Manufacturing method of vapor chamber heat dissipation assembly

Abstract

The invention relates to a manufacturing method of a vapor chamber heat dissipation assembly, which comprises the following steps: S1, a heat dissipation part, a cover plate and a capillary structure are manufactured and molded, and the heat dissipation part is provided with a vapor chamber; s2, fixing the capillary structure in a uniform temperature tank; s3, working liquid is injected into the temperature equalizing groove of the heat dissipation component in the vacuum environment; and S4, the cover plate and the heat dissipation part are fixed in a vacuum environment, and meanwhile, the cover plate covers the temperature equalization groove to form a temperature equalization cavity. The manufacturing method has the advantages that the manufacturing quality of the vapor chamber heat dissipation assembly can be improved, and the manufacturing difficulty of the vapor chamber heat dissipation assembly can also be reduced.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation devices, and in particular to a method for manufacturing a heat dissipation assembly of a temperature vapor chamber. Background Art

[0002] In recent years, the continuous development of microelectronics integration technology has led to a sharp increase in the heat generation of electronic products, and now electronic products are required to be thin and light. Therefore, when electronic products are running, a large amount of heat will be generated in a small area to form heat accumulation. Long-term heat accumulation will cause damage to the core equipment of electronic products and affect the life of electronic products. Vapor Chamber is a high-efficiency thermal conductive element filled with phase-changeable fluid. It can achieve the purpose of rapid heat transfer and temperature uniformity through the cyclic phase change process of the liquid working fluid inside, and has the characteristics of lightweight. At present, ultra-thin vapor chambers have been widely used in the heat dissipation of electronic products.

[0003] In the related technology, the temperature equalizer heat dissipation module includes a temperature equalizer and a heat dissipation component, wherein the temperature equalizer includes an upper cover, a lower cover and a capillary structure, and the heat dissipation component is a component in an electronic product, and the heat dissipation component includes but is not limited to a mobile phone middle frame, a heat dissipation substrate and heat dissipation fins. During the manufacturing process, the temperature equalizer is first manufactured and formed, and then the temperature equalizer is welded and fixed to the heat dissipation component.

[0004] Regarding the above-mentioned related technologies, there is a problem that, first, during the process of the temperature equalizer monomer, the heat generated during the heat treatment process will cause the temperature equalizer to bend to a certain extent, which will affect the subsequent assembly of the temperature equalizer and the heat dissipation component, thereby increasing the contact thermal resistance between the temperature equalizer and the heat dissipation component; second, during the welding and assembly process of the temperature equalizer and the heat dissipation component, it is necessary to use a clamp to apply pressure to the temperature equalizer to prevent the temperature equalizer from expanding due to heat, which will make the manufacturing process of the temperature equalizer heat dissipation assembly more cumbersome. Summary of the invention

[0005] In order to improve the manufacturing quality of a temperature vapor chamber heat dissipation assembly and reduce the manufacturing difficulty of the temperature vapor chamber heat dissipation assembly, the present application provides a manufacturing method of a temperature vapor chamber heat dissipation assembly.

[0006] The present application provides a method for manufacturing a heat spreader heat dissipation assembly using the following technical solution: A method for manufacturing a temperature vapor chamber heat dissipation assembly, comprising: S1, manufacturing a heat dissipation component, a cover plate and a capillary structure, wherein the heat dissipation component is provided with a temperature equalizing tank; S2, fixing the capillary structure in a temperature bath; S3, injecting working liquid into the temperature-averaging tank of the heat dissipation component under a vacuum environment; S4. Fix the cover plate and the heat dissipation component under a vacuum environment, and the cover plate covers the temperature-averaging groove to form a temperature-averaging cavity.

[0007] By adopting the above technical scheme, since the heat dissipation component is provided with a temperature equalizing groove, the area where the temperature equalizing groove is located on the heat dissipation component can be used as another cover plate of the temperature equalizing plate. After the heat dissipation component and the cover plate are fixed, the two processes of forming the temperature equalizing plate and fixing the temperature equalizing plate on the heat dissipation component are completed. Therefore, there is no process of separately welding and fixing the temperature equalizing plate and the heat dissipation component together. In summary, firstly, the flatness requirement for the temperature equalizing plate before welding is avoided. Secondly, the high contact thermal resistance between the temperature equalizing plate and the heat dissipation component is avoided. Thirdly, the phenomenon of the temperature equalizing plate expanding due to heat during the welding process is avoided, thereby improving the manufacturing quality of the temperature equalizing plate heat dissipation assembly and reducing the manufacturing difficulty of the temperature equalizing plate heat dissipation assembly. Fourthly, there is no need to plan a separate area for the temperature equalizing plate on the heat dissipation component, so it is helpful to stack the heat dissipation devices.

[0008] Preferably, in S4, the cover plate and the heat dissipation component are fixed by gluing.

[0009] By adopting the above technical solution, the cover plate and the heat dissipation component are fixed by bonding, which will definitely prevent the cover plate from thermal deformation. At the same time, the fixing process is also relatively simple, thereby making the manufacturing process simpler while meeting quality requirements.

[0010] Preferably, in S4, laser welding is used to fix the cover plate and the heat dissipation component.

[0011] By adopting the above technical solution and using laser welding, an instant welding method, the reliability and life of the product can be improved while preventing the working liquid from evaporating during the welding process.

[0012] Preferably, in S1, the temperature-averaging tanks are distributed in a special shape, a plurality of cover plates are provided, and each cover plate is in a non-bending prism structure.

[0013] By adopting the above technical solution, it is only necessary to open a corresponding temperature-averaging groove on the heat dissipation component, and at the same time, cooperate with multiple cover plates of different specifications, so as to produce a heat dissipation component with an irregular distribution of temperature-averaging cavities through simpler processes and lower production costs.

[0014] Preferably, in S1, a plurality of temperature-averaging tanks are provided, the plurality of temperature-averaging tanks are not interconnected, the centers of the plurality of temperature-averaging tanks are not on the same straight line, and one temperature-averaging tank corresponds to one cover plate.

[0015] By adopting the above technical solution, while satisfying the requirement of irregular distribution of the heat dissipation structure, each temperature-averaging tank can be made into a rectangular shape, and the cover plate can also be made into a rectangular shape, and the cover plate only needs to consider completely covering and sealing one temperature-averaging tank, thereby making it easier to produce a heat dissipation component with irregular distribution of the temperature-averaging cavity.

[0016] Preferably, in S1, one temperature-averaging tank is provided, and the temperature-averaging tank is distributed in a continuous bending extension.

[0017] By adopting the above technical solution, while satisfying the requirement of the heat dissipation structure being distributed in an irregular shape, the range occupied by the heat dissipation structure can be reduced, thereby making a heat dissipation component with a smaller volume and an irregular distribution of the temperature-averaging cavity.

[0018] Preferably, in S4, after the cover plate and the heat dissipation component are fixed, a supplementary plate is firstly attached to the joint between two adjacent cover plates, and then welding is performed on the joint between the supplementary plate and the cover plate.

[0019] By adopting the above technical solution, since the temperature-averaging trough is continuously bent and extended, there must be joints between multiple cover plates. Therefore, the setting of the supplementary plate can appropriately reduce the splicing accuracy between the cover plates while maintaining the splicing sealing between the cover plates, thereby maintaining the sealing of the temperature-averaging chamber.

[0020] Preferably, in S4, the joint between two adjacent cover plates is fixed by a sealant.

[0021] By adopting the above technical solution, a stable connection and a sealed connection between two adjacent cover plates can be achieved in a simpler way.

[0022] Preferably, in S4, at the joint between two adjacent cover plates, one of the cover plates is provided with a plug-in block, and the other adjacent cover plate is provided with a plug-in groove for embedding the plug-in block.

[0023] By adopting the above technical solution, the joint between two adjacent cover plates is in an overlapping and embedded structure, and the overlapping and embedded parts can be directly welded, thereby improving the joint sealing between the cover plates without the need for additional components.

[0024] Preferably, in S4, the joint between two adjacent cover plates is in a toothed meshing structure, and the toothed meshing structure extends and distributes along the jointing track.

[0025] By adopting the above technical solution, two adjacent cover plates can be positioned relative to each other, so that relative sliding between the two adjacent cover plates along the joint can be limited, thereby improving the installation accuracy of the cover plates on the heat dissipation components and the splicing accuracy between the cover plates.

[0026] In summary, the present application includes at least one of the following beneficial technical effects: 1. Since the heat dissipation component has a temperature equalizing groove, the area where the temperature equalizing groove is located on the heat dissipation component can be used as another cover plate of the temperature equalizing plate. After the heat dissipation component and the cover plate are fixed, the two processes of forming the temperature equalizing plate and fixing the temperature equalizing plate on the heat dissipation component are completed. Therefore, there is no process of separately welding and fixing the temperature equalizing plate and the heat dissipation component together. In summary, firstly, the flatness requirement for the temperature equalizing plate before welding is avoided. Secondly, the high contact thermal resistance between the temperature equalizing plate and the heat dissipation component is avoided. Thirdly, the phenomenon of the temperature equalizing plate expanding due to heat during the welding process is avoided, thereby improving the manufacturing quality of the temperature equalizing plate heat dissipation component and reducing the manufacturing difficulty of the temperature equalizing plate heat dissipation component. Fourthly, there is no need to plan a separate area for the temperature equalizing plate on the heat dissipation component, so it is helpful for stacking heat dissipation devices. 2. While satisfying the requirement of the heat dissipation structure being a heterogeneous distribution, each temperature trough can be made into a rectangular parallelepiped shape, and the cover plate can also be made into a rectangular parallelepiped shape, and the cover plate only needs to consider completely covering and sealing one temperature trough, thereby making it easier to make a heat dissipation component with a heterogeneous distribution of the temperature cavities; 3. While satisfying the requirement of the heat dissipation structure being a heterogeneous distribution, the range occupied by the heat dissipation structure can be reduced, thereby making a heat dissipation component with a smaller volume and a heterogeneous distribution of the temperature-averaging cavity. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic diagram of the structure of the temperature equalizer heat dissipation assembly in the embodiment of the present application.

[0028] Figure 2 It is a schematic diagram made to illustrate the matching structure between the supplementary plate and the cover plate in the embodiment of the present application.

[0029] Figure 3 It is a schematic diagram for illustrating the plug-in blocks and plug-in slots between the cover plates in the embodiment of the present application.

[0030] Figure 4 This is a schematic diagram for illustrating the toothed meshing structure between the cover plates in the embodiment of the present application.

[0031] Explanation of the reference numerals: 1. heat dissipation component; 2. cover plate; 3. capillary structure; 4. temperature equalizing tank; 5. supplementary plate; 6. plug-in block; 7. plug-in through slot. DETAILED DESCRIPTION

[0032] The following is combined with Figure 1-4 This application is described in further detail.

[0033] The embodiment of the present application discloses a method for manufacturing a temperature vapor chamber heat dissipation assembly.

[0034] Reference Figure 1 The method for manufacturing a heat spreader assembly comprises the following steps: S1, forming a heat dissipation component 1, a cover plate 2 and a capillary structure 3, wherein the heat dissipation component 1 is provided with a temperature equalizing tank 4; S2, fixing the capillary structure 3 in the temperature-equalizing bath 4; S3, injecting working liquid into the temperature-averaging tank 4 of the heat dissipation component 1 under a vacuum environment; S4. Fix the cover plate 2 and the heat dissipation component 1 under a vacuum environment, and at the same time, the cover plate 2 covers the temperature-averaging tank 4 to form a temperature-averaging cavity.

[0035] In summary, because the heat dissipation component 1 has a temperature equalizing groove 4, the area where the temperature equalizing groove 4 is located on the heat dissipation component 1 can be used as another cover plate 2 of the temperature equalizing plate. After the completion of step S4, the two processes of forming the temperature equalizing plate and fixing the temperature equalizing plate on the heat dissipation component 1 are also completed at the same time. There is no process of welding and fixing the temperature equalizing plate and the heat dissipation component 1 together separately. Therefore, this process has the following advantages in achieving forming. First, it avoids the flatness requirement for the temperature equalizing plate before welding. Second, it avoids the situation where the contact thermal resistance between the temperature equalizing plate and the heat dissipation component 1 is high. Third, it avoids the phenomenon of thermal expansion of the temperature equalizing plate during welding, thereby improving the manufacturing quality of the temperature equalizing plate heat dissipation assembly and reducing the manufacturing difficulty of the temperature equalizing plate heat dissipation assembly. Fourth, there is no need to plan a separate area for the temperature equalizing plate on the heat dissipation component 1, so it is helpful for stacking heat dissipation devices.

[0036] In step S1, the heat dissipation component 1 and the cover plate 2 are processed into target shapes by stamping, etching, forging and CNC machining, wherein the shape changes of the heat dissipation component 1 mainly include size specifications and the structural form of the temperature equalizing tank 4, and the shape changes of the cover plate 2 mainly include size specifications and whether there is a temperature equalizing tank 4 on the cover plate 2. These changes will not affect the difficulty of processing and forming, which is mainly determined by product requirements. For example, when the temperature equalizing chamber on the heat dissipation component is not a standard rectangular structure, that is, the temperature equalizing chamber is distributed in an irregular shape, the temperature equalizing tank 4 on the heat dissipation component 1 is also distributed in an irregular shape, but at this time, a plurality of cover plates 2 will be provided, and each cover plate 2 is a non-bending prism structure, so that a heat dissipation component with an irregular distribution of the temperature equalizing chamber can be made through a simpler process.

[0037] There are two types of special-shaped distribution modes of the temperature-averaging tank 4. First, a plurality of temperature-averaging tanks 4 are provided, and the plurality of temperature-averaging tanks 4 are not interconnected, and the centers of the plurality of temperature-averaging tanks 4 are not on the same straight line. One temperature-averaging tank 4 corresponds to one cover plate 2. Specifically, each temperature-averaging tank 4 may be in a standard rectangular parallelepiped shape, and the centers of the plurality of temperature-averaging tanks 4 may be evenly distributed in a circle around the centroid of the heat dissipation component 1. The cover plate 2 may be in a standard rectangular parallelepiped shape, so that a heat dissipation component with a plurality of temperature-averaging chambers can be made, and the production cost does not increase significantly. Second, refer to Figure 2 There is only one temperature-averaging tank 4, but the temperature-averaging tank 4 is distributed in a continuous bending extension, and multiple cover plates 2 are combined together to cover the notch of the temperature-averaging tank 4. Specifically, the temperature-averaging tank 4 can be in a U-shaped bending shape, and the cover plate 2 can be a standard rectangular parallelepiped shape, and then multiple cover plates 2 respectively cover a part of the temperature-averaging tank 4, and the chamber of each part is in a rectangular parallelepiped shape, so a heat dissipation component with a special-shaped temperature-averaging cavity can be made, and this type of heat dissipation component can be made by a smaller heat dissipation component 1.

[0038] In summary, by means of a construction method in which a portion of the heat dissipation component 1 is a temperature equalizing plate and one of the cover plates 2 is formed, a temperature equalizing chamber with a special structural form can be made, and at the same time, the production cost and the production difficulty will not be significantly increased.

[0039] In step S2, the capillary structure 3 may be installed only in the temperature equalizing groove 4 of the heat dissipation component 1 or in the temperature equalizing groove 4 of the cover plate 2 according to different actual product requirements, or the capillary structure 3 may be installed in both the temperature equalizing groove 4 of the heat dissipation component 1 and the temperature equalizing groove 4 of the cover plate 2.

[0040] In step S4, gluing or laser welding can be selected to implement it. The gluing method is simpler and easier to implement, while the welding method can make the product more reliable and have a longer life. In addition, in this step, it is also important to pay attention to how to make the cover plate 2 completely seal and cover the temperature-averaging tank 4. If there is only one or more temperature-averaging tanks 4 that are not connected to each other, the cover plate 2 only needs to be accurately aligned with the temperature-averaging tank 4 to achieve the goal of making the cover plate 2 completely seal and cover the temperature-averaging tank 4.

[0041] If there is only one temperature-averaging tank 4, but it is distributed in a continuous bending and extension manner, the joint sealing between two adjacent cover plates 2 needs to be considered. Therefore, there are usually several treatment methods: first, refer to Figure 2 After the cover plate 2 is fixed to the heat dissipation component 1, a supplementary plate 5 is first attached to the joint between two adjacent cover plates 2, and then welding is performed on the joint between the supplementary plate 5 and the cover plate 2. With such a matching structure, even if the splicing accuracy between the cover plates 2 is slightly poor, the supplementary plate 5 can be used to make up for the splicing sealing between the cover plates 2, thereby maintaining the sealing of the temperature-averaging chamber.

[0042] Secondly, the joints between two adjacent cover plates 2 are fixed by means of sealant, wherein the sealant may be selected to have stronger waterproof sealing properties, so that a firm connection and a sealed connection between two adjacent cover plates 2 can be achieved in a simpler way.

[0043] Third, refer to Figure 3In the joint between two adjacent cover plates 2, one of the cover plates 2 is provided with a plug-in block 6, and the other adjacent cover plate 2 is provided with a plug-in groove 7 for the plug-in block 6 to be embedded. Therefore, the joint between the two adjacent cover plates 2 will be an overlapping embedded structure, and the overlapping embedded parts can be directly welded later, so there is no need to add additional components and the splicing sealing between the cover plates 2 can be improved.

[0044] Fourth, refer to Figure 4 The joint between two adjacent cover plates 2 is a toothed meshing structure, and the toothed meshing structure extends along the jointing track, so that the two adjacent cover plates 2 can be positioned relative to each other, so that the relative sliding between the two adjacent cover plates 2 along the joint can be limited, thereby improving the installation accuracy of the cover plates 2 on the heat dissipation component 1, and the splicing accuracy between the cover plates 2, thereby improving the splicing sealing between the cover plates 2. In addition, it should be noted that the toothed meshing structure cannot be used in conjunction with the aforementioned overlapping embedded structure.

[0045] The implementation principle of a method for manufacturing a temperature equalizing plate heat dissipation assembly in an embodiment of the present application is as follows: since a temperature equalizing groove 4 is provided on the heat dissipation component 1, the area where the temperature equalizing groove 4 is located on the heat dissipation component 1 can be used as another cover plate 2 of the temperature equalizing plate. After the heat dissipation component 1 and the cover plate 2 are fixed, the two processes of forming the temperature equalizing plate and fixing the temperature equalizing plate on the heat dissipation component 1 are completed. Therefore, there is no process of separately welding and fixing the temperature equalizing plate and the heat dissipation component 1 together. In summary, firstly, the flatness requirement for the temperature equalizing plate before welding is avoided. Secondly, the high contact thermal resistance between the temperature equalizing plate and the heat dissipation component 1 is avoided. Thirdly, the phenomenon of the temperature equalizing plate expanding due to heat during the welding process is avoided, thereby improving the manufacturing quality of the temperature equalizing plate heat dissipation assembly and reducing the manufacturing difficulty of the temperature equalizing plate heat dissipation assembly. Fourthly, there is no need to plan a separate area for the temperature equalizing plate on the heat dissipation component 1, so it is helpful to stack the heat dissipation devices.

[0046] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A method for manufacturing a temperature vapor chamber heat dissipation assembly, characterized in that: The following steps are involved: S1, manufacturing a heat dissipation component (1), a cover plate (2), and a capillary structure (3), wherein the heat dissipation component (1) is provided with a temperature equalizing tank (4); S2, fixing the capillary structure (3) in a temperature-equalizing bath (4); S3, injecting working liquid into the temperature-averaging tank (4) of the heat dissipation component (1) under a vacuum environment; S4. Fixing the cover plate (2) and the heat dissipation component (1) under a vacuum environment, and at the same time, the cover plate (2) covers the temperature-averaging groove (4) to form a temperature-averaging cavity.

2. The method for manufacturing a heat spreader assembly according to claim 1, characterized in that: In S4, the cover plate (2) and the heat dissipation component (1) are fixed by gluing.

3. The method for manufacturing a heat spreader assembly according to claim 1, characterized in that: In S4, laser welding is used to fix the cover plate (2) and the heat dissipation component (1).

4. The method for manufacturing a heat spreader assembly according to claim 1, characterized in that: In the S1, the temperature-averaging tanks (4) are distributed in a special shape, a plurality of cover plates (2) are provided, and each cover plate (2) is in a non-bending prism structure.

5. The method for manufacturing a heat spreader assembly according to claim 4, characterized in that: In the above S1, a plurality of temperature-averaging grooves (4) are provided, the plurality of temperature-averaging grooves (4) are not interconnected, the centers of the plurality of temperature-averaging grooves (4) are not on the same straight line, and one temperature-averaging groove (4) corresponds to one cover plate (2).

6. The method for manufacturing a heat spreader assembly according to claim 4, characterized in that: In the S1, a temperature-averaging tank (4) is provided, and the temperature-averaging tank (4) is distributed in a continuous bending and extending manner.

7. The method for manufacturing a heat spreader assembly according to claim 6, characterized in that: In the above S4, after the cover plate (2) and the heat dissipation component (1) are fixed, a supplementary plate (5) is firstly attached to the joint between two adjacent cover plates (2), and then a welding process is performed at the joint between the supplementary plate (5) and the cover plate (2).

8. The method for manufacturing a heat spreader assembly according to claim 6, characterized in that: In S4, the joint between two adjacent cover plates (2) is fixed by means of a sealant.

9. The method for manufacturing a heat spreader assembly according to claim 6, characterized in that: In the above-mentioned S4, at the joint between two adjacent cover plates (2), one of the cover plates (2) is provided with a plug-in block (6), and the other adjacent cover plate (2) is provided with a plug-in slot (7) for the plug-in block (6) to be embedded.

10. The method for manufacturing a heat spreader heat dissipation assembly according to claim 6, characterized in that: In the above S4, the joint between two adjacent cover plates (2) is in the form of a toothed meshing structure, and the toothed meshing structure extends and distributes along the joint track.

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