Board card automatic testing device and method

Abstract

The invention discloses a board card automatic testing device and method, the device comprises a chassis at the bottom and a fixing rod at the upper part, the fixing rod comprises a pressing rod and an insulating support pillar mounting plate which performs linkage control through the pressing rod, the insulating support pillar mounting plate is horizontally arranged, and an insulating support pillar is also arranged below the insulating support pillar mounting plate. According to the scheme, the applicable voltage and current range of board card testing is greatly expanded, meanwhile, the device is suitable for measurement of various board cards, manual measurement is completely replaced, the read data precision is high, the data acquisition rate is greatly increased, automatic signature can be achieved, and meanwhile, damage to a to-be-tested circuit board and terminals on the circuit board caused by plugging and unplugging of a cable is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board card detection, and in particular to a circuit board card automatic testing device and method. Background Art

[0002] At present, the testing of single circuit board or multiple circuit boards is mostly done manually with multimeter or other instruments. On the one hand, the measured value is not very accurate (it is related to the length of time or contact position of the test point during manual operation); on the other hand, the measurement time is long and the efficiency is low, which makes it impossible to implement large-scale single circuit board power-on testing, and it is also impossible to complete the joint power-on testing of multiple circuit boards. There is another problem when testing multiple circuit boards jointly. It is necessary to plug and unplug the connecting cables between the boards, which is time-consuming and easy to damage the connecting plugs of the circuit board.

[0003] The disadvantages of the prior art include the following aspects: 1. When using a switching power supply module for power supply, it is impossible to perform a board short-circuit alarm; the power output (voltage, current) is fixed, and the voltage or current cannot be adjusted, which is not convenient for measuring multiple boards.

[0004] 2. Circuit board testing uses a manually operated multimeter for measurement, which is labor-intensive (one person operates, one person records) and has low accuracy (manual recording is prone to typos and readings are delayed).

[0005] 3. The data collection method uses a multimeter to measure, which can only measure one data at a time, and the efficiency is low.

[0006] 4. Data is recorded by manually filling out forms, which is prone to typos and alterations.

[0007] 5. The joint debugging of multiple boards requires multiple plugging and unplugging of the connecting cables and terminals between each other. Some of them also require the use of professional tools for plugging and unplugging. On the one hand, it will take a long time to replace the boards, and on the other hand, it will cause unnecessary damage to the wiring terminals of the boards. Summary of the invention

[0008] In view of the above technical problems, the present invention provides a board automatic testing device and method.

[0009] The present invention is implemented by adopting the following technical scheme: a board automatic testing device, including a chassis at the bottom and a fixing rod at the top, the fixing rod including a pressure rod and an insulating top column mounting plate which is linked and controlled by the pressure rod, the insulating top column mounting plate is horizontally arranged, and an insulating top column is also arranged at the bottom.

[0010] Specifically, a circuit board placement and fixing frame for placing the circuit board is provided on the upper surface of the chassis, and the circuit board placement and fixing frame corresponds to the insulating top column to contact and fix the circuit board.

[0011] Specifically, the circuit board placement and fixing frame is provided as one or more; connecting lines are provided between the circuit board cards placed in the circuit board placement and fixing frame, and a power-on button is provided corresponding to each circuit board placement and fixing frame.

[0012] Specifically, a spring-type probe connected by a central direct connection wire is also arranged inside the chassis, and the spring-type probe is in close contact with a test pad of the circuit board to be tested.

[0013] Specifically, the test pad is set to 1.5mm~2mm.

[0014] Specifically, the chassis is also provided with a terminal for connecting an external adjustable power supply, a voltage and current analog quantity acquisition module is also provided inside the chassis, and a buzzer for alarming and a switch button (10) for switching the measurement and acquisition data cable channel are also provided on the panel on the upper surface of the chassis.

[0015] The board automatic testing method comprises the following steps: Place the circuit board to be tested in the circuit board placement and fixing frame; The pressure rod presses down the insulating top column mounting plate through the linkage rod, and the linkage insulating top column on the insulating top column mounting plate contacts and fixes the circuit board card in the circuit board placement fixing frame; The external adjustable power supply introduces power to the chassis through the terminal on the chassis. The voltage and current signals are directly collected from the test pads on the circuit board and enter the voltage and current analog quantity acquisition module. After the analog quantity is converted into digital quantity, it is transmitted to the host computer software through network communication.

[0016] Specifically, it also includes: configuring serial port communication parameters on the software and clicking to start the connection, importing the collected data by clicking the send button and the receive button on the software, and generating a table for storage.

[0017] Specifically, it also includes: when testing a multi-circuit board, increasing the number of slots and spring-type probes in the circuit board placement fixing frame, and replacing the customized voltage and current analog acquisition module with more acquisition input interfaces to acquire voltage and current signals.

[0018] Specifically, it also includes: when testing multiple circuit board cards and the multiple boards are interconnected, the test device is switched to the board interconnection cable connection gear through a switch button on the panel, and a spring probe and a welding cable are used for contact connection.

[0019] The beneficial effects of the present invention are: (1) A test pad with a fixed diameter of 1.5 mm is designed on the circuit board for contact with the metal probe, so that the contact time of the test point pad is stable and controllable, and the contact position of the test point pad is fixed and repeatable. This solves the problem of poor contact of the test pen, long reading time and unstable reading when measuring manually with a multimeter.

[0020] (2) Use a multi-channel data acquisition module (a large number of acquisition channels can be customized) to simultaneously collect signals from multiple test points and transmit them to the computer for recording through communication. This solves the drawbacks of manual point-by-point measurement and allows a large amount of test data to be saved on the computer instead of being manually recorded in a table.

[0021] (3) This device can hold multiple circuit boards, and can be used for both joint power-on testing of multiple circuit boards and separate testing of a single circuit board. Multiple test probes are used to replace the connecting cables between circuit boards, solving the problem of multiple plugging and unplugging of connecting cables when testing multiple circuit boards. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0023] Figure 1 It is a structural diagram of a board automatic testing device in an embodiment of the present invention; Figure 2 It is a module diagram of a board automatic testing device in an embodiment of the present invention; Figure 3 A flow chart of board automation testing in one embodiment of the present invention; Figure 4 A schematic diagram of panel arrangement in an embodiment of the present invention; Among them, 1-pressure rod, 2-insulating top column, 3-insulating top column mounting plate, 4-circuit board placement fixing frame, 5-spring-loaded probe, 6-chassis, 7-binding post, 8-panel, 9-buzzer, 10-switch button, 11-power button one, 12-power button two. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0025] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0026] The following is combined with Figures 1 to 4 , some embodiments of the present invention are described in detail. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0027] The present invention proposes a board card automatic testing device and method. In a preferred embodiment, the board card automatic testing device, such as Figure 1 , 2 As shown, it includes a chassis 6 at the bottom and a fixing rod at the top, the fixing rod includes a pressure rod 1 and an insulating top column mounting plate 3 controlled by the pressure rod 1, the insulating top column mounting plate 3 is horizontally arranged, and an insulating top column 2 is also arranged below. A circuit board placement fixing frame 4 for placing a circuit board is arranged on the upper surface of the chassis 6, and the circuit board placement fixing frame 4 corresponds to the insulating top column 2 to contact and fix the circuit board.

[0028] In one embodiment, the circuit board placement and fixing frame 4 is set to one or more; connecting lines are set between the circuit board cards placed in the circuit board placement and fixing frame 4, and a power-on button is set corresponding to each circuit board placement and fixing frame 4. In this embodiment, when two circuit board placement and fixing frames 4 are set to place two circuit board cards to be tested respectively, the power-on button 11 for circuit board card debugging is the power-on switch of the first circuit board card to be tested, and the power-on button 2 12 for circuit board card debugging is the power-on switch of another circuit board card to be tested. The power-on button 11 and the power-on button 2 12 are respectively set at both ends of the panel 8.

[0029] In this embodiment, a spring-type probe 5 connected by a central direct connection wire is also provided inside the chassis 6, and the spring-type probe 5 is in close contact with the test pad of the circuit board to be tested. In this embodiment, a probe is provided below the circuit board, and a top column for pressing down the insulating plate and a circuit board placement fixing frame are provided above the circuit board. The circuit board and the probe are pressed and connected steadily by the top column for pressing down the insulating plate to ensure that the circuit board does not move on the Z axis; the circuit board placement fixing frame is used to limit the movement of the circuit board to ensure that the circuit board does not move on the X / Y axis plane.

[0030] In this embodiment, the test pad is set to 1.5mm~2mm. According to the test requirements, the test pad with a diameter of 1.5mm~2mm is arranged nearby on the circuit board, and the spring probe is used to closely contact the detection point. The end of the spring probe is directly connected to the wire, and the voltage drop or current error to be measured on the circuit board can be within the allowable range.

[0031] In this embodiment, the chassis 6 is also provided with a terminal 7 for connecting an external adjustable power supply, a voltage and current analog quantity acquisition module and a buzzer are also provided inside the chassis 6, and a buzzer 9 for alarm reminder and a switch button 10 for switching the measurement and acquisition data cable channel are also provided on the panel 8 on the upper surface of the chassis 6. The voltage of the adjustable power supply can be set arbitrarily, and the prerequisite for convenient testing can be changed according to the application scenario of the customer; the adjustable power supply has a short circuit alarm function, which can detect welding tinning, short circuit and other faults in the circuit board to be tested; at the same time, the terminal 7 provides a guarantee for the expansion function of the device, such as increasing the number of acquisition modules, increasing the number of test circuit boards, etc.; the buzzer 9 is used to remind the completion of the detection or alarm to remind the circuit board short circuit, and the switch button 10 is used to switch the conduction of the measurement and acquisition data cable, such as when measuring a single board, some cables are conductive and some cables are not conductive.

[0032] The present invention also proposes a board automatic testing method, which comprises the following steps: The circuit board to be tested is placed in the circuit board placement and fixing frame 4 and fixed; The pressure rod 1 presses down the insulating top column mounting plate 3 through the linkage rod, and the linkage insulating top column 2 on the insulating top column mounting plate 3 contacts and fixes the circuit board card in the circuit board placement fixing frame 4; The external adjustable power supply introduces power to the chassis 6 through the terminal on the chassis, and the voltage and current signals are directly collected from the test pads on the circuit board and enter the voltage and current analog acquisition module. After the analog quantity is converted into a digital quantity, it is transmitted to the host computer software through network communication. In this embodiment, the network communication method uses the RS485 communication method, and the data acquisition method uses the voltage and current analog acquisition module (0~100V / 4~20mA to RS485 isolation). The module can customize the number of acquisition channels (1 channel~36 channels) to meet the number of signal acquisition points on the circuit board.

[0033] In this embodiment, if Figure 2As shown, when the board is tested automatically, the serial port communication parameters are configured on the software and the connection is started. The collected data is imported by clicking Send and Receive on the software, and a table is generated and saved. In one embodiment, the data recording interface is written in C# language, and the data table is converted into an interface control using the Excel control ReoGrid to avoid the tediousness of using the ListView control to make a table. At the same time, RS485 communication is used to directly fill the read signal acquisition value into the specified cell of the table, and it is automatically saved in a printable format.

[0034] In one embodiment, when testing a multi-circuit board, the number of slots in the circuit board placement frame 4 and the number of spring-loaded probes 5 are increased, and a customized voltage and current analog acquisition module with more acquisition input interfaces is used to acquire voltage and current signals.

[0035] In another embodiment, when multiple circuit boards are tested and the multiple boards are interconnected, the test device is switched to the board interconnection cable connection position through the switch button 10 on the panel 8, and a spring probe and a welding cable are used for contact connection; the switch button 10 is used to switch the conductivity of the measurement and data collection cable. For example, when measuring a single board, some cables are conductive and some cables are not conductive.

[0036] In one embodiment, the board automation test device is as follows: Figure 1 , 4 As shown, it includes the following parts: 1- The pressure rod is used to press down the insulating top column mounting plate 3 through the linkage rod, and the insulating top column 2 is linked to contact the circuit board in the circuit board placement fixing frame 4 to ensure that the circuit board is stable in the circuit board placement fixing frame 4 and the circuit board will not shake.

[0037] 5- Spring-type probe, which is blocked in the figure and cannot be shown, is in close contact with the 1.5mm~2mm test pad on the circuit board. The spring-type probe 5 and the direct connection wire are both located in the 6 chassis.

[0038] 6- Chassis, which contains voltage and current analog acquisition module, buzzer, etc.

[0039] 7- Binding post, for external adjustable power supply.

[0040] 8- Panel, the upper surface of the chassis, with multiple buttons and a buzzer 9.

[0041] 9-Buzzer, used to remind the completion of detection or alarm to remind the circuit board short circuit.

[0042] 10- Switch button, used to switch the conductivity of the measurement and data collection cables. For example, when measuring a single board, some cables are conductive and some are not.

[0043] 11- Circuit board 1 debugging power-on button, used to power on the circuit board 1 to be tested.

[0044] 12- Circuit board 2 debugging power button, used to power on the circuit board 2 to be tested The external adjustable power supply introduces power to the chassis through the terminal on the chassis. The voltage and current signals are directly collected from the test pads on the circuit board and enter the voltage and current analog acquisition module. After the analog quantity is converted into digital quantity, it is transferred to the laptop computer (host computer software) through RS485 communication to USB communication.

[0045] When the circuit board and the board cards are debugged together, the connecting cables between the boards are realized by using the test pads plus the spring-loaded probes and the cables welded on them, which enable direct contact connection and avoid the plugging and unplugging of the cables.

[0046] The basic process of board testing is as follows: Figure 3 As shown; when the process of multi-board measurement is the same as that of single-board measurement, it is only necessary to increase the slots for placing the circuit board in the fixed frame, the number of spring probes, and customize more voltage and current analog acquisition modules with acquisition input interfaces for voltage and current signal acquisition.

[0047] When multiple boards are interconnected, click the switch button on the panel to switch to the board interconnection cable connection position (spring probe + welding cable contact connection) to replace the previous connection cables of multiple boards.

[0048] In the test phase of the present invention, when multiple boards are debugged together, they are often connected by means of cables (including flexible flat cables) plus terminals. This method affects the efficiency of cable plugging and unplugging, and it is also easy to cause external force damage to the board. Therefore, in the present design, the connection method of cables plus terminals is cancelled in the board connection. Instead, the probes are directly connected to the probes, and the test points are crimped at the same time. The joint debugging between boards no longer requires plugging and unplugging of cables. The efficiency is greatly improved.

[0049] The test device is powered by an adjustable power supply, which also provides a board short-circuit alarm function; the power output (voltage, current) can be adjusted steplessly, and various board measurements can be performed.

[0050] The voltage and current analog acquisition module is used to solve the problem of manual measurement, and the data accuracy can reach 4 decimal places.

[0051] Data collection is implemented using functional modules, and multiple sets of data (up to 36 sets) can be collected at one time.

[0052] Data recording adopts polling method to collect multiple sets of data at a time. The collected data can be directly written into the cells of a fixed table through software, avoiding manual recording errors and alterations, and can also automatically complete qualified signatures.

[0053] Multiple boards are debugged together by directly connecting the probe and its wires, using spring crimping to make contact and connect with other test points on the board, saving the time of plugging and unplugging terminals and cables, and avoiding damage to the wiring terminals.

[0054] The applicable voltage and current range of this device has been greatly expanded. One set of devices can be used to measure multiple boards, completely replacing manual measurement. The data read is highly accurate and labor is saved. The data acquisition rate has been greatly accelerated. It used to take 10 minutes to measure a set of boards, but now it only takes 30 seconds. The data recording table is automatically generated and the format is fixed, which can realize automatic signature and no longer require manual signature. Multiple boards are jointly debugged on the device, and there is no need to plug and unplug cables and terminals when replacing boards.

[0055] For the aforementioned embodiments, for the sake of simplicity, they are all described as a series of action combinations, but those skilled in the art should be aware that the present application is not limited by the order of the actions described, because according to the present application, some steps can be performed in other orders or simultaneously. Secondly, those skilled in the art should also be aware that the embodiments described in the specification are preferred embodiments, and the actions involved are not necessarily required by the present application.

[0056] The above embodiments describe the basic principles and main features of the present invention and the advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments, and the above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the changes and modifications made by those skilled in the art shall be within the scope of protection of the appended claims of the present invention without departing from the spirit and scope of the present invention.

Claims

1. Board automatic testing device, characterized in that: It comprises a chassis (6) at the bottom and a fixing rod at the top, wherein the fixing rod comprises a pressure rod (1) and an insulating top column mounting plate (3) which is linked and controlled by the pressure rod (1), and the insulating top column mounting plate (3) is arranged horizontally, and an insulating top column (2) is also arranged below.

2. The board automation test device according to claim 1, characterized in that: The upper surface of the chassis (6) is provided with a circuit board placement and fixing frame (4) for placing the circuit board, and the circuit board placement and fixing frame (4) corresponds to the insulating top column (2) to contact and fix the circuit board.

3. The board automation test device according to claim 2, characterized in that: The circuit board placement fixing frame (4) is provided as one or more; connecting wires are provided between the circuit board cards placed in the circuit board placement fixing frame (4), and a power-on button is provided corresponding to each circuit board placement fixing frame (4).

4. The board automation test device according to claim 2, characterized in that: A spring-type probe (5) connected via a central direct-connection wire is also provided inside the chassis (6), and the spring-type probe (5) is in close contact with a test pad of the circuit board to be tested.

5. The board automation test device according to claim 4, characterized in that: The test pad is set to 1.5mm~2mm.

6. The board automation test device according to claim 4, characterized in that: The chassis (6) is also provided with a terminal (7) for connecting to an external adjustable power supply, a voltage and current analog quantity acquisition module is also provided inside the chassis (6), and a buzzer (9) for alarming and a switch button (10) for switching a measurement and acquisition data cable channel is also provided on a panel (8) on the upper surface of the chassis (6).

7. A board automation test method, implemented based on the board automation test device according to any one of claims 1 to 6, characterized in that: The following steps are involved: Place the circuit board to be tested in the circuit board placement and fixing frame (4) and fix it; The pressure rod (1) presses down the insulating top column mounting plate (3) through the linkage rod, and the linkage insulating top column (2) on the insulating top column mounting plate (3) contacts and fixes the circuit board card in the circuit board placement fixing frame (4); The external adjustable power supply is introduced into the chassis (6) through the terminal on the chassis, and the voltage and current signals are directly collected from the test pads on the circuit board and enter the voltage and current analog quantity acquisition module. After the analog quantity is converted into a digital quantity, it is transmitted to the upper computer software through network communication.

8. The board automation testing method according to claim 7, characterized in that: Also includes: Configure the serial port communication parameters on the software and click to start the connection. Import the collected data by clicking the Send button and the Receive button on the software and generate a table to save it.

9. The board automation testing method according to claim 7, characterized in that: Also includes: When testing a multi-circuit board, the number of slots and spring-type probes (5) of the circuit board placement frame (4) is increased, and a customized voltage and current analog quantity acquisition module with more acquisition input interfaces is used to acquire voltage and current signals.

10. The board automation testing method according to claim 7, characterized in that: Also includes: When testing multiple circuit board cards and interconnecting multiple boards, the test device is switched to the board interconnection cable connection position through a switch button (10) on the panel (8), and a spring probe and a welding cable are used for contact connection.

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