Method, device, storage medium and system for determining overheating abnormity of target component

Abstract

The invention provides a method, a device, a storage medium and a system for determining overheating abnormity of a target component. The method comprises the following steps: acquiring infrared images and ultraviolet detection images of a plurality of switch cabinets; according to the plurality of infrared images and the plurality of ultraviolet detection images, judging whether the switch cabinet has an overheating area or not; and under the condition that the target switch cabinet has the overheat area, according to the space information of the target switch cabinet and the overheat area, a target assembly with overheat abnormity in the target switch cabinet is determined, the first detection temperature of the overheat area is larger than a first threshold value, and the space information comprises position distribution information of a plurality of assemblies in the target switch cabinet. The method can at least solve the problem that the overheating abnormal component in the switch cabinet cannot be accurately obtained in the prior art.

Description

Technical Field

[0001] The present application relates to the field of electrical equipment, and in particular, to a method for determining an overheating anomaly of a target component, an apparatus for determining an overheating anomaly of a target component, a computer-readable storage medium, and a system for determining an overheating anomaly of a target component. Background Art

[0002] In recent years, with the rapid development of optical communication, chemical analysis, biomedicine and environmental monitoring, the demand for ultraviolet detectors has increased dramatically. GaN-based ultraviolet detectors have attracted much attention in ultraviolet detection applications because of their high sensitivity, wide response spectrum, low dark current and high operating temperature. GaN-based ultraviolet detectors generally adopt a pin structure, which consists of a p-type doped layer, an i-type non-doped layer and an n-type doped layer. Among them, the i-type non-doped layer is the main photoelectric conversion layer of the detector, which can absorb ultraviolet light and generate electron-hole pairs. Since GaN has a higher energy gap and can absorb shorter wavelength ultraviolet light, the response wavelength range of GaN-based ultraviolet detectors is usually 200nm to 400nm. Under the action of the electric field, the electron-hole pairs move along the inside of the GaN material and generate current signals at the doped layer. The doped layer is connected to the metal electrode to output the current signal.

[0003] GaN-based semiconductor UV detectors have high sensitivity, fast response and good stability, which make them very suitable for use in thermal imaging switchgear. By detecting the temperature distribution and abnormal conditions inside the switchgear, GaN-based UV detectors can monitor the operating status of the switchgear in real time and discover potential safety hazards in time, thereby improving the safety and reliability of the power system. GaN-based UV detectors have high sensitivity to ultraviolet light and can quickly respond to and capture small temperature changes inside the switchgear, thereby realizing real-time monitoring of the internal status of the switchgear; GaN-based materials have high stability, which can ensure the long-term stable operation of the detector, reduce the possibility of false alarms and missed alarms, and improve the safety and reliability of the switchgear; Through the application of GaN-based UV detectors, it is possible to quickly detect the temperature distribution inside the switchgear, discover abnormal conditions in time, improve detection efficiency and accuracy, and reduce the frequency and difficulty of manual inspections; By real-time monitoring the operating status of the switchgear, GaN-based UV detectors can prevent safety accidents such as equipment failures or fires caused by overheating or other reasons, and ensure the safe and stable operation of the power system.

[0004] Traditional GaN-based semiconductor UV detector switch cabinet thermal imaging has the following disadvantages:

[0005] In the process of detecting switch cabinets with traditional GaN-based semiconductor ultraviolet detectors, the thermal imaging temperature of the switch cabinet is only collected by GaN-based semiconductor ultraviolet detectors. The collected abnormal temperature values ​​cannot be quickly identified, which is not convenient for quickly and accurately providing target information to users. Summary of the invention

[0006] The main purpose of the present application is to provide a method for determining an overheating abnormality of a target component, an apparatus for determining an overheating abnormality of a target component, a computer-readable storage medium, and a system for determining an overheating abnormality of a target component, so as to at least solve the problem in the prior art that it is impossible to accurately obtain an overheating abnormal component in a switch cabinet.

[0007] In order to achieve the above-mentioned purpose, according to one aspect of the present application, a method for determining an overheating abnormality of a target component is provided, comprising: acquiring infrared images and ultraviolet detection images of a plurality of switch cabinets; judging whether there is an overheating area in the switch cabinet based on the plurality of the infrared images and the plurality of the ultraviolet detection images; in the case where the overheating area exists in the target switch cabinet, determining the target component with an overheating abnormality in the target switch cabinet based on the spatial information of the target switch cabinet and the overheating area, wherein a first detection temperature of the overheating area is greater than a first threshold value, and the spatial information includes position distribution information of multiple components in the target switch cabinet.

[0008] Optionally, judging whether there is an overheating area in the switch cabinet based on the multiple infrared images and the multiple ultraviolet detection images includes: registering the infrared image and the ultraviolet detection image; extracting feature information from the registered ultraviolet detection image, the feature information including ultraviolet radiation intensity features; generating temperature distribution information based on the feature information and a target relationship model, wherein the target relationship model is used to characterize the correspondence between the temperature of the switch cabinet and the ultraviolet radiation intensity; and determining whether there is an overheating area in the target switch cabinet based on the temperature distribution information.

[0009] Optionally, determining whether the target component has an overheating abnormality based on the spatial information of the target switch cabinet and the overheating area includes: determining the target position information and the second detection temperature of the target component based on the infrared image and the ultraviolet detection image; acquiring the operating status of the target component, wherein the operating status includes a temperature threshold of the target component under working conditions; judging whether the target component has an overheating abnormality based on the operating status and the second detection temperature; and determining that the target component has an overheating abnormality when the second detection temperature is greater than the temperature threshold.

[0010] Optionally, the method further includes: obtaining first detection position information of multiple switch cabinets and overheating position information of the overheating area according to the infrared image and the ultraviolet detection image; and determining the target switch cabinet according to the first detection position information and the overheating position information.

[0011] Optionally, obtaining the spatial information of the target switch cabinet includes: receiving scanning information of the target switch cabinet, the scanning information is information generated by identifying an identification on the target switch cabinet, the scanning information includes distribution information of the component and temperature threshold information of the component; and retrieving the spatial information from the scanning information.

[0012] Optionally, acquiring the infrared images and the ultraviolet detection images of the plurality of switch cabinets includes: acquiring the infrared images detected by an infrared thermal imaging device; and acquiring the ultraviolet detection images detected by an ultraviolet detector.

[0013] In order to achieve the above-mentioned purpose, according to the present application, a device for determining thermal overheating abnormality of a switch cabinet includes: an acquisition unit, used to acquire infrared images and ultraviolet detection images of multiple switch cabinets; a judgment unit, used to judge whether there is an overheating area in the switch cabinet based on the multiple infrared images and the multiple ultraviolet detection images; a first determination unit, used to determine, when the overheating area exists in the target switch cabinet, the target component with overheating abnormality in the target switch cabinet based on the spatial information of the target switch cabinet and the overheating area, wherein the first detection temperature of the overheating area is greater than a first threshold value, and the spatial information includes position distribution information of multiple components in the target switch cabinet.

[0014] According to another aspect of the present application, a computer-readable storage medium is provided, the computer-readable storage medium including a stored program, wherein when the program is executed, the device where the computer-readable storage medium is located is controlled to execute any one of the methods for determining thermal overheating abnormality of a switch cabinet.

[0015] According to another aspect of the present application, a system for determining thermal overheating anomalies of a switch cabinet is provided, comprising: one or more processors, a memory, one or more programs, and an infrared thermal imaging device and an ultraviolet detector, wherein the infrared thermal imaging device is connected to the processor to collect infrared images of the switch cabinet, and the ultraviolet detector is connected to the processor to collect ultraviolet detection images of the switch cabinet, and the one or more programs are stored in the memory and are configured to be executed by the one or more processors, and the one or more programs include methods for executing any one of the methods for determining thermal overheating anomalies of a switch cabinet.

[0016] Optionally, the ultraviolet detector is a Schottky type ultraviolet detector.

[0017] By applying the technical solution of the present application, a method for determining the overheating abnormality of a target component is provided, including: obtaining infrared images and ultraviolet detection images of multiple switch cabinets; judging whether there is an overheating area in the switch cabinet according to the multiple infrared images and multiple ultraviolet detection images; in the case that there is an overheating area in the target switch cabinet, determining the target component with overheating abnormality in the target switch cabinet according to the spatial information and the overheating area of ​​the target switch cabinet, wherein the first detection temperature of the overheating area is greater than the first threshold value, and the spatial information includes the position distribution information of multiple components in the target switch cabinet. In the above method, the infrared image and the ultraviolet detection image are used to jointly confirm the target switch cabinet with overheating abnormality in the switch cabinet, and the target component with overheating abnormality in the target switch cabinet is confirmed, so as to increase the accuracy of confirming the overheating abnormal component in the switch cabinet, and the overheating component in the switch cabinet can be directly obtained, which provides the target information to the user quickly and accurately, and increases the experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The drawings constituting part of the present application are used to provide a further understanding of the present application. The exemplary embodiments and descriptions of the present application are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0019] Figure 1 A hardware structure block diagram of a mobile terminal for executing a method for determining an overheating abnormality of a target component provided in an embodiment of the present application is shown;

[0020] Figure 2 A schematic flow chart of a method for determining an overheating anomaly of a target component provided in accordance with an embodiment of the present application is shown;

[0021] Figure 3 A schematic diagram of a process of scanning a two-dimensional code according to an embodiment of the present application is shown;

[0022] Figure 4 A schematic diagram showing a specific process of obtaining an infrared image by an infrared thermal imaging device provided in an embodiment of the present application is shown;

[0023] Figure 5 A schematic diagram of a specific process of optimizing an ultraviolet detector provided according to an embodiment of the present application is shown;

[0024] Figure 6 A flow chart of another method for determining an overheating anomaly of a target component provided in accordance with an embodiment of the present application is shown;

[0025] Figure 7 A structural block diagram of a device for determining an overheating abnormality of a target component provided according to an embodiment of the present application is shown.

[0026] The above drawings include the following reference numerals:

[0027] 102, processor; 104, memory; 106, transmission device; 108, input and output devices. DETAILED DESCRIPTION

[0028] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0029] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present application.

[0030] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequential order. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present application described here. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0031] As introduced in the background technology, in the process of detecting the switch cabinet by the traditional gallium nitride-based semiconductor ultraviolet detector in the prior art, the thermal imaging temperature of the switch cabinet is only collected by the gallium nitride-based semiconductor ultraviolet detector, and the collected abnormal temperature values ​​cannot be quickly identified, which is not convenient for quickly and accurately providing target information to the user. In order to solve the problem that the overheated abnormal components in the switch cabinet cannot be accurately obtained in the prior art, the embodiments of the present application provide a method for determining the overheated abnormality of the target component, a device for determining the overheated abnormality of the target component, a computer-readable storage medium and a system for determining the overheated abnormality of the target component.

[0032] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0033] The method embodiments provided in the embodiments of the present application can be executed in a mobile terminal, a computer terminal or a similar computing device. Taking running on a mobile terminal as an example, Figure 1 1 is a hardware structure block diagram of a mobile terminal for determining a method for determining a thermal overheating abnormality of a switch cabinet according to an embodiment of the present invention. Figure 1 As shown, the mobile terminal may include one or more ( Figure 1 Only one is shown in the figure) a processor 102 (the processor 102 may include but is not limited to a processing device such as a microprocessor MCU or a programmable logic device FPGA) and a memory 104 for storing data, wherein the mobile terminal may also include a transmission device 106 and an input / output device 108 for communication functions. It can be understood by those skilled in the art that Figure 1 The structure shown is only for illustration and does not limit the structure of the mobile terminal. Figure 1 More or fewer components as shown, or with Figure 1 Different configurations are shown.

[0034] The memory 104 can be used to store computer programs, for example, software programs and modules of application software, such as the corresponding computer program for determining the thermal overheating anomaly of the switch cabinet in the embodiment of the present invention. The processor 102 executes various functional applications and data processing by running the computer program stored in the memory 104, that is, the above method is implemented. The memory 104 may include a high-speed random access memory, and may also include a non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory. In some examples, the memory 104 may further include a memory remotely arranged relative to the processor 102, and these remote memories may be connected to the mobile terminal via a network. Examples of the above network include but are not limited to the Internet, an intranet, a local area network, a mobile communication network, and a combination thereof. The transmission device 106 is used to receive or send data via a network. The specific example of the above network may include a wireless network provided by a communication provider of the mobile terminal. In one example, the transmission device 106 includes a network adapter (Network Interface Controller, referred to as NIC), which can be connected to other network devices through a base station so as to communicate with the Internet. In one example, the transmission device 106 may be a radio frequency (RF) module, which is used to communicate with the Internet wirelessly.

[0035] In this embodiment, a method for determining an overheating abnormality of a target component running on a mobile terminal, a computer terminal or a similar computing device is provided. It should be noted that the steps shown in the flowchart of the accompanying drawings can be executed in a computer system such as a set of computer executable instructions, and although a logical order is shown in the flowchart, in some cases, the steps shown or described can be executed in an order different from that shown here.

[0036] Figure 2 1 is a flow chart of a method for determining an overheating abnormality of a target component according to an embodiment of the present application. Figure 2 As shown, the method comprises the following steps:

[0037] Step S201, acquiring infrared images and ultraviolet detection images of multiple switch cabinets.

[0038] Specifically, infrared images are the product of the combination of infrared technology and imaging technology. They have strong permeability and strong anti-interference ability. In addition, infrared images sense and reflect the difference in outward radiation energy between the target and the background, or describe the difference in temperature maintained by the target and the background. They are passive imaging and can work around the clock. Since infrared images have the above characteristics, before obtaining the infrared image of the switch cabinet, the above method also includes scanning the background of the switch cabinet to obtain reference data to increase the accuracy of the infrared image display.

[0039] In addition, ultraviolet detection images, that is, images obtained using thermal imaging technology, can obtain thermal images of the target object without contacting it, avoiding the interference that traditional temperature measurement methods may cause to the target object. Changes and abnormal conditions of the target object can be monitored in real time. Moreover, thermal imaging technology has high sensitivity and high resolution, which helps to accurately analyze overheating anomalies of switchgear components.

[0040] Step S202: judging whether there is an overheating area in the switch cabinet according to the multiple infrared images and the multiple ultraviolet detection images.

[0041] Specifically, combining infrared images with ultraviolet detection images can improve the perception of temperature changes and achieve higher sensitivity. In addition, the combination of infrared images and thermal imaging technology can provide higher spatial resolution and more clearly display the temperature distribution of switch cabinets and switch cabinet components. In addition, the real-time and non-contact nature of thermal imaging technology helps to detect abnormal conditions in a timely manner and take corresponding measures, while avoiding the limitations of traditional contact temperature measurement.

[0042] Step S203, when there is an overheating area in the target switch cabinet, determine the target component with overheating abnormality in the target switch cabinet based on the spatial information and the overheating area of ​​the target switch cabinet, wherein the first detected temperature of the overheating area is greater than the first threshold, and the spatial information includes the position distribution information of multiple components in the target switch cabinet.

[0043] Through the embodiment of the present application, in the above method, infrared images and ultraviolet detection images are used to jointly confirm the target switch cabinet with overheating abnormality in the switch cabinet, and at the same time confirm the target component with overheating abnormality in the target switch cabinet, so as to increase the accuracy of confirming the overheating abnormal component in the switch cabinet. In addition, the overheating component in the switch cabinet can be directly obtained, which provides the user with target information quickly and accurately, and increases the experience.

[0044] In some optional embodiments, judging whether there is an overheating area in the switch cabinet based on multiple infrared images and multiple ultraviolet detection images includes: registering the infrared image and the ultraviolet detection image; extracting feature information from the registered ultraviolet detection image, the feature information including ultraviolet radiation intensity features; generating temperature distribution information based on the feature information and a target relationship model, wherein the target relationship model is used to characterize the correspondence between the temperature of the switch cabinet and the ultraviolet radiation intensity; and determining whether there is an overheating area in the target switch cabinet based on the temperature distribution information.

[0045] Specifically, the infrared image and the ultraviolet detection image are registered so that the two are aligned in the same spatial coordinate system. This can be achieved through an image registration algorithm, such as the RANSAC algorithm based on feature point matching; then, feature information is extracted from the infrared image and the ultraviolet detection image. For the infrared image, the temperature feature can be extracted, and for the ultraviolet detection image, the ultraviolet radiation intensity feature can be extracted. These feature information will be used for subsequent temperature distribution analysis; and using the known temperature and ultraviolet radiation intensity data, a relationship model between temperature and ultraviolet radiation intensity is established. This model can be a linear regression model, a neural network model, etc. By training the model, the temperature value corresponding to the unknown ultraviolet radiation intensity can be predicted; the ultraviolet radiation intensity feature in the ultraviolet detection image is substituted into the established relationship model, the temperature value of the corresponding area is calculated, and then these temperature values ​​are mapped back to the spatial coordinate system of the infrared image to obtain the temperature distribution information of the switch cabinet.

[0046] Furthermore, the accuracy of the model can be verified by comparing the actually measured temperature data with the calculated temperature distribution information, and the prediction accuracy can be improved by optimizing and adjusting the model.

[0047] In some optional embodiments, determining whether a target component has an overheating abnormality is based on spatial information and an overheating area of ​​a target switch cabinet, including: determining target position information and a second detection temperature of the target component based on an infrared image and an ultraviolet detection image; obtaining an operating status of the target component, wherein the operating status includes a temperature threshold of the target component under working conditions; judging whether the target component has an overheating abnormality based on the operating status and the second detection temperature; and determining that the target component has an overheating abnormality when the second detection temperature is greater than the temperature threshold.

[0048] Specifically, the switch cabinet may include multiple electrical components, and if the components are not handled in time when they have overheating anomalies, it may seriously cause equipment damage or fire anomalies. Among them, the internal components of the switch cabinet include: circuit breakers, knife switches, current transformers, voltage transformers, protection relays, instruments, control devices, power supply equipment, lighting equipment, thermal detectors, temperature sensors, connectors, wires, insulators and SF6 gas pressure sensors. Among them, the circuit breaker is used to cut off the current when the circuit is interrupted or overloaded, and is divided into air circuit breakers, vacuum circuit breakers and SF6 circuit breakers; the knife switch is mainly used to cut off the circuit, but cannot be used for overload or short circuit protection. It is a manually operated switching device; the current transformer and the voltage transformer are used to measure current and voltage respectively, converting high current and high voltage into low current and low voltage for use by measuring instruments and protection devices; the protection relay is used to monitor current, voltage and other power grid parameters. When an abnormal situation is detected, the circuit breaker operation is triggered to achieve power grid protection; the instrument includes an ammeter, a voltmeter, and a power meter, which are used to monitor the electrical parameters of the power grid and perform Real-time measurement and recording; control devices are used to manually or automatically control the operation of equipment in the switch cabinet, including buttons, switches, and remote control devices; power supply equipment provides power to various equipment in the switch cabinet, usually using a DC power supply system; lighting equipment provides lighting inside the switch cabinet to facilitate operation and maintenance, heat detectors and temperature sensors; monitor the temperature of equipment and connectors to detect potential problems in a timely manner; connectors and wires are used to connect various equipment in the switch cabinet and build electrical connections; insulators are used to maintain electrical isolation between equipment to prevent current from flowing in inappropriate places; F6 gas pressure sensor is used to monitor the pressure state of SF6 gas.

[0049] In multiple switch cabinets in the same group, the positions of various components in different switch cabinets may vary. For example, in switch cabinet A, the protection relay is located on the left side of switch cabinet A, and in switch cabinet B, due to the position and device layout, the protection relay may be located on the right side of switch cabinet B. Therefore, according to the distribution information of various components in different switch cabinets, the accuracy of identifying the components with overheating abnormalities in the target switch cabinet can be improved.

[0050] In addition, after obtaining the distribution information and spatial information of the components in the target switch cabinet, the information is compared with the position information obtained in the overheating area to identify the overheated components, and further identify whether the overheated abnormal components have overheated abnormalities according to the operating status of the overheated components. That is, in the above embodiment, not only the target switch cabinet in the overheating area is identified, but also the overheated components in the target switch cabinet are identified, which can further improve the accuracy and reliability of the judgment, without the need for manual participation in the detection process, and improve the detection efficiency and reliability of the detection results.

[0051] In the process of determining some abnormal components, multiple overheating areas may be detected. In this case, the above method will confirm the overheating abnormality of the component for each overheating area. Specifically, when multiple overheating areas are detected in multiple switch cabinets, first, it will be determined whether the multiple overheating areas are distributed in multiple switch cabinets; then, the overheating abnormal components are confirmed for the overheating areas in each switch cabinet, including multiple overheating areas in a switch cabinet, or one overheating area in a switch cabinet. In the above method, the target components with overheating abnormalities will be confirmed for the overheating areas to obtain the final temperature measurement results and diagnostic reports of the switch cabinet, so as to achieve accurate temperature measurement and fault diagnosis of the switch cabinet.

[0052] In some optional embodiments, the method further includes: obtaining first detection position information of multiple switch cabinets and overheating position information of overheating areas based on infrared images and ultraviolet detection images; and determining the target switch cabinet based on the first detection position information and the overheating position information.

[0053] Specifically, multiple switch cabinets are detected in real time. When the detection finds that multiple switch cabinets have temperature abnormality areas, the target switch cabinet with temperature abnormality can be judged first according to the set threshold. Then, after the target switch cabinet with overheating is screened out, the next step of confirmation is carried out, which narrows the detection scope, reduces the waste of resources, and improves the efficiency and accuracy of judging overheating abnormalities in switch cabinets.

[0054] In some optional embodiments, obtaining spatial information of a target switch cabinet includes: receiving scanning information of the target switch cabinet, the scanning information is information generated by identifying an identification on the target switch cabinet, the scanning information includes component distribution information and component temperature threshold information; and retrieving spatial information from the scanning information.

[0055] Specifically, each switch cabinet may have a QR code for distinguishing the scanned information of the switch cabinet. After determining the target switch cabinet with overheating anomaly, the target switch cabinet information can be obtained by scanning the QR code of the target switch cabinet, and the spatial information of the target switch cabinet can be retrieved through the QR code to reduce the detection time and further improve the detection efficiency.

[0056] Among them, Figure 3 As shown, the process of performing two-dimensional code scanning may include: step S21, starting the scanning device: sending a control signal to the scanning device to control the scanning device to start, wherein the scanning device includes a barcode scanner divided into a laser scanner and an image scanner, the laser scanner is suitable for one-dimensional barcodes, has a fast speed and a long distance, and is suitable for rapid scanning of bulk commodities; while the image scanner is suitable for two-dimensional barcodes, recognizes complex patterns and information, and the scanner can be selected according to actual needs, which is not specifically limited in the embodiment of the present application; step S22, aligning the two-dimensional code: controlling the scanning device to move and align with the two-dimensional code of the target switch cabinet so that the light of the scanning device is located above the barcode, wherein an environment that is too dark or too bright affects the scanning effect, and the photoelectric sensor of the scanner is aligned with the barcode to ensure that the barcode information is read; S23, two-dimensional code scanning: when the light of the scanning device is located above the two-dimensional code, the scanning device is controlled to scan the two-dimensional code; S24, confirming the scanning result: in the case of receiving a signal of successful scanning, confirming that the scanning is successful; in the case of not receiving a signal of successful scanning, steps S22 and S23 are repeated for a second scan. If the scan is successful, the user can view the scan results to further determine whether the barcode information is correct.

[0057] In some optional implementations, acquiring infrared images and ultraviolet detection images of multiple switch cabinets includes: acquiring infrared images detected by infrared thermal imaging equipment; acquiring ultraviolet detection images detected by ultraviolet detectors.

[0058] Specifically, the specific process of infrared thermal imaging equipment acquiring infrared images may include: Figure 4As shown, step S31, equipment startup: sending a control signal to the infrared thermal imaging device to start the infrared thermal imaging device, wherein the startup sequence is starting the laser, MaiTai, ACE, TOPAS and AOM devices, which includes connecting the communication line and adjusting the equipment parameters, such as current setting and power adjustment, to ensure the normal operation of the equipment; step S32, parameter adjustment: controlling the infrared thermal imaging device to make the Probe light and the He-Ne light overlap, as well as the Pump light and the He-Ne light overlap, which is a key step to ensure the accuracy of the spectral data; step S33, data acquisition: after the equipment adjustment is completed, the infrared thermal imaging device is used to scan the background of the switch cabinet to obtain the benchmark data, wherein the background is the background environment in which the switch cabinet is located, and the infrared thermal imaging device is used to scan the switch cabinet to obtain the spectral data of the switch cabinet; step S34, data analysis: the spectral data is analyzed by the data analysis software to obtain more detailed spectral information as the final spectral graph. Specifically, the steps of data analysis include: preprocessing the collected spectral data, including background correction, baseline correction, and peak identification to ensure the accuracy and reliability of the data; selecting a suitable spectral library, comparing the spectral data to be analyzed with the spectral maps in the spectral library, and setting appropriate retrieval parameters and algorithms according to needs to improve the accuracy of data analysis; analyzing the data based on the matching results to obtain more accurate spectral information.

[0059] Among them, the data analysis software includes: TQ-Analyst spectral analysis software, GRAMS Suite software, OMNICSpectra software and Spectra Plus software.

[0060] Specifically, TQ Analyst spectral analysis software is a general spectral analysis software used for processing and analysis of spectral data. TQ Analyst spectral analysis software can process, analyze and visualize a variety of spectral data, support the import and export of multiple data formats, and facilitate users to exchange and share data with other software. GRAMS Suite is a comprehensive spectral data analysis, quantitative analysis and chemometrics software, which is widely used in chemistry, materials science, environmental science, biomedicine, food safety and other fields for processing and analyzing various spectral data. OMNIC Spectra software is a software for analyzing infrared spectral data. It provides a variety of functions and tools to help users process, interpret and visualize spectral data. Spectra Plus is an audio analysis and signal processing software used to analyze and process sound and music. It has a variety of functions, including spectrum analysis, frequency response measurement, signal generation and processing, noise elimination, etc.

[0061] In order to improve the accuracy of UV detection images, the UV detector can be optimized, such as Figure 5 As shown, the optimization steps include: S41, preparation of epitaxial layer: a GaN-based pin-type ultraviolet detector with a thin p-type layer is prepared on a patterned sapphire substrate, and by optimizing the growth conditions, such as using an AlN insertion layer and annealing treatment, a high-quality AlGaN film with adjustable band gap is obtained, thereby improving the performance of the detector; S42, design and preparation of the detector: an AlGaN-based metal-semiconductor-metal (MSM) type ultraviolet detector is provided, and the specific preparation method is as follows: first, a high-quality Al buffer layer is formed on the substrate by molecular beam epitaxy, wherein the Al buffer layer has a small lattice mismatch between Al and the Si substrate on the one hand; on the other hand, the Al buffer layer can react with the subsequent epitaxial growth to generate AlGaN, reducing the dislocations caused by the mismatch of the directly grown AlGaN, which is conducive to the preparation of high-quality AlGaN films with low defect density and good crystal quality; then, the AlGaN film is grown by deposition technology; then, the metal-semiconductor-metal layers are sequentially formed on the AlGaN film by electron beam evaporation coating to form an AlGaN-based metal-semiconductor-metal (MSM) type ultraviolet detector. In the structure of the above-mentioned ultraviolet detector, the crystal quality and the electrical and optical properties of the detector are improved by optimizing the device structure, such as doping gradient and high-temperature growth of AlN as a buffer layer; S43, construction and optimization of the performance test system: a spectral response test system is built to evaluate the performance of the detector. The purpose of the construction and optimization of the performance test system includes analyzing and eliminating the noise problems existing in the system, such as using ultraviolet optical fiber and optimizing the optical power problem to reduce the attenuation of optical power and improve the test accuracy. Through these measures, the noise of the entire system is reduced to 10 to 12 orders of magnitude, meeting the test requirements; S44, image acquisition: the AlGaN-based ultraviolet detector used is a pin structure, in which the i-type non-doped layer is the main photoelectric conversion layer of the detector, which absorbs ultraviolet light and generates electron-hole pairs. These electrons and holes move along the inside of the gallium nitride material under the action of the electric field and generate current signals at the doped layer. The doped layer is connected to the metal electrode to output the current signal, thereby realizing image capture and transmission. Gallium nitride-based ultraviolet sensors have the advantages of high sensitivity, fast response and strong anti-interference ability. Using gallium nitride-based ultraviolet detectors to obtain information from switch cabinets can increase the accuracy of thermal imaging images and make the temperature detection of switch cabinets more accurate, which is conducive to accurate health judgment of switch cabinets.

[0062] Specifically, the specific steps of the above step S43: building and optimizing the performance test system are as follows:

[0063] Step S431: System and component selection: select suitable components, such as UV spectrum test equipment, UV optical fiber, UV light source, etc., design the layout of the test system, and ensure the rationality and effectiveness of the optical path, signal transmission path and data processing flow;

[0064] Step S432: Analyze and eliminate the noise problem existing in the system by using ultraviolet optical fiber and optimizing optical power;

[0065] Step S433: System construction, connecting the components according to the system layout, where hardware for signal amplification and data processing, such as amplifiers, AD converters, etc., can be installed, and data analysis software can be configured;

[0066] Step S434: System optimization, including spectral response test and noise level test.

[0067] The steps of the spectral response test include:

[0068] Step S43411: Perform background scanning to obtain the noise level of the system itself as a baseline;

[0069] Step S43412: Perform response tests on ultraviolet light of different wavelengths to evaluate the sensitivity and linear response of the detector.

[0070] The steps of the noise level test include:

[0071] Step S43421: When there is no ultraviolet light input, test the low noise of the system to ensure that the noise level reaches the order of 10-12;

[0072] Step S43422: Analyze the noise source, such as electronic noise, thermal noise, etc., and perform targeted optimization.

[0073] Among them, the gallium nitride-based semiconductor ultraviolet detector may include a substrate, an ohmic contact layer, an active layer, a covering layer, an ohmic electrode and a Schottky electrode. The substrate serves as a supporting structure to provide physical support and electrical stability. The ohmic contact layer is located above the substrate to provide good electrical contact. The active layer is the core part of the detector and is responsible for the photoelectric conversion process. The covering layer is located above the active layer to protect the active layer and to optimize the photoelectric performance. The ohmic electrode is located on the ohmic contact layer to draw out current. The Schottky electrode is located on the covering layer to form a Schottky contact with the active layer to collect photogenerated carriers.

[0074] In order to enable those skilled in the art to more clearly understand the technical solution of the present application, the implementation process of the method for detecting the health status of a switch cabinet of the present application will be described in detail below in combination with specific embodiments.

[0075] This embodiment relates to a specific method for determining an overheating abnormality of a target component, such as Figure 6 The steps include:

[0076] Step S1: Obtain cabinet information: Obtain basic information of the switch cabinet by scanning the QR code on the switch cabinet, and obtain relevant parameters of the switch cabinet, including rated voltage, rated current, rated frequency, rated power frequency withstand voltage, and rated lightning impulse withstand voltage;

[0077] Step S2: Obtaining a two-dimensional infrared spectrum: Using an infrared thermal imaging device to scan the switch cabinet to obtain its two-dimensional infrared spectrum for subsequent determination of whether there are temperature abnormalities;

[0078] Step S3: thermal imaging image acquisition: using a gallium nitride-based semiconductor ultraviolet detector to acquire thermal imaging images of the switch cabinet;

[0079] Step S4: Analyze temperature anomaly: Compare the image collected in step S3 with the image collected in step S2. If there is a temperature anomaly point in the collected image, further obtain the internal equipment space information of the switch cabinet corresponding to the switch cabinet information, and determine the first overheated device inside the switch cabinet according to the temperature anomaly point and the internal equipment space information. Specifically, when the sampling temperature of a certain first temperature control area is greater than or equal to the temperature threshold, the adjacent temperature control area of ​​the first temperature control area can be determined and the image comparison value in the adjacent temperature control area can be verified, and then the control instruction is sent to the background and named as the first device;

[0080] Step S5: diagnose device status: the background obtains the device operating status of the first device through the monitoring device, and determines whether the device is overheated abnormally according to the device operating status. If it is overheated, it is marked as an overheated device, otherwise it is marked as a non-overheated device;

[0081] Step S6: Fusion diagnosis: The above steps are performed for each temperature abnormality point to obtain the final temperature measurement result and diagnosis report of the switch cabinet, so as to realize accurate temperature measurement and fault diagnosis of the switch cabinet.

[0082] Exemplarily, the specific process of the above-mentioned method for determining the overheating abnormality of the target component includes: obtaining the basic information of the switch cabinet by scanning the QR code on the switch cabinet to obtain the relevant parameters of the switch cabinet; using infrared thermal imaging equipment to scan the switch cabinet to obtain its two-dimensional infrared spectrum for subsequent judgment whether there are temperature abnormalities; using gallium nitride-based semiconductor ultraviolet detectors to collect thermal imaging images of the switch cabinet; using GaN-based semiconductor photon detectors instead of vacuum tubes for ultraviolet detection, if there are temperature abnormalities in the collected image, further obtaining the internal equipment space information of the switch cabinet corresponding to the switch cabinet information, and determining the first overheating device inside the switch cabinet according to the temperature abnormality and the internal equipment space information; obtaining the equipment operating status of the first equipment, and judging whether the equipment is overheating abnormally according to the equipment operating status, if it is overheated, marking it as an overheating device, otherwise marking it as a non-overheating device; performing the above steps for each temperature abnormality point to obtain the final temperature measurement result and diagnosis report of the switch cabinet, so as to realize accurate temperature measurement and fault diagnosis of the switch cabinet.

[0083] In another exemplary embodiment, the specific process of the above-mentioned method for determining the overheating anomaly of the target component includes: obtaining basic information of the switch cabinet by scanning the QR code on the switch cabinet to obtain relevant parameters of the switch cabinet; using infrared thermal imaging equipment to scan the switch cabinet to obtain its two-dimensional infrared spectrum for subsequent judgment whether there are temperature abnormalities; using a gallium nitride-based semiconductor ultraviolet detector to collect thermal imaging images of the switch cabinet; preparing a GaN-based pin-type ultraviolet detector on a patterned sapphire substrate with a thickness of 60nm to reduce the defect density in the gallium nitride material and improve the quality of the epitaxial layer. X-ray diffraction results show that compared with the epitaxial layer grown on the standard sapphire substrate, the epitaxial layer grown on PSS has a lower defect density. In addition, in order to facilitate the comparison of the performance of the detector, a GaN-based Schottky-type ultraviolet detector can also be prepared on PSS. If there are temperature anomalies in the collected image, the internal equipment space information of the switch cabinet corresponding to the switch cabinet information is further obtained, and the first overheated device inside the switch cabinet is determined according to the temperature anomaly point and the internal equipment space information; the equipment operating status of the first equipment is obtained, and whether the equipment is overheated abnormally according to the equipment operating status. If it is overheated, it is marked as an overheated device, otherwise it is marked as a non-overheated device; the above steps are performed for each temperature anomaly point to obtain the final temperature measurement result and diagnosis report of the switch cabinet, so as to realize accurate temperature measurement and fault diagnosis of the switch cabinet.

[0084] In another example, the specific process of the above method for determining the overheating anomaly of the target component may include: scanning the QR code on the switch cabinet to obtain the basic information of the switch cabinet to obtain the relevant parameters of the switch cabinet; using infrared thermal imaging equipment to scan the switch cabinet to obtain its two-dimensional infrared spectrum for subsequent judgment of whether there is a temperature abnormality point; using a gallium nitride-based semiconductor ultraviolet detector to collect thermal imaging images of the switch cabinet; using an AlGaN-based MSM structure ultraviolet photodetector, the device uses a standard photolithography process to form a comb electrode, and exemplarily, each of the comb-shaped interdigitated electrodes is 10 mm wide, 200 mm long, and 10 mm apart, and Metal Pt is formed by magnetron sputtering with a thickness of 300nm. If there are temperature anomalies in the collected image, the internal equipment space information of the switch cabinet corresponding to the switch cabinet information is further obtained, and the first overheated device inside the switch cabinet is determined according to the temperature anomaly points and the internal equipment space information; the equipment operating status of the first equipment is obtained, and whether the equipment is overheated abnormally is determined according to the equipment operating status. If overheated, it is marked as an overheated device, otherwise it is marked as a non-overheated device; the above steps are performed for each temperature anomaly point to obtain the final temperature measurement result and diagnosis report of the switch cabinet, so as to realize accurate temperature measurement and fault diagnosis of the switch cabinet.

[0085] In another example, the specific process of the above-mentioned method for determining the overheating anomaly of the target component includes: obtaining the basic information of the switch cabinet by scanning the QR code on the switch cabinet to obtain the relevant parameters of the switch cabinet; using infrared thermal imaging equipment to scan the switch cabinet to obtain its two-dimensional infrared spectrum for subsequent judgment of whether there is a temperature abnormality point; using a gallium nitride-based semiconductor ultraviolet detector to collect thermal imaging images of the switch cabinet; wherein, the group III reactant is trimethylgallium as a gallium source, trimethylaluminum as an aluminum source, hydrogen as a carrier gas, and the group V reactant gas is ammonia to prepare the AlGaN base layer in the gallium nitride-based semiconductor ultraviolet detector , which can improve the accuracy of data collection by the ultraviolet detector; if there are temperature anomalies in the collected image, further obtain the internal equipment space information of the switch cabinet corresponding to the switch cabinet information, and determine the first overheated device inside the switch cabinet according to the temperature anomaly point and the internal equipment space information; obtain the equipment operation status of the first equipment, and determine whether the equipment is overheated abnormally according to the equipment operation status. If it is overheated, it is marked as an overheated device, otherwise it is marked as a non-overheated device; perform the above steps for each temperature anomaly point to obtain the final temperature measurement result and diagnosis report of the switch cabinet, so as to realize accurate temperature measurement and fault diagnosis of the switch cabinet.

[0086] Among them, the preparation process of the AlGaN layer includes: first, cleaning the gem surface with H2 at 1150°C; then, using trimethylgallium as the gallium source, hydrogen as the carrier gas, and introducing ammonia to grow the GaN layer; then, on the surface of the GaN layer, a high-quality GaN support layer is grown through a low-temperature nitridation reaction, and the thickness of the GaN support layer is 1um; after the GaN growth is completed, the reaction chamber temperature is maintained at 1100°C and the pressure is 100Tor (1Tor = 133.3224Pa), and high-temperature AlN is grown with a thickness of 10nm. After a short growth interruption, Ga source and Al source are introduced at the same time to grow the AlGaN layer, and the growth time is 1h to obtain the AlGaN base layer. The AlGaN base layer prepared by the above method can improve the sensitivity and high resolution of the ultraviolet detector and realize the accurate detection of ultraviolet detection data.

[0087] The embodiment of the present application also provides a device for determining an abnormal overheating of a target component. It should be noted that the device for determining an abnormal overheating of a target component in the embodiment of the present application can be used to execute the method for determining an abnormal overheating of a target component provided in the embodiment of the present application. The device is used to implement the above-mentioned embodiments and preferred implementation modes, and the descriptions that have been made will not be repeated. As used below, the term "module" can implement a combination of software and / or hardware for a predetermined function. Although the device described in the following embodiments is preferably implemented in software, the implementation of hardware, or a combination of software and hardware, is also possible and conceivable.

[0088] The following is an introduction to the device for determining the overheating abnormality of a target component provided in an embodiment of the present application.

[0089] Figure 7 Schematic diagram of a device for determining an overheating abnormality of a target component according to an embodiment of the present application. Figure 7 As shown, the device comprises:

[0090] An acquisition unit 10 is used to acquire infrared images and ultraviolet detection images of multiple switch cabinets;

[0091] A judgment unit 20, used to judge whether there is an overheating area in the switch cabinet according to the multiple infrared images and the multiple ultraviolet detection images;

[0092] The first determination unit 30 is used to determine, when an overheating area exists in the target switch cabinet, a target component with overheating abnormality in the target switch cabinet based on the spatial information and the overheating area of ​​the target switch cabinet, wherein a first detected temperature of the overheating area is greater than a first threshold, and the spatial information includes position distribution information of multiple components in the target switch cabinet.

[0093] In the above device, the infrared image and the ultraviolet detection image are acquired by the acquisition unit, the target switch cabinet with overheating area in multiple switch cabinets is determined by the judgment unit, and the target switch cabinet with overheating abnormality in the switch cabinet is confirmed by the first determination unit using the infrared image and the ultraviolet detection image, and the target component with overheating abnormality in the target switch cabinet is confirmed at the same time, so as to increase the accuracy of confirming the overheating abnormal component in the switch cabinet. In addition, the overheating component in the switch cabinet can be directly obtained, which can quickly and accurately provide the target information to the user and increase the experience.

[0094] In one embodiment of the present application, the judgment unit includes a registration subunit, an information extraction subunit, a generation subunit and a first determination subunit, wherein the registration subunit is used to align the infrared image and the ultraviolet detection image; the information extraction subunit is used to extract feature information from the aligned ultraviolet detection image, the feature information including ultraviolet radiation intensity features; the generation subunit is used to generate temperature distribution information based on the feature information and the target relationship model, wherein the target relationship model is used to characterize the correspondence between the temperature of the switch cabinet and the ultraviolet radiation intensity; the first determination subunit is used to determine whether there is an overheating area in the target switch cabinet based on the temperature distribution information.

[0095] In one embodiment of the present application, the first determination unit includes a second determination subunit, a first acquisition subunit, a third judgment subunit and a fourth determination subunit, wherein the second determination subunit is used to determine the target position information and the second detection temperature of the target component according to the infrared image and the ultraviolet detection image; the first acquisition subunit is used to obtain the operating status of the target component, wherein the operating status includes the temperature threshold of the target component under working conditions; the third judgment subunit is used to determine whether the target component has an overheating anomaly according to the operating status and the second detection temperature; the fourth determination subunit is used to determine whether the target component has an overheating anomaly when the second detection temperature is greater than the temperature threshold. The accuracy and reliability of the judgment can be further improved, without the need for manual participation in the detection process, and the detection efficiency and reliability of the detection results can be improved.

[0096] The above device also includes a second determination unit and a third determination unit, wherein the second determination unit is used to obtain first detection position information of multiple switch cabinets and overheating position information of overheating areas according to infrared images and thermal imaging images; the third determination unit is used to determine the target switch cabinet according to the first detection position information and overheating position information. This can narrow the detection range, reduce the waste of resources, and improve the efficiency and accuracy of judging overheating anomalies in switch cabinets.

[0097] In another embodiment of the present application, the first determination unit includes a receiving unit and a retrieving unit, wherein the receiving unit is used to receive scanning information of the target switch cabinet, the scanning information is information generated by identifying the identification on the target switch cabinet, and the scanning information includes the distribution information of the components and the temperature threshold information of the components; the retrieving unit is used to retrieve the spatial information from the scanning information. This can save time and further improve the detection efficiency.

[0098] In one embodiment of the present application, the acquisition unit includes a second acquisition subunit and a third acquisition subunit, wherein the second acquisition subunit is used to acquire an infrared image detected by an infrared thermal imaging device; and the third acquisition subunit is used to acquire an ultraviolet detection image detected by an ultraviolet detector. Acquiring an infrared image by an infrared thermal imaging device and acquiring an ultraviolet detection image by an ultraviolet detector can further increase the accuracy of the image, make the temperature detection of the switch cabinet more accurate, and facilitate accurate health judgment of the switch cabinet.

[0099] The device for detecting the health status of a switch cabinet includes a processor and a memory, wherein the acquisition unit, the judgment unit, the first determination unit, the second determination unit, etc. are all stored in the memory as program units, and the processor executes the program units stored in the memory to implement corresponding functions. The modules are all located in the same processor; or, the modules are located in different processors in any combination.

[0100] The processor includes a kernel, which retrieves the corresponding program unit from the memory. One or more kernels can be set, and the efficiency of partial discharge detection and overheating abnormality detection of the switch cabinet can be improved by adjusting the kernel parameters.

[0101] The memory may include non-permanent memory in a computer-readable medium, random access memory (RAM) and / or non-volatile memory, such as read-only memory (ROM) or flash RAM, and the memory includes at least one memory chip.

[0102] An embodiment of the present invention provides a computer-readable storage medium, which includes a stored program, wherein when the program is running, a device where the computer-readable storage medium is located is controlled to execute a method for determining an overheating abnormality of a target component.

[0103] Specifically, the method for determining the overheating abnormality of the target component includes:

[0104] Step S201, acquiring infrared images and ultraviolet detection images of multiple switch cabinets.

[0105] Specifically, infrared images are the product of the combination of infrared technology and imaging technology. They have strong permeability and strong anti-interference ability. In addition, infrared images sense and reflect the difference in outward radiation energy between the target and the background, or describe the difference in temperature maintained by the target and the background. They are passive imaging and can work around the clock. Since infrared images have the above characteristics, before obtaining the infrared image of the switch cabinet, the above method also includes scanning the background of the switch cabinet to obtain reference data to increase the accuracy of the infrared image display.

[0106] In addition, ultraviolet detection images, that is, images obtained using thermal imaging technology, can obtain thermal images of the target object without contacting it, avoiding the interference that traditional temperature measurement methods may cause to the target object. Changes and abnormal conditions of the target object can be monitored in real time. Moreover, thermal imaging technology has high sensitivity and high resolution, which helps to accurately analyze overheating anomalies of switchgear components.

[0107] Step S202: judging whether there is an overheating area in the switch cabinet according to the multiple infrared images and the multiple ultraviolet detection images.

[0108] Specifically, combining infrared images with ultraviolet detection images can improve the perception of temperature changes and achieve higher sensitivity. In addition, the combination of infrared images and thermal imaging technology can provide higher spatial resolution and more clearly display the temperature distribution of switch cabinets and switch cabinet components. In addition, the real-time and non-contact nature of thermal imaging technology helps to detect abnormal conditions in a timely manner and take corresponding measures, while avoiding the limitations of traditional contact temperature measurement.

[0109] Step S203, when there is an overheating area in the target switch cabinet, determine the target component with overheating abnormality in the target switch cabinet based on the spatial information and the overheating area of ​​the target switch cabinet, wherein the first detected temperature of the overheating area is greater than the first threshold, and the spatial information includes the position distribution information of multiple components in the target switch cabinet.

[0110] Optionally, judging whether there is an overheating area in the switch cabinet based on multiple infrared images and multiple ultraviolet detection images includes: registering the infrared image and the ultraviolet detection image; extracting feature information from the registered ultraviolet detection image, the feature information including ultraviolet radiation intensity features; generating temperature distribution information based on the feature information and a target relationship model, wherein the target relationship model is used to characterize the correspondence between the temperature of the switch cabinet and the ultraviolet radiation intensity; and determining whether there is an overheating area in the target switch cabinet based on the temperature distribution information.

[0111] Optionally, based on the spatial information and overheating area of ​​the target switch cabinet, determining whether the target component has an overheating abnormality includes: determining the target position information and a second detection temperature of the target component based on the infrared image and the ultraviolet detection image; obtaining the operating status of the target component, wherein the operating status includes a temperature threshold of the target component under working conditions; judging whether the target component has an overheating abnormality based on the operating status and the second detection temperature; and determining that the target component has an overheating abnormality when the second detection temperature is greater than the temperature threshold.

[0112] Optionally, the method further includes: obtaining first detection position information of multiple switch cabinets and overheating position information of overheating areas based on the infrared image and the thermal imaging image; and determining the target switch cabinet based on the first detection position information and the overheating position information.

[0113] Optionally, obtaining spatial information of the target switch cabinet includes: receiving scanning information of the target switch cabinet, the scanning information is information generated by identifying an identification on the target switch cabinet, the scanning information includes component distribution information and component temperature threshold information; retrieving spatial information from the scanning information.

[0114] Optionally, acquiring infrared images and ultraviolet detection images of multiple switch cabinets includes: acquiring infrared images detected by infrared thermal imaging equipment; acquiring ultraviolet detection images detected by ultraviolet detectors.

[0115] An embodiment of the present invention provides a system for detecting and determining an overheating anomaly of a target component, comprising: one or more processors, a memory, one or more programs, and an infrared thermal imaging device and an ultraviolet detector, wherein the infrared thermal imaging device is connected to the processor to collect infrared images of the switch cabinet, and the ultraviolet detector is connected to the processor to collect thermal imaging images of the switch cabinet. The one or more programs are stored in the memory and are configured to be executed by the one or more processors, and the one or more programs include a method for executing the method of determining an overheating anomaly of the switch cabinet in the above embodiment.

[0116] Specifically, the method for determining the overheating abnormality of the target component includes:

[0117] Step S201, acquiring infrared images and ultraviolet detection images of multiple switch cabinets.

[0118] Specifically, infrared images are the product of the combination of infrared technology and imaging technology. They have strong permeability and strong anti-interference ability. In addition, infrared images sense and reflect the difference in outward radiation energy between the target and the background, or describe the difference in temperature maintained by the target and the background. They are passive imaging and can work around the clock. Since infrared images have the above characteristics, before obtaining the infrared image of the switch cabinet, the above method also includes scanning the background of the switch cabinet to obtain reference data to increase the accuracy of the infrared image display.

[0119] In addition, ultraviolet detection images, that is, images obtained using thermal imaging technology, can obtain thermal images of the target object without contacting it, avoiding the interference that traditional temperature measurement methods may cause to the target object. Changes and abnormal conditions of the target object can be monitored in real time. Moreover, thermal imaging technology has high sensitivity and high resolution, which helps to accurately analyze overheating anomalies of switchgear components.

[0120] Step S202: judging whether there is an overheating area in the switch cabinet according to the multiple infrared images and the multiple ultraviolet detection images.

[0121] Specifically, combining infrared images with ultraviolet detection images can improve the perception of temperature changes and achieve higher sensitivity. In addition, the combination of infrared images and thermal imaging technology can provide higher spatial resolution and more clearly display the temperature distribution of switch cabinets and switch cabinet components. In addition, the real-time and non-contact nature of thermal imaging technology helps to detect abnormal conditions in a timely manner and take corresponding measures, while avoiding the limitations of traditional contact temperature measurement.

[0122] Step S203, when there is an overheating area in the target switch cabinet, determine the target component with overheating abnormality in the target switch cabinet based on the spatial information and the overheating area of ​​the target switch cabinet, wherein the first detected temperature of the overheating area is greater than the first threshold, and the spatial information includes the position distribution information of multiple components in the target switch cabinet.

[0123] Optionally, judging whether there is an overheating area in the switch cabinet based on multiple infrared images and multiple ultraviolet detection images includes: registering the infrared image and the ultraviolet detection image; extracting feature information from the registered ultraviolet detection image, the feature information including ultraviolet radiation intensity features; generating temperature distribution information based on the feature information and a target relationship model, wherein the target relationship model is used to characterize the correspondence between the temperature of the switch cabinet and the ultraviolet radiation intensity; and determining whether there is an overheating area in the target switch cabinet based on the temperature distribution information.

[0124] Optionally, based on the spatial information and overheating area of ​​the target switch cabinet, determining whether the target component has an overheating abnormality includes: determining the target position information and a second detection temperature of the target component based on the infrared image and the ultraviolet detection image; obtaining the operating status of the target component, wherein the operating status includes a temperature threshold of the target component under working conditions; judging whether the target component has an overheating abnormality based on the operating status and the second detection temperature; and determining that the target component has an overheating abnormality when the second detection temperature is greater than the temperature threshold.

[0125] Optionally, the method further includes: obtaining first detection position information of multiple switch cabinets and overheating position information of overheating areas based on the infrared image and the thermal imaging image; and determining the target switch cabinet based on the first detection position information and the overheating position information.

[0126] Optionally, obtaining spatial information of the target switch cabinet includes: receiving scanning information of the target switch cabinet, the scanning information is information generated by identifying an identification on the target switch cabinet, the scanning information includes component distribution information and component temperature threshold information; retrieving spatial information from the scanning information.

[0127] Optionally, acquiring infrared images and ultraviolet detection images of multiple switch cabinets includes: acquiring infrared images detected by infrared thermal imaging equipment; acquiring ultraviolet detection images detected by ultraviolet detectors.

[0128] In some optional embodiments, the UV detector is a Schottky type UV detector.

[0129] Specifically, the UV detector is optimized, such as Figure 5As shown, the optimization steps may include: S41, preparation of epitaxial layer: a GaN-based pin-type ultraviolet detector with a thin p-type layer is prepared on a patterned sapphire substrate. By optimizing the growth conditions, such as using an AlN insertion layer and annealing treatment, a high-quality AlGaN film with adjustable bandgap is obtained, thereby improving the performance of the detector; S42, design and preparation of the detector: a Schottky-type ultraviolet detector and an AlGaN-based metal-semiconductor-metal ultraviolet detector are prepared on an epitaxial wafer based on a PSS and buffer layer substrate. By optimizing the device structure, such as doping gradient and high-temperature growth of AlN as a buffer layer, the crystal quality and the electrical and optical properties of the detector are improved; S43, construction and optimization of the performance test system: In order to evaluate the performance of the detector, a spectral response test system needs to be built, which includes analyzing and eliminating the noise problems existing in the system, such as using ultraviolet optical fiber and optimizing the optical power problem to reduce the attenuation of optical power and improve the test accuracy. Through these measures, the noise of the entire system is reduced to the order of 10-12, which meets the test requirements; S44, image acquisition: a pin structure is adopted, in which the i-type non-doped layer is the main photoelectric conversion layer of the detector, absorbing ultraviolet light and generating electron-hole pairs. These electrons and holes move along the inside of the gallium nitride material under the action of the electric field, and generate current signals at the doped layer. The doped layer is connected to the metal electrode to output the current signal, thereby realizing the capture and transmission of the image. The gallium nitride-based ultraviolet sensor has the advantages of high sensitivity, fast response and strong anti-interference ability. The information acquisition of the switch cabinet by the gallium nitride-based ultraviolet detector can increase the accuracy of the thermal imaging image, and the temperature detection of the switch cabinet is more accurate, which is conducive to accurate health judgment of the switch cabinet.

[0130] Obviously, those skilled in the art should understand that the above modules or steps of the present invention can be implemented by a general computing device, they can be concentrated on a single computing device, or distributed on a network composed of multiple computing devices, they can be implemented by a program code executable by a computing device, so that they can be stored in a storage device and executed by the computing device, and in some cases, the steps shown or described can be executed in a different order than here, or they can be made into individual integrated circuit modules, or multiple modules or steps therein can be made into a single integrated circuit module for implementation. Thus, the present invention is not limited to any specific combination of hardware and software.

[0131] Those skilled in the art will appreciate that the embodiments of the present application may be provided as methods, systems, or computer program products. Therefore, the present application may adopt the form of a complete hardware embodiment, a complete software embodiment, or an embodiment in combination with software and hardware. Moreover, the present application may adopt the form of a computer program product implemented in one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) that include computer-usable program code.

[0132] The present application is described with reference to the flowcharts and / or block diagrams of the methods, devices (systems), and computer program products according to the embodiments of the present application. It should be understood that each process and / or box in the flowchart and / or block diagram, as well as the combination of the processes and / or boxes in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to generate a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0133] These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0134] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing instructions for implementing the process. Figure 1 A process or multiple processes and / or boxes Figure 1 A step that specifies a function in one or more boxes.

[0135] In a typical configuration, a computing device includes one or more processors (CPU), input / output interfaces, network interfaces, and memory.

[0136] The memory may include non-permanent memory in a computer-readable medium, random access memory (RAM) and / or non-volatile memory in the form of read-only memory (ROM) or flash RAM. The memory is an example of a computer-readable medium.

[0137] Computer readable media include permanent and non-permanent, removable and non-removable media that can be implemented by any method or technology to store information. Information can be computer readable instructions, data structures, program modules or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, compact disk read-only memory (CD-ROM), digital versatile disk (DVD) or other optical storage, magnetic cassettes, magnetic tape disk storage or other magnetic storage devices or any other non-transmission media that can be used to store information that can be accessed by a computing device. As defined herein, computer readable media does not include temporary computer readable media (transitory media), such as modulated data signals and carrier waves.

[0138] It should also be noted that the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, commodity or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, commodity or device. In the absence of more restrictions, the elements defined by the sentence "comprises a ..." do not exclude the existence of other identical elements in the process, method, commodity or device including the elements.

[0139] From the above description, it can be seen that the above embodiments of the present application achieve the following technical effects:

[0140] 1) A method for determining an overheating abnormality of a target component of the present application includes: acquiring infrared images and ultraviolet detection images of multiple switch cabinets; judging whether there is an overheating area in the switch cabinet based on the multiple infrared images and multiple ultraviolet detection images; in the case where there is an overheating area in the target switch cabinet, determining the target component with overheating abnormality in the target switch cabinet based on the spatial information and the overheating area of ​​the target switch cabinet, wherein the first detection temperature of the overheating area is greater than the first threshold value, and the spatial information includes the position distribution information of multiple components in the target switch cabinet. In the above method, the infrared image and the ultraviolet detection image are used to jointly confirm the target switch cabinet with overheating abnormality in the switch cabinet, and the target component with overheating abnormality in the target switch cabinet is confirmed, so as to increase the accuracy of confirming the overheating abnormal component in the switch cabinet, and the overheating component in the switch cabinet can be directly obtained, which provides the user with target information quickly and accurately while increasing the experience.

[0141] 2) A device for determining the abnormal overheating of a switch cabinet according to the present application comprises: a first acquisition unit for acquiring infrared images and ultraviolet detection images of a plurality of switch cabinets; a judgment unit for judging whether the switch cabinet has an overheating area according to the plurality of infrared images and the plurality of ultraviolet detection images; a determination unit for determining the target component with the abnormal overheating in the target switch cabinet according to the spatial information and the overheating area of ​​the target switch cabinet when the target switch cabinet has an overheating area, wherein the first detection temperature of the overheating area is greater than the first threshold value, and the spatial information includes the position distribution information of the plurality of components in the target switch cabinet. In the above device, the infrared image and the ultraviolet detection image are acquired by the acquisition unit, the target switch cabinet with the overheating area in the plurality of switch cabinets is judged by the judgment unit, the target switch cabinet with the abnormal overheating in the switch cabinet is jointly confirmed by the first determination unit using the infrared image and the ultraviolet detection image, and the target component with the abnormal overheating in the target switch cabinet is confirmed at the same time, so as to increase the accuracy of confirming the abnormal overheating component in the switch cabinet. In addition, the overheating component in the switch cabinet can be directly obtained, and the user is provided with the target information quickly and accurately, while increasing the sense of experience.

[0142] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A method for determining an overheating anomaly of a target component, characterized in that: include: Acquire infrared images and ultraviolet detection images of multiple switch cabinets; Determining whether there is an overheating area in the switch cabinet according to the plurality of infrared images and the plurality of ultraviolet detection images; In the case where the overheating area exists in the target switch cabinet, the target component with overheating abnormality in the target switch cabinet is determined based on the spatial information of the target switch cabinet and the overheating area, wherein the first detected temperature of the overheating area is greater than a first threshold, and the spatial information includes position distribution information of multiple components in the target switch cabinet.

2. The method according to claim 1, characterized in that Judging whether there is an overheating area in the switch cabinet according to the plurality of infrared images and the plurality of ultraviolet detection images includes: registering the infrared image and the ultraviolet detection image; Extracting feature information from the registered ultraviolet detection image, wherein the feature information includes ultraviolet radiation intensity features; Generate temperature distribution information according to the characteristic information and the target relationship model, wherein the target relationship model is used to characterize the corresponding relationship between the temperature of the switch cabinet and the ultraviolet radiation intensity; According to the temperature distribution information, it is determined that an overheating area exists in the target switch cabinet.

3. The method according to claim 1, characterized in that Determining, according to the spatial information of the target switch cabinet and the overheating area, that the target component has an overheating abnormality includes: Determining target position information and a second detection temperature of the target component according to the infrared image and the ultraviolet detection image; Acquiring the operating status of the target component, wherein the operating status includes a temperature threshold of the target component under working conditions; Determining whether the target component has an overheating abnormality according to the operating status and the second detected temperature; When the second detected temperature is greater than the temperature threshold, it is determined that the target component has an overheating abnormality.

4. The method according to claim 1, characterized in that: The method further comprises: Obtaining first detection position information of a plurality of switch cabinets and overheating position information of the overheating area according to the infrared image and the ultraviolet detection image; The target switch cabinet is determined according to the first detection position information and the overheating position information.

5. The method according to claim 1, characterized in that Acquiring the spatial information of the target switch cabinet includes: receiving scanning information of the target switch cabinet, wherein the scanning information is information generated by identifying an identifier on the target switch cabinet, and the scanning information includes distribution information of the component and temperature threshold information of the component; The spatial information is retrieved from the scanning information.

6. The method according to claim 1, characterized in that Acquiring the infrared images and the ultraviolet detection images of a plurality of the switch cabinets includes: Acquire the infrared image detected by infrared thermal imaging equipment; The ultraviolet detection image detected by the ultraviolet detector is acquired.

7. A device for determining thermal overheating anomaly of a switch cabinet, characterized in that: include: An acquisition unit, used for acquiring infrared images and ultraviolet detection images of multiple switch cabinets; A judging unit, used for judging whether there is an overheating area in the switch cabinet according to the plurality of infrared images and the plurality of ultraviolet detection images; The first determination unit is used to determine, when the overheating area exists in the target switch cabinet, a target component with overheating abnormality in the target switch cabinet based on the spatial information of the target switch cabinet and the overheating area, wherein a first detected temperature of the overheating area is greater than a first threshold, and the spatial information includes position distribution information of multiple components in the target switch cabinet.

8. A computer-readable storage medium, characterized in that: The computer-readable storage medium includes a stored program, wherein when the program is executed, the device where the computer-readable storage medium is located is controlled to execute the method for determining the overheating abnormality of a target component according to any one of claims 1 to 6.

9. A system for determining thermal overheating anomalies in a switch cabinet, characterized in that: include: One or more processors, a memory, one or more programs, an infrared thermal imaging device and an ultraviolet detector, wherein the infrared thermal imaging device is connected to the processor to collect infrared images of the switch cabinet, and the ultraviolet detector is connected to the processor to collect ultraviolet detection images of the switch cabinet, and the one or more programs are stored in the memory and are configured to be executed by the one or more processors, and the one or more programs include a method for executing any one of claims 1 to 6 to determine the overheating anomaly of the target component.

10. The system according to claim 9, characterized in that The ultraviolet detector is a Schottky type ultraviolet detector.

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