Reducing type inner and outer wall polishing equipment and method for multi-dimensional sensor

Abstract

The invention discloses multi-dimensional sensor variable-diameter inner and outer wall polishing equipment and method.The multi-dimensional sensor variable-diameter inner and outer wall polishing equipment comprises a supporting assembly, a press-fit limiting assembly and a polishing assembly, the supporting assembly comprises a supporting base and a fixing plate, the fixing plate is arranged on the supporting base, the press-fit limiting assembly is arranged on the fixing plate, and the polishing assembly is arranged on the supporting base; the pressing limiting assembly is used for pressing and fixing a sensor to be polished and comprises a positioning plate, an adjusting screw rod, a clamping plate block and a pressing plate, the positioning plate is arranged on the fixing plate block, the adjusting screw rod is in threaded connection with the positioning plate, the clamping plate block is movably arranged on the fixing plate block, the pressing plate is arranged on the clamping plate block, and the adjusting screw rod is in threaded connection with the pressing plate. And the polishing assembly is arranged on the fixed plate. Therefore, the polishing component with the variable spacing is adopted to polish the sensor, polishing is conducted according to the inner walls with different hole diameters in the sensor in the polishing process, then the polishing device is suitable for various inner diameters, the replacement frequency of the polishing component is reduced, and the polishing efficiency is improved.

Description

Technical Field

[0001] The invention relates to the technical field of sensor polishing, and in particular to a multi-dimensional sensor variable diameter inner and outer wall polishing device and method. Background Art

[0002] A multidimensional sensor is a sensor that can measure multiple physical quantities simultaneously, which may include force, pressure, temperature, displacement, etc. Multidimensional sensors have a wide range of applications in industrial automation, robotics, aerospace, and other fields. When designing a multidimensional sensor, you may need to consider its ability to adapt to different diameters or sizes. For example, in some application scenarios, the sensor needs to be installed on a shaft or in a hole with different diameters. By adopting a variable diameter design, the sensor can more easily adapt to these different installation conditions, thereby improving its versatility and flexibility.

[0003] Under existing technical conditions, when polishing sensors, if different inner diameters of the same sensor need to be polished, there is often a challenge: different polishing parts usually need to be replaced for different inner diameters, and multiple polishing operations may be required. This practice not only greatly prolongs the time required for polishing, but also significantly reduces the overall efficiency of polishing. Summary of the invention

[0004] The present invention aims to solve one of the technical problems in the related art at least to a certain extent.

[0005] To this end, the purpose of the present invention is to propose a multi-dimensional sensor variable diameter inner and outer wall polishing equipment and method, which uses polishing parts with variable spacing to polish the sensor. During the polishing process, the inner walls of the sensor with different apertures are polished, thereby being suitable for a variety of inner diameters, reducing the number of times the polishing parts are replaced and improving the polishing efficiency.

[0006] To achieve the above-mentioned purpose, the present invention proposes a multi-dimensional sensor variable diameter inner and outer wall polishing equipment, including a support assembly, a pressing and limiting assembly and a polishing assembly, wherein the support assembly includes a support base and a fixed plate, wherein the fixed plate is arranged on the support base; the pressing and limiting assembly is arranged on the fixed plate, and the pressing and limiting assembly is used to press and fix the sensor to be polished; the pressing and limiting assembly includes a positioning plate, an adjusting screw, a clamping plate and a pressure plate, wherein the positioning plate is arranged on the fixed plate; the adjusting screw is threadedly connected to the positioning plate; the clamping plate is movably arranged on the fixed plate; the pressure plate is arranged on the clamping plate; and the polishing assembly is arranged on the fixed plate.

[0007] In addition, the multi-dimensional sensor variable diameter inner and outer wall polishing device and method proposed in the application may also have the following additional technical features:

[0008] Specifically, the polishing assembly includes a driving component, a transmission shaft, a positioning substrate, a second driving component, a pressing mechanism, an outer sleeve, a buffer mechanism, a variable diameter polishing mechanism and a driven mechanism, wherein the driving component is arranged on the fixed plate; the transmission shaft is arranged at the output end of the driving component; the positioning substrate is arranged at the other end of the transmission shaft; the second driving component is arranged on the positioning substrate; the pressing mechanism is arranged on the positioning substrate; the outer sleeve is arranged on the positioning substrate; the buffer mechanism is arranged in the outer sleeve; the variable diameter polishing mechanism is movably arranged in the outer sleeve; one end of the driven mechanism is rotatably arranged on the second driving component, and the other end of the driven mechanism is rotatably arranged on the variable diameter polishing mechanism.

[0009] Specifically, the pressing mechanism includes a supporting seat, an adjusting component and a polishing component, wherein the supporting seat is arranged on the positioning substrate; the adjusting component is threadedly connected to the supporting seat; the polishing component is rotatably arranged on the adjusting component, and the polishing component is movably arranged in the outer sleeve.

[0010] Specifically, the buffer mechanism includes a buffer component and a movable shaft, wherein the buffer component is arranged in the outer sleeve; the movable shaft is movably arranged in the outer sleeve, and the buffer component is sleeved on the movable shaft.

[0011] Specifically, the variable diameter polishing mechanism includes a movable plate, a base, a telescopic part, an inner polishing part, a telescopic connection part 1, a telescopic connection part 2, a fastening plate, a lifting drive part and a positioning card plate, wherein the movable plate is movably arranged in the outer sleeve; the base is arranged on the movable plate; the telescopic part is arranged on the base; the inner polishing part is arranged on the telescopic part; one end of the telescopic connection part 1 is arranged on the base; one end of the telescopic connection part 2 is arranged on the telescopic part; the fastening plate is arranged at the other end of the telescopic connection part 2; the lifting drive part is arranged at the other end of the telescopic connection part 1, and the lifting drive part is connected to the fastening plate; the positioning card plate is movably arranged on the telescopic connection part 2.

[0012] Specifically, the telescopic member includes a hollow sleeve and a movable bracket, wherein the hollow sleeve is arranged on the base; and the movable bracket is movably arranged in the hollow sleeve.

[0013] Specifically, the lifting drive member includes an outer cover shell, a driving component three, a rotating screw, a driven component and a guide bracket, wherein the outer cover shell is arranged at the other end of the telescopic connecting component one; the driving component three is arranged on the outer cover shell; the rotating screw is arranged at the output end of the driving component three; the driven component is threadedly connected to the rotating screw; the guide bracket is divided into two groups, and the two groups of guide brackets are respectively arranged on the driven component.

[0014] Specifically, the driven mechanism includes a moving seat, a support rod and an axle seat, wherein the moving seat is arranged on the driving component 2; one end of the support rod is rotatably arranged on the moving seat; the axle seat is arranged on the movable plate, and the other end of the support rod is rotatably arranged on the axle seat.

[0015] Specifically, a polishing method of a multi-dimensional sensor variable diameter inner and outer wall polishing device comprises the following steps:

[0016] S1: The steps of installing the sensor to be polished are as follows: placing the multi-dimensional sensor to be polished on the support base, adjusting the pressing limit assembly on the fixed plate, and rotating the adjusting screw to drive the clamping plate to move downward, and in the process of the clamping plate moving downward, the pressing plate is driven to move downward so as to be pressed on the top wall of the sensor to fix the sensor;

[0017] S2: The steps of polishing the sensor are as follows: operating the driving component, the driving component drives the transmission shaft to rotate when operating, the transmission shaft drives the positioning substrate to rotate when operating, thereby rotating the positioning substrate and the outer sleeve, adjusting the pressing mechanism and then rotating the adjusting component, pushing the polishing component when the adjusting component is operating, so that the polishing component is moved out of the outer sleeve, and then the polishing component is attached to the inner wall of the sensor to be polished, and then operating the driving component 2, the driving component 2 drives the driven mechanism to open and close when operating, adjusts the position of the movable plate in the outer sleeve, so that the inner polishing component moves and fits on the inner wall of the sensor with a variable diameter, and the inner polishing component is driven by the driving component to polish the inner wall of the sensor with a variable diameter;

[0018] S3: The steps of making the inner polishing component close to and fit on the inner wall of the sensor variable diameter are as follows: operate the driving component 2, the driving component 2 pushes the driven mechanism to move downward, and the supporting rod is pushed to open and close during the downward movement of the movable seat, thereby driving the movable plate to open and close in the outer sleeve, and the movable plate slides in the inner wall of the outer sleeve through the base, thereby making the inner polishing component fit on the inner wall of the sensor variable diameter, and then in the process of polishing, operate the driving component 3, the operation of the driving component 3 drives the rotating screw to rotate, and the driven component is threadedly connected to the rotating screw and moves up and down, and when the driven component moves up and down, it drives the fastening plate and the telescopic connecting member 2 to move up and down synchronously through the guide bracket, thereby driving the telescopic member to move, thereby adjusting the height of the inner polishing component according to the inner diameter height of the sensor to be polished, and then comprehensively polishing the sensor.

[0019] Compared with the prior art, the variable diameter inner and outer wall polishing equipment and method of the multi-dimensional sensor of the present invention has the following advantages: the sensor is polished by polishing parts with variable spacing, and the inner walls of the sensor with different apertures are polished during the polishing process, thereby being suitable for a variety of inner diameters, reducing the number of times the polishing parts are replaced and improving the polishing efficiency.

[0020] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the following description of the embodiments in conjunction with the accompanying drawings, in which:

[0022] Figure 1 It is a structural schematic diagram of an embodiment of the present invention;

[0023] Figure 2 A schematic diagram of a sensor structure according to an embodiment of the present invention;

[0024] Figure 3 A schematic diagram of the structure of a polishing assembly according to an embodiment of the present invention;

[0025] Figure 4 The figure is a schematic diagram of the structure of a variable diameter polishing mechanism according to an embodiment of the present invention.

[0026] As shown in the figure: 10, support assembly; 101, support base; 102, fixed plate; 20, pressing limit assembly; 201, positioning plate; 202, adjusting screw; 203, clamping plate; 204, pressing plate; 30, polishing assembly; 301, driving component; 302, transmission shaft; 303, positioning base plate; 304, driving component 2; 305, pressing mechanism; 3051, support seat; 3052, adjusting component; 3053, polishing component; 306, outer sleeve; 307, buffer mechanism; 3071, buffer component; 3072, movable shaft; 308, variable diameter polishing mechanism ; 3081, movable plate; 3082, base; 3083, telescopic part; 30831, hollow sleeve; 30832, movable bracket; 3084, inner polishing part; 3085, telescopic connection part 1; 3086, telescopic connection part 2; 3087, fastening plate; 3088, lifting drive part; 30881, outer cover shell; 30882, drive part 3; 30883, rotating screw; 30884, driven part; 30885, guide bracket; 3089, positioning card plate; 309, driven mechanism; 3091, moving seat; 3092, support rod; 3093, shaft seat. DETAILED DESCRIPTION

[0027] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and are not to be construed as limitations of the present invention. On the contrary, embodiments of the present invention include all changes, modifications and equivalents that fall within the spirit and connotation of the appended claims.

[0028] The following describes the multi-dimensional sensor variable diameter inner and outer wall polishing equipment and method according to the embodiments of the present invention in conjunction with the accompanying drawings.

[0029] like Figure 1-4 As shown, the multi-dimensional sensor variable diameter inner and outer wall polishing device and method according to the embodiment of the present invention comprises a support assembly 10 , a pressing and limiting assembly 20 and a polishing assembly 30 .

[0030] The support assembly 10 includes a support base 101 and a fixing plate 102 .

[0031] The fixing plate 102 is disposed on the supporting base 101 .

[0032] It should be noted that the support base 101 described in this embodiment includes a fixed base and a movable base. The fixed base support is installed on a horizontal plane, and the movable base is detachably installed on the fixed base. The sensor 40 to be polished is placed on the movable base, and then the movable base is limitedly installed on the fixed base.

[0033] The pressing and limiting assembly 20 is disposed on the fixed plate 102 and is used to press and fix the sensor 40 to be polished. The pressing and limiting assembly 20 includes a positioning plate 201 , an adjusting screw 202 , a clamping plate 203 and a pressing plate 204 .

[0034] The positioning plate 201 is disposed on the fixed plate 102, and the adjusting screw 202 is threadedly connected to the positioning plate 201. The clamping plate 203 is movably disposed on the fixed plate 102, and the pressing plate 204 is disposed on the clamping plate 203.

[0035] It should be noted that a slider is provided on the clamping plate 203, and a slide groove is provided on the fixed plate 102. The slider slides in the slide groove to a limited position, so that the positioning plate 201 is limitedly moved up and down on the fixed plate 102, and the clamping plate 203 drives the pressure plate 204 to be pressed onto the sensor 40 to be polished.

[0036] Furthermore, the size of the pressing plate 204 is set according to the style and outer diameter of the sensor 40, and then the pressing plate 204 is limitedly pressed on the top wall of the outer shell of the sensor 40, and the sensor 40 is limitedly pressed on the top wall of the movable base.

[0037] The polishing assembly 30 is disposed on the fixed plate 102 and is used for polishing the sensor 40 .

[0038] It should be noted that a sensor 40 is also included, which includes an outer shell 401, an inner partition 402 and an inner partition layer 403, wherein the inner partition 402 is arranged on the inner wall of the outer shell 401 and located at the lower end of the inner cavity of the outer shell 401, and the inner partition layer 403 is limitedly installed on the inner partition 402.

[0039] Specifically, the steps for polishing the sensor 40 are as follows: the sensor 40 to be polished is limitedly mounted on a movable base, and then the sensor 40 to be processed is limitedly matched with the polishing assembly 30, and then the clamping plate 203 is adjusted to move on the fixed plate 102, and the clamping plate 203 is driven to move within the limit position on the fixed plate 102 by adjusting the screw 202, and then the pressure plate 204 is pressed on the top wall of the sensor 40 to press and limit the sensor 40, and then the sensor 40 is polished by the polishing assembly 30.

[0040] In one embodiment of the present invention, Figure 3As shown, the polishing assembly 30 includes a driving component 301, a transmission shaft 302, a positioning base plate 303, a second driving component 304, a pressing mechanism 305, an outer sleeve 306, a buffer mechanism 307, a variable diameter polishing mechanism 308 and a driven mechanism 309.

[0041] The driving component 301 is arranged on the fixed plate 102, the transmission shaft 302 is arranged at the output end of the driving component 301, and the positioning substrate 303 is arranged at the other end of the transmission shaft 302. The second driving component 304 is arranged on the positioning substrate 303, the pressing mechanism 305 is arranged on the positioning substrate 303, and the outer sleeve 306 is arranged on the positioning substrate 303. The buffer mechanism 307 is arranged in the outer sleeve 306, the variable diameter polishing mechanism 308 is movably arranged in the outer sleeve 306, one end of the driven mechanism 309 is rotatably arranged on the second driving component 304, and the other end of the driven mechanism 309 is rotatably arranged on the variable diameter polishing mechanism 308.

[0042] It should be noted that the driving component 301 is a stepper motor, which drives the positioning substrate 303 to rotate and then drives the outer sleeve 306 to rotate. The driving component 2 304 is a hydraulic cylinder, which is connected to the control switch and the power supply to operate the driving component 2 304, thereby pushing the driven mechanism 309 to open and close, and driving the variable diameter polishing mechanism 308 to move in the outer sleeve 306, and polishing the outer sleeve 306 through the variable diameter polishing mechanism 308. When the driving component 2 304 is running, the buffer mechanism 307 pushes the buffer mechanism 307 downward, thereby adjusting the telescopic adjustment of the buffer mechanism 307 according to the size of the sensor 40, and then adjusting the height of the outer sleeve 306. The pressing mechanism 305 is adjusted on the outer sleeve 306, so that the pressing mechanism 305 is close to the inner wall of the sensor 40, and then the sensor 40 is polished. The variable diameter polishing mechanism 308 polishes the inner wall of the sensor with variable diameter.

[0043] In one embodiment of the present invention, Figure 3 As shown, the pressing mechanism 305 includes a supporting seat 3051 , an adjusting component 3052 and a polishing component 3053 .

[0044] The support seat 3051 is disposed on the positioning substrate 303 , the adjusting component 3052 is threadedly connected to the support seat 3051 , the polishing component 3053 is rotatably disposed on the adjusting component 3052 , and the polishing component 3053 is movably disposed in the outer sleeve 306 .

[0045] It should be noted that an internal thread plate is provided on the support seat 3051, and the adjusting component 3052 is a screw, which is threadedly adjusted on the internal thread plate. The adjusting component 3052 and the polishing component 3053 are connected to each other through a pin shaft, and the polishing component 3053 is a polishing grinding plate.

[0046] In one embodiment of the present invention, Figure 3 As shown, the buffer mechanism 307 includes a buffer component 3071 and a movable shaft 3072 .

[0047] The buffer component 3071 is disposed in the outer sleeve 306 , the movable shaft 3072 is movably disposed in the outer sleeve 306 , and the buffer component 3071 is sleeved on the movable shaft 3072 .

[0048] It should be noted that the buffer component 3071 is a buffer spring, and the movable shaft 3072 telescopically moves in the outer sleeve 306, and then extends the height of the outer sleeve 306, and is adjusted according to the height of the sensor to be polished.

[0049] In one embodiment of the present invention, Figure 4 As shown, the variable diameter polishing mechanism 308 includes a movable plate 3081, a base 3082, a telescopic member 3083, an inner polishing member 3084, a telescopic connecting member 1 3085, a telescopic connecting member 2 3086, a fastening plate 3087, a lifting drive member 3088 and a positioning card plate 3089.

[0050] Among them, the movable plate 3081 is movably arranged in the outer sleeve 306, the base 3082 is arranged on the movable plate 3081, and the telescopic member 3083 is arranged on the base 3082. The inner polishing component 3084 is arranged on the telescopic member 3083, one end of the telescopic connecting member 1 3085 is arranged on the base 3082, and one end of the telescopic connecting member 2 3086 is arranged on the telescopic member 3083. The fastening plate 3087 is arranged at the other end of the telescopic connecting member 2 3086, the lifting driving member 3088 is arranged at the other end of the telescopic connecting member 1 3085, and the lifting driving member 3088 is connected to the fastening plate 3087, the positioning card plate 3089 is movably arranged on the telescopic connecting member 2 3086, and the guide bracket 30885 is connected to the positioning card plate 3089.

[0051] It should be noted that a slide bar is provided on the base 3082, and a through slot is provided on the bottom wall of the outer sleeve 306, and an inner concave slot is provided on the inner wall of the through slot, and the slide bar slides in the inner concave slot, so that the base 3082 slides in the outer sleeve 306. The inner polishing component 3084 is an inner polishing plate, and the inner wall of the sensor variable diameter is polished by the inner polishing component 3084. The telescopic connection member 1 3085 and the telescopic connection member 2 3086 are telescopically movable and adjusted, and when the driven mechanism 309 moves, the variable diameter polishing mechanism 308 is driven to open and move in the outer sleeve 306.

[0052] In one embodiment of the present invention, Figure 4 As shown, the telescopic member 3083 includes a hollow sleeve 30831 and a movable bracket 30832 .

[0053] The hollow sleeve 30831 is disposed on the base 3082 , and the movable bracket 30832 is movably disposed in the hollow sleeve 30831 .

[0054] It should be noted that the movable bracket 30832 is telescopically moved and adjusted in the hollow sleeve 30831, and the movable bracket 30832 moves and adjusts the movement of the internal polishing component 3084.

[0055] In one embodiment of the present invention, Figure 4 As shown, the lifting drive component 3088 includes an outer cover shell 30881, a driving component 30882, a rotating screw 30883, a driven component 30884 and a guide bracket 30885.

[0056] The outer cover shell 30881 is arranged at the other end of the telescopic connector 1 3085, the driving component 30882 is arranged on the outer cover shell 30881, and the rotating screw 30883 is arranged at the output end of the driving component 30882. The driven component 30884 is threadedly connected to the rotating screw 30883, and the guide brackets 30885 are divided into two groups, and the two groups of guide brackets 30885 are respectively arranged on the driven component 30884.

[0057] It should be noted that the driving component three 30882 described in this embodiment is a servo motor, which is operated by controlling the switch and the power supply. When the driving component three 30882 is in operation, it drives the rotating screw 30883 to rotate, and the driven component 30884 is threadedly connected to the rotating screw 30883. Then, the driven component 30884 moves up and down on the rotating screw 30883, and during the movement, the positioning clamp 3089 is synchronously driven to move through the guide bracket 30885.

[0058] In one embodiment of the present invention, Figure 4 As shown, the driven mechanism 309 includes a moving seat 3091 , a support rod 3092 and an axle seat 3093 .

[0059] Among them, the moving seat 3091 is set on the driving component 304, one end of the support rod 3092 is rotatably set on the moving seat 3091, the shaft seat 3093 is set on the movable plate 3081, and the other end of the support rod 3092 is rotatably set on the shaft seat 3093.

[0060] It should be noted that, when the driving component 2 304 is running, the support rod 3092 pushes the movable plate 3081 to slide within the outer sleeve 306 in a limited position.

[0061] In one embodiment of the present invention, Figure 1-4 As shown, a polishing method of a multi-dimensional sensor 40 variable diameter inner and outer wall polishing device comprises the following steps:

[0062] S1: The steps of installing the sensor 40 to be polished are as follows: placing the multi-dimensional sensor 40 to be polished on the supporting base 101, adjusting the pressing limit assembly 20 on the fixed plate 102, and rotating the adjusting screw 202 to drive the clamping plate 203 to move downward, and in the process of the clamping plate 203 moving downward, the pressing plate 204 is driven to move downward so as to be pressed on the top wall of the sensor 40, thereby fixing the sensor 40;

[0063] S2: The steps of polishing the sensor 40 are as follows: operate the driving component 301, the driving component 301 drives the transmission shaft 302 to rotate when it is running, the transmission shaft 302 drives the positioning substrate 303 to rotate when it is running, thereby rotating the positioning substrate 303 and the outer sleeve 306, adjusting the pressing mechanism 305 to rotate the adjusting component 3052, the adjusting component 3052 pushes the polishing component 3053 when it is running, so that the polishing component 3053 moves out of the outer sleeve 306, and then the polishing component 3053 fits on the inner wall of the sensor 40 to be polished, and then the driving component 304 is operated, and the driving component 304 drives the driven mechanism 309 to open and close when it is running, and adjusts the position of the movable plate 3081 in the outer sleeve 306, so that the inner polishing component 3084 moves and fits on the inner wall of the sensor 40 with the change in diameter, and the inner polishing component 3084 is driven by the driving component 301 to polish the inner wall of the sensor 40 with the change in diameter;

[0064] S3: The steps of making the inner polishing component 3084 approach and fit the inner wall of the sensor 40 are as follows: operating the second driving component 304, the second driving component 304 pushes the driven mechanism 309 to move downward, and the moving seat 3091 pushes the support rod 3092 to open and close during the downward movement, thereby driving the movable plate 3081 to open and close in the outer sleeve 306, and the movable plate 3081 slides in the inner wall of the outer sleeve 306 through the base 3082, thereby making the inner polishing component 3084 fit the inner wall of the sensor 40, and then in the polishing process, operating Driving component three 30882, the operation of driving component three 30882 drives the rotating screw 30883 to rotate, and the driven component 30884 is threadedly connected to the rotating screw 30883 and moves up and down. When the driven component 30884 moves up and down, it drives the fastening plate 3087 and the telescopic connecting member 2 3086 to move up and down through the guide bracket 30885, and then drives the telescopic member 3083 to move, thereby adjusting the height of the inner polishing component 3084 according to the inner diameter height of the sensor 40 to be polished, and then comprehensively polishing the sensor 40.

[0065] In summary, the multi-dimensional sensor variable diameter inner and outer wall polishing equipment and method of the embodiments of the present invention use polishing parts with variable spacing to polish the sensor. During the polishing process, the inner walls of the sensor with different apertures are polished, thereby being suitable for a variety of inner diameters, reducing the number of times the polishing parts are replaced and improving the polishing efficiency.

[0066] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and deform the above embodiments within the scope of the present invention.

Claims

1. A multi-dimensional sensor variable diameter inner and outer wall polishing device, characterized in that: It comprises a supporting assembly (10), a pressing and limiting assembly (20) and a polishing assembly (30), wherein: The support assembly (10) comprises a support base (101) and a fixed plate (102), wherein: The fixed plate (102) is arranged on the supporting base (101); The pressing and limiting assembly (20) is arranged on the fixing plate (102), and the pressing and limiting assembly (20) is used to press and fix the sensor to be polished; The pressing and limiting assembly (20) comprises a positioning plate (201), an adjusting screw (202), a clamping plate (203) and a pressing plate (204), wherein: The positioning plate (201) is arranged on the fixing plate (102); The adjusting screw (202) is threadedly connected to the positioning plate (201); The clamping plate (203) is movably arranged on the fixed plate (102); The pressing plate (204) is arranged on the clamping plate (203); The polishing assembly (30) is arranged on the fixed plate (102), and the polishing assembly (30) is used to perform polishing processing on the sensor.

2. The multi-dimensional sensor variable diameter inner and outer wall polishing equipment according to claim 1 is characterized in that: The polishing assembly (30) comprises a driving component (301), a transmission shaft (302), a positioning base plate (303), a second driving component (304), a material pressing mechanism (305), an outer sleeve (306), a buffer mechanism (307), a variable diameter polishing mechanism (308) and a driven mechanism (309), wherein: The driving component (301) is arranged on the fixed plate (102); The transmission shaft (302) is arranged at the output end of the driving component (301); The positioning substrate (303) is arranged at the other end of the transmission shaft (302); The second driving component (304) is arranged on the positioning substrate (303); The material pressing mechanism (305) is arranged on the positioning substrate (303); The outer sleeve (306) is arranged on the positioning substrate (303); The buffer mechanism (307) is arranged inside the outer sleeve (306); The variable diameter polishing mechanism (308) is movably disposed in the outer sleeve (306); One end of the driven mechanism (309) is rotatably disposed on the second driving component (304), and the other end of the driven mechanism (309) is rotatably disposed on the variable diameter polishing mechanism (308).

3. The multi-dimensional sensor variable diameter inner and outer wall polishing device according to claim 2 is characterized in that: The material pressing mechanism (305) comprises a support seat (3051), an adjusting component (3052) and a polishing component (3053), wherein: The support seat (3051) is arranged on the positioning substrate (303); The adjusting component (3052) is threadedly connected to the supporting seat (3051); The polishing component (3053) is rotatably disposed on the adjusting component (3052), and the polishing component (3053) is movably disposed within the outer sleeve (306).

4. The multi-dimensional sensor variable diameter inner and outer wall polishing device according to claim 2 is characterized in that: The buffer mechanism (307) comprises a buffer component (3071) and a movable shaft (3072), wherein: The buffer component (3071) is arranged inside the outer sleeve (306); The movable shaft (3072) is movably disposed in the outer sleeve (306), and the buffer component (3071) is sleeved on the movable shaft (3072).

5. The multi-dimensional sensor variable diameter inner and outer wall polishing device according to claim 2, characterized in that: The variable diameter polishing mechanism (308) comprises a movable plate (3081), a base (3082), a telescopic member (3083), an inner polishing member (3084), a telescopic connecting member 1 (3085), a telescopic connecting member 2 (3086), a fastening plate (3087), a lifting driving member (3088) and a positioning clamping plate (3089), wherein: The movable plate (3081) is movably disposed in the outer sleeve (306); The base (3082) is arranged on the movable plate (3081); The telescopic member (3083) is arranged on the base (3082); The inner polishing component (3084) is arranged on the telescopic component (3083); One end of the telescopic connecting member 1 (3085) is disposed on the base (3082); One end of the second telescopic connecting member (3086) is arranged on the telescopic member (3083); The fastening plate (3087) is arranged at the other end of the second telescopic connecting member (3086); The lifting drive member (3088) is arranged at the other end of the telescopic connecting member (3085), and the lifting drive member (3088) is connected to the fastening plate (3087); The positioning card plate (3089) is movably arranged on the second telescopic connecting member (3086).

6. The multi-dimensional sensor variable diameter inner and outer wall polishing device according to claim 5, characterized in that: The telescopic member (3083) includes a hollow sleeve (30831) and a movable bracket (30832), wherein: The hollow sleeve (30831) is arranged on the base (3082); The movable bracket (30832) is movably disposed in the hollow sleeve (30831).

7. The multi-dimensional sensor variable diameter inner and outer wall polishing device according to claim 5, characterized in that: The lifting drive member (3088) includes an outer cover shell (30881), a driving member three (30882), a rotating screw (30883), a driven member (30884) and a guide bracket (30885), wherein: The outer cover shell (30881) is arranged at the other end of the telescopic connecting member 1 (3085); The driving component three (30882) is arranged on the outer cover shell (30881); The rotating screw (30883) is arranged at the output end of the driving component three (30882); The driven component (30884) is threadedly connected to the rotating screw (30883); The guide brackets (30885) are divided into two groups, and the two groups of guide brackets (30885) are respectively arranged on the driven component (30884).

8. The multi-dimensional sensor variable diameter inner and outer wall polishing device according to claim 5, characterized in that: The driven mechanism (309) comprises a moving seat (3091), a support rod (3092) and an axle seat (3093), wherein: The movable seat (3091) is arranged on the second driving component (304); One end of the support rod (3092) is rotatably disposed on the movable seat (3091); The shaft seat (3093) is arranged on the movable plate (3081), and the other end of the support rod (3092) is rotatably arranged on the shaft seat (3093).

9. The polishing method of the multi-dimensional sensor variable diameter inner and outer wall polishing device according to any one of claims 1 to 8, characterized in that: The method comprises the following steps: S1: The steps of installing the sensor to be polished are as follows: placing the multi-dimensional sensor to be polished on the support base (101), adjusting the pressing limit assembly (20) on the fixed plate (102), rotating the adjusting screw (202) to drive the clamping plate (203) to move downward, and in the process of the clamping plate (203) moving downward, driving the pressing plate (204) to move downward so as to be pressed on the top wall of the sensor, thereby fixing the sensor; S2: The step of polishing the sensor is as follows: operating the driving component (301), wherein the driving component (301) drives the transmission shaft (302) to rotate, and the transmission shaft (302) drives the positioning substrate (303) to rotate, thereby rotating the positioning substrate (303) and the outer sleeve (306), adjusting the pressing mechanism (305) and then rotating the adjusting component (3052), and when the adjusting component (3052) is in operation, it pushes the polishing component (3053), so that the polishing component (3053) is moved from the outer sleeve (306). The inner polishing component (3084) is moved out of the sleeve (306), so that the polishing component (3053) is attached to the inner wall of the sensor to be polished, and then the driving component (304) is operated. When the driving component (304) is operated, it drives the driven mechanism (309) to open and close, and adjusts the position of the movable plate (3081) in the outer sleeve (306), so that the inner polishing component (3084) moves and attaches to the inner wall of the sensor with a variable diameter, and the inner polishing component (3084) is driven by the driving component (301) to polish the inner wall of the sensor with a variable diameter; S3: The steps of making the inner polishing component (3084) approach and fit against the inner wall of the sensor variable diameter are as follows: operating the second driving component (304), the second driving component (304) pushes the driven mechanism (309) to move downward, and the supporting rod (3092) is pushed to open and close during the downward movement of the movable seat (3091), thereby driving the movable plate (3081) to open and close in the outer sleeve (306), and the movable plate (3081) slides in the inner wall of the outer sleeve (306) through the base (3082), thereby making the inner polishing component (3084) fit against the inner wall of the sensor variable diameter, and then in the polishing process, operating The driving component three (30882) is driven to rotate the rotating screw (30883), and the driven component (30884) is threadedly connected to the rotating screw (30883) to move up and down. When the driven component (30884) moves up and down, it drives the fastening plate (3087) and the telescopic connecting member 2 (3086) to move up and down through the guide bracket (30885), thereby driving the telescopic member (3083) to move, thereby adjusting the height of the inner polishing component (3084) according to the inner diameter height of the sensor to be polished, and then comprehensively polishing the sensor.

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