9 may refer to the same reference numerals in FIG. 1 and FIG. 4 . The heat dissipation control method may include the following steps:

[0080] In the initial state, the first plate 110 is not connected to the first liquid cooling circuit 400 a and the second liquid cooling circuit 400 b .

[0081] The temperature of the first liquid cooling circuit 400a and the temperature of the second liquid cooling circuit 400b among the multiple liquid cooling circuits 400 are obtained. Specifically, the temperature of the first liquid cooling circuit 400a can be obtained by the first temperature sensor 430 and reported to the intelligent module 300. The temperature of the second liquid cooling circuit 400b can be obtained by the second temperature sensor 440 and reported to the intelligent module 300.

[0082] The intelligent module 300 can determine whether the temperature of the first liquid cooling circuit 400a meets the access conditions. When the temperature of the first liquid cooling circuit 400a meets the access conditions, the intelligent module 300 can control the first plate 110 of the heat dissipation device to connect to the first liquid cooling circuit 400a, or the intelligent module 300 can request the central control system to control the first plate 110 of the heat dissipation device to connect to the first liquid cooling circuit 400a, so that a liquid cooling heat dissipation mode can be adopted for the intelligent module 300.

[0083] When the temperature of the first liquid cooling loop 400a does not meet the access conditions, the intelligent module 300 can determine whether the temperature of the second liquid cooling loop 400b meets the access conditions. When the temperature of the second liquid cooling loop 400b meets the access conditions, the intelligent module 300 can control the first plate 110 to connect to the second liquid cooling loop 400b, or the intelligent module 300 can request the central control system to control the first plate 110 to connect to the second liquid cooling loop 400b, so that the liquid cooling heat dissipation mode can also be adopted for the intelligent module 300.

[0084] When the temperature of the second liquid cooling circuit 400b does not meet the connection condition, the first plate body 110 remains disconnected from the first liquid cooling circuit 400a and the second liquid cooling circuit 400b, and the intelligent module 300 can control the air-cooled heat dissipation part 200 of the heat dissipation device to be in a working state, so that the air-cooled heat dissipation mode can be adopted for the intelligent module 300.

[0085] The heat dissipation control method provided in the embodiments of the present application can be used to selectively connect the first plate 110 to a liquid cooling circuit 400, thereby implementing a liquid cooling heat dissipation mode for the smart module 300 and meeting the heat dissipation requirements of the smart module 300. Furthermore, by configuring appropriate connection conditions, condensation can be avoided when the smart module 300 is in a liquid cooling heat dissipation mode, thereby preventing short circuits in the smart module 300 caused by condensation and improving the heat dissipation safety of the smart module 300.

[0086] As a possible implementation, before the smart module 300 controls the first plate 110 to connect to the first liquid cooling circuit 400a or the second liquid cooling circuit 400b, the smart module 300 can control the air cooling heat dissipation unit 200 to start, so that the air cooling heat dissipation mode can be adopted for the smart module 300. When the intelligent module 300 determines that the temperature of the first liquid cooling circuit 400a meets the access conditions, the intelligent module 300 or the intelligent module 300 requests the central control system to control the first board 110 to connect to the first liquid cooling circuit 400a, or when the intelligent module 300 determines that the temperature of the first liquid cooling circuit 400a does not meet the access conditions, and the temperature of the second liquid cooling circuit 400b meets the access conditions, the intelligent module 300 or the intelligent module 300 requests the central control system to control the first board 110 to connect to the second liquid cooling circuit 400b, the intelligent module 300 does not change the working state of the air-cooling heat dissipation part 200, so that a heat dissipation mode combining liquid cooling and air cooling can be adopted for the intelligent module 300, or the intelligent module 300 controls the air-cooling heat dissipation part 200 to be turned off, that is, only a liquid cooling heat dissipation mode can be adopted for the intelligent module 300.

[0087] The heat dissipation control method provided in the embodiments of the present application can be used to at least employ an air-cooling mode for the smart module 300, providing relatively reliable heat dissipation for the smart module 300. Furthermore, a combined liquid-cooling and air-cooling mode, or a liquid-cooling mode, can be employed for the smart module 300, achieving relatively ideal heat dissipation for the smart module 300. When combining the liquid-cooling mode to enhance the heat dissipation of the smart module 300, condensation can also be avoided, thereby preventing short circuits in the smart module 300 caused by condensation and improving the safety of heat dissipation for the smart module 300. Overall, the heat dissipation control method provided in the embodiments of the present application can achieve reliable and safe heat dissipation for the smart module 300.

[0088] In a specific implementation, the intelligent module 300 controls the air-cooling heat dissipation part 200 of the heat dissipation device to be in a working state, including: when the air-cooling heat dissipation part 200 is in a working state, the intelligent module 300 does not change the working state of the air-cooling heat dissipation part 200, and the air-cooling heat dissipation part 200 still remains in a working state; when the air-cooling heat dissipation part 200 is in a closed state, the intelligent module 300 controls the air-cooling heat dissipation part 200 to start, and the air-cooling heat dissipation part 200 changes from a closed state to a working state.

[0089] In one possible embodiment, the access condition is that the temperature of the liquid cooling circuit 400 is greater than or equal to the sum of the dew point temperature of the environment in which the smart module 300 is located and a preset temperature, where the value of the preset temperature is greater than or equal to zero. In a specific implementation, the temperature and humidity of the environment in which the smart module 300 is located can be obtained by a temperature and humidity sensor, and the temperature and humidity of the environment in which the smart module 300 is located can be reported to the smart module 300. The smart module 300 can determine the dew point temperature of the environment in which the smart module 300 is located by calculation or query based on the temperature and humidity reported by the temperature and humidity sensor.

[0090] The above is only a specific implementation method of the present application, but the protection scope of the present application is not limited thereto. Any changes or replacements that can be easily thought of by any technician familiar with this technical field within the technical scope disclosed in this application should be covered by the protection scope of the present application.

Claims

1. A heat dissipation device, characterized in that: The invention comprises a housing and an air-cooling heat dissipation unit, wherein the housing comprises a first plate body, an intelligent module close to the first plate body is arranged in the housing, and the air-cooling heat dissipation unit and the intelligent module are arranged on the same side of the first plate body; The first plate body has a first cavity therein, and the first plate body is located in a plurality of liquid cooling circuits. The air-cooling heat dissipation portion and / or the first plate body are used to dissipate heat from the smart module.

2. The heat dissipation device according to claim 1, wherein: The multiple liquid cooling circuits include a first liquid cooling circuit and a second liquid cooling circuit. The first plate body is connected to the first liquid cooling circuit through a first pipeline assembly, and the first plate body is connected to the second liquid cooling circuit through a second pipeline assembly.

3. The heat dissipation device according to claim 2, wherein: The first pipeline assembly includes a first pipeline and a first control valve; The second pipeline assembly includes a second pipeline and the first control valve, or the second pipeline assembly includes a second pipeline and a second control valve.

4. The heat dissipation device according to claim 3, wherein: A first temperature sensor is provided on the first liquid cooling circuit, and the first temperature sensor is used to measure the temperature of the first liquid cooling circuit; A second temperature sensor is provided on the second liquid cooling circuit, and the second temperature sensor is used to measure the temperature of the second liquid cooling circuit.

5. The heat dissipation device according to claim 4, wherein: Also included is a temperature and humidity sensor, the temperature and humidity sensor is used to measure the temperature and humidity of the environment in which the smart module is located, and the temperature and humidity sensor is electrically connected to the smart module; The measurement results of the temperature and humidity sensor are used to determine the dew point temperature of the environment in which the intelligent module is located. The measurement results of the first temperature sensor, the measurement results of the second temperature sensor, and the dew point temperature are used to determine the liquid cooling circuit to which the first plate is connected. When the liquid cooling circuit to which the first plate is connected dissipates heat for the intelligent module, the intelligent module will not generate condensation.

6. The heat dissipation device according to any one of claims 1 to 5, characterized in that: A first heat conducting portion is provided on a side of the first plate body facing the smart module, and the smart module is connected to the first heat conducting portion.

7. The heat dissipation device according to any one of claims 1 to 6, wherein: The air-cooling heat dissipation portion is provided with a heating portion, and the heating portion is used to heat the airflow generated by the air-cooling heat dissipation portion.

8. A vehicle, characterized in that: It includes a central control system, a battery cooling system, a motor cooling system and a heat dissipation device according to any one of claims 1 to 7; The battery cooling system is used to dissipate heat from the battery of the vehicle, and the motor cooling system is used to dissipate heat from the motor of the vehicle, and the battery cooling system and the motor cooling system are controlled by the central control system; The first plate of the heat dissipation device is located in a plurality of liquid cooling circuits, and the plurality of liquid cooling circuits are used to be respectively connected to the battery cooling system and the motor cooling system.

9. The vehicle according to claim 8, wherein: The multiple liquid cooling circuits include a first liquid cooling circuit and a second liquid cooling circuit. The first liquid cooling circuit is used to be connected to the battery cooling system, and the second liquid cooling circuit is used to be connected to the motor cooling system.

10. A heat dissipation control method, characterized in that: The method is applied to the heat dissipation device according to any one of claims 1 to 7 or the vehicle according to claim 8 or 9, and the method comprises: acquiring a temperature of a first liquid cooling circuit and a temperature of a second liquid cooling circuit among the plurality of liquid cooling circuits; determining whether the temperature of the first liquid cooling circuit meets an access condition, and when the temperature of the first liquid cooling circuit meets the access condition, controlling the first plate of the heat dissipation device to connect to the first liquid cooling circuit to dissipate heat from the smart module; When the temperature of the first liquid cooling circuit does not meet the access condition, determining whether the temperature of the second liquid cooling circuit meets the access condition; and when the temperature of the second liquid cooling circuit meets the access condition, controlling the first plate to connect to the second liquid cooling circuit to dissipate heat for the smart module; When the temperature of the second liquid cooling circuit does not meet the connection condition, the first plate is not connected to the first liquid cooling circuit or the second liquid cooling circuit, and the air cooling heat dissipation part of the heat dissipation device is controlled to be in a working state to dissipate heat from the smart module.

11. The heat dissipation control method according to claim 10, wherein: Before controlling the first plate to be connected to the first liquid cooling circuit or the second liquid cooling circuit, controlling the air cooling heat dissipation unit to start; When the temperature of the first liquid cooling circuit meets the access condition and the first board is connected to the first liquid cooling circuit, or when the temperature of the first liquid cooling circuit does not meet the access condition and the temperature of the second liquid cooling circuit meets the access condition and the first board is connected to the second liquid cooling circuit, the working state of the air-cooling heat dissipation unit is not changed or the air-cooling heat dissipation unit is controlled to be closed.

12. The heat dissipation control method according to claim 10, wherein: The controlling the air cooling heat dissipation part of the heat dissipation device to be in a working state comprises: When the air-cooling heat dissipation unit is in a working state, the working state of the air-cooling heat dissipation unit is not changed; When the air-cooling heat dissipation unit is in a closed state, the air-cooling heat dissipation unit is controlled to start.

13. The heat dissipation control method according to any one of claims 10 to 12, wherein: The access condition is: the temperature of the liquid cooling circuit is higher than or equal to the sum of the dew point temperature of the environment where the smart module is located and the preset temperature; Wherein, the value of the preset temperature is greater than or equal to zero.

14. The heat dissipation control method according to claim 13, wherein: The method further comprises: The temperature and humidity of the environment in which the smart module is located are acquired, and the dew point temperature is determined according to the temperature and the humidity.

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