Dewar device for measuring in single-module differential chip of infrared detector and manufacturing method of Dewar device

Abstract

The invention discloses a Dewar device for measuring in a single-module differential chip of an infrared detector and a manufacturing method of the Dewar device. The intermediate measurement Dewar device comprises a Dewar assembly and a chip assembly, the chip assembly comprises a single-module chip component and a differential chip component, and the Dewar assembly comprises a first cold table, a cold finger, a second cold table and a third cold table; the single-module chip component is adhered to the second cooling table, the differential chip component is adhered to the third cooling table, the first cooling table is glued with the second cooling table, the cold finger is fixed on the first cooling table through a brazing process, and the surface temperature of the first cooling table is a first preset temperature; a boss is arranged at the preset position of the cold finger, the third cold table is in glue joint with the boss, and the preset position is the distribution position corresponding to the second preset temperature in the simulated temperature gradient distribution on the cold finger. According to the embodiment of the invention, the performance test of the chip with the secondary processing capability can be realized, and the working temperatures corresponding to the single-module chip and the differential chip can be ensured.

Description

Technical Field

[0001] The present application belongs to the technical field of infrared detector dewar components, and in particular, relates to a dewar device for measuring infrared detector single-module differential chip and a manufacturing method thereof. Background Art

[0002] With the rapid development of infrared detector research and development, infrared detector imaging technology has been widely used in civil and military fields. The most core part of the imaging system is the infrared detector chip. Driven by aerospace projects, detectors are developing towards large arrays and long lines. In order to ensure the operability of splicing, single modularization is usually used to complete the splicing. In order to meet the requirements of low-noise and high-quality imaging indicators, the hybrid infrared detector chip will use a secondary differential chip to achieve the secondary processing capability of the single-chip signal, achieve the effect of anti-interference and anti-noise, and to ensure the normal operation of the secondary differential chip, it is necessary to provide an operating temperature of 170K-200K.

[0003] The chip mid-test process is an indispensable part of evaluating detector performance. After the infrared detector chip is prepared, the chip performance needs to be tested before the component is formally packaged. The conventional chip mid-test structure electrically leads out the detector chip through a ceramic frame or a flexible tape. For detector chips with secondary signal processing capabilities, the electrical connections of the single-module chip and the differential chip need to be simultaneously led out, and the single-module chip needs to provide a 60K operating temperature, and the differential chip needs to provide a 170K-200K operating temperature. However, the traditional mid-test structure can only monitor one main chip and cannot meet the needs. Summary of the invention

[0004] The embodiment of the present application provides an infrared detector single-module differential chip mid-test Dewar device and a manufacturing method thereof, which is used to at least solve the problem that the traditional mid-test structure in the related art can only monitor one main chip but cannot perform performance testing of chips with secondary processing capabilities.

[0005] In a first aspect, an embodiment of the present application provides a single-module differential chip in-chip measuring dewar device for an infrared detector, comprising a dewar assembly and a chip assembly, wherein the chip assembly comprises a single-module chip component and a differential chip component, and the dewar assembly comprises a first cold stage, a cold finger, a second cold stage, and a third cold stage;

[0006] The single module chip component is bonded to the second cold stage, the differential chip component is bonded to the third cold stage, the first cold stage is glued to the second cold stage, the cold finger is fixed to the first cold stage by a brazing process, and the surface temperature of the first cold stage is a first preset temperature;

[0007] A boss is provided at a preset position of the cold finger, and the third cold stage is glued to the boss. The preset position is a distribution position corresponding to a second preset temperature in a simulated temperature gradient distribution on the cold finger.

[0008] In a second aspect, an embodiment of the present application provides a method for manufacturing a Dewar device in a single-module differential chip of an infrared detector, wherein the manufacturing method is used to manufacture a Dewar device in a single-module differential chip of an infrared detector as described in any embodiment of the first aspect:

[0009] The manufacturing method comprises: a cold finger temperature gradient simulation stage, a Dewar semi-finished product preparation stage, a single module chip component preparation stage, a differential chip component preparation stage, a chip Dewar coupling stage and a pressure sealing stage;

[0010] The stage of simulating the temperature gradient of the cold finger comprises: setting the surface temperature of the first cold platen to a first preset temperature; simulating the temperature gradient of the cold finger and determining the distribution position corresponding to the second preset temperature in the simulated temperature gradient distribution on the cold finger as a preset position; and setting a boss at the preset position;

[0011] The preparation of the semi-finished product of the Dewar comprises: brazing the cold finger with the first cold stage; brazing the shell with the exhaust pipe and brazing the shell with the transition ring to obtain the shell component; laser welding the cold finger with the transition ring; gluing the shell with the electrical lead-out plug-in; gluing the first cold stage with the second cold stage; gluing the third cold stage with the boss, and gluing and fixing with a cold stage clip to complete the preparation of the semi-finished product of the Dewar;

[0012] The differential chip component preparation stage includes: gluing the differential chip to the PCB board, screwing the PCB board to the secondary substrate, screwing two flexible belt pressing plates to the secondary substrate respectively, covering the outer surface of the secondary substrate with a protective cover and screwing the protective cover to the secondary substrate, and completing the differential chip component preparation;

[0013] The chip Dewar coupling stage includes: after the single module chip component preparation stage and the differential chip component preparation stage, bonding the single module chip component to the second cold stage, bonding the differential chip component to the third cold stage, and arranging an indium skin between the differential chip component and the third cold stage; plugging the flexible tape plug-in into the shell plug-in, gluing the cold screen to the second cold stage, and completing the chip Dewar coupling;

[0014] The compression sealing stage includes: bonding the window seat and the window sheet to obtain a window seat component, and compression sealing the window seat component and the outer shell component with a rubber ring to complete the preparation of the mid-test Dewar.

[0015] The infrared detector single-module differential chip central measurement Dewar device and its manufacturing method of the embodiment of the present application, the central measurement Dewar device includes a Dewar assembly and a chip assembly, the chip assembly includes a single-module chip component and a differential chip component, the chip assembly can be disassembled separately, realizing the function of repeated use of the central measurement Dewar structure; the Dewar assembly includes a first cold stage, a cold finger, a second cold stage and a third cold stage, the single-module chip component is bonded to the second cold stage, the differential chip component is bonded to the third cold stage, the first cold stage is glued to the second cold stage and the cold finger is fixed to the first cold stage by a brazing process, the surface temperature of the first cold stage is a first preset temperature, a boss is provided at the distribution position corresponding to the second preset temperature in the simulated temperature gradient distribution on the cold finger, and the third cold stage is glued to the boss to realize the performance test of the chip with secondary processing capability, and can ensure the corresponding working temperature of the single-module chip and the differential chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solution of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0017] Figure 1 It is a structural schematic diagram of a Dewar measuring device in a single-module differential chip of an infrared detector provided in an embodiment of the present application;

[0018] Figure 2 is a schematic diagram of the assembly of the third cold stage and the cold finger provided in the embodiment of the present application;

[0019] Figure 3 It is a schematic diagram of installing a differential chip component provided in an embodiment of the present application;

[0020] Figure 4 It is a schematic diagram of installing another differential chip component provided in an embodiment of the present application;

[0021] Figure 5 It is a flow chart of a method for manufacturing a Dewar device in a single-module differential chip of an infrared detector provided in an embodiment of the present application.

[0022] Reference numerals:

[0023] Window piece 1, window seat 2, cold shield 3, single module chip component 4, second cold stage 5, flexible tape 6, cold finger 7, shell 8, shell plug-in 9, flexible tape plug-in 10, differential chip component 11, third cold stage 12, transition ring 13, first cold stage 14, exhaust pipe 15, boss notch 16, cold stage clip 17, protective cover 18, differential chip 19, PCB board 20, flexible tape pressure plate 21, secondary substrate 22. DETAILED DESCRIPTION

[0024] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application, rather than to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating the examples of the present application.

[0025] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "include..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0026] With the rapid development of infrared detector research and development, infrared detector imaging technology has been widely used in civil and military fields. The most core part of the imaging system is the infrared detector chip. Driven by aerospace projects, detectors are developing towards large arrays and long lines. In order to ensure the operability of splicing, single modularization is usually used to complete the splicing. In order to meet the requirements of low-noise and high-quality imaging indicators, the hybrid infrared detector chip will use a secondary differential chip to achieve the secondary processing capability of the single-chip signal, achieve the effect of anti-interference and anti-noise, and to ensure the normal operation of the secondary differential chip, it is necessary to provide an operating temperature of 170K-200K.

[0027] The chip mid-test process is an indispensable part of evaluating detector performance. After the infrared detector chip is prepared, the chip performance needs to be tested before the component is formally packaged. The conventional chip mid-test structure electrically leads out the detector chip through a ceramic frame or a flexible tape. For detector chips with secondary signal processing capabilities, the electrical connections of the single-module chip and the differential chip need to be simultaneously led out, and the single-module chip needs to provide a 60K operating temperature, and the differential chip needs to provide a 170K-200K operating temperature. However, the traditional mid-test structure can only monitor one main chip and cannot meet the needs.

[0028] In order to solve the problems of the related art, the embodiments of the present application provide a Dewar device in a single-module differential chip of an infrared detector and a manufacturing method thereof.

[0029] The following is a detailed description of the Dewar device in the infrared detector single-module differential chip provided in the embodiment of the present application through specific embodiments and application scenarios in conjunction with the accompanying drawings.

[0030] refer to Figure 1 , is a schematic diagram of the structure of a Dewar device in a single-module differential chip of an infrared detector according to an embodiment of the present application. Figure 1 As shown, the infrared detector single-module differential chip measuring Dewar device includes a Dewar assembly and a chip assembly, wherein the chip assembly includes a single-module chip component 4 and a differential chip component 11, and the Dewar assembly includes a first cold stage 14, a cold finger 7, a second cold stage 5 and a third cold stage 12.

[0031] Specifically, the single-module chip component 4 is bonded to the second cold stage 5, the differential chip component 11 is bonded to the third cold stage 12, the first cold stage 14 is glued to the second cold stage 5, the cold finger 7 is fixed to the first cold stage 14 by a brazing process, and the surface temperature of the first cold stage 14 is a first preset temperature; a boss is provided at a preset position of the cold finger 7, and the third cold stage 12 is glued to the boss, and the preset position is the distribution position corresponding to the second preset temperature in the simulated temperature gradient distribution on the cold finger 7.

[0032] Furthermore, in some embodiments, Figure 2 FIG. 2 shows a schematic diagram of the assembly of the third cold stage 12 and the cold finger 7. Figure 2 As shown, the third cold stage 12 is glued to the boss, boss notches 16 are provided on both sides of the boss, and the edge of the third cold stage 12 is flush with the center line of the boss notches 16 .

[0033] It should be noted that, in the embodiment of the present application, the first preset temperature is 60K, and the second preset temperature includes 170K-200K. That is, they correspond to the operating temperatures of the single module chip and the differential chip, respectively. In other words, when the single module chip is working, the refrigerator provides a temperature of 60K to the Dewar cold stage. At this time, there is a temperature gradient distribution on the cold finger 7. The position of the 170K-200K temperature distribution on the cold finger 7 is determined by simulation, and a circular boss is set at this position of the cold finger 7, and boss notches 16 are provided on both sides of the boss. After the edge of the third cold stage 12 is flush with the center line of the boss notch 16 on the cold finger boss, the third cold stage 12 is glued to the circular boss of the cold finger, so that the differential chip component works at a temperature of 170K-200K.

[0034] Therefore, the Dewar device in the infrared detector single-module differential chip of the embodiment of the present application can ensure that the single-module chip operates at a temperature of 60K, and can ensure that the differential chip component operates at a temperature of 170K-200K.

[0035] In some optional embodiments, the Dewar assembly further includes a housing 8, a housing plug-in 9, a transition ring 13 and an exhaust pipe 15, and the chip assembly further includes a flexible belt 6 and a flexible belt plug-in 10. The transition ring 13 and the exhaust pipe 15 are respectively fixed to the housing 8 by a brazing process to form a housing component; the cold finger 7 is welded to the transition ring 13, the flexible belt plug-in 10 is plugged into the housing plug-in 9, and the housing 8 is glued to the electrical lead-out plug-in to realize the electrical signal of the chip.

[0036] In some optional embodiments, the Dewar assembly further comprises a window sheet 1 and a window seat 2. The window seat 2 is bonded to the window sheet 1 to form a window seat component; and the window seat component is sealed with a rubber ring of the housing component.

[0037] Optionally, the Dewar assembly further includes a cold shield 3 , which is glued to the second cold stage 5 .

[0038] As an optional embodiment, Figure 3 FIG. 1 shows a schematic diagram of the installation of a differential chip component 11. Figure 3 As shown, the differential chip component 11 includes: a differential chip 19 , a PCB board 20 , a secondary substrate 22 and two flexible tape pressing plates 21 .

[0039] Furthermore, Figure 4 FIG. 1 shows another schematic diagram of the installation of a differential chip component 11. Figure 4 As shown, the differential chip component 11 further includes a protective cover 18 .

[0040] Specifically, the differential chip 19 is glued to the PCB board 20 , the PCB board 20 is glued to the secondary substrate 22 , the two flexible tape pressing plates 21 are respectively screwed to the secondary substrate 22 , and a protective cover 18 is provided on the outer surface of the secondary substrate 22 .

[0041] In some optional embodiments, a temperature measuring resistor and a heating resistor are provided on the secondary substrate 22. In this way, based on fixing the third cold stage 12 in the middle of the Dewar cold finger 7 and installing the heating resistor and the temperature measuring resistor on the secondary substrate 22, the differential chip component 11 can be ensured to work at a temperature of 170K-200K through simulation and actual measurement.

[0042] In addition, in some embodiments, Figure 4 As shown, the Dewar assembly further includes a cold stage clamp 17, which is used to fix the third cold stage 12 and the boss after being glued together, so as to further ensure the stability of the structure.

[0043] In addition, in some optional embodiments, an indium skin is provided between the differential chip component 11 and the third cold stage 12. Thus, by providing a layer of indium skin between the secondary chip component (i.e., the differential chip component 11) and the third cold stage 12, the indium skin has good thermal conductivity, which is more conducive to heat conduction.

[0044] In summary, the infrared detector single module differential chip measuring dewar device of the embodiment of the present application includes two parts, namely the dewar structure and the chip component. The dewar structure features mainly include: window 1, window seat 2, cold screen 3, second cold stage 5, cold finger 7, first cold stage 14, shell 8, shell plug-in 9, third cold stage 12, transition ring 13, exhaust pipe 15, cold stage clip 17. The chip component features mainly include: single module chip component 4, differential chip component 11, flexible belt 6, flexible belt plug-in 10. Among them, the differential chip component 11 includes: protective cover 18, differential chip 19, PCB board 20, flexible belt pressure plate 21, secondary substrate 22.

[0045] Furthermore, the present application also provides a method for manufacturing a Dewar device in a single-module differential chip of an infrared detector. It should be noted that the manufacturing method can be used to manufacture a Dewar device in a single-module differential chip of an infrared detector as in any of the above embodiments.

[0046] Figure 5 The flowchart of the manufacturing method of the Dewar device in the infrared detector single module differential chip of the embodiment of the present application is shown. Figure 5 As shown, the manufacturing method of the Dewar device in the infrared detector single-module differential chip may specifically include the following steps: S501 to S506.

[0047] S501, the stage of simulating the temperature gradient of the cold finger includes: setting the surface temperature of the first cold platen to a first preset temperature; simulating the temperature gradient of the cold finger and determining the distribution position corresponding to the second preset temperature in the simulated temperature gradient distribution on the cold finger as the preset position; and setting a boss at the preset position.

[0048] In specific implementation, the lower surface of the cold finger can be set to room temperature, and the upper surface of the first cold stage can be set to 60K; the temperature gradient of the cold finger is simulated to determine the position of the 170K temperature distribution of the cold finger, and a circular boss is set at this position, with notches on both sides of the boss.

[0049] S502, the stage of preparing the semi-finished product of Dewar includes: brazing the cold finger with the first cold stage; brazing the outer shell with the exhaust pipe and brazing the outer shell with the transition ring to obtain the outer shell component; laser welding the cold finger with the transition ring; gluing the outer shell with the electrical lead-out plug-in; gluing the first cold stage with the second cold stage; gluing the third cold stage with the boss, and gluing and fixing with the cold stage clamp to complete the preparation of the semi-finished product of Dewar.

[0050] During the specific implementation, the titanium alloy cold finger is brazed with the indium kovar cold stage (the first cold stage); the kovar shell is brazed with the exhaust pipe, and the kovar shell is brazed with the titanium alloy transition ring; the titanium alloy cold finger is laser welded with the titanium alloy transition ring; the shell is glued to the electrical lead-out plug-in; the second cold stage is glued to the first cold stage; after the edge of the third cold stage is flush with the center line of the notch on the cold finger boss, the third cold stage is glued to the circular boss of the cold finger, and is glued and fixed with a cold stage clamp to complete the preparation of the Dewar semi-finished product.

[0051] S503, single module chip component preparation stage.

[0052] S504, the differential chip component preparation stage includes: gluing the differential chip to the PCB board, screwing the PCB board to the secondary substrate, screwing the two flexible belt pressure plates to the secondary substrate respectively, covering the outer surface of the secondary substrate with a protective cover and screwing the protective cover to the secondary substrate, and completing the differential chip component preparation.

[0053] In some optional embodiments, the differential chip is glued to the PCB board, the PCB board is screwed to the indium valve material secondary substrate, two flexible belt pressure plates are screwed to the secondary substrate to fix the electrical flexible belt; temperature measuring resistors and heating resistors are bonded to the secondary substrate to further control the operating temperature of the differential chip; an aluminum protective cover is covered on the outer surface of the secondary substrate, and the protective cover is screwed to the secondary substrate to protect the differential chip from damage, thereby completing the preparation of the differential chip components.

[0054] S505, the chip Dewar coupling stage includes: after the single-module chip component preparation stage and the differential chip component preparation stage, bonding the single-module chip component to the second cold stage, bonding the differential chip component to the third cold stage, and setting an indium skin between the differential chip component and the third cold stage; plugging the flexible tape plug-in into the shell plug-in, gluing the cold screen to the second cold stage, and completing the chip Dewar coupling.

[0055] In the specific implementation, after the chip components are prepared, the single-module chip components in the chip components are bonded to the second cold stage, and the differential chip components are bonded to the third cold stage; a layer of indium skin is placed between the secondary chip components and the third cold stage, because the indium skin has good thermal conductivity, it is more conducive to heat conduction; the flexible tape plug-in is plugged into the shell plug-in, and the cold screen is glued to the second cold stage to complete the chip Dewar coupling.

[0056] S506, the compression and sealing stage includes: bonding the window seat and the window sheet to obtain a window seat component, and compression and sealing the window seat component and the outer shell component with a rubber ring to complete the preparation of the intermediate test Dewar.

[0057] Therefore, by simulating the cold finger temperature gradient stage, the preparation of the semi-finished product of the dewar, the preparation of the single module chip components, the preparation of the differential chip components, the chip dewar coupling stage and the pressure sealing stage, the existing mid-test dewar structure can be improved to achieve the performance test of the single module differential chip, ensuring that the single module chip works at 60K and the differential chip works at 170K-200K. In addition, the chip components can be disassembled separately, realizing the function of repeated use of the mid-test dewar structure.

[0058] It should be noted that the above describes some embodiments of the present application. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in an order different from that in the above embodiments and still achieve the desired results. In addition, the processes depicted in the accompanying drawings do not necessarily require the specific order or continuous order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0059] Reference to "embodiment" in this application means that a particular feature, structure, or characteristic described in conjunction with the embodiment may be included in at least one embodiment of the present application. The appearance of the phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments.

[0060] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", and "attached" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0061] In the embodiments of the present application, the same reference numerals represent the same components, and for the sake of brevity, detailed descriptions of the same components are omitted in different embodiments. It should be understood that the thickness, length, width and other dimensions of various components in the embodiments of the present application shown in the drawings, as well as the overall thickness, length, width and other dimensions of the integrated device are only exemplary descriptions and should not constitute any limitation to the present application.

[0062] The term "plurality" used in the present application refers to two or more (including two).

[0063] Although the present application has been described with reference to preferred embodiments, various modifications may be made thereto and parts thereof may be replaced with equivalents without departing from the scope of the present application. In particular, the various technical features mentioned in the various embodiments may be combined in any manner as long as there is no structural conflict. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

[0064] It should also be noted that the exemplary embodiments mentioned in this application describe some methods or systems based on a series of steps or devices. However, this application is not limited to the order of the above steps, that is, the steps can be performed in the order mentioned in the embodiment, or in a different order from the embodiment, or several steps can be performed simultaneously.

[0065] The above is only a specific implementation of the present application. Those skilled in the art can clearly understand that for the convenience and simplicity of description, the specific working processes of the systems, modules and units described above can refer to the corresponding processes in the aforementioned method embodiments, and will not be repeated here. It should be understood that the protection scope of the present application is not limited to this. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed in this application, and these modifications or replacements should be included in the protection scope of this application.

Claims

1. A Dewar device for measuring infrared detectors in a single module differential chip, characterized in that: It includes a Dewar assembly and a chip assembly, wherein the chip assembly includes a single-module chip component and a differential chip component, and the Dewar assembly includes a first cold stage, a cold finger, a second cold stage and a third cold stage; The single module chip component is bonded to the second cold stage, the differential chip component is bonded to the third cold stage, the first cold stage is glued to the second cold stage, the cold finger is fixed to the first cold stage by a brazing process, and the surface temperature of the first cold stage is a first preset temperature; A boss is provided at a preset position of the cold finger, and the third cold stage is glued to the boss. The preset position is a distribution position corresponding to a second preset temperature in a simulated temperature gradient distribution on the cold finger.

2. The device according to claim 1, characterized in that Notches are arranged on both sides of the boss, and the edge of the third cold stage is flush with the center line of the notches on the boss.

3. The device according to claim 1, characterized in that The Dewar assembly also includes a housing, a housing plug-in, a transition ring and an exhaust pipe, and the chip assembly also includes a flexible belt and a flexible belt plug-in; The transition ring and the exhaust pipe are respectively fixed on the shell by a brazing process, the cold finger is welded to the transition ring, and the flexible belt plug-in is plugged into the shell plug-in.

4. The device according to claim 3, characterized in that The Dewar assembly also includes a window sheet and a window seat; The window seat component and the shell component are sealed by rubber ring compression. The window seat component is obtained by bonding the window seat and the window sheet. The shell component is obtained by fixing the transition ring and the exhaust pipe on the shell respectively through a brazing process.

5. The device according to claim 1, characterized in that The Dewar assembly also includes a cold shield, which is glued to the second cold stage.

6. The device according to claim 1, characterized in that The Dewar assembly further comprises a cold stage clamp, which is used for fixing the third cold stage after being glued to the boss.

7. The device according to claim 1, characterized in that An indium skin is provided between the differential chip component and the third cold stage.

8. The device according to claim 1, characterized in that The differential chip components include: a protective cover, a differential chip, a PCB board, a secondary substrate and two flexible belt pressing plates; The differential chip is glued to the PCB board, the PCB board is glued to the secondary substrate by screws, two flexible belt pressure plates are respectively screwed to the secondary substrate, a protective cover is provided on the outer surface of the secondary substrate, and a temperature measuring resistor and a heating resistor are provided on the secondary substrate.

9. The device according to claim 1, characterized in that The first preset temperature is 60K, and the second preset temperature includes 170K-200K.

10. A method for manufacturing a Dewar device in a single-module differential chip of an infrared detector, characterized in that: The manufacturing method is used to manufacture a Dewar device in a single-module differential chip of an infrared detector as described in any one of claims 1 to 9; The manufacturing method comprises: a cold finger temperature gradient simulation stage, a Dewar semi-finished product preparation stage, a single module chip component preparation stage, a differential chip component preparation stage, a chip Dewar coupling stage and a pressure sealing stage; The stage of simulating the temperature gradient of the cold finger comprises: setting the surface temperature of the first cold platen to a first preset temperature; simulating the temperature gradient of the cold finger and determining the distribution position corresponding to the second preset temperature in the simulated temperature gradient distribution on the cold finger as a preset position; and setting a boss at the preset position; The preparation of the semi-finished product of the Dewar comprises: brazing the cold finger with the first cold stage; brazing the shell with the exhaust pipe and brazing the shell with the transition ring to obtain the shell component; laser welding the cold finger with the transition ring; gluing the shell with the electrical lead-out plug-in; gluing the first cold stage with the second cold stage; gluing the third cold stage with the boss, and gluing and fixing with a cold stage clip to complete the preparation of the semi-finished product of the Dewar; The differential chip component preparation stage includes: gluing the differential chip to the PCB board, screwing the PCB board to the secondary substrate, screwing two flexible belt pressing plates to the secondary substrate respectively, covering the outer surface of the secondary substrate with a protective cover and screwing the protective cover to the secondary substrate, and completing the differential chip component preparation; The chip Dewar coupling stage includes: after the single module chip component preparation stage and the differential chip component preparation stage, bonding the single module chip component to the second cold stage, bonding the differential chip component to the third cold stage, and arranging an indium skin between the differential chip component and the third cold stage; Insert the flexible tape plug-in into the shell plug-in, glue the cold shield to the second cold stage, and complete the chip Dewar coupling; The compression sealing stage includes: bonding the window seat and the window sheet to obtain a window seat component, and compression sealing the window seat component and the outer shell component with a rubber ring to complete the preparation of the mid-test Dewar.

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